A DSP loading and unloading adaptive force detection control method and device

By real-time detection and adjustment of the robot posture, the problem of uneven force in wafer manufacturing is solved, and the uniform force and flat placement of wafers during loading and unloading is achieved, improving work efficiency and accuracy of wafer manufacturing.

CN119820470BActive Publication Date: 2025-09-05BEIJING SUNTAG INTELLIGENT EQUIPMENT CO LTD
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Patent Information

Application Number
CN202510142716.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-02-10
Publication Date
2025-09-05
Estimated Expiration
2045-02-10

AI Technical Summary

Technical Problem

During the wafer manufacturing process, during the loading and unloading process of double-sided grinding and polishing equipment, the wafer is unevenly subjected to the force, resulting in the inability to absorb the wafer, drop the wafer or not being placed in place, which affects the working efficiency and may damage the crystal. The prior art has low efficiency by manually waiting to adjust the movement point.

Method used

By real-time detection of the force sensor pressure value when the robot absorbs the crystal, adjust the robot posture according to the preset pressure value and the difference value, adaptive force control is achieved, ensuring that the wafer is subjected to uniform force during loading and unloading, avoiding damage and improper placement.

Benefits of technology

The force uniformity detection and adjustment of the wafer during loading and unloading is achieved, which avoids damage to the wafer, improves working efficiency and accuracy, and ensures a smooth fit between the wafer and the platform.

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Abstract

The present invention discloses a DSP loading and unloading adaptive force detection control method, comprising the following steps: a manipulator sucks the wafer and moves downward and detects the real-time pressure values ​​of three force sensors in real time; when any real-time pressure value is detected to be greater than a preset pressure value, the manipulator stops to adjust its posture, determines whether to continue to move downward and repeats the above process until the three real-time pressure values ​​are all greater than the preset pressure value, calculates the difference between the three real-time pressure values ​​and the current average pressure value, and adjusts the manipulator posture accordingly until the three differences are all less than the threshold pressure value, determines whether the three real-time pressure values ​​are greater than the alarm pressure value, and adjusts the manipulator position accordingly. The present invention monitors the force in real time and compares it with the set value in real time, controls the robot's action posture during the loading and unloading process, and makes the wafer evenly stressed during the loading and unloading process to avoid damage. The present invention also discloses a device, an electronic device, and a computer-readable storage medium for implementing the above method.
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Description

Technical Field

[0001] The present invention relates to the field of wafer manufacturing technology, and in particular to a DSP loading and unloading adaptive force detection control method and device. Background Art

[0002] The key process in wafer manufacturing is double-sided grinding and polishing of the wafer surface. Currently, during the automatic loading and unloading process of the double-sided grinding and polishing equipment (DSP), it is completed by a robot performing fixed-point movement. In actual work, the grinding paper will become thinner and thinner over time, resulting in uneven force on the wafer during the loading and unloading process, which can easily cause the wafer to fail to be sucked up, fall off, or not be placed in place. It is necessary to continuously adjust the movement points over time during the production process, affecting work efficiency and causing damage to the wafer. During the unloading process of the double-sided grinding and polishing equipment (DSP), when the suction cup moves upward to lift the wafer, the adsorption force between the wafer and the grinding paper is very strong, resulting in the suction cup being unable to absorb the wafer, causing the wafer to fall or be damaged. The existing technology is to manually increase the waiting time, the waiting time is fixed, and the overall lifting time is long, affecting the lifting efficiency. Summary of the Invention

[0003] In order to solve the above problems existing in the prior art, the present invention provides a DSP loading and unloading adaptive force detection control method, device, electronic device and storage medium. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0004] A first aspect of an embodiment of the present invention provides a DSP loading and unloading adaptive force detection control method, comprising the following steps:

[0005] First detection step: The robot picks up the wafer and moves it downward, and detects the real-time pressure values ​​of the three force sensors in real time;

[0006] When it is detected that at least one real-time pressure value is greater than a preset pressure value, a stop instruction is sent to the manipulator; wherein the preset pressure value includes: a loading preset pressure value or a unloading preset pressure value;

[0007] Sending a posture adjustment instruction to the manipulator according to the difference between each real-time pressure value and the preset pressure value, and when at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, returning to the first detection step until all three real-time pressure values ​​are greater than the preset pressure value;

[0008] When the three real-time pressure values ​​are all greater than the preset pressure value, a posture readjustment instruction is sent to the manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values;

[0009] When the differences between the three real-time pressure values ​​after readjustment and the current average pressure value are all less than the threshold pressure value, it is determined whether at least one real-time pressure value is greater than or equal to the alarm pressure value; wherein the alarm pressure value includes: the loading alarm pressure value or the unloading alarm pressure value;

[0010] When at least one real-time pressure value is greater than or equal to the alarm pressure value, an upward movement instruction is sent to the manipulator until all three real-time pressure values ​​are less than the alarm pressure value.

