Back-contact battery, photovoltaic module and manufacturing method thereof

Abstract

The present application provides a back-contact battery, a photovoltaic module and a manufacturing method thereof. The back-contact battery includes: a battery body having a scribe line, a plurality of sub-grid lines and a plurality of solder-tape regions. The plurality of sub-grid lines and the scribe line extend in a first direction. The plurality of sub-grid lines are arranged at intervals in a second direction on at least one side of the scribe line. The first direction intersects the second direction. The plurality of solder-tape regions extend in the second direction and are arranged at intervals in the first direction. The solder-tape regions intersect the plurality of sub-grid lines; a plurality of first conductive layers arranged at intervals in the first direction and the second direction. The plurality of first conductive layers are located on the battery body. The sub-grid lines and the first conductive layers overlap in the orthographic projection on the battery body. One solder-tape region overlaps the orthographic projections of the plurality of first conductive layers. The distance between the orthographic projection of any first conductive layer and the scribe line is greater than a target distance, and the target distance is the distance between the sub-grid line closest to the scribe line and the scribe line.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaics, and in particular, to an interdigitated back contact (IBC) cell, a photovoltaic module, and a manufacturing method thereof. Background Art

[0002] An interdigitated back contact (IBC) solar cell refers to a solar cell in which there are no electrodes on the front side of the cell wafer, and both the positive and negative electrodes are provided on the back side of the cell wafer, thereby reducing the shielding of the cell wafer by the electrodes, increasing the short-circuit current of the cell wafer, and improving the energy conversion efficiency of the cell wafer. In the existing IBC cells, solder paste splashing is likely to occur during the dicing process, and the splashed solder paste is likely to bridge to the grid lines with different polarities around the dicing area, thereby causing a risk of short circuit. Summary of the Invention

[0003] The main object of the present application is to provide an interdigitated back contact cell, a photovoltaic module, and a manufacturing method thereof, so as to at least solve the problem that the dicing process of the existing interdigitated back contact cell is likely to cause a short-circuit risk.

[0004] To achieve the above object, according to one aspect of the present application, there is provided an interdigitated back contact cell, including: a cell body having a dicing channel, a plurality of sub-grid lines, and a plurality of solder ribbon regions, the plurality of sub-grid lines and the dicing channel extending in a first direction, the plurality of sub-grid lines being arranged at intervals in a second direction on at least one side of the dicing channel, the first direction intersecting the second direction, the plurality of solder ribbon regions extending in the second direction and being arranged at intervals in the first direction, the solder ribbon regions intersecting the plurality of sub-grid lines; a plurality of first conductive layers arranged at intervals in the first direction and the second direction, the plurality of first conductive layers being located on the cell body, the sub-grid lines overlapping with the positive projections of the first conductive layers on the cell body, one solder ribbon region overlapping with the positive projections of the plurality of first conductive layers, and the distance between the positive projection of any one of the first conductive layers and the dicing channel being greater than a target distance, where the target distance is the distance between the sub-grid line closest to the dicing channel and the dicing channel.

[0005] Optionally, the length of the first conductive layer in the first direction is 1.0 - 1.2 mm, and the length of the first conductive layer in the second direction is 0.15 - 0.25 mm.

[0006] Optionally, the plurality of sub-grid lines include a plurality of first sub-grids and a plurality of second sub-grids. The first sub-grids and the second sub-grids are alternately arranged at intervals along the second direction, and the polarities of the first sub-grids and the second sub-grids are different. The back-contact battery further includes: a plurality of first insulating adhesives arranged at intervals along the second direction, the plurality of first insulating adhesives being located on the battery body, the orthographic projection of the first insulating adhesives on the battery body overlapping at least the first sub-grids, and the maximum distance between the orthographic projection of the first insulating adhesives and the first target solder-tape region in the first direction being less than or equal to half of the distance between two adjacent solder-tape regions, where the first target solder-tape region is the solder-tape region adjacent to the first insulating adhesives in the first direction; a plurality of second insulating adhesives arranged at intervals along the second direction, the plurality of second insulating adhesives being located on the battery body, the orthographic projection of the second insulating adhesives on the battery body overlapping at least the second sub-grids, and the maximum distance between the orthographic projection of the second insulating adhesives and the second target solder-tape region in the first direction being less than or equal to half of the distance between two adjacent solder-tape regions, where the second target solder-tape region is the solder-tape region adjacent to the second insulating adhesives in the first direction.

[0007] Optionally, the orthographic projections of the first insulating adhesives and the second insulating adhesives also overlap the solder-tape regions respectively. The first insulating adhesives and the second insulating adhesives respectively include: a first insulating portion extending along the first direction, the first insulating portion being axisymmetric about a third target solder-tape region, where the third target solder-tape region is the solder-tape region overlapping the first insulating portion; two second insulating portions respectively connected to two ends of the first insulating portion along the first direction, the second insulating portions extending along the first direction, and the length of the second insulating portions in the second direction being less than the length of the first insulating portion in the second direction.

[0008] Optionally, the first sub-grids and the second sub-grids are disconnected at the solder-tape regions, forming a plurality of sub-grid portions arranged at intervals along the first direction. The first insulating adhesives and the second insulating adhesives respectively include: a plurality of third insulating portions arranged at intervals along the first direction, the target portions of the sub-grid portions being respectively located in the orthographic projections of the third insulating portions on the battery body, where the target portions of the sub-grid portions are the ends of the sub-grid portions close to the solder-tape regions; a plurality of fourth insulating portions arranged at intervals along the first direction, the fourth insulating portions being respectively located at the ends of the third insulating portions away from the solder-tape regions, and the length of the fourth insulating portions in the second direction being less than the length of the third insulating portions in the second direction.

[0009] Optionally, the length of the third insulating portion in the first direction is 1.2 to 2 mm, the length of the third insulating portion in the second direction is 0.4 to 0.46 mm, and the length of the fourth insulating portion in the second direction is 0.2 to 0.25 mm.

