Substrate comprising edge surface

Abstract

The edge surface (111, 211) includes a first peripheral surface (123, 223) extending between the first major surface (105) and the outer peripheral surface (113) of the substrate (101, 201). The first peripheral surface (123, 223) includes a first depth (124) and a first width (126). In aspects, the first depth (124) is from about 4 microns to about 12 microns, and the first width (126) is from about 30 microns to about 50 microns. In aspects, the first depth (124) is from about 14 microns to about 24 microns, and the first width (126) is from about 40 microns to about 60 microns. In aspects, a ratio of the first depth (124) to the substrate thickness (109) is from about 0.2 to about 0.4, a ratio of the first width (126) to the substrate thickness (109) is from about 1 to about 1.55, and a ratio of the first width (126) to the first depth (124) is from about 2 to about 8.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority under 35 USC §119 to U.S. Provisional Application No. 63 / 390,010, filed on July 18, 2022, the contents of which are relied upon and incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure relates generally to substrates including edge surfaces, and more particularly to substrates including edge surfaces having an outer peripheral surface, a first peripheral surface, and a second peripheral surface. Background Art

[0004] Foldable substrates are often used in, for example, display applications (eg, liquid crystal display (LCD), electrophoretic display (EPD), organic light-emitting diode display (OLED), plasma display panel (PDP), etc.).

[0005] It is desirable to develop a display and a protective cover mounted on the display. The display and the cover should have good impact resistance and puncture resistance. At the same time, the display and the cover should be foldable, for example, with a small parallel plate distance (e.g., about 10 millimeters (mm) or less).

[0006] Therefore, there is a need to develop a substrate for a display device and / or a foldable device having high transparency, low haze, a low minimum parallel plate distance, and good edge strength. Summary of the invention

[0007] The present invention discloses a substrate including an edge surface between a first major surface and a second major surface. The dimensions of the first peripheral surface between the outer peripheral surface of the edge surface and the first major surface and / or the second peripheral surface between the outer peripheral surface and the second major surface (e.g., the first width, the second width, the first depth, the second depth, their ratios, and the ratios relative to the thickness of the substrate) can reduce damage to the substrate, simplify handling of the substrate, and / or improve the edge strength of the substrate without compromising subsequent processing (e.g., coating) of the substrate.

[0008] Damage to the substrate can be reduced by avoiding stress concentration (e.g., from sharp corners). For example, the first peripheral surface and / or the second peripheral surface replace the sharp corner between the first main surface and the initial edge surface. Similarly, providing a ratio of the first width to the first depth and / or the ratio of the second width to the second depth in the range of about 2 to about 8 (e.g., about 2 to about 4, about 4 to about 8, about 4 to about 6, about 4 to about 5.5) can reduce stress concentration at the angle where the corresponding peripheral surface intersects with the corresponding main surface. In addition, providing a ratio of the first depth and / or the second depth to the thickness of the substrate of about 0.1 to about 0.4 (e.g., about 0.15 to about 0.4, about 0.2 to about 0.4, about 0.25 to about 0.35) can make the thickness of the outer peripheral surface large enough to avoid stress concentration at the intersection of the first peripheral surface and the second peripheral surface with the outer peripheral surface. In addition, providing a ratio of the first width and / or the second width to the substrate thickness of about 0.3 to about 1.6 (e.g., about 0.5 to about 1.55, about 1 to about 1.55) can separate the intersection of the corresponding peripheral surface with the corresponding major surface and the intersection of the corresponding peripheral surface with the outer peripheral surface, which can improve the edge strength of the substrate. One or more of these aspects (e.g., the dimensions and / or ratios recited above in this paragraph) can improve the edge strength (e.g., a B10 edge strength of about 1000 megapascals (MPa) or greater and / or about 1200 MPa to about 1700 MPa, a median edge strength of about 1700 MPa or greater and / or about 1900 MPa to about 2500 MPa).

[0009] For a substrate having a thickness of about 25 micrometers (μm) to about 35 μm, providing a first depth and / or a second depth of about 4 μm to about 12 μm and a first width and / or a second width of about 30 μm to about 50 μm can reduce damage to the substrate, simplify processing of the substrate, and improve the edge strength of the substrate. For a substrate having a thickness of about 35 μm or more, providing a first depth and / or a second depth of about 14 μm to about 24 μm and a first width and / or a second width of about 40 μm to about 60 μm can reduce damage to the substrate, simplify processing of the substrate, and improve the edge strength of the substrate.

[0010] Providing a ratio of the first depth and / or the second depth to the substrate thickness of about 0.1 to about 0.4 (e.g., about 0.15 to about 0.4, about 0.2 to about 0.4, about 0.25 to about 0.35) can allow the thickness of the outer peripheral surface to be large enough so that the edge surface is blunt enough to reduce processing concerns, which can simplify processing of the substrate.

[0011] Providing a first width to first depth ratio and / or a second width to second depth ratio in a range of about 2 to about 8 (e.g., about 2 to about 4, about 4 to about 8, about 4 to about 6, about 4 to about 5.5) can make the corresponding peripheral surface shallow enough to prevent viscous material disposed on the corresponding major surface from flowing out of the edge surface, which allows for in-situ formation of a coating on the substrate. Avoiding viscous fluid from flowing out of the edge surface can reduce material waste, avoid contamination of processing equipment and / or additional cleaning for removing such viscous fluid.

[0012] Providing a substrate including a glass-based material or a ceramic-based material can enhance puncture resistance and / or impact resistance. In addition, such a substrate can be chemically strengthened to further enhance the impact resistance and / or puncture resistance of the foldable device. In addition, edge surfaces including the peripheral surfaces described herein can improve bendability by removing stress concentrations on the edges of the substrate (e.g., achieving a parallel plate distance in the range of about 1 mm to about 10 mm).

[0013] Some example aspects of the present disclosure are described below, and it should be understood that any of the features of the various aspects may be used alone or in combination with each other.

[0014] Aspect 1. A substrate, comprising:

[0015] a first major surface extending along a first plane;

[0016] a second major surface extending along a second plane substantially parallel to the first plane;

[0017] a substrate thickness in a range of about 25 micrometers to about 35 micrometers, the substrate thickness being defined between a first plane and a second plane in a thickness direction perpendicular to the first major surface; and

[0018] an edge surface extending between the first major surface and the second major surface, the edge surface including an outer peripheral point, the edge surface comprising:

[0019] an outer peripheral surface including a portion of the edge surface within 5 micrometers of an outer plane that is perpendicular to the first major surface and intersects the outer peripheral point;

[0020] a first peripheral surface extending between the first major surface and the outer peripheral surface, and comprising:

[0021] a first depth, the first depth being defined as a minimum distance between the outer peripheral surface and the first plane in a thickness direction, the first depth being in a range from about 4 microns to about 12 microns; and

[0022] a first width, the first width being defined as a minimum distance between the outer peripheral surface and the first major surface along a first direction along which the first plane extends, the first width being in a range from about 30 micrometers to about 50 micrometers; and

[0023] a second peripheral surface extending between the second major surface and the outer peripheral surface, the second peripheral surface comprising:

[0024] a second depth, the second depth being defined as a minimum distance between the outer peripheral surface and the second plane in the thickness direction, the second depth being in a range from about 4 microns to about 12 microns; and

[0025] A second width, defined as a minimum distance between the outer peripheral surface and the second major surface along a first direction, along which the first plane extends, is in a range of about 30 micrometers to about 50 micrometers.

[0026] Aspect 2. The substrate of aspect 1, wherein the first depth is in a range from about 6 microns to about 10 microns.

[0027] Aspect 3. The substrate of any one of aspects 1 to 2, wherein a ratio of the first width to the substrate thickness is in a range from about 1 to about 1.6.

[0028] Aspect 4. The substrate of aspect 3, wherein a ratio of the first width to the substrate thickness is in a range from about 1.1 to about 1.55.

[0029] Aspect 5. The substrate of any one of Aspects 1 to 4, wherein a ratio of the first width to the first depth is in a range from about 4 to about 8.

[0030] Aspect 6. The substrate of aspect 5, wherein a ratio of the first width to the first depth is in a range from about 4 to about 6.

[0031] Aspect 7. The substrate of any one of Aspects 1 to 6, wherein a ratio of the first depth to the substrate thickness is in a range from about 0.2 to about 0.4.

[0032] Aspect 8. The substrate of aspect 7, wherein a ratio of the first depth to the substrate thickness is in a range from about 0.25 to about 0.35.

[0033] Aspect 9. A substrate comprising:

[0034] a first major surface extending along a first plane;

[0035] a second major surface extending along a second plane substantially parallel to the first plane;

[0036] a substrate thickness of about 35 microns or greater, the substrate thickness being defined between a first plane and a second plane in a thickness direction perpendicular to the first major surface; and

[0037] an edge surface extending between the first major surface and the second major surface, the edge surface including an outer peripheral point, the edge surface comprising:

[0038] an outer peripheral surface including a portion of the edge surface within 5 micrometers of an outer plane that is perpendicular to the first major surface and intersects the outer peripheral point;

[0039] a first peripheral surface extending between the first major surface and the outer peripheral surface, the first peripheral surface comprising:

[0040] a first depth, the first depth being defined as a minimum distance between the outer peripheral surface and the first plane in the thickness direction, the first depth being in a range from about 14 microns to about 24 microns; and

[0041] a first width, the first width being defined as a minimum distance between the outer peripheral surface and the first major surface along a first direction along which the first plane extends, the first width being in a range from about 40 micrometers to about 60 micrometers; and

[0042] a second peripheral surface extending between the second major surface and the outer peripheral surface, the second peripheral surface comprising:

[0043] a second depth, the second depth being defined as a minimum distance between the outer peripheral surface and the second plane in the thickness direction, the second depth being in a range from about 14 microns to about 24 microns; and

[0044] A second width, defined as a minimum distance between the outer peripheral surface and the second major surface along a first direction, along which the first plane extends, is in a range of about 40 micrometers to about 60 micrometers.