[0011] In one embodiment of the present invention, the step of sending a posture adjustment instruction to the manipulator according to the difference between each real-time pressure value and the preset pressure value, and returning to the first detection step when at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, until all three real-time pressure values ​​are greater than the preset pressure value, includes:

[0012] Calculating a first difference between each of the real-time pressure values ​​and a preset pressure value;

[0013] Determining the real-time flip angle of the manipulator corresponding to each real-time pressure value according to each of the first differences and the conversion coefficient between the force deviation value and the flip angle;

[0014] Send a posture adjustment instruction to the manipulator according to the real-time flip angle of each manipulator. When at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, return to the first detection step until all three real-time pressure values ​​are greater than the preset pressure value.

[0015] In one embodiment of the present invention, when the three real-time pressure values ​​are all greater than the preset pressure value, sending a posture readjustment instruction to the manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values ​​includes:

[0016] When the three real-time pressure values ​​are all greater than the preset pressure value, respectively calculating a second difference between each real-time pressure value and the current average pressure value of the three real-time pressure values;

[0017] Determining a balanced flip angle of the manipulator corresponding to each real-time pressure value according to the second difference and a conversion coefficient between the force deviation value and the flip angle;

[0018] A posture readjustment instruction is sent to the manipulator according to the balanced flip angle of the manipulator.

[0019] In one embodiment of the present invention, when the preset pressure value is a blanking preset pressure value and the alarm pressure value is a blanking alarm pressure value, the method further includes:

[0020] Second detection step: During the unloading process, the robot picks up the wafer and moves upward from the unloading position, detecting the real-time tensile force values ​​of the three force sensors in real time;

[0021] When it is detected that at least one real-time tension value is greater than or equal to the preset tension value for blanking, a stop command is sent to the manipulator, and according to the differences between the three real-time tension values ​​and the preset tension value for blanking, a posture adjustment command is sent to the manipulator until the three real-time tension values ​​are all less than the preset tension value for blanking;

[0022] When it is detected that the three adjusted real-time tension values ​​are all less than the preset tension value for blanking, the process returns to the second detection step until the robot moves up to the target position and stops moving.

[0023] A second aspect of an embodiment of the present invention provides a DSP loading and unloading adaptive force detection and control device, comprising:

[0024] The detection module is used to perform the first detection step: the manipulator sucks the wafer and moves it downward, and detects the real-time pressure values ​​of the three force sensors in real time;

[0025] A sending module is used to send a stop instruction to the manipulator when it is detected that at least one real-time pressure value is greater than a preset pressure value; wherein the preset pressure value includes: a loading preset pressure value or a unloading preset pressure value;

[0026] a calculation and adjustment module, configured to send a posture adjustment instruction to the manipulator according to the difference between each real-time pressure value and the preset pressure value, and return to the first detection step when at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, until all three real-time pressure values ​​are greater than the preset pressure value;

[0027] a calculation and transmission module, configured to send a posture readjustment instruction to the manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values ​​when all three real-time pressure values ​​are greater than a preset pressure value;

[0028] a judgment module, configured to judge whether at least one real-time pressure value is greater than or equal to an alarm pressure value when the differences between the three real-time pressure values ​​after readjustment and the current average pressure value are all less than a threshold pressure value; wherein the alarm pressure value includes: a loading alarm pressure value or a unloading alarm pressure value;

[0029] The judgment and adjustment module is used to send an upward movement instruction to the manipulator when at least one real-time pressure value is greater than or equal to the alarm pressure value, until the three real-time pressure values ​​are all less than the alarm pressure value.

[0030] In one embodiment of the present invention, the calculation adjustment module is further configured to:

[0031] Calculating a first difference between each of the real-time pressure values ​​and a preset pressure value;

[0032] Determining the real-time flip angle of the manipulator corresponding to each real-time pressure value according to each of the first differences and the conversion coefficient between the force deviation value and the flip angle;

[0033] Send a posture adjustment instruction to the manipulator according to the real-time flip angle of each manipulator. When at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, return to the first detection step until all three real-time pressure values ​​are greater than the preset pressure value.

