Preparation method of solar cell and solar cell

Abstract

The invention relates to a solar cell preparation method and a solar cell. The preparation method of the solar cell comprises the following steps: a carrier plate comprises a first region and a second region, and substrates are placed on the first region and the second region; performing a first thin film deposition process on the substrate on the carrier plate; exchanging the positions of at least part of the substrate on the first area and at least part of the substrate on the second area; and performing a second thin film deposition process on the substrate on the carrier plate. The positions of the substrates are exchanged between the first thin film deposition process and the second thin film deposition process, so that the thicknesses of film layers on the surfaces of the substrates on the carrier plate are uniform after film coating is finished finally.

Description

Technical Field

[0001] The present application relates to the technical field of chemical deposition process coating, and in particular to a method for preparing a solar cell and a solar cell. Background Art

[0002] With the development of solar cell manufacturing technology, chemical deposition coating technology has emerged, which requires coating the substrate on the carrier in a coating chamber. However, as the area of ​​the carrier gradually increases, due to the CVD edge effect, that is, the chemical deposition process in the process chamber cannot make the film deposited evenly on the carrier, the film layer on the substrate located in the edge area and non-edge area of ​​the carrier will have uneven film thickness. After the entire battery process is completed, the performance of the battery prepared in the edge area of ​​the carrier and the performance of the battery prepared in the non-edge area are too different, which is not conducive to the sorting of the later battery component packaging process. Summary of the invention

[0003] Based on this, it is necessary to provide a method for preparing a solar cell and a solar cell to address the problems existing in the above-mentioned chemical deposition process coating.

[0004] A method for preparing a solar cell, the method comprising:

[0005] The carrier includes a first area and a second area, and the substrate is placed on both the first area and the second area;

[0006] performing a first thin film deposition process on the substrate on the carrier;

[0007] exchanging the positions of at least a portion of the substrate located on the first area with at least a portion of the substrate located on the second area;

[0008] A second thin film deposition process is performed on the substrate on the carrier.

[0009] In one embodiment, the carrier includes a first area and a second area, and the substrate is placed on both the first area and the second area, including:

[0010] The carrier has a first direction X and a second direction Y; the first direction X and the second direction Y are perpendicular to each other in the plane where the carrier is located;

[0011] The carrier will be transported along a carrier transport direction, which is parallel to the first direction X;

[0012] The first area is arranged at the edge portion of the carrier parallel to the first direction X; the second area is arranged at the main body portion of the carrier; the main body portion is closer to the central axis of the carrier in the second direction Y than the edge portion.

[0013] In one embodiment, the substrate located on the first area is swapped with the substrate located on the second area;

[0014] The method comprises: setting a plurality of mutually parallel position exchange reference lines along the second direction Y, and selecting a substrate on the first area and a substrate on the second area on the position exchange reference lines to exchange positions with each other.

[0015] In one embodiment, the carrier includes a first carrier and a second carrier, and step S3, exchanging the positions of at least a portion of the substrate located on the first area with at least a portion of the substrate located on the second area, specifically includes:

[0016] At least part of the substrates on the first area of ​​the first carrier are placed on the second area of ​​the second carrier, and at least part of the substrates on the second area of ​​the first carrier are placed on the first area of ​​the second carrier to exchange positions.

[0017] In one embodiment, the first thin film deposition process and the second thin film deposition process are located on the same surface of the substrate, or the first thin film deposition process and the second thin film deposition process are located on different surfaces of the substrate.

[0018] In one embodiment, after performing a first thin film deposition process on a substrate on a carrier, the method includes: transferring the carrier on which the substrate is placed into a loading and unloading chamber, and then performing a flipping operation on the substrate.

[0019] In one embodiment, the first thin film deposition process is one of a front passivation layer, a back passivation layer, a front doping layer and a back doping layer, and / or the first thin film deposition process and the second thin film deposition process are one of a front passivation layer, a back passivation layer, a front doping layer and a back doping layer.

