Array substrate, manufacturing method thereof and display device

Abstract

The application provides an array substrate and a preparation method thereof and a display device. The preparation method comprises the following steps: applying a first organic solution on a first inorganic layer of a substrate; the first organic solution comprises fluorine elements; the substrate comprises a rigid substrate and the first inorganic layer, and the first inorganic layer is located on a first surface of the rigid substrate. The first organic solution is solidified to form a first organic film. The first organic film is peeled off from the substrate. The first surface contains first particles, the concentration of the first particles on a surface of the first inorganic layer away from the rigid substrate is less than the concentration on the first surface; and the first particles comprise alkali metal elements or alkaline earth metal elements. The scheme of the application can reduce the number of the first particles entering the first organic solution, control the ratio of the fluorine-containing particle groups in the first organic solution to the first particles to be at a low level, control the number of carrier channels in the first organic layer to be small, and help to improve the yellowing phenomenon.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to an array substrate, a preparation method thereof and a display device. BACKGROUND

[0002] In the existing process, it is usually selected to prepare part of the film layer structure in the display panel on a rigid base to improve the yield of the finished product of the display panel. Among them, the above-mentioned part of the film layer is usually a polyimide film layer in the flexible display panel. It should be noted that the above-mentioned polyimide film layer usually includes a fluorine-containing particle group, and the existence of the fluorine-containing particle group can reduce the probability of charge transfer phenomenon in the polyimide film layer, thereby reducing the possibility of yellowing phenomenon of the polyimide film layer.

[0003] The existing preparation process of the polyimide film layer usually needs to be completed on a rigid base, that is, the polyimide film layer often contacts the rigid base. However, due to the limitation of process technology, the surface of the rigid base usually contains a large number of particles with the property of losing electrons (such as alkali metal ions, alkaline earth metal ions, etc.), and the above-mentioned particles are easy to diffuse into the polyimide film layer. The above-mentioned particles can react with the fluorine-containing particle group and cause the fluorine-containing particle group in the polyimide film layer to decrease, thereby it is difficult to inhibit the charge transfer phenomenon in the polyimide film layer, ultimately leading to the increase of the yellowing degree of the polyimide film layer, affecting the visual effect. SUMMARY

[0004] Therefore, the present application provides an array substrate, a preparation method thereof and a display device to solve the problem of serious yellowing phenomenon of part of the film layer in the display panel.

[0005] In a first aspect, an embodiment of the present application provides a preparation method of an array substrate, comprising:

[0006] coating a first organic solution on a first inorganic layer of a substrate; the first organic solution includes fluorine element, the substrate includes a rigid substrate and the first inorganic layer, and the first inorganic layer is located on a first surface of the rigid substrate;

[0007] solidifying the first organic solution to form a first organic film;

[0008] peeling off the first organic film from the substrate;

[0009] Among them, the first surface contains first particles, and the concentration of the first particles on the surface of the first inorganic layer away from the rigid substrate is less than that on the first surface; the first particles include alkali metal elements or alkaline earth metal elements.

[0010] In a second aspect, the present application provides an array substrate prepared by the preparation method provided in the first aspect.

[0011] In a third aspect, the present application provides a display device, comprising the array substrate provided in the second aspect.

[0012] In the embodiments of the present application, compared with the scheme of applying the first organic solution on the first surface of the rigid substrate, the scheme of applying the first organic solution on the first inorganic layer can reduce the number of the first particles entering the first organic solution, and control the proportion of the fluorine-containing particle groups in the first organic solution to be combined with the first particles to be at a low level. The above scheme is beneficial to control the number of carrier channels in the first organic layer to be small, and keep the charge transfer phenomenon in the first organic layer to be weak, which is helpful to improve the yellowing phenomenon. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0014] Figure 1 Part of the structure of a display panel related to the present application is shown in the preparation process;

[0015] Figure 2 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process;

[0016] Figure 3 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process; Figure 2 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process;