[0010] According to another aspect of the present application, there is provided a photovoltaic module, including: a first cover plate; a first encapsulant film located on the first cover plate; a battery string located on a surface of the first encapsulant film away from the first cover plate, the battery string including a plurality of solder tapes and a plurality of any one of the back contact batteries arranged at intervals, the solder tapes being located on the solder tape regions of two adjacent back contact batteries; a second encapsulant film located on a surface of the battery string away from the first encapsulant film; and a second cover plate located on a surface of the second encapsulant film away from the battery string and the solder tapes.

[0011] Optionally, the photovoltaic module further includes: a modified crosslinked film located on surfaces of the solder tapes and the back contact batteries, and a modulus of the modified crosslinked film is greater than or equal to 10 GPa.

[0012] According to still another aspect of the present application, there is provided a method for manufacturing a photovoltaic module, including: providing a first cover plate and disposing a first encapsulant film on the first cover plate; controlling a pick-and-place structure to pick up a plurality of solder tapes and a plurality of any one of the back contact batteries, and placing the plurality of solder tapes and the plurality of back contact batteries on a surface of the first encapsulant film away from the first cover plate, a contact area between the pick-and-place structure and the back contact battery being located between two adjacent solder tape regions of the back contact battery, and a width of the contact area being less than a distance between two adjacent solder tape regions; welding the solder tapes and the solder tape regions of the back contact batteries so that two adjacent back contact batteries are connected in series through the solder tapes to form a battery string; stacking a second encapsulant film and a second cover plate on a surface of the battery string away from the first encapsulant film, and sequentially performing heating and lamination curing to form the photovoltaic module.

[0013] Optionally, before placing the plurality of solder tapes and the plurality of back contact batteries on the surface of the first encapsulant film away from the first cover plate, the method further includes: disposing a modified crosslinked film on the back contact batteries and the solder tapes to obtain a preliminary structure; heating the preliminary structure at 120 to 130 °C so that the modified crosslinked film crosslinks to fix the solder tapes.

[0014] Applying the technical solution of the present application, the battery body has cutting channels, a plurality of sub-grid lines and a plurality of solder strip areas. A plurality of first conductive layers are provided on some of the sub-grid lines. The orthographic projection of the first conductive layer on the battery body overlaps with the solder strip area. At least on the sub-grid lines adjacent to the cutting channels, no first conductive layer is provided, ensuring that the distance between the orthographic projection of any first conductive layer and the cutting channel is greater than the distance between the cutting channel and its adjacent sub-grid line. In this way, during the process of cutting the back-contact battery along the cutting channel, due to the scanning deviation of the laser head of the cutting machine, it is possible to prevent the laser head from scanning to the first conductive layer on the sub-grid line adjacent to the cutting channel, causing the first conductive layer to splash and connect to the sub-grid line with a different polarity, resulting in the problem of short circuit of the back-contact battery, and ensuring a high processing yield of the back-contact battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The schematic diagrams in the specification, which form a part of the present application, are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0016] Figure 1 shows a schematic structural diagram of a back-contact battery provided in an embodiment of the present application;

[0017] Figure 2 shows another schematic structural diagram of a back-contact battery provided in an embodiment of the present application;

[0018] Figure 3 shows still another schematic structural diagram of a back-contact battery provided in an embodiment of the present application;

[0019] Figure 4 shows a hardware structural block diagram of a mobile terminal for implementing a method for manufacturing a photovoltaic module provided in an embodiment of the present application;

[0020] Figure 5 shows a schematic flowchart of a method for manufacturing a photovoltaic module provided in an embodiment of the present application;

[0021] Figure 6 shows a schematic structural diagram of a contact area between a pick-and-place structure and a back-contact battery provided in an embodiment of the present application.

[0022] Wherein, the drawings include the following reference numerals:

[0023] 102. Processor; 104. Memory; 106. Transmission device; 108. Input / output device; 10. Scoring channel; 11. Sub-grid line; 111. First sub-grid; 112. Second sub-grid; 113. Sub-grid portion; 12. Tab area; 13. First conductive layer; 14. First insulating adhesive; 15. Second insulating adhesive; 16. First insulating portion; 17. Second insulating portion; 18. Third insulating portion; 19. Fourth insulating portion; 20. Contact area. Detailed implementation manners

[0024] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0025] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data may be interchanged under appropriate circumstances for the embodiments of the present application described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily need to be limited to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0027] As introduced in the background art, in the prior art, the scribing process of back-contact batteries is prone to short-circuit risks. To solve the above technical problems, the embodiments of the present application provide a back-contact battery, a photovoltaic module and a manufacturing method thereof.

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.

[0029] The embodiments of the present application provide a back-contact battery. Figure 1 Exemplarily, a schematic structural diagram of a back-contact battery in the embodiments of the present application is shown, as Figure 1 shown, the back-contact battery includes:

[0030] A battery body, the battery body having a cutting path 10, a plurality of sub-grid lines 11, and a plurality of solder tape regions 12. The plurality of sub-grid lines 11 and the cutting path 10 extend in a first direction. The plurality of sub-grid lines 11 are arranged at intervals along a second direction on at least one side of the cutting path 10. The first direction intersects the second direction. The plurality of solder tape regions 12 extend along the second direction and are arranged at intervals along the first direction. The solder tape regions 12 intersect the plurality of sub-grid lines 11.

[0031] Specifically, the first direction may be perpendicular to the second direction. Along the second direction, the sub-grid lines 11 may be distributed on one side of the cutting path 10 or on both sides of the cutting path 10. The solder tape region 12 is a region for soldering a solder tape. Each solder tape region 12 intersects the plurality of sub-grid lines 11. The battery body is the back surface of a back-contact battery.

[0032] A plurality of first conductive layers 13, arranged at intervals along the first direction and the second direction. The plurality of first conductive layers 13 are located on the battery body. The sub-grid lines 11 overlap with the positive projections of the first conductive layers 13 on the battery body. One solder tape region 12 overlaps with the positive projections of the plurality of first conductive layers 13. The distance D1 between the positive projection of any first conductive layer 13 and the cutting path 10 is greater than a target distance D0. The target distance D0 is the distance between the sub-grid line 11 closest to the cutting path 10 and the cutting path 10.

