Optical module

Abstract

The optical module provided by the invention is provided with a coherent component which is used for receiving local oscillation light and a first optical signal and carrying out coherent demodulation on the local oscillation light and the first optical signal. And the receiving photoelectric detector generates photo-generated current for the first optical signal. The trans-impedance amplifier receives the photo-generated current, amplifies the photo-generated current and outputs a voltage signal. The analog-to-digital conversion sampler converts the voltage signal into an AD sampling value and transmits the AD sampling value to an MCU formula, the AD sampling value is substituted into a reference optical power formula to calculate and obtain a reference optical power value, and the current frequency value is substituted into a frequency deviation formula to calculate and obtain the current frequency deviation. And subtracting the current frequency deviation from the reference optical power value to obtain an optical power calculation value as reported optical power.

Description

optical modules

[0001] This application claims the priority of application number 202311013099.4 filed with the China Patent Office on August 11, 2023; the priority of application number 202311010232.0 filed with the China Patent Office on August 11, 2023; the priority of application number 202323194852.2 filed with the China Patent Office on November 24, 2023; the priority of application number 202311019057.1 filed with the China Patent Office on August 14, 2023; and the priority of application number 202311462211.2 filed with the China Patent Office on November 6, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of communication technology, and in particular to an optical module. Background Art

[0003] Optical communication technology is used in new business models and applications such as cloud computing, mobile internet, and video. In optical communications, optical modules are tools for converting optical and electrical signals and are key components in optical communication equipment. With the rapid development of 5G networks, optical modules, at the core of optical communications, have experienced significant development.

[0004] Summary of the Invention

[0005] In one aspect, an embodiment of the present disclosure discloses an optical module, comprising:

[0006] circuit boards;

[0007] A local oscillator light source is electrically connected to the circuit board, and the local oscillator light source is configured to generate local oscillator light;

[0008] a receiving optical fiber adapter containing a first optical signal;

[0009] A coherent optical component connected to the light source; the coherent optical component includes a coherent modulation chip, which includes an optical splitter, a modulation section, and a demodulation section. The optical splitter includes an optical input interface, an optical output interface, and an electrical input interface. The optical input interface receives local oscillator light, one optical output interface is connected to the modulation section, and the other optical output interface is connected to the demodulation section. The coherent optical component performs coherent demodulation on the local oscillator light and the first optical signal to generate an electrical signal.

[0010] An MCU is connected to the electrical input interface; the MCU includes a register that stores a plurality of splitting ratio functions corresponding to temperatures; the MCU retrieves the splitting ratio function according to the temperature and controls the operating current of the electrical input interface of the spectrometer according to the splitting ratio function and a sampling voltage, wherein the sampling voltage corresponds to the sampling current of the photodetector;

[0011] The product of the digital signal and the photocurrent is a preset value, and the MCU is configured to calculate the photocurrent according to the digital signal, and calculate the optical power according to the mapping relationship between the photocurrent and the optical power;

[0012] The MCU is further configured to calculate and report the optical power based on the frequency of the electrical signal and the first optical signal and an optical power formula;

[0013] The optical power formula is:

[0014] P = P1 - P2 (1);

[0015] In formula (1), P1 is the reference optical power, and P2 is the current frequency deviation;

[0016] The reference optical power formula is a functional relationship between the electrical signal and the reference optical power when the frequency of the first optical signal is the first frequency and the first temperature is the first frequency;

[0017] The frequency deviation is a functional relationship between the frequency difference and the frequency at the first temperature, wherein the frequency difference is the difference between the optical power corresponding to different frequencies and the reference optical power.

[0018] On the other hand, an embodiment of the present disclosure discloses an optical module, including:

[0019] A coherent component receives the local oscillator light and the first optical signal and performs coherent demodulation on the local oscillator light and the first optical signal. A receiving photodetector generates a photocurrent in response to the first optical signal;

[0020] A transimpedance amplifier receives the photocurrent, amplifies the photocurrent, and outputs a voltage signal;

[0021] Analog-to-digital conversion sampler, converts the voltage signal into an AD sampling value and transmits the AD sampling value to the MCU;

[0022] The MCU calculates and reports the optical power based on the AD sampling value, the frequency of the first optical signal, and the optical power formula;

[0023] The optical power formula is:

[0024] P = P1 - P2 (1);

[0025] In formula (1), P1 is the reference optical power, and P2 is the current frequency deviation;

[0026] The reference optical power is a functional relationship between the AD sampling value and the reference optical power when the frequency of the first optical signal is the first frequency and the temperature is the first temperature;

[0027] The frequency deviation is a functional relationship between the frequency difference and the frequency at the first temperature, wherein the frequency difference is the difference between the optical power corresponding to different frequencies and the reference optical power. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0029] FIG1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0030] FIG2 is a partial structural diagram of a host computer according to some embodiments;

[0031] FIG3 is a structural diagram of an optical module according to some embodiments;

[0032] FIG4 is an exploded view of an optical module according to some embodiments;

[0033] FIG5 is a structural diagram of an optical module provided in accordance with some embodiments without a housing and an unlocking component;

[0034] FIG6 is a structural diagram of a fiber optic adapter, a light source, a coherent optical component, and a circuit board according to some embodiments;

[0035] FIG7 is a simplified structural diagram of a light receiving component according to some embodiments;

[0036] FIG8 is a data diagram showing the corresponding sample values ​​and reference optical power sample values ​​in Table 1 according to some embodiments;

[0037] FIG9 is a frequency deviation curve shown by the data in Table 2 according to some embodiments;

[0038] FIG10 is a temperature deviation curve shown in Table 3 according to some embodiments;

[0039] FIG11 is a structural diagram of a coherent optical component according to some embodiments;

[0040] FIG12 is an exploded view of a coherent optical assembly according to some embodiments;

[0041] FIG13 is a cross-sectional view of a coherent optical assembly according to some embodiments;

[0042] FIG14 is an assembly diagram of a cover shell and a bottom shell according to some embodiments;

[0043] FIG15 is an exploded view of a cover shell and a bottom shell according to some embodiments;

[0044] FIG16 is an exploded view of a coherent optical assembly without a cover and a bottom housing according to some embodiments;

[0045] FIG17 is a cross-sectional view of a coherent optical assembly with the cover and bottom housing removed, according to some embodiments;

[0046] FIG18 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate according to some embodiments;

[0047] FIG19 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate from another perspective according to some embodiments;

[0048] FIG20 is an exploded view of an optical chip, an optical matching chip, and a coherent substrate according to some embodiments;

[0049] FIG21 is a structural diagram of an electrical transfer fixture according to some embodiments;

[0050] FIG22 is a structural diagram of an electrical adapter fixture provided in another perspective according to some embodiments;

[0051] FIG23 is an assembly diagram of an electrical transfer fixture, an optical chip, and an optical matching chip according to some embodiments;

[0052] FIG24 is a structural diagram of an optical module excluding a housing according to some embodiments;

[0053] FIG25 is a diagram illustrating the relationship between an MCU, an adjustable voltage source, a DSP, and a coherent optical component according to some embodiments;

[0054] FIG26 is a block diagram of a DSP according to some embodiments;

[0055] FIG27 is a structural diagram of an MCU according to some embodiments;

[0056] FIG28 is a structural diagram of an adjustable voltage source according to some embodiments;

[0057] FIG29 is a schematic diagram of a coherent optical component according to some embodiments;

[0058] FIG30 is an assembly diagram of a coherent optical component and an MCU according to some embodiments;

[0059] FIG31 is another assembly diagram of a coherent optical component and an MCU according to some embodiments;

[0060] FIG32 is a splitting ratio curve provided according to some embodiments;

[0061] FIG33 is a partial structural diagram of an optical module according to some embodiments of the present disclosure;

[0062] FIG34 is a schematic diagram illustrating the working principle of an optical module according to some embodiments of the present disclosure;

[0063] FIG35 is a cross-sectional view of a light source in a light module according to some embodiments of the present disclosure;

[0064] FIG36 is a structural block diagram 1 of a coherent optical chip in an optical module according to some embodiments of the present disclosure;

[0065] FIG37 is a second structural block diagram of a coherent optical chip in an optical module according to some embodiments of the present disclosure;

[0066] FIG38 is a third structural block diagram of a coherent optical chip in an optical module according to some embodiments of the present disclosure;

[0067] FIG39 is a fourth structural block diagram of a coherent optical chip in an optical module according to some embodiments of the present disclosure;

[0068] FIG40 is a fifth structural block diagram of a coherent optical chip in an optical module according to some embodiments of the present disclosure;

[0069] FIG41 is a structural diagram of a wavelength locker in an optical module according to some embodiments of the present disclosure;

[0070] FIG42 is a power curve diagram of a light detector in an optical module according to some embodiments of the present disclosure;

[0071] FIG43 is a schematic structural diagram of a coherent optical component according to some embodiments of the present disclosure;

[0072] FIG44 is a schematic structural diagram of a coherent optical component and a circuit board according to some embodiments of the present disclosure;

[0073] FIG45 is a schematic diagram of the structure of an automatic gain control unit according to some embodiments of the present disclosure;

[0074] FIG46 is a schematic diagram of the structure of an automatic gain controller according to some embodiments of the present disclosure;

[0075] FIG47 is an assembly diagram of a test host and an optical module according to some embodiments;

[0076] FIG48 is a first flow chart of a method for optimizing frequency control parameters of a high-frequency electrical signal according to some embodiments;

[0077] FIG49 is a second flow chart of a method for optimizing frequency control parameters of a high-frequency electrical signal according to some embodiments;

[0078] FIG50 is a third flow chart of a method for optimizing frequency control parameters of a high-frequency electrical signal according to some embodiments;

[0079] FIG51 is a fourth flow chart of a method for optimizing frequency control parameters of a high-frequency electrical signal according to some embodiments;

[0080] FIG52 is a fifth flow chart of a method for optimizing frequency control parameters of a high-frequency electrical signal according to some embodiments. DETAILED DESCRIPTION

[0081] Optical communication technology enables information transmission between information processing devices. It loads information onto light and uses the propagation of light to achieve this transmission. Light loaded with information is an optical signal. The propagation of optical signals within information transmission equipment reduces optical power loss, enabling high-speed, long-distance, and low-cost information transmission. The information processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission devices.

[0082] The conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is achieved through optical modules. For example, an optical fiber is connected to the optical signal input end and / or optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or electrical signal output end of the optical module. A first optical signal from the optical fiber is transmitted into the optical module, and the optical module converts the first optical signal into a first electrical signal, which is then transmitted into the optical network terminal. A second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module converts the second electrical signal into a second optical signal, which is then transmitted into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and not all types of information processing devices need to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0083] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments. As shown in Figure 1 , the optical communication system partially comprises a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 , and a network cable 103 .

[0084] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end connects to the optical interface of optical module 200. Optical signals can undergo total internal reflection within optical fiber 101, maintaining nearly their original optical power as they propagate in the direction of total internal reflection. Multiple total internal reflections within optical fiber 101 transmit optical signals from the direction of remote information processing device 1000 into optical module 200, or transmit light from optical module 200 toward remote information processing device 1000, enabling long-distance, low-power information transmission.

[0085] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0086] The host computer 100 has an optical module interface 102, which is configured to connect to the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0087] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a unidirectional / bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0088] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and data center servers are common host computers.

[0089] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0090] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0091] For example, a first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0092] Optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information remains unchanged, but the encoding and decoding methods of the information can change.

[0093] Figure 2 is a partial structural diagram of a host computer provided according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown) disposed within the cage 106. The heat sink 107 has a raised structure that increases the heat dissipation area. A fin-like structure is a common raised structure.

[0094] Optical module 200 is inserted into cage 106 of host computer 100. Cage 106 secures optical module 200, and heat generated by optical module 200 is transferred to cage 106 and then dissipated through heat sink 107. After optical module 200 is inserted into cage 106, the electrical interface of optical module 200 connects to the electrical connector inside cage 106.

[0095] Figure 3 is a structural diagram of an optical module provided according to some embodiments, and Figure 4 is an exploded view of an optical module provided according to some embodiments. Figure 5 is a structural diagram of an optical module provided according to some embodiments without a shell and an unlocking component. Figure 6 is a structural diagram of an optical fiber adapter, a light source, a coherent optical component, and a circuit board according to some embodiments. As shown in Figures 3, 4, 5, and 6, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0096] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0097] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0098] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0099] The direction of the line connecting the two openings 204 and 205 can be consistent with the length of the optical module 200, or it can be inconsistent with the length of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical interface, from which the gold fingers of the circuit board 300 extend and are inserted into the electrical connector of the host computer; opening 205 is an optical port, configured to receive the optical fiber 101, so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0100] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, light emitting component 400, and light receiving component 500 within the housings. These components are encapsulated and protected by the upper and lower housings 201 and 202. Furthermore, during assembly of the circuit board 300, light emitting component 400, and light receiving component 500, positioning components, heat dissipation components, and electromagnetic shielding components are easily positioned, facilitating automated production.

[0101] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0102] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0103] For example, the unlocking member 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes engaging components that mate with the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the engaging components of the unlocking member 600 secure the optical module 200 within the cage 106. When the unlocking member 600 is pulled, the engaging components of the unlocking member 600 move accordingly, thereby changing the connection between the engaging components and the host computer, thereby releasing the fixed engagement between the optical module 200 and the host computer, allowing the optical module 200 to be removed from the cage 106.

[0104] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected together according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0105] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0106] The circuit board 300 also includes gold fingers formed on its end surfaces. The gold fingers are composed of multiple independent pins. The circuit board 300 is inserted into the cage 106, and the gold fingers are electrically connected to the electrical connector inside the cage 106. The gold fingers can be provided only on one side of the circuit board 300 (such as the top surface shown in FIG4 ), or they can be provided on both the top and bottom surfaces of the circuit board 300 to provide more pins. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0107] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0108] The light emitting component and / or the light receiving component are located on the side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting component and the light receiving component are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0109] The circuit board 300 includes a first circuit board 301, a second circuit board 302 and a third circuit board 303. The first circuit board 301 and the second circuit board 302 are both rigid circuit boards, and the third circuit board 303 is a flexible circuit board. The second circuit board 302 is stacked and placed on one end of the first circuit board 301 close to the local oscillator light source 401. The second circuit board 302 is located between the first circuit board 301 and the upper shell 201. The first circuit board 301 and the second circuit board 302 are connected through the third circuit board 303.

[0110] Local oscillator light source 401 is connected to second circuit board 302 and is configured to emit a light beam of a preset specific wavelength. In some examples, local oscillator light source 401 includes a semiconductor gain chip and a silicon photonics chip. The semiconductor gain chip emits a light beam within a wavelength range, while the silicon photonics chip selects a light beam of a specific wavelength from the light beam within the wavelength range. The silicon photonics chip and the semiconductor gain chip form a resonant cavity, and the light beam of the specific wavelength is reflected back and forth between the silicon photonics chip and the semiconductor gain chip, thereby achieving stable output of the light beam of the specific wavelength from the semiconductor gain chip.

[0111] The optical module further includes a transmitting optical fiber adapter 800 and a receiving optical fiber adapter 801. The transmitting optical fiber adapter 800 is used to transmit high-speed optical signals, and the receiving optical fiber adapter 801 is used to receive high-speed optical signals (in some examples, also called high-frequency optical signals).

[0112] The coherent optical component 500 is placed on a circuit board and is used to achieve high-speed optical-to-electrical signal conversion. In some examples, the coherent optical component 500 can be a light receiving component. The coherent optical component 500 includes an optical transmission interface, an optical reception interface, and a local oscillator optical interface. The optical transmission interface extends a first optical fiber, the optical reception interface extends a second optical fiber, and the local oscillator optical interface extends a third optical fiber. The optical transmission interface is connected to the transmission fiber adapter 800, the optical reception interface is connected to the reception fiber adapter 801, and the local oscillator optical interface is connected to the local oscillator light source 401. The coherent optical component is connected to the transmission fiber adapter, the reception fiber adapter, and the local oscillator light source 401 through the optical transmission interface, the optical reception interface, and the local oscillator optical interface, respectively. The coherent optical component 500 is also connected to the DSP chip.

[0113] The narrow-linewidth, high-power laser light emitted by the local oscillator light source 401 is input into the coherent optical assembly 500 through the local oscillator optical interface. Within the coherent optical assembly 500, this laser light is split into two beams. One beam, acting as the transmit beam, enters the coherent modulator within the coherent optical assembly. Driven by the high-speed electrical signals of the DSP chip, this optical-electrical signal is converted into an optical signal. The converted high-speed optical signal is then output from the module's optical transmit interface. The other beam, acting as the local oscillator light beam, undergoes coherent demodulation with the high-speed optical signal input into the coherent optical assembly 500 from the module's optical receive port. The demodulated electrical signal enters the DSP chip for signal processing, completing the optical-electrical signal conversion. The narrow-linewidth, high-power laser light is a beam of a specific wavelength.

[0114] LO light source 401 also includes an internal fiber adapter. A first optical fiber extends from the internal fiber adapter, and a local oscillator optical interface extends from the local oscillator optical fiber. The first optical fiber and the local oscillator optical fiber are fusion-connected to connect the internal fiber adapter to the local oscillator optical interface. A second optical fiber extends from the transmitting fiber adapter 800, and the transmitting optical interface extends from the transmitting optical fiber. The second optical fiber and the transmitting optical fiber are fusion-connected to connect the transmitting fiber adapter 800 to the transmitting optical interface. A third optical fiber extends from the receiving fiber adapter 801, and the receiving optical fiber extends from the receiving optical interface. The third optical fiber and the receiving optical fiber are fusion-connected to connect the receiving fiber adapter 801 to the receiving optical interface.

[0115] FIG7 is a simplified structural diagram of an optical receiving component provided according to some embodiments. As shown in FIG7 , the optical receiving component includes: a local oscillator light source 401, a coherent optical component 500, a transimpedance amplifier 510, an analog-to-digital conversion sampler 520, and an MCU. The coherent optical component has a local oscillator interface and a receiving interface, wherein the local oscillator interface is connected to the local oscillator light source and receives local oscillator light from the local oscillator light source; the receiving interface receives a first optical signal from the optical fiber. The coherent optical component receives the local oscillator light and the first optical signal, performs coherent demodulation on the local oscillator light and the first optical signal, and the receiving photodetector generates a photocurrent for the first optical signal. The transimpedance amplifier amplifies the photocurrent and outputs a voltage signal. The analog-to-digital conversion sampler performs data acquisition on the voltage signal, converts the voltage signal into a data signal, and transmits the acquired data signal to the MCU. Based on the data signal, the MCU calculates the optical power value using a preset optical power formula.

[0116] The first signal light in the optical fiber contains signal lights of multiple wavelengths. By adjusting the frequency of the local oscillator light, the reception of signal lights of different wavelengths can be achieved.

[0117] In some embodiments, the MCU is further connected to a photoresistor, and the MCU receives a temperature signal from the photoresistor to obtain the temperature of the coherent optical component. The MCU calculates the actual optical power value based on the current receiving frequency.

[0118] The first optical power formula of the example is: P = P1 - P2 (1)

[0119] Where P1 is the reference optical power, and P2 is the current frequency deviation. The reference optical power is calculated by substituting the data signal collected by the analog-to-digital conversion sampler into the reference optical power formula.

[0120] The reference optical power formula is formula (2), which represents the mapping relationship between the current AD sampling value and the reference optical power. P1 = aln(AD) + b (2)

[0121] In Formula 2, AD is the current AD sampling value of the analog-to-digital converter sampler, a is the formula coefficient, and b is a constant. During the calculation of the reference optical power formula, the temperature of the optical module and the frequency of the first optical signal do not change.

[0122] For example, a can be 4.4, and b can be -44; that is, the reference optical power formula (2) can be as follows: P1 = 4.4ln(AD) - 44

[0123] In some embodiments, when the temperature is a first temperature and the frequency is a first frequency, the AD sampling value and the reference optical power may be collected respectively, and the reference optical power formula may be obtained by fitting calculation.

[0124] The frequency of the first optical signal of the coherent optical component is less than or greater than the frequency minimum value, and the temperature of the coherent optical component is greater than or equal to the frequency maximum value, then the first frequency is a value between the frequency minimum value and the frequency maximum value.

[0125] In some embodiments, the first temperature may be any temperature point between 23° C. and 27° C. For example, the first temperature is 25° C., that is, the sampling value and the reference optical power are collected when the frequency of the first signal light is 193.7 THz and the temperature is 25° C., and the reference optical power formula is obtained by fitting.

[0126] The current frequency deviation is the value calculated by substituting the current frequency value into the frequency deviation formula L2. The frequency deviation formula represents the mapping between frequency and optical power. The AD sampling value at this time is the data signal collected by the analog-to-digital converter sampler. The optical power calculated by substituting it into the formula is called the calculated optical power. The current optical power is the actual optical power of the first optical signal. The frequency deviation value is the difference between the calculated optical power and the actual optical power.

[0127] For ease of expression, the difference between the frequency maximum and the frequency minimum is referred to as the frequency extreme difference. For example, the difference between the first frequency and the frequency minimum is referred to as the first frequency difference, and the ratio of the first frequency difference to the frequency extreme difference is greater than or equal to 40%, and the ratio of the first frequency difference to the frequency extreme difference is less than or equal to 60%.

[0128] In some embodiments, the minimum frequency value of the first optical signal is 191.3 THz, and the maximum frequency value is 196.1 THz, so the first frequency may be 193.7 THz, that is, the sampling value and the reference optical power are collected at a frequency of 193.7 THz, and the reference optical power formula is obtained by fitting.