[0045] Aspect 10. The substrate of aspect 9, wherein the substrate thickness is in a range from about 35 microns to about 300 microns.

[0046] Aspect 11. The substrate of aspect 10, wherein the substrate thickness is in a range from about 50 microns to about 200 microns.

[0047] Aspect 12. The substrate of any one of Aspects 9 to 11, wherein a ratio of the first width to the substrate thickness is in a range from about 0.3 to about 1.6.

[0048] Aspect 13. The substrate of aspect 12, wherein a ratio of the first width to the substrate thickness is in a range from about 0.5 to about 1.55.

[0049] Aspect 14. The substrate of any one of Aspects 9 to 13, wherein a ratio of the first width to the first depth is in a range from about 2 to about 4.

[0050] Aspect 15. The substrate of aspect 14, wherein a ratio of the first width to the first depth is in a range from about 2.5 to about 3.

[0051] Aspect 16. The substrate thickness of any one of Aspects 9 to 15, wherein a ratio of the first depth to the substrate thickness is in a range from about 0.15 to about 0.4.

[0052] Aspect 17. The substrate of aspect 16, wherein a ratio of the first depth to the substrate thickness is in a range from about 0.15 to about 0.35.

[0053] Aspect 18. A substrate, comprising:

[0054] a first major surface extending along a first plane;

[0055] a second major surface extending along a second plane substantially parallel to the first plane;

[0056] a substrate thickness defined between a first plane and a second plane in a thickness direction perpendicular to the first major surface; and

[0057] an edge surface extending between the first major surface and the second major surface, the edge surface including an outer peripheral point, the edge surface comprising:

[0058] an outer peripheral surface including a portion of the edge surface within 5 micrometers of an outer plane that is perpendicular to the first major surface and intersects the outer peripheral point;

[0059] a first peripheral surface extending between the first major surface and the outer peripheral surface, the first peripheral surface including a first depth and a first width, the first depth being defined as a minimum distance between the outer peripheral surface and a first plane in a thickness direction, the first width being defined as a minimum distance between the outer peripheral surface and the first major surface along a first direction, the first plane extending along the first direction; and

[0060] a second peripheral surface extending between the second major surface and the outer peripheral surface, the second peripheral surface including a second depth and a second width, the second depth being defined as a minimum distance between the outer peripheral surface and the second plane in a thickness direction, the second width being defined as a minimum distance between the outer peripheral surface and the second major surface along a first direction, the first plane extending along the first direction,

[0061] Wherein a ratio of the first depth to the substrate thickness is in a range of about 0.2 to about 0.4, a ratio of the first width to the substrate thickness is in a range of about 1 to about 1.55, and a ratio of the first width to the first depth is in a range of about 2 to about 8.

[0062] Aspect 19. The substrate of aspect 18, wherein a ratio of the first width to the first depth is in a range from about 2 to about 6.

[0063] Aspect 20. The substrate of aspect 19, wherein a ratio of the first width to the first depth is in a range from about 2.5 to about 3.

[0064] Aspect 21. The substrate of aspect 19, wherein a ratio of the first width to the first depth is in a range from about 4 to about 5.5.

[0065] Aspect 22. The substrate of any one of Aspects 18 to 21, wherein a ratio of the first depth to the substrate thickness is in a range from about 0.25 to about 0.35.

[0066] Aspect 23. The substrate of any one of Aspects 1 to 22, wherein the first depth is substantially equal to the second depth.

[0067] Aspect 24. The substrate of any one of Aspects 1 to 23, wherein the first width is substantially equal to the second width.

[0068] Aspect 25. The substrate of any one of Aspects 1 to 24, wherein the substrate comprises a glass-based material or a ceramic-based material.

[0069] Aspect 26. A substrate as described in any of Aspects 1 to 25, wherein the first major surface includes a first compressive stress region extending from the first major surface to a first compression depth and a maximum first compressive stress of about 400 MPa or greater, and the second major surface includes a second compressive stress region extending from the second major surface to a second compression depth and a maximum second compressive stress of about 400 MPa or greater.

[0070] Aspect 27. The substrate of aspect 26, wherein the edge surface comprises an edge compressive stress region extending from the edge surface to an edge compression depth and a maximum edge compressive stress of about 400 MPa or greater.

[0071] Aspect 28. The substrate of aspect 27, wherein the maximum edge compressive stress is substantially equal to the maximum first compressive stress.

[0072] Aspect 29. The substrate of any of Aspects 1 to 28, wherein the substrate comprises a stress of about 1000 MPa or greater, at which stress the probability of failure is less than 10% for a two-point bend test (B10 edge strength).

[0073] Aspect 30. The substrate of aspect 29, wherein the B10 edge strength is in a range from about 1200 MPa to about 1700 MPa.

[0074] Aspect 31. The substrate of any one of Aspects 1 to 28, wherein the median edge strength in a two-point bend test is about 1700 MPa or greater.

[0075] Aspect 32. The substrate of aspect 31, wherein the median edge strength in a two-point bend test is in a range from about 1900 MPa to about 2500 MPa. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] The above and other features and advantages of various aspects of the present disclosure will be better understood when the following detailed description is read with reference to the accompanying drawings, in which:

[0077] Figure 1 to Figure 2 is a schematic diagram of an example substrate according to aspects of the present disclosure;

[0078] Figure 3 is a schematic plan view of an example consumer electronic device according to various aspects;

[0079] Figure 4 yes Figure 3 a schematic perspective view of an example consumer electronic device; and

[0080] Figure 5 is a schematic cross-sectional view of a parallel plate device.

[0081] Throughout this disclosure, the drawings are used to emphasize certain aspects. Therefore, unless otherwise explicitly stated, the relative sizes of different regions, parts, and substrates shown in the drawings should not be assumed to be proportional to their actual relative sizes. DETAILED DESCRIPTION

[0082] Various aspects will now be described more fully hereinafter with reference to the accompanying drawings, in which example aspects are shown. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.

[0083] Reference Figure 1 to Figure 2 The substrates 101 and 201 shown in the drawings are used to discuss the substrates of various aspects of the present disclosure. However, it should be understood that the substrate products are not limited to such aspects and can be used in various applications. Unless otherwise stated, the discussion of the features of various aspects of a coating or coated product can be equally applicable to the corresponding features of any aspect of the present disclosure. For example, the same component symbols throughout the present disclosure can indicate that in some aspects, the identified features are the same as each other, and unless otherwise stated, the discussion of the identified features of one aspect can be equally applicable to the identified features of any other aspect of the present disclosure.

[0084] like Figure 1 to Figure 2As shown, substrates 101 and 201 include substrate material 103, which may be a glass-based material and / or a ceramic-based material. As used herein, "glass-based" includes both glass and glass-ceramic, wherein the glass-ceramic has one or more crystalline phases and an amorphous residual glass phase. Glass-based materials (e.g., glass-based substrates) may include amorphous materials (e.g., glass) and optional one or more crystalline materials (e.g., ceramics). Amorphous materials and glass-based materials may be strengthened. As used herein, the term "strengthened" may refer to materials that have been chemically strengthened, for example, by exchanging smaller ions with larger ions in the surface of the substrate, as discussed below. However, other strengthening methods (e.g., thermal tempering, or using the mismatch of thermal expansion coefficients between the substrate parts to generate compressive stress and central tension regions) may be used to form a strengthened substrate. Exemplary glass-based materials that may not contain lithium oxide or contain lithium oxide include soda-lime glass, alkali-aluminosilicate glass, alkali-containing borosilicate glass, alkali-containing aluminum borosilicate glass, alkali-containing phosphosilicate glass, and alkali-containing aluminum phosphosilicate glass. In various aspects, the glass-based material may include an alkali-containing glass or an alkali-free glass, either of which may be free of lithium oxide or contain lithium oxide. In various aspects, the glass material may be alkali-free and / or include a low content of alkali metals (e.g., about 10 mol% or less of R2O, wherein R2O includes Li2O, Na2O, KO, or a more extensive list provided below). In one or more aspects, the glass-based material may include, by mole percentage (mol%): SiO2 in a range of about 40 mol% to about 80%, Al2O3 in a range of about 5 mol% to about 30 mol%, B2O3 in a range of 0 mol% to about 10 mol%, ZrO2 in a range of 0 mol% to about 5 mol%, P2O5 in a range of 0 mol% to about 15 mol%, TiO2 in a range of 0 mol% to about 2 mol%, R2O in a range of 0 mol% to about 20 mol%, and RO in a range of 0 mol% to about 15 mol%. As used herein, R2O may refer to alkali metal oxides, such as Li2O, Na2O, K2O, Rb2O and C2O. As used herein, RO may refer to MgO, CaO, SrO, BaO and ZnO. "Glass ceramics" include materials produced via controlled glass crystallization. In various aspects, the glass ceramics have a crystallinity of about 1% to about 99%. Examples of suitable glass ceramics may include Li2O-Al2O3-SiO2 system (i.e., LAS system) glass ceramics, MgO-Al2O3-SiO2 system (i.e., MAS system) glass ceramics, ZnO×Al2O3×nSiO2 (i.e., ZAS system) and / or glass ceramics including a main crystalline phase, the main crystalline phase including β-quartz solid solution, β-spodumene, cordierite, petalite and / or lithium disilicate. A chemical strengthening process may be used to strengthen the glass ceramic substrate.In one or more aspects, the MAS system glass-ceramic substrate can be strengthened in a Li2SO4 molten salt, whereby an exchange of Mg2+ with 2Li+ can occur.

