PCB and bottom shell rubberizing and assembling all-in-one machine

Abstract

The invention relates to the technical field of LED production, and discloses a PCB and bottom shell rubberizing and assembling all-in-one machine which comprises a rack, a PCB feeding device, a bottom shell feeding device, a rubberizing detection device, a rubberizing device, an assembling positioning detection device, a transfer device, a pressing discharging device and a pressure detection device. The rubberizing detection device is used for detecting a to-be-rubberized position and a rubberized position of the bottom shell, and the rubberizing device is used for transferring the bottom shell to a rubberizing station after rubberizing the bottom shell; the assembly positioning detection device is used for detecting the positions of the PCBs before and after assembly, and the transfer device is used for transferring the bottom shells on the bottom shell feeding station to the rubberizing device, transferring the bottom shells on the rubberizing station to the assembly station or the NG storage station and then transferring the PCBs to the assembly station; the pressing and discharging device is used for discharging after the PCB and the bottom shell are pressed. According to the invention, the problems of how to improve the assembling and bonding efficiency of the PCB and the bottom shell and how to ensure the assembling and bonding quality can be solved.

Description

Technical Field

[0001] The invention relates to the technical field of LED production, and in particular to a machine for gluing and assembling a PCB board and a bottom shell. Background Art

[0002] In the modern electronic manufacturing industry, LED products are widely used in various lighting and display fields due to their high energy efficiency, long life and environmental protection characteristics. One of the core components of LED products is the printed circuit board (PCB), which carries the LED chip, drive circuit and other necessary electronic components. In order to ensure the stability and durability of LED products, the PCB board needs to be accurately assembled on the bottom shell and fixed by a reliable connection method. One of the traditional connection methods is to use double-sided tape for bonding, which has the advantages of low cost, easy operation and good sealing performance.

[0003] However, in the existing LED product production process, the assembly and bonding of the PCB board and the bottom shell are mainly done manually. On the production line, workers need to manually attach double-sided tape to the preset position of the bottom shell or PCB board, and then accurately align the PCB board with the corresponding position on the bottom shell, and achieve a tight connection between the two through the viscosity of the double-sided tape, and apply appropriate pressure to ensure the firmness of the bonding.

[0004] However, this manual operation process is not only time-consuming and labor-intensive, resulting in low production efficiency, but is also easily affected by human factors such as worker fatigue and lack of concentration, making it difficult to ensure the quality of assembly and bonding. Problems such as misalignment and weak bonding may occur, affecting the reliability and service life of the product. In addition, manual operation also has certain safety hazards. For example, workers frequently come into contact with electronic components and adhesive materials, which may cause safety accidents such as electric shock and chemical injuries.

[0005] In order to solve the above problems, it is necessary to develop an all-in-one machine for gluing and assembling the PCB board and the bottom shell to replace manual assembly and bonding. Summary of the invention

[0006] 1. Technical issues to be resolved

[0007] The present invention provides a PCB board and bottom shell gluing and assembling all-in-one machine, which can at least solve the technical problem of: how to improve the efficiency of assembling and bonding the PCB board and the bottom shell and ensure the quality of the assembly and bonding.

[0008] (II) Technical solution

[0009] In order to solve the above technical problems, the present invention provides the following technical solutions: a PCB board and bottom shell gluing and assembly all-in-one machine, comprising:

[0010] The rack is equipped with PCB loading station, bottom shell loading station, glue sticking station, NG storage station and assembly station;

[0011] The PCB board loading device is arranged on the frame and is used to convey the PCB board to the PCB loading station;

[0012] A bottom shell loading device is arranged on the frame and is used to transport the bottom shell to the bottom shell loading station;

[0013] The gluing detection device and the gluing device are both arranged on the frame, the gluing detection device is used to detect the position to be glued and the position already glued of the bottom shell, and the gluing device is used to transfer the bottom shell to the gluing station after gluing the bottom shell according to the position to be glued detected by the gluing detection device;

[0014] The assembly positioning detection device and the transfer device are both arranged on the frame. The assembly positioning detection device is used to detect the position of the PCB board before and after assembly. The transfer device is used to transfer the bottom shell on the bottom shell loading station to the gluing device, and transfer the bottom shell on the gluing station to the assembly station or the NG storage station according to the glued position detected by the gluing detection device, and then grab the PCB board on the PCB loading station, and transfer the PCB board to the assembly station according to the position of the PCB board before assembly detected by the assembly positioning detection device;

[0015] The pressing and unloading device is installed on the frame and is used to press the PCB board and the bottom shell before unloading;

[0016] The pressure detection device is arranged on the pressing and blanking device and is used to monitor the pressure applied by the pressing and blanking device.

[0017] Further, the aforementioned adhesive detection device includes:

[0018] The glue positioning camera is arranged on the frame and located above the glue sticking station. The glue positioning camera is used to detect the position to be glued and the glued position on the horizontal plane of the bottom shell;

[0019] The thickness detection camera is installed on the frame and located on one side of the bottom shell loading station. The thickness detection camera is used to detect the thickness of the bottom shell to determine the position to be glued in the height direction of the bottom shell.

[0020] Further, the aforementioned assembly positioning detection device includes:

[0021] The PCB board positioning camera is installed on the frame and located between the assembly station and the PCB loading station. The PCB board positioning camera is used to detect whether the transfer device has grabbed the PCB board and the position of the grabbed PCB board, that is, the position of the PCB board before assembly;

[0022] The assembly inspection camera is installed on the frame and located above the assembly station. The assembly inspection camera is used to detect the installation position of the PCB board on the bottom shell, that is, the position of the PCB board after assembly, to determine whether the combination of the PCB board and the bottom shell is qualified.

