Anti-vibration anti-disassembly equipment and anti-disassembly detection method thereof

Abstract

The invention relates to the technical field of anti-disassembly detection, in particular to an anti-vibration anti-disassembly device and an anti-disassembly detection method thereof.The anti-vibration anti-disassembly device comprises a front machine shell, a main board is fixedly arranged in an inner cavity of the front machine shell, and the main board is provided with a first detection pin and a processing module connected with the first detection pin; the rear machine shell is detachably connected with the front machine shell, a first screw column is arranged in an inner cavity of the rear machine shell, and annular first conductive silica gel is arranged on the inner wall of the first screw column; the screw connecting piece is used for sequentially locking the front shell, the first conductive silica gel, the mainboard and the first screw column; the method comprises the following steps: when the front casing and the rear casing are compressed and deformed, the first conductive silica gel abuts against the first detection pin; when the processing module detects the level change of the first detection pin, the relative position change of the front casing, the mainboard and the rear casing is judged; according to the invention, more reliable anti-disassembly detection can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of anti-disassembly detection, and in particular to a vibration-resistant anti-disassembly device and an anti-disassembly detection method thereof. Background Art

[0002] Anti-tampering products in related technologies generally set anti-tampering points on the circuit board, and set conductive silicone on the structure to compress the anti-tampering points and keep the anti-tampering point circuit conductive. When the front casing of the anti-tampering product is illegally dismantled, the conductive silicone and the anti-tampering will separate, the anti-tampering circuit will be disconnected, and the anti-tampering judgment will be triggered.

[0003] Generally, screws are used to fix the columns near the anti-tampering point to prevent the front housing from deforming due to vibration, which would cause the electric silicone and the anti-tampering point to fail to be pressed tightly, resulting in false triggering signals. However, when there is severe vibration, such as falling, there is also a probability of false triggering.

[0004] Therefore, it is necessary to provide a more reliable anti-disassembly solution. Summary of the invention

[0005] To solve the above problems, the present invention provides a vibration-resistant anti-dismantling device and an anti-dismantling detection method thereof to solve one or more technical problems existing in the prior art and at least provide a beneficial choice or create conditions.

[0006] In order to achieve the above object, the present invention provides the following technical solutions: In one aspect, the present invention provides a vibration-resistant anti-tampering device, comprising: A front housing, wherein a mainboard is fixedly disposed in an inner cavity of the front housing, and the mainboard is provided with a first detection pin and a processing module connected to the first detection pin; A rear housing, the rear housing is detachably connected to the front housing, the inner cavity of the rear housing is provided with a first screw column, and the inner wall of the first screw column is provided with a first annular conductive silicone; A screw connector, used to sequentially lock the front housing, the first conductive silicone, the mainboard and the first screw column, so that when the front housing and the rear housing are pressed and deformed, the first conductive silicone abuts against the first detection pin; The processing module is used to detect and analyze the level change of the first detection pin to determine whether the relative positions of the front housing, the mainboard and the rear housing are changed.

[0007] Furthermore, the mainboard is provided with a first screw hole adapted to the first screw column, and the first detection pin includes two circles of first signal lines for anti-disassembly detection arranged on the edge of the first screw hole; when the rear casing and the mainboard are pressed and deformed, the first conductive silicone connects the two circles of the first signal lines, and the processing module determines the relative position changes of the front casing, the mainboard and the rear casing.

[0008] Furthermore, the inner cavity of the front housing is provided with a plurality of second screw columns, and the mainboard is provided with a plurality of second screw holes adapted to the second screw columns.

[0009] Furthermore, an inner wall of at least one of the second screw columns is provided with a ring-shaped second conductive silicone, and the mainboard is provided with a second detection pin connected to the processing module; when the front housing and the mainboard are pressed and deformed, the second conductive silicone abuts against the second detection pin.

[0010] Furthermore, the second detection pin includes two circles of second signal lines for anti-disassembly detection arranged on the edge of the second screw hole; when the second conductive silicone connects the two circles of the second signal lines, the processing module determines the change in the relative position of the front housing and the mainboard.

[0011] Furthermore, the inner cavity of the rear housing is provided with a plurality of third screw columns, the mainboard is provided with a plurality of third screw holes, the front housing is provided with a plurality of fourth screw holes, and the plurality of third screw holes, fourth screw holes and third screw columns are adapted one-to-one.

[0012] Furthermore, an inner wall of at least one of the third screw columns is provided with a ring-shaped third conductive silicone, and the mainboard is provided with a third detection pin connected to the processing module; when the front housing and the rear housing are pressed and deformed, the third conductive silicone abuts against the third detection pin.