[0085] As used herein, "ceramic-based" includes both ceramics and glass-ceramics, wherein the glass-ceramics have one or more crystalline phases and an amorphous residual glass phase. The ceramic-based material can be strengthened (e.g., chemically strengthened). In various aspects, the ceramic-based material can be formed by heating the glass-based material to form a ceramic (e.g., crystalline) portion. In other aspects, the ceramic-based material may include one or more nucleating agents that can promote the formation of a crystalline phase. In various aspects, the ceramic-based material may include one or more oxides, nitrides, oxynitrides, carbides, borides, and / or silicides. Example aspects of ceramic oxides include zirconium oxide (ZrO2), zircon (ZrSiO4), alkali metal oxides (e.g., sodium oxide (Na2O)), alkaline earth metal oxides (e.g., magnesium oxide (MgO)), titanium dioxide (TiO2), hafnium oxide (Hf2O), yttrium oxide (Y2O3), iron oxide, beryllium oxide, vanadium oxide (VO2), fused quartz, mullite (a mineral comprising a combination of aluminum oxide and silicon dioxide) and spinel (MgAl2O4). Example aspects of ceramic nitrides include silicon nitride (Si3N4), aluminum nitride (AlN), gallium nitride (GaN), beryllium nitride (Be3N2), boron nitride (BN), tungsten nitride (WN), vanadium nitride, alkaline earth metal nitrides (e.g., magnesium nitride (Mg3N2)), nickel nitride, and tantalum nitride. Example aspects of oxynitride ceramics include silicon oxynitride, aluminum oxynitride, and SiAlON (a combination of aluminum oxide and silicon nitride, and may have a chemical formula such as Si12-m-nAlm+nOnN16-n, Si6-nAlnOnN8-n, or Si2-nAlnO1+nN2-n, where m, n, and the subscripts derived therefrom are all non-negative integers). Example aspects of carbides and carbon-containing ceramics include silicon carbide (SiC), tungsten carbide (WC), iron carbide, boron carbide (B4C), alkali metal carbides such as lithium carbide (Li4C3), alkaline earth metal carbides such as magnesium carbide (Mg2C3), and graphite. Example aspects of borides include chromium boride (CrB2), molybdenum boride (Mo2B5), tungsten boride (W2B5), iron boride, titanium boride, zirconium boride (ZrB2), hafnium boride (HfB2), vanadium boride (VB2), niobium boride (NbB2), and lanthanum boride (LaB6). Example aspects of silicides include molybdenum disilicide (MoSi2), tungsten disilicide (WSi2), titanium disilicide (TiSi2), nickel silicide (NiSi), alkaline earth silicides such as sodium silicide (NaSi), alkali metal silicides such as magnesium silicide (Mg2Si), hafnium disilicide (HfSi2), and platinum silicide (PtSi).

[0086] Throughout this disclosure, pencil hardness is measured using a standard lead grade pencil using ASTM D 3363-20. In various aspects, the substrate 101 and / or 201 may have a pencil hardness of 8H or greater, such as 9H or greater. Throughout this disclosure, the elastic modulus (e.g., Young's modulus) of the substrate 101 or 201 (e.g., the substrate material 103 including a glass-based material or a ceramic-based material) is measured using an indentation method according to ASTM E2546-15. In various aspects, the substrate 101 or 201 (e.g., the substrate material 103) including a glass-based material or a ceramic-based material may include an elastic modulus of about 10 gigapascals (GPa) or greater, about 50 GPa or greater, about 60 GPa or greater, about 70 GPa or greater, about 100 GPa or less, or about 80 or less. In various aspects, the substrate 101 or 201 (e.g., substrate material 103) including a glass-based material or a ceramic-based material may include an elastic modulus in the range of about 10 GPa to about 100 GPa, about 50 GPa to about 100 GPa, about 60 GPa to about 80 GPa, about 70 GPa to about 80 GPa, or any range or sub-range therebetween.

[0087] like Figure 1 to Figure 2 As shown, the substrate 101 or 201 may include a first major surface 105 and a second major surface 107 opposite to the first major surface 105. Figure 1 to Figure 2 As shown, the first major surface 105 may extend along the first plane 104. Figure 1 to Figure 2As further shown, the substrate 101 or 201 can include a second major surface 107 extending along a second plane 106. In various aspects, as shown, the second plane 106 can be substantially parallel to the first plane 104. As used herein, a substrate thickness 109 can be defined between the first major surface 105 and the second major surface 107 as a distance between the first plane 104 and the second plane 106. In various aspects, the substrate thickness 109 can extend in a thickness direction 108 that can be perpendicular to the first major surface 105. In various aspects, the substrate thickness 109 may be about 25 micrometers (μm) or more, about 30 μm or more, about 40 μm or more, about 50 μm or more, about 60 μm or more, about 80 μm or more, about 100 μm or more, about 125 μm or more, about 150 μm or more, about 3 millimeters (mm) or less, about 2 mm or less, about 1 mm or less, about 800 μm or less, about 500 μm or less, about 300 μm or less, about 200 μm or less, about 180 μm or less, about 160 μm or less, about 100 μm or less, about 80 μm or less, about 35 μm or less, or about 30 μm or less. In various aspects, the substrate thickness 109 can be in the range of about 25 μm to about 3 mm, about 25 μm to about 2 mm, about 30 μm to about 1 mm, about 35 μm to about 800 μm, about 40 μm to about 500 μm, about 50 μm to about 300 μm, about 60 μm to about 200 μm, about 80 μm to about 160 μm, or any range or sub-range therebetween. In further aspects, the substrate thickness 109 can be in the range of about 25 μm to about 35 μm, about 25 μm to about 30 μm, about 30 μm to about 35 μm, or any range or sub-range therebetween. In further aspects, the substrate thickness 109 can be in a range from about 35 μm to about 3 mm, about 35 μm to about 1 mm, about 35 μm to about 500 μm, about 35 μm to about 300 μm, about 40 μm to about 200 μm, about 50 μm to about 200 μm, about 50 μm to about 180 μm, about 50 μm to about 160 μm, about 50 μm to about 100 μm, about 60 μm to about 100 μm, about 80 μm to about 100 μm, about 80 μm to about 100 μm, or any range or sub-range therebetween.

[0088] The substrates 101 and 201 include edge surfaces 111 and 211, which extend between and connect the first major surface 105 and the second major surface 107. Figure 1 to Figure 2 As shown, edge surfaces 111 and 211 intersect first major surface 105 at point 110a, and edge surfaces 111 and 211 intersect second major surface 107 at point 110b. Figure 1As shown, the edge surface 111 may include a chamfer that includes one or more (e.g., three) substantially straight surfaces. Figure 2 As shown, edge surface 211 may include a rounded (e.g., curved, curved) edge surface. In other aspects, as Figure 2 As shown, edge surface 211 may include a convex cross-section, but in other aspects, the edge surface may include a concave cross-section. In various aspects, the local thickness may decrease from the substrate thickness 109 to the edge thickness 119 of the outer peripheral surface 115 or 215 in the edge surface 111 and 211. In other aspects, as Figure 1 to Figure 2 As shown, the thickness of edge surfaces 111 and 211 can decrease smoothly, decrease monotonically, and / or decrease smoothly and monotonically between substrate thickness 109 and edge thickness 119. As used herein, a thickness decreases smoothly if the change in local thickness is a smooth (e.g., gradual) rather than an abrupt (e.g., step-like) change in thickness. As used herein, a thickness decreases monotonically in a direction (i.e., the thickness decreases but never increases in that direction) if the thickness decreases for a portion of the time and remains the same, decreases, or a combination thereof for the rest of the time. For example, Figure 1 to Figure 2 As shown, edge surfaces 111 and 211 decrease smoothly and monotonically in the first direction 102. Providing a smooth and / or monotonous decrease can reduce stress concentrations on edge surfaces (e.g., where the edge surface intersects the first major surface or the second major surface), which can improve edge strength and / or bendability of the substrate.

[0089] The edge surfaces 111 and 211 include an outer peripheral point 113, which is the point farthest in the first direction 102 perpendicular to the thickness direction 108. In various aspects, as Figure 2 As shown, the outer perimeter point 113 may include a single point. In various aspects, as Figure 1 As shown, the outer peripheral point 113 may include more than one point, such as the entire outer peripheral surface 115 (discussed below). The outer plane 112 extends in a direction (e.g., thickness direction 108) perpendicular to the first major surface 105 (e.g., first plane 104, first direction 102), and the outer plane 112 intersects the outer peripheral point 113. Throughout the present disclosure, the outer peripheral surfaces 115 and 215 include a portion of the edge surfaces 111 and 211 within 5 μm (distance 118) of the outer plane 112, such as Figure 1 to Figure 2 As used herein, "within 5 μm" includes all points that are 0 μm to 5 μm away from the reference position, including the endpoints. Figure 1 to Figure 2As shown, the outer peripheral surface 115 and 215 include portions of the edge surfaces 111 and 211 between points 114a and 114b or 214a and 214b, which are 5 μm away from the outer plane 112. Without wishing to be bound by theory, the portion within 5 μm of the outer plane 112 may include a steeper slope in the thickness direction 108 than other portions of the edge surfaces 111 and 211, for example, Figure 1 to Figure 2 The absolute value of the tangential slope in the shown orientation is 1 or greater.