[0023] It is further provided that the aforementioned pressing and unloading device comprises an unloading conveyor line and a clamping mechanism arranged on the frame, and the unloading conveyor line is used to convey the qualified PCB board and bottom shell assembled on the assembly station to the clamping mechanism for clamping according to the detection result of the assembly detection camera, and then output the unloading;

[0024] The pressure detection device includes a pressure gauge, which is used to detect the pressure applied by the pressing mechanism to the assembly of the PCB board and the bottom shell.

[0025] Further, the aforementioned pressing mechanism includes:

[0026] A first driving member and a pressing plate, wherein the first driving member is disposed on the frame and is located above the unloading conveying line, the first driving member is in transmission connection with the pressing plate and is used to drive the pressing plate to move upward or downward toward or away from the unloading conveying line;

[0027] The second driving member and the support plate, the second driving member is arranged on the frame and is located below the unloading conveyor line, the second driving member is transmission-connected with the support plate and is used to drive the support plate to move upward or downward toward or away from the unloading conveyor line.

[0028] Further, the aforementioned glue sticking device includes:

[0029] The glue sticking platform and the platform rotating mechanism, the glue sticking platform is arranged on the output end of the platform rotating mechanism and is used to load and position the bottom shell, and the platform rotating mechanism is used to drive the glue sticking platform to rotate;

[0030] The gluing mechanism and the three-axis moving mechanism are arranged on the frame and are drivingly connected with the gluing mechanism and / or the platform rotating mechanism. The three-axis moving mechanism is used to drive the relative movement between the gluing mechanism and the gluing platform.

[0031] Further, the aforementioned glue sticking mechanism includes:

[0032] A mounting frame is arranged on the output end of the three-axis moving mechanism, and a displacement sensor is arranged on the mounting frame, and the displacement sensor is used to detect the position of the double-sided adhesive tape;

[0033] An unwinding wheel is rotatably mounted on the mounting frame and is used to load the double-sided film;

[0034] The winding wheel and the winding drive are both arranged on the mounting frame, and the winding drive is connected to the winding wheel in a transmission manner and is used to drive the winding wheel to rotate and wind up the release paper of the double-sided adhesive;

[0035] The glue sticking head is used to press the double-sided adhesive onto the position to be glued on the bottom shell;

[0036] The adhesive cutting component is used to cut off the double-sided adhesive.

[0037] It is further arranged that the aforementioned three-axis moving mechanism includes an X-axis moving mechanism, a Y-axis moving mechanism and a Z-axis moving mechanism, the X-axis moving mechanism and the Y-axis moving mechanism are both arranged on the frame, the output end of the X-axis moving mechanism is connected to the glue sticking platform, the output end of the Y-axis moving mechanism is connected to the Z-axis moving mechanism, the output end of the Z-axis moving mechanism is connected to the glue sticking mechanism, and the glue sticking mechanism, the Y-axis moving mechanism and the Z-axis moving mechanism are each provided with two;

[0038] The X-axis and the Y-axis are two mutually perpendicular directions on a horizontal plane, and the Z-axis is a vertical direction.

[0039] It is further configured that the aforementioned bottom shell loading device includes a bottom shell conveyor line and a bottom shell lifting mechanism arranged on the frame, the bottom shell conveyor line is used to convey the bottom shells one by one and / or in stacks to the bottom shell lifting mechanism, and the bottom shell lifting mechanism is used to drive the lifting movement of one or a stack of bottom shells to convey the bottom shell or the topmost bottom shell to the bottom shell loading station.

[0040] Further, the aforementioned PCB board feeding device includes:

[0041] The PCB board conveyor line is installed on the frame and is used to convey the PCB boards one by one to the PCB loading station;

[0042] The material blocking mechanism is arranged on the frame, and the material blocking mechanisms are arranged in pairs and are used to separate adjacent PCB boards on the PCB board conveyor line.

[0043] (III) Beneficial effects

[0044] Compared with the prior art, the present invention provides a PCB board and bottom shell gluing and assembly all-in-one machine, which has the following beneficial effects:

[0045] 1. When the integrated machine for gluing and assembling a PCB board and a bottom shell provided by the present invention is used, first, the bottom shell feeding device conveys the bottom shell to the bottom shell feeding station, and at the same time, the PCB board feeding device conveys the PCB board to the PCB feeding station; then, the transfer device grabs the bottom shell on the bottom shell feeding station and transfers it to the gluing device, the gluing detection device detects the position of the bottom shell to be glued, and the gluing device attaches double-sided tape to the position of the bottom shell to be glued according to the detection result of the gluing detection device; after the gluing is completed, the gluing device transfers the glued bottom shell to the gluing station, and the gluing detection device detects the glued position of the bottom shell to determine whether the gluing quality of the bottom shell meets the requirements; then, the transfer device classifies and transfers the bottom shells on the gluing station according to the detection result of the gluing detection device, and transfers the bottom shells with qualified glue to the gluing station. Move to the assembly station, and transfer the bottom shell with unqualified glue to the NG storage station; after the bottom shell is transferred to the assembly station, the transfer device grabs the PCB board on the PCB loading station, and after the assembly positioning detection device detects the position of the PCB board, the transfer device transfers the PCB board to the glued position of the bottom shell of the assembly station according to the position of the PCB board before assembly detected by the assembly positioning detection device, so as to bond the combined PCB board and the bottom shell; finally, the assembly positioning detection device detects the position of the PCB board after assembly to determine whether the assembly quality of the PCB board and the bottom shell meets the requirements, and the pressing and unloading device presses the qualified PCB board and the bottom shell and then unloads the material. During the pressing process, the pressure detection device monitors the pressure applied by the pressing and unloading device to the assembly of the PCB board and the bottom shell in real time. It can be seen that the present invention, from the loading, gluing, bonding assembly to pressing and unloading of the PCB board and the bottom shell, the entire process is automatically completed by the equipment, replacing manual labor, effectively improving the efficiency of gluing and assembly of the PCB board and the bottom shell, and ensuring the quality of the bonding assembly of the two.