[0017] Figure 4 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process;

[0018] Figure 5 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process; Figure 2 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process;

[0019] Figure 6 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process;

[0020] Figure 7 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process; Figure 6 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process;

[0021] Figure 8 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process; Figure 7 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process;

[0022] Figure 9 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process; Figure 7 A schematic diagram of a preparation method of an array substrate provided by the present application is shown in the preparation process;

[0023] Figure 10 FIG. 1 shows a schematic diagram of a part of a preparation method according to an embodiment of the present application; Figure 2

[0024] Figure 11 FIG. 2 shows a schematic diagram of a part of a preparation method according to an embodiment of the present application;

[0025] Figure 12 FIG. 3 shows a structural flow chart corresponding to the preparation method shown in FIG. 2; Figure 11

[0026] Figure 13 FIG. 4 shows a top view schematic diagram of a part of structure of an array substrate corresponding to the part of flow shown in FIG. 3; Figure 12

[0027] Figure 14 FIG. 5 shows a schematic diagram of a display device according to an embodiment of the present application. DETAILED DESCRIPTION

[0028] In order to better understand the technical solutions of the present application, the embodiments of the present application are described in detail below with reference to the drawings.

[0029] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0030] The terms used in the embodiments of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0031] It should be understood that the term "and / or" used herein is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.

[0032] In the prior art, the preparation process of the display panel usually needs the participation of the base table, for example, the base table can be used as a carrier to prepare part of the film layer of the display panel on the surface of the base table. In order to reduce the preparation difficulty of the display panel, a rigid base table is often used to participate in the preparation process of the display panel. This is because the rigidity of the part of the film layer structure of the display panel is insufficient, and it is difficult to ensure the setting accuracy of the film layer structure during preparation; in particular, when preparing a flexible display panel, it is particularly necessary to prepare it on a rigid base table.​​​

[0033] Figure 1 A schematic diagram of a preparation process of a partial structure of a display panel related to the present application is shown.

[0034] As shown in Figure 1 , in the preparation process of the existing display panel 10', the organic layer 02' in the existing display panel 10' can be prepared on the rigid base 01'. The organic layer 02' can include fluorine-containing polyimide molecules, and the fluorine elements in the fluorine-containing polyimide molecules are mainly concentrated in fluorine-containing particle groups in the molecules, which can have the characteristics of large volume and low polarity. The presence of the above-mentioned fluorine-containing particle groups is beneficial to increase the intermolecular gap, thereby reducing the number of carrier channels available for carrier movement in the fluorine-containing polyimide molecules, inhibiting the phenomenon of carrier combination (charge transfer) in the fluorine-containing polyimide molecules, and helping to improve the light transmittance of the organic layer 02'. Among them, the above-mentioned charge transfer phenomenon can reduce the light transmittance of the organic layer 02' because under light conditions, part of the bonds of the polyimide molecules in the organic layer 02' can easily absorb light energy to generate carriers, and part of the carriers can be transferred from the original area to other areas through the carrier channel (the above-mentioned charge transfer phenomenon), resulting in energy level transition. However, the carrier will often absorb photons while passing through the carrier channel, reducing the number of photons emitted from the organic layer 02'; that is, the stronger the above-mentioned charge transfer phenomenon, the fewer the number of photons emitted from the organic layer 02', and the lower the light transmittance of the organic layer 02'. It should be noted that among all the color lights included in visible light, blue light has higher energy, so among the visible light irradiated into the organic layer 02', the photons corresponding to blue light are often preferentially absorbed by the carriers. Therefore, the presence of the above-mentioned fluorine-containing particle groups helps to ensure that the visible light emitted from the organic layer 02' contains a sufficient proportion of blue light.