[0033] Specifically, the first conductive layer 13 is located on the sub-grid line 11 and in the solder tape region 12. For the sub-grid line 11 provided with the first conductive layer 13, a plurality of first conductive layers 13 may be provided on one sub-grid line 11. Along the second direction, one solder tape region 12 overlaps with the positive projections of the plurality of first conductive layers 13. In order to satisfy that the distance between the positive projection of any first conductive layer 13 and the cutting path 10 is greater than the target distance, it is necessary to at least not provide the first conductive layer 13 on the sub-grid line 11 adjacent to the cutting path 10.

[0034] Through the above embodiments, the battery body has cutting channels, a plurality of sub-grid lines and a plurality of solder tab areas. A plurality of first conductive layers are provided on some of the sub-grid lines. The orthographic projection of the first conductive layer on the battery body overlaps with the solder tab area. At least on the sub-grid lines adjacent to the cutting channels, no first conductive layer is provided, ensuring that the distance between the orthographic projection of any first conductive layer and the cutting channel is greater than the distance between the cutting channel and its adjacent sub-grid line. In this way, during the process of cutting the back-contact battery along the cutting channel, due to the scanning deviation of the laser head of the cutting machine, the laser head may scan to the first conductive layer on the sub-grid line adjacent to the cutting channel, causing the first conductive layer to splash and connect to the sub-grid line with a different polarity, resulting in the problem of short circuit of the back-contact battery, and ensuring a relatively high processing yield of the back-contact battery.

[0035] Among them, the back-contact battery is a battery with a special design. It has no grid lines on the front to maintain a high light transmittance, and has a complex circuit design on the back for collecting current. The back-contact battery of the present application can be a back-contact battery without a main grid on the back, or a back-contact battery with a main grid on the back.

[0036] For the sub-grid lines adjacent to the cutting channel and without the first conductive layer, they are directly electrically connected to the solder tab without passing through the first conductive layer.

[0037] In the present application, the number of sub-grid lines without the first conductive layer can be controlled according to the offset control accuracy of the laser head of the dicing machine. Assume that the sub-grid lines located on one side of the cutting channel and arranged in the direction away from the cutting channel are the first sub-grid line, the second sub-grid line and the third sub-grid line respectively. For example, in the case of relatively high offset control accuracy, the first conductive layer may not be provided only on the first sub-grid line, and the first conductive layer is normally provided on the second sub-grid line and the third sub-grid line; while in the case of relatively low offset control accuracy, the first conductive layer is not provided on both the first sub-grid line and the second sub-grid line, and the first conductive layer starts to be provided from the third sub-grid line.

[0038] Specifically, the first conductive layer is used to weld the solder tab in the solder tab area. In the actual application process, the material of the first conductive layer includes but is not limited to solder paste, conductive adhesive, silver paste, etc. The outer contour of the first conductive layer can be circular, oval, rectangular or other polygonal shapes, etc.

[0039] In some embodiments of the present application, the length of the first conductive layer in the first direction is 1.0 to 1.2 mm. For example, the length of the first conductive layer in the first direction can be 1.0 mm, 1.1 mm, or 1.2 mm, etc.; the length of the first conductive layer in the second direction is 0.15 to 0.25 mm. For example, the length of the first conductive layer in the second direction can be 0.15 mm, 0.18 mm, 0.20 mm, or 0.25 mm, etc. In this embodiment, by setting the size of the first conductive layer within the above range, the size and shape of the first conductive layer can provide sufficient contact area and adhesion strength, so that the contact area between the first conductive layer and the battery body and the solder tape is relatively large, and the curing tension between the solder tape connected by the first conductive layer and the battery body is relatively large, making the solder tape and the back contact battery closely connected, ensuring the reliability of welding, and avoiding the phenomenon of blackening in the EL (Electroluminescence) test due to solder tape offset or the small size of the first conductive layer, resulting in insufficient connection between the solder tape and the back contact battery, thereby further ensuring good electrical performance of the back contact battery.

[0040] Among them, the EL test is to apply a voltage to make the battery cell emit specific light to detect the welding quality and possible defects inside the battery cell. The blackened area usually means poor welding quality at that place, which may be caused by reasons such as solder tape offset, insufficient solder paste, or poor contact between the solder tape and the battery cell. This not only affects the appearance of the battery module, but more importantly, it will reduce the electrical performance of the battery module, such as reducing current or increasing series resistance, thereby affecting the output power of the entire module.

[0041] In some embodiments, such as Figure 2 and Figure 3 As shown, a plurality of the auxiliary grid lines 11 include a plurality of first auxiliary grids 111 and a plurality of second auxiliary grids 112. The first auxiliary grids 111 and the second auxiliary grids 112 are alternately arranged at intervals along the second direction. The polarities of the first auxiliary grids 111 and the second auxiliary grids 112 are different. The back contact battery further includes:

[0042] A plurality of first insulating adhesives 14 are arranged at intervals along the second direction. The plurality of first insulating adhesives 14 are located on the battery body. The orthographic projection of the first insulating adhesive 14 on the battery body at least overlaps with the first auxiliary grid 111. The maximum distance D2 between the orthographic projection of the first insulating adhesive 14 and the first target solder tape area in the first direction is less than or equal to half of the distance D3 between two adjacent solder tape areas 12. The first target solder tape area is the solder tape area adjacent to the first insulating adhesive 14 in the first direction;

[0043] Specifically, the positional relationship between the orthographic projection of the first insulating glue 14 and the solder strip area 12 can be an overlap as shown in Figure 2 or a non - overlap as shown in Figure 3 . In the case of the overlap as shown in Figure 2 , the maximum distance between the orthographic projection of the first insulating glue 14 and the first target solder strip area in the first direction is less than or equal to half of the distance between two adjacent solder strip areas 12. It can be understood that the first target solder strip area is the solder strip area 12 adjacent to and non - intersecting with the orthographic projection of the first insulating glue 14, and the first insulating glue covers at least 1 / 2 of the length of the first sub - grid 111 between two adjacent solder strip areas. In the case of the non - overlap as shown in Figure 3 , the maximum distance between the orthographic projection of the first insulating glue 14 and the first target solder strip area in the first direction is less than or equal to half of the distance between two adjacent solder strip areas 12. It can be understood that the first target solder strip area is the solder strip area 12 with a larger distance from the first insulating glue 14 among the two solder strip areas 12 adjacent to the first insulating glue 14, and the first insulating glue 14 covers at least 1 / 2 of the length of the first sub - grid 111 between two adjacent solder strip areas.