[0013] Furthermore, the third detection pin includes two circles of third signal lines for anti-disassembly detection arranged on the edge of the third screw hole; when the third conductive silicone connects the two circles of the third signal lines, the processing module determines the relative position changes of the front housing, the main board and the rear housing.

[0014] On the other hand, the present invention provides an anti-disassembly detection method, which is applied to the above-mentioned anti-vibration anti-disassembly device, and the method comprises the following steps: S100, when the front housing and the rear housing are pressed together to produce deformation, the first conductive silicone is in contact with the first detection pin; S200, when the processing module detects a change in the level of the first detection pin, it determines a change in the relative positions of the front housing, the mainboard and the rear housing.

[0015] Furthermore, the mainboard is provided with a first screw hole adapted to the first screw column, and the first detection pin includes two circles of first signal lines for anti-disassembly detection arranged at the edge of the first screw hole; When the processing module detects a change in the level of the first detection pin, determining a change in the relative positions of the front housing, the mainboard, and the rear housing includes: When the rear housing and the mainboard are pressed together to produce deformation, the first conductive silicone connects the two circles of the first signal line, and the processing module determines the relative position change of the front housing, the mainboard and the rear housing.

[0016] The beneficial effects of the present invention are as follows: the present invention provides a vibration-resistant anti-disassembly device and an anti-disassembly detection method thereof, which realizes real-time monitoring of the anti-disassembly state of the device by detecting the contact state between the first conductive silicone and the first detection pin. Compared with the solution of placing the screw fixing hole next to the anti-disassembly point, the structural deformation of this embodiment is smaller and it is more difficult to trigger the anti-disassembly signal by mistake. The present invention can realize more reliable anti-disassembly detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 is an exploded view of a vibration-resistant anti-tampering device according to an embodiment of the present invention; Figure 2 yes Figure 1 A schematic diagram of the structure of the middle and upper shell; Figure 3 yes Figure 1 A schematic diagram of the structure of the middle and lower shells; Figure 4 yes Figure 2 The local schematic diagram of the A in the middle; Figure 5 yes Figure 3 The local schematic diagram of point B in the middle; Figure 6 It is a flow chart of an anti-disassembly detection method in an embodiment of the present invention. DETAILED DESCRIPTION

[0019] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0021] In the description of the present invention, if there are words such as "several", it means one or more, "more" means more than two, greater than, less than, exceed, etc. are understood as not including the number, and above, below, within, etc. are understood as including the number.

[0022] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0023] refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , an embodiment of the present invention provides a vibration-resistant anti-disassembly device, comprising: A front housing 100, wherein a mainboard 200 is fixedly disposed in an inner cavity of the front housing 100, and the mainboard 200 is provided with a first detection pin 221 and a processing module 210 connected to the first detection pin 221; A rear housing 300, wherein the rear housing 300 is detachably connected to the front housing 100, a first screw column 310 is disposed in an inner cavity of the rear housing 300, and an annular first conductive silicone 311 is disposed on an inner wall of the first screw column 310; The screw connector 320 is used to sequentially lock the front housing 100, the first conductive silicone 311, the mainboard 200 and the first screw column 310, so that when the front housing 100 and the rear housing 300 are pressed and deformed, the first conductive silicone 311 abuts against the first detection pin 221; The processing module 210 is used to detect and analyze the level change of the first detection pin 221 to determine whether the relative positions of the front housing 100, the mainboard 200 and the rear housing 300 are changed.

[0024] In the embodiment provided by the present invention, the real-time monitoring of the device anti-disassembly state is achieved through the contact state between the first conductive silicone 311 and the first detection pin 221. Compared with the solution of placing the screw fixing hole next to the anti-disassembly point, the structural deformation of this embodiment is smaller and it is more difficult to trigger the anti-disassembly signal by mistake.

[0025] refer to Figure 5 As a preferred embodiment of the above embodiment, the mainboard 200 is provided with a first screw hole 241 adapted to the first screw column 310, and the first detection pin 221 includes two circles of first signal lines 231 for anti-disassembly detection arranged on the edge of the first screw hole 241; when the rear housing 300 and the mainboard 200 are pressed and deformed, the first conductive silicone 311 connects the two circles of the first signal lines 231, and the processing module 210 determines the relative position changes of the front housing 100, the mainboard 200 and the rear housing 300.