[0035] As shown in Figure 1 , due to the limitation of process level, the rigid base 01' usually contains a large number of active metal particles 03', which can have the characteristic of losing electrons easily and can easily combine with some particles that can easily lose electrons (such as the above-mentioned fluorine-containing particle groups). When the organic layer 02' is prepared, the active metal particles 03' in the rigid base 01' often diffuse into the organic layer 02' and combine with the fluorine-containing particle groups, thereby reducing the number of fluorine-containing particle groups in the fluorine-containing polyimide molecules, increasing the number of carrier channels, and weakening the inhibitory effect on the charge transfer phenomenon in the organic layer 02'. Among them, the more obvious changes caused by the diffusion of the active metal particles 03' into the organic layer 02' include: the proportion of blue light in the visible light passing through the organic layer 02' decreases, the proportion of yellow light increases, and the color of the organic layer 02' tends to be yellow (yellowing phenomenon).

[0036] Figure 2A schematic diagram of a preparation method of an array substrate provided in the present application is shown in the following figure, Figure 3 A preparation method is shown in the following figure, Figure 2 For the convenience of understanding, Figure 3 Only the structure of the substrate and the positional relationship between the first organic solution and the substrate corresponding to the step of preparing the first organic film on the first inorganic layer are shown.

[0037] To solve the above problems, the present application provides a preparation method of an array substrate, as shown in the following figure, Figure 2 The preparation method comprises the following steps:

[0038] S1: coating a first organic solution on a first inorganic layer of a substrate.

[0039] The first organic solution 02a includes fluorine elements, as shown in the following figure, Figure 3 The substrate 01 includes a rigid substrate 11 and a first inorganic layer 12, and the first inorganic layer 12 is located on the first surface S1 of the rigid substrate 11.

[0040] The first organic solution 02a can include fluorine-containing polyimide molecules, which can include fluorine-containing particle groups, which can be trifluoromethyl groups.

[0041] The rigid substrate 11 can include SiO2, and the surface of the rigid substrate 11 facing the first organic solution 02a is the first surface S1, which can contain active metal ions.

[0042] The first inorganic layer 12 can be provided between the rigid substrate 11 and the first organic solution 02a, and the first inorganic layer 12 can isolate the rigid substrate 11 and the first organic solution 02a.

[0043] The first inorganic layer 12 can be in contact with the first surface S1 of the rigid substrate 11; the first inorganic layer 12 can include at least one of SiNx, SiOx, indium tin oxide, indium zinc oxide, SiC, AlN, diamond and the like.

[0044] S2: solidifying the first organic solution to form a first organic film.

[0045] Solidifying the first organic solution on the first inorganic layer 12 can obtain a first organic film in the array substrate, which can isolate external water and oxygen.

[0046] S3: peeling the first organic film from the substrate.

[0047] The first organic film can be peeled off from the substrate 01, and other film layer structures (e.g., array layer, etc.) in the array substrate can be arranged on the side of the first organic film away from the substrate 01. This means that most of the film layer structures in the array substrate, including the first organic film and the array layer, have been prepared.

[0048] The first surface S1 contains first particles, which include alkali metal elements or alkaline earth metal elements. The first particles can be active metal particles, for example, the first particles can be calcium ions, magnesium ions, sodium ions, etc. When the first particles meet the fluorine-containing polyimide molecules, the first particles can combine with the fluorine-containing particle groups in the fluorine-containing polyimide molecules, resulting in a decrease in the number of fluorine-containing particle groups.

[0049] It should be noted that, since the first inorganic layer 12 can be in contact with the first surface S1 of the rigid substrate 11, considering the diffusion effect, part of the first particles on the first surface S1 can be transferred into the first inorganic layer 12.