[0046] 2. In the process of gluing and assembling, the present invention cooperates with detection devices such as a gluing detection device, an assembly positioning detection device and a pressure detection device to realize accurate feeding, gluing, assembly and pressing, further improving the accuracy of gluing and assembly of the PCB board and the bottom shell, and the first-time yield rate is as high as 99.8%; wherein, the gluing detection device can also be used to classify and transfer the bottom shell, and the bottom shell with unqualified gluing can be centrally stored in the NG storage station, which can facilitate the staff to centrally scrap or reprocess the bottom shell with unqualified gluing, so as to further ensure the quality of assembly and bonding of the PCB board and the bottom shell; the assembly positioning detection device can also be used to classify and unload the assembly of the PCB board and the bottom shell.

[0047] 3. The present invention can complete the transfer of the PCB board and the bottom shell between various devices through a transfer device, which not only improves the one-time success rate of the product, but also effectively reduces the space occupied by the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1It is a three-dimensional diagram of the gluing and assembly of the PCB board and the bottom shell in the embodiment;

[0049] Figure 2 It is a top view of the gluing and assembly of the PCB board and the bottom shell in the embodiment;

[0050] Figure 3 for Figure 1 The enlarged schematic diagram of point A in the middle;

[0051] Figure 4 It is a schematic diagram of the structure of the transfer device and the pressing and unloading device in the embodiment;

[0052] Figure 5 It is a schematic diagram of the partial structure of the pressing and unloading device in the embodiment;

[0053] Figure 6 It is a structural schematic diagram of the bottom shell feeding device in the embodiment;

[0054] Figure 7 Schematic diagram of the structure of the PCB board feeding device in the embodiment.

[0055] Figure Number:

[0056] 1. Rack; 11. PCB loading station; 12. Bottom shell loading station; 13. Gluing station; 14. Assembly station; 15. NG storage station;

[0057] 2. PCB board feeding device; 21. PCB board conveyor line; 22. Material blocking mechanism;

[0058] 3. Bottom shell feeding device; 31. Bottom shell conveying line; 32. Bottom shell lifting mechanism; 321. Lifting frame; 322. Lifting drive member;

[0059] 4. Glue sticking device; 41. Glue sticking mechanism; 411. Mounting frame; 412. Unwinding wheel; 413. Rewinding wheel; 414. Rewinding drive member; 415. Glue sticking head; 416. Glue cutting assembly; 42. Platform rotating mechanism; 43. Glue sticking platform; 431. Fixing mechanism; 44. Three-axis moving mechanism; 441. X-axis moving mechanism; 442. Y-axis moving mechanism; 443. Z-axis moving mechanism;

[0060] 5. Transfer device; 51. Manipulator; 52. Telescopic drive member; 53. Suction cup; 54. Chuck;

[0061] 61. Glue positioning camera; 62. Thickness detection camera; 63. PCB board positioning camera; 64. Assembly detection camera;

[0062] 7. Pressing and unloading device; 71. Unloading conveying line; 72. Pressing mechanism; 721. First driving member; 722. Pressing plate; 723. Second driving member; 724. Support plate; 73. Pressure gauge;

[0063] 8. PCB board; 9. Bottom case. DETAILED DESCRIPTION

[0064] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0065] The present invention provides a PCB board and bottom shell gluing and assembling all-in-one machine, which is used to improve the efficiency of assembling and bonding the PCB board 8 and the bottom shell 9 and ensure the quality of the assembly and bonding.

[0066] See also Figure 1 and Figure 2 As shown, Figure 1 It is a three-dimensional diagram of the gluing and assembly of the PCB board and the bottom shell in the embodiment. Figure 2 It is a top view of the gluing and assembling all-in-one machine for PCB board and bottom shell in the embodiment, and the gluing and assembling all-in-one machine for PCB board and bottom shell includes a frame 1, a PCB board feeding device 2, a bottom shell feeding device 3, a gluing detection device, a gluing device 4, an assembly positioning detection device, a transfer device 5, a pressing and unloading device 7 and a pressure detection device.

[0067] The frame 1 is provided with a PCB loading station 11 , a bottom shell loading station 12 , a gluing station 13 , an assembly station 14 and an NG storage station 15 .

[0068] The PCB board loading device 2 is installed on the frame 1 , and the PCB board loading device 2 is used to transport the PCB board 8 to the PCB loading station 11 .

[0069] The bottom shell loading device 3 is installed on the frame 1 , and the bottom shell loading device 3 is used to transport the bottom shell 9 to the bottom shell loading station 12 .

[0070] The gluing detection device and the gluing device 4 are both installed on the frame 1. The gluing detection device is used to detect the position to be glued and the glued position of the bottom shell 9. The gluing device 4 is used to glue the bottom shell 9 according to the position to be glued detected by the gluing detection device, and then transfer the bottom shell 9 to the gluing station 13.

[0071] The assembly positioning detection device and the transfer device 5 are both installed on the frame 1. The assembly positioning detection device is used to detect the position of the PCB board 8 before assembly and the position after assembly. The transfer device 5 is used to transfer the bottom shell 9 on the bottom shell loading station 12 to the gluing device 4, and transfer the glued bottom shell 9 on the gluing station 13 to the assembly station 14 or the NG storage station 15 according to the glued position detected by the gluing detection device, and then grab the PCB board 8 on the PCB loading station 11, and transfer the PCB board 8 to the assembly station 14 according to the position of the PCB board 8 before assembly detected by the assembly positioning detection device.

[0072] The pressing and unloading device 7 is installed on the frame and is used to unload the material after pressing the PCB board 8 and the bottom shell 9. The pressure detection device is installed on the pressing and unloading device 7 and is used to monitor the pressure applied by the pressing and unloading device 7.