[0034] In one embodiment of the present invention, the calculation and sending module is further configured to:

[0035] When the three real-time pressure values ​​are all greater than the preset pressure value, respectively calculating a second difference between each real-time pressure value and the current average pressure value of the three real-time pressure values;

[0036] Determining a balanced flip angle of the manipulator corresponding to each real-time pressure value according to the second difference and a conversion coefficient between the force deviation value and the flip angle;

[0037] A posture readjustment instruction is sent to the manipulator according to the balanced flip angle of the manipulator.

[0038] In one embodiment of the present invention, it further comprises:

[0039] The detection module is further configured to perform a second detection step: during the unloading process, the robot arm picks up the wafer and moves upward from the unloading position, and detects the real-time pulling force values ​​of the three force sensors in real time;

[0040] The calculation and adjustment module is further configured to send a stop instruction to the manipulator when it is detected that at least one real-time tension value is greater than or equal to a preset tension value for blanking, and send a posture adjustment instruction to the manipulator according to the differences between the three real-time tension values ​​and the preset tension value for blanking, until all three real-time tension values ​​are less than the preset tension value for blanking;

[0041] The sending module is further configured to return to the second detection step when it is detected that the three adjusted real-time tension values ​​are all less than the preset tension value for blanking, until the robot moves up to the target position and stops moving.

[0042] A third aspect of an embodiment of the present invention provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and runnable on the processor. When the processor executes the program, a DSP loading and unloading adaptive force detection control method provided by the first aspect of an embodiment of the present invention is implemented.

[0043] A fourth aspect of an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the method for adaptive force detection and control of DSP loading and unloading provided by the first aspect of an embodiment of the present invention is implemented.

[0044] Beneficial effects of the present invention:

[0045] The present invention intelligently controls the wafer placement process based on real-time monitoring of force changes, continuously adjusts the angle according to real-time monitoring during the process, and thus adjusts the force on the wafer, so that the wafer is evenly stressed during loading and unloading, avoiding damage to the wafer caused by excessive force on the wafer and the phenomenon of the wafer not being placed in place or not being able to be taken up due to insufficient pressure on the wafer. It can also detect whether the wafer is placed flat and whether there is any deviation, realize real-time detection of the wafer loading effect, and improve work efficiency and accuracy. In addition, the wafer and the platform are better fitted, and the contact force is controllable, avoiding damage caused by excessive force.

[0046] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purposes and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0047] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0049] Figure 1 A flow chart of a DSP loading and unloading adaptive force detection control method provided by an embodiment of the present invention;

[0050] Figure 2 A block diagram of a DSP loading and unloading adaptive force detection control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0051] The present invention will be further described in detail below with reference to specific examples, but the embodiments of the present invention are not limited thereto.

[0052] like Figure 1 As shown, the first aspect of the embodiment of the present invention provides a DSP loading and unloading adaptive force detection control method, including the following steps:

[0053] Step 11, first detection step: the robot arm picks up the wafer and moves downward, and detects the real-time pressure values ​​of the three force sensors in real time.

[0054] Step 12: When it is detected that at least one real-time pressure value is greater than a preset pressure value, a stop instruction is sent to the robot arm.

[0055] Among them, when loading, the preset pressure value is the loading preset pressure value, and when unloading, the preset pressure value is the unloading preset pressure value.

[0056] Step 13: Send a posture adjustment instruction to the manipulator based on the difference between each real-time pressure value and the preset pressure value. When at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, return to step 11 until all three real-time pressure values ​​are greater than the preset pressure value.

[0057] Step 14: When the three real-time pressure values ​​are all greater than the preset pressure value, a posture readjustment instruction is sent to the manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values.

[0058] Step 15: When the differences between the three real-time pressure values ​​after readjustment and the current average pressure value are all smaller than the threshold pressure value, it is determined whether at least one real-time pressure value is greater than or equal to the alarm pressure value.

[0059] Among them, when loading, the alarm pressure value is the loading alarm pressure value, and when unloading, the alarm pressure value is the unloading alarm pressure value.

[0060] Step 16: When at least one real-time pressure value is greater than or equal to the alarm pressure value, an upward movement instruction is sent to the manipulator until all three real-time pressure values ​​are less than the alarm pressure value.