[0129] In some embodiments, the first frequency may be any point between a minimum frequency value and a maximum frequency value. For example, the minimum frequency value is 191.3 THz, the maximum frequency value is 196.1 THz, and the first frequency may be set to 193.7 THz.

[0130] In some embodiments, when the frequency of the first optical signal is 191.3 THz to 193.7 THz, sampling values ​​and reference optical power are collected when the first frequency is 192.7 THz, and the reference optical power formula is obtained by fitting.

[0131] Table 1 is a value set of sampling values ​​and reference optical powers, wherein the sampling values ​​and reference optical powers are collected when the frequency of the first signal light is 193.7 THz and the temperature is 25°C.

[0132] Figure 8 is a data graph showing the corresponding sample values ​​in Table 1 and the sample values ​​of the reference optical power according to some embodiments. As shown in Figure 8 , the horizontal axis represents the AD sample values, and the vertical axis represents the AD sample values. The data in Figure 8 corresponds to Table 1 and was obtained by collecting the sample values ​​and the reference optical power when the frequency of the first signal light was 193.7 THz and the temperature was 25°C. The reference optical power formula was obtained through fitting calculation.

[0133] In some embodiments of the present disclosure, a method for obtaining the frequency deviation formula includes:

[0134] When the temperature is a first temperature and the frequency of the first signal light is a first frequency, the actual optical power serves as the first reference value, and the actual optical power is a fixed value. When the frequency of the first signal light is a second frequency and the temperature is the first temperature, a second calculated optical power is calculated according to the reference optical power formula. The difference between the second calculated optical power and the first reference value is the second frequency deviation value. When the frequency of the first signal light is a third frequency and the temperature is the first temperature, a third calculated optical power is calculated according to the reference optical power formula. The difference between the third calculated optical power and the first reference value is the third frequency deviation value.

[0135] A frequency deviation formula is obtained by fitting according to the deviation values ​​of the first frequency, the second frequency, the third frequency and the optical powers corresponding thereto.

[0136] For example, the first frequency is V1, the first frequency deviation value is A1; the second frequency is V2, the second frequency deviation value is A2, and the frequency deviation formula after fitting includes a first frequency broken line segment and a second frequency broken line segment.

[0137] The first frequency broken line segment is obtained by fitting the first frequency as V1 and the first frequency deviation as 0; the second frequency as V2 and the second frequency deviation as A2, formula (3):

[0138] The second frequency broken line segment is obtained by fitting the first frequency as V1 and the first frequency deviation as 0; the third frequency as V3 and the third frequency deviation as A3, formula (4):

[0139] The frequency deviation formula is the mapping relationship between the frequency deviation value and the frequency. In formula (3) and formula (4), V is the current frequency, V1 is the first frequency, V3 is the third frequency, V2 is the second frequency, A2 is the difference between the current optical power and the reference optical power when the frequency is the second frequency, and A3 is the difference between the current optical power and the reference optical power when the frequency is the third frequency.

[0140] For example, if the temperature is 25°C, the first frequency is 193.7 THz, the second frequency is 191.3 THz, the fixed input optical power is -15 dBm, and the reported optical power is -16 dBm, then the second frequency deviation value A2 is -1 dB. If the temperature is 25°C, the third frequency is 196.1 THz, the fixed input optical power is -15 dBm, and the reported optical power is -14 dBm, then the third frequency deviation value A3 is 1 dB.

[0141] Table 2 is a frequency deviation value data table of an example of the present disclosure. Figure 9 is a frequency deviation curve shown by the data in Table 2 according to some embodiments. In Figure 9, the horizontal axis is the temperature value, and the vertical axis is the temperature deviation value.

[0142] When the temperature is the first temperature and the frequency of the first signal light is 193.7 THz, the actual optical power serves as the first reference value, the actual optical power is a fixed value, and the power deviation value is 0. When the frequency of the first signal light is 191.3 THz and the temperature is the first temperature, the second calculated optical power is calculated according to the reference optical power formula. The difference between the second calculated optical power and the first reference value, i.e., the second frequency deviation value, is 1. When the frequency of the first signal light is 196.1 THz and the temperature is the first temperature, the third calculated optical power is calculated according to the reference optical power formula. The difference between the third calculated optical power and the first reference value, i.e., the third frequency deviation value, is -1.

[0143] In some embodiments, the frequency deviation formula may be obtained by collecting multiple frequencies and the deviation values ​​of the optical powers corresponding to the frequencies, and then performing fitting calculations. For example, the frequency deviation formula may be obtained by collecting four, five, or six frequencies and the deviation values ​​of the optical powers corresponding to the frequencies, and then performing fitting calculations.

[0144] In some embodiments, the optical power formula is: P = P1 - P2 (1)

[0145] Where P1 is the reference optical power and P2 is the current frequency deviation.

[0146] Collect the current AD sampling value, substitute the AD sampling value into the reference optical power formula to calculate the reference optical power value. Collect the frequency of the current signal light, substitute the frequency value into the current frequency deviation formula to calculate the current frequency deviation value.

[0147] The first optical power formula provided in some embodiments of the present disclosure calculates a reference optical power value by substituting the AD sampling value into the reference optical power formula, and then substituting the current frequency value into the frequency deviation formula to calculate the current frequency deviation. The calculated optical power value is then subtracted from the current frequency deviation from the reference optical power value. This calculated optical power value, based on the reference optical power value, subtracts the current frequency deviation, making the calculated optical power closer to the actual optical power and improving the accuracy of the reported optical power.

[0148] Other embodiments of the present disclosure further disclose that: the MCU calculates the optical power value according to the current receiving frequency and the current temperature.

[0149] The second optical power formula of the example is formula (5): P = P1-P2-P3 (5)

[0150] Where P1 is the reference optical power, P2 is the current frequency deviation, and P3 is the current temperature deviation.

[0151] The reference optical power is a functional relationship between the AD sampling value and the reference optical power when the frequency of the first optical signal is the first frequency at the first temperature. The reference optical power is a reference optical power value calculated by substituting the data signal collected by the analog-to-digital conversion sampler into the reference optical power formula.

[0152] The reference optical power formula is formula (2), which represents the mapping relationship between the sampling value and the reference optical power. P1 = a1n(AD) + b2 (2)

[0153] In Equation 2, AD is the current AD sampling value of the analog-to-digital converter sampler. The current temperature deviation value is the value calculated by substituting the current temperature value into the temperature deviation formula. The temperature deviation formula represents the mapping relationship between temperature value and optical power.

[0154] The current frequency deviation is the value calculated by substituting the current frequency value into the frequency deviation formula. The frequency deviation formula represents the mapping relationship between frequency value and optical power.

[0155] In some embodiments, the reference optical power formula is a relationship formula obtained by respectively collecting the sampling value and the reference optical power and fitting the calculation when the temperature is the first temperature and the frequency is the first frequency.

[0156] The current temperature deviation value is calculated by substituting the current frequency value into the temperature deviation formula. The temperature deviation formula represents the mapping relationship between temperature and optical power.

[0157] Wherein the temperature of the coherent optical component is less than or greater than the temperature minimum value, and the temperature of the coherent optical component is greater than or equal to the temperature maximum value, then the first temperature is a value between the temperature minimum value and the temperature maximum value.

[0158] For ease of expression, the difference between the maximum temperature value and the minimum temperature value is referred to as the extreme temperature difference value. For example, the difference between the first temperature value and the minimum temperature value is referred to as the first temperature difference value, and the ratio of the first temperature difference value to the extreme temperature difference value is greater than or equal to 35%, and the ratio of the first temperature difference value to the extreme temperature difference value is less than or equal to 75%.

[0159] In some embodiments of the present disclosure, the method for obtaining the frequency deviation formula is consistent with the above description and will not be repeated here.

[0160] When the temperature is the first temperature and the frequency of the first signal light is the first frequency, the actual optical power serves as the first reference value, and the actual optical power is a fixed value. When the frequency of the first signal light is the first frequency and the temperature is the second temperature, the fourth calculated optical power is calculated according to the reference optical power formula. The difference between the fourth calculated optical power and the first reference value is the second temperature deviation value. When the frequency of the first signal light is the first frequency and the temperature is the third temperature, the fifth calculated optical power is calculated according to the reference optical power formula. The difference between the fifth calculated optical power and the first reference value is the third temperature deviation value. The second temperature is lower than the first temperature, and the third temperature is higher than the first temperature.

[0161] A temperature deviation formula is obtained by fitting according to the first temperature, the second temperature, the third temperature and the deviation values ​​of the optical powers respectively corresponding to the first temperature, the second temperature and the third temperature.

[0162] For example, the first temperature is W1, the first temperature deviation value is I1; the second temperature is W2, the second temperature deviation value is I2, and the fitted temperature deviation formula includes a first temperature broken line segment and a second temperature broken line segment.

[0163] The first temperature segment is obtained by fitting the first temperature as W1 and the first temperature deviation as 0; the second temperature as W2 and the second temperature optical power as I2, formula (6):

[0164] The second temperature broken line segment is obtained by fitting the first temperature as W1, the first temperature optical power as 0, the third temperature as W3, and the third temperature optical power as I3, formula (7):

[0165] The temperature deviation formula is a mapping relationship between the temperature deviation value and the temperature. In formula (6) and formula (7), W is the current frequency, W1 is the first temperature, W3 is the third temperature, W2 is the second temperature, I2 is the difference between the current optical power and the reference optical power at the second temperature, and I3 is the difference between the current optical power and the reference optical power at the third temperature.

[0166] For example, the frequency of the first signal light is 193.7 THz, the second temperature is 0°C, the fixed input optical power is -15 dBm, the reported optical power is -16 dBm, and the second temperature deviation value I2 is -1 dB. The frequency of the first signal light is 193.7 THz, the third temperature is 55°C, the fixed input optical power is -15 dBm, the reported optical power is -14 dBm, and the third temperature deviation value I3 is 1 dB.

[0167] Table 3 is a temperature deviation value data table of an example of the present disclosure. Figure 10 is a temperature deviation curve shown by the data in Table 3 according to some embodiments.

[0168] In some embodiments, when the frequency of the first optical signal is 191.3 THz to 193.7 THz, sampling values ​​and reference optical power are collected when the first frequency is 192.7 THz, and the reference optical power formula is obtained by fitting.

[0169] In some embodiments of the present disclosure, a method for obtaining a temperature deviation formula includes: collecting the frequency of the first signal light as the first frequency and fixing the optical power as the first reference value. The frequency of the first signal light is collected as the first frequency and fixing the optical power as the first reference value, and the difference between the optical power corresponding to the second temperature of the coherent optical chip and the first reference value is referred to as the second temperature deviation value. The frequency of the first signal light is collected as the first frequency and the optical power corresponding to the third temperature of the coherent optical chip is referred to as the third temperature deviation value. The second temperature is less than the first temperature, and the third temperature is greater than the first temperature.

[0170] A temperature deviation formula is obtained by fitting according to the first temperature, the second temperature, the third temperature and the deviation values ​​of the optical powers respectively corresponding to the first temperature, the second temperature and the third temperature.

[0171] In some embodiments, the temperature deviation formula can be obtained by collecting multiple temperatures and the optical power deviation values ​​corresponding to the different temperatures, and then performing fitting calculations. For example, the frequency deviation formula can be obtained by collecting four, five, or six temperatures and the optical power deviation values ​​corresponding to the temperatures, and then performing fitting calculations.

[0172] In some embodiments, the optical power formula is as follows: P = P1 - P2 - P3 (5)

[0173] Where P1 is the reference optical power, P2 is the current frequency deviation, and P3 is the current temperature deviation.

[0174] Collect the current AD sampling value and substitute it into the reference optical power formula to calculate the reference optical power value. Collect the current signal light frequency and substitute it into the frequency deviation formula to calculate the current frequency deviation value. Collect the current temperature and substitute it into the temperature deviation formula to calculate the current temperature deviation value.

[0175] The first optical power formula provided by the present disclosure calculates a reference optical power value by substituting the AD sampling value into the reference optical power formula, calculates the current frequency deviation based on the current frequency value into the frequency deviation formula, and calculates the temperature deviation based on the current temperature. The calculated optical power value is obtained by subtracting the current frequency deviation and the current temperature deviation from the reference optical power value. This calculated optical power value, by subtracting the current frequency deviation and the current temperature deviation from the reference optical power value, makes the calculated optical power closer to the actual optical power, thereby improving the accuracy of the reported optical power.

[0176] FIG11 is a structural diagram of a coherent optical component provided according to some embodiments. FIG12 is an exploded view of a coherent optical component provided according to some embodiments. As shown in FIG11 and FIG12, in some examples, the coherent optical component 902 (500) includes a cover 921 and a substrate 923, the substrate 923 is fixed on the circuit board 300, and the cover 921 is covered on the substrate 923 to form a first storage cavity, in which an optical chip and an optical matching chip are arranged, the optical chip includes a coherent modulation chip 925, and the optical matching chip includes a driver chip 926 and a transimpedance amplifier chip 924, the coherent modulation chip 925 is configured to modulate and demodulate the optical signal, the driver chip 926 is configured to provide a modulation current to the coherent modulation chip 925 so that the coherent modulation chip 925 can modulate the optical signal, and the transimpedance amplifier chip 924 is used to amplify the electrical signal. The electrical signal is obtained by demodulating the received optical signal by the coherent modulation chip 925.

[0177] The substrate 923 is a circuit adapter board used to transfer electrical signals from the circuit board 300 to the first storage cavity, and also to transfer electrical signals within the first storage cavity to the circuit board 300. In some embodiments, the substrate 923 includes circuit traces, etc., which connect the circuit board 300 to the optical chip and optical matching chip within the first storage cavity.

[0178] In some embodiments, the optical chip and the optical matching chip are both mounted in the first storage cavity using a BGA package with a face-mounted surface mount process. Specifically, the second surfaces of the optical chip and the optical matching chip are mounted on the substrate, while the first surfaces of the optical chip and the optical matching chip are provided with bonding pads. A gap exists between the first surfaces of the optical chip and the optical matching chip and the cover 921, and the first surfaces of the optical chip and the optical matching chip are connected to the substrate via bonding wires.

[0179] Under the upright mounting process, the heat dissipation of the optical chip and the optical matching chip becomes a difficult point. First, the heat dissipation performance of the substrate is poor. The substrate is soldered on the circuit board, and the heat conducted to the substrate will also cause thermal interference to other devices on the circuit board. Secondly, the main heat dissipation path of the optical chip and the optical matching chip is the first side of the optical chip and the optical matching chip - air - cover 921 - thermal gasket - upper shell of the optical module. However, there are wire bonding pads on the first side of the optical chip and the optical matching chip, and the area available for heat dissipation on the first side of the optical chip and the optical matching chip is small. In addition, the optical chip and the optical matching chip are still a certain distance away from the cover 921, and the thermal conductivity of the air is small, resulting in only a very small part of the heat of the optical chip and the optical matching chip being conducted outside the optical module, resulting in low heat dissipation efficiency.

[0180] To address this issue, in some embodiments, the optical chip and optical matching chip are mounted within the first storage cavity using a flip-chip process. Specifically, the second surfaces of the optical chip and optical matching chip are mounted on the inner top wall of the cover 921. Solder pads are provided on the first surfaces of the optical chip and optical matching chip. A gap exists between the first surfaces of the optical chip and optical matching chip and the substrate, and the first surfaces of the optical chip and optical matching chip are connected to the substrate via wire bonding.

[0181] The packaging process for a coherent optical component involves first attaching the optical chip and optical matching chip to the inner top wall of the cover 921, then securing the cover 921 to the substrate 923, and finally bonding the pads of the optical chip and optical matching chip to the pad area on the substrate 923. However, after the cover 921 is secured to the substrate 923, bonding tools cannot enter the first storage cavity enclosed by the cover 921 and the substrate 923, making it impossible to bond the pads of the optical chip and optical matching chip to the pad area on the substrate 923. Therefore, an electrical adapter fixture 922 is required within the first storage cavity to transfer electrical signals from the optical chip and optical matching chip to the circuit board, and also to transfer electrical signals from the circuit board to the optical chip and optical matching chip.

[0182] The electrical transfer fixture 922 is a circuit transfer board used to transfer electrical signals on the circuit board 300 to the optical chip and optical matching chip, and also to transfer electrical signals from the optical chip and optical matching chip to the circuit board 300. In some embodiments, the electrical transfer fixture 922 includes circuit traces, etc., which connect the circuit board 300 to the optical chip and optical matching chip through the circuit traces.

[0183] Figure 13 is a cross-sectional view of a coherent optical assembly according to some embodiments. As shown in Figure 13, in some embodiments, a cover 921 and a substrate 923 define a first storage cavity, within which an electrical adapter fixture 922 is disposed. The electrical adapter fixture 922 includes a solder pad area and a solder ball area. The solder pad area is wire-bonded to the optical chip and the optical matching chip, while the solder ball area is connected to the substrate 923.

[0184] As shown in Figures 12 and 13, the coherent optical assembly further includes an optical fiber array 927. One end of the optical fiber array 927 is located within the second storage cavity, and the other end of the optical fiber array 927 extends outside the second storage cavity. The three optical fibers of the optical fiber array 927 extending outside the second storage cavity are respectively connected to the light source, the transmitting optical fiber adapter 700, and the receiving optical fiber adapter 701, so that the optical fiber array 927 receives light emitted by the light source 901, the optical signal sent by the receiving optical fiber adapter 701, and transmits the optical signal to the transmitting optical fiber adapter 700. The first storage cavity and the second storage cavity enclose the storage cavity.

[0185] Figure 14 is an assembled diagram of the cover and bottom shell provided in accordance with some embodiments. Figure 15 is an exploded view of the cover and bottom shell provided in accordance with some embodiments. As shown in Figures 14 and 15, the coherent optical assembly further includes a bottom shell 928. The cover 921 and bottom shell 928 define a second storage cavity 9218 having a through hole 9217 for securing the optical fiber array 927 within the second storage cavity 9218. Specifically, one end of the optical fiber array 927 is located within the second storage cavity 9218, while the other end of the optical fiber array 927 extends outside the second storage cavity 9218 through the through hole 9217.

[0186] As shown in FIG15 , in some embodiments, the cover 921 is provided with a first protrusion 9215 and a second protrusion 9216. The first protrusion 9215 is provided corresponding to the transimpedance amplifier chip 924, and the second protrusion 9216 is provided corresponding to the driver chip 926. The first protrusion 9215 is in contact with the transimpedance amplifier chip 924, and the second protrusion 9216 is in contact with the driver chip 926. The first protrusion 9215 and the second protrusion 9216 not only compensate for the height difference between the transimpedance amplifier chip 924 and the driver chip 926 and the coherent modulation chip 925, thereby ensuring that the first surfaces of the transimpedance amplifier chip 924, the driver chip 926, and the coherent modulation chip 925 are flush, but also dissipate heat. The first protrusion 9215 and the second protrusion 9216 increase the thickness of the cover 921, thereby improving the heat dissipation efficiency of the cover 921.

[0187] As shown in Figure 15, in some embodiments, the cover shell 921 includes a cover shell bottom plate 9213 and a cover shell side plate 9214, the upper surface of the cover shell side plate 9214 is in contact and connected with the cover shell bottom plate 9213, and the lower surface of the cover shell side plate 9214 is in contact and connected with the substrate 923, the cover shell bottom plate 9213 and the cover shell side plate 9214 form a first storage groove 9211 and a second storage groove 9212, the second storage groove 9212 and the bottom shell 928 form a second storage cavity 9218, the first storage groove is arranged corresponding to the optical chip and the optical matching chip, the first storage groove 9211 and the second storage groove 9212 are connected, and the first storage groove 9211 is provided with a first protrusion 9215 and a second protrusion 9216.

[0188] One end of the cover side plate 9214 has a through hole 9217. One end of the bottom shell 928 is in contact with the side wall of the through hole 9217, and two oppositely disposed side walls of the other end of the bottom shell 928 are in contact with the side walls of the second storage cavity 9218. Specifically, the bottom shell 928 includes a first bottom shell portion 9281 and a second bottom shell portion 9282. The width of the first bottom shell portion 9281 is smaller than the width of the second bottom shell portion 9282, so that the first bottom shell portion 9281 is in contact with the side wall of the through hole 9217, and the two oppositely disposed side walls of the second bottom shell portion 9282 are in contact with the side walls of the second storage slot.

[0189] Figure 16 is an exploded view of a coherent optical assembly, excluding the cover and bottom housing, according to some embodiments. Figure 17 is a cross-sectional view of a coherent optical assembly, excluding the cover and bottom housing, according to some embodiments. As shown in Figures 16 and 17, in some embodiments, the optical fiber array 927 is connected to the coherent modulation chip 925, so that the coherent modulation chip 925 receives light and received optical signals transmitted by the optical fiber array 927, and also sends transmitted optical signals to the optical fiber array 927.

[0190] In order to prevent the light in the optical fiber array 927 and the transmitted optical signal from being reflected at the connection between the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925, thereby affecting the optical power, the central axis of the optical fiber array 927 and the central axis of the optical port of the coherent modulation chip 925 are at an angle of 6° to 8°, thereby reducing the light and the transmitted optical signal from being reflected at the connection between the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925.

[0191] In some embodiments, the optical fiber array 927 and the coherent modulation chip 925 are directly bonded by glue, that is, the end face of the optical fiber array 927 and the end face of the coherent modulation chip 925 are directly connected by glue.

[0192] In some embodiments, the optical fiber array 927 is connected to the coherent modulation chip 925 via a connector 929. Specifically, the end surface of one end of the connector 929 is connected to the end surface of the optical fiber array 927 via glue, and the upper surface of the other end of the connector 929 is connected to the first surface of the coherent modulation chip 925 via glue. This increases the bonding surface between the connector 929 and the optical fiber array 927, thereby improving the connection stability between the optical fiber array 927 and the coherent modulation chip 925.