[0073] When the PCB board and bottom shell gluing and assembling all-in-one machine of the above technical solution is used, first, the bottom shell feeding device 3 conveys the bottom shell 9 to the bottom shell feeding station 12, and at the same time, the PCB board feeding device 2 conveys the PCB board 8 to the PCB loading station 11; then, the transfer device 5 grabs the bottom shell 9 on the bottom shell loading station 12 and transfers it to the gluing device 4, the gluing detection device detects the position of the bottom shell 9 to be glued, and the gluing device 4 attaches double-sided tape to the position of the bottom shell 9 to be glued according to the detection result of the gluing detection device; after the gluing is completed, the gluing device 4 transfers the glued bottom shell 9 to the gluing station 13, and the gluing detection device detects the glued position of the bottom shell 9 to determine whether the gluing quality of the bottom shell 9 meets the requirements; then, the transfer device 5 classifies and transfers the bottom shell 9 on the gluing station 13 according to the detection result of the gluing detection device, and transfers the bottom shell 9 with qualified glue to At the assembly station 14, the bottom shell 9 with unqualified gluing is transferred to the NG storage station 15; after the bottom shell 9 is transferred to the assembly station 14, the transfer device 5 grabs the PCB board 8 on the PCB loading station 11, and after the position of the PCB board 8 is detected by the assembly positioning detection device, the transfer device 5 transfers the PCB board 8 to the glued position of the bottom shell 9 of the assembly station 14 according to the position of the PCB board 8 before assembly detected by the assembly positioning detection device, so as to bond and combine the PCB board 8 and the bottom shell 9; finally, the assembly positioning detection device detects the position of the PCB board 8 after assembly to determine whether the assembly quality of the PCB board 8 and the bottom shell 9 meets the requirements, and the pressing and unloading device 7 presses the qualified PCB board 8 and the bottom shell 9 and then unloads them. During the pressing process, the pressure detection device monitors the pressure applied by the pressing and unloading device 7 to the assembly of the PCB board 8 and the bottom shell 9 in real time.

[0074] It can be seen from the above use process that compared with the prior art, the present invention has the following advantages:

[0075] 1) From the loading, gluing, bonding and assembly of the PCB board 8 and the bottom shell 9 to the pressing and unloading, the whole process is completed automatically by the equipment, replacing manual work, effectively improving the efficiency of gluing and assembling the PCB board 8 and the bottom shell 9, and ensuring the quality of the bonding and assembly of the two;

[0076] 2) During the gluing and assembly process, the gluing detection device, assembly positioning detection device, pressure detection device and other detection devices are used to achieve accurate feeding, gluing, assembly and pressing, further improving the accuracy of gluing and assembly of the PCB board 8 and the bottom shell 9, with a one-time yield rate of up to 99.8%; wherein, the gluing detection device can also be used to classify and transfer the bottom shell 9, and the bottom shell 9 with unqualified gluing can be centrally stored in the NG storage station 15, which can facilitate the staff to centrally scrap or reprocess the bottom shell 9 with unqualified gluing, so as to further ensure the quality of assembly and bonding of the PCB board 8 and the bottom shell 9; the assembly positioning detection device can also be used to classify and unload the assembly of the PCB board 8 and the bottom shell 9;

[0077] 3) The PCB board 8 and the bottom shell 9 can be transferred between the devices through a transfer device 5, which not only improves the first-time success rate of the product, but also effectively reduces the space occupied by the equipment.

[0078] See also Figure 4 As shown, Figure 4 Schematic diagram of the structure of the transfer device and the pressing and unloading device in the embodiment. In one embodiment of the transfer device 5, the transfer device 5 includes a manipulator 51, a telescopic drive 52, a suction cup 53 and a chuck 54. Any one of the suction cup 53 and the chuck 54 is installed on the output end of the telescopic drive 52 by screw connection or welding, and the other is installed on the output end of the manipulator 51 together with the telescopic drive 52 by screw connection or welding. In this way, the manipulator 51 cooperates with the suction cup 53 to accurately grasp the PCB board 8, and the manipulator 51 cooperates with the chuck 54 to accurately grasp the bottom shell 9, that is, the PCB board 8 and the bottom shell 9 can be accurately grasped by one manipulator 51, which greatly saves equipment cost and improves the alignment assembly accuracy; and the telescopic drive 52 can drive the suction cup 53 and the chuck 54 to move relative to each other to provide a gap to avoid mutual interference between the two and affect the grasping of the PCB board 8 or the bottom shell 9.

[0079] The manipulator 51 may use an existing four-axis robot. The suction cup 53 may use an existing vacuum suction cup 53 to grasp the PCB board 8 by negative pressure adsorption. The chuck 54 may use an existing gripper cylinder.

[0080] See also Figure 1 and Figure 2As shown, in one embodiment of the gluing detection device, the gluing detection device includes a gluing positioning camera 61 and a thickness detection camera 62. The gluing positioning camera 61 and the thickness detection camera 62 are both arranged on the frame 1 by screwing or welding. Among them, the gluing positioning camera 61 is located above the gluing station 13, and the gluing positioning camera 61 is used to detect the position to be glued on the horizontal plane of the bottom shell 9, as well as the glued position. The thickness detection camera 62 is located on one side of the bottom shell loading station 12, and the thickness detection camera 62 is used to detect the thickness of the bottom shell 9 to determine the position to be glued in the height direction of the bottom shell 9. In this way, the gluing positioning camera 61 and the thickness detection camera 62 cooperate to detect and determine the position to be glued of the bottom shell 9 in the three-dimensional direction. After the position to be glued is determined, the gluing device 4 glues the bottom shell 9 according to the detected position to be glued, which can effectively improve the gluing accuracy and thus improve the yield rate.

[0081] The above-mentioned glue positioning camera 61 and thickness detection camera 62 can both use existing CCD cameras, which can visually quickly and accurately locate the position of the bottom shell 9 to be glued.