[0026] Specifically, after the first conductive silicone 311 is pressed against the mainboard 200, the first conductive silicone 311 conducts the two circles of the first signal line 231, and the processing module 210 detects the level change of the first detection pin 221, and determines the relative position change of the front housing 100, the mainboard 200 and the rear housing 300. Compared with the solution of placing the screw fixing hole next to the anti-disassembly point, the structural deformation of this embodiment is smaller, and it is more difficult to accidentally trigger the anti-disassembly signal.

[0027] As a preferred embodiment of the above embodiment, the inner cavity of the front housing 100 is provided with a plurality of second screw columns 120 , and the mainboard 200 is provided with a plurality of second screw holes adapted to the second screw columns 120 .

[0028] Specifically, through the cooperation between the second screw column 120 and the second screw hole, the front housing 100 and the mainboard 200 are detachably connected, which increases the stability of the device and facilitates the maintenance and replacement of internal components.

[0029] As a preferred embodiment of the above embodiment, the inner wall of at least one of the second screw columns 120 is provided with a ring-shaped second conductive silicone 121, and the main board 200 is provided with a second detection pin 222 connected to the processing module 210; when the front housing 100 and the main board 200 are pressed and deformed, the second conductive silicone 121 abuts against the second detection pin 222.

[0030] Specifically, the inner wall of the second screw column 120 is also provided with an annular conductive silicone to enhance the anti-disassembly stability and provide an additional detection circuit to further reduce the probability of false triggering. During the device assembly process, through the cooperation of these conductive silicone and the screw hole, the relative position of the upper rear housing 300 is monitored with high precision, which ensures the safety of the device and improves the reliability of use.

[0031] In this embodiment, a second detection pin 222 and a second conductive silicone 121 are provided around the second screw hole, and their working mechanism is similar to that of the first detection pin 221 and the first conductive silicone 311, and are used to enhance the stability and accuracy of the anti-disassembly function. In addition, the processing module 210 can implement multi-dimensional vibration detection according to the conductive state of the conductive silicone of different screw columns, so as to further improve the safety protection performance of the equipment. The second conductive silicone 121 also adopts a ring design, which is close to the second detection pin 222. When the equipment is vibrated or disassembled, the deformation of the conductive silicone will cause the level of the second detection pin 222 to change. By analyzing these changes, the processing module 210 can accurately identify whether the equipment has been illegally disassembled, thereby ensuring the stability and safety of the equipment during use. At the same time, the design also simplifies the structure, reduces manufacturing costs, and facilitates large-scale promotion and application.

[0032] As a preferred embodiment of the above embodiment, the second detection pin 222 includes two circles of second signal lines for anti-disassembly detection arranged on the edge of the second screw hole; when the second conductive silicone 121 connects the two circles of the second signal lines, the processing module 210 determines the relative position change between the front housing 100 and the mainboard 200.

[0033] Specifically, the second signal line is similar to the first signal line 231. After the second conductive silicone 121 is pressed against the mainboard 200, the second conductive silicone 121 conducts two circles of the second signal line, and the processing module 210 detects the level change of the second detection pin 222 to determine the relative position change of the front housing 100 and the mainboard 200. This embodiment is also provided with a second detection pin 222 and a second conductive silicone 121 to automatically switch when the first conductive silicone 311 fails, thereby ensuring the stability and reliability of the monitoring system.

[0034] As a preferred embodiment of the above, the inner cavity of the rear housing 300 is provided with a plurality of third screw columns 330, the mainboard 200 is provided with a plurality of third screw holes, and the front housing 100 is provided with a plurality of fourth screw holes 140, and the plurality of third screw holes, fourth screw holes 140 and third screw columns 330 are adapted one-to-one.

[0035] Specifically, a plurality of third screw holes adapted to the third screw columns 330 are provided in the area of ​​the main board 200 that is in contact with the front housing 100, and a plurality of fourth screw holes 140 adapted to the third screw columns 330 are provided in the area of ​​the front housing 100 that is in contact with the main board 200. The rear housing 300, the main board 200 and the front housing 100 are connected by screws passing through the third screw columns 330, the third screw holes and the fourth screw holes 140 in sequence.

[0036] As a preferred embodiment of the above embodiment, the inner wall of at least one of the third screw columns 330 is provided with a ring-shaped third conductive silicone 331, and the main board 200 is provided with a third detection pin 223 connected to the processing module 210; when the front housing 100 and the rear housing 300 are pressed and deformed, the third conductive silicone 331 abuts against the third detection pin 223.