[0193] FIG18 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments. FIG19 is an assembly diagram of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments from another perspective. FIG20 is an exploded view of an optical chip, an optical matching chip, and a coherent substrate provided according to some embodiments. As shown in FIG18 , FIG19 , and FIG20 , an electrical transfer fixture 922 is fixed to a substrate 923, and the electrical transfer fixture 922 is electrically connected to the substrate 923. The coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are wired to the electrical transfer fixture 922 to transmit the electrical signals of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 to the substrate 923 via the electrical transfer fixture 922, and also to transmit the electrical signals on the substrate 923 to the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 via the electrical transfer fixture 922.

[0194] In some embodiments, the electrical transfer fixture 922 is soldered to the substrate 923 via solder balls, which not only fixes the electrical transfer fixture 922 to the substrate 923 but also enables electrical connection between the electrical transfer fixture 922 and the substrate 923 .

[0195] To protect the gold wires, in some embodiments, a gap is provided between the first surfaces of the optical chip and the optical matching chip and the substrate. This gap prevents the gold wires from colliding with components within the cavity, thereby protecting the gold wires.

[0196] To reduce the bonding distance between the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 and the electrical adapter fixture 922, in some embodiments, the electrical adapter fixture 922 is provided with multiple hollowed-out regions. Second bonding pads are provided in the areas surrounding the hollowed-out regions of the electrical adapter fixture 922. The coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all placed in the corresponding hollowed-out regions. The first bonding pads of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all bonded to the second bonding pads. The areas surrounding the hollowed-out regions of the electrical adapter fixture 922 are provided with second bonding pads. The coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all placed in the corresponding hollowed-out regions. This ensures that the first bonding pads of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are flush with the second bonding pads, thereby shortening the gold wire between the first bonding pads and the second bonding pads.

[0197] In some embodiments, the length of the substrate 923 is greater than the length of the electrical adapter fixture 922, and the width of the substrate 923 is greater than the width of the electrical adapter fixture 922. If the length of the substrate 923 is greater than the length of the electrical adapter fixture 922, and the width of the substrate 923 is greater than the width of the electrical adapter fixture 922, then the electrical adapter fixture 922 can be located in the second storage cavity enclosed by the cover 921 and the substrate 923.

[0198] In some embodiments, the second surface of the coherent modulation chip 925 protrudes relative to the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924. The second surface of the coherent modulation chip 925 protrudes relative to the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924 to compensate for the height difference between the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924, so that the first surfaces of the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are flush. For example, the second surface of the coherent modulation chip 925 is flush with the upper surface of the electrical transfer fixture 922, and the second surfaces of the driver chip 926 and the transimpedance amplifier chip 924 are recessed relative to the upper surface of the electrical transfer fixture 922; the second surface of the coherent modulation chip 925 protrudes relative to the upper surface of the electrical transfer fixture 922; and the second surface of the coherent modulation chip 925 is recessed relative to the upper surface of the electrical transfer fixture 922.

[0199] Figure 21 is a structural diagram of an electrical transfer fixture provided according to some embodiments. Figure 22 is a structural diagram of an electrical transfer fixture provided according to some embodiments from another perspective. Figure 23 is an assembly diagram of an electrical transfer fixture, an optical chip and an optical matching chip provided according to some embodiments. As shown in Figures 21, 22 and 23, the electrical transfer fixture 922 includes a substrate body 9221. A plurality of hollow areas are provided on a side of the substrate body 9221 facing the optical fiber array 927. The plurality of hollow areas include a first hollow area 9224, a second hollow area 9222 and a third hollow area 9223. The first hollow area 9224 is closer to the optical fiber array 927 than the second hollow area 9222 and the third hollow area 9223. The first hollow area 9224 is At the opening of the electrical adapter fixture 922, a coherent modulation chip 925 is placed in the first hollow area 9224, the second hollow area 9222 is connected to the first hollow area 9224, a transimpedance amplifier chip 924 is placed in the second hollow area 9222, the third hollow area 9223 is connected to the first hollow area 9224, there is a barrier 9225 between the third hollow area 9223 and the second hollow area 9222, and a driver chip 926 is placed in the third hollow area 9223.

[0200] As shown in FIG22 , in some embodiments, a pad area and a solder ball area are provided on the lower surface of the substrate body 9221. The pad area is connected to the solder ball area, and the solder ball area is surrounded by the pad area. The solder ball area is the area on the lower surface of the substrate body 9221 excluding the pad area. The coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 are all wire-bonded to the pad area, and the electrical adapter fixture 922 is connected to the substrate 923 via the solder ball area. The wires used to bond the coherent modulation chip 925, the driver chip 926, and the transimpedance amplifier chip 924 to the pad area are gold wires.

[0201] In some embodiments, the pad area of ​​the electrical adapter fixture 922 is flush with the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924 to shorten the gold wire distance between the pad area of ​​the electrical adapter fixture 922 and the first surface of the coherent modulation chip 925, the driver chip 926 and the transimpedance amplifier chip 924.

[0202] In some embodiments, the pad area and the solder ball area are flush with each other, that is, the distance from the pad area to the substrate 923 is equal to the distance from the solder ball area to the substrate 923 .

[0203] In some embodiments, the pad area is recessed relative to the solder ball area, that is, the distance from the pad area to the substrate 923 is greater than the distance from the solder ball area to the substrate 923, thereby increasing the gap height between the pad area and the substrate 923, and then increasing the vertical distance between the gold wire and the substrate 923, thereby further protecting the gold wire.

[0204] The signal line of the solder ball area extends upward to the pad area, so that the electrical signal of the pad area is transmitted to the substrate 923, and the electrical signal of the substrate 923 is also transmitted to the pad area. Because the pad area is recessed upward relative to the solder ball area, the signal line of the solder ball area extends upward to the second pad of the pad area.

[0205] [Corrected 29.08.2024 according to Rule 91] As shown in FIG22 and FIG23, in some embodiments, the substrate body 9221 includes a first electrical transfer fixing portion 9226 and a second electrical transfer fixing portion 9227, the first electrical transfer fixing portion 9226 being a solder ball area, the second electrical transfer fixing portion 9227 being a solder pad area, and the first electrical transfer fixing portion 9226 and the second electrical transfer fixing portion 9227 being located on two extending directions of the electrical transfer fixing member 9221, respectively. The first electrical transfer fixing portion 9226 is located around the second electrical transfer fixing portion 9227. The first electrical transfer fixing portion 9226 is connected to the second electrical transfer fixing portion 9227. The vertical distance between the first electrical transfer fixing portion 9226 and the substrate 923 is smaller than the vertical distance between the second electrical transfer fixing portion 9227 and the substrate 923. The first electrical transfer fixing portion 9226 is fixed to the substrate 923 via solder balls to achieve electrical connection between the electrical transfer fixture 922 and the substrate 923. The second electrical transfer fixing portion 9227 is provided with multiple hollowed-out areas. Second solder pads are provided in the areas surrounding the hollowed-out areas of the second electrical transfer fixing portion 9227. The second solder pads are wire-bonded to the first solder pads to achieve electrical connection between the electrical transfer fixture 922 and the optical chip and the optical matching chip.

[0206] In some embodiments, the first power transfer fixing portion 9226 and the second power transfer fixing portion 9227 are respectively located in two extending directions of the power transfer fixing member 922. For example, the first power transfer fixing portion 926 extends downward along the vertical direction of the power transfer fixing member 922 so that the first power transfer fixing portion 926 is perpendicular to the substrate 923, and the second power transfer fixing portion 9227 extends leftward along the horizontal direction of the power transfer fixing member 922 so that the second power transfer fixing portion 9227 is parallel to the substrate 923, and the first power transfer fixing portion 926 and the second power transfer fixing portion 9227 are perpendicular to each other.

[0207] In some embodiments, the first electrical transfer fixing portion 9226 includes two first arms connected to form an L-shaped first open slot with an opening. An optical chip and an optical matching chip are disposed within the first open slot. The opening is distal to the optical matching chip, and the optical fiber array 927 traverses the opening to connect with the coherent modulation chip 925 within the U-shaped slot. A second electrical transfer fixing portion 9227 is disposed within the first open slot. The second electrical transfer fixing portion 9227 is connected to the first electrical transfer fixing portion 9226, i.e., the second arm of the second electrical transfer fixing portion 9227 is connected to the first arm of the first electrical transfer fixing portion 9226 to form an L-shaped second open slot. The second open slot has a hollowed-out area, in which the coherent modulation chip 925, the transimpedance amplifier chip 924, and the driver chip 926 are disposed. Since there is at least one second arm around the hollowed-out area to limit the positions of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926; the area around the hollowed-out area in the second electrical transfer fixing part 9227 (i.e., the second arm of the second opening groove) is provided with a second solder pad, and the first solder pads of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are all wired to the second solder pad to realize the electrical connection between the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 and the electrical transfer fixing part 922.

[0208] As shown in FIG22 , in some embodiments, the first electrical transfer fixing portion 9226 includes three first arms, which are sequentially connected to form a U-shaped first open slot with an opening. An optical chip and an optical matching chip are disposed within the first open slot. The opening is distal to the optical matching chip, and the optical fiber array 927 traverses the opening and connects to the coherent modulation chip 925 within the U-shaped slot. A second electrical transfer fixing portion 9227 is disposed within the first open slot and is connected to the first electrical transfer fixing portion 9226. That is, the second arm of the second electrical transfer fixing portion 9227 is connected to the first arm of the first electrical transfer fixing portion 9226 to form a U-shaped second open slot. The second open slot has a hollowed-out area, in which the coherent modulation chip 925, the transimpedance amplifier chip 924, and the driver chip 926 are disposed. Since there are at least two second arms around the hollowed-out area, the positions of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are further limited; the area around the hollowed-out area in the second electrical transfer fixing part 9227 (i.e., the second arm of the second opening groove) is provided with a second solder pad, and the first solder pads of the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 are all wired to the second solder pad to realize the electrical connection between the coherent modulation chip 925, the transimpedance amplifier chip 924 and the driver chip 926 and the electrical transfer fixing part 922.

[0209] In some embodiments, the second electrical transfer fixing portion 9227 includes a first pad portion 92271, a second pad portion 92272, a third pad portion 92273, a fourth pad portion 92274, and a fifth pad portion 92275. The first pad portion 92271, the second pad portion 92272, the third pad portion 92273, the fourth pad portion 92274, and the fifth pad portion 92275 are sequentially connected to form a U-shaped placement recess. A gap is provided between the placement recess and the substrate 923. A second pad is disposed within the placement recess. The second pad within the placement recess is wire-bonded to the first pads of the optical chip and the optical matching chip, thereby creating a gap between the first pads of the optical chip and the optical matching chip and the substrate 923, thereby protecting the gold wire between the first pad and the second pad.

[0210] In some embodiments, the second electrical connection fixing portion 9227 also includes a sixth pad portion, which is the side of the barrier 9225 facing the substrate 923. The sixth pad portion is connected to the middle area of ​​the third pad portion 92273 so that the sixth pad portion is located between the transimpedance amplifier chip 924 and the driver chip 926.

[0211] The first solder pad portion 92271 and the fifth solder pad portion 92275 are both arranged corresponding to the coherent modulation chip 925. The first solder pad portion 92271 is located behind the coherent modulation chip 925, and the fifth solder pad portion 92275 is located in front of the coherent modulation chip 925. The second solder pads of the first solder pad portion 92271 and the fifth solder pad portion 92275 are both wire-bonded to the first solder pad of the coherent modulation chip 925 to electrically connect the coherent modulation chip 925 to the electrical adapter fixture 922.

[0212] The second pad portion 92272 is arranged corresponding to the transimpedance amplifier chip 924, the second pad portion 92272 is located behind the transimpedance amplifier chip 924, the sixth pad portion is located between the transimpedance amplifier chip 924 and the driver chip 926, and the transimpedance amplifier chip 924 is located between the coherent modulation chip 925 and the third pad portion 92273. Then the first pad of the transimpedance amplifier chip 924 is respectively connected with the second pad portion 92272, the third pad portion 92273 and the second pad of the sixth pad portion, so that the transimpedance amplifier chip 924 is electrically connected to the electrical adapter fixture 922; the first pad of the transimpedance amplifier chip 924 is also connected with the first pad of the coherent modulation chip 925, so that the transimpedance amplifier chip 924 is electrically connected to the coherent modulation chip 925.

[0213] The fourth pad portion 92274 is arranged corresponding to the driver chip 926. The fourth pad portion 92274 is located at the front end of the driver chip 926. The driver chip 926 is also located between the coherent modulation chip 925 and the third pad portion 92273. Then the first pad of the driver chip 926 is respectively connected to the fourth pad portion 92274, the third pad portion 92273 and the second pad of the sixth pad portion, so that the driver chip 926 is electrically connected to the electrical adapter fixture 922; the first pad of the driver chip 926 is also connected to the first pad of the coherent modulation chip 925, so that the driver chip 926 is electrically connected to the coherent modulation chip 925.

[0214] In some embodiments, an optical module includes a circuit board and a coherent optical component, which is disposed on the circuit board and is used to modulate and demodulate optical signals. The coherent optical component includes a cover and a substrate, which is fixed to the circuit board and electrically connected to the circuit board. The cover is disposed on the substrate to form a storage cavity, in which an optical chip, an optical matching chip, and an electrical adapter fixture are disposed. The first surface of the optical chip and the optical matching chip are provided with a first solder pad, while the second surface of the optical chip and the optical matching chip do not have a solder pad. The second surface of the optical chip and the optical matching chip is mounted on the inner top wall of the cover. The heat generated by the optical chip and the optical matching chip is directly transferred to the cover without passing through the air to the cover, thereby improving heat dissipation efficiency. The heat generated by the optical chip and the optical matching chip is directly transferred to the cover and no longer enters the circuit board, thereby preventing thermal interference with electrical components on the circuit board. To ensure the normal operation of the optical chip and the optical matching chip, the electrical adapter fixture is fixed to the substrate, electrically connected to the substrate, and wire-bonded to the first solder pads of the optical chip and the optical matching chip. The electrical signals on the circuit board are transmitted to the optical chip and the optical matching chip in sequence through the substrate and the electrical adapter fixture. The electrical signals of the optical chip and the optical matching chip are transmitted to the circuit board in sequence through the electrical adapter fixture and the substrate, so that the optical chip and the optical matching chip can work normally. Since the gold wires between the electrical adapter fixture and the first solder pads of the optical chip and the optical matching chip are easily damaged, in order to protect the gold wires, there is a gap between the first surface of the optical chip and the optical matching chip and the substrate. There is a gap between the first surface of the optical chip and the optical matching chip and the substrate to prevent the gold wires from colliding with the components in the storage cavity, thereby protecting the gold wires. In order to shorten the gold wires, the electrical adapter fixture has multiple hollow areas and second solder pads. The second solder pads are arranged on the side of the electrical adapter fixture that is away from the cover shell. The second solder pads are located around the hollow areas. The optical chip and the optical matching chip are both placed in the corresponding hollow areas. The first solder pads of the optical chip and the optical matching chip are both wire-bonded to the second solder pads. The second pads are located around the hollowed-out area, and the optical chip and optical matching chip are placed within the corresponding hollowed-out area, so that the first pads of the optical chip and the optical matching chip are flush with the second pads, thereby shortening the gold wire between the first and second pads. There is a gap between the second pads and the substrate, and the first and second pads are wire-bonded to ensure a gap between the first surface of the optical chip and the optical matching chip and the substrate.In some embodiments, a first solder pad is provided on the first side of the optical chip and the optical matching chip, and the second sides of the optical chip and the optical matching chip are both mounted on the inner top wall of the cover shell to improve heat dissipation efficiency; the electrical adapter fixture is electrically connected to the substrate, the substrate is electrically connected to the circuit board, and the electrical adapter fixture is wired to the first solder pad of the optical chip and the optical matching chip to ensure the normal operation of the optical chip and the optical matching chip; the electrical adapter fixture has multiple hollowed-out areas, and the optical chip and the optical matching chip are both placed in the corresponding hollowed-out areas, and a second solder pad is provided in the area around the hollowed-out area in the electrical adapter fixture, so that the first solder pads of the optical chip and the optical matching chip are flush with the second solder pad, thereby shortening the gold wire between the first solder pad and the second solder pad.

[0215] In some embodiments, a DSP chip, a voltage source, an MCU, and a coherent optical component are provided on the circuit board 300. The DSP chip and the MCU are both connected to the coherent optical component. The voltage source is connected to the MCU and the DSP chip respectively, and the voltage source provides a fixed voltage to the DSP chip.

[0216] The DSP chip requires different minimum voltages for different processes. The voltage source provides the DSP chip with a fixed voltage, resulting in high power consumption in the optical module. To address this issue, the MCU reads the DSP chip's power supply parameters in real time and adjusts the output voltage of the adjustable voltage source based on these parameters to provide the minimum voltage required by the DSP chip. This minimizes power consumption while ensuring that the optical module's performance is not affected. Power supply parameters include the voltage regulation status flag and the voltage regulation feedback flag.

[0217] Figure 24 is a structural diagram of an optical module excluding the housing, according to some embodiments. Figure 25 is a diagram illustrating the relationship between an MCU, an adjustable voltage source, a DSP, and a coherent optical component, according to some embodiments. As shown in Figures 24 and 25, a DSP chip 304, an adjustable voltage source 305, an MCU, and a coherent optical component 902 are provided on a circuit board 300. The DSP chip 304 and the MCU are both connected to the coherent optical component 902. The adjustable voltage source 305 is connected to the MCU and the DSP chip 304, respectively. The adjustable voltage source 305 is used to provide an adjustable voltage to the DSP chip. The coherent optical component is used to implement modulation and demodulation of optical signals. That is, the DSP chip includes an electrical input pin, an electrical input / output pin, and an electrical output pin. The electrical input pin of the DSP chip is connected to the voltage output pin of the adjustable voltage source, the electrical input / output pin of the DSP chip is connected to the first electrical input / output pin of the MCU, the electrical output pin of the DSP chip is connected to the coherent optical component 902, the electrical output pin of the MCU is connected to the control pin of the adjustable voltage source 305, and the second electrical input / output pin of the MCU is connected to the coherent optical component 902.

[0218] Figure 26 is a block diagram of a DSP provided according to some embodiments. As shown in Figure 26, the DSP chip includes a first register and a second register. The first register is used to store a voltage regulation status flag, and the second register is used to store a voltage regulation feedback flag. The voltage regulation status flag indicates whether the voltage regulation feedback flag is valid. If the voltage regulation status flag is a first value, the digital signal processing chip has completed the calculation, and the voltage regulation feedback flag is valid. If the voltage regulation status flag is a second value, the digital signal processing chip has not completed the calculation, and the voltage regulation feedback flag is invalid. The adaptive voltage regulation control feedback flag indicates the voltage compensation direction of the digital signal processing chip. If the voltage regulation feedback flag is a first value, it indicates that compensation is required towards low voltage; if the voltage regulation feedback flag is a second value, it indicates that no voltage compensation is required; if the voltage regulation feedback flag is a third value, it indicates that compensation is required towards high voltage. The MCU reads the voltage regulation feedback flag based on the read voltage regulation status flag and adjusts the MCU's output voltage based on the read voltage regulation feedback flag to adjust the output voltage of the adjustable voltage source.

[0219] Figure 27 is a block diagram of an MCU according to some embodiments. As shown in Figure 27, in some embodiments, the MCU includes a third register, a fourth register, and a fifth register. The third register is used to store the step voltage, the fourth register is used to store the initial voltage, the fifth register is used to store the real-time voltage, and the sixth register is used to store the adaptive voltage regulation control loop switch flag.

[0220] The initial voltage is the maximum operating voltage required by the DSP chip to ensure normal startup. After the optical module is powered on, the MCU transmits the initial voltage to the adjustable voltage source, which then outputs the maximum operating voltage required by the DSP chip corresponding to the initial voltage to ensure normal startup. For example, the initial voltage is 0.65V.

[0221] The real-time voltage includes the initial voltage. After the optical module is powered on, the MCU copies the initial voltage in the fourth register to the fifth register. At this time, the real-time voltage in the fifth register is the initial voltage.

[0222] The MCU determines the voltage compensation direction based on the voltage regulation feedback flag it reads, and calculates the first output voltage based on the voltage compensation direction, the step voltage, and the real-time voltage. For example, when the MCU reads a first value for the voltage regulation feedback flag, the first output voltage = real-time voltage - step voltage; when the MCU reads a second value for the voltage regulation feedback flag, the first output voltage = real-time voltage; and when the MCU reads a third value for the voltage regulation feedback flag, the first output voltage = real-time voltage + step voltage.

[0223] As shown in Figure 27, the MCU also includes a sixth register for storing an adaptive voltage regulation control loop switch flag. When the adaptive voltage regulation control loop switch flag is a first value, it indicates that the adaptive voltage regulation control loop is enabled; when the adaptive voltage regulation control loop switch flag is a second value, it indicates that the adaptive voltage regulation control loop is disabled.

[0224] After reading that the adaptive voltage regulation control loop switch flag is a first value, the MCU reads the voltage regulation state flag. When the voltage regulation state flag is read as the first value, the MCU reads the voltage regulation feedback flag and adjusts the output voltage of the MCU according to the voltage regulation feedback flag.

[0225] As shown in Figure 27, the MCU also includes a seventh register, which is used to store the power compensation ratio. After reading that the adaptive voltage regulation control loop switch flag is the first value, the MCU transmits the power compensation ratio to the DSP chip. The DSP chip adjusts the voltage regulation feedback flag according to the power compensation ratio.