[0082] See also Figure 1 and Figure 2As shown, in one embodiment of the assembly positioning detection device, the assembly positioning detection device includes a PCB board positioning camera 63 and an assembly detection camera 64. The PCB board positioning camera 63 and the assembly detection camera 64 are both arranged on the frame 1 by screwing or welding. Among them, the PCB board positioning camera 63 is located between the assembly station 14 and the PCB loading station 11, and the PCB board positioning camera 63 is used to detect whether the transfer device 5 grabs the PCB board 8, and the position of the grabbed PCB board 8, that is, the position of the PCB board 8 before assembly. The assembly detection camera 64 is located above the assembly station 14, and the assembly detection camera 64 is used to detect the installation position of the PCB board 8 on the bottom shell 9, that is, the position of the PCB board 8 after assembly, so as to determine whether the combination of the PCB board 8 and the bottom shell 9 is qualified. In this way, when the PCB board and bottom shell gluing and assembly all-in-one machine assembles the PCB board 8 and the bottom shell 9, the transfer device 5 grabs the PCB board 8 on the PCB loading station 11 and transfers it to the detection range of the PCB board positioning camera 63. The PCB board positioning camera 63 can not only quickly detect the position of the PCB board 8 before assembly, but also effectively avoid the transfer device 5 from missing the material. Then, the transfer device 5 aligns and places the PCB board 8 on the glued position of the bottom shell 9 of the assembly station 14 according to the position information of the PCB board 8 provided by the PCB board positioning camera 63, so that the PCB board 8 and the bottom shell 9 can be accurately bonded and combined; and after the PCB board 8 and the bottom shell 9 are assembled, the PCB board and bottom shell gluing and assembly all-in-one machine can determine the assembly quality of the PCB board 8 and the bottom shell 9 through the assembly detection camera 64. In this way, the combined use of the PCB board positioning camera 63 and the assembly detection camera 64 can effectively improve the quality of the bonding and assembly of the PCB board 8 and the bottom shell 9, and further improve the yield rate.

[0083] The PCB board positioning camera 63 and the assembly inspection camera 64 can both use existing CCD cameras, which can visually locate the PCB board 8 and the bottom shell 9 quickly and accurately.

[0084] See also Figure 1 and Figure 2As shown, in one embodiment of the pressing and unloading device 7 and the pressure detection device, the pressing and unloading device 7 includes a unloading conveyor line 71 and a clamping mechanism 72, and the unloading conveyor line 71 and the clamping mechanism 72 are both arranged on the frame 1 by screw connection or welding. The pressure detection device includes a pressure gauge 73. The unloading conveyor line 71 is used to convey the qualified PCB board 8 and the bottom shell 9 on the assembly station 14 to the clamping mechanism 72 for clamping according to the detection result of the assembly detection camera 64, and then output the unloading. The clamping mechanism 72 is used to clamp the qualified PCB board 8 and the bottom shell 9. The pressure gauge 73 is used to detect the pressure applied by the clamping mechanism 72 to the assembly of the PCB board 8 and the bottom shell 9. In this way, the pressing and unloading device 7 can press the PCB board 8 and the bottom shell 9 through the clamping mechanism 72 to ensure the firmness of the bonding between the two, and automatic unloading can be achieved through the unloading conveyor line 71; and during the pressing process, the pressure value applied by the pressing mechanism 72 can be monitored in real time through the pressure gauge 73, effectively avoiding insufficient pressure applied by the pressing mechanism 72 resulting in insufficient bonding between the PCB board 8 and the bottom shell 9, or the pressure applied by the pressing mechanism 72 exceeds the limit that the PCB board 8 or the bottom shell 9 can withstand, resulting in the PCB board 8 or the bottom shell 9 being crushed, thereby further improving the quality of the glue sticking.

[0085] The pressure gauge 73 may use an existing pressure-maintaining pressure gauge 73 .

[0086] See also Figure 4 and Figure 5 As shown, Figure 5Schematic diagram of the partial structure of the pressing and unloading device in the embodiment. In one embodiment of the pressing mechanism 72, the pressing mechanism 72 includes a first driving member 721, a pressing plate 722, a second driving member 723 and a support plate 724. The first driving member 721 and the second driving member 723 are both arranged on the frame 1 by screwing or welding. The first driving member 721 is located above the unloading conveyor line 71, and the first driving member 721 is connected to the pressing plate 722 in a transmission manner. The first driving member 721 is used to drive the pressing plate 722 to move upward or downward toward the unloading conveyor line 71. The second driving member 723 is located below the unloading conveyor line 71, and the second driving member 723 is connected to the support plate 724 in a transmission manner. The second driving member 723 is used to drive the support plate 724 to move upward or downward toward the unloading conveyor line 71. In this way, when the unloading conveyor line 71 conveys the qualified PCB board 8 and the bottom shell 9 to the pressing mechanism 72, the second driving member 723 drives the support plate 724 to rise toward the unloading conveyor line 71, and the support plate 724 lifts the assembly away from the unloading conveyor line 71. At the same time, the first driving member 721 drives the pressing plate 722 to descend toward the unloading conveyor line 71, and the pressing plate 722 presses down on the assembly, and cooperates with the support plate 724 to press the PCB board 8 and the bottom shell 9 to ensure the firmness of the bonding between the two. During the pressing process, the support plate 724 can support The assembly of the PCB board 8 and the bottom shell 9 increases the contact area with the assembly, effectively avoiding stress concentration, thereby protecting the assembly from being easily crushed; after pressing the PCB board 8 and the bottom shell 9, the first driving member 721 drives the pressing plate 722 to rise with its back facing the unloading conveyor line 71, and at the same time the second driving member 723 drives the supporting plate 724 to descend with its back facing the unloading conveyor line 71, so that the assembly can be released and placed back on the unloading conveyor line 71, so that the unloading conveyor line 71 can output the assembly to the gluing and assembly all-in-one machine of the PCB board and the bottom shell.

[0087] The above-mentioned first driving member 721 and the second driving member 723 can use existing linear displacement driving mechanisms such as telescopic gas rods or telescopic electric poles. The output end of the first driving member 721 is connected to the pressure plate 722 by welding or integral connection, and the output end of the second driving member 723 is connected to the support plate 724 by welding or integral connection.