[0050] The concentration of the first particles on the surface of the first inorganic layer 12 away from the rigid substrate 11 is less than that on the first surface S1. After part of the first particles are transferred from the first surface S1 to the first inorganic layer 12, the first particles diffused into the first inorganic layer 12 can have a tendency to continue to transfer to the surface of the first inorganic layer 12 away from the rigid substrate 11, thereby causing the first particles to also exist on the surface of the first inorganic layer 12 away from the rigid substrate 11. The first particles on the surface of the first inorganic layer 12 away from the rigid substrate 11 can further diffuse into the first organic solution 02a and combine with the fluorine-containing particle groups in the first organic solution 02a. It should be noted that the concentration of the first particles on the surface of the first inorganic layer 12 away from the rigid substrate 11 is less than that on the first surface S1.

[0051] In an embodiment of the present application, compared with coating the first organic solution 02a on the first surface S1 of the rigid substrate 11, the scheme of coating the first organic solution 02a on the first inorganic layer can reduce the number of first particles entering the first organic solution 02a, and control the ratio of the combination of the fluorine-containing particle groups and the first particles in the first organic solution 02a to be at a low level. The above scheme is beneficial to control the number of carrier channels in the first organic layer to be small, maintain the charge transfer phenomenon in the first organic layer to be weak, and help to improve the yellowing phenomenon.

[0052] In a possible embodiment, the first inorganic layer does not contain the first particles.

[0053] Figure 4 A schematic diagram of the distribution of the first particles in a part of the area on the substrate.

[0054] In an embodiment of the present application, as Figure 4As shown, the initial concentration of the first particles a on the first surface S1 is ρ, and the concentration of the first particles a in the first inorganic layer 12 at the first position 121 is ρ / e, where e is an exponential constant. Before the other film layer (e.g., the first inorganic layer 12) is disposed on the first surface S1, the concentration of the first particles a on the first surface S1 is the initial concentration ρ. After the first inorganic layer 12 is disposed on the first surface S1, part of the first particles a on the first surface S1 can be transferred into the first inorganic layer 12. Based on the principle of particle diffusion, etc., the first particles a in the first inorganic layer 12 can have a tendency to diffuse in a direction away from the first surface S1, and the farther away from the first surface S1, the smaller the concentration of the first particles a in the corresponding part of the first inorganic layer 12.

[0055] When the concentration of the corresponding first particles a at the first position 121 in the first inorganic layer 12 is ρ / e, the concentration of the first particles a in each region of the first inorganic layer 12 reaches an equilibrium state. At this time, the first particles a are difficult to continue to diffuse in a direction away from the first surface S1 from the first position 121.

[0056] where H is the thickness of the first inorganic layer 12, and H > 1.5 h, and h is the spacing between the first position 121 and the surface of the first inorganic layer 12 close to the rigid substrate 11, which can be referred to as the diffusion depth.

[0057] In an embodiment of the present application, by setting H > 1.5 h, it is helpful to reduce the number of first particles a diffused to the surface of the first inorganic layer 12 away from the rigid substrate 11, to help achieve that the surface of the first inorganic layer 12 away from the rigid substrate 11 does not contain first particles a, and to greatly weaken the phenomenon of the combination of fluorine-containing particle groups and the first particles a, thereby further improving the yellowing phenomenon.

[0058] Figure 5 For Figure 2 A schematic diagram of part of the preparation method is shown.

[0059] In an embodiment of the present application, as Figure 5 As shown, S2: solidifying the first organic solution to form a first organic film, comprising:

[0060] S21: heating the first organic solution to solidify it to form a first organic film under the condition that the oxygen content T is in the threshold range.

[0061] In the present application, the first organic film can be prepared by heating and curing. During the heating and curing process, the ambient temperature of the first organic solution can be greater than or equal to 250°C. In addition, oxygen in the heating environment also participates in the curing process, which may cause the first organic solution to be oxidized and yellow. Therefore, it is necessary to control the oxygen content T in the heating environment within a threshold range to reduce the probability of oxygen participating in the heating and curing process.

[0062] In an embodiment of the present application, the threshold range is 0≤T≤10ppm.

[0063] In an embodiment of the present application, when the oxygen content T in the heating environment satisfies 0≤T≤10ppm, the risk of oxygen participating in the curing process of the first organic solution is low, and the degree of yellowing of the first organic film after curing is low.