[0090] The first peripheral surfaces 123 and 223 extend between and connect the first major surface 105 and the outer peripheral surfaces 115 and 215 (i.e., the point 114a or 214a 5 μm from the outer plane 112). As used herein, the first depth 124 of the first peripheral surfaces 123 and 223 is defined as the minimum distance between the outer peripheral surfaces 115 and 215 and the first plane 104 in the thickness direction 108. Figure 1 to Figure 2As shown, the first depth 124 corresponds to the distance between the point 114a or 214a and the first plane 104 in the thickness direction 108. In various aspects, the first depth 124 can be about 4 μm or more, about 6 μm or more, about 8 μm or more, about 12 μm or more, about 14 μm or more, about 16 μm or more, about 18 μm or more, about 24 μm or less, about 22 μm or less, about 20 μm or less, about 12 μm or less, about 10 μm or less, or about 9 μm or less. In various aspects, the first depth 124 can be in the range of about 4 μm to about 24 μm, about 6 μm to about 22 μm, about 8 μm to about 20 μm, or any range or sub-range therebetween. In various aspects, when the substrate thickness 109 is about 35 μm or less, the first depth 124 may be in the range of about 4 μm to about 12 μm, about 6 μm to about 10 μm, about 8 μm to about 10 μm, about 8 μm to about 9 μm, or any range or sub-range therebetween. In various aspects, when the substrate thickness 109 is about 35 μm or greater, the first depth 124 may be in the range of about 14 μm to about 24 μm, about 16 μm to about 22 μm, about 18 μm to about 20 μm, or any range or sub-range therebetween. In various aspects, the ratio of the first depth 124 to the substrate thickness 109 may be about 0.1 or greater, about 0.15 or greater, about 0.2 or greater, about 0.25 or greater, about 0.28 or greater, about 0.4 or less, about 0.35 or less, or about 0.32 or less. In various aspects, the ratio of the first depth 124 to the substrate thickness 109 can be in the range of about 0.1 to about 0.4, about 0.15 to about 0.4, about 0.15 to about 0.35, about 0.2 to about 0.35, about 0.25 to about 0.35, about 0.28 to about 0.32, or any range or sub-range therebetween. Providing a first depth to substrate thickness ratio of about 0.4 or less can avoid stress concentration at the outer peripheral surface and / or at a relatively sharp edge at the outer peripheral surface by increasing the edge thickness (e.g., reducing stress concentration at the intersection of the first outer peripheral surface and / or the second outer peripheral surface with the outer peripheral surface), which can improve the edge strength and / or bendability of the substrate.

[0091] As used herein, the first width 126 of the first peripheral surface 123 and 223 is defined as the minimum distance between the outer peripheral surface 115 and 215 and the first major surface 105 along the first direction 102, and the first plane 104 extends along the first direction 102. Figure 1 to Figure 2As shown, the first width 126 corresponds to the distance between the point 114a or 214a and the point 110a in the first direction 102. In various aspects, the first width 126 can be about 30 μm or more, about 35 μm or more, about 38 μm or more, about 40 μm or more, about 45 μm or more, about 50 μm or more, about 55 μm or more, about 60 μm or less, about 55 μm or less, about 50 μm or less, about 45 μm or less, or about 42 μm or less. In various aspects, the first width 126 can be in the range of about 30 μm to about 60 μm, about 35 μm to about 60 μm, about 38 μm to about 55 μm, about 40 μm to about 50 μm, about 40 μm to about 45 μm, or any range or sub-range therebetween. In various aspects, when the substrate thickness 109 is about 35 μm or less, the first width 126 can be in the range of about 30 μm to about 50 μm, about 35 μm to about 45 μm, about 38 μm to about 42 μm, or any range or sub-range therebetween. In various aspects, when the substrate thickness 109 is about 35 μm or more, the first width 126 can be in the range of about 40 μm to about 60 μm, about 45 μm to about 60 μm, about 45 μm to about 55 μm, about 50 μm to about 55 μm, or any range or sub-range therebetween.

[0092] In various aspects, the ratio of the first width 126 to the substrate thickness 109 can be about 0.3 or more, about 0.5 or more, about 0.8 or more, about 1 or more, about 1.1 or more, about 1.2 or more, about 1.3 or more, about 1.6 or less, about 1.55 or less, or about 1.45 or less, or about 1.4 or less. In various aspects, the ratio of the first width 126 to the substrate thickness 109 can be in the range of about 0.3 to about 1.6, about 0.5 to about 1.6, about 0.8 to about 1.6, about 1 to about 1.6, about 1 to about 1.55, about 1.1 to about 1.55, about 1.2 to about 1.45, about 1.3 to about 1.4, or any range or sub-range therebetween. In various aspects, when the substrate thickness 109 is about 35 μm or less, the ratio of the first width 126 to the substrate thickness 109 may be in the range of about 1 to about 1.6, about 1.1 to about 1.55, about 1.2 to about 1.45, about 1.3 to about 1.4, or any range or sub-range therebetween. In various aspects, when the substrate thickness 109 is about 35 μm or more, the ratio of the first width 126 to the substrate thickness 109 may be in the range of about 0.3 to about 1.6, about 0.5 to about 1.55, about 0.8 to about 1.55, about 1 to about 1.55, about 1.1 to about 1.55, about 1.2 to about 1.45, about 1.3 to about 1.4, or any range or sub-range therebetween. Providing a ratio of the first width to the substrate thickness within one or more of the above ranges may reduce stress concentration at the angle (or slope) at which the corresponding peripheral surface intersects the corresponding major surface, which increases the edge strength and / or bendability of the substrate.

[0093] In various aspects, the ratio of the first width 126 to the first depth 124 can be about 2 or more, about 2.5 or more, about 2.7 or more, about 3 or more, about 4 or more, about 4.5 or more, about 4.8 or more, about 8 or less, about 7 or less, about 6 or less, about 5.5 or less, about 5.2 or less, about 5 or less, about 4 or less, about 3.5 or less, about 3 or less, or about 2.9 or less. In various aspects, the ratio of the first width 126 to the first depth 124 can be in the range of about 2 to about 8, about 2 to about 7, about 2 to about 6, about 3 to about 6, about 4 to about 6, about 4 to about 5.5, about 4.5 to about 5.2, about 4.8 to about 5, or any range or sub-range therebetween. In various aspects, when the substrate thickness 109 is about 35 μm or less, the ratio of the first width 126 to the first depth 124 can be in the range of about 4 to about 8, about 4 to about 7, about 4 to about 6, about 4 to about 5.5, about 4.5 to about 5.5, about 4.8 to about 5.2, or any range or sub-range therebetween. In various aspects, for example, when the substrate thickness 109 is about 35 μm or greater, the ratio of the first width 126 to the first depth 124 can be in the range of about 2 to about 4, about 2 to about 3.5, about 2.5 to about 3, about 2.7 to about 2.9, or any range or sub-range therebetween. A ratio of the first width to the first depth provided within one or more of the above ranges can separate the intersection of the corresponding peripheral surface with the corresponding major surface and the intersection of the corresponding peripheral surface with the outer peripheral surface, which can improve the edge strength and / or bendability of the substrate. Providing a ratio of the first width to the first depth within one or more of the above ranges can separate the intersection of the corresponding peripheral surface with the corresponding major surface and the intersection of the corresponding peripheral surface with the outer peripheral surface, which can improve the edge strength and / or bendability of the substrate.

[0094] In various aspects, the second peripheral surface 133 and 233 extends between and connects the second major surface 107 and the outer peripheral surface 115 and 215 (i.e., the point 114b or 214b 5 μm from the outer plane 112). As used herein, the second depth 134 of the second peripheral surface 133 and 233 is defined as the minimum distance between the outer peripheral surface 115 and 215 and the second plane 106 in the thickness direction 108. Figure 1 to Figure 2As shown, the second depth 134 corresponds to the distance between the point 114b or 214b and the second plane 106 in the thickness direction 108. In further aspects, the second depth 134 may be within one or more of the ranges discussed above for the first depth 124. In still further aspects, the second depth 134 may be substantially equal to the first depth 124. In further aspects, the ratio of the second depth 134 to the substrate thickness 109 may be within one or more of the ranges discussed above for the ratio of the first depth 124 to the substrate thickness 109. In further aspects, when the substrate thickness 109 is about 35 μm or less or when the substrate thickness 109 is about 35 μm or more, the ratio of the second depth 134 to the substrate thickness 109 may be within one or more of the corresponding ranges discussed above for the ratio of the first depth 124 to the substrate thickness 109. In further aspects, a ratio of second depth 134 to substrate thickness 109 can be substantially equal to a ratio of first depth 124 to substrate thickness 109 .

[0095] As used herein, the second width 136 of the second peripheral surface 133 and 233 is defined as the minimum distance between the outer peripheral surface 115 and 215 and the second major surface 107 along the first direction 102, and the second plane 106 extends along the first direction 102. Figure 1 to Figure 2 As shown, the second width 136 corresponds to the distance between the point 114b or 214b and the point 110b in the first direction 102. In various aspects, the second width 136 can be within one or more of the ranges discussed above for the first width 126. In further aspects, the second width 136 can be substantially equal to the first width 126. In further aspects, when the substrate thickness 109 is about 35 μm or less or when the substrate thickness 109 is about 35 μm or more, the second width 136 can be within one or more of the corresponding ranges discussed above for the first width 126.