[0044] A plurality of second insulating glues 15 are arranged at intervals along the second direction. The plurality of second insulating glues 15 are located on the battery body. The orthographic projection of the second insulating glue 15 on the battery body overlaps at least with the second sub - grid 112. The maximum distance D4 between the orthographic projection of the second insulating glue 15 and the second target solder strip area in the first direction is less than or equal to half of the distance D3 between two adjacent solder strip areas 12. The second target solder strip area is the solder strip area adjacent to the second insulating glue 15 in the first direction.

[0045] Specifically, the positional relationship between the orthographic projection of the second insulating glue 15 and the solder strip area 12 can be an overlap as shown in Figure 2 or a non - overlap as shown in Figure 3 . In the case of the overlap as shown in Figure 2 , the maximum distance between the orthographic projection of the second insulating glue 15 and the second target solder strip area in the first direction is less than or equal to half of the distance between two adjacent solder strip areas 12. It can be understood that the second target solder strip area is the solder strip area 12 adjacent to and non - intersecting with the orthographic projection of the second insulating glue 15, and the second insulating glue covers at least 1 / 2 of the length of the second sub - grid 112 between two adjacent solder strip areas. In the case of the non - overlap as shown in Figure 3In the case of non-overlap as shown, the maximum distance between the orthographic projection of the second insulating glue 15 and the second target solder strip area in the first direction is less than or equal to half of the distance between two adjacent solder strip areas 12. It can be understood that the second target solder strip area is the solder strip area 12 with a larger distance from the second insulating glue 15 among the two solder strip areas 12 adjacent to the second insulating glue 15, and the second insulating glue 15 covers at least 1 / 2 of the length of the second sub-grid 112 between two adjacent solder strip areas.

[0046] In the embodiment, the first sub-grid and the second sub-grid are alternately arranged at intervals in the second direction. The first insulating glue is arranged on the first sub-grid and covers at least 1 / 2 of the length of the first sub-grid between two adjacent solder strip areas. The second insulating glue is arranged on the second sub-grid and covers at least 1 / 2 of the length of the second sub-grid between two adjacent solder strip areas. All the positive or negative sub-grid lines on both sides of the solder strip area can be covered, realizing a full-coverage stencil design for the sub-grid lines, and further avoiding the problem of short circuit caused by the solder paste falling and simultaneously contacting two different-polarity sub-grid lines.

[0047] According to some other embodiments of the present application, as Figure 2 shown, the orthographic projections of the first insulating glue 14 and the second insulating glue 15 also overlap with the solder strip area 12 respectively. The first insulating glue 14 and the second insulating glue 15 respectively include: a first insulating part 16 extending along the first direction, and the first insulating part 16 is axisymmetric about a third target solder strip area, and the third target solder strip area is the solder strip area 12 overlapping with the first insulating part 16; two second insulating parts 17 respectively connected to the two ends of the first insulating part 16 along the first direction, the second insulating part 17 extends along the first direction, and the length of the second insulating part in the second direction is less than the length of the first insulating part in the second direction. In this embodiment, the first insulating glue and the second insulating glue with a wide middle and narrow sides are provided, further ensuring a good electrical isolation effect of the insulating glue and avoiding the risk of short circuit caused by the contact between the solder strip and the sub-grid line with a different polarity due to the offset of the solder strip or the insulating glue.

[0048] Further, the length of the first insulating portion in the first direction is 1.2 to 2 mm. For example, the length of the first insulating portion in the first direction may be 1.2 mm, 1.3 mm, 1.5 mm, 1.7 mm, or 2 mm, etc.; the length of the first insulating portion in the second direction is 0.4 to 0.46 mm. For example, the length of the first insulating portion in the second direction may be 0.4 mm, 0.41 mm, 0.42 mm, 0.43 mm, 0.44 mm, 0.45 mm, or 0.46 mm, etc.; the length of the second insulating portion in the second direction is 0.2 to 0.25 mm. By setting the length and width of the first insulating portion and the width of the second insulating portion within the above ranges, the insulating effect of the insulating glue can be ensured to be good, and the increase in the manufacturing cost of the back-contact battery caused by the oversize of the insulating glue can be avoided.

[0049] According to other embodiments of the present application, as Figure 3 shown, the first sub-grid 111 and the second sub-grid 112 are disconnected at the solder strip area 12 to form a plurality of sub-grid portions 113 arranged at intervals in the first direction. The first insulating glue 14 and the second insulating glue 15 respectively include: a plurality of third insulating portions 18 arranged at intervals in the first direction, and the target portions of the sub-grid portions 113 are respectively located in the orthographic projection of the third insulating portions 18 on the battery body. The target portion of the sub-grid portion 113 is the end portion of the sub-grid portion 113 close to the solder strip area 12; a plurality of fourth insulating portions 19 arranged at intervals in the first direction, and the fourth insulating portions 19 are respectively located at the end portions of the third insulating portions 18 away from the solder strip area 12. The length of the fourth insulating portion in the second direction is less than the length of the third insulating portion in the second direction. In this embodiment, the end portions of the first insulating glue and the second insulating glue close to the solder strip area are designed to be relatively wide, which further ensures good electrical isolation effect of the insulating glue, and avoids the risk of short circuit caused by the contact between the solder strip and the sub-grid line with different polarities due to the offset of the solder strip or the insulating glue. The end portions of the first insulating glue and the second insulating glue away from the solder strip area are designed to be relatively narrow, which can save the amount of the first insulating glue and the second insulating glue on the basis of ensuring the electrical isolation effect.