[0064] Figure 6 A schematic diagram of part of the preparation method provided by the present application, Figure 7 A structure flowchart corresponding to the part of the preparation method shown in Figure 6

[0065] In an embodiment of the present application, in combination with Figure 6 and Figure 7 After S2: curing the first organic solution to form the first organic film, and before S3: peeling the first organic film 03 from the substrate 01, the method further comprises:

[0066] S201: disposing a second inorganic layer 22 on the side of the first organic film 03 away from the substrate 01.

[0067] The composition of the second inorganic layer 22 can be the same as that of the first inorganic layer 22, so that the second inorganic layer 22 can have the effect of hindering the first particles from continuing to diffuse to the film layer structure on the side of the second inorganic layer 22 away from the first organic film 03.

[0068] S202: coating a second organic solution 02b on the side of the second inorganic layer 22 away from the first organic film 03.

[0069] The second organic solution 02b can also include fluorine-containing polyimide molecules. Coating the second organic solution 02b on the side of the second inorganic layer 22 away from the first organic film 03 can avoid the integration of the second organic solution 02b with the first organic film 03, and also prevent the phenomenon of diffusion of the first particles from the first organic film 03 to the second organic solution 02b.

[0070] S203: curing the second organic solution 02b coated on the second inorganic layer 22 to form a second organic film 04.

[0071] ​The first organic film 03 and the second organic film 04 can be attached to the second inorganic layer 22, and when the first organic film 03 is peeled from the substrate 01, a structure of two organic films attached to the same inorganic layer can be obtained.

[0072] In the embodiment of the present application, the second inorganic layer 22 can play a role of isolating the first organic film 03 and the second organic film 04, that is, even if the first particles can diffuse to the first organic film 03 through the first inorganic layer 12, the diffusion of the first particles can be further hindered by the presence of the second inorganic layer 22, which helps to eliminate the yellowing phenomenon of the second organic film 04.

[0073] Figure 8 For Figure 7 convenience of understanding, a schematic diagram of the corresponding part of the film layer structure under the part of the steps shown in FIG. 4 is shown in FIG. 5. Figure 8 In FIG. 5, only the size relationship between the thickness of the first organic film and the thickness of the second organic film after the second organic solution is solidified into the second organic film is shown.

[0074] In one embodiment of the present application, as shown in FIG. 6, the thickness H1 of the first organic film 03 is greater than the thickness H2 of the second organic film 04. Figure 8

[0075] In the embodiment of the present application, the thickness of the first organic film 03 is greater than that of the second organic film 04, so that when the first particles diffuse to the first organic film 03, the greater thickness of the first organic film 03 helps to hinder the further diffusion of the first particles, which is conducive to reducing or eliminating the first particles diffusing to the second organic film 04 and improving the yellowing phenomenon. In addition, when the first organic film 03 is peeled from the first inorganic layer 12, laser needs to be irradiated to the first organic film 03 from the side of the rigid substrate 11, however, the laser required to peel the first organic film 03 is easy to pass through the first organic film 03 and the second inorganic layer 22 to irradiate the second organic film 04. In order to avoid the above laser peeling the second organic film 04 from the second inorganic layer 22, the thickness of the first organic film 03 can be set to be greater than the thickness of the second organic film 04, so as to realize the first organic film 03 hindering the continuous propagation of the laser and reducing the risk of peeling the second organic film 04.

[0076] Figure 9 For Figure 7 another schematic diagram of the corresponding part of the film layer structure under the part of the steps shown in FIG. 4 is shown in FIG. 7.