[0096] In various aspects, the ratio of the second width 136 to the substrate thickness 109 can be within one or more of the ranges discussed above for the ratio of the first width 126 to the substrate thickness 109. In further aspects, the ratio of the second width 136 to the substrate thickness 109 can be substantially equal to the ratio of the first width 126 to the substrate thickness 109. In further aspects, when the substrate thickness 109 is about 35 μm or less or when the substrate thickness 109 is about 35 μm or more, the ratio of the second width 136 to the substrate thickness 109 can be within one or more of the corresponding ranges discussed above for the ratio of the first width 126 to the substrate thickness 109.

[0097] In various aspects, the ratio of the second width 136 to the second depth 134 can be within one or more of the ranges discussed above for the ratio of the first width 126 to the first depth 124. In further aspects, the ratio of the second width 136 to the second depth 134 can be substantially equal to the ratio of the first width 126 to the first depth 124. In further aspects, the ratio of the second width 136 to the second depth 134 can be within one or more of the corresponding ranges discussed above for the ratio of the first width 126 to the first depth 124 when the substrate thickness 109 is about 35 μm or less or when the substrate thickness 109 is about 35 μm or more.

[0098] In various aspects, although not shown, it should be understood that the substrate may include Figure 1 to Figure 2 The second edge surface 111 or 211 shown is opposite to the edge surface. In another aspect, the second edge surface may include a third peripheral surface extending between the first main surface and the second outer peripheral surface and connecting the first main surface to the second outer peripheral surface, and / or the second edge surface may include a fourth peripheral surface extending between the second main surface and the second outer peripheral surface and connecting the second main surface to the second outer peripheral surface. In another aspect, the third peripheral surface and / or the fourth peripheral surface may include a corresponding width and a corresponding depth within one or more of the corresponding ranges discussed above for the first edge surface. In another aspect, the width and / or depth of the third peripheral surface may be substantially equal to the corresponding width and / or depth of the first peripheral surface. In another aspect, the width and / or depth of the fourth peripheral surface may be substantially equal to the corresponding width and / or depth of the second peripheral surface. In another aspect, the ratio of the width of the third peripheral surface and / or the fourth peripheral surface to the substrate thickness, the ratio of the depth to the substrate thickness, and / or the ratio of the width to the depth may be within one or more of the ranges discussed above for the corresponding ratios of the features of the first peripheral surface.

[0099] In various aspects, substrate 101 or 201 (e.g., substrate material 103) may include a glass-based substrate and / or a ceramic-based substrate, wherein one or more portions of the substrate may include a compressive stress region. In various aspects, the compressive stress region may be generated by chemically strengthening the substrate. Chemical strengthening may include an ion exchange process in which ions in a surface layer are replaced or exchanged with larger ions having the same valence or oxidation state. Without wishing to be bound by theory, chemically strengthening the substrate may achieve a small (e.g., less than about 10 mm or less) parallel plate distance because the compressive stress from chemical strengthening may offset the compressive stress of the outermost surface (e.g., Figure 1 to Figure 2The first main surface 105 in the substrate is the bending-induced tensile stress. The compressive stress region may extend into a portion of the substrate to a depth called the compression depth. As used herein, the compression depth means the depth at which the stress in the chemically strengthened substrate described herein changes from compressive stress to tensile stress. Depending on the ion exchange treatment and the thickness of the measured product, the compression depth can be measured by a surface stress meter or a scattered light polariscope (scattered light polariscope, SCALP, wherein the value reported herein is obtained using the SCALP-5 manufactured by Estonian Glasstress). In the case where the stress in the substrate is caused by exchanging potassium ions into the substrate, a surface stress meter, such as FSM-6000 (Orihara Industrial Co., Ltd. (Japan)) is used to measure the compression depth. Unless otherwise stated, the compressive stress (including surface CS) is measured by a surface stress meter (FSM) using a commercially available instrument (e.g., FSM-6000 manufactured by Orihara). Surface stress measurement relies on the accurate measurement of the stress optical coefficient (stress optical coefficient, SOC), which is related to the birefringence of the glass. Unless otherwise stated, SOC is measured according to Procedure C (Glass Disk Method) described in ASTM Standard C770-16 entitled "Standard Test Method for Measurement of Glass Stress-Optical Coefficient", the contents of which are incorporated herein by reference in their entirety. In the case where the stress is due to the exchange of sodium ions into the substrate and the thickness of the measured article is greater than about 75 μm, SCALP is used to measure the depth of compression and central tension (CT). In the case where the stress in the substrate is due to the exchange of both potassium and sodium ions into the glass and the thickness of the measured article is greater than about 75 μm, the depth of compression and CT are measured by SCALP. Without wishing to be bound by theory, the depth of exchange of sodium ions may indicate the depth of compression, while the depth of exchange of potassium ions may indicate a change in the magnitude of the compressive stress (rather than a change in stress from compressive stress to tensile stress). A graphical representation of the stress distribution may also be derived using a refracted near-field (RNF; the RNF method is described in U.S. Pat. No. 8,854,623, entitled “Systems and methods for measuring a profile characteristic of a glass sample,” which is incorporated herein by reference in its entirety) method.When the RNF method is used to derive a graphical representation of the stress distribution, the maximum center pull value provided by SCALP is utilized in the RNF method. The graphical representation of the stress distribution derived by the RNF is force balanced and calibrated to the maximum center pull value provided by the SCALP measurement. As used herein, "depth of layer" (DOL) means the depth to which ions have been exchanged into the substrate (e.g., sodium, potassium). Through the present disclosure, when the center pull cannot be directly measured by SCALP (such as when the thickness of the measured article is less than about 75 μm), the maximum center pull can be approximated by the product of the maximum compressive stress and the compression depth divided by the difference between the substrate thickness and twice the compression depth, where the compressive stress and the compression depth are measured by FSM.

[0100] In various aspects, the substrate 101 or 201 can be chemically strengthened to form a first compressive stress region extending from the first major surface 105 to a first compression depth. In various aspects, the substrate 101 or 201 can be chemically strengthened to form a second compressive stress region extending from the second major surface 107 to a second compression depth. In other aspects, the first compressive stress region and / or the second compressive stress region can include a plurality of ion-exchanged metal ions that produce compressive stress in the corresponding compressive stress region. In other aspects, the first compression depth (e.g., from the first major surface 105) and / or the second compression depth (e.g., from the second major surface 107) as a percentage of the substrate thickness 109 can be about 1% or more, about 5% or more, about 10% or more, about 30% or less, about 25% or less, or about 20% or less. In further aspects, the first compression depth and / or the second compression depth as a percentage of the substrate thickness 109 may be in the range of about 1% to about 30%, about 5% to about 25%, about 10% to about 20%, or any range or sub-range therebetween. In various aspects, the first compression depth and / or the second compression depth may be about 1 μm or more, about 3 μm or more, about 10 μm or more, about 30 μm or more, about 50 μm or more, about 200 μm or less, about 150 μm or less, about 100 μm or less, about 80 μm or less, or about 65 μm or less. In various aspects, the first compression depth and / or the second compression depth may be in the range of about 1 μm to about 200 μm, about 3 μm to about 150 μm, about 10 μm to about 100 μm, about 30 μm to about 80 μm, about 50 μm to about 65 μm, or any range or sub-range therebetween. In various aspects, the first compression depth may be greater than, less than, or substantially equal to the second compression depth. By providing a glass-based substrate and / or a ceramic-based substrate including a first compression depth and / or a second compression depth in the range of about 1% to about 30% of the thickness of the substrate, good impact resistance and / or puncture resistance may be achieved.

[0101] In various aspects, the substrate 101 or 201 may include a first layer depth of one or more alkali metal ions associated with a first compressive stress region and / or a second layer depth of one or more alkali metal ions associated with a second compressive stress region. In various aspects, the first layer depth and / or the second layer depth as a percentage of the substrate thickness 109 may be about 1% or more, about 5% or more, about 10% or more, about 15% or more, about 20% or more, about 35% or less, about 30% or less, about 25% or less, or about 22% or less. In various aspects, the first layer depth and / or the second layer depth as a percentage of the substrate thickness 109 may be in the range of about 1% to about 35%, about 5% to about 30%, about 10% to about 25%, about 15% to about 22%, about 20% to about 22%, or any range or sub-range therebetween. In various aspects, the first layer depth and / or the second layer depth may be about 1 μm or more, about 3 μm or more, about 10 μm or more, about 30 μm or more, about 50 μm or more, about 200 μm or less, about 150 μm or less, about 100 μm or less, about 80 μm or less, or about 65 μm or less. In various aspects, the first layer depth and / or the second layer depth may be in the range of about 1 μm to about 200 μm, about 3 μm to about 150 μm, about 10 μm to about 100 μm, about 30 μm to about 80 μm, about 50 μm to about 65 μm, or any range or sub-range therebetween. By providing a glass-based substrate and / or a ceramic-based substrate including a first layer depth and / or a second layer depth in the range of about 1% to about 30% of the substrate thickness, good impact resistance and / or puncture resistance may be achieved.