[0020] In one embodiment, exchanging the positions of the substrate located on the first area with the substrate located on the second area comprises:

[0021] The position of the substrate on the first area and the substrate on the second area are exchanged by using a robot.

[0022] In one embodiment, the substrate is a half-sheet or a whole sheet.

[0023] A solar cell is manufactured by any of the above-mentioned methods for manufacturing a solar cell.

[0024] The above-mentioned method for preparing solar cells includes: the carrier includes a first area and a second area, and substrates are placed on both the first area and the second area; a first thin film deposition process is performed on the substrate on the carrier; at least part of the substrate located on the first area is swapped with at least part of the substrate located on the second area; and a second thin film deposition process is performed on the substrate on the carrier. The substrates are swapped between the first thin film deposition process and the second thin film deposition process. Compared with a single film layer thin film deposition process, after the chemical deposition process is completed, a film layer with a relatively uniform thickness is generated on the surface of the substrate. For the entire battery thin film deposition process, after all the thin film deposition processes of the battery are completed, the performance differences between the solar cells prepared on the entire carrier are reduced, which is convenient for the subsequent component packaging and sorting.

[0025] A solar cell is manufactured by the above-mentioned solar cell manufacturing method, and comprises the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a flow chart of the method for preparing a solar cell provided in an embodiment of the present application.

[0027] Figure 2 A schematic diagram of the distribution of substrates on a carrier before the positions of the substrates provided in an embodiment of the present application are changed.

[0028] Figure 3 A schematic diagram of the distribution of substrates on a carrier after the positions of the substrates provided in an embodiment of the present application are replaced.

[0029] Figure Number:

[0030] 1. Carrier; 1.1. First region; 1.2. Second region; 2. Substrate;

[0031] X, first direction; Y, second direction;

[0032] aa, central axis; bb, position change reference line. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0035] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0037] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0039] Reference Manual Attached Figure 1 -Attached Figure 3 , Figure 1 This is a flow chart of the method for preparing a solar cell provided in an embodiment of the present application. Figure 2 A schematic diagram of the distribution of substrates on a carrier before the positions of the substrates provided in an embodiment of the present application are changed. Figure 3 A schematic diagram of the distribution of substrates on a carrier after the positions of the substrates are replaced is provided in an embodiment of the present application. A method for preparing a solar cell is shown, the method comprising:

[0040] Step S1: The carrier 1 comprises a first area 1.1 and a second area 1.2. A substrate 2 is placed on both the first area 1.1 and the second area 1.2.

[0041] Step S2 , performing a first thin film deposition process on the substrate 2 on the carrier 1 .

[0042] Step S3, swapping the positions of at least a portion of the substrate 2 located on the first area 1.1 with at least a portion of the substrate 2 located on the second area 1.2.

[0043] Step S4 , performing a second thin film deposition process on the substrate 2 on the carrier 1 .

[0044] The above-mentioned method for preparing a solar cell belongs to a method for preparing a solar cell that reduces the influence of the CVD edge effect, specifically:

[0045] For a system that manufactures solar cells using a chemical deposition process, at least a process chamber and a loading and unloading chamber are required. The substrate 2 is coated with a chemical deposition process in the process chamber, and the process chamber is in a vacuum environment. After the carrier 1 carrying the substrate 2 is placed in the process chamber, a glow is released toward the carrier 1 in the process chamber, and a subsequent chemical deposition process is performed to coat the surface of the substrate 2. The loading and unloading chamber is used to transfer the carrier 1 carrying the substrate 2 into the process chamber. Specifically, the carrier 1 is first transferred from the atmospheric environment to the loading and unloading chamber, and then the loading and unloading chamber is vacuumed. After the pressure of the loading and unloading chamber and the process chamber is less than 20%, the valve plate between the loading and unloading chamber and the process chamber is opened, and the carrier 1 is transferred into the process chamber for a thin film deposition process. After the thin film deposition process is completed, the carrier is transferred from the vacuum environment to the atmospheric environment. The outgoing path is opposite to the above-mentioned incoming path, and no further explanation is given here.