[0077] In one possible implementation, as shown in FIG. 8, the thickness H3 of the first inorganic layer 12 is less than the thickness H4 of the second inorganic layer 22. Figure 9

[0078] ​​In the present implementation, since the thickness of the first inorganic layer 12 is small, the first inorganic layer 12 has a small hindering effect on the laser during the peeling of the first organic film 03, which is conducive to improving the peeling effect of the first organic film 03. The thickness H4 of the second inorganic layer 22 is larger than that of the first inorganic layer 12, which helps to achieve the hindering effect of the second inorganic layer 22 on the continuous propagation of the laser, thereby reducing the risk of peeling of the second organic film 04.

[0079] Figure 10 For Figure 2 a schematic diagram of part of the preparation method.

[0080] In an embodiment of the present application, as Figure 10 shown in FIG. 3, S3: peeling the first organic film 03 from the substrate 01, comprising:

[0081] S31: irradiating laser from the side of the rigid substrate 11 to the interface between the first inorganic layer 12 and the first organic film 03, and peeling the first organic film 03 from the first inorganic layer 12.

[0082] In an embodiment of the present application, the laser can be irradiated to the first organic film 03 from the side of the rigid substrate 11 away from the first inorganic layer 12, and the laser can irradiate to the interface between the first inorganic layer 12 and the first organic film 03 after passing through the first inorganic layer 12. Then, the light energy of the laser can be converted into heat energy to heat the first organic film 03, and the components such as water and oxygen in the first organic film 03 expand at the interface between the first organic film 03 and the first inorganic layer 12 to form a bulge structure. The part of the first organic film 03 corresponding to the bulge structure can be peeled from the first inorganic layer 12. In the present embodiment, the laser is irradiated from the side of the rigid substrate 11 away from the first inorganic layer 12, which helps to achieve the hindering effect of the first organic film 03 on the continuous propagation of the laser, and can reduce the influence of laser irradiation on the film structure located on the side of the first organic film 03 away from the rigid substrate 11.

[0083] In an embodiment of the present application, the transmittance of the first inorganic layer 12 to the laser is c, and c≥40%.

[0084] In the present embodiment, the transmittance of the first inorganic layer 12 to the laser can affect the peeling effect of the first organic film 03. The larger the transmittance of the first inorganic layer 12 to the laser, the better the peeling effect of the first organic film 03 from the first inorganic layer 12. By setting c≥40% in the present embodiment, the film structure adhered to the first inorganic layer 12 due to incomplete peeling of the first organic film 03 can be reduced, which helps to improve the surface flatness of the first organic film 03 after being peeled.

[0085] In an embodiment of the present application, the wavelength L of the laser is ≤400nm.

[0086] The shorter the wavelength of the laser, the higher the frequency, and the greater the corresponding energy density. By limiting L≤400nm, the embodiment helps to ensure that the laser has a large energy density, which is beneficial to ensuring that the peeling effect of the first organic layer 03 can achieve the desired effect.

[0087] Figure 11 A schematic diagram of part of the preparation method provided in the present application, Figure 12 A structure flowchart corresponding to the preparation method shown in Figure 11

[0088] In one embodiment of the present application, in combination Figure 11 and Figure 12 Before S3: peeling the first organic film 03 from the substrate 01, at least the following steps are further included:

[0089] S204: Preparing an array layer 05 on the side of the first organic film 03 away from the substrate 01, the array layer 05 including thin film transistors.

[0090] The array layer 05 can be located on the side of the second organic film 04 away from the first organic film 03, and the thin film transistors in the array layer 05 can be used as a component of a pixel circuit, which can be used to drive light emitting devices located on the side of the array layer 05 away from the second organic film 04. In the present embodiment, the first organic film 03 can prevent external water and oxygen from entering the array layer 05, which helps to maintain the normal working state of the array substrate.