[0050] Further, the length of the third insulating portion in the first direction is 1.2 - 2 mm. For example, the length of the third insulating portion in the first direction may be 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, or 2 mm; the length of the third insulating portion in the second direction is 0.4 - 0.46 mm. For example, the length of the third insulating portion in the second direction may be 0.4 mm, 0.42 mm, 0.44 mm, 0.45 mm, or 0.46 mm; the length of the fourth insulating portion in the second direction is 0.2 - 0.25 mm. For example, the length of the fourth insulating portion in the second direction may be 0.2 mm, 0.21 mm, 0.23 mm, or 0.25 mm. Setting the length and width of the third insulating portion and the width of the fourth insulating portion within the above ranges can not only ensure good insulation effect of the insulating glue, but also avoid the increase in the manufacturing cost of the back contact battery caused by the oversize of the insulating glue.

[0051] According to another aspect of the present application, a photovoltaic module is provided, including: a first cover plate; a first encapsulant film located on the first cover plate; a battery string located on the surface of the first encapsulant film away from the first cover plate, the battery string including a plurality of solder ribbons and a plurality of any one of the back contact batteries arranged at intervals, the solder ribbons being located on the solder ribbon regions of two adjacent back contact batteries; a second encapsulant film located on the surface of the battery string away from the first encapsulant film; and a second cover plate located on the surface of the second encapsulant film away from the battery string and the solder ribbons.

[0052] Through the above embodiments, the photovoltaic module includes a stacked first cover plate, a first encapsulant film, a battery string, a second encapsulant film, and a second cover plate. The battery string includes a plurality of the back contact batteries arranged at intervals and solder ribbons for connecting the back contact batteries. In the back contact battery, the battery body has scribe lines, a plurality of sub-grid lines, and a plurality of solder ribbon regions. A plurality of first conductive layers are provided on some of the sub-grid lines. The orthographic projection of the first conductive layer on the battery body overlaps with the solder ribbon region, and at least on the sub-grid lines adjacent to the scribe lines, no first conductive layer is provided, ensuring that the distance between the orthographic projection of any first conductive layer and the scribe line is greater than the distance between the scribe line and its adjacent sub-grid line. In this way, during the process of cutting the back contact battery along the scribe line, due to the scanning deviation of the laser head of the cutting machine, the laser head may scan to the first conductive layer on the sub-grid line adjacent to the scribe line, causing the first conductive layer to splash and connect to the sub-grid line with a different polarity, resulting in the short circuit of the back contact battery. This ensures a high processing yield of the back contact battery, and thus a high manufacturing yield of the photovoltaic module.

[0053] Specifically, the first cover plate is usually made of transparent and high-strength glass or transparent plastic and is located at the forefront of the photovoltaic module. Its main function is to protect the battery cells from mechanical damage and environmental erosion while allowing sunlight to penetrate and reach the battery cells. The first cover plate also has a high light transmittance to ensure maximum utilization of solar energy. The first encapsulant film is a kind of encapsulation material, such as EVA (ethylene-vinyl acetate copolymer) or POE (polyolefin elastomer). It is located between the first cover plate and the battery string and serves to bond the battery cells to the cover plate and seal the battery cells during the lamination process to prevent moisture and air from entering and protect the battery cells from corrosion. At the same time, the first encapsulant film can also absorb external impacts and reduce the mechanical stress on the battery cells. The battery string is the core component of the photovoltaic module and is formed by connecting multiple back-contact cells through solder ribbons. The battery string connects multiple back-contact cells in series to increase the voltage output of the module and also connects them in parallel to increase the current output. The solder ribbons are used for electrical connection between adjacent back-contact cells and are usually made of tinned copper strips. The two ends are soldered to the backside sub-grid lines of the battery cells through solder paste. The solder ribbons not only provide a path for current transmission but also help keep the battery cells in a fixed position in the battery string and enhance the structural stability of the battery string. The second encapsulant film is similar to the first encapsulant film and is also a kind of encapsulation material located between the battery string and the second cover plate. Its function is to fix the battery string in the module, provide electrical insulation and environmental protection at the same time. The second encapsulant film also plays a role in buffering and absorbing external stresses to protect the battery string from damage. The second cover plate is located at the back of the photovoltaic module and is usually made of transparent or opaque materials such as glass, plastic or backsheet film. For back-contact cells, the second cover plate is usually opaque to block the light on the back side and avoid light passing through the back grid line area of the battery, thereby improving the battery efficiency. In addition, the second cover plate also provides additional mechanical protection and environmental protection to prevent the back side from being eroded. These components in the photovoltaic module work together to ensure that the module can effectively convert solar energy into electrical energy, protect the internal battery cells from the external environment and mechanical stresses, and maintain the long-term stability and reliability of the module.

[0054] Optionally, the photovoltaic module further includes: a modified crosslinked film, which is located on the surface of the solder ribbon and the back contact cell, and the modulus of the modified crosslinked film is greater than or equal to 10 GPa. In this application, a high-modulus modified crosslinked film is used to fix the solder ribbon in the solder ribbon area of the back contact cell. Compared with the conventional crosslinked film, the modified high-modulus crosslinked film in this application has better fluidity and filling ability during the heating process, as well as higher strength and adhesion after curing. This means that the high-modulus modified crosslinked film can be more evenly distributed and tightly wrap the cell and the solder ribbon during heating, forming a more solid encapsulation layer, reducing the formation of bubbles and voids, improving the integrity and reliability of the encapsulation, significantly improving the film covering effect, reducing or eliminating the blackening phenomenon that occurs in the EL test due to poor contact between the solder ribbon and the cell, ultimately enhancing the electrical performance and reliability of the photovoltaic module, and avoiding performance losses and component failures caused by poor encapsulation.

[0055] Specifically, the modified crosslinked film can be a modified EVA (ethylene-vinyl acetate copolymer) film.

[0056] The method embodiments provided in the embodiments of this application can be executed on a mobile terminal, a computer terminal, or a similar computing device. Taking running on a mobile terminal as an example, Figure 4 is a hardware structure block diagram of a mobile terminal for a manufacturing method of a photovoltaic module according to an embodiment of the present invention. As Figure 4 shown, the mobile terminal may include one or more ( Figure 4 only one is shown in the figure) processors 102 (the processor 102 may include, but is not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data. Among them, the mobile terminal may further include a transmission device 106 for communication functions and an input / output device 108. Those of ordinary skill in the art can understand that Figure 4 the structure shown is only schematic and does not limit the structure of the mobile terminal. For example, the mobile terminal may further include more or fewer components than Figure 4 shown in the figure, or have a different configuration from Figure 4 shown in the figure.