[0046] After the carrier 1 is transferred out of the loading and unloading chamber, the substrate 2 on the carrier 1 may be subjected to an automated process, such as position exchange or flipping.

[0047] The substrate 2 refers to the material used as a cell substrate for manufacturing solar cells, and common materials include silicon wafers, glass substrates, flexible material substrates, etc., which are not limited in this article.

[0048] In actual use, the upper substrate 2 is first placed on the first area 1.1 and the second area 1.2 of the carrier 1. Then, the carrier 1 carrying the substrate 2 is transferred to the process chamber, and the first thin film deposition process is performed on the substrate 2 using a chemical deposition process. When the first thin film deposition process is completed, the carrier 1 is transferred from the process chamber to the loading and unloading chamber, and then transferred from the loading and unloading chamber to the atmosphere, and the positions of the substrates 2 on the first area 1.1 and the second area 1.2 are exchanged in the atmosphere. After the position exchange is completed, the carrier 1 is pushed into the next process chamber, and the second thin film deposition process is performed on the substrate 2 after the position exchange.

[0049] When the first area 1.1 of the carrier 1 is located near the center of the carrier 1 and the second area 1.2 of the carrier 1 is located near the edge of the carrier 1, the above method realizes the position exchange of the substrate 2 on the center of the carrier 1 and the substrate 2 on the edge of the carrier 1.

[0050] During the coating process of the first thin film deposition process and the second thin film deposition process, glow will be released to the carrier 1, but the glow is unevenly distributed at the center and the edge of the carrier 1. Using the above method, the substrate 2 located at the center of the carrier 1 and the substrate 2 on the edge of the carrier 1 are swapped with each other, and the positions of the substrates 2 located at the edge of the carrier 1 and the center of the carrier 1 are swapped between the first thin film deposition process and the second thin film deposition process. The positions of the substrates 2 are swapped without changing the glow distribution, so that after all the thin film deposition processes are completed, the performance differences between the prepared solar cells on the entire carrier are reduced, which is convenient for the subsequent component packaging and sorting.

[0051] Before placing the substrate 2, the surface of the carrier 1 needs to be cleaned to remove dust, oil and other impurities on the surface to ensure that the substrate can fit tightly on the carrier. This can be achieved by using ultrasonic cleaning, plasma cleaning and other methods in accordance with the prior art. After the carrier 1 is positioned, it needs to have a certain degree of flatness and stability to ensure that the substrate 2 can be placed stably.

[0052] In some embodiments, the carrier 1 can be the same carrier. The specific position exchange can be performed by unloading all substrates 2 on the carrier 1, calibrating each substrate 2, and then reloading the substrate 2 onto the carrier 1 according to the set position to perform position exchange.

[0053] In some embodiments, the carrier 1 may include two different carriers. Specifically, the carrier includes a first carrier and a second carrier. In step S3, the substrate 2 located on the first area 1.1 of the first carrier is placed on the second area 1.2 of the second carrier, and the substrate 2 located on the second area 1.2 of the first carrier is placed on the first area 1.1 of the second carrier, thereby swapping positions.

[0054] The first carrier and the second carrier may be similar in structure, and both have areas for placing the substrate 2, including corresponding first areas 1.1 and second areas 1.2. When the position is exchanged in step S3, a precise automated device is required to complete the transfer of the substrate 2 from the first area 1.1 of the first carrier to the second area 1.2 of the second carrier, and the transfer of the substrate 2 from the second area 1.2 of the first carrier to the first area 1.1 of the second carrier. This can be achieved by an automated manipulator, and the manipulator needs to have a high-precision positioning system to ensure that the substrate 2 will not be damaged during the transfer process. For example, the end of the manipulator can be designed with a suction cup or clamp that matches the shape of the substrate, pick up the substrate by vacuum adsorption or mechanical clamping, and then accurately place it in the designated area of ​​the target carrier. Similarly, other automated devices are also applicable.