[0061] In this embodiment, the wafer placement process is intelligently controlled based on real-time monitoring of the wafer force. During the process, the angle is continuously adjusted based on real-time monitoring, thereby adjusting the wafer force. This ensures that the wafer is evenly stressed during loading and unloading, avoiding damage to the wafer due to excessive force and the phenomenon of the wafer not being properly placed or removed due to insufficient placement pressure. It can also detect whether the wafer is placed flat and whether there is any deviation, realizing real-time detection of the wafer loading effect, improving work efficiency and accuracy. In addition, the wafer and the platform are better aligned, and the contact force is controllable, avoiding damage caused by excessive force.

[0062] A second aspect of an embodiment of the present invention provides a DSP loading and unloading adaptive force detection control method, when the preset pressure value is the loading preset pressure value and the alarm pressure value is the loading alarm pressure value, the wafer loading process is at this time, including the following steps:

[0063] Here, three wafer suction cups are installed at the front of the robot, spaced evenly around the circumference. Cups 1, 2, and 3 correspond to the robot's flip angles u, v, and w. A force sensor is installed at the bottom of the cups to detect force changes. A preset pressure value, P10, is set for normal loading and unloading, while a loading alarm pressure value, P11, is set. P10 is the lower limit for normal loading, and P11 is the upper limit. The loading alarm pressure value, P11, must be less than the maximum allowable value for the process.

[0064] In step 21 , the robot arm picks up the wafer and moves downward from above the loading position, and detects the real-time pressure values ​​of the three force sensors in real time.

[0065] Step 22: determine whether at least one real-time pressure value detected is greater than a preset loading pressure value.

[0066] The robot picks up and places a wafer through the suction and exhaust of three suction cups. During the loading process on the DSP (Double Side Polishing) machine, the robot grasps the wafer and moves from the upper loading position to the lower loading position, monitoring the force sensors of the three suction cups in real time. This process provides real-time detection and judgment.

[0067] Step 23: When it is detected that any of the real-time pressure values ​​is greater than the preset loading pressure value, a stop command is sent to the robot.

[0068] Here, if the real-time pressure value of any one or two of the three sensors is greater than the preset loading pressure value, or if all three real-time pressure values ​​are detected to be greater than the preset loading pressure value for the first time, it indicates that the wafer has touched the grinding paper at the loading position. However, this indicates that the force on the wafer is uneven. At this time, it is necessary to send a stop-pressing command to the robot arm, causing the robot arm to stop moving downward and then make adjustments to prevent damage to the wafer due to uneven force. If the real-time pressure values ​​of all sensors are less than or equal to the preset loading pressure value, it indicates that the wafer has not moved into place and no adjustment is required. The robot arm will continue to move downward until it detects that the real-time pressure value is greater than the preset loading pressure value, at which point the robot arm will stop moving.

[0069] Step 24, based on the difference between each real-time pressure value and the preset loading pressure value, send a posture adjustment instruction to the robot arm. When at least one of the adjusted real-time pressure values ​​is less than or equal to the preset loading pressure value, return to step 21 until all three real-time pressure values ​​are greater than the preset loading pressure value.

[0070] The specific steps of step 24 include step 241 to step 247:

[0071] Step 241: Calculate the first difference between each real-time pressure value and the preset loading pressure value. Calculate the first difference ΔP between each of the three real-time pressure values ​​and the preset loading pressure value. For example, the first difference ΔP1 corresponding to the real-time pressure value P1 of the first force sensor is P1 - P10. The first difference ΔP2 corresponding to the real-time pressure value P2 of the second force sensor is P2 - P10. The first difference ΔP3 corresponding to the real-time pressure value P3 of the third force sensor is P3 - P10.

[0072] Step 242: Determine the real-time manipulator flip angle corresponding to each real-time pressure value based on each first difference and the conversion coefficient k between the force deviation value and the flip angle. Real-time manipulator flip angle = ΔP × k. For example, the real-time manipulator flip angle u corresponding to the real-time pressure value P1 of the first sensor is ΔP1 × k, the real-time manipulator flip angle v corresponding to the real-time pressure value P2 of the second sensor is ΔP2 × k, and the real-time manipulator flip angle w corresponding to the real-time pressure value P1 of the third sensor is ΔP3 × k. The conversion coefficient k between the force deviation value and the flip angle is preset.

[0073] Step 243: Send a posture adjustment instruction to the corresponding manipulator according to the real-time flip angle of each manipulator.

[0074] Here, the real-time flip angles of the three manipulators correspond to corresponding coordinate values ​​in the manipulator coordinate system. After the manipulator receives the posture adjustment instruction, the manipulator moves according to the coordinates to make the suction cup rotate to the corresponding real-time flip angle of the manipulator.

[0075] Step 244 : Detect the real-time pressure values ​​of the three adjusted force sensors in real time.