[0057] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the manufacturing method of the photovoltaic module in the embodiments of the present invention. The processor 102 executes various functional applications and data processing by running the computer programs stored in the memory 104, that is, the described method is implemented. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memories. In some instances, the memory 104 may further include a memory remotely disposed relative to the processor 102, and these remote memories can be connected to the mobile terminal through a network. Examples of the network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof. The transmission device 106 is used to receive or send data via a network. Specific examples of the network may include a wireless network provided by a communication provider of the mobile terminal. In one instance, the transmission device 106 includes a network adapter (Network Interface Controller, abbreviated as NIC), which can be connected to other network devices through a base station and thus communicate with the Internet. In one instance, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0058] In this embodiment, a manufacturing method of a photovoltaic module running on a mobile terminal, a computer terminal, or a similar computing device is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order than here.

[0059] Figure 5 is a flowchart of the manufacturing method of the photovoltaic module according to the embodiments of the present application. As Figure 5 shown, the method includes the following steps:

[0060] Step S201: Provide a first cover plate and dispose a first adhesive film on the first cover plate;

[0061] Step S202: Control the picking and placing structure to pick up a plurality of solder tapes and a plurality of any one of the back contact batteries, and place the plurality of solder tapes and the plurality of back contact batteries on the surface of the first adhesive film away from the first cover plate. As Figure 6 shown, the contact area 20 between the picking and placing structure and the back contact battery is located between two adjacent solder tape areas 12 of the back contact battery, and the width of the contact area 20 is less than the distance between two adjacent solder tape areas 12;

[0062] Specifically, the contact area refers to the position where the pick-and-place structure picks up the back-contact battery, and this contact area does not contact the solder tape area. The pick-and-place structure can be the suction nozzle and chuck of the welding equipment, which picks up the back-contact battery and the solder tape by suction.

[0063] Step S203: Weld the solder tape to the solder tape area of the back-contact battery, so that adjacent back-contact batteries are connected in series through the solder tape to form a battery string.

[0064] Step S204: Stack a second adhesive film and a second cover plate on the surface of the battery string away from the first adhesive film, and perform heating and lamination curing in sequence to form the photovoltaic module.

[0065] Through the above embodiments, first, a first cover plate provided with a first adhesive film is provided; then, the pick-and-place structure is controlled to pick up a plurality of solder tapes and a plurality of back-contact batteries, and place them on the surface of the first adhesive film away from the first cover plate. The contact area between the pick-and-place structure and the back-contact battery is located between two solder tape areas and does not contact the solder tape area; then, the solder tape and the back-contact battery are welded so that a plurality of back-contact batteries are connected into a battery string through the solder tape; finally, a second adhesive film and a second cover plate are stacked on the surface of the battery string away from the first adhesive film, and heating and lamination curing are performed to obtain a photovoltaic module. In the back-contact battery, the battery body has a cutting channel, a plurality of sub-grid lines and a plurality of solder tape areas. A plurality of first conductive layers are provided on some of the sub-grid lines. The orthographic projection of the first conductive layer on the battery body overlaps with the solder tape area, and at least on the sub-grid lines adjacent to the cutting channel, no first conductive layer is provided, ensuring that the distance between the orthographic projection of any first conductive layer and the cutting channel is greater than the distance between the cutting channel and its adjacent sub-grid line. In this way, during the process of cutting the back-contact battery along the cutting channel, due to the scanning deviation of the laser head of the cutting machine, the laser head scans to the first conductive layer on the sub-grid line adjacent to the cutting channel, causing the first conductive layer to splash and connect to the sub-grid line with a different polarity, resulting in the problem of short circuit of the back-contact battery, ensuring a high processing yield of the back-contact battery, and thus ensuring a high manufacturing yield of the photovoltaic module. In addition, in this application, by modifying the size of the contact area between the pick-and-place structure and the back-contact battery, the size of the contact area is made smaller than the distance between two solder tape areas, ensuring that the first conductive layer will not be contacted during picking, and avoiding the problem that the semi-cured first conductive layer adheres to the pick-and-place structure due to a large picking force or picking friction, resulting in blackening of some areas of the back-contact battery, or the problem that the first conductive layer falls to other positions and causes a short circuit of the battery.

[0066] Optionally, before placing the plurality of the welding tapes and the plurality of the back-contact cells on the surface of the first adhesive film away from the first cover plate, the method further includes: disposing a modified crosslinked film on the back-contact cells and the welding tapes to obtain a preliminary structure; heating the preliminary structure at 120-130 °C to crosslink the modified crosslinked film so as to fix the welding tapes. In this embodiment, the modified crosslinked film with high modulus can be more evenly distributed and tightly wrap the cell and the welding tape during heating by heating the modified crosslinked film at a temperature of 120-130 °C, forming a more firm encapsulation layer, reducing the formation of bubbles and voids, improving the integrity and reliability of the encapsulation, significantly improving the film covering effect, reducing or eliminating the blackening phenomenon occurring in the EL test due to poor contact between the welding tape and the cell, ultimately enhancing the electrical performance and reliability of the photovoltaic module, and avoiding performance loss and component failure caused by poor encapsulation.

[0067] It should be noted that the steps shown in the flowchart of the drawings can be executed in a computer system such as a set of computer-executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order than here.

[0068] Obviously, those skilled in the art should understand that the various modules or steps of the present invention can be implemented by a general-purpose computing device. They can be concentrated on a single computing device or distributed on a network composed of multiple computing devices. They can be implemented by program codes executable by the computing device, so that they can be stored in a storage device and executed by the computing device. And in some cases, the steps shown or described can be executed in a different order than here, or they can be separately fabricated into individual integrated circuit modules, or multiple modules or steps among them can be fabricated into a single integrated circuit module to be implemented. In this way, the present invention is not limited to any specific combination of hardware and software.