[0055] In some embodiments, the carrier 1 may include two different carriers. Specifically, the carrier includes a first carrier and a second carrier. The specific position exchange can be performed by unloading all substrates 2 on the carrier 1, calibrating each substrate 2, and then reloading the substrate 2 onto another carrier 1 according to the set position to perform a position exchange.

[0056] In some embodiments, preferably, when the first thin film deposition process and the second thin film deposition process are different, the position exchange is performed between different carriers, that is, the carrier includes a first carrier and a second carrier, and the substrate 2 located on the first area 1.1 of the first carrier is placed on the second area 1.2 of the second carrier, and the substrate 2 located on the second area 1.2 of the first carrier is placed on the first area 1.1 of the second carrier to exchange positions. When the first thin film deposition process and the second thin film deposition process are different, such as an n-doped layer / p-doped layer and a passivation layer, or between an n-doped layer and a p-doped layer, the doping gas will be adsorbed onto the carrier during the thin film deposition process, and the doping gas adsorbed onto the carrier will affect the performance of the thin film in the subsequent thin film deposition process, so the position exchange between different carriers can reduce the influence of the doping gas adsorbed on the carrier between adjacent different thin film deposition processes on another thin film deposition process.

[0057] In one embodiment of the present application, with respect to step S1, the carrier 1 includes a first area 1.1 and a second area 1.2, and a substrate 2 is placed on both the first area 1.1 and the second area 1.2, including:

[0058] The plane where the carrier 1 is located has a first direction X and a second direction Y, and the first direction X and the second direction Y are perpendicular to each other. The carrier 1 will be transported along the carrier transmission direction according to the processing flow, and the carrier transmission direction is set parallel to the first direction X.

[0059] Alternatively, the plane where the carrier 1 is located has a first direction X and a second direction Y, and the first direction X and the second direction Y are perpendicular to each other. The carrier 1 will be transported along the carrier transport direction according to the processing flow, and the carrier transport direction is set parallel to the second direction Y.

[0060] In some embodiments, when the carrier transmission direction is set to be parallel to the second direction Y, for example, when the first thin film deposition process and the second thin film deposition process are located on the same side surface of the substrate 2, there is no need to perform a flipping process, and the substrate 2 located in the second area 1.2 (for example, multiple substrates in a row in the edge area 1.2) can be adsorbed and placed directly on the first area 1.1 of another carrier (i.e., the second carrier) by an automated device (such as a robot) to exchange positions.

[0061] In some embodiments, preferably, the carrier 1 will be transported along the carrier transmission direction according to the processing flow, and the carrier transmission direction is set to be parallel to the first direction X. When the first thin film deposition process and the second thin film deposition process are located on different sides of the substrate 2, the specific position exchange can be performed by an automated device (such as a robot) to absorb and linearly arrange the substrate 2 located in the second area 1.2 (such as a plurality of substrates 2 linearly arranged on the edge area 1.2) and place them on the transmission runway, and the plurality of substrates 2 are flipped by a flipping mechanism. The plurality of substrates 2 after flipping are arranged in a straight line on the transmission runway, and then the plurality of substrates 2 are adsorbed and placed on the first area 1.1 of another carrier by an automated device (such as a robot) to perform position exchange. Similarly, for the substrate 2 located on the first area 1.1 of the carrier, after flipping, the substrate 2 located in the first area 1.1 is placed on the second area 1.2 of another carrier to perform position exchange. The above-mentioned exchange method can simplify the automation device, and the position can be exchanged while the substrate 2 is loaded onto the carrier after flipping the substrate, without the need for an additional position exchange process, thereby simplifying the process flow and improving the process cycle.

