A PCB and bottom shell gluing and assembling all-in-one machine

Abstract

The application relates to the technical field of LED production, and discloses a gluing and assembling all-in-one machine for PCB and bottom shell, which comprises a rack and a PCB plate feeding device, a bottom shell feeding device, a gluing detection device, a gluing device, an assembling positioning detection device, a transfer device, a pressing and discharging device and a pressure detection device arranged on the rack; the gluing detection device is used for detecting the positions of the bottom shell to be glued and the positions of the bottom shell having been glued; the gluing device is used for transferring the bottom shell after gluing to a gluing station; the assembling positioning detection device is used for detecting the positions of the PCB before and after assembling; the transfer device is used for transferring the bottom shell from the bottom shell feeding station to the gluing device, transferring the bottom shell from the gluing station to an assembling station or an NG storage station, and transferring the PCB to the assembling station; and the pressing and discharging device is used for pressing the PCB and the bottom shell and discharging. The application can solve the problem of how to improve the efficiency of the assembling and gluing of the PCB and the bottom shell and ensure the quality of the assembling and gluing.

Description

Technical Field

[0001] This invention relates to the field of LED manufacturing technology, specifically to an integrated machine for applying adhesive to and assembling PCB boards and base shells. Background Technology

[0002] In the modern electronics manufacturing industry, LED products are widely used in various lighting and display fields due to their high energy efficiency, long lifespan, and environmental friendliness. One of the core components of LED products is the printed circuit board (PCB), which houses the LED chip, driver circuitry, and other essential electronic components. To ensure the stability and durability of LED products, the PCB needs to be precisely assembled onto the substrate and secured using reliable connection methods. One traditional connection method is using double-sided adhesive, which offers advantages such as low cost, ease of operation, and good sealing performance.

[0003] However, in the current LED product manufacturing process, the assembly and bonding of the PCB board and the base shell mainly rely on manual labor. On the production line, workers need to manually and precisely apply double-sided tape to the preset positions on the base shell or PCB board, then accurately align the PCB board with the corresponding position on the base shell, using the adhesiveness of the double-sided tape to achieve a tight connection between the two, and applying appropriate pressure to ensure the bonding is strong.

[0004] However, this manual operation process is not only time-consuming and labor-intensive, leading to low production efficiency, but it is also highly susceptible to human factors such as worker fatigue and lack of concentration, making it difficult to guarantee the quality of assembly and bonding. Problems such as misalignment and weak bonding may occur, affecting the reliability and service life of the product. In addition, manual operation also poses certain safety hazards, such as frequent contact between workers and electronic components and adhesive materials, which may cause safety accidents such as electric shock and chemical injuries.

[0005] To solve the above problems, it is necessary to develop an integrated machine for gluing and assembling PCB boards and bottom shells to replace manual assembly and bonding. Summary of the Invention

[0006] (a) Technical problems to be solved

[0007] This invention provides an integrated machine for applying adhesive to and assembling a PCB board and a bottom shell. The technical problem it can solve is at least: how to improve the efficiency of assembling and bonding the PCB board and the bottom shell, and ensure the quality of the assembly and bonding.

[0008] (II) Technical Solution

[0009] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an integrated machine for gluing and assembling a PCB board and a bottom shell, comprising:

[0010] The rack is equipped with PCB loading station, bottom shell loading station, adhesive application station, NG storage station and assembly station;

[0011] The PCB board loading device is located on the frame and is used to transport PCB boards to the PCB loading station;

[0012] The bottom shell feeding device is located on the frame and is used to transport the bottom shell to the bottom shell feeding station;

[0013] Both the adhesive application detection device and the adhesive application device are mounted on the frame. The adhesive application detection device is used to detect the position of the bottom shell to be adhesiveped and the position of the bottom shell that has been adhesiveped. The adhesive application device is used to apply adhesive to the bottom shell according to the position of the bottom shell to be adhesiveped detected by the adhesive application detection device, and then transfer the bottom shell to the adhesive application station.

[0014] The assembly positioning and detection device and the transfer device are both located on the frame. The assembly positioning and detection device is used to detect the position of the PCB board before and after assembly. The transfer device is used to transfer the bottom shell on the bottom shell loading station to the gluing device, and to transfer the bottom shell on the gluing station to the assembly station or NG storage station according to the gluing position detected by the gluing detection device. Then, the PCB board on the PCB loading station is picked up, and the PCB board is transferred to the assembly station according to the position of the PCB board before assembly detected by the assembly positioning and detection device.

[0015] The pressing and unloading device is located on the frame and is used to press the PCB board and the bottom shell together before unloading.

[0016] A pressure detection device is installed on the pressing and unloading device and is used to monitor the pressure applied by the pressing and unloading device;

[0017] The adhesive tape detection device includes:

[0018] The adhesive application positioning camera is mounted on the frame and located above the adhesive application station. The adhesive application positioning camera is used to detect the position of the adhesive to be applied and the position of the adhesive already applied on the horizontal surface of the bottom shell.

[0019] A thickness detection camera is mounted on the frame and located on one side of the bottom shell loading station. The thickness detection camera is used to detect the thickness of the bottom shell in order to determine the position of the adhesive to be applied in the height direction of the bottom shell.

[0020] The assembly positioning and detection device includes:

[0021] The PCB board positioning camera is mounted on the rack and located between the assembly station and the PCB loading station. The PCB board positioning camera is used to detect whether the transfer device has picked up the PCB board and the position of the picked-up PCB board, that is, the position of the PCB board before assembly.