[0069] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system, or a computer program product. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0070] This application is described with reference to the flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present application. It should be understood that each flow and / or block in the flowchart and / or block diagram can be implemented by computer program instructions, as well as the combination of flows and / or blocks in the flowchart and / or block diagram. These computer program instructions can be provided to the processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing device to generate a machine, such that the instructions executed by the processor of the computer or other programmable data processing device produce means for implementing the functions specified in one flow Figure 1 one flow or multiple flows and / or blocks Figure 1 or means for implementing the functions specified in multiple blocks.

[0071] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, such that the instructions stored in the computer-readable memory produce a manufactured article including instruction means that implement the functions specified in one flow Figure 1 one flow or multiple flows and / or blocks Figure 1 or means for implementing the functions specified in multiple blocks.

[0072] These computer program instructions can also be loaded onto a computer or other programmable data processing device, such that a series of operation steps are executed on the computer or other programmable device to generate a computer-implemented process, and thus the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one flow Figure 1 one flow or multiple flows and / or blocks Figure 1 or means for implementing the functions specified in multiple blocks.

[0073] In a typical configuration, a computing device includes one or more processors (CPUs), an input / output interface, a network interface, and memory.

[0074] The memory may include non-permanent memory in the form of computer-readable media, random access memory (RAM), and / or non-volatile memory such as read-only memory (ROM) or flash memory (flash RAM). The memory is an example of computer-readable media.

[0075] A computer-readable medium includes both permanent and non-permanent, removable and non-removable media and can implement information storage by any method or technology. The information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette tapes, magnetic tape disk storage or other magnetic storage devices, or any other non-transitory medium that can be used to store information accessible by a computing device. As defined herein, a computer-readable medium does not include transitory computer-readable media such as modulated data signals and carrier waves.

[0076] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or apparatus comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or apparatus. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising the element.

[0077] From the above description, it can be seen that the embodiments described in this application achieve the following technical effects:

[0078] 1). For the back-contact battery of this application, the battery body has cutting channels, a plurality of sub-grid lines, and a plurality of solder tab areas. A plurality of first conductive layers are provided on some of the sub-grid lines. The orthographic projection of the first conductive layer on the battery body overlaps with the solder tab area, and at least on the sub-grid lines adjacent to the cutting channels, no first conductive layer is provided, ensuring that the distance between the orthographic projection of any first conductive layer and the cutting channel is greater than the distance between the cutting channel and its adjacent sub-grid line. In this way, during the process of cutting the back-contact battery along the cutting channel, due to the scanning deviation of the laser head of the cutting machine, it is possible to prevent the laser head from scanning the first conductive layer on the sub-grid line adjacent to the cutting channel, causing the first conductive layer to spatter and connect to the sub-grid line with a different polarity, resulting in the problem of short circuit of the back-contact battery, and ensuring a high processing yield of the back-contact battery.

[0079] 2), The photovoltaic module of the present application includes a stacked first cover plate, a first encapsulant film, a battery string, a second encapsulant film, and a second cover plate. The battery string includes a plurality of the back-contact batteries arranged at intervals and solder tapes for connecting the back-contact batteries. In the back-contact battery, the battery body has scribe lines, a plurality of sub-grid lines, and a plurality of solder-tape areas. A plurality of first conductive layers are provided on some of the sub-grid lines. The orthographic projection of the first conductive layer on the battery body overlaps with the solder-tape areas, and at least on the sub-grid lines adjacent to the scribe lines, no first conductive layer is provided, ensuring that the distance between the orthographic projection of any first conductive layer and the scribe line is greater than the distance between the scribe line and its adjacent sub-grid line. In this way, during the process of cutting the back-contact battery along the scribe line, due to the scanning deviation of the laser head of the cutting machine, the laser head may scan to the first conductive layer on the sub-grid line adjacent to the scribe line, causing the first conductive layer to splash and connect to the sub-grid line with a different polarity, resulting in the problem of short circuit of the back-contact battery. This ensures a high processing yield of the back-contact battery, and thus ensures a high manufacturing yield of the photovoltaic module.

[0080] 3), In the manufacturing method of the photovoltaic module of the present application, first, a first cover plate provided with a first encapsulant film is provided; then, a pick-and-place structure is controlled to pick up a plurality of solder tapes and a plurality of back-contact batteries and place them on the surface of the first encapsulant film away from the first cover plate. The contact area between the pick-and-place structure and the back-contact battery is located between two solder-tape areas and does not contact the solder-tape areas; then, the solder tapes and the back-contact batteries are welded so that a plurality of back-contact batteries are connected into a battery string through the solder tapes; finally, a second encapsulant film and a second cover plate are stacked on the surface of the battery string away from the first encapsulant film, and heating and lamination curing are performed to obtain the photovoltaic module. In the back-contact battery, the battery body has scribe lines, a plurality of sub-grid lines, and a plurality of solder-tape areas. A plurality of first conductive layers are provided on some of the sub-grid lines. The orthographic projection of the first conductive layer on the battery body overlaps with the solder-tape areas, and at least on the sub-grid lines adjacent to the scribe lines, no first conductive layer is provided, ensuring that the distance between the orthographic projection of any first conductive layer and the scribe line is greater than the distance between the scribe line and its adjacent sub-grid line. In this way, during the process of cutting the back-contact battery along the scribe line, due to the scanning deviation of the laser head of the cutting machine, the laser head may scan to the first conductive layer on the sub-grid line adjacent to the scribe line, causing the first conductive layer to splash and connect to the sub-grid line with a different polarity, resulting in the problem of short circuit of the back-contact battery. This ensures a high processing yield of the back-contact battery, and thus ensures a high manufacturing yield of the photovoltaic module. In addition, by modifying the size of the contact area between the pick-and-place structure and the back-contact battery, the size of the contact area is made smaller than the distance between two solder-tape areas, ensuring that the first conductive layer will not be contacted during picking, and avoiding the problem that the semi-cured first conductive layer adheres to the pick-and-place structure due to a large picking force or picking friction, resulting in blackening of some areas of the back-contact battery, or the problem that the first conductive layer falls to other positions and causes battery short circuit.