[0226] The specific process for calculating the power compensation ratio is as follows: the MCU controls the first output voltage to be output at equal intervals, collects multiple DSP parameters, calculates the average value of each DSP parameter at a voltage value, and then calculates the average value of each DSP parameter at multiple voltage values ​​to obtain the power compensation ratio. For example, if the power compensation ratio is 4.3%, taking into account the margin, the power compensation margin set in the MCU's seventh register is 4.5%.

[0227] Because the optical module is a small package, the DSP chip requires up to 30A of current, making a large adjustable voltage source unsuitable for powering the DSP chip impossible. To ensure 30A is delivered to the DSP chip within the limited space of the optical module, in some embodiments, the adjustable voltage source is a multi-phase power supply chip that can meet the voltage and current requirements of the DSP.

[0228] Figure 28 is a block diagram of an adjustable voltage source according to some embodiments. As shown in Figure 28, the adjustable voltage source includes a first power chip, a second power chip, and a third power chip. The first, second, and third power chips are connected in parallel. The sum of the phase currents of the first, second, and third power chips is equal to the output current of the adjustable voltage source, which can meet the voltage and current requirements of the DSP.

[0229] The input pin (IN) of the first power chip is connected to the input voltage, and the input pins of the second power chip and the third power chip are both connected to the input pin of the first power chip to receive the power voltage. For example, the power voltage is 3.3V.

[0230] The output pin (SW) of the first power chip is connected to the DSP chip through the ninth resistor R9. The output pins of the second power chip and the third power chip are both connected to the input pin of the first power chip to provide output voltage to the DSP chip.

[0231] The multi-phase mode / synchronization control pin (Mode / Sync) of the first power chip is connected to the multi-phase mode / synchronization control pin of the second power chip and the multi-phase mode / synchronization control pin of the third power chip respectively.

[0232] The feedback pin (FB) of the first power supply chip is connected to the MCU through the seventh resistor R7, and the feedback pin of the first power supply chip is also grounded through the sixth resistor R6. The feedback pin of the first power supply chip is connected to the DSP chip through the eighth resistor R8, and the timing resistor pin (RT) of the first power supply chip is grounded through the fifth resistor R5.

[0233] The feedback pin of the second power supply chip is connected to the input voltage, the timing resistor pin of the second power supply chip is connected to the feedback pin of the second power supply chip through the third resistor R3, the timing resistor pin of the second power supply chip is also grounded through the fourth resistor R4, and the voltage ratio received by FB and RT of the second power supply chip is R3:R4.

[0234] The feedback pin of the third power supply chip is connected to the input voltage, the timing resistor pin of the third power supply chip is connected to the feedback pin of the third power supply chip through the first resistor R1, the timing resistor pin of the third power supply chip is also grounded through the second resistor R2, and the voltage ratio received by FB and RT of the third power supply chip is R1:R2.

[0235] The first power chip is a main phase power chip, and the phase of the first power chip is 0°. The second power chip and the third power chip are slave phase power chips, and the phase of the second power chip is 120°, and the phase of the third power chip is 240°, so that the adjustable voltage source is a three-phase power chip, and the three phase currents of the three-phase power chip are equal to the output current of the three-phase power chip.

[0236] The multi-phase mode / synchronization control pin (Mode / Sync) sets the clock of the master phase power chip as the output in the multi-phase power chip. At the same time, after the FB of the slave phase power chip is directly connected to the input voltage, the clock of the slave phase power chip is configured as an input, receiving the clock output of the master phase power chip.

[0237] The timing resistor pin (RT) of the master phase power chip is used to set the master phase power chip's switching frequency. After the slave phase power chip's FB is directly connected to the input voltage, the master phase power chip's Mode / Sync outputs the switching frequency to the slave phase power chip's Mode / Sync, ensuring that the master and slave phase power chips have the same switching frequency.

[0238] In some embodiments, the ratio of the third resistor R3 to the fourth resistor R4 is a first preset value, so that the phase of the second power chip is 120°. For example, the first preset value is 7:5, that is, the ratio of the third resistor R3 to the fourth resistor R4 is 7:5.

[0239] In some embodiments, the ratio of the first resistor R1 to the second resistor R2 is a second preset value, so that the phase of the third power chip is 240°. For example, the second preset value is 5:7, that is, the ratio of the first resistor R1 to the second resistor R2 is 5:7.

[0240] The output voltage of the MCU is a first output voltage, and the output voltage of the adjustable voltage source is a second output voltage. The first output voltage and the second output voltage are in a preset relationship. The output voltage of the adjustable voltage source can be adjusted by simply adjusting the output voltage of the MCU.

[0241] The default relationship is: V out =0.6424-0.1424*V mcu , where V out is the second output voltage, V mcu is the first output voltage.

[0242] According to the current flowing into FB is equal to the current flowing out of FB, that is (V out- V FB ) / R8+(V out- V mcu ) / R 7＝ V FB / R 6。 R8=4.7k,R 6＝ R7=33k,V FB =5, V out =0.6424-0.1424*V mcu。

[0243] In some embodiments, an optical module includes a digital signal processing chip, an adjustable voltage source, and an MCU. The digital signal processing chip includes an electrical input pin and an electrical input / output pin. The electrical input / output pin of the MCU is connected to the electrical input / output pin of the digital signal processing chip. The electrical output pin of the MCU is connected to the control pin of the adjustable voltage source. The voltage output pin of the adjustable voltage source is connected to the electrical input pin of the digital signal processing chip. The MCU adjusts the output voltage of the voltage output pin of the adjustable voltage source to power the digital signal processing chip. The digital signal processing chip includes a register for storing a voltage regulation feedback flag. The adaptive voltage regulation control state feedback flag indicates the voltage compensation direction of the digital signal processing chip. The voltage regulation feedback flag has a first value indicating that compensation is required toward a lower voltage; a second value indicating that voltage compensation is not required; and a third value indicating that compensation is required toward a higher voltage. The MCU reads the voltage regulation feedback flag and adjusts the output voltage of the voltage output pin of the adjustable voltage source based on the voltage regulation feedback flag to provide the minimum voltage required by the digital signal processing chip. In some embodiments, the MCU reads the voltage regulation feedback flag of the digital signal processing chip in real time, and adjusts the output voltage of the voltage output pin of the adjustable voltage source in real time according to the voltage regulation feedback flag to provide the minimum voltage required by the digital signal processing chip. This can minimize the power consumption of the optical module while ensuring that the performance of the optical module is not affected.

[0244] Figure 30 is a schematic diagram of a coherent optical component provided according to some embodiments. Figure 31 is an assembly diagram of a coherent optical component and an MCU provided according to some embodiments. As shown in Figures 30 and 31, in some embodiments, the coherent optical component includes a storage cavity, in which a coherent modulation chip, a transimpedance amplifier chip and a driver chip are arranged. The coherent modulation chip includes a spectrometer, a modulation area, a demodulation area and a photodetector (MPD). The driver chip is connected to the modulation area, the transimpedance amplifier chip is connected to the demodulation area, and the spectrometer is respectively connected to the modulation area, the demodulation area and the photodetector. The spectrometer is used to divide the light emitted by the light source into emitted light and local oscillation light according to the working current. The modulation area modulates the emitted light into an emitted light signal under the modulation current of the driver chip. The demodulation area uses the local oscillation light to demodulate the received light signal to obtain an electrical signal, and the transimpedance amplifier chip (TIA) amplifies the electrical signal. The light source emits light, which is then divided into transmitted light and local oscillator light by the spectrometer. The transmitted light is modulated into a transmitted light signal in the modulation area and then emitted. The local oscillator light and the received light signal are demodulated in the demodulation area to obtain an electrical signal.

[0245] The optical splitter includes an optical input interface, an optical output interface, and an electrical input interface. The optical input interface receives light from the light source. One optical output interface is connected to the modulation area to transmit the emitted light to the modulation area for modulation. The other optical output interface is connected to the demodulation area and the photodetector respectively to transmit most of the local oscillation light to the demodulation area for demodulation, and also transmit a small part of the local oscillation light to the photodetector to monitor the local oscillation light flowing through the demodulation area.

[0246] As shown in Figures 30 and 31, in some embodiments, an MCU is provided on the circuit board 300, and the MCU is respectively connected to the electrical input interface of the spectrometer and the photodetector. The MCU controls the operating current of the electrical input interface of the spectrometer according to the sampling voltage, wherein the sampling voltage corresponds to the sampling current of the photodetector.

[0247] In some embodiments, the beam splitter includes a first interferometer arm and a second interferometer arm, each of which is provided with a heater, and the MCU is connected to each of the two heaters. The MCU adjusts the operating current of the two heaters to change the refractive index of the first interferometer arm and the second interferometer arm, thereby changing the phase difference between the light passing through the first interferometer arm and the second interferometer arm, thereby adjusting the splitting ratio of the beam splitter.

[0248] In some embodiments, the spectrometer includes a first interferometer arm and a second interferometer arm, wherein a heater is provided on the first interferometer arm or the second interferometer arm, the heater being connected to an electrical input interface of the spectrometer, and the MCU being connected to the heater. The MCU adjusts the operating current of one heater to change the refractive index of the interferometer arm provided with the heater, thereby changing the phase difference between light passing through the first interferometer arm and the second interferometer arm, thereby adjusting the splitting ratio of the spectrometer.

[0249] In some embodiments, one end of the photodetector is connected to the optical output interface of the optical splitter, and the other end of the photodetector is connected to the MCU to monitor the local oscillator light flowing through the demodulation region.

[0250] A sampling resistor is provided between the other end of the photodetector and the MCU. One end of the sampling resistor is connected to the other end of the photodetector, and the other end of the sampling resistor is connected to the MCU, so that the MCU collects the sampled voltage across the sampling resistor.

[0251] In some embodiments, the MCU includes an eighth register, and the eighth register stores a plurality of splitting ratio functions.

[0252] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to wavelengths, with one splitting ratio function corresponding to each wavelength. The MCU calls the splitting ratio function according to the wavelength and controls the operating current of the electrical input interface of the splitter according to the sampling voltage and the splitting ratio function. For example, at wavelength λ1, the splitting ratio function is Y λ1; When the wavelength is λ2, the splitting ratio function is Y λ2 ; When the wavelength is λ3, the splitting ratio function is Y λ3 .

[0253] In some embodiments, the optical module further includes a temperature measuring component, which is used to measure the temperature of the optical module.

[0254] In some embodiments, a temperature measuring element is located within the coherent optical assembly, that is, within a storage cavity of the coherent optical assembly. The temperature measuring element is connected to the MCU and positioned around the coherent modulation chip to measure the temperature around the coherent modulation chip, thereby measuring the temperature of the optical module. For example, the temperature measuring element includes a thermistor. The thermistor is temperature-sensitive and exhibits different resistance values ​​at different temperatures. The MCU determines the temperature around the coherent modulation chip based on the resistance value of the thermistor.

[0255] In some embodiments, a temperature measuring element is integrated into the MCU, and is used to measure the temperature around the MCU and thereby measure the temperature of the optical module. For example, the temperature measuring element is a temperature sensor integrated into the MCU, and the MCU obtains the temperature around the MCU based on the temperature sensor.

[0256] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to temperatures, with one splitting ratio function corresponding to each temperature. The MCU calls the splitting ratio function according to the temperature and controls the operating current of the electrical input interface of the splitter according to the sampled voltage and the splitting ratio function corresponding to the temperature. For example, at temperature T1, the splitting ratio function is Y T1 ; At temperature T2, the splitting ratio function is Y T2 ; At temperature T3, the splitting ratio function is Y T3 .

[0257] In some embodiments, the multiple splitting ratio functions include multiple splitting ratio functions corresponding to both temperature and wavelength, with each temperature and wavelength corresponding to a splitting ratio function. The MCU retrieves the splitting ratio function corresponding to the temperature and wavelength based on the temperature and wavelength, and controls the operating current of the electrical input interface of the splitter based on the sampled voltage and the splitting ratio function. For example, at temperature T1 and wavelength λ1, the splitting ratio function is Y1; at temperature T1 and wavelength λ2, the splitting ratio function is Y2; and at temperature T2 and wavelength λ1, the splitting ratio function is Y3.

[0258] When the temperature of the coherent modulation chip is not controlled to be relatively stable, the coherent modulation chip can be mounted on the inner top wall of the cover shell as shown in Figure 13. When the temperature of the coherent modulation chip is controlled to be relatively stable, the coherent modulation chip can be placed on a semiconductor cooler (TEC), a conductor cooler is placed in the storage cavity, and a temperature measuring element is placed on the semiconductor cooler. The temperature measuring element is used to measure the temperature of the coherent optical component. The semiconductor cooler is connected to the power chip, which supplies power to the semiconductor cooler. The power chip is also connected to the MCU. The MCU adjusts the electrical signal sent to the power chip according to the resistance value of the temperature measuring element. The power chip dynamically adjusts the current transmitted to the semiconductor cooler according to the received electrical signal to keep the temperature of the semiconductor cooler constant, and thus the temperature of the coherent modulation chip constant.

[0259] The temperature is relatively stable within the preset time. The MCU calls the splitting ratio function according to the temperature and controls the working current of the electrical input interface of the splitter according to the sampling voltage and the splitting ratio function. For example, at temperature T1, the splitting ratio function is Y T1 ; At temperature T2, the splitting ratio function is Y T2 ; At temperature T3, the splitting ratio function is Y T3 .

[0260] Alternatively, if the temperature remains relatively stable within a preset time, the MCU retrieves the splitting ratio function based on the temperature and wavelength, and controls the operating current of the splitter's electrical input interface based on the sampled voltage and the splitting ratio function. For example, at temperature T1 and wavelength λ1, the splitting ratio function is Y1; at temperature T1 and wavelength λ2, the splitting ratio function is Y2; and at temperature T2 and wavelength λ1, the splitting ratio function is Y3. Relatively stable temperatures mean that the difference between two adjacent temperatures is within the error range.

[0261] In some embodiments, a current source is provided between the MCU and the electrical input interface of the spectrometer, the input interface of the current source is connected to the MCU, and the output interface of the current source is connected to the electrical input interface of the wind-solar device. The MCU obtains a control signal based on the sampling voltage and the splitting ratio function, and the current source adjusts the operating current output to the electrical input interface of the spectrometer according to the control signal.

[0262] FIG31 is another assembly diagram of a coherent optical component and an MCU according to some embodiments. As shown in FIG31 , in some embodiments, a digital-to-analog converter (DAC) is provided between the MCU and the electrical input interface of the spectrometer. The DAC is located on a circuit board 300. One end of the DAC is connected to the MCU, and the other end of the DAC is connected to the electrical input interface of the spectrometer. The MCU obtains a digital current signal based on the sampling voltage and the splitting ratio function, and the DAC converts the digital current signal into an analog current signal. For example, the DAC is a current-type DAC, which converts the digital current signal into an analog current signal to provide an analog current signal to the heater of the spectrometer. The analog current signal of the heater is the analog current signal of the spectrometer, and the analog current signal is the working current.

[0263] In some implementations, the splitting ratio function is used to characterize the correspondence between the control signal and the sampled voltage. For example, the abscissa of the splitting ratio curve corresponding to the splitting ratio function is the control signal, and the ordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampled voltage.

[0264] In some embodiments, the splitting ratio function is used to characterize the corresponding relationship between the operating current and the sampling voltage. For example, the abscissa of the splitting ratio curve corresponding to the splitting ratio function is the operating current, and the ordinate of the splitting ratio curve corresponding to the splitting ratio function is the sampling voltage.

[0265] Figure 32 shows a splitting ratio curve according to some embodiments. As shown in Figure 32 , the horizontal axis represents the operating current of the splitter, and the vertical axis represents the sampling current of the photodetector. The splitting ratio curve shows the relationship between the operating current of the splitter and the sampling current of the photodetector. The splitting ratio function is a function obtained by fitting multiple points of the splitting ratio curve.

[0266] As shown in Figure 32, in some embodiments, a splitting ratio function is used to characterize the relationship between operating current and sampling current. For example, the horizontal axis of the splitting ratio curve corresponding to the splitting ratio function represents the operating current, and the vertical axis represents the sampling current. The MCU controls the splitter's operating current to increase at equal intervals starting from zero, while simultaneously collecting the sampling current of the photodetector to obtain the splitting ratio curve, and thus the splitting ratio function.

[0267] In some embodiments, a coherent optical component includes a coherent modulation chip. The coherent modulation chip includes a spectrometer, a modulation section, and a demodulation section. The spectrometer includes an optical input interface, two optical output interfaces, and an electrical input interface. The optical input interface receives light from a light source. One optical output interface is connected to the modulation section, and the other optical output interface is connected to the demodulation section and a photodetector. The spectrometer is configured to separate the light from the light source into transmitted light and local oscillator light based on an operating current. The modulation section is configured to modulate the transmitted light into a transmitted light signal, and the demodulation section uses the local oscillator light to demodulate the received light signal. An MCU is connected to the photodetector and the electrical input interface of the spectrometer, respectively, and the MCU adjusts the operating current of the spectrometer based on a sampling voltage. The MCU includes a register that stores multiple light ratio functions that correspond to temperature. The MCU controls the operating current of the spectrometer's electrical input interface based on the temperature splitting ratio function, the splitting ratio function, and the sampling voltage. In the present disclosure, the MCU retrieves the splitting ratio function based on temperature and controls the operating current of the spectrometer's electrical input interface based on the splitting ratio function and the sampling voltage, thereby enabling the spectrometer to achieve light splitting.

[0268] FIG33 is a partial structural diagram of an optical module provided according to some embodiments of the present disclosure, and FIG34 is a schematic diagram of the working principle of an optical module provided according to some embodiments of the present disclosure. As shown in FIG33 and FIG34, the coherent optical chip 1100 (902, 500) is a coherent silicon photonic integrated chip. Since the silicon material in the silicon photonic chip is not an ideal laser chip light-emitting material, the light-emitting unit cannot be integrated during the silicon photonic chip manufacturing process. Therefore, the silicon photonic chip needs to be provided with light by an external light source. For example, a laser component 410 (in some examples, it can also be called a local oscillator light source 401) is used as an external light source to provide light for the silicon photonic chip.

[0269] The coherent optical chip 1100 includes three external optical fiber interfaces, namely the first coupling port (local oscillator optical interface), the second coupling port (optical receiving interface) and the third coupling port (optical transmitting interface). The optical transmitting interface and the optical receiving interface are respectively connected to the two external optical fiber interfaces of the coherent optical module, and the local oscillator optical interface is connected to the laser component 410 via a polarization-maintaining optical fiber.

[0270] The circuit board 300 is provided with a digital signal processing chip 304 (also referred to as a DSP chip in some examples), a driver chip 306, and an amplifier chip 307. The digital signal processing chip 304 is connected to the coherent optical chip 1100 through the driver chip 306 and the amplifier chip 307. That is, the digital signal processing chip 304 applies a high-speed modulated electrical signal to the modulator in the coherent optical chip 1100 through the driver chip 306, so that the coherent optical chip 1100 generates a coherent transmitted optical signal; the digital signal processing chip 304 receives the received electrical signal fed back by the coherent optical chip 1100 through the amplifier chip 307, and the digital signal processing chip 304 demodulates the electrical signal to achieve reception of the coherent optical signal.

[0271] The working principle of the coherent optical module is as follows: the narrow linewidth and high power laser emitted by the laser component 410 is coupled to the coherent optical chip 1100 through the local oscillator optical interface, and the laser is subjected to beam splitting processing inside the coherent optical chip 1100, wherein one beam of light enters the coherent modulator inside the coherent optical chip 1100 as the emission light, and the electro-optical signal conversion is realized under the high-speed electrical signal drive of the digital signal processing chip. The converted high-speed optical signal is output from the optical emission interface, and the optical signal is transmitted to the emission optical fiber adapter 700 (801) through the emission optical fiber, and is emitted through the emission optical fiber adapter 700 to realize the emission of coherent light.

[0272] The external optical signal transmitted by the receiving optical fiber adapter 800 is emitted into the coherent optical chip 1100 via the receiving optical fiber and the optical receiving interface. Another beam of light is used as the local oscillator light to perform coherent demodulation with the external optical signal. The demodulated electrical signal enters the digital signal processing chip 302 for signal processing to complete the conversion of the optical and electrical signals, thereby realizing the reception of coherent light.

[0273] In some embodiments, the laser component 410 used in the coherent optical module is a narrow-linewidth, wavelength-tunable laser component. A wavelength locking device is integrated inside the laser component. The wavelength locking device is used to monitor the wavelength of light emitted by the laser and perform real-time wavelength locking. However, the packaging process of this laser component is complex and expensive, which is not conducive to short-distance coherent applications.

[0274] To address the above-mentioned issues, an embodiment of the present disclosure provides an optical module that integrates a wavelength locking device within a coherent optical chip 1100. The wavelength locking device can monitor the wavelength of light emitted by an external laser component 410 in real time and generate a feedback signal to the external laser component to adjust and lock the preset wavelength, thereby simplifying the packaging complexity and cost of the external laser component 4101 and meeting the use requirements of short-distance coherent optical modules.

[0275] Figure 35 is a cross-sectional view of a light source in an optical module according to some embodiments of the present disclosure. As shown in Figure 35, laser assembly 410 includes a housing 411 and a cover plate. The cover plate fits within housing 411, forming a cavity. Housing 411 includes a base plate and a first side plate, a second side plate, and a third side plate connected to the base plate. The first side plate is opposite the second side plate, and the third side plate is the right side plate of housing 411. Housing 411 has an opening on its left side and an opening on its top surface.