[0076] Step 245 , determining whether the detected at least one adjusted real-time pressure value is less than or equal to the preset loading pressure value.

[0077] Step 246 , when the detected at least one adjusted real-time pressure value is less than or equal to the preset loading pressure value, return to step 21 .

[0078] Here, among the three adjusted real-time pressure values, at least one real-time pressure value is less than or equal to the preset loading pressure value, and the process returns to step 21 . The manipulator needs to continue to move downward (press downward) and continue to detect, judge, and adjust.

[0079] Step 247 , when the three real-time pressure values ​​detected after adjustment are all greater than the preset loading pressure value, execute step 25 .

[0080] Step 25 : Sending a posture readjustment instruction to the corresponding manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values.

[0081] The specific steps of step 25 include step 251 to step 253:

[0082] Step 251 : When the three real-time pressure values ​​are all greater than the preset loading pressure value, second differences between the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values ​​are calculated respectively.

[0083] Here, the current average pressure value P0 of the three real-time pressure values ​​is calculated first, and then the differences ΔP21, ΔP22, and ΔP23 between the three real-time pressure values ​​and P0 are calculated respectively.

[0084] Step 252: Determine the three manipulator balanced flip angles corresponding to each real-time pressure value based on the second difference and the conversion coefficient k between the force deviation value and the flip angle. The three manipulator balanced flip angles are ΔP21×k, ΔP22×k, and ΔP23×k, respectively.

[0085] Step 253: The manipulator sends a posture readjustment instruction based on the manipulator's balanced flip angle. After receiving the posture readjustment instruction, the manipulator flips to make the suction cup move to a balanced flip angle.

[0086] Step 26: After the adjustment is completed, the three real-time pressure values ​​after adjustment are detected, and the current average pressure value after the three real-time pressure values ​​are adjusted is calculated.

[0087] Step 27 , determining whether the differences between the three adjusted real-time pressure values ​​and the current average pressure value are all smaller than a threshold pressure value.

[0088] Step 28: When the differences between the three adjusted real-time pressure values ​​and the current average pressure value are all less than the threshold pressure value, determine whether at least one of the adjusted real-time pressure values ​​is greater than or equal to the feeding alarm pressure value.

[0089] Here, if the differences between the three adjusted real-time pressure values ​​and the current average pressure value are all less than the threshold pressure value, it means that the pressure values ​​of the three suction cups are relatively close to each other, which means that the wafer is evenly stressed in three directions, and the wafer and the loading platform are basically parallel, thereby ensuring that the wafer is placed flat, avoiding deviations, and realizing real-time detection of the wafer loading effect.

[0090] Step 29: If at least one of the adjusted real-time pressure values ​​is greater than or equal to the loading alarm pressure value, an upward movement instruction is sent to the robot arm until all three real-time pressure values ​​are less than the loading alarm pressure value.

[0091] Step 30: If the three adjusted real-time pressure values ​​are all less than the loading alarm pressure value, loading is performed, a placement instruction is sent to the robot, and the suction cup of the robot releases the wafer.

[0092] Step 31 : When the difference between the adjusted at least one real-time pressure value and the current average pressure value is greater than or equal to the threshold pressure value, return to step 25 .

[0093] In this step, the forces on the wafer in three directions are relatively uneven, and it is necessary to return to step 25 for further adjustment.

[0094] This embodiment is a process for controlling the suction cup pressure during the loading process. The following is a detailed description of the control process of the suction cup pressure during the unloading process:

[0095] A DSP unloading and loading adaptive force detection control method, when the preset pressure value is the unloading preset pressure value and the alarm pressure value is the unloading alarm pressure value, is a wafer unloading process, including the following steps:

[0096] During the unloading process, the robot needs to first move down to the unloading position to pick up the wafer, and then move up to take away the wafer. The control method for the robot to move down to pick up the wafer is the same as the method of steps 21 to 31 above. The difference is that during the execution process, the loading preset pressure value and the loading alarm pressure value are replaced with the unloading preset pressure value and the unloading alarm pressure value respectively, and in step 21, the robot picks up the wafer and moves downward from the unloading position. After executing steps 21 to 31 to complete the wafer pickup, the robot moves upward to take away the wafer, which is steps 41 to 44:

[0097] Step 41: The robot arm picks up the wafer and moves upward from the unloading position, detecting the real-time pulling force values ​​of the three force sensors in real time. Here, the robot arm pulls up the wafer, but the wafer has not yet left the unloading platform.