[0037] Specifically, the level state of the third detection pin 223 changes through the deformation of the third conductive silicone 331, thereby triggering the processing module 210 to perform a corresponding safety monitoring response. This design not only realizes all-round protection of the equipment, but also can quickly start the backup system when a single conductive silicone system has problems, ensuring the stable operation of the equipment in a complex environment.

[0038] As a preferred embodiment of the above embodiment, the third detection pin 223 includes two circles of third signal lines for anti-disassembly detection arranged on the edge of the third screw hole; when the third conductive silicone 331 connects the two circles of the third signal lines, the processing module 210 determines the relative position changes of the front housing 100, the main board 200 and the rear housing 300.

[0039] Specifically, the third signal line is similar to the first signal line 231. After the third conductive silicone 331 is pressed against the mainboard 200, the third conductive silicone 331 conducts the two circles of the third signal line. The processing module 210 detects the level change of the third detection pin 223 and determines the relative position change of the front housing 100 and the mainboard 200. The anti-disassembly detection function of the third signal line further enhances the anti-tampering capability of the device. The setting of the third signal line not only improves the safety performance of the device, but also makes the maintenance of the entire monitoring system easier. The use of the third signal line also reduces the reliance on complex circuits, reduces the probability of false detection, and improves the overall reliability of the device.

[0040] In addition, reference Figure 6 The embodiment of the present invention provides an anti-disassembly detection method, which is applied to the anti-vibration anti-disassembly device described in any of the above embodiments, and the method comprises the following steps: S100, when the front housing 100 and the rear housing 300 are pressed and deformed, the first conductive silicone 311 abuts against the first detection pin 221; S200 , when the processing module 210 detects a change in the level of the first detection pin 221 , it determines a change in the relative positions of the front housing 100 , the mainboard 200 and the rear housing 300 .

[0041] It can be seen that the contents of the above embodiments are all applicable to the embodiments of the present method. The functions specifically implemented by the embodiments of the present method are the same as those of the above embodiments, and the beneficial effects achieved are also the same as those achieved by the above embodiments.

[0042] As a preferred embodiment of the above, the mainboard 200 is provided with a first screw hole 241 adapted to the first screw column 310, and the first detection pin 221 includes two circles of first signal lines 231 for anti-disassembly detection arranged at the edge of the first screw hole 241; When the processing module 210 detects a level change of the first detection pin 221, it determines a relative position change of the front housing 100, the mainboard 200 and the rear housing 300, including: When the rear housing 300 and the mainboard 200 are pressed together to deform, the first conductive silicone 311 conducts the two circles of the first signal line 231 , and the processing module 210 determines the relative position change of the front housing 100 , the mainboard 200 and the rear housing 300 .

[0043] This design of the first signal line 231 not only realizes real-time monitoring of the device status, but also avoids false triggering due to environmental factors, thereby greatly improving the stability and reliability of the device's anti-disassembly detection in a changing environment.

[0044] The embodiments described in the embodiments of the present invention are intended to more clearly illustrate the technical solutions of the embodiments of the present invention, and do not constitute a limitation on the technical solutions provided by the embodiments of the present invention. Those skilled in the art can appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of the present invention are also applicable to similar technical problems.

[0045] Those skilled in the art will appreciate that the technical solutions shown in the figures do not limit the embodiments of the present invention and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0046] The device embodiments described above are merely illustrative, and the circuits described as separate components may or may not be physically separated, that is, they may be located in one place, or they may be distributed over multiple network circuits. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0047] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / circuits in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0048] The terms "first", "second", "third", "fourth", etc. (if any) in the description of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or circuits is not necessarily limited to those steps or circuits clearly listed, but may include other steps or circuits that are not clearly listed or inherent to these processes, methods, products or devices.

[0049] It should be understood that in the present invention, "at least one (item)" refers to one or more, and "plurality" refers to two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can represent: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0050] In the several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above circuits is only a logical function division. There may be other division methods in actual implementation, such as multiple circuits or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or circuits, which can be electrical, mechanical or other forms.

[0051] The circuits described above as separate components may or may not be physically separated, and the components shown as circuits may or may not be physical circuits, that is, they may be located in one place or distributed over multiple network circuits. Some or all of the circuits may be selected according to actual needs to achieve the purpose of the present embodiment.

[0052] In addition, each functional circuit in each embodiment of the present invention may be integrated into one processing circuit, or each circuit may exist physically separately, or two or more circuits may be integrated into one circuit. The above integrated circuit may be implemented in the form of hardware or in the form of software functional circuit.