[0102] In various aspects, the first compressive stress region may include a maximum first compressive stress. In various aspects, the second compressive stress region may include a maximum second compressive stress. In other aspects, the maximum first compressive stress and / or the maximum second compressive stress may be about 400 megapascals (MPa), about 500 MPa or greater, about 700 MPa or greater, about 1,500 MPa or less, about 1,200 MPa or less, about 1,000 MPa or less, or about 900 MPa or less. In other aspects, the maximum first compressive stress and / or the maximum second compressive stress may be in the range of about 400 MPa to about 1,500 MPa, about 400 MPa to about 1,200 MPa, about 500 MPa to about 1,000 MPa, about 700 MPa to about 900 MPa, or any range or sub-range therebetween. In various aspects, the maximum first compressive stress may be substantially equal to the maximum second compressive stress. Providing the maximum first compressive stress and / or the maximum second compressive stress in the range of about 400 MPa to about 1,500 MPa may achieve good impact resistance and / or puncture resistance.

[0103] In various aspects, the substrate can include a central tensile region between the first compressive stress region and the second compressive stress region. In further aspects, the central tensile region can include a maximum central tensile stress. In various aspects, the maximum central tensile stress can be about 50 MPa or more, about 100 MPa or more, about 200 MPa or more, about 250 MPa or more, about 750 MPa or less, about 600 MPa or less, about 500 MPa or less, about 450 MPa or less, about 400 MPa or less, about 350 MPa or less, or about 300 MPa or less. In various aspects, the maximum central tensile stress may be in the range of about 50 MPa to about 750 MPa, about 50 MPa to about 600 MPa, about 100 MPa to about 600 MPa, about 100 MPa to about 500 MPa, about 200 MPa to about 500 MPa, about 200 MPa to about 450 MPa, about 250 MPa to about 450 MPa, about 250 MPa to about 350 MPa, about 250 MPa to about 300 MPa, or any range or sub-range therebetween.

[0104] In various aspects, the substrate may include an edge layer depth of one or more alkali metal ions extending from the edge surface to the compression edge depth and / or associated with the edge compression stress region. In other aspects, the edge compression depth (as a percentage or as an absolute distance) may be within one or more of the ranges discussed above for the first compression depth. In other aspects, the edge compression depth (as a percentage or as an absolute distance) may be substantially equal to or less than the first compression depth. In other aspects, the edge layer depth (as a percentage or as an absolute distance) may be within one or more of the ranges discussed above for the first layer depth. In other aspects, the edge layer depth (as a percentage or as an absolute distance) may be substantially equal to or less than the first layer depth. In other aspects, the edge compression stress layer may include a maximum edge compression stress that may be within one or more of the ranges discussed above for the maximum first compression stress. In yet another aspect, the maximum edge compression stress may be substantially equal to the maximum first compression stress. Providing edge compression stress may further improve the edge strength and / or bendability of the substrate.

[0105] As used herein, "edge strength" is measured using the "Two Point Bending Test" described in the paper "Two Point Bending of Thin Glass Substrate" by ST Gulati, J. Westbrook, S. Carley, H. Vepakomma, and T. Ono, in the Society for Information Display (SID) 2011 Digest, pages 652-654. As described in that document and as Figure 5As shown, the substrate 101 or 201 is placed between a pair of parallel rigid stainless steel plates 503 and 505 of a parallel plate device 501, so that the second major surface 107 of the substrate 101 or 201 contacts each plate 503 and 505, and the distance between the parallel plates is reduced until the substrate fails at the parallel plate distance 507 (D). The edge strength σ is calculated as σ=1.198E t / (Dt), where E is the elastic modulus of the substrate and t is the thickness of the substrate. During the two-point bending test, the environment was controlled at 50% relative humidity and 25°C, and the parallel plate distance 507 was reduced at a rate of 50 μm / second. As used herein, the term "failure" and the like refer to fracture, destruction, delamination or crack propagation. Throughout this disclosure, the "B10 edge strength" of a substrate is the average failure stress of the substrate when 10% of the samples are expected to fail, and the "median edge strength" of a substrate is the average failure stress of the substrate when 50% of the samples are expected to fail. In various aspects, the B10 edge strength of the substrate may be about 1000 MPa or more, about 1100 MPa or more, about 1200 MPa or more, about 1300 MPa or more, about 1400 MPa or more, about 1500 MPa or more, about 2000 MPa or less, or about 1700 MPa or less. In various aspects, the B10 edge strength of the substrate may be in the range of about 1000 MPa to about 2000 MPa, about 1100 MPa to about 1800 MPa, about 1200 MPa to about 1700 MPa, about 1300 MPa to about 1700 MPa, about 1400 MPa to about 1600 MPa, or any range or sub-range therebetween. In various aspects, the median edge strength of the substrate can be about 1700 MPa or more, about 1900 MPa or more, about 2000 MPa or more, about 2200 MPa or more, about 2300 MPa or more, about 2700 MPa or less, about 2500 MPa or less, about 2450 MPa or less, about 2400 MPa or less, or about 2350 MPa or less. In various aspects, the median edge strength of the substrate can be in the range of about 1700 MPa to about 2700 MPa, about 1900 MPa to about 2500 MPa, about 2000 MPa to about 2450 MPa, about 2200 MPa to about 2400 MPa, about 2300 MPa to about 2350 MPa, or any range or sub-range therebetween.

[0106] Figure 5The parallel plate apparatus 501 shown can also be used to determine the parallel plate distance (e.g., minimum parallel plate distance) using a parallel plate test. As used herein, a substrate 101 or 201 achieves or has a parallel plate distance "X" if the substrate 101 or 201 resists failure when maintained at the parallel plate distance "X" for 24 hours at about 60° C. and about 90% relative humidity. As with the two-point bend test, Figure 5 As shown, the substrate 101 or 201 is placed between a pair of parallel rigid stainless steel plates 503 and 505 of the parallel plate device 501, so that the second major surface 107 of the substrate 101 or 201 contacts each plate 503 and 505. In the parallel plate test, the parallel plate distance 507 is reduced at a rate of 50 μm / second until the parallel plate distance 507 is equal to the "parallel plate distance" to be tested. Then, the parallel plates are maintained at the parallel plate distance to be tested for 24 hours at about 60°C and about 90% relative humidity. As used herein, the minimum parallel plate distance is the minimum parallel plate distance that the substrate 101 or 201 can withstand without failure under the above conditions and configurations.

[0107] In various aspects, the substrate 101 or 201 can achieve a parallel plate distance of 10 mm or less, 9 mm or less, 8 mm or less, 7 mm or less, about 6 mm or less, about 5 mm or less, about 4 mm or less, about 3 mm or less, or about 2 mm or less. For example, the substrate 101 or 201 can achieve a parallel plate distance of 10 mm, or 9 mm, or 8 mm, or 7 mm, or 6 mm, or 5 mm, or 4 mm, or 3 mm, or 2 mm, or 1 mm. In various aspects, the substrate 101 or 201 can achieve a parallel plate distance in the range of about 1 mm to about 10 mm, about 1 mm to about 8 mm, about 2 mm to about 7 mm, about 2 mm to about 6 mm, about 2 mm to about 5 mm, about 3 mm to about 5 mm, or any range or sub-range therebetween. In various aspects, substrate 101 or 201 may include a minimum parallel plate distance of about 10 mm or less, 9 mm or less, 8 mm or less, 7 mm or less, about 6 mm or less, about 5 mm or less, about 4 mm or less, about 3 mm or less, or about 2 mm or less. In various aspects, substrate 101 or 201 may include a minimum parallel plate distance in the range of about 1 mm to about 10 mm, about 2 mm to about 7 mm, about 3 mm to about 6 mm, about 4 mm to about 5 mm, or any range or sub-range therebetween.

[0108] In various aspects, the substrate may include an optional coating disposed on the first major surface and / or the second major surface, the coating including one or more of an easy-to-clean coating, a low-friction coating, an oil-resistant coating, a diamond-like coating, a scratch-resistant coating, or a wear-resistant coating. The scratch-resistant coating may include a nitride oxide having a thickness of about 500 microns or more, such as aluminum oxynitride or silicon oxynitride. In such aspects, the wear-resistant layer may include the same material as the scratch-resistant layer. In various aspects, the low-friction coating may include a highly fluorinated silane coupling agent, such as an alkylfluorosilane having an oxygen methyl group suspended from a silicon atom. In such aspects, the easy-to-clean coating may include the same material as the low-friction coating. In other aspects, the easy-to-clean coating may include a protonatable group, such as an amine, such as an alkylaminosilane having an oxygen methyl group suspended from a silicon atom. In such aspects, the oil-resistant coating may include the same material as the easy-to-clean coating. In various aspects, the diamond-like coating includes carbon and may be produced by applying a high voltage potential in the presence of a hydrocarbon plasma.

[0109] Aspects of the present disclosure may include consumer electronic products. The consumer electronic product may include a front surface, a rear surface, and a side surface. The consumer electronic product may further include an electrical component at least partially within the housing. The electrical component may include a controller, a memory, and a display. The display may be located at or adjacent to the front surface of the housing. The consumer electronic product may include a cover substrate disposed on the display. In various aspects, at least one of a portion of the housing or the cover substrate includes a coating article discussed throughout the present disclosure. The display may include a liquid crystal display (LCD), an electrophoretic display (EPD), an organic light-emitting diode (OLED) display, or a plasma display panel (PDP). In various aspects, the consumer electronic product may be a portable electronic device, such as a smart phone, a tablet computer, a wearable device, or a laptop computer.