[0098] During the unloading process, the robot grabs the wafer and pulls the wafer up from the wafer unloading position, and the force sensors of the three suction cups are detected in real time.

[0099] Step 42: determine whether the at least one real-time tension value detected is greater than or equal to a preset tension value for blanking. The preset tension value for blanking is the upper limit of the pressure value during blanking operation.

[0100] Step 43: When it is detected that the three real-time pulling force values ​​are all less than the preset pulling force value for blanking, the process returns to step 41 and stops moving upward after the robot moves to the target position.

[0101] In step 44, when at least one real-time tension value is detected to be greater than or equal to the preset tension value for blanking, a stop command is sent to the robot. At this point, the robot stops pulling the wafer. Based on the difference between the three real-time tension values ​​and the preset tension value for blanking, posture adjustment commands are sent to the corresponding robot until all three real-time tension values ​​are detected to be less than the preset tension value for blanking.

[0102] The specific steps of step 44 include: step 441 to step 448:

[0103] Here, the method of sending a posture adjustment instruction to the corresponding manipulator according to the difference between at least one real-time tension value and the preset tension value for blanking is the same as the calculation method of steps 241 to 243, for example:

[0104] Step 441: When it is detected that at least one of the real-time tension values ​​is greater than or equal to the preset tension value for blanking, a stop command is sent to the robot arm, and the robot arm stops moving.

[0105] Step 442 , calculating the difference between each real-time tension value and the preset tension value for blanking.

[0106] Step 443: Determine the real-time flip angle of the manipulator corresponding to the real-time tension value based on each difference and the conversion coefficient k between the force deviation value and the flip angle. Multiply each difference by k to obtain the real-time flip angle of the manipulator corresponding to the real-time tension value.

[0107] Step 444: Send a posture adjustment instruction to the manipulator according to the real-time flip angle of the manipulator.

[0108] After receiving the posture adjustment instruction, the manipulator flips to make the suction cup flip to the real-time flip angle.

[0109] Step 445 : Detect the real-time tension values ​​of the three adjusted force sensors in real time.

[0110] Step 446 , determining whether there is at least one real-time tension value detected after adjustment that is greater than or equal to the preset tension value for blanking.

[0111] Step 447 , when the detected at least one adjusted real-time tension value is greater than or equal to the preset tension value for blanking, return to step 442 .

[0112] Step 448 , when the three real-time tension values ​​detected after adjustment are all less than the preset tension value for blanking, return to step 41 until the robot moves up to the target position and stops moving up.

[0113] In this embodiment, the wafer retrieval process is intelligently controlled based on real-time monitoring of the force applied to the wafer. During the process, the angle is continuously adjusted based on the real-time monitoring, thereby adjusting the force applied to the wafer so that the force applied to the wafer is uniform during the unloading process. This avoids damage to the wafer due to excessive force and the inability to remove the wafer due to insufficient pressure, thereby improving work efficiency and accuracy.

[0114] like Figure 2 As shown, the third aspect of the embodiment of the present invention provides a DSP guide loading and unloading adaptive force detection control device, comprising:

[0115] The detection module 51 is used to perform the first detection step: the robot picks up the wafer and moves it downward, and detects the real-time pressure values ​​of the three force sensors in real time;

[0116] The sending module 52 is used to send a stop instruction to the manipulator when it is detected that at least one real-time pressure value is greater than a preset pressure value; wherein the preset pressure value includes: a preset pressure value for loading or a preset pressure value for unloading;

[0117] a calculation and adjustment module 53 for sending a posture adjustment instruction to the manipulator according to the difference between each real-time pressure value and a preset pressure value, and returning to the first detection step when at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, until all three real-time pressure values ​​are greater than the preset pressure value;

[0118] a calculation and transmission module 54 for sending a posture readjustment instruction to the manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values ​​when all three real-time pressure values ​​are greater than a preset pressure value;

[0119] The judgment module 55 is configured to judge whether at least one of the real-time pressure values ​​is greater than or equal to the alarm pressure value when the differences between the three real-time pressure values ​​after readjustment and the current average pressure value are all less than the threshold pressure value; wherein the alarm pressure value includes: the loading alarm pressure value or the unloading alarm pressure value;

[0120] The judgment and adjustment module 56 is configured to send an upward movement instruction to the manipulator when at least one real-time pressure value is greater than or equal to the alarm pressure value, until all three real-time pressure values ​​are less than the alarm pressure value.