[0053] The preferred embodiments of the embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of rights of the embodiments of the present invention is not limited thereby. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and essence of the embodiments of the present invention should be within the scope of rights of the embodiments of the present invention. Although the description disclosed in the present invention has been quite detailed and several of the embodiments are described in particular, it is not intended to be limited to any of these details or embodiments or any particular embodiment, but should be regarded as providing a broad possible interpretation of these claims by reference to the attached claims, taking into account the prior art, so as to effectively cover the intended scope disclosed by the present invention. In addition, the above describes the present invention with the foreseeable embodiments of the inventor, the purpose of which is to provide a useful description, and those non-substantial changes to the present invention that have not yet been foreseen may still represent equivalent changes to the present disclosure.

Claims

1. A vibration-resistant anti-tampering device, characterized in that: include: A front housing, wherein a mainboard is fixedly disposed in an inner cavity of the front housing, and the mainboard is provided with a first detection pin and a processing module connected to the first detection pin; A rear housing, the rear housing is detachably connected to the front housing, the inner cavity of the rear housing is provided with a first screw column, and the inner wall of the first screw column is provided with a first annular conductive silicone; A screw connector, used to sequentially lock the front housing, the first conductive silicone, the mainboard and the first screw column, so that when the front housing and the rear housing are pressed and deformed, the first conductive silicone abuts against the first detection pin; The processing module is used to detect and analyze the level change of the first detection pin to determine whether the relative positions of the front housing, the mainboard and the rear housing are changed.

2. The vibration-resistant anti-tampering device according to claim 1, characterized in that: The mainboard is provided with a first screw hole adapted to the first screw column, and the first detection pin includes two circles of first signal lines for anti-disassembly detection arranged at the edge of the first screw hole; when the rear casing and the mainboard are pressed and deformed, the first conductive silicone connects the two circles of the first signal lines, and the processing module determines the relative position changes of the front casing, the mainboard and the rear casing.

3. The vibration-resistant anti-tampering device according to claim 1, characterized in that: The inner cavity of the front housing is provided with a plurality of second screw columns, and the mainboard is provided with a plurality of second screw holes adapted to the second screw columns.

4. The vibration-resistant anti-tampering device according to claim 3, characterized in that: The inner wall of at least one of the second screw columns is provided with a ring-shaped second conductive silicone, and the mainboard is provided with a second detection pin connected to the processing module; when the front housing and the mainboard are pressed and deformed, the second conductive silicone abuts against the second detection pin.

5. The vibration-resistant anti-tampering device according to claim 4, characterized in that: The second detection pin includes two circles of second signal lines for anti-disassembly detection arranged at the edge of the second screw hole; when the second conductive silicone connects the two circles of the second signal lines, the processing module determines the change in the relative position of the front housing and the mainboard.

6. The vibration-resistant anti-tampering device according to claim 1, characterized in that: The inner cavity of the rear housing is provided with a plurality of third screw columns, the mainboard is provided with a plurality of third screw holes, and the front housing is provided with a plurality of fourth screw holes. The plurality of third screw holes, fourth screw holes and third screw columns are adapted one-to-one.

7. The vibration-resistant anti-tampering device according to claim 6, characterized in that: The inner wall of at least one of the third screw columns is provided with a ring-shaped third conductive silicone, and the mainboard is provided with a third detection pin connected to the processing module; when the front housing and the rear housing are pressed and deformed, the third conductive silicone abuts against the third detection pin.

8. The vibration-resistant anti-tampering device according to claim 7, characterized in that: The third detection pin includes two circles of third signal lines for anti-disassembly detection arranged on the edge of the third screw hole; when the third conductive silicone connects the two circles of the third signal lines, the processing module determines the relative position changes of the front housing, the mainboard and the rear housing.

9. A method for detecting tampering, characterized in that: Applied to the vibration-resistant anti-tampering device according to any one of claims 1 to 8, the method comprises the following steps: S100, when the front housing and the rear housing are pressed together to produce deformation, the first conductive silicone is in contact with the first detection pin; S200: When the processing module detects a change in the level of the first detection pin, it determines a change in the relative positions of the front housing, the mainboard and the rear housing.

10. The anti-disassembly detection method according to claim 9, characterized in that: The mainboard is provided with a first screw hole adapted to the first screw column, and the first detection pin includes two circles of first signal lines for anti-disassembly detection arranged at the edge of the first screw hole; When the processing module detects a change in the level of the first detection pin, determining a change in the relative positions of the front housing, the mainboard, and the rear housing includes: When the rear housing and the mainboard are pressed together to produce deformation, the first conductive silicone connects the two circles of the first signal line, and the processing module determines the relative position change of the front housing, the mainboard and the rear housing.

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