[0276] A boss 419 is provided on the left side of the shell 411, and the boss 419 is installed on the bottom plate of the shell 411. The boss 419 is arranged opposite to the third side plate. A adapter circuit board 4110 is provided on the surface of the boss 419. One end of the adapter circuit board 4110 is located in the accommodating cavity of the shell 411, and the other end of the adapter circuit board 4110 is located outside the accommodating cavity. The end of the adapter circuit board 4110 located outside the accommodating cavity is electrically connected to the circuit board 300 through a wire bonding or a flexible circuit board, so that the driving electrical signal emitted by the circuit board 300 is transmitted to the laser 412 through the adapter circuit board, and the laser 412 emits light under the action of the driving electrical signal.

[0277] A through hole 4111 is formed on the third side panel, and an optical fiber connector 4120 is provided in the through hole 4111. The optical fiber connector 4120 is coupled to the light source optical fiber, and the light source optical fiber is a polarization-maintaining fiber to achieve the coupling connection between the laser assembly 410 and the light source optical fiber.

[0278] In some embodiments, a TEC 417 and a carrier board 418 are disposed in the accommodating cavity of the shell 411, and a laser 412 and a collimating lens 413 are disposed on the surface of the TEC 417. The laser 412 receives a driving electrical signal transmitted by the circuit board 300 through the adapter circuit board 4110, so that the laser 412 generates a laser that does not carry data; the collimating lens 413 is located in the light emitting direction of the laser 412, and the collimating lens 413 converts the laser generated by the laser 412 into parallel light.

[0279] In coherent communication, the wavelength difference (or frequency difference) between the received optical signal and the local oscillator optical signal must be less than a certain value to generate interference and ensure that the digital signal processing chip can process the response signal. Therefore, the wavelength of laser 412 needs to be maintained in a very stable state. Therefore, TEC417 is used as a key temperature control element to control the wavelength of laser 412, and a high-precision temperature sensor is used to detect the temperature of laser 412.

[0280] In some embodiments, a converging lens 415 is provided on the surface of the carrier 418 , and the parallel light emitted by the collimating lens 413 is converged to the light source fiber in the optical fiber connector 4120 via the converging lens 415 to couple the laser light generated by the laser 412 to the light source fiber.

[0281] Due to the difference in transmission media, the convergent light emitted by the converging lens 415 is easily reflected at the fiber end face of the light source optical fiber. In order to prevent the reflected light from returning to the laser 412 along the original path, an optical isolator 414 is also provided on the surface of the carrier 418. The optical isolator 414 is located between the collimating lens 413 and the converging lens 415. The parallel light emitted by the collimating lens 413 directly passes through the optical isolator 414 and enters the converging lens 415. The parallel light is converged to the light source optical fiber through the converging lens 415. The reflected light at the fiber end face is isolated by the optical isolator 414 and cannot pass through the optical isolator 414 to return to the laser 412, thereby ensuring the luminous performance of the laser 412.

[0282] In some embodiments, the carrier plate 418 is used to raise the height of the optical isolator 414 and the converging lens 415 so that the optical axes of the optical isolator 414 and the converging lens 415, the optical axis of the laser 412, and the optical axis of the collimating lens 413 are on the same straight line, so as to facilitate coupling the laser generated by the laser 412 to the light source optical fiber.

[0283] In some embodiments, when performing optical coupling of the laser assembly 410, it is necessary to consider the subsequent installation direction of the laser assembly 410 on the circuit board 300 and modulate the placement of the light source optical fiber to avoid twisting of the light source optical fiber when the laser assembly 410 is installed on the module circuit board 300.

[0284] Figure 36 is a block diagram of a coherent optical chip in an optical module according to some embodiments of the present disclosure. As shown in Figures 34 and 36, the optical module provided by the embodiments of the present disclosure includes a circuit board 300, a laser assembly 410, and a coherent optical chip 1100. The laser assembly 410 and the coherent optical chip 1100 are mounted on the circuit board 300. The circuit board 300 is also provided with a controller 303. The laser assembly 410 is connected to the coherent optical chip via a polarization-maintaining fiber to input local oscillator light to the coherent optical chip; the coherent optical chip is electrically connected to the controller (also referred to as an MCU in some examples) to feedback electrical signals to the controller; the controller is control-connected to the laser assembly 410 to send control signals to the laser assembly 410 based on the feedback electrical signals received by the controller, thereby controlling the wavelength of the laser light generated by the laser assembly 410.

[0285] To receive the local oscillator light generated by the laser assembly 410, the coherent optical chip 1100 includes a first coupling port 1101, a second coupling port 1102, and a third coupling port 1103. The first coupling port 1101 is a local oscillator light interface, the second coupling port 1102 is a receiving coupling port, and the third coupling port 1103 is a transmitting coupling port. The first coupling port 1101, the second coupling port 1102, and the third coupling port 1103 are packaged with a three-channel optical fiber array to achieve interconnection between the coherent optical chip 1100 and external optical signals.

[0286] The first coupling port 1101 is connected to the laser assembly 410 via a polarization-maintaining optical fiber, and light of a preset wavelength emitted by the external laser assembly 410 enters the coherent optical chip 1100 through the first coupling port 1101. The second coupling port 1102 is connected to the receiving optical fiber adapter 800 via a receiving optical fiber, so that the external optical signal transmitted by the receiving optical fiber adapter 800 is transmitted to the coherent optical chip 1100 via the second coupling port 1102. The third coupling port 1103 is connected to the transmitting optical fiber adapter 700 via a transmitting optical fiber, so that the transmitting optical signal generated by the coherent optical chip 302 is transmitted to the transmitting optical fiber adapter 700 via the third coupling port 1103 and then emitted by the transmitting optical fiber adapter 700.

[0287] The coherent optical chip 1100 is integrated with a splitter group. The input end of the splitter group is connected to the first coupling port 1101. After the local oscillator light emitted by the laser assembly 410 enters the coherent optical chip 1100, it is split into three parts by the splitter group. One part of the light enters the dual-coherent modulator as the transmission light. After being loaded by the electro-optical signal (where the electrical signal is emitted by the digital signal processing chip 302 and loaded onto the coherent optical chip 1100 through the driver chip 304), it is modulated into orthogonal signal light. The orthogonal signal light is polarized by the transmission polarization rotation combiner, and then the processed orthogonal signal light is output from the third coupling port to achieve coherent light emission.

[0288] The other part of the light, as the local oscillator light, is split again and enters the dual-polarization balanced detector respectively, and is mixed with the light input from the second coupling port 1102 and processed by the receiving polarization rotation beam splitter 1111, thereby realizing the demodulation processing of the optical signal. The demodulated electrical signal is input into the amplifier chip through the high-speed detector, and the electrical signal is input into the digital signal processing chip for electrical signal processing after amplification to realize the reception of coherent light.

[0289] The coherent optical chip 1100 includes an integrated wavelength locker 1106. The wavelength locker 1106 is connected to an output end of the optical splitter group. That is, the third portion of light enters the wavelength locker 1106. The wavelength locker 1106 can detect the wavelength of the incoming light and transmit the detected electrical signal to the controller. The controller calculates the wavelength difference between the detected wavelength and a preset wavelength based on the detected electrical signal. The controller then feeds a control signal back to the laser assembly 410 based on the wavelength difference to adjust the wavelength of the laser light generated by the laser assembly 410, thereby stabilizing the wavelength of the laser light generated by the laser assembly 410 at the preset wavelength to achieve wavelength locking.

[0290] In some embodiments, the optical splitter group includes a directional coupler 1104, a second optical splitter 1105, and a third optical splitter 1107. The input end of the directional coupler 1104 can be connected to the first coupling port 1101. The directional coupler 1104 splits the local oscillation light incident from the first coupling port 1101 into a first local oscillation light split and a second local oscillation light split. The first local oscillation light split and the second local oscillation light split have the same wavelength and frequency.

[0291] The input end of the second optical splitter 1105 is connected to the first output end of the directional coupler 1104, so that the first local oscillator light is input to the second optical splitter 1105. The wavelength locker 1106 is connected to the second output end of the directional coupler 1104 to input the second local oscillator light into the wavelength locker 1106. The wavelength locker 1106 detects the second local oscillator light. The controller receives the electrical signal detected by the wavelength locker 1106 and determines the wavelength of the second local oscillator light based on the detected electrical signal. It then calculates the wavelength difference between the wavelength of the second local oscillator light and the preset wavelength. The controller then controls and adjusts the wavelength of the laser light emitted by the laser assembly 410 based on the wavelength difference, thereby stabilizing the wavelength of the laser light emitted by the laser assembly 410 at the preset wavelength.

[0292] The second optical splitter 1105 splits the first local oscillator light into the first local oscillator light and the second local oscillator light. The first local oscillator light enters the fourth optical splitter 1115 as the local oscillator light. The fourth optical splitter 1115 splits the first local oscillator light into two beams of light. The two beams of light enter the first mixer 1112 and the second mixer 1113 respectively. The received light input from the second coupling port 1102 is split into two beams of light by the receiving polarization rotation beam splitter 1111. The two beams of light enter the first mixer 1112 and the second mixer 1113 respectively. The local oscillator light and the received light are mixed by the mixer to realize the demodulation processing of the optical signal. The demodulated electrical signal is then input into the amplifier chip through the first high-speed detector group 1116 and the second high-speed detector group 1114 respectively. After amplification, the electrical signal is input into the digital signal processing chip for electrical signal processing, realizing the reception of coherent light.

[0293] The second local oscillator is split and incident on the third optical splitter 1107. The third optical splitter 1107 splits the second local oscillator into two beams of light. The two beams of light enter the first orthogonal coherent modulator 1108 and the second orthogonal coherent modulator 1109 respectively. After the two beams of light are loaded with electro-optical signals in the first orthogonal coherent modulator 1108 and the second orthogonal coherent modulator 1109, two orthogonal signal lights are obtained. The two orthogonal signal lights are transmitted through the emission polarization rotation beam splitter 1110 to obtain one signal light. The one signal light is emitted from the third coupling port 1103, thereby realizing the emission of coherent light.

[0294] In some embodiments, the wavelength locker 1106 receives one local oscillator beam split by the directional coupler 1104 in the optical splitter group. The wavelength locker 1106 outputs at least two detection lights from the one local oscillator beam split. The controller determines the wavelength of the local oscillator beam split based on the optical power of the at least two detection lights and a curve of the relationship between optical power and wavelength stored in the controller 303. However, the wavelength locker 1106 is not limited to being connected to one output end of the directional coupler 1104; as long as the wavelength locker 1106 can receive one local oscillator beam split, it can be used.

[0295] FIG37 is a second block diagram of a coherent optical chip in an optical module provided according to some embodiments of the present disclosure. As shown in FIG37 , the optical splitter group includes a second optical splitter 1105, a directional coupler 1104, and a third optical splitter 1107. The input end of the second optical splitter 1105 is connected to the first coupling port 1101 to receive the local oscillator light output by the laser component; the second optical splitter 1105 splits the local oscillator light into a first local oscillator light and a second local oscillator light. The first local oscillator light enters the fourth optical splitter 1115 as the local oscillator light. The fourth optical splitter 1115 splits the first local oscillator light into two beams of light. The two beams of light enter the first mixer 1112 and the second mixer 1113, respectively. 113; The received light incident from the second coupling port 1102 is split into two beams of light by the receiving polarization rotation beam splitter 1111, and the two beams of light enter the first mixer 1112 and the second mixer 1113 respectively. The local oscillator light and the received light are mixed by the mixer, thereby realizing the demodulation processing of the optical signal, and then the demodulated electrical signal is input to the amplifier chip through the first high-speed detector group 1116 and the second high-speed detector group 1114 respectively. After amplification, the electrical signal is input to the digital signal processing chip for electrical signal processing, thereby realizing the reception of coherent light.

[0296] The input end of the directional coupler 1104 is connected to the second output end of the second optical splitter 1105. The second local oscillator light enters the directional coupler 1104. The directional coupler 1104 splits the second local oscillator light into the first local oscillator light and the second local oscillator light. The wavelength locker 1106 is connected to the first output end of the directional coupler 1104, so that the first local oscillator light enters the wavelength locker 1106. The wavelength locker 1106 detects the first local oscillator light, so that the wavelength locker 1106, the controller 303 and the laser assembly 900 form a closed-loop control to achieve wavelength locking.

[0297] The input end of the third optical splitter 1107 is connected to the second output end of the directional coupler 1104. The third optical splitter 1107 splits the second local oscillator into two beams of light. The two beams of light enter the first orthogonal coherent modulator 1108 and the second orthogonal coherent modulator 1109 respectively. After the two beams of light are loaded with electro-optical signals in the first orthogonal coherent modulator 1108 and the second orthogonal coherent modulator 1109, two orthogonal signal lights are obtained. The two orthogonal signal lights are transmitted through the emission polarization rotation beam splitter 1110 to obtain one signal light. The one signal light is emitted from the third coupling port 1103, thereby realizing the emission of coherent light.

[0298] FIG38 is a third structural block diagram of a coherent optical chip in an optical module provided according to some embodiments of the present disclosure. As shown in FIG38 , the optical splitter group includes a second optical splitter 1105, a directional coupler 1104, and a third optical splitter 1107. The input end of the second optical splitter 1105 is connected to the first coupling port 1101 to receive the local oscillator light output by the laser assembly 900. The second optical splitter 1105 splits the local oscillator light into a first local oscillator light and a second local oscillator light. The input end of the directional coupler 1104 is connected to the first output end of the second optical splitter 1105, so that the first local oscillator light enters the directional coupler 1104. The directional coupler 1104 splits the first local oscillator light into a first local oscillator light and a second local oscillator light. The first local oscillator light enters the fourth optical splitter 1115 as the local oscillator light. The fourth optical splitter 1115 splits the first local oscillator light into two beams, which enter the first mixer 1112 and the second mixer 1113 respectively. The received light input from the second coupling port 1102 is split into two beams by the receiving polarization rotation beam splitter 1111, and the two beams enter the first mixer 1112 and the second mixer 1113 respectively. The local oscillator light and the received light are mixed by the mixer, thereby realizing the demodulation processing of the optical signal. The demodulated electrical signal is then input into the amplifier chip through the first high-speed detector group 1116 and the second high-speed detector group 1114 respectively. After amplification, the electrical signal is input into the digital signal processing chip for electrical signal processing, thereby realizing the reception of coherent light.

[0299] The wavelength locker 1106 is connected to the second output end of the directional coupler 1104, so that the second local oscillator light is split and enters the wavelength locker 1106. The wavelength locker 1106 detects the second local oscillator light, so that the wavelength locker 1106, the controller and the laser assembly 900 form a closed-loop control to achieve wavelength locking.

[0300] The input end of the third optical splitter 1107 is connected to the second output end of the second optical splitter 1105, so that the second local oscillator light enters the third optical splitter 1107. The third optical splitter 1107 splits the second local oscillator light into two beams of light. The two beams of light enter the first orthogonal coherent modulator 1108 and the second orthogonal coherent modulator 1109 respectively. After the two beams of light are loaded with electro-optical signals in the first orthogonal coherent modulator 1108 and the second orthogonal coherent modulator 1109, two orthogonal signal lights are obtained. The two orthogonal signal lights are transmitted through the emission polarization rotation beam splitter 1110 to obtain one signal light. The one signal light is emitted from the third coupling port 1103, thereby realizing the emission of coherent light.

[0301] FIG39 is a fourth structural block diagram of a coherent optical chip in an optical module provided according to some embodiments of the present disclosure. As shown in FIG39 , the optical splitter group includes a second optical splitter 1105, a third optical splitter 1107, and a directional coupler 1104. The input end of the second optical splitter 1105 is connected to the first coupling port 1101 to receive the local oscillator light output by the laser component; the second optical splitter 1105 splits the local oscillator light into a first local oscillator light and a second local oscillator light. The first local oscillator light enters the fourth optical splitter 1115 as the local oscillator light. The fourth optical splitter 1115 splits the first local oscillator light into two beams of light. The two beams of light enter the first mixer 1112 and the second mixer 1113, respectively. 113; The received light incident from the second coupling port 1102 is split into two beams of light by the receiving polarization rotation beam splitter 1111, and the two beams of light enter the first mixer 1112 and the second mixer 1113 respectively. The local oscillator light and the received light are mixed by the mixer, thereby realizing the demodulation processing of the optical signal, and then the demodulated electrical signal is input to the amplifier chip through the first high-speed detector group 1116 and the second high-speed detector group 1114 respectively. After amplification, the electrical signal is input to the digital signal processing chip for electrical signal processing, thereby realizing the reception of coherent light.

[0302] The input end of the third optical splitter 1107 is connected to the second output end of the second optical splitter 1105, so that the second local oscillator light enters the third optical splitter 1107, and the third optical splitter 1107 splits the second local oscillator light into two beams. The input end of the directional coupler 1104 is connected to the first output end of the third optical splitter 1107, so that a beam of light enters the directional coupler 1104, and the directional coupler 1104 splits the beam of light into a first local oscillator light and a second local oscillator light. The first local oscillator light enters the wavelength locker 1106, and the wavelength locker 1106 detects the first local oscillator light, so that the wavelength locker 1106, the controller and the laser assembly form a closed-loop control to achieve wavelength locking.

[0303] Another beam of light output from the second output end of the third optical splitter 1107 enters the first orthogonal coherent modulator 1108, and the second local oscillator splits the light and enters the second orthogonal coherent modulator 1109. After the two beams of light are loaded with electro-optical signals in the first orthogonal coherent modulator 1108 and the second orthogonal coherent modulator 1109, two orthogonal signal lights are obtained. The two orthogonal signal lights are transmitted through the emission polarization rotation beam splitter 1110 to obtain one signal light, and one signal light is emitted from the third coupling port 1103, thereby realizing the emission of coherent light.

[0304] FIG40 is a fifth structural block diagram of a coherent optical chip in an optical module provided according to some embodiments of the present disclosure. As shown in FIG40 , the optical splitter group includes a second optical splitter 1105, a third optical splitter 1107, and a directional coupler 1104. The input end of the second optical splitter 1105 is connected to the first coupling port 1101 to receive the local oscillator light output by the laser assembly 900. The second optical splitter 1105 splits the local oscillator light into a first local oscillator light and a second local oscillator light. The first local oscillator light enters the fourth optical splitter 1115 as the local oscillator light. The fourth optical splitter 1115 splits the first local oscillator light into two beams of light. The two beams of light enter the first mixer 1112 and the second mixer 1113 respectively. 13; The received light incident from the second coupling port 1102 is split into two beams of light by the receiving polarization rotation beam splitter 1111, and the two beams of light enter the first mixer 1112 and the second mixer 1113 respectively. The local oscillator light and the received light are mixed by the mixer, thereby realizing the demodulation processing of the optical signal, and then the demodulated electrical signal is input to the amplifier chip 305 through the first high-speed detector group 1116 and the second high-speed detector group 1114 respectively. After amplification, the electrical signal is input to the digital signal processing chip 302 for electrical signal processing, thereby realizing the reception of coherent light.

[0305] The input end of the third optical splitter 1107 is connected to the second output end of the second optical splitter 1105, so that the second local oscillator light enters the third optical splitter 1107, and the third optical splitter 1107 splits the second local oscillator light into two beams. The input end of the directional coupler 1104 is connected to the second output end of the third optical splitter 1107, so that a beam of light enters the directional coupler 1104, and the directional coupler 1104 splits the beam of light into the first local oscillator light and the second local oscillator light. The first local oscillator light enters the wavelength locker 1106, and the wavelength locker 1106 detects the first local oscillator light, so that the wavelength locker 1106, the controller and the laser assembly form a closed-loop control to achieve wavelength locking.

[0306] The second local oscillator splits the light and enters the first orthogonal coherent modulator 1108. Another beam of light output from the first output end of the third optical splitter 1107 enters the second orthogonal coherent modulator 1109. After the two beams of light are loaded with electro-optical signals in the first orthogonal coherent modulator 1108 and the second orthogonal coherent modulator 1109, two orthogonal signal lights are obtained. The two orthogonal signal lights are transmitted through the emission polarization rotation beam splitter 1110 to obtain one signal light, which is emitted from the third coupling port 1103, thereby realizing the emission of coherent light.

[0307] In some embodiments, the splitting ratio of the directional coupler 1104 is 96:4, the splitting ratio of the second optical splitter 1105 is 75:25, the splitting ratio of the third optical splitter 1107 is 50:50, and the splitting ratio of the fourth optical splitter 1115 is 50:50.

[0308] Figure 41 is a structural diagram of a wavelength locker in an optical module according to some embodiments of the present disclosure. As shown in Figure 41 , to enable wavelength locker 1106 to detect the wavelength of local oscillator light incident on coherent optical chip 1100, wavelength locker 1106 includes a first optical splitter 1120, a first waveguide 1122, a second waveguide 1124, a multimode interference coupler 1125, and a photodetector group, wherein:

[0309] The first optical splitter 1120 has an input end connected to the second output end of the directional coupler 1104 . The first optical splitter 1120 is used to split the second local oscillator light output by the directional coupler 1104 into a first split light and a second split light.

[0310] One end of the first waveguide 1122 is connected to the first output end of the first optical splitter 1120 . The first waveguide 1122 is used to transmit the first split light.

[0311] One end of a second waveguide 1124 is connected to the second output end of the first optical splitter 1120. The optical path length of the second waveguide 1124 is greater than the optical path length of the first waveguide 1122. The second waveguide 1124 is used to transmit the second split light. Due to the different optical path lengths of the first waveguide 1122 and the second waveguide 1124, there is an optical path length difference between the first split light and the second split light. Consequently, the first split light and the second split light transmitted through the first waveguide 1122 and the second waveguide 1124 have a corresponding phase difference.

[0312] In some embodiments, the optical path difference between the first waveguide 1122 and the second waveguide 1124 is designed such that the phase difference between the first split light and the second split light transmitted through the first waveguide 1122 and the second waveguide 1124 is 180 degrees.