[0121] In one embodiment of the present invention, the calculation adjustment module 53 is further configured to:

[0122] Calculating a first difference between each real-time pressure value and a preset pressure value;

[0123] Determine the real-time flip angle of the manipulator corresponding to each real-time pressure value according to each first difference value and the conversion coefficient between the force deviation value and the flip angle;

[0124] Send a posture adjustment instruction to the manipulator according to the real-time flip angle of each manipulator. When at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, return to the first detection step until all three real-time pressure values ​​are greater than the preset pressure value.

[0125] In one embodiment of the present invention, the calculation and sending module 54 is further configured to:

[0126] When the three real-time pressure values ​​are all greater than the preset pressure value, respectively calculating a second difference between each real-time pressure value and the current average pressure value of the three real-time pressure values;

[0127] Determine the manipulator's balanced flip angle corresponding to each real-time pressure value based on the second difference and the conversion coefficient between the force deviation value and the flip angle;

[0128] Send posture readjustment instructions to the robot according to the robot's balanced flip angle.

[0129] In one embodiment of the present invention, it further comprises:

[0130] The detection module 51 is further configured to perform a second detection step: during the unloading process, the manipulator picks up the wafer and moves upward from the unloading position, and detects the real-time pulling force values ​​of the three force sensors in real time;

[0131] The calculation and adjustment module 53 is further configured to send a stop instruction to the manipulator when it is detected that at least one real-time tension value is greater than or equal to the preset tension value for blanking, and send a posture adjustment instruction to the manipulator according to the differences between the three real-time tension values ​​and the preset tension values ​​for blanking, until all three real-time tension values ​​are less than the preset tension value for blanking;

[0132] The sending module 52 is further configured to return to the second detection step when it is detected that the three adjusted real-time tension values ​​are all less than the preset tension value for blanking, until the robot moves up to the target position and stops moving.

[0133] The fourth aspect of an embodiment of the present invention provides an electronic device, including a memory, a processor, and a computer program stored in the memory and runnable on the processor. When the processor executes the program, it implements a DSP loading and unloading adaptive force detection control method provided by the above-mentioned embodiment of the present invention.

[0134] The fifth aspect of the embodiments of the present invention further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the DSP loading and unloading adaptive force detection control method provided by the above-mentioned embodiment of the present invention are implemented.

[0135] The memory may include random access memory (RAM) or non-volatile memory (NVM), such as at least one disk storage. Alternatively, the memory may be at least one storage device located away from the processor.

[0136] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware systems.

[0137] The method provided in the embodiments of the present invention can be applied to electronic devices. Specifically, the electronic devices can be desktop computers, portable computers, smart mobile terminals, servers, etc. This is not limited here; any electronic device that can implement the present invention falls within the scope of protection of the present invention.

[0138] As for the device / electronic device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0139] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0140] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0141] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0142] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A DSP loading and unloading adaptive force detection control method, characterized in that: The following steps are involved: The first detection step: The robot picks up the wafer and moves it downward, detecting the real-time pressure values ​​of three force sensors in real time. The front end of the robot is equipped with three wafer suction cups, which are evenly spaced around the circumference. When it is detected that at least one real-time pressure value is greater than a preset pressure value, a stop instruction is sent to the manipulator; wherein the preset pressure value includes: a loading preset pressure value or a unloading preset pressure value; Calculating a first difference between each of the real-time pressure values ​​and a preset pressure value; Determining the real-time flip angle of the manipulator corresponding to each real-time pressure value according to each of the first differences and the conversion coefficient between the force deviation value and the flip angle; Sending a posture adjustment instruction to the manipulator according to the real-time flip angle of each manipulator, and when at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, returning to the first detection step until all three real-time pressure values ​​are greater than the preset pressure value; When the three real-time pressure values ​​are all greater than the preset pressure value, a posture readjustment instruction is sent to the manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values; When the differences between the three real-time pressure values ​​after readjustment and the current average pressure value are all less than the threshold pressure value, it is determined whether at least one real-time pressure value is greater than or equal to the alarm pressure value; wherein the alarm pressure value includes: the loading alarm pressure value or the unloading alarm pressure value; When at least one real-time pressure value is greater than or equal to the alarm pressure value, an upward movement instruction is sent to the manipulator until all three real-time pressure values ​​are less than the alarm pressure value.

2. The method according to claim 1, wherein When the three real-time pressure values ​​are all greater than the preset pressure value, sending a posture readjustment instruction to the manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values, including: When the three real-time pressure values ​​are all greater than the preset pressure value, respectively calculating a second difference between each real-time pressure value and the current average pressure value of the three real-time pressure values; Determining a balanced flip angle of the manipulator corresponding to each real-time pressure value according to the second difference and a conversion coefficient between the force deviation value and the flip angle; A posture readjustment instruction is sent to the manipulator according to the balanced flip angle of the manipulator.