[0110] The coated articles and / or coatings disclosed herein may be incorporated into another article, such as an article having a display (or multiple display articles) (e.g., consumer electronics, including mobile phones, tablet computers, computers, navigation systems, wearable devices (e.g., watches), etc.), architectural articles, transportation articles (e.g., cars, trains, airplanes, ships, etc.), household appliances, or any article that can benefit from a certain degree of transparency, scratch resistance, abrasion resistance, or a combination thereof. Figure 3 and Figure 4 In the embodiment of the present invention, exemplary articles incorporating any of the coating articles disclosed herein are shown. Specifically, Figure 3 and Figure 4A consumer electronic device 300 is shown, which includes a housing 302 having a front surface 304, a rear surface 306, and a side surface 308. The consumer electronic device 300 may include electrical components (not shown) at least partially within the housing or completely within the housing and including at least a controller, a memory, and a display 310 located at or adjacent to the front surface of the housing. The consumer electronic device 300 may include a cover substrate 312 at or on the front surface of the housing such that it is located above the display. In various aspects, at least one of the cover substrate 312 or a portion of the housing 302 may include any of the coated articles disclosed herein.

[0111] Example

[0112] Various aspects will be further illustrated by the following examples. Table 1 presents information about Examples AE and Comparative Examples AA-FF. Unless otherwise noted, the substrates of Examples AE and Comparative Examples AA-FF are similar to Figure 1 to Figure 2 The glass-based material of the substrate 101 or 201 shown (nominal composition in mol % 1: 69.1 SiO2; 10.2 Al2O3; 15.1 Na2O; 0.01 K2O; 5.5 MgO; 0.09 SnO2). Examples AB and AA-CC were chemically strengthened by immersing the substrate in a molten salt solution including 100 wt% KNO3 maintained at 400°C for 12 minutes. Example C and Comparative Example DD were chemically strengthened by immersing the substrate in a molten salt solution including 100 wt% KNO3 maintained at 420°C for 17 minutes. Example E and Comparative Example FF were chemically strengthened by immersing the substrate in a molten salt solution including 100 wt% KNO3 maintained at 420°C for 30 minutes. Example D and Comparative Example EE were chemically strengthened by immersing the substrate in a molten salt solution including 100 wt% KNO3 maintained at 420°C for 35 minutes.

[0113] Table 1 presents the substrate thickness ("Thickness"), the first depth of the first peripheral surface ("Depth"), and the first width of the first peripheral surface ("Width"). In Examples AE and Comparative Examples AA-EE, the second peripheral surface is the same as the first outer peripheral surface. The minimum parallel plate distance reported in Table 10 is the median minimum parallel plate distance for the sample substrates tested for that example. In Table 1, "W / t" refers to the ratio of the first width to the substrate thickness, "W / D" refers to the ratio of the first width to the first depth, and "D / t" refers to the ratio of the first depth to the substrate thickness.

[0114] Table 1: Properties of Examples AD and Comparative Examples AA-EE

[0115]

[0116] Examples A to B and Comparative Examples AA to CC include substrate thicknesses in the range of about 25 μm to about 35 μm. Comparative Example AA does not include any peripheral surface having substantially right angles at the edge of the substrate, and the comparative example includes a B10 edge strength of 851 MPa. Comparative Examples BB to CC include a first depth greater than 12 μm (i.e., about 15 μm) and a ratio (D / t) of the first depth to the substrate thickness greater than 0.4 (i.e., about 0.5). Comparative Examples BB to CC include B10 edge strengths of 730 MPa and 783 MPa, respectively, which are lower than the B10 edge strength of Example AA. Therefore, providing a first depth greater than 12 μm (substrate thickness is about 25 μm to about 35 μm) and / or a ratio (D / t) of the first depth to the substrate thickness greater than 0.4 will impair edge strength.

[0117] Examples A to B include a first depth of about 6 μm to about 12 μm (e.g., about 8 μm to about 10 μm, about 8 μm to about 9 μm), a first width of about 30 μm to about 50 μm, a ratio of the first width to the substrate thickness of about 1 to about 1.6 (e.g., about 1.1 to about 1.55), a ratio of the first width to the first depth of about 4 to 8 (e.g., about 4 to 6, about 4 to about 5.5), and a ratio of the first depth to the substrate thickness of about 0.15 to about 0.4 (e.g., about 0.25 to about 0.35). Examples A to B include B10 edge strengths of 1603 MPa and 1690 MPa (e.g., about 1000 MPa or greater, about 1200 MPa to about 1700 MPa, about 1500 MPa to about 1700 MPa), respectively. Examples A-B include median edge strengths of 2371 MPa and 2238 MPa, respectively (e.g., about 1700 MPa or greater, about 1900 MPa to about 2500 MPa, about 2200 MPa to about 2400 MPa). Examples A-B unexpectedly increase edge strength (e.g., B10 edge strength, median edge strength) compared to Comparative Examples AA to CC. For example, Examples A-B increase B10 edge strength by 88% and 99%, respectively, relative to Example AA.

[0118] Examples C to E and Comparative Examples DD to FF include a substrate thickness of about 35 μm or greater (e.g., about 35 μm to about 300 μm, about 50 μm to about 200 μm, about 50 μm to about 100 μm). Comparative Example DD includes a first width of 93.2 μm, which is greater than about 65 μm; Comparative Example DD includes a first width to substrate thickness ratio of 1.90, which is greater than about 1.6; and Comparative Example DD includes a first width to first depth ratio of 5.62, which is greater than about 4. Comparative Example EE includes a first depth of 12.4 μm, which is less than about 14 μm; and Comparative Example EE includes a first depth to substrate thickness ratio of 0.12, which is less than about 0.15. Comparative Examples DD to EE include B10 edge strengths of 949 MPa and 877 MPa, respectively, which are less than about 1000 MPa. The B10 edge strength of Comparative Examples DD to EE is slightly increased compared to Comparative Examples AA to CC, but it is still substantially different from the B10 edge strength of Examples A to B or Examples C to E (discussed below).

[0119] Examples C to E include a first depth of about 14 μm to about 24 μm, a first width of about 40 μm to about 60 μm (e.g., about 45 μm to about 55 μm), a ratio of the first width to the substrate thickness of about 0.3 to about 1.6 (e.g., about 0.5 to about 1.55), a ratio of the first width to the first depth in a range of about 2 to about 4, and a ratio of the first depth to the substrate thickness in a range of about 0.15 to about 0.4 (e.g., about 0.15 to about 0.35). Examples C to E include B10 edge strengths of 1579 MPa, 1253 MPa, and 1377 MPa (e.g., about 1000 MPa or greater, about 1200 MPa to about 1700 MPa, about 1300 MPa to about 1600 μm), respectively. Examples C to E include median edge strengths of about 2459 MPa, 1955 MPa, and 2228 MPa, respectively (e.g., about 1700 MPa or greater, about 1900 MPa to about 2500 MPa). Examples C to E unexpectedly increase edge strength (e.g., B10 edge strength, median edge strength) compared to Comparative Examples AA to EE. For example, Examples C to E increase B10 edge strength by 86%, 47%, and 62%, respectively, relative to Example AA. For example, Examples C to E increase B10 edge strength by 80%, 43%, and 57%, respectively, relative to Example EE.

[0120] Comparative Example FF is similar to Example E (having an increased first depth and an increased first width greater than 60 μm), but Example FF includes Figure 1 The substantially straight sides of the substrate 101 in Example E include Figure 2The curved edge surface is the same as the substrate 201 in the example. The B10 edge strength of Comparative Example FF is 698 MPa, which is lower than any of Comparative Examples AA to EE. In contrast, the B10 edge strength of Example E is more than 100% greater than the B10 edge strength of the Comparative Examples. Without wishing to be bound by theory, it is believed that the reduced first width (of Example E relative to Comparative Example FF) and the curved edge surface (of Example E relative to the straight edge of Comparative Example FF) each provide an increase in edge strength (e.g., B10 edge strength, median edge strength), which provides an accretive advantage to provide the benefits seen.

[0121] The above observations can be combined to provide a substrate comprising an edge surface between a first major surface and a second major surface, wherein dimensions of the first peripheral surface between an outer peripheral surface of the edge surface and the first major surface and / or the second peripheral surface between the outer peripheral surface and the second major surface (e.g., first width, second width, first depth, second depth, their ratio, and ratio relative to the thickness of the substrate) can reduce damage to the substrate, simplify handling of the substrate, and / or improve edge strength of the substrate without compromising subsequent processing (e.g., coating) of the substrate.

[0122] Damage to the substrate can be reduced by avoiding stress concentration (e.g., from sharp corners). For example, the first peripheral surface and / or the second peripheral surface replace the sharp corner between the first main surface and the initial edge surface. Similarly, providing a ratio of the first width to the first depth and / or the ratio of the second width to the second depth in the range of about 2 to about 8 (e.g., about 2 to about 4, about 4 to about 8, about 4 to about 6, about 4 to about 5.5) can reduce stress concentration at the angle where the corresponding peripheral surface intersects with the corresponding main surface. In addition, providing a ratio of the first depth and / or the second depth to the thickness of the substrate of about 0.1 to about 0.4 (e.g., about 0.15 to about 0.4, about 0.2 to about 0.4, about 0.25 to about 0.35) can make the thickness of the outer peripheral surface large enough to avoid stress concentration at the intersection of the first peripheral surface and the second peripheral surface with the outer peripheral surface. In addition, providing a ratio of the first width and / or the second width to the substrate thickness of about 0.3 to about 1.6 (e.g., about 0.5 to about 1.55, about 1 to about 1.55) can separate the intersection of the corresponding peripheral surface with the corresponding major surface and the intersection of the corresponding peripheral surface with the outer peripheral surface, which can improve the edge strength of the substrate. One or more of these aspects (e.g., the dimensions and / or ratios described above in this paragraph) can improve the edge strength (e.g., a B10 edge strength of about 1000 megapascals (MPa) or greater and / or about 1200 MPa to about 1700 MPa, a median edge strength of about 1700 MPa or greater and / or about 1900 MPa to about 2500 MPa) and / or the bendability of the substrate.