[0088] See also Figure 1 and Figure 2As shown, in one embodiment of the gluing device 4, the gluing device 4 includes a gluing mechanism 41, a platform rotating mechanism 42, a gluing platform 43 and a three-axis moving mechanism 44. The gluing platform 43 is arranged on the output end of the platform rotating mechanism 42 by screwing or welding, and the gluing platform 43 is used to load and position the bottom shell 9. The platform rotating mechanism 42 is used to drive the gluing platform 43 to rotate. The three-axis moving mechanism 44 is arranged on the frame 1 by screwing or welding, and the three-axis moving mechanism 44 is transmission-connected with the gluing mechanism 41 and / or the platform rotating mechanism 42, and the three-axis moving mechanism 44 is used to drive the relative movement between the gluing mechanism 41 and the gluing platform 43. In this way, the three-axis moving mechanism 44 and the platform rotating mechanism 42 cooperate to facilitate the gluing mechanism 41 to glue any position of the bottom shell 9 on the gluing platform 43.

[0089] See also Figure 3 As shown, Figure 3 for Figure 1In the enlarged schematic diagram at A in the middle, in one embodiment of the glue sticking device 4, the glue sticking mechanism 41 includes a mounting frame 411, an unwinding wheel 412, a rewinding wheel 413 and a rewinding drive 414, a glue sticking head 415 and a glue cutting assembly 416. The mounting frame 411 is mounted on the output end of the three-axis moving mechanism 44. A displacement sensor (not shown in the figure) is installed on the mounting frame 411, and the displacement sensor is used to detect the colloid position of the double-sided adhesive tape. The unwinding wheel 412 is rotatably connected to the mounting frame 411 and is used to load the double-sided film. The rewinding wheel 413 is rotatably connected to the mounting frame 411, and the rewinding drive 414 is arranged on the mounting frame 411 by screwing or welding. The rewinding drive 414 is connected to the rewinding wheel 413 in a transmission connection, and is used to drive the rewinding wheel 413 to rotate and rewind the release paper of the double-sided adhesive tape. The glue sticking head 415 is used to press the colloid of the double-sided adhesive tape to the position to be glued on the bottom shell 9. The glue cutting assembly 416 is used to cut the glue of the double-sided adhesive tape. In this way, one end of the double-sided adhesive tape on the unwinding wheel 412 bypasses the glue sticking head 415 and is fixed on the rewinding wheel 413; during glue sticking, the three-axis moving mechanism 44 drives the glue sticking mechanism 41 and the glue sticking platform 43 to move relative to each other, so that the glue sticking head 415 contacts and moves relative to the bottom shell 9, thereby sticking the glue of the double-sided adhesive tape to the position to be glued on the bottom shell 9, and at the same time, the rewinding driving member 414 drives the rewinding wheel 413 to rotate to peel off and rewind the release paper of the double-sided adhesive tape, thereby driving the unwinding wheel 412 to rotate and unwind the double-sided adhesive tape. During the glue sticking process, the displacement sensor detects the position of the glue of the double-sided adhesive tape in real time. If the glue is tilted and misplaced, the glue sticking device 4 can immediately adjust the relative position of the glue and the bottom shell 9 and the glue sticking speed to ensure the accurate attachment of the double-sided adhesive tape and improve the attachment effect of the double-sided adhesive tape; after the glue sticking is completed, the glue cutting assembly 416 cuts the glue of the double-sided adhesive tape, but retains the release paper. It can be seen that the gluing device 4 can adjust the speed of reeling and unwinding the double-sided tape through the cooperation of the winding drive 414 and the three-axis moving mechanism 44, thereby adjusting the gluing speed of the double-sided tape to ensure that the gluing speed of the gluing device 4 at various parts of the bottom shell 9 is the same, thereby ensuring smooth gluing. Combined with the displacement sensor, the gluing error can be greatly reduced, further improving the gluing quality.

[0090] The above-mentioned glue cutting component 416 can use an existing cutter and a linear displacement drive mechanism such as a telescopic gas rod or a telescopic electric pole. The glue of the double-sided adhesive is wrapped around the glue sticking head 415 and then wrapped around the cutter of the glue cutting component 416, while the release paper of the double-sided adhesive is not wrapped around the cutter of the glue cutting component 416. In this way, the glue cutting component 416 can cut off the glue of the double-sided adhesive by telescopically driving the cutter, but can retain the release paper.

[0091] The platform rotating mechanism 42 may use an existing rotating motor, a rotating cylinder or other rotating drive mechanism.

[0092] See also Figure 1 and Figure 2As shown, in one embodiment of the three-axis moving mechanism 44, the three-axis moving mechanism 44 includes an X-axis moving mechanism 441, a Y-axis moving mechanism 442, and a Z-axis moving mechanism 443. The X-axis moving mechanism 441 and the Y-axis moving mechanism 442 are both arranged on the frame 1 by screwing or welding, the output end of the X-axis moving mechanism 441 is connected to the glue sticking platform 43 by screwing or welding, the output end of the Y-axis moving mechanism 442 is connected to the Z-axis moving mechanism 443 by screwing or welding, and the output end of the Z-axis moving mechanism 443 is connected to the glue sticking mechanism 41 by screwing or welding. The number of the glue sticking mechanism 41, the Y-axis moving mechanism 442, and the Z-axis moving mechanism 443 is two. In this way, the two gluing mechanisms 41, the Y-axis moving mechanism 442 and the Z-axis moving mechanism 443 can form two groups of gluing components, and double-sided tapes of different sizes can be installed on the two gluing mechanisms 41. In this way, when double-sided tapes of different sizes need to be attached, the gluing platform 43 only needs to be moved directly to the bottom of the corresponding group of gluing mechanisms 41 through the X-axis moving mechanism 441, and double-sided tape of another size can be attached. There is no need to stop the machine to replace the double-sided tape on the gluing mechanism 41, which greatly improves the gluing efficiency.