[0313] In some embodiments, the wavelength locker 1106 employs a dual-waveguide Mach-Zehnder modulator structure. Based on the Mach-Zehnder interference principle, the waveform of the output intensity of the output light beam at the output end of the wavelength locker 1106 as it varies with the wavelength of the input light beam at the input end is related to the refractive index and optical path length of the first waveguide 1122 and the second waveguide 1124. The difference between the refractive index and the waveguide length product of the two waveguides determines the wavelength position of the input light beam. Therefore, as long as the waveguide design ensures that the difference between the product of the two waveguides (the product of the refractive index and the waveguide length) remains constant at different temperatures, the waveform of the output intensity of the output light beam at the output end as it varies with the wavelength of the input light beam at the input end can be ensured to remain constant at different temperatures, thereby achieving temperature-insensitive wavelength of the input light beam.

[0314] In some embodiments, the first waveguide 1122 may be a silicon waveguide, and the second waveguide 1124 may be a silicon waveguide + a silicon nitride waveguide + a silicon waveguide. Temperature insensitivity of wavelength to temperature can be achieved by simply adjusting the lengths of the first waveguide 1122 and the second waveguide 1124 so that the difference between the product of the length and the refractive index of the first waveguide 1122 and the product of the length and the refractive index of the second waveguide 1124 remain unchanged.

[0315] Since the first end of the second waveguide 1124 is a silicon waveguide, the second end of the second waveguide 1124 is a silicon waveguide, and the space between the first and second ends of the second waveguide 1124 is a silicon nitride waveguide, in order to ensure smooth transmission of a preset wavelength light beam between waveguides made of two different materials, a second waveguide converter 1123 is provided on the second waveguide 1124, and the second waveguide converter 1123 is located between the silicon waveguide and the silicon nitride waveguide.

[0316] Since the second waveguide converter 1123 is provided on the second waveguide 1124 , in order to eliminate the influence of the second waveguide converter 1123 on the second waveguide 1124 , a first waveguide converter 1121 is correspondingly provided on the first waveguide 1122 .

[0317] The multimode interference coupler 1125 has two input optical ports and at least two output optical ports. The two input optical ports are connected to the first waveguide 1122 and the second waveguide 1124, respectively, so as to inject the first and second split beams with phase differences into the multimode interference coupler 1125. The first and second split beams perform interference of different modes within the multimode interference coupler 1125, and detective lights of different phases are output from the at least two output optical ports, with adjacent phases differing by 90 degrees.

[0318] In some embodiments, a multimode interference coupler is an optical device that can couple multiple optical modes together to achieve the distribution and merging of optical signals. Its principle is based on the interference phenomenon of light and uses the phase difference of light waves when propagating in optical fibers to achieve the coupling and separation of optical signals.

[0319] A multimode interference coupler typically consists of two or more optical fibers. To split an optical signal, at least one fiber serves as the input and the others as the output. At the input, the lightwave is split into multiple modes, each with a different propagation path and phase difference. These modes interfere with each other within the coupler, forming multiple splits that are then emitted through the output port.

[0320] The coupling efficiency of a multimode interference coupler depends on the phase difference of the light waves and the interference conditions. When the phase difference of the light waves is an even number, they reinforce each other, forming a strong composite light wave. When the phase difference is an odd number, they cancel each other out, forming a weak composite light wave. Therefore, a multimode interference coupler can control the phase difference of the light waves by adjusting the length and position of the optical fiber, thereby achieving different coupling effects.

[0321] The optical detector group includes at least two optical detectors, which are used to convert the optical signal of the detection light into an electrical signal and transmit the electrical signal to the controller. The controller can calculate the wavelength of the local oscillator light input to the wavelength locker based on the received electrical signal, thereby calculating the wavelength difference between the local oscillator light wavelength and the preset wavelength. The controller 303 feeds back a control signal to the laser component based on the wavelength difference to adjust the wavelength of the local oscillator light output by the laser component, thereby achieving wavelength locking.

[0322] In some embodiments, the multimode interference coupler 1125 may have two input optical ports and two output optical ports. The two input optical ports are respectively connected to the first waveguide 1122 and the second waveguide 1124 to inject the first split light and the second split light with a phase difference into the multimode interference coupler 1125; the first split light and the second split light perform interference of different modes in the multimode interference coupler 1125, and the first detection light and the second detection light are output from the two output optical ports. The phases of the first detection light and the second detection light are different, and the phase difference between the first detection light and the second detection light is 90 degrees.

[0323] The optical detector group may include a first optical detector 1126 and a second optical detector 1127. The first optical detector 1126 converts the optical signal of the first detection light into an electrical signal, and the second optical detector 1127 converts the optical signal of the second detection light into an electrical signal. Then, the first optical detector 1126 and the second optical detector 1127 input the electrical signals into the controller 303. The controller 303 can calculate the input electrical signals to obtain the wavelength difference that needs to be adjusted. Then, the controller feeds back the wavelength difference information to the laser component, controls the laser component to adjust the temperature or driving current, thereby stabilizing the wavelength of the local oscillator light output by the laser component 900 at a preset wavelength to achieve wavelength locking.

[0324] In some embodiments, the multimode interference coupler 1125 may further have two input optical ports and four output optical ports. The two input optical ports are respectively connected to the first waveguide 1122 and the second waveguide 1124 to inject the first split light and the second split light with a phase difference into the multimode interference coupler 1125. The first split light and the second split light perform interference of different modes in the multimode interference coupler 1125, and the first detection light, the second detection light, the third detection light and the fourth detection light are output from the four output optical ports. The phase of the first detection light differs from the phase of the second detection light by 90 degrees, the phase of the second detection light differs from the phase of the fourth detection light by 90 degrees, and the phase of the fourth detection light differs from the phase of the third detection light by 90 degrees. For example, the phase of the first detection light is 0°, the phase of the second detection light is 90°, the phase of the fourth detection light is 180°, and the phase of the third detection light is 270°.

[0325] The photodetector group includes a first photodetector 1126, a second photodetector 1127, a third photodetector 1128, and a fourth photodetector 1129. The first photodetector 1126 converts the optical signal of the first detection light into an electrical signal, the second photodetector 1127 converts the optical signal of the second detection light into an electrical signal, the third photodetector 1128 converts the optical signal of the third detection light into an electrical signal, and the fourth photodetector 1129 converts the optical signal of the fourth detection light into an electrical signal. The first photodetector 1126, the second photodetector 1127, the third photodetector 1128, and the fourth photodetector 1129 then input the electrical signals into a controller. The controller can calculate the input electrical signals to obtain a wavelength difference that needs to be adjusted. The controller then feeds back the wavelength difference information to the laser component, controls the laser component to adjust the temperature or drive current, and thereby stabilizes the wavelength of the local oscillator light output by the laser component at a preset wavelength to achieve wavelength locking.

[0326] Figure 42 is a power curve diagram of an optical detector in an optical module provided according to some embodiments of the present disclosure. As shown in Figures 34 and 42, in order for controller 3 to detect the wavelength of the local oscillator light incident on the coherent optical chip 1100, the controller receives the electrical signal detected by the optical detector group. The controller stores the relationship curves between the optical power and wavelength of the detection light at different phases, for example, Port 1: The relationship curve between the optical power and wavelength of the detection light at 0°, Port 2: The relationship curve between the optical power and wavelength of the detection light at 90°, Port 4: The relationship curve between the optical power and wavelength of the detection light at 180°, and Port 3: The relationship curve between the optical power and wavelength of the detection light at 270°.

[0327] The relationship curve between the optical power and wavelength of the probe light is a cosine curve, which is periodic. Its period is related to the preset wavelength of the local oscillator light output by the laser assembly 900 and the optical path difference between the first waveguide 1122 and the second waveguide 1124. Different optical path difference designs can achieve different detection periods. For example, if the wavelength of the local oscillator light output by the laser assembly 900 is in the C band (1530 nm to 1565 nm), based on the C band and the optical path difference between the first waveguide 1122 and the second waveguide 1124, the detection period of the relationship curve is 1537 to 1541.5 nm, indicating that the preset wavelength of the local oscillator light output by the laser assembly 900 is 1537 to 1541.5 nm.

[0328] When wavelength locker 1106 outputs two probe beams with a 90-degree phase difference, the controller can detect the wavelength based on the optical power ratio of the two probe beams. For example, the controller calculates the optical powers of the two probe beams to be P1 and P2, respectively, and uses P1 / P2 to represent the wavelength change direction of the preset wavelength beam.

[0329] For example, the wavelength of the preset wavelength light beam output by the laser assembly 900 is set to 1538 nm. When the wavelength of the input light beam at the input end of the wavelength locker 1106 is 1538 nm, P1 / P2 is equal to 1. When the wavelength of the input light beam at the input end of the wavelength locker 1106 is 1537.5 nm, P1 / P2 is greater than 1, indicating that 1537.5 nm deviates from the preset wavelength.

[0330] The wavelength deviation direction of the specific wavelength light beam is known according to P1 / P2, and the controller sends a control signal to the laser component to adjust the temperature or driving current of the laser component to stabilize the wavelength of the laser component at the specific wavelength.

[0331] For example, if the controller calculates that P1 / P2 is greater than 1, it means that the wavelength of the input light beam at the input end of the wavelength locker 1106 is less than the preset wavelength, and the wavelength of the local oscillator light output by the laser assembly needs to be increased. In this case, the controller can control the temperature of the TEC 417 in the laser assembly to reduce the ambient temperature of the laser 412, thereby increasing the wavelength of the local oscillator light output by the laser assembly, until the controller detects that P1 / P2 is equal to 1, so that the wavelength of the local oscillator light output by the laser assembly is stabilized at a specific wavelength.

[0332] When the controller calculates that P1 / P2 is less than 1, it means that the wavelength of the input light beam at the input end of the wavelength locker 1106 is greater than the preset wavelength, and the wavelength of the local oscillator light output by the laser component needs to be reduced. At this time, the controller can control the temperature of the TEC inside the laser component to increase the ambient temperature of the laser, thereby reducing the wavelength of the local oscillator light output by the laser component until the controller detects that P1 / P2 is equal to 1.

[0333] In some embodiments, the controller can not only adjust the wavelength of the light beam output by the laser assembly 900 by controlling the temperature of the laser assembly 900, but can also control the drive current transmitted to the laser assembly 900 to adjust the wavelength of the light beam output by the laser assembly 900. For example, when the drive current of the laser increases and the wavelength of its output increases, when the controller calculates that P1 / P2 is greater than 1, the controller controls the increase of the drive current transmitted to the laser to increase the wavelength of the light beam output by the laser assembly until the P1 / P2 detected by the controller is equal to 1. When the controller calculates that P1 / P2 is less than 1, the controller controls the decrease of the drive current transmitted to the laser to decrease the wavelength of the light beam output by the laser assembly until the P1 / P2 detected by the controller is equal to 1.

[0334] When wavelength locker 1106 outputs four probe beams with phases differing by 90 degrees, the controller can detect the wavelength based on the optical power difference between two probe beams with phases differing by 180 degrees. For example, the controller calculates the optical powers of the four probe beams, P1, P2, P3, and P4, and determines a first optical power difference ΔP1 between P1 and P4, and a second optical power difference ΔP2 between P2 and P3. The controller then determines the wavelength of the input beam to wavelength locker 1106 based on P1, P2, P3, P4, ΔP1, and ΔP2.

[0335] For example, the wavelength of the preset wavelength light beam output by the laser assembly 900 is set to 1538 nm. The controller determines that the wavelength of the input light beam to the wavelength locker 1106 is 1538.5 nm based on P1, P2, P3, P4, ΔP1, and ΔP2. According to the relationship curve between optical power and wavelength, the wavelength of the input light beam to the wavelength locker 1106 differs from the preset wavelength by 0.5 nm. Furthermore, the optical power at port 1 gradually increases to a maximum value, the optical power at port 2 gradually increases, the optical power at port 3 gradually decreases, and the optical power at port 4 gradually decreases to a minimum value. Based on this relationship, the controller feeds back a control signal to the laser assembly to increase the temperature of the TEC 417 or reduce the drive current transmitted to the laser 412, thereby reducing the wavelength of the output light beam of the laser assembly until the wavelength of the input light beam to the wavelength locker 1106 detected by the controller reaches the preset wavelength.

[0336] In some embodiments, the controller calculates the optical powers of the four detection lights as P1, P2, P3, and P4, respectively, and obtains a first optical power ratio K1 of P1 and P4, and a second optical power ratio K2 of P2 and P3. The controller obtains the wavelength of the input light beam of the wavelength locker 1106 based on P1, P2, P3, P4, K1, and K2.

[0337] For example, the wavelength of the preset wavelength light beam output by the laser assembly 900 is set to 1538 nm. The controller determines that the wavelength of the input light beam to the wavelength locker 1106 is 1537.5 nm based on P1, P2, P3, P4, K1, and K2. According to the relationship curve between optical power and wavelength, the wavelength of the input light beam to the wavelength locker 1106 differs from the preset wavelength by 0.5 nm. In addition, the change relationship of port 1 shows that the optical power gradually increases, the change relationship of port 2 shows that the change relationship gradually increases from the minimum value, the change relationship of port 3 shows that the change relationship gradually decreases, and the change relationship of port 4 shows that the change relationship gradually decreases. Based on this change relationship, the controller feeds back a control signal to the laser assembly to reduce the temperature of TEC 417 or increase the drive current transmitted to the laser 902, thereby increasing the wavelength of the output light beam of the laser assembly, until the wavelength of the input light beam to the wavelength locker 1106 detected by the controller 303 reaches the preset wavelength.

[0338] In some embodiments, the multimode interference coupler 1125 within the wavelength locker 1106 is used to split the two beams into four probe beams. The four probe beams have phases that differ by 90 degrees. Compared to characterizing the wavelength change direction of a preset wavelength beam based on the optical power ratio of the two probe beams, the controller 303 determines the wavelength of the input beam to the wavelength locker 1106 based on the optical powers of the four probe beams and the optical power difference between the two probe beams with a phase difference of 180 degrees. This allows for precise determination of the wavelength of the input beam to the wavelength locker 1106 and the wavelength difference between the wavelength of the input beam to the wavelength locker 1106 and the preset wavelength. This allows for a clear definition of the approximate range within which the laser assembly 900 can adjust the wavelength of the output beam, such as by how much the temperature should be raised or lowered, or by how much the drive current should be increased or decreased, without requiring repeated testing.

[0339] The optical module provided by the embodiments of the present disclosure integrates a wavelength locker within a coherent optical chip, enabling precise monitoring, feedback, and locking of the wavelength of input light from an external light source. This eliminates the need for an integrated wavelength locking device in the external light source, reducing the packaging complexity of the external light source. Furthermore, the coherent optical chip has both coherent transmission and reception functions and an integrated wavelength monitoring function, meeting the requirements for short-distance coherent application scenarios, which require lower linewidth and wavelength accuracy of the external light source but are more cost-sensitive.

[0340] In coherent optical modules, to monitor the signal light power in real time, an optical coupler is typically used to split the light and send the split light to a photodetector, enabling direct monitoring of the signal light. However, the optical coupler and photodetector take up a lot of space, hindering the miniaturization of optical modules.

[0341] To address these issues, the present invention provides a mapping relationship between the preset voltage and optical power of the optical module MCU. This calculation calculates the optical power by monitoring the output current of the automatic gain control. This eliminates the need for an optical coupler and photodetector, reducing the number of components in the optical module and facilitating its miniaturization.

[0342] Figure 43 is a schematic diagram of the structure of a coherent optical component provided according to some embodiments of the present disclosure. Figure 44 is a schematic diagram of the structure of a coherent optical component and a circuit board provided according to some embodiments of the present disclosure. As shown in Figures 43 and 44, the coherent component (in some examples, it may also be referred to as a coherent optical component) includes: a local oscillator interface and a receiving interface. The input end of the first mixer is connected to the local oscillator interface and the receiving interface respectively, and the output end of the first mixer is connected to the first balanced receiver. The first mixer mixes the local oscillator light with the first optical signal, and the first balanced receiver receives the mixed signal light in a balanced manner and converts the optical signal into a current signal. The transimpedance amplifier amplifies the current signal, and the current signal is converted into an analog signal through the first analog-to-digital converter. The DSP chip receives the analog signal and parses the analog signal to generate a data signal.

[0343] The automatic gain control unit outputs a gain control voltage to perform automatic gain control on the amplified current signal so that the signal amplitude output by the coherent component remains within a preset range.

[0344] The optical module also includes a second analog-to-digital converter (ADC), which collects the gain voltage from the automatic gain control unit (AGC) and converts it into a digital voltage signal. The MCU, connected to the second ADC, calculates the optical power based on the digital voltage signal and a mapping equation.

[0345] In some embodiments of the present disclosure, the LO interface is connected to the LO light source 401, and the LO light generated by the LO light source 401 enters the coherent component through the LO interface. The receiving interface is connected to the receiving fiber adapter 801 to receive the first optical signal from the external fiber.

[0346] Figure 45 is a schematic diagram of the structure of an automatic gain control unit provided according to some embodiments of the present disclosure. As shown in Figure 45, in some embodiments of the present disclosure, the automatic gain control unit includes: a gain controller, a gain amplifier, and a feedback regulator. The gain amplifier is disposed between the transimpedance amplifier and the feedback regulator. A first balanced receiver receives the mixed signal light in a balanced manner and converts the optical signal into a current signal. The transimpedance amplifier amplifies the current signal to form a first amplified signal.

[0347] The transimpedance amplifier is located between the first balanced receiver and the gain amplifier. It receives the current signal output by the first balanced receiver and amplifies it to form a first amplified signal. The gain amplifier amplifies the first amplified signal to generate a first gain signal. The feedback regulator is located between the gain amplifier and the gain controller. The feedback regulator adjusts the output voltage of the gain controller based on the magnitude of the first gain signal. The output voltage of the gain controller controls the gain value of the gain amplifier.

[0348] FIG46 is a schematic diagram of the structure of an automatic gain controller provided according to some embodiments of the present disclosure. As shown in FIG46 , in some embodiments, the gain controller has a first input pin connected to an input voltage. The gain controller has a second input pin connected to a feedback regulator and receiving a gain control signal from the feedback regulator. The gain controller has a first output pin connected to a gain amplifier, and the output voltage of the first output pin controls the gain of the gain amplifier.

[0349] The gain controller also has a monitoring pin whose output voltage is the same as the output voltage of the first output pin. The monitoring pin is connected to a second analog-to-digital converter, which converts the output voltage of the monitoring pin into a digital voltage signal. The second analog-to-digital converter is also connected to an MCU, which calculates the optical power of the first optical signal based on the digital voltage signal and a preset mapping relationship.

[0350] In some embodiments of the present disclosure, to ensure the stability of the optical signal, a feedback regulator adjusts the output voltage of the gain controller so that the amplified electrical signal reaches a preset value. Therefore, the output voltage of the first output pin of the gain controller can be used to represent the optical power of the signal light.

[0351] The preset mapping relationship is a functional relationship between optical power and voltage digital signal. Table 4 is a relationship table between optical power and voltage digital signal disclosed in the embodiment of the present disclosure.

[0352] In some embodiments of the present disclosure, the photocurrent I1(t) is converted by the first balanced receiver and represents the optical power of the input signal light. When the input voltage of the first input pin of the gain controller is set to a fixed value, the output power of the gain controller is a certain value. At this time, I1(t)*RX_TIA_GC = a fixed value, and RX_TIA_GC is the output voltage of the monitoring pin. It can be seen that the product of the photocurrent and the output voltage of the monitoring pin is a preset value. Therefore, as long as the value of the RX_TIA_GC voltage is known, the magnitude of the signal light photocurrent can be indirectly calculated based on the relationship between the RX_TIA_GC voltage and the signal light optical power. Based on the mapping relationship between the photocurrent and the optical power, the value of the optical power can be obtained based on the photocurrent.

[0353] The MCU has a preset functional relationship between optical power and voltage digital signal. By collecting the output voltage of the first output pin of the gain controller and substituting the voltage value into the functional relationship, the optical power can be obtained.

[0354] Some embodiments of the present disclosure provide an optical module, comprising: a local oscillator light source, a coherent component, and an MCU. The local oscillator interface of the coherent component is connected to the local oscillator light source to receive the local oscillator signal light; the receiving interface of the coherent component is connected to the receiving optical fiber adapter to receive the first optical signal from the outside. The first mixer mixes the local oscillator light with the first optical signal, and the first balanced receiver receives the mixed signal light in a balanced manner to convert the optical signal into a current signal. The transimpedance amplifier amplifies the current signal, and the automatic gain control unit outputs a gain control voltage, and performs automatic gain control on the amplified current signal so that the signal amplitude output by the coherent component remains within a preset range. The MCU collects the gain control voltage output by the automatic gain control unit, and calculates the optical power of the first optical signal based on the gain control voltage and a preset mapping relationship.

[0355] In some embodiments of the present disclosure, the gain amplifier may be one gain amplification component or two gain amplification components. For example, the gain amplifier includes a first gain amplification component and a second gain amplification component, and a gain controller is connected to the first gain amplification component and the second gain amplification component to adjust the amplification factor of the first gain amplification component or the second gain amplification component according to a signal fed back by a feedback regulator.

[0356] In some embodiments of the present disclosure, a coherent optical module typically features multi-channel signal transmission, meaning that a first optical signal may include multiple different optical signals. The coherent component includes a second coupler, through which the first optical signal is split into a first sub-optical signal and a second sub-optical signal with different polarization directions. The local oscillator light is then split into a first sub-local oscillator light and a second sub-local oscillator light with different polarization directions via a third coupler.