[0062] The above-mentioned flipping mechanism and the above-mentioned transmission track are both related to the prior art, that is, they can just realize the flipping and transmission of the substrate 2, and no further explanation will be given here.

[0063] In some embodiments, the first area 1.1 is disposed on the edge portion, and the second area 1.2 is other areas outside the first area 1.1. Therefore, it is sufficient to simply swap the positions of the substrate in the first area 1.1 and the substrate in the second area 1.2 on the carrier 1.

[0064] In some embodiments, the carrier 1 includes a main body portion and an edge portion, and the carrier 1 has a central axis aa parallel to the first direction X. The main body portion is arranged closer to the central axis aa than the edge portion in the second direction Y. The first area 1.1 is arranged on the edge portion, and the second area 1.2 is arranged on the main body portion.

[0065] When the carrier 1 carries the substrate 2 for a chemical deposition process in a reaction chamber, the glow will be more distributed in the main part and less distributed in the edge part. Therefore, after the substrate 2 on the main part and the substrate 2 on the edge part are swapped with each other, for the entire battery thin film deposition process, after the entire thin film deposition process is completed, the performance differences between the solar cells prepared on the entire carrier can be reduced, which is convenient for the subsequent component packaging and sorting.

[0066] In some embodiments, in step S3, at least a portion of the substrate 2 located on the first area 1.1 and at least a portion of the substrate 2 located on the second area 1.2 are swapped with each other. The swapping can be performed between two different carriers, that is, the substrate 2 located on the first area 1.1 of the first carrier is placed on the second area 1.2 of the second carrier, and the substrate 2 located on the second area 1.2 of the first carrier is placed on the first area 1.1 of the second carrier, thereby achieving the purpose of mutual position swapping.

[0067] In some embodiments, the specifications of the first carrier and the second carrier must be consistent, including size, material, and load-bearing capacity. For example, their external dimensions must be able to adapt to the requirements of the transmission device on the production line and the accommodation requirements of the process chamber, loading and unloading chamber and other related equipment. The material can be carbon-carbon materials, graphite and other materials that are not easy to deform and have good corrosion resistance, to ensure that the substrate quality and process implementation will not be affected by the carrier's own factors during the entire solar cell preparation process.

[0068] The first area 1.1 and the second area 1.2 respectively divided on the first carrier plate and the second carrier plate should be clearly divided and corresponding to each other to ensure that the expected process effect can be achieved after the position of the substrate is replaced.

[0069] This method of exchanging the position of the substrate 2 between two different carriers can more effectively balance the process influences on the substrates 2 in different areas. For example, in dealing with the CVD edge effect, the substrate originally in the edge area of ​​the first carrier (the second area 1.2) is transferred to the central area of ​​the second carrier (the first area 1.1), and vice versa. In the subsequent thin film deposition process, the effects of adverse factors such as uneven glow distribution on the solar cells of different substrates 2 can offset or reduce each other, thereby reducing the performance differences between the solar cells prepared on the entire carrier and improving the consistency of product quality.

[0070] In one embodiment of the present application, with respect to step S3, at least a portion of the substrate 2 located on the first area 1.1 is swapped with at least a portion of the substrate 2 located on the second area 1.2;

[0071] The method comprises: setting a plurality of position exchange reference lines bb along the second direction Y, wherein the plurality of position exchange reference lines bb are parallel to each other, and each position exchange reference line bb is parallel to the second direction Y.

[0072] The substrate 2 to be replaced is selected along the position replacement reference line bb, and the substrate 2 located on the first area 1.1 is replaced with the substrate 2 located on the second area 1.2. When replacing the positions, the substrates 2 on the same position replacement reference line bb can be replaced.

[0073] In some embodiments, the substrates 2 located in different areas on different position exchange reference lines bb may also be exchanged.