[0093] The X-axis and Y-axis are two mutually perpendicular directions on a horizontal plane, the Z-axis is a vertical direction, and the X-axis, the Y-axis and the Z-axis are mutually perpendicular in any two.

[0094] See also Figure 1 and Figure 2 As shown, on the basis of the above embodiment, a fixing mechanism 431 is provided on the gluing platform 43 by screw connection or welding. The fixing mechanism 431 is used to fix the bottom shell 9 on the gluing platform 43. In this way, the fixing mechanism 431 can realize the positioning of the bottom shell 9, effectively avoiding the movement of the bottom shell 9 during the gluing process to cause the gluing position to shift, thereby ensuring the gluing quality.

[0095] The fixing mechanism 431 can use an existing linear telescopic drive mechanism such as a telescopic gas rod or a telescopic electric pole. In this way, when the fixing mechanism 431 is extended, the bottom shell 9 can be tightly fixed on the glue-applying platform 43. Conversely, when the fixing mechanism 431 is shortened, the bottom shell 9 can be released so that the transfer device 5 can grab it.

[0096] See also Figure 1 , Figure 2 and Figure 6 As shown, Figure 6: is a schematic diagram of the structure of the bottom shell feeding device in the embodiment. In one embodiment of the bottom shell feeding device 3, the bottom shell feeding device 3 includes a bottom shell conveyor line 31 and a bottom shell lifting mechanism 32. The bottom shell conveyor line 31 and the bottom shell lifting mechanism 32 are arranged on the frame 1 by screwing or welding. Among them, the bottom shell conveyor line 31 is used to convey the bottom shells 9 one by one and / or stack by stack to the bottom shell lifting mechanism 32; the bottom shell lifting mechanism 32 is used to drive the lifting movement of one or a stack of bottom shells 9 to convey the bottom shell 9 or the topmost bottom shell 9 to the bottom shell feeding station 12. It can be seen that the bottom shell feeding device 3 can not only load the bottom shells 9 one by one or stack by stack through the bottom shell conveyor line 31 and the bottom shell lifting mechanism 32, but also can load the bottom shells 9 one by one, and can also load the bottom shells 9 stack by stack. The use method is flexible and diverse, and the loading efficiency is greatly improved.

[0097] See also Figure 1 , Figure 2 and Figure 6 As shown, in one embodiment of the bottom shell lifting mechanism 32, the bottom shell lifting mechanism 32 includes a lifting frame 321 and a lifting drive 322. The lifting drive 322 is arranged on the frame 1 by screwing or welding, and is in driving connection with the lifting frame 321. The lifting drive 322 is used to drive the lifting frame 321 to move up and down. It can be seen that when the bottom shell conveyor line 31 conveys the bottom shells 9 one by one or stack by stack to the lifting frame 321, the lifting drive 322 drives the lifting frame 321 to rise, and the bottom shell 9 on the lifting frame 321 or the top bottom shell 9 can be lifted to the assembly station 14 so that the transfer device 5 can grab it.

[0098] The lifting drive member 322 may use an existing linear displacement drive mechanism such as a linear motor linear module or a ball screw linear module, and an output end thereof is connected to the lifting frame 321 by screw connection or welding.

[0099] See also Figure 1 , Figure 2 and Figure 7 As shown, Figure 7 Schematic diagram of the structure of the PCB board feeding device in the embodiment. In one embodiment of the PCB board feeding device 2, the PCB board feeding device 2 includes a PCB board conveying line 21 and a material blocking mechanism 22. The PCB board conveying line 21 and the material blocking mechanism 22 are both arranged on the frame 1 by screwing or welding. The PCB board conveying line 21 is used to convey the PCB boards 8 to the PCB loading station 11 one by one. The material blocking mechanisms 22 are arranged in pairs, and are used to separate adjacent PCB boards 8 on the PCB board conveying line 21. In this way, the material blocking mechanism 22 cooperates with the PCB board conveying line 21 to ensure that the PCB boards 8 on the PCB board conveying line 21 enter the PCB loading station 11 one by one, so as to be grasped by the transfer device 5.

[0100] The above-mentioned unloading conveyor line 71, bottom shell conveyor line 31 and PCB board conveyor line 21 can all use existing adjustable width conveyors, which are composed of two symmetrically spaced conveyor belts, which are driven by a bidirectional screw-nut linear drive assembly to adjust the interval between the two to match the width of the workpiece being conveyed. The above-mentioned unloading conveyor line 71 and bottom shell conveyor line 31 can also use existing conveying mechanisms such as conveyor chains or transplanting mechanisms. In addition, a plurality of pairs of blocking mechanisms 22 can also be set on the unloading conveyor line 71 to convey the assemblies of PCB board 8 and bottom shell 9 one by one.

[0101] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A machine for gluing and assembling a PCB board and a bottom shell, characterized in that: include: A rack, wherein the rack is provided with a PCB loading station, a bottom shell loading station, a gluing station, an NG storage station and an assembly station; A PCB board loading device is arranged on the frame and is used to transport the PCB board to the PCB loading station; A bottom shell loading device is provided on the frame and is used to transport the bottom shell to the bottom shell loading station; The gluing detection device and the gluing device are both arranged on the frame, the gluing detection device is used to detect the position to be glued and the position already glued of the bottom shell, and the gluing device is used to transfer the bottom shell to the gluing station after gluing the bottom shell according to the position to be glued detected by the gluing detection device; An assembly positioning detection device and a transfer device are both arranged on the frame, the assembly positioning detection device is used to detect the position of the PCB board before and after assembly, and the transfer device is used to transfer the bottom shell on the bottom shell loading station to the gluing device, and transfer the bottom shell on the gluing station to the assembly station or NG storage station according to the glued position detected by the gluing detection device, and then grab the PCB board on the PCB loading station, and transfer the PCB board to the assembly station according to the position of the PCB board before assembly detected by the assembly positioning detection device; A pressing and unloading device is arranged on the frame and is used for pressing the PCB board and the bottom shell and then unloading the material; The pressure detection device is arranged on the pressing and blanking device and is used to monitor the pressure applied by the pressing and blanking device.