[0357] The second mixer is connected to the second coupler and the third coupler, respectively. The second mixer receives the first optical sub-signal and the first local oscillator light, performs phase splitting and frequency mixing on the first optical sub-signal and the first local oscillator light, respectively, to generate a first mixed light and a second mixed light. The second balanced receiver is connected to the second mixer, converts the first mixed light and the second mixed light to generate a first electrical sub-signal and a second electrical sub-signal.

[0358] A first transimpedance amplifier is connected to the first output port of the second balanced receiver to amplify the first sub-electrical signal. A first automatic gain control unit is connected to the first transimpedance amplifier to perform gain control on the amplified first sub-electrical signal. A third analog-to-digital converter collects a gain voltage from the first automatic gain control unit and converts the gain voltage into a first voltage digital signal. An MCU is connected to the third analog-to-digital converter to calculate the first sub-optical power based on the first voltage digital signal and a mapping relationship.

[0359] A second transimpedance amplifier is connected to the second output port of the second balanced receiver to amplify the second sub-electrical signal. A second automatic gain control unit is connected to the second transimpedance amplifier to perform gain control on the amplified second sub-electrical signal. A fourth analog-to-digital converter collects a gain voltage from the second automatic gain control unit and converts the gain voltage into a second voltage digital signal. An MCU is connected to the fourth analog-to-digital converter to calculate the second sub-optical power based on the second voltage digital signal and a mapping relationship.

[0360] In some embodiments, a voltage digital signal and a mapping relationship are preset in the MCU, and the first sub-optical power is calculated based on the first voltage digital signal and the mapping relationship; the second sub-optical power is calculated based on the second voltage digital signal and the mapping relationship.

[0361] In some embodiments, a voltage digital signal and a mapping relationship are preset in the MCU, and the average value of the first voltage digital signal and the second voltage digital signal is calculated as the average voltage digital signal. The optical power calculated according to the preset voltage digital signal and the mapping relationship is the received optical power.

[0362] In some embodiments, the coherent component further includes a third mixer connected to the second coupler and the third coupler, respectively. The third mixer receives the second sub-optical signal and the second sub-local oscillator light, performs phase splitting and mixing on the second sub-optical signal and the second sub-local oscillator light, respectively, to generate third mixed light and fourth mixed light.

[0363] The third balanced receiver is connected to the second mixer, and converts the third mixed-frequency light and the fourth mixed-frequency light to generate a third sub-electrical signal and a fourth sub-electrical signal.

[0364] A third transimpedance amplifier is connected to the first output port of the third balanced receiver to amplify the third sub-electrical signal. A third automatic gain control unit is connected to the third transimpedance amplifier to perform gain control on the amplified third sub-electrical signal. A fifth analog-to-digital converter collects a gain voltage from the third automatic gain control unit and converts the gain voltage into a third voltage digital signal. An MCU is connected to the fifth analog-to-digital converter to calculate the third sub-optical power based on the third voltage digital signal and a mapping relationship.

[0365] A fourth transimpedance amplifier is connected to the second output port of the third balanced receiver to amplify the fourth sub-electrical signal. A fourth automatic gain control unit is connected to the fourth transimpedance amplifier to perform gain control on the amplified fourth sub-electrical signal. A sixth analog-to-digital converter collects a gain voltage from the fourth automatic gain control unit and converts the gain voltage into a fourth voltage digital signal. An MCU is connected to the sixth analog-to-digital converter to calculate the fourth sub-optical power based on the fourth voltage digital signal and a mapping relationship.

[0366] In some embodiments, a voltage digital signal and a mapping relationship are preset in the MCU, and the third sub-optical power is calculated based on the third voltage digital signal and the mapping relationship; the fourth sub-optical power is calculated based on the fourth voltage digital signal and the mapping relationship.

[0367] An average value of the first sub-optical power, the second sub-optical power, the third sub-optical power, and the fourth sub-optical power may be calculated, and the average value may be used as a reported value of the received optical power.

[0368] Some embodiments of the present disclosure provide an optical module comprising: a local oscillator (LO) light source, a coherent component, and an MCU. The LO interface of the coherent component is connected to the LO light source to receive LO signal light; the receiving interface of the coherent component is connected to a receiving fiber adapter to receive a first optical signal from an external source. A coupler splits the first optical signal. A mixer mixes the LO light with the first optical signal, and a balanced receiver receives the mixed signal light in a balanced manner, converting the optical signal into a current signal. A transimpedance amplifier amplifies the current signal, and an automatic gain control unit outputs a gain control voltage. Automatic gain control is performed on the amplified current signal to ensure that the signal amplitude output by the coherent component remains within a preset range. The MCU collects the gain control voltage output by the automatic gain control unit and calculates the optical power of the first optical signal based on a mapping relationship between the gain control voltage and a preset mapping equation. By calculating the optical power corresponding to multiple gain control voltages and calculating their average as the optical power reporting value, the optical power of the received signal light can be monitored without adding a photodetector, reducing the number of optoelectronic components and the occupied space, which is conducive to the miniaturization of the optical module design.

[0369] Due to the insufficient bandwidth of the laser driver chip and coherent modulator, and the high-frequency damage introduced by the wiring on the circuit board during the module connection process, the spectrum of the high-frequency optical signal emitted by the coherent optical module often deviates, resulting in an increase in the pre-correction bit error rate, thereby reducing the quality and stability of optical communications. To solve this problem, the conventional method is to use a global traversal method to optimize the frequency control parameters of the high-frequency electrical signal. However, using a global traversal method to optimize the frequency control parameters of the high-frequency electrical signal is difficult and inefficient. To solve this problem, the test host uses a combination of local traversal and preset methods to optimize the frequency control parameters of the high-frequency electrical signal.

[0370] Figure 47 is an assembly diagram of a test host and an optical module provided according to some embodiments. As shown in Figure 47, the optical module has a gold finger, and the test host and the optical module are connected through the gold finger. The test host includes a processor, and the processor is configured to: set an initial value set of the high-frequency electrical signal frequency control parameter; within a preset range, multiple high-frequency electrical signal frequency control parameters are traversed in sequence to obtain multiple first pre-correction errors; wherein, when a high-frequency electrical signal frequency control parameter is traversed, the other high-frequency electrical signal frequency control parameters remain unchanged at the initial value; find the smallest first pre-correction error from the multiple first pre-correction errors obtained after traversing a high-frequency electrical signal frequency control parameter; and set the high-frequency electrical signal frequency control parameter corresponding to the smallest first pre-correction error to the initial value set. The real-time value of the number is recorded as the first optimized value of the high-frequency electrical signal frequency control parameter to obtain the first optimized value set of the high-frequency electrical signal frequency control parameter; at least one first optimized value of the high-frequency electrical signal frequency control parameter is selected from the first optimized value set of the high-frequency electrical signal frequency control parameter according to a preset combination method, and the selected first optimized value of the high-frequency electrical signal frequency control parameter is used to replace the initial value of the high-frequency electrical signal frequency control parameter to obtain multiple second pre-correction code errors; the smallest second pre-correction code error is selected from the multiple second pre-correction code errors to obtain the second optimized value set of the high-frequency electrical signal frequency control parameter corresponding to the smallest second pre-correction error.

[0371] The processor is also configured to: determine whether the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first code error before correction is a minimum point; if the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first code error before correction is not a minimum point, use the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first code error before correction as the initial value, and re-traverse the high-frequency electrical signal frequency control parameter until the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest code error before correction is a minimum point; if the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first code error before correction is a minimum point, record the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first code error before correction as the first optimized value of the high-frequency electrical signal frequency control parameter to obtain a first optimized value set of the high-frequency electrical signal frequency control parameter.

[0372] FIG48 is a first flow chart of a method for optimizing a high-frequency electrical signal frequency control parameter according to some embodiments. FIG49 is a second flow chart of a method for optimizing a high-frequency electrical signal frequency control parameter according to some embodiments. FIG50 is a third flow chart of a method for optimizing a high-frequency electrical signal frequency control parameter according to some embodiments. As shown in FIG48, FIG49 and FIG50, the optimization method includes:

[0373] S100: Setting an initial value set of a high-frequency electrical signal frequency control parameter.

[0374] The processor sets an initial value set for a high-frequency electrical signal frequency control parameter, where each high-frequency electrical signal frequency control parameter has an initial value. For example, in low sampling mode, seven high-frequency electrical signal frequency control parameters are set in the DSP, and the processor assigns an initial value set of 0 0 0 127 0 0 0 to the seven high-frequency electrical signal frequency control parameters, where the initial value of the first high-frequency electrical signal frequency control parameter is 0, the initial value of the second high-frequency electrical signal frequency control parameter is 0, the initial value of the third high-frequency electrical signal frequency control parameter is 0, the initial value of the fourth high-frequency electrical signal frequency control parameter is 127, the initial value of the fifth high-frequency electrical signal frequency control parameter is 0, the initial value of the sixth high-frequency electrical signal frequency control parameter is 0, and the initial value of the seventh high-frequency electrical signal frequency control parameter is 0.

[0375] S200: Within a preset range, multiple high-frequency electrical signal frequency control parameters are sequentially traversed to obtain multiple first pre-correction bit errors.

[0376] S201: Within a preset range, multiple high-frequency electrical signal frequency control parameters are sequentially traversed to obtain multiple sets of real-time value sets of the high-frequency electrical signal frequency control parameters.

[0377] The preset range is the traversal range, and the traversal range of each high-frequency electrical signal frequency control parameter is M, that is, each high-frequency electrical signal frequency control parameter traverses within the range of Fn0-M to Fn0+M. Among them, Fn is the nth high-frequency electrical signal frequency control parameter, and Fn0 is the initial value of the nth high-frequency electrical signal frequency control parameter.

[0378] The range of each high-frequency electrical signal frequency control parameter is 0 to 511. When Fni is less than 0, Fni=Fni+512, and when Fni is greater than 511, Fni=Fni-512. Wherein, Fni is the real-time value of the nth high-frequency electrical signal frequency control parameter at point i.

[0379] The traversal step length of the high-frequency electrical signal frequency control parameter is a second preset value. For example, the second preset value is 2, and the traversal step length of the high-frequency electrical signal frequency control parameter is 2.

[0380] The preset traversal order is the order in which the frequency control parameters of the high-frequency electrical signal perform frequency compensation on the high-frequency electrical signal. For example, the preset traversal order is 1, 2, 3, 4, 5, 6, and 7.

[0381] The preset traversal order is the order of the weights of the frequency control parameters of the high-frequency electrical signal. For example, the preset traversal order is 4, 3, 5, 2, 6, 1, and 7.

[0382] Within the traversal range, the processor traverses multiple high-frequency electrical signal frequency control parameters in accordance with a preset traversal order, and each high-frequency electrical signal frequency control parameter is traversed independently to obtain multiple first pre-correction errors. For example, the preset traversal order is 1, 2, 3, 4, 5, 6, 7, and the first high-frequency electrical signal frequency control parameter F1, the second high-frequency electrical signal frequency control parameter F2, the third high-frequency electrical signal frequency control parameter F3, the fourth high-frequency electrical signal frequency control parameter F4, the fifth high-frequency electrical signal frequency control parameter F5, the sixth high-frequency electrical signal frequency control parameter F6, and the seventh high-frequency electrical signal frequency control parameter F7 are traversed in sequence; the preset traversal order is 4, 3, 5, 2, 6, 1, 7, and the fourth high-frequency electrical signal frequency control parameter F4, the third high-frequency electrical signal frequency control parameter F3, the fifth high-frequency electrical signal frequency control parameter F5, the second high-frequency electrical signal frequency control parameter F2, the sixth high-frequency electrical signal frequency control parameter F6, the first high-frequency electrical signal frequency control parameter F1, and the seventh high-frequency electrical signal frequency control parameter F7 are traversed in sequence.

[0383] The preset traversal order affects the size of the preset traversal range. For example, the preset traversal order is 1, 2, 3, 4, 5, 6, 7, and the preset traversal ranges of all high-frequency electrical signal frequency control parameters are the first value. The preset traversal order is 4, 3, 5, 2, 6, 1, 7, and the traversal ranges of the high-frequency electrical signal frequency control parameters decrease in sequence. That is, the preset traversal range of F4 is the first value, the preset traversal range of F3 is the second value, the preset traversal range of F5 is the third value, the preset traversal range of F2 is the fourth value, the preset traversal range of F6 is the fifth value, the preset traversal range of F1 is the sixth value, and the preset traversal range of F7 is the seventh value, and the first value > the second value > the third value > the fourth value > the fifth value > the sixth value > the seventh value.

[0384] When a high-frequency electrical signal frequency control parameter is traversed, the other high-frequency electrical signal frequency control parameters remain unchanged at their initial values. For example, when the second high-frequency electrical signal frequency control parameter F2 is traversed, the other high-frequency electrical signal frequency control parameters F1 = 0, F3 = 0, F4 = 127, F5 = 0, F6 = 0, and F7 = 0.

[0385] S202: Sending multiple sets of real-time value sets of high-frequency electrical signal frequency control parameters.

[0386] After the processor sends a set of real-time value sets of high-frequency electrical signal frequency control parameters, the processor sends an initialization instruction. After receiving the initialization instruction, the MCU of the optical module completes the initialization and changes the initialization parameter from the first value to the second value in the register of the MCU. The processor periodically reads the initialization parameter in the register.

[0387] S203: If the read initialization parameter is the second value, read the first pre-correction bit error multiple times, and record the first pre-correction bit error read last time.

[0388] The processor reads that the initialization parameter is the second value, reads the first pre-correction bit error multiple times, and records the first pre-correction bit error read last time.

[0389] Each time the processor issues a set of real-time value sets of high-frequency electrical signal frequency control parameters, the processor will re-issue an initialization parameter instruction to facilitate reading multiple first pre-correction bit errors.

[0390] S300: Finding the smallest first pre-correction bit error from multiple first pre-correction bit errors obtained after traversing a frequency control parameter of a high-frequency electrical signal.

[0391] Each high-frequency electrical signal frequency control parameter is independently traversed to obtain multiple first pre-correction code errors. The processor finds the smallest first pre-correction code error from the multiple first pre-correction code errors obtained after traversing the frequency control parameter of a high-frequency electrical signal.

[0392] S400: Determine whether the real-time value of the frequency control parameter of the high-frequency electrical signal corresponding to the smallest first pre-correction bit error is a minimum point.

[0393] Since the traversal range of each high-frequency electrical signal frequency control parameter is limited, the minimum first pre-correction code error obtained by traversing the high-frequency electrical signal frequency control parameter within the traversal range may not be the minimum first pre-correction code error after the high-frequency electrical signal frequency control parameter traverses all values. Therefore, after obtaining the minimum first pre-correction code error, it is necessary to determine whether the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction code error is a minimum point.

[0394] The processor determines whether the real-time value of the frequency control parameter of the high-frequency electrical signal corresponding to the smallest first pre-correction bit error is a minimum point.

[0395] S500: If the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first pre-correction code error is not a minimum point, the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first pre-correction code error is used as the initial value, and the high-frequency electrical signal frequency control parameter is re-traversed until the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest pre-correction code error is a minimum point.

[0396] If the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first pre-correction code error is not a minimum point, the processor uses the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first pre-correction code error as the initial value, and the high-frequency electrical signal frequency control parameter is re-traversed until the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest pre-correction code error is a minimum point.

[0397] S600: If the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction code error is a minimum point, the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction code error is recorded as the first optimized value of the high-frequency electrical signal frequency control parameter to obtain a first optimized value set of the high-frequency electrical signal frequency control parameter.

[0398] Figure 51 is a fourth flow chart of a method for optimizing a high-frequency electrical signal frequency control parameter according to some embodiments. As shown in Figure 51 , the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction bit error is recorded as the first optimized value of the high-frequency electrical signal frequency control parameter to obtain a first optimized value set of the high-frequency electrical signal frequency control parameter, including:

[0399] S601: If the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction bit error is a minimum point, the processor records the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction bit error as the first optimized value of the high-frequency electrical signal frequency control parameter.

[0400] The first optimized value of the nth high-frequency electrical signal frequency control parameter is F ni-best .

[0401] S602: Combining first optimized values ​​of a plurality of high-frequency electrical signal frequency control parameters to obtain a first optimized value set of the high-frequency electrical signal frequency control parameters.

[0402] Traverse a high-frequency electrical signal frequency control parameter to obtain a first optimized value of the high-frequency electrical signal frequency control parameter, and traverse multiple high-frequency electrical signal frequency control parameters to obtain a first optimized value set of the high-frequency electrical signal frequency control parameter. For example, there are 7 high-frequency electrical signal frequency control parameters set in the DSP, and the first optimized value set of the high-frequency electrical signal frequency control parameter is (F 1i-best、 F 2i-best、 F 3i-best、 F 4i-best、 F 5i-best、 F 6i-best、 F 7i-best ).

[0403] When a high-frequency electrical signal frequency control parameter is traversed, the other high-frequency electrical signal frequency control parameters remain unchanged at their initial values, indicating that each high-frequency electrical signal frequency control parameter is traversed independently. Although each high-frequency electrical signal frequency control parameter can also obtain the first optimized value set of the high-frequency electrical signal frequency control parameter by independently traversing, the mutual influence between multiple high-frequency electrical signal frequency control parameters is not considered, resulting in a large pre-correction bit error. In order to solve this problem, the optimization method also includes:

[0404] S700: Select at least one first optimized value of a high-frequency electrical signal frequency control parameter from a first optimized value set of the high-frequency electrical signal frequency control parameter according to a preset combination method, and replace the initial value of the high-frequency electrical signal frequency control parameter with the selected first optimized value of the high-frequency electrical signal frequency control parameter to obtain multiple second pre-correction error codes.

[0405] FIG52 is a fifth flow chart of a method for optimizing a high-frequency electrical signal frequency control parameter according to some embodiments. As shown in FIG52 , at least one first optimized value of a high-frequency electrical signal frequency control parameter is selected from a first optimized value set of the high-frequency electrical signal frequency control parameter according to a preset combination method, and the selected first optimized value of the high-frequency electrical signal frequency control parameter is used to replace the initial value of the high-frequency electrical signal frequency control parameter, thereby obtaining multiple second pre-error correction methods, including:

[0406] S701: Select at least one first optimized value of a high-frequency electrical signal frequency control parameter from a first optimized value set of high-frequency electrical signal frequency control parameters according to a preset combination method.

[0407] The preset combination method is to select 1 to N first optimized values ​​of the high-frequency electrical signal frequency control parameters from the N first optimized values ​​of the high-frequency electrical signal frequency control parameters for combination.

[0408] N high-frequency electrical signal frequency control parameters are set in the DSP, and the preset combination method is to read 1 from the first optimized values ​​of the N high-frequency electrical signal frequency control parameters for combination + read 2 from the first optimized values ​​of the N high-frequency electrical signal frequency control parameters for combination + read 3 from the first optimized values ​​of the N high-frequency electrical signal frequency control parameters for combination +... + read N-3 from the first optimized values ​​of the N high-frequency electrical signal frequency control parameters for combination + read N-2 from the first optimized values ​​of the N high-frequency electrical signal frequency control parameters for combination + read N-1 from the first optimized values ​​of the N high-frequency electrical signal frequency control parameters for combination + read N from the first optimized values ​​of the N high-frequency electrical signal frequency control parameters for combination. For example, 7 high-frequency electrical signal frequency control parameters are set in the DSP, and the preset combination method is to read 1 from the first optimized values ​​of the 7 high-frequency electrical signal frequency control parameters for combination + read 2 from the first optimized values ​​of the 7 high-frequency electrical signal frequency control parameters for combination + read 3 from the first optimized values ​​of the 7 high-frequency electrical signal frequency control parameters for combination +... + read 4 from the first optimized values ​​of the 7 high-frequency electrical signal frequency control parameters for combination + read 5 from the first optimized values ​​of the 7 high-frequency electrical signal frequency control parameters for combination + read 6 from the first optimized values ​​of the 7 high-frequency electrical signal frequency control parameters for combination + read 7 from the first optimized values ​​of the 7 high-frequency electrical signal frequency control parameters for combination.

[0409] S702: Replace the initial value of the high-frequency electrical signal frequency control parameter with the selected first optimized value of the high-frequency electrical signal frequency control parameter to obtain multiple sets of real-time values ​​of the high-frequency electrical signal frequency control parameter.

[0410] S703: Send down multiple sets of real-time value sets of high-frequency electrical signal frequency control parameters.

[0411] S704: If the read initialization parameter is the second value, read the second pre-correction code errors multiple times, and record the second pre-correction code errors read last time to obtain multiple second pre-correction code errors.

[0412] S800: Selecting a minimum second error before correction from a plurality of second error before correction to obtain a second optimized value set of frequency control parameters of a high-frequency electrical signal corresponding to the minimum second error before correction.