[0074] When the carrier transport direction of the carrier 1 is set and the carrier transport direction is parallel to the first direction X, the position replacement of the substrate 2 can only be performed along the direction parallel to the second direction Y.

[0075] In one embodiment of the present application, the specific scheme for replacing the position of the substrate 2 is determined according to production requirements and process characteristics, and factors such as the size, shape, coating thickness, and requirements of subsequent processes of the substrate can be considered. For example, a symmetrical position replacement method can be adopted to interchange the substrates 2 on the first area 1.1 and the second area 1.2 according to a certain rule to achieve a more uniform thin film deposition effect for a single film layer; or a targeted position replacement can be performed according to the performance difference of the substrate 2 to improve the overall performance of the solar cell, reduce the performance difference between the prepared solar cells on the entire carrier, and facilitate the subsequent component packaging and sorting.

[0076] In one embodiment of the present application, before step S3, exchanging the positions of at least a portion of the substrate 2 located on the first area 1.1 with at least a portion of the substrate 2 located on the second area 1.2, the method further includes:

[0077] The carrier plate 1 on which the substrate 2 is placed is transferred into an atmospheric environment.

[0078] In actual production, the carrier 1 is transferred from the vacuum process chamber to the loading and unloading chamber, and then transferred from the loading and unloading chamber to the atmospheric environment.

[0079] In one embodiment of the present application, after the carrier 1 is taken out of the loading and unloading chamber in step S2.1 until the carrier 1 enters the atmospheric environment, the method further includes:

[0080] The substrate 2 is flipped using a flipping device or tool. An automatic flipping machine, a flipping fixture, etc. can be used to ensure a smooth and accurate flipping process to prevent the substrate 2 from falling or being damaged. After flipping, the other side of the substrate 2 is inspected to see if there are defects such as scratches and cracks, as well as the integrity of the coating layer. For example, the substrate 2 on the carrier 1 is flipped using a flipping machine, and the surface of the substrate 2 includes a first surface and a second surface, the second surface and the first surface are opened in directions away from each other, and the coating is deposited on the surfaces of the first surface and the second surface.

[0081] In one embodiment of the present application, the first thin film deposition process and the second thin film deposition process may be performed on the same surface of the substrate 2. Alternatively, the first thin film deposition process and the second thin film deposition process may be performed on different surfaces of the substrate 2.

[0082] In one embodiment of the present application, the first thin film deposition process is one of a front passivation layer, a back passivation layer, a front doped layer and a back doped layer. Similarly, the second thin film deposition process can also be set to one of a front passivation layer, a back passivation layer, a front doped layer and a back doped layer. According to actual conditions, one or more of the four coatings can be completed by the first thin film deposition process and the second thin film deposition process. Among them, the function of the front passivation layer is to reduce the recombination loss on the surface of the substrate and improve the conversion efficiency of the solar cell. The back passivation layer can also reduce the recombination loss and improve the battery performance. The front doped layer can improve the conductivity of the substrate and promote the collection of photogenerated carriers. The function of the back doped layer is similar to that of the front doped layer, and different doping elements from the front doping can be used to form a pn junction. In actual use, the substrate 2 can be coated according to needs.

[0083] In some embodiments, the n-doped layer has a two-layer structure, and the first thin film deposition process and the second thin film deposition process can both be n-doped layer deposition processes. After the positions are swapped, a more uniform thin film deposition effect of the n-doped layer on the entire carrier can be achieved, and the difference in thickness of the n-doped layer on the substrate in the edge area and the middle area of ​​the carrier can be reduced; or, the first thin film deposition process is the n-doped layer on the front side of the battery, and the second thin film deposition process is the p-doped layer on the back side of the battery. After the positions are swapped, the performance differences between the prepared solar cells on the entire carrier can be reduced, which is convenient for subsequent component packaging and sorting.