[0091] Figure 13 A top view schematic diagram of part of the structure of the array substrate corresponding to the part of the flow shown in Figure 12

[0092] In addition, as shown in Figure 12 After the preparation of the array layer 05 is completed, a device layer 06 (which can include light emitting materials, etc.), an encapsulation layer 07, a touch layer 08, etc. film layer structure can be further prepared on the side of the array layer 05 away from the first organic film 03. Subsequently, the device layer 06, the encapsulation layer 07, the touch layer 08, etc. film layer structure can be cut for the first time according to actual needs, as shown in Figure 13 The device layer 06, the encapsulation layer 07, the touch layer 08, etc. film layer structure are divided into at least one sub-area A1, and the corresponding device layer 06, the encapsulation layer 07, the touch layer 08, etc. film layer structure in each sub-area A1 belong to the film layer structure in the same array substrate.

[0093] After the first cutting is completed, the first organic film 03 can be peeled from the first inorganic layer 12, and then the first organic film 03, the second inorganic layer 22 and the second organic film 04 are cut for the second time. Subsequently, a polarizing plate and a protective film, etc. can be attached to the side of the touch layer 08 away from the first organic film 03, to obtain the required array substrate.​​

[0094] This application provides an array substrate, which is prepared using the above-described preparation method.

[0095] The yellowing phenomenon of the array substrate provided in this application has been greatly improved.

[0096] Figure 14 This is a schematic diagram of a display device provided in this application.

[0097] This application provides a display device 20, such as... Figure 14 As shown, the display device 20 includes the array substrate 10 provided in the above embodiment. The display device 20 can be a mobile phone, or it can be an electronic device such as a computer or television.

[0098] The yellowing issue of the display screen on the display device 20 provided in this application has been greatly improved.

Claims

1. A method for manufacturing an array substrate, characterized by, The method comprises: coating a first organic solution on a first inorganic layer of a substrate; the first organic solution comprises a fluorine element, and the substrate comprises a rigid substrate and the first inorganic layer on a first surface of the rigid substrate; solidifying the first organic solution to form a first organic film; peeling the first organic film from the substrate; wherein the first surface contains first particles, a concentration of the first particles on a surface of the first inorganic layer away from the rigid substrate is less than a concentration of the first particles on the first surface; the first particles comprise an alkali metal element or an alkaline earth metal element; an initial concentration of the first particles on the first surface is ρ, and a concentration of the first particles at a first position in the first inorganic layer is ρ / e, e being an exponential constant; The thickness of the first inorganic layer is H, H>1.5 h, h is the distance between the first position and the surface of the first inorganic layer close to the rigid substrate.

2. The production method according to claim 1, characterized by, the solidifying the first organic solution to form a first organic film comprises: heating the first organic solution to solidify the first organic solution to form the first organic film under a condition that an oxygen content T is in a threshold range.

3. The preparation method according to claim 2, characterized in that, The threshold range is 0≤T≤10ppm.

4. The method of claim 1, wherein, After the solidifying the first organic solution to form a first organic film and before the peeling the first organic film from the substrate, the method further comprises: providing a second inorganic layer on a side of the first organic film away from the substrate; coating a second organic solution on a side of the second inorganic layer away from the first organic film; solidifying the second organic solution coated on the second inorganic layer to form a second organic film.

5. The preparation method according to claim 4, characterized in that, A thickness of the first organic film is greater than a thickness of the second organic film.

6. The method of claim 1, wherein, The peeling the first organic film from the substrate comprises: irradiating a laser from a side of the rigid substrate to an interface between the first inorganic layer and the first organic film to peel the first organic film from the first inorganic layer.

7. The preparation method according to claim 6, characterized in that, The first inorganic layer has a transmittance c to the laser, c≥40%.

8. The preparation method according to claim 6, characterized in that, The laser has a wavelength L≤400nm.

9. The method of claim 1, wherein, Before the peeling the first organic film from the substrate, the method further comprises: preparing an array layer on a side of the first organic film away from the substrate, the array layer comprising a thin film transistor.

10. An array substrate, characterized by, The method is prepared by the preparation method of any one of claims 1-9.

11. A display device, characterized by comprising: The array substrate of claim 10 is provided.

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