2. The PCB board and bottom shell gluing and assembling all-in-one machine according to claim 1, characterized in that: The glue detection device comprises: A glue pasting positioning camera is arranged on the frame and located above the glue pasting station, and the glue pasting positioning camera is used to detect the position to be pasted with glue and the position where glue has been pasted on the horizontal plane of the bottom shell; A thickness detection camera is arranged on the frame and located at one side of the bottom shell loading station. The thickness detection camera is used to detect the thickness of the bottom shell to determine the position to be glued in the height direction of the bottom shell.

3. The PCB board and bottom shell gluing and assembling all-in-one machine according to claim 1 or 2, characterized in that: The assembly positioning detection device comprises: A PCB board positioning camera is provided on the frame and is located between the assembly station and the PCB loading station. The PCB board positioning camera is used to detect whether the transfer device has grasped the PCB board and the position of the grasped PCB board, that is, the position of the PCB board before assembly; An assembly inspection camera is arranged on the frame and located above the assembly station. The assembly inspection camera is used to detect the installation position of the PCB board on the bottom shell, that is, the position of the PCB board after assembly, so as to determine whether the combination of the PCB board and the bottom shell is qualified.

4. The PCB board and bottom shell gluing and assembling all-in-one machine according to claim 3, characterized in that: The pressing and unloading device comprises an unloading conveying line and a pressing mechanism arranged on the frame, wherein the unloading conveying line is used to convey the qualified PCB board and the bottom shell assembled on the assembly station to the pressing mechanism for pressing according to the detection result of the assembly detection camera, and then output the unloading; The pressure detection device comprises a pressure gauge, and the pressure gauge is used to detect the pressure applied by the pressing mechanism to the assembly of the PCB board and the bottom shell.

5. The integrated machine for gluing and assembling PCB board and bottom shell according to claim 4, characterized in that: The clamping mechanism comprises: A first driving member and a pressing plate, wherein the first driving member is disposed on the frame and is located above the unloading conveyor line, the first driving member is in driving connection with the pressing plate and is used to drive the pressing plate to move upward or downward toward or away from the unloading conveyor line; A second driving member and a support plate, wherein the second driving member is arranged on the frame and is located below the unloading conveyor line. The second driving member is transmission-connected to the support plate and is used to drive the support plate to move upward or downward toward or away from the unloading conveyor line.

6. The PCB board and bottom shell gluing and assembling all-in-one machine according to any one of claims 1, 2, 4 and 5, characterized in that: The glue sticking device comprises: A glue-sticking platform and a platform rotating mechanism, wherein the glue-sticking platform is arranged on the output end of the platform rotating mechanism and is used to load and position the bottom shell, and the platform rotating mechanism is used to drive the glue-sticking platform to rotate; The gluing mechanism and the three-axis moving mechanism are arranged on the frame and are drivingly connected with the gluing mechanism and / or the platform rotating mechanism. The three-axis moving mechanism is used to drive the relative movement between the gluing mechanism and the gluing platform.

7. The integrated machine for gluing and assembling PCB board and bottom shell according to claim 6, characterized in that: The glue sticking mechanism comprises: A mounting frame, arranged on the output end of the three-axis moving mechanism, the mounting frame is provided with a displacement sensor, and the displacement sensor is used to detect the position of the double-sided adhesive tape; An unwinding wheel, rotatably mounted on the mounting frame and used for loading double-sided film; The winding wheel and the winding drive member are both arranged on the mounting frame, and the winding drive member is connected to the winding wheel in a transmission manner and is used to drive the winding wheel to rotate and wind up the release paper of the double-sided adhesive tape; A glue sticking head, used for pressing the double-sided adhesive onto the position of the bottom shell to be glued; The adhesive cutting component is used to cut off the adhesive of the double-sided adhesive.

8. The integrated machine for gluing and assembling PCB board and bottom shell according to claim 6, characterized in that: The three-axis moving mechanism includes an X-axis moving mechanism, a Y-axis moving mechanism and a Z-axis moving mechanism, the X-axis moving mechanism and the Y-axis moving mechanism are both arranged on the frame, the output end of the X-axis moving mechanism is connected to the glue sticking platform, the output end of the Y-axis moving mechanism is connected to the Z-axis moving mechanism, the output end of the Z-axis moving mechanism is connected to the glue sticking mechanism, and the glue sticking mechanism, the Y-axis moving mechanism and the Z-axis moving mechanism are each provided with two; The X-axis and the Y-axis are two mutually perpendicular directions on a horizontal plane, and the Z-axis is a vertical direction.

9. The PCB board and bottom shell gluing and assembling all-in-one machine according to any one of claims 1, 2, 4, 5, 7 and 8, characterized in that: The bottom shell loading device includes a bottom shell conveying line and a bottom shell lifting mechanism arranged on the frame, the bottom shell conveying line is used to convey the bottom shells one by one and / or in stacks to the bottom shell lifting mechanism, and the bottom shell lifting mechanism is used to drive the lifting movement of one or a stack of the bottom shells to convey the bottom shell or the topmost layer of the bottom shell to the bottom shell loading station.

10. The PCB board and bottom shell gluing and assembling all-in-one machine according to any one of claims 1, 2, 4, 5, 7 and 8, characterized in that: The PCB board feeding device comprises: A PCB board conveying line is arranged on the frame and is used to convey the PCB boards one by one to the PCB loading station; The material blocking mechanism is arranged on the frame, and the material blocking mechanisms are arranged in pairs and are used to separate adjacent PCB boards on the PCB board conveying line.

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