3. The method according to claim 1, wherein When the preset pressure value is a blanking preset pressure value and the alarm pressure value is a blanking alarm pressure value, the method further includes: Second detection step: During the unloading process, the robot picks up the wafer and moves upward from the unloading position, detecting the real-time tensile force values ​​of the three force sensors in real time; When it is detected that at least one real-time tension value is greater than or equal to the preset tension value for blanking, a stop command is sent to the manipulator, and according to the differences between the three real-time tension values ​​and the preset tension value for blanking, a posture adjustment command is sent to the manipulator until the three real-time tension values ​​are all less than the preset tension value for blanking; When it is detected that the three adjusted real-time tension values ​​are all less than the preset tension value for blanking, the process returns to the second detection step until the robot moves up to the target position and stops moving.

4. A DSP loading and unloading adaptive force detection control device, characterized in that: include: The detection module is used to perform the first detection step: the robot arm sucks the wafer and moves it downward, and detects the real-time pressure values ​​of three force sensors in real time; wherein, three wafer suction cups are installed at the front end of the robot arm and are evenly spaced around the circumference; A sending module is used to send a stop instruction to the manipulator when it is detected that at least one real-time pressure value is greater than a preset pressure value; wherein the preset pressure value includes: a loading preset pressure value or a unloading preset pressure value; a calculation and adjustment module, configured to send a posture adjustment instruction to the manipulator according to the difference between each real-time pressure value and the preset pressure value, and return to the first detection step when at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, until all three real-time pressure values ​​are greater than the preset pressure value; a calculation and transmission module, configured to send a posture readjustment instruction to the manipulator according to the three real-time pressure values ​​and the current average pressure value of the three real-time pressure values ​​when all three real-time pressure values ​​are greater than a preset pressure value; a judgment module, configured to judge whether at least one real-time pressure value is greater than or equal to an alarm pressure value when the differences between the three real-time pressure values ​​after readjustment and the current average pressure value are all less than a threshold pressure value; wherein the alarm pressure value includes: a loading alarm pressure value or a unloading alarm pressure value; a judgment and adjustment module, configured to send an upward movement instruction to the manipulator when at least one real-time pressure value is greater than or equal to the alarm pressure value, until all three real-time pressure values ​​are less than the alarm pressure value; The calculation adjustment module is further used to: Calculating a first difference between each of the real-time pressure values ​​and a preset pressure value; Determining the real-time flip angle of the manipulator corresponding to each real-time pressure value according to each of the first differences and the conversion coefficient between the force deviation value and the flip angle; Send a posture adjustment instruction to the manipulator according to the real-time flip angle of each manipulator. When at least one of the adjusted real-time pressure values ​​is less than or equal to the preset pressure value, return to the first detection step until all three real-time pressure values ​​are greater than the preset pressure value.

5. The device according to claim 4, characterized in that The calculation and sending module is further used to: When the three real-time pressure values ​​are all greater than the preset pressure value, respectively calculating a second difference between each real-time pressure value and the current average pressure value of the three real-time pressure values; Determining a balanced flip angle of the manipulator corresponding to each real-time pressure value according to the second difference and a conversion coefficient between the force deviation value and the flip angle; A posture readjustment instruction is sent to the manipulator according to the balanced flip angle of the manipulator.

6. The device according to claim 5, characterized in that Also includes: The detection module is further configured to perform a second detection step: during the unloading process, the robot arm picks up the wafer and moves upward from the unloading position, and detects the real-time pulling force values ​​of the three force sensors in real time; The calculation and adjustment module is further configured to send a stop instruction to the manipulator when it is detected that at least one real-time tension value is greater than or equal to a preset tension value for blanking, and send a posture adjustment instruction to the manipulator according to the differences between the three real-time tension values ​​and the preset tension value for blanking, until all three real-time tension values ​​are less than the preset tension value for blanking; The sending module is further configured to return to the second detection step when it is detected that the three adjusted real-time tension values ​​are all less than the preset tension value for blanking, until the robot moves up to the target position and stops moving.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the DSP loading and unloading adaptive force detection control method according to any one of claims 1 to 3 is implemented.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the DSP loading and unloading adaptive force detection control method according to any one of claims 1 to 3 is implemented.

Citation Information

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