[0123] For a substrate having a thickness of about 25 micrometers (μm) to about 35 μm, providing a first depth and / or a second depth of about 4 μm to about 12 μm and a first width and / or a second width of about 30 μm to about 50 μm can reduce damage to the substrate, simplify processing of the substrate, and improve the edge strength of the substrate. For a substrate having a thickness of about 35 μm or more, providing a first depth and / or a second depth of about 14 μm to about 24 μm and a first width and / or a second width of about 40 μm to about 60 μm can reduce damage to the substrate, simplify processing of the substrate, and improve the edge strength of the substrate.

[0124] Providing a ratio of the first depth and / or the second depth to the substrate thickness of about 0.1 to about 0.4 (e.g., about 0.15 to about 0.4, about 0.2 to about 0.4, about 0.25 to about 0.35) can allow the thickness of the outer peripheral surface to be large enough so that the edge surface is blunt enough to reduce processing concerns, which can simplify processing of the substrate.

[0125] Providing a first width to first depth ratio and / or a second width to second depth ratio in a range of about 2 to about 8 (e.g., about 2 to about 4, about 4 to about 8, about 4 to about 6, about 4 to about 5.5) can make the corresponding peripheral surface shallow enough to prevent viscous material disposed on the corresponding major surface from flowing out of the edge surface, which allows for in-situ formation of a coating on the substrate. Avoiding viscous fluid from flowing out of the edge surface can reduce material waste, avoid contamination of processing equipment and / or additional cleaning for removing such viscous fluid.

[0126] Providing a substrate including a glass-based material or a ceramic-based material can enhance puncture resistance and / or impact resistance. In addition, such a substrate can be chemically strengthened to further enhance the impact resistance and / or puncture resistance of the foldable device. In addition, edge surfaces including the peripheral surfaces described herein can improve bendability by removing stress concentrations on the edges of the substrate (e.g., achieving a parallel plate distance in the range of about 1 mm to about 10 mm).

[0127] Directional terms used herein (eg, up, down, right, left, front, back, top, bottom) refer only to the drawings drawn and are not intended to imply an absolute orientation.

[0128] It should be understood that each disclosed aspect may relate to features, components or steps described with respect to that aspect. It should also be understood that features, components or steps, although described with respect to one aspect, may be interchanged or combined with alternative aspects in various combinations or permutations not shown.

[0129] It should also be understood that the terms "the," "a," or "an" as used herein mean "at least one," and should not be limited to "only one," unless clearly indicated to the contrary. For example, reference to "a component" includes aspects having two or more such components, unless the context clearly indicates otherwise. Likewise, "plurality" is intended to mean "more than one."

[0130] As used herein, the term "about" means that the amount, size, formula, parameter and other quantities and characteristics are not and need not be exact, but may be approximate and / or larger or smaller as needed, thereby reflecting tolerances, conversion factors, truncation, measurement errors, etc., and other factors known to those skilled in the art. Ranges can be expressed herein as from "about" a specific value and / or to "about" another specific value. When such a range is expressed, each aspect includes from a specific value and / or to another specific value. Similarly, when a value is expressed as an approximation by using the preceding "about", it will be understood that the specific value forms another aspect. Regardless of whether the numerical value or endpoint of the range in the specification is mentioned and "about", the numerical value or endpoint of the range is intended to include two aspects: one is modified by "about" and one is not modified by "about". It will be further understood that the endpoints of each of the ranges are meaningful with respect to the other endpoint and independently of the other endpoint.

[0131] As used herein, the terms "substantially," "substantially," and variations thereof are intended to indicate that the described feature is equal to or approximately equal to a value or description. For example, a "substantially flat" surface is intended to mean a flat or approximately flat surface. Furthermore, as defined above, "substantially similar" is intended to mean that two values ​​are equal or approximately equal. In various aspects, "substantially similar" can mean values ​​that are within about 10% of each other, for example, within about 5% of each other, or within about 2% of each other.

[0132] Unless explicitly stated otherwise, any method described herein is in no way intended to be construed as requiring that its steps be performed in a specific order. Therefore, if a method claim does not actually recite the order in which its steps are to be followed, or if it is not otherwise specifically stated in the claims or description that these steps are to be limited to a specific order, no specific order is intended to be inferred.

[0133] Although the transition phrase "comprising" may be used to disclose various features, components, or steps of a particular aspect, it should be understood that alternative aspects, including those aspects that may be described using the transition phrases "consisting of" or "consisting essentially of" are implied. Thus, for example, implicit alternative aspects of a device comprising A+B+C include aspects wherein the device consists of A+B+C, and aspects wherein the device consists essentially of A+B+C. As used herein, the terms "comprising" and "including" and variations thereof should be interpreted as synonymous and open-ended unless otherwise noted.

[0134] The above aspects and features of those aspects are exemplary and may be provided alone or in any combination with any one or more features of the other aspects provided herein without departing from the scope of the present disclosure.

[0135] Those skilled in the art will appreciate that various modifications and changes may be made to the present disclosure without departing from the spirit and scope of the present disclosure. Therefore, it is intended that the present disclosure covers modifications and changes of aspects herein as long as they are within the scope of the appended claims and their equivalents.

Claims

1. A substrate, comprising: a first major surface extending along a first plane; a second major surface extending along a second plane substantially parallel to the first plane; a substrate thickness, the substrate thickness being defined between the first plane and the second plane in a thickness direction perpendicular to the first major surface; and an edge surface extending between the first major surface and the second major surface, the edge surface including an outer peripheral point, the edge surface comprising: an outer peripheral surface, the outer peripheral surface comprising a portion of the edge surface within 5 microns of an outer plane, the outer plane being perpendicular to the first major surface and intersecting the outer peripheral point; a first peripheral surface extending between the first major surface and the outer peripheral surface, the first peripheral surface comprising a first depth and a first width, the first depth being defined as a minimum distance between the outer peripheral surface and the first plane in the thickness direction, the first width being defined as a minimum distance between the outer peripheral surface and the first major surface along a first direction, the first plane extending along the first direction; and a second peripheral surface, the second peripheral surface extending between the second major surface and the outer peripheral surface, the second peripheral surface comprising a second depth and a second width, the second depth being defined as a minimum distance between the outer peripheral surface and the second plane in the thickness direction, the second width being defined as a minimum distance between the outer peripheral surface and the second major surface along the first direction, the first plane extending along the first direction, wherein a ratio of the first depth to the substrate thickness is in a range of about (narrowest 0.1) 0.2 to about 0.4, a ratio of the first width to the substrate thickness is in a range of about 1 (minimum 0.3) to about 1.55 (maximum 1.6), and a ratio of the first width to the first depth is in a range of about 2 to about 8.

2. The substrate of claim 1, wherein a ratio of the first depth to the substrate thickness is in a range of about 0.2 to about 0.4, and a ratio of the first width to the substrate thickness is in a range of about 1 to about 1.

55.

3. The substrate according to claim 1: wherein the substrate thickness is in the range of about 25 microns to about 35 microns; wherein the first depth of the first peripheral surface is in a range from about 4 microns to about 12 microns; wherein the first width of the first peripheral surface is in a range from about 30 microns to about 50 microns; wherein the second depth of the second peripheral surface is in a range from about 4 microns to about 12 microns; and Wherein the second width of the second peripheral surface is in a range from about 30 microns to about 50 microns. 4 . The substrate of claim 3 , wherein a ratio of the first width to the substrate thickness is in a range from about 1 to about 1.

6. 5 . The substrate of claim 3 , wherein a ratio of the first width to the first depth is in a range of about 4 to about 8. 6 .

6. The substrate according to claim 1: wherein the substrate thickness is about 35 microns or greater; wherein the first depth of the first peripheral surface is in a range from about 14 microns to about 24 microns; wherein the first width of the first peripheral surface is in a range from about 40 microns to about 60 microns; wherein the second depth of the second peripheral surface is in a range from about 14 microns to about 24 microns; and Wherein the second width of the second peripheral surface is in a range from about 40 microns to about 60 microns.

7. The substrate of claim 6, wherein the substrate thickness is in a range of about 50 microns to about 200 microns.

8. The substrate of any one of claims 6 to 7, wherein a ratio of the first width to the substrate thickness is in a range of about 0.3 to about 1.

6. 9 . The substrate of claim 6 , wherein a ratio of the first width to the first depth is in a range of about 2 to about 4.

10. The substrate of any one of claims 6 to 9, wherein a ratio of the first depth to the substrate thickness is in a range of about 0.1 to about 0.

4.

11. The substrate of any one of claims 1 to 10, wherein the substrate comprises a glass-based material or a ceramic-based material.

12. The substrate of any one of claims 1 to 11, wherein the first major surface comprises a first compressive stress region extending from the edge surface to a first compression depth and a maximum first compressive stress of about 400 MPa or greater, and the second major surface comprises a second compressive stress region extending from the second major surface to a second compression depth and a maximum second compressive stress of about 400 MPa or greater.

13. The substrate of any one of claims 1 to 12, wherein the substrate comprises a stress of about 1000 MPa or greater, at which stress the probability of failure is less than 10% for a two point bend test (B10 edge strength).

14. The substrate of any one of claims 1 to 13, wherein the median edge strength in a two point bend test is about 1700 MPa or greater.

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