[0081] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various modifications and variations can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A back contact battery, characterized in that: include: A battery body, wherein the battery body comprises a cutting path, a plurality of secondary grid lines and a plurality of welding strip regions, the plurality of secondary grid lines and the cutting path extend along a first direction, the plurality of secondary grid lines are arranged at intervals on at least one side of the cutting path along a second direction, the first direction intersects with the second direction, the plurality of welding strip regions extend along the second direction and are arranged at intervals along the first direction, the welding strip regions intersect with the plurality of secondary grid lines, the plurality of secondary grid lines comprise a plurality of first secondary grids and a plurality of second secondary grids, the first secondary grids and the second secondary grids are arranged alternately and at intervals along the second direction, and the first secondary grids and the second secondary grids have different polarities; A plurality of first conductive layers are arranged at intervals along the first direction and the second direction, the plurality of first conductive layers are located on the battery body, the auxiliary grid line overlaps with the orthographic projection of the first conductive layer on the battery body, one of the welding strip regions overlaps with the orthographic projections of the plurality of first conductive layers, and the distance between the orthographic projection of any first conductive layer and the cutting path is greater than a target distance, and the target distance is the distance between the auxiliary grid line closest to the cutting path and the cutting path, A plurality of first insulating glues are arranged at intervals along the second direction, the plurality of first insulating glues are located on the battery body, the orthographic projection of the first insulating glue on the battery body at least overlaps with the first auxiliary grid, the maximum distance between the orthographic projection of the first insulating glue and a first target welding strip area in the first direction is less than or equal to half of the distance between two adjacent welding strip areas, and the first target welding strip area is the welding strip area adjacent to the first insulating glue in the first direction; A plurality of second insulating glues are arranged at intervals along the second direction, and a plurality of the second insulating glues are located on the battery body. The orthographic projection of the second insulating glue on the battery body at least overlaps with the second sub-grid. The maximum distance between the orthographic projection of the second insulating glue and the second target welding strip area in the first direction is less than or equal to half of the distance between two adjacent welding strip areas. The second target welding strip area is the welding strip area adjacent to the second insulating glue in the first direction.

2. The back contact cell according to claim 1, characterized in that: The length of the first conductive layer in the first direction is 1.0-1.2 mm, and the length of the first conductive layer in the second direction is 0.15-0.25 mm.

3. The back contact cell according to claim 1, characterized in that: The orthographic projections of the first insulating glue and the second insulating glue also overlap with the welding strip area respectively, and the first insulating glue and the second insulating glue respectively include: A first insulating portion extending along the first direction, the first insulating portion being symmetrical about a third target soldering strip region, the third target soldering strip region being the soldering strip region overlapping the first insulating portion; Two second insulating parts are respectively connected to two ends of the first insulating part along the first direction. The second insulating parts extend along the first direction. The length of the second insulating parts in the second direction is less than the length of the first insulating parts in the second direction.

4. The back contact cell according to claim 1, characterized in that: The first auxiliary grid and the second auxiliary grid are disconnected at the welding strip area to form a plurality of auxiliary grid portions arranged at intervals along the first direction, and the first insulating glue and the second insulating glue respectively include: A plurality of third insulating portions are arranged at intervals along the first direction, the target portions of the auxiliary grid portions are located one by one in the orthographic projection of the third insulating portions on the battery body, and the target portions of the auxiliary grid portions are the ends of the auxiliary grid portions close to the welding strip area; A plurality of fourth insulating portions are arranged at intervals along the first direction, the fourth insulating portions are located one by one at the ends of the third insulating portion away from the welding strip area, and the length of the fourth insulating portion in the second direction is less than the length of the third insulating portion in the second direction.

5. The back contact cell according to claim 4, characterized in that: The length of the third insulating portion in the first direction is 1.2-2 mm, the length of the third insulating portion in the second direction is 0.4-0.46 mm, and the length of the fourth insulating portion in the second direction is 0.2-0.25 mm.

6. A photovoltaic module, characterized in that: include: first cover plate; A first adhesive film, located on the first cover plate; A battery string, located on a surface of the first adhesive film away from the first cover plate, the battery string comprising a plurality of welding strips and a plurality of back contact batteries according to any one of claims 1 to 5 arranged at intervals, the welding strips being located on welding strip regions of two adjacent back contact batteries; A second adhesive film is located on a surface of the battery string away from the first adhesive film; The second cover plate is located on a surface of the second adhesive film away from the battery string and the welding strip.

7. The photovoltaic module according to claim 6, characterized in that: The photovoltaic module further comprises: A modified cross-linked film, wherein the modified cross-linked film is located on the surface of the solder strip and the back contact battery, and the modulus of the modified cross-linked film is greater than or equal to 10 GPa.

8. A method for manufacturing a photovoltaic module, characterized in that: include: Providing a first cover plate, and disposing a first adhesive film on the first cover plate; Controlling the pick-and-place structure to pick up a plurality of solder strips and a plurality of back-contact batteries according to any one of claims 1 to 5, and placing the plurality of solder strips and the plurality of back-contact batteries on a surface of the first adhesive film away from the first cover plate, wherein a contact area between the pick-and-place structure and the back-contact battery is located between two adjacent solder strip areas of the back-contact battery, and a width of the contact area is smaller than a distance between two adjacent solder strip areas; Welding the welding ribbon to the welding ribbon area of ​​the back contact battery so that two adjacent back contact batteries are connected in series through the welding ribbon to form a battery string; A second adhesive film and a second cover plate are stacked on the surface of the battery string away from the first adhesive film, and heating and lamination curing are performed in sequence to form the photovoltaic module.

9. The method according to claim 8, characterized in that Before placing the plurality of welding ribbons and the plurality of back contact cells on the surface of the first adhesive film away from the first cover plate, the method further comprises: Disposing a modified cross-linked film on the back contact cell and the solder strip to obtain a preliminary structure; The prepared structure is heated at 120-130° C. to cross-link the modified cross-linked film, thereby fixing the welding strip.

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