[0084] In some embodiments, since the thin film deposition process needs to be turned over when it is on different surfaces of the substrate, it can be replaced while the carrier is transferred to the atmosphere and turned over, thereby simplifying the process difficulty. Therefore, preferably, the first thin film deposition process and the second thin film deposition process can be performed on different surfaces of the substrate. For example, the first thin film deposition process is a back passivation layer, and the second thin film deposition process is a front passivation layer, or the first thin film deposition process is a front doping layer, and the second thin film deposition process is a back doping layer, or the first thin film deposition process is a front doping layer, and the second thin film deposition process is a back passivation layer, etc. For other different schemes, examples will not be given here, as long as the first thin film deposition process and the second thin film deposition process are performed on different surfaces of the substrate.

[0085] In one embodiment of the present application, with respect to step S3, exchanging the positions of at least a portion of the substrate 2 located on the first area 1.1 with at least a portion of the substrate 2 located on the second area 1.2 includes:

[0086] The position exchange between the substrate 2 on the first area 1.1 and the substrate 2 on the second area 1.2 is achieved by using a manipulator. This position exchange method can ensure that the substrate 2 at any position in the first area 1.1 can be exchanged with the substrate 2 at any position in the second area 1.2.

[0087] In one embodiment of the present application, with respect to step S3, exchanging the positions of at least a portion of the substrate 2 located on the first area 1.1 with at least a portion of the substrate 2 located on the second area 1.2 includes:

[0088] All substrates on the carrier 1 are grabbed and placed on the conveyor belt by a manipulator, and are marked. The flipping mechanism flips the substrates, and then the manipulator grabs and places the substrates in the corresponding area of ​​the carrier, so as to realize the mutual position exchange of the substrate 2 on the first area 1.1 and the substrate 2 on the second area 1.2. This position exchange method can ensure that the substrate 2 at any position in the first area 1.1 can be swapped with the substrate 2 at any position in the second area 1.2.

[0089] Of course, other structures provided in the prior art that can realize the position replacement of the substrate 2 can also be applied here, and will not be elaborated in this article.

[0090] In one embodiment of the present application, the substrate 2 is a half-sheet or a whole sheet.

[0091] In one embodiment of the present application, the surface of the carrier 1 is first cleaned, and the substrate 2 is placed on the carrier 1 after cleaning. The entire carrier 1 is transferred from the loading and unloading chamber to the process chamber for chemical vapor deposition coating of the first thin film deposition process. In this stage, due to the existence of the marginal effect of the chemical deposition process, the coating thickness of the substrate 2 surface located in the middle part and the edge part of the carrier 1 is different. After that, the carrier 1 is placed in the loading and unloading chamber from the process chamber along the carrier transfer direction. It is transferred from the loading and unloading chamber to the atmospheric environment, and at least part of the substrates 2 on the first area 1.1 and the second area 2.2 are exchanged with each other by a manipulator. Compared with the single film layer thin film deposition process, the substrate 2 originally at the edge part that is easily affected by the edge effect is transferred to the middle part, and the silicon wafer originally in the middle part is adjusted to the edge part. After the deposition of the film layer is completed, the difference in the thickness of the film layer deposited on the substrate on the entire carrier is reduced. As for the entire battery thin film deposition process, after the entire battery thin film deposition process is completed, the performance differences between the solar cells prepared on the entire carrier can be reduced, which is convenient for the subsequent component packaging and sorting.

[0092] The precise operation of the manipulator ensures that the substrate 2 can be accurately grasped and placed, avoiding damage to the substrate 2 during the process of swapping positions. By precisely controlling the movement sequence and position of the manipulator, the efficiency and accuracy of the swap process can be ensured. The carrier 1 is then transferred to the next process chamber for the second thin film deposition process. After the position of the substrate 2 is swapped, the substrate 2 that was previously at the edge is now in the middle, and the substrate 2 that was previously in the middle area is now in the edge area, which complement each other during the thin film deposition process, thereby reducing the impact of the edge effect. The substrate 2 that is newly at the edge has already undergone the first thin film deposition process, and can be adjusted in a targeted manner in the subsequent second thin film deposition process to reduce the difference in film thickness deposited on the substrates on the entire carrier.