[0413] In some embodiments, an optimization method for the high-frequency electrical signal frequency control parameters based on an optical module includes: setting an initial value set of the high-frequency electrical signal frequency control parameters; within a preset range, traversing multiple high-frequency electrical signal frequency control parameters in sequence to obtain multiple first pre-correction code errors; finding the minimum first pre-correction code error from multiple first pre-correction code errors after traversing a high-frequency electrical signal frequency control parameter; recording the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction code error as the first optimized value of the high-frequency electrical signal frequency control parameter to obtain the first optimized value set of the high-frequency electrical signal frequency control parameter. Among them, when one high-frequency electrical signal frequency control parameter is traversed, the other high-frequency electrical signal frequency control parameters maintain the initial value unchanged, indicating that each high-frequency electrical signal frequency control parameter is traversed independently. Although each high-frequency electrical signal frequency control parameter can also obtain the first optimized value set of the high-frequency electrical signal frequency control parameter by independently traversing, the mutual influence between multiple high-frequency electrical signal frequency control parameters is not considered, resulting in a large pre-correction code error. In order to avoid this problem, after each high-frequency electrical signal frequency control parameter is independently traversed, at least one first optimized value of the high-frequency electrical signal frequency control parameter is selected from the first optimized value set of the high-frequency electrical signal frequency control parameter according to a preset combination method, and the selected first optimized value of the high-frequency electrical signal frequency control parameter is used to replace the initial value of the high-frequency electrical signal frequency control parameter to obtain multiple second pre-correction code errors; the smallest second pre-correction code error is selected from the multiple second pre-correction code errors to obtain the second optimized value set of the high-frequency electrical signal frequency control parameter corresponding to the smallest second pre-correction code error. In some embodiments, a local traversal method is first used to traverse the multiple high-frequency electrical signal frequency control parameters in sequence, and each high-frequency electrical signal frequency control parameter is traversed independently to obtain the first optimized value set of the high-frequency electrical signal frequency control parameter, and then the preset combination method is used to combine the first optimized value set of the high-frequency electrical signal frequency control parameter to obtain the second optimized value set of the high-frequency electrical signal frequency control parameter corresponding to the smallest second pre-correction code error. In some embodiments, the high-frequency electrical signal frequency control parameters are optimized by local traversal and combination methods to obtain the optimal high-frequency electrical signal frequency control parameters, thereby reducing the pre-correction bit error of the optical module; compared with the global variable method for optimizing the high-frequency electrical signal frequency control parameters, it also effectively reduces the number of optimization times and improves the optimization efficiency.

[0414] In addition to providing an optimization method for high-frequency electrical signal frequency control parameters based on an optical module, the present disclosure also provides an optimization device for high-frequency electrical signal frequency control parameters based on an optical module, the optimization device including a setting module, a first traversal module, a first selection module, a recording module, a replacement module and a second selection module, the setting module is used to set an initial value set of the high-frequency electrical signal frequency control parameters; the first traversal module is used to traverse the high-frequency electrical signal frequency control parameters within a preset range to obtain multiple first pre-correction errors; the first selection module is used to find the minimum first pre-correction error among multiple first pre-correction errors obtained from traversing a high-frequency electrical signal frequency control parameter; the recording module is used to find the minimum first pre-correction error if the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction error is extremely A minimum value point is selected, and the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the minimum first pre-correction error is recorded as the first optimized value of the high-frequency electrical signal frequency control parameter to obtain a first optimized value set of the high-frequency electrical signal frequency control parameter; the replacement module is used to select at least one first optimized value of the high-frequency electrical signal frequency control parameter from the first optimized value set of the high-frequency electrical signal frequency control parameter according to a preset combination method, and replace the initial value of the high-frequency electrical signal frequency control parameter with the selected first optimized value of the high-frequency electrical signal frequency control parameter to obtain multiple second pre-correction errors; the second selection module is used to select the minimum second pre-correction error from the multiple second pre-correction errors to obtain a second optimized value set of the high-frequency electrical signal frequency control parameter corresponding to the minimum second pre-correction error.

[0415] The optimization device also includes a judgment module and a second traversal module. The judgment module is used to judge whether the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first pre-correction code error is a minimum point; the second traversal module is used to use the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first pre-correction code error as the initial value if the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest first pre-correction code error is not a minimum point, and restart the traversal of the high-frequency electrical signal frequency control parameter until the real-time value of the high-frequency electrical signal frequency control parameter corresponding to the smallest pre-correction code error is a minimum point.

[0416] Since the above embodiments are all described by reference in combination with other embodiments, different embodiments have the same parts, and the same and similar parts between the various embodiments in this specification can be referred to each other. No further detailed explanation is given here.

[0417] It should be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, the presence of an element defined by the phrase "includes a..." does not exclude the presence of other identical elements in the circuit structure, article or device comprising the element.

[0418] Those skilled in the art will readily conceive of other embodiments of the present disclosure after considering the specification and practicing the disclosure of the present disclosure. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered merely as exemplary, and the true scope and spirit of the present disclosure are indicated by the contents of the claims. The embodiments of the present disclosure described above do not constitute a limitation on the scope of protection of the present disclosure.

Claims

1. An optical module, comprising: Circuit boards; A local oscillator light source, electrically connected to the circuit board, the local oscillator light source being configured to generate local oscillator light; a receiving optical fiber adapter containing a first optical signal; a coherent optical component connected to the light source; the coherent optical component comprises a coherent modulation chip, the coherent modulation chip comprises an optical splitter, a modulation area and a demodulation area, the optical splitter comprises an optical input interface, an optical output interface and an electrical input interface, the optical input interface receives the local oscillation light, one optical output interface is connected to the modulation area, and the other optical output interface is respectively connected to the demodulation area; so as to coherently demodulate the local oscillation light and the first optical signal and generate an electrical signal; MCU, connected to the electrical input interface; the MCU includes a register, the register stores a plurality of splitting ratio functions corresponding to the temperature; the MCU calls the splitting ratio function according to the temperature, and controls the working current of the electrical input interface of the spectrometer according to the splitting ratio function and a sampling voltage, wherein the sampling voltage corresponds to the sampling current of the photodetector; The product of the digital signal and the photocurrent is a preset value, and the MCU is configured to calculate the photocurrent according to the digital signal, and calculate the optical power according to the mapping relationship between the photocurrent and the optical power; The MCU is further configured to calculate the reported optical power according to the frequency of the electrical signal and the first optical signal and an optical power formula; The optical power formula is: P = P1 - P2 (1); In formula (1), P1 is the reference optical power, and P2 is the current frequency deviation; The reference optical power formula is a functional relationship between the electrical signal and the reference optical power when the frequency of the first optical signal is the first frequency at the first temperature; The frequency deviation is a functional relationship between a frequency difference and a frequency at the first temperature, wherein the frequency difference is a difference between optical powers corresponding to different frequencies and a reference optical power.

2. The optical module according to claim 1, wherein: The coherent modulation chip receives the photodetector to generate a photocurrent in response to the first light signal; The optical module further includes: a transimpedance amplifier, configured to receive the photogenerated current, amplify the photogenerated current, and output a voltage signal; The analog-to-digital conversion sampler converts the voltage signal into an AD sampling value and transmits the AD sampling value to the MCU; The MCU is further configured to calculate the reported optical power according to the AD sampling value, the frequency of the first optical signal and an optical power formula.

3. The optical module according to claim 2, wherein: The current frequency deviation includes a first frequency broken line segment and a second frequency broken line segment; The first frequency broken line segment is: The second frequency broken line segment is: In formulas (3) and (4), V is the current frequency, V1 is the first frequency, V3 is the third frequency, V2 is the second frequency, A2 is the difference between the current optical power and the reference optical power when the frequency is the second frequency, and A3 is the difference between the current optical power and the reference optical power when the frequency is the third frequency. The second frequency is less than the first frequency; The third frequency is greater than the first frequency.

4. The optical module according to claim 2, wherein: The reference optical power formula is: P1 = aln(AD) + b (2); In formula (2), AD is the current AD sampling value, a is the formula coefficient, and b is a constant.

5. The optical module according to claim 2, wherein: The frequency of the first optical signal is greater than or equal to 191.3 THz, and the frequency of the first optical signal is less than or equal to 196.1 THz.

6. The optical module according to claim 2, wherein: The frequency of the first optical signal is greater than or equal to a frequency minimum value, and the frequency of the first optical signal is less than or equal to a frequency maximum value; the difference between the frequency maximum value and the frequency minimum value is a frequency difference value; The difference between the first frequency and the frequency minimum is a first frequency difference, and the ratio of the first frequency difference to the frequency minimum is 40% to 60%.

7. The optical module according to claim 2, wherein: The frequency of the first optical signal is greater than or equal to 191.3 THz, and the frequency of the first optical signal is less than or equal to 196.1 THz.

8. The optical module according to claim 2, wherein: The first temperature is any temperature point between 23 and 27°C.

9. The optical module according to any one of claims 2 to 8, further comprising: A temperature collector, connected to the MCU, and configured to collect the temperature of the coherent optical component; The MCU is further configured to calculate and report the optical power according to the AD sampling value, the frequency of the first optical signal, the current temperature of the coherent optical component and the optical power formula; The optical power formula is: P = P1 - P2 - P3 (5); In formula (1), P1 is the reference optical power, P2 is the current frequency deviation, and P3 is the current temperature deviation. The reference optical power formula is a functional relationship between the AD sampling value and the reference optical power when the frequency of the first optical signal is the first frequency at the first temperature; The frequency deviation is a functional relationship between the frequency difference and the frequency at the first temperature, and the frequency difference is the difference between the optical power corresponding to different frequencies and the reference optical power; The frequency deviation is a functional relationship between a frequency difference and temperature at the first frequency, and the frequency difference is a difference between optical powers corresponding to different temperature rates and a reference optical power.

10. The optical module according to claim 9, wherein: The temperature deviation includes: a first temperature broken line segment and a second temperature broken line segment; Wherein, the first temperature broken line segment: The second temperature broken line segment: In equations (6) and (7), W is the current frequency, W1 is the first temperature, W3 is the third temperature, W2 is the second temperature, I2 is the difference between the current optical power and the reference optical power at the second temperature, and I3 is the difference between the current optical power and the reference optical power at the third temperature.

11. The optical module according to claim 1, wherein: The coherent optical component also includes: A first mixer is coupled to the local oscillator light source and the receiving optical fiber adapter to receive the local oscillator light and the first optical signal; a first balanced receiver, connected to the first mixer, performing balanced reception on the received optical signal and converting the optical signal into the electrical signal; The transimpedance amplifier is connected to the first balanced receiver to amplify the electrical signal; An automatic gain control unit, connected to the transimpedance amplifier, for performing gain control on the amplified electrical signal; A second analog-to-digital converter is connected to the automatic gain control unit, receives a gain voltage of the automatic gain control unit, and converts the gain voltage into a voltage digital signal; The MCU is connected to the second analog-to-digital converter to calculate the photocurrent according to the voltage digital signal, and to calculate the optical power according to the mapping relationship between the photocurrent and the optical power.

12. The optical module according to claim 11, further comprising: A first analog-to-digital converter and the automatic gain control unit receive the voltage signal after gain; The DSP chip is connected to the first analog-to-digital converter.

13. The optical module according to claim 11, wherein: The automatic gain control unit comprises: A gain amplifier, connected to the transimpedance amplifier, for performing gain on the amplified electrical signal; A feedback regulator is connected to the gain amplifier and outputs a gain control signal according to the gained electrical signal; The gain controller is located between the gain amplifier and the feedback regulator, receives a gain control signal from the feedback regulator and outputs a gain voltage.

14. The optical module according to claim 13, wherein: The gain controller comprises: A first input pin connected to an input voltage; A second input pin, connected to the feedback regulator, receiving a gain control signal of the feedback regulator; A first output pin connected to the gain amplifier; A monitoring pin is connected to the second analog-to-digital converter, and the voltage of the monitoring pin is the same as that of the first output pin.

15. The optical module according to claim 13, characterized in that: The gain amplifier comprises a first gain amplification component and a second gain amplification component; The gain controller is connected to the first gain amplifying component and the second gain amplifying component.

16. The optical module according to claim 1, wherein the coherent optical component further comprises: A third coupler is connected to the local oscillator light source and divides the local oscillator light into a first sub-local oscillator light and a second sub-local oscillator light; a second coupler connected to the receiving optical fiber adapter, and dividing the first optical signal into a first sub-optical signal and a second sub-optical signal; A second mixer is coupled to the third coupler and the second coupler, and receives the first sub-optical signal and the first sub-local oscillator light; a second balanced receiver connected to the second mixer, performing balanced reception on the received optical signal, and converting the optical signal into a first sub-electrical signal and a second sub-electrical signal; a first transimpedance amplifier, connected to the second balanced receiver, to amplify the first sub-electrical signal; a first automatic gain control unit, connected to the first transimpedance amplifier, and performing gain control on the amplified first sub-electrical signal; A third analog-to-digital converter, connected to the first automatic gain control unit, receives a gain voltage of the automatic gain control unit, and converts the gain voltage into a first voltage digital signal; a second transimpedance amplifier, connected to the second balanced receiver, to amplify the second sub-electrical signal; a second automatic gain control unit, connected to the second transimpedance amplifier, and performing gain control on the amplified second electrical sub-signal; a fourth analog-to-digital converter, connected to the second automatic gain control unit, receiving a gain voltage of the automatic gain control unit, and converting the gain voltage into a second voltage digital signal; The MCU is connected to the third analog-to-digital converter and the fourth analog-to-digital converter, and calculates the optical power according to the first voltage digital signal, the first voltage digital signal and a preset mapping relationship.

17. The optical module according to claim 16, wherein: Calculating the optical power according to the first voltage digital signal, the first voltage digital signal and a preset mapping relationship includes: Calculate the first voltage digital signal and the average value of the first voltage digital signal to obtain an average voltage digital signal; The mapping relationship between the voltage digital signal and the optical power is preset in the MCU. The photocurrent is calculated based on the average voltage digital signal and the mapping relationship, and the optical power is calculated based on the photocurrent.

18. The optical module according to claim 1, wherein: Another optical output interface is connected to the demodulation area and the photoelectric detector respectively; The MCU is configured to be connected to the photodetector and the electrical input interface; the MCU includes a register, which stores a plurality of splitting ratio functions corresponding to temperature; the MCU calls the splitting ratio function according to the temperature, and controls the working current of the electrical input interface of the splitter according to the splitting ratio function and a sampling voltage, wherein the sampling voltage corresponds to the sampling current of the photodetector.

19. The optical module according to claim 18, wherein: The coherent optical component also includes a semiconductor refrigerator, on which the coherent modulation chip and the temperature measuring element are arranged. The semiconductor refrigerator is connected to a power chip, which supplies power to the semiconductor refrigerator, and the power chip is also connected to the MCU.

20. The optical module according to claim 18, wherein: The spectrometer comprises a first interference arm and a second interference arm. A heater is arranged on the first interference arm or the second interference arm. The working current acts on the heater to adjust the splitting ratio of the spectrometer.

21. The optical module according to claim 18, further comprising a digital-to-analog converter; One end of the digital-to-analog converter is connected to the MCU, and the other end is connected to the electrical input interface of the optical splitter.

22. The optical module according to claim 18, wherein: A sampling resistor is provided between the photodetector and the MCU, one end of the sampling resistor is connected to the photodetector, and the other end of the sampling resistor is connected to the MCU.

23. The optical module according to claim 18, wherein: The coherent optical component further includes a driving chip and a transimpedance amplifier chip, wherein the driving chip is connected to the modulation area, and the transimpedance amplifier chip is connected to the demodulation area.

24. The optical module according to claim 23, wherein: The coherent optical component comprises a cover shell and a substrate, wherein the cover shell and the substrate form a storage cavity, and the coherent modulation chip, the driving chip and the transimpedance amplifier chip are arranged in the storage cavity.

25. The optical module according to claim 1, wherein: The coherent modulation chip comprises: A first coupling port, optically connected to the light source, the first coupling port being used to input the local oscillator light; The input end of the optical splitter is connected to the first coupling port, and the optical splitter is configured to split the local oscillator light into multiple local oscillator light splits; a wavelength locker connected to an output end of the optical splitter, the wavelength locker comprising a first waveguide, a second waveguide and a multimode interference coupler, the first waveguide and the second waveguide having different optical paths, and an input end of the multimode interference coupler being respectively connected to the first waveguide and the second waveguide; the wavelength locker is used to split one path of the local oscillator into two beams of light, the two beams of light are transmitted via the first waveguide and the second waveguide, and the multimode interference coupler outputs at least two paths of detection light with different phases; The MCU is electrically connected to the coherent modulation chip and the local oscillator light source respectively, and the MCU is configured to obtain the optical power of the at least two detection lights, determine the wavelength of the local oscillator light according to the optical power and the relationship curve between the optical power and the wavelength stored in the MCU, and adjust the wavelength of the local oscillator light output by the light source according to the wavelength difference between the local oscillator light wavelength and a preset wavelength to achieve wavelength locking.

26. The optical module according to claim 25, wherein: The wavelength locker also includes: A first optical splitter, whose input end is connected to an output end of the optical splitter group, the first optical splitter is used to split the local oscillator light into a first light split and a second light split, the first waveguide is used to transmit the first light split, and the second waveguide is used to transmit the second light split; The multimode interference coupler has an output end including at least two output light ports, so that the first light splitting and the second light splitting interfere with each other to output at least two detection lights with different phases; The photodetector group includes at least two photodetectors, and the photodetectors are used to convert the optical signal of the detection light into an electrical signal and transmit the electrical signal to the MCU.

27. The optical module according to claim 26, wherein: The multimode interference coupler comprises four output light ports, the first split light and the second split light output the first detection light, the second detection light, the third detection light and the fourth detection light through the multimode interference coupler, the first detection light and the second detection light have a phase difference of 90 degrees, the second detection light and the fourth detection light have a phase difference of 90 degrees, and the fourth detection light and the third detection light have a phase difference of 90 degrees; The optical detector group includes four optical detectors, and the four optical detectors convert optical signals of the first detection light, the second detection light, the third detection light, and the fourth detection light into electrical signals respectively.

28. The optical module according to claim 27, wherein: The MCU is configured to receive an electrical signal sent by the detector group, calculate the optical powers of the first detection light, the second detection light, the third detection light, and the fourth detection light, obtain a first optical power difference between the first detection light and the fourth detection light and a second optical power difference between the second detection light and the third detection light, and determine the wavelength of the local oscillator light according to the optical power, the first optical power difference, the second optical power difference, and a relationship curve between the optical power and the wavelength.

29. The optical module according to claim 27, wherein: The MCU is configured to receive an electrical signal sent by the detector group, calculate the optical powers of the first detection light, the second detection light, the third detection light, and the fourth detection light, obtain a first optical power ratio of the first detection light to the fourth detection light and a second optical power ratio of the second detection light to the third detection light, and determine the wavelength of the local oscillator light according to the optical power, the first optical power ratio, the second optical power ratio, and a relationship curve between the optical power and the wavelength.

30. The optical module according to claim 25, wherein: The MCU is further configured to adjust the ambient temperature of the light source according to the wavelength difference between the local oscillator light wavelength and the preset wavelength, so as to adjust the wavelength of the local oscillator light output by the light source.

31. The optical module according to claim 25, wherein: The MCU is further configured to adjust the driving current transmitted to the light source according to the wavelength difference between the wavelength of the local oscillator light and the preset wavelength, so as to adjust the wavelength of the local oscillator light output by the light source.

32. The optical module according to claim 25, wherein: The optical splitter comprises: a directional coupler, wherein an input end of the directional coupler is connected to the first coupling port, and a first output end of the directional coupler is connected to the wavelength locker; A second optical splitter, whose input end is connected to the second output end of the directional coupler, and whose first output end is connected to the polarization balanced detector group; The third optical splitter has an input end connected to the second output end of the second optical splitter, and output ends of the third optical splitter are respectively connected to the bi-coherent modulators.

33. The optical module according to claim 25, wherein: The relationship curve between the optical power and the wavelength is a cosine curve, and the detection period of the relationship curve is determined according to the preset wavelength of the local oscillation light and the optical path difference between the first waveguide and the second waveguide.

34. An optical module, comprising: The receiving photodetector generates a photocurrent in response to the first light signal; A transimpedance amplifier receives the photogenerated current, amplifies the photogenerated current, and outputs a voltage signal; The analog-to-digital conversion sampler converts the voltage signal into an AD sampling value and transmits the AD sampling value to the MCU; MCU, calculates and reports the optical power according to the AD sampling value, the frequency of the first optical signal and the optical power formula; The optical power formula is: P = P1 - P2 (1); In formula (1), P1 is the reference optical power, and P2 is the current frequency deviation; The reference optical power is a functional relationship between the AD sampling value and the reference optical power when the frequency of the first optical signal is the first frequency at the first temperature; The frequency deviation is a functional relationship between a frequency difference and a frequency at the first temperature, wherein the frequency difference is a difference between optical powers corresponding to different frequencies and a reference optical power.

35. The optical module according to claim 34, wherein: The current frequency deviation includes a first frequency broken line segment and a second frequency broken line segment; The first frequency broken line segment is: The second frequency broken line segment is: In formulas (3) and (4), V is the current frequency, V1 is the first frequency, V3 is the third frequency, V2 is the second frequency, A2 is the difference between the current optical power and the reference optical power when the frequency is the second frequency, and A3 is the difference between the current optical power and the reference optical power when the frequency is the third frequency. The second frequency is less than the first frequency; The third frequency is greater than the first frequency.

36. The optical module according to claim 34, wherein: The reference optical power formula is: P1 = aln(AD) + b (2); In formula (2), AD is the current AD sampling value, a is the formula coefficient, and b is a constant.

37. The optical module according to claim 34, wherein: The frequency of the first optical signal is greater than or equal to 191.3 THz, and the frequency of the first optical signal is less than or equal to 196.1 THz.

38. The optical module according to claim 34, wherein: The frequency of the first optical signal is greater than or equal to a frequency minimum value, and the frequency of the first optical signal is less than or equal to a frequency maximum value; the difference between the frequency maximum value and the frequency minimum value is a frequency difference value; The ratio of the difference between the first frequency and the minimum frequency value to the frequency extreme difference value is 40% to 60%.

39. The optical module according to claim 34, wherein: The frequency of the first optical signal is greater than or equal to 191.3 THz, and the frequency of the first optical signal is less than or equal to 196.1 THz.

40. The optical module according to claim 34, wherein: The first temperature is any temperature point between 23 and 27°C.

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