[0093] A solar cell is manufactured by the solar cell manufacturing method.

[0094] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A method for preparing a solar cell, characterized in that: The method comprises the following steps: Step S1: the carrier plate (1) comprises a first area (1.1) and a second area (1.2); a substrate (2) is placed on the first area (1.1) and the second area (1.2); Step S2, performing a first thin film deposition process on the substrate (2) on the carrier (1); Step S3, exchanging the positions of at least a portion of the substrate (2) located on the first area (1.1) and at least a portion of the substrate (2) located on the second area (1.2); Step S4: performing a second thin film deposition process on the substrate (2) on the carrier (1).

2. The method for preparing a solar cell according to claim 1, characterized in that: The carrier plate (1) comprises a first area (1.1) and a second area (1.2), and a substrate (2) is placed on the first area (1.1) and the second area (1.2), comprising: The carrier plate (1) has a first direction X and a second direction Y; the first direction X and the second direction Y are perpendicular to each other in the plane where the carrier plate (1) is located; The carrier (1) is transported along a carrier transport direction, wherein the carrier transport direction is parallel to the first direction X; The first area (1.1) is arranged at an edge portion of the carrier (1) parallel to the first direction X; the second area (1.2) is arranged at a main body portion of the carrier (1); the main body portion is closer to the central axis of the carrier (1) in the second direction Y than the edge portion.

3. The method for preparing a solar cell according to claim 2, characterized in that: Exchanging the positions of the substrate (2) located on the first area (1.1) and the substrate (2) located on the second area (1.2); The method comprises: setting a plurality of mutually parallel position exchange reference lines along the second direction Y, and selecting the substrate (2) on the first area (1.1) and the substrate (2) on the second area (1.2) on the position exchange reference lines to exchange positions with each other.

4. The method for preparing a solar cell according to claim 1, characterized in that: The carrier includes a first carrier and a second carrier, and the step S3 includes placing the carrier located in the first area ( At least part of the substrate (2) on the second area (1.1) is exchanged with at least part of the substrate (2) located on the second area (1.2), specifically comprising: At least part of the substrate (2) located on the first area (1.1) of the first carrier is placed on the second area (1.2) of the second carrier, and at least part of the substrate (2) located on the second area (1.2) of the first carrier is placed on the first area (1.1) of the second carrier, thereby exchanging positions.

5. The method for preparing a solar cell according to claim 1, characterized in that: The first thin film deposition process and the second thin film deposition process are located on the same surface of the substrate (2), or the first thin film deposition process and the second thin film deposition process are located on different surfaces of the substrate (2).

6. The method for preparing a solar cell according to claim 1, characterized in that: After performing a first thin film deposition process on the substrate (2) on the carrier (1), the method comprises: transferring the carrier (1) on which the substrate (2) is placed into an atmospheric environment, and then performing a flipping operation on the substrate (2).

7. The method for preparing a solar cell according to claim 1, characterized in that: The first thin film deposition process is one of a front passivation layer, a back passivation layer, a front doped layer and a back doped layer, and / or the second thin film deposition process is one of a front passivation layer, a back passivation layer, a front doped layer and a back doped layer.

8. The method for preparing a solar cell according to claim 1, characterized in that: The substrate (2) located on the first area (1.1) and the substrate (2) located on the second area (1.2) are mutually exchanged in position, comprising: A robot is used to realize the mutual position exchange between the substrate (2) on the first area (1.1) and the substrate (2) located on the second area (1.2).

9. The method for preparing a solar cell according to claim 1, characterized in that: The substrate (2) is a half-sheet or a whole sheet.

10. A solar cell, characterized in that: The solar cell is manufactured by the method for preparing the solar cell according to any one of claims 1 to 9.

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