[0022] An assembly inspection camera is mounted on the rack and positioned above the assembly station. The assembly inspection camera is used to inspect the installation position of the PCB board on the bottom shell, that is, the position of the PCB board after assembly, in order to determine whether the PCB board and the bottom shell are properly assembled.

[0023] The pressing and unloading device includes an unloading conveyor line and a pressing mechanism mounted on the frame. The unloading conveyor line is used to transport the qualified PCB board and bottom shell assembled at the assembly station to the pressing mechanism for pressing based on the inspection results of the assembly inspection camera, and then output the unloaded material.

[0024] The pressure detection device includes a pressure gauge, which is used to detect the pressure applied by the clamping mechanism to the assembly of the PCB board and the base.

[0025] Furthermore, the aforementioned clamping mechanism includes:

[0026] The first driving component and the pressure plate are mounted on the frame and located above the feeding conveyor line. The first driving component is connected to the pressure plate and is used to drive the pressure plate to move up and down towards or away from the feeding conveyor line.

[0027] The second drive unit and the support plate are mounted on the frame and located below the feeding conveyor line. The second drive unit is connected to the support plate and is used to drive the support plate to move up and down towards or away from the feeding conveyor line.

[0028] Further, the aforementioned adhesive applicator includes:

[0029] The adhesive application platform and the platform rotation mechanism are provided. The adhesive application platform is located on the output end of the platform rotation mechanism and is used to load and position the bottom shell. The platform rotation mechanism is used to drive the adhesive application platform to rotate.

[0030] The adhesive applicator and the three-axis moving mechanism are mounted on the frame and are connected to the adhesive applicator and / or the platform rotation mechanism. The three-axis moving mechanism is used to drive the relative movement of the adhesive applicator and the adhesive applicator platform.

[0031] Further, the aforementioned adhesive application mechanism includes:

[0032] The mounting bracket is located on the output end of the three-axis moving mechanism. The mounting bracket is equipped with a displacement sensor, which is used to detect the position of the double-sided adhesive.

[0033] The unwinding reel is rotatably mounted on the mounting frame and is used to load double-sided film rolls;

[0034] Both the winding roller and the winding drive are mounted on the mounting frame. The winding drive is connected to the winding roller and is used to drive the winding roller to rotate and wind up the release paper of the double-sided adhesive.

[0035] The adhesive applicator is used to press the adhesive of the double-sided tape onto the desired adhesive position on the bottom shell.

[0036] Adhesive cutting assembly, used to cut the adhesive of double-sided tape.

[0037] Further configuration: the aforementioned three-axis moving mechanism includes an X-axis moving mechanism, a Y-axis moving mechanism, and a Z-axis moving mechanism. The X-axis moving mechanism and the Y-axis moving mechanism are both mounted on the frame. The output end of the X-axis moving mechanism is connected to the adhesive application platform, the output end of the Y-axis moving mechanism is connected to the Z-axis moving mechanism, and the output end of the Z-axis moving mechanism is connected to the adhesive application mechanism. There are two adhesive application mechanisms, two Y-axis moving mechanisms, and two Z-axis moving mechanisms.

[0038] The X-axis and Y-axis are two mutually perpendicular directions on the horizontal plane, and the Z-axis is the vertical direction.

[0039] In a further configuration, the aforementioned bottom shell feeding device includes a bottom shell conveying line and a bottom shell lifting mechanism mounted on the frame. The bottom shell conveying line is used to convey the bottom shells one by one and / or stack by stack to the bottom shell lifting mechanism. The bottom shell lifting mechanism is used to drive the lifting motion of one or a stack of bottom shells to convey the bottom shell or the uppermost bottom shell to the bottom shell feeding station.

[0040] Further, the aforementioned PCB board loading device includes:

[0041] The PCB board conveyor line is located on the frame and is used to transport PCB boards one by one to the PCB loading station.

[0042] The material blocking mechanism is located on the frame. There are two material blocking mechanisms in pairs, which are used to separate adjacent PCB boards on the PCB board conveyor line.

[0043] (III) Beneficial Effects

[0044] Compared with the prior art, the PCB board and bottom shell bonding and assembly integrated machine provided by the present invention has the following beneficial effects:

[0045] 1. When using the PCB board and base shell adhesive application and assembly integrated machine provided by this invention, firstly, the base shell feeding device transports the base shell to the base shell feeding station, and simultaneously the PCB board feeding device transports the PCB board to the PCB board feeding station; then, the transfer device picks up the base shell from the base shell feeding station and transfers it to the adhesive application device, and the adhesive application detection device detects the adhesive application position on the base shell, and the adhesive application device applies double-sided tape to the adhesive application position on the base shell according to the detection result of the adhesive application detection device; after the adhesive application is completed, the adhesive application device transfers the adhesive-applied base shell to the adhesive application station, and the adhesive application detection device detects the adhesive application position on the base shell to determine whether the adhesive application quality of the base shell meets the requirements; then, the transfer device classifies and transfers the base shells on the adhesive application station according to the detection result of the adhesive application detection device, and transfers the qualified adhesive-applied base shells to the adhesive application station. The defective bottom shells are transferred to the assembly station and then to the NG storage station. After the bottom shells are transferred to the assembly station, the transfer device picks up the PCB board from the PCB loading station. After the assembly positioning detection device detects the position of the PCB board, the transfer device transfers the PCB board to the glued position of the bottom shell at the assembly station according to the position detected by the assembly positioning detection device, thereby bonding the PCB board and the bottom shell together. Finally, the assembly positioning detection device detects the position of the PCB board after assembly to determine whether the assembly quality of the PCB board and the bottom shell meets the requirements. The pressing and unloading device presses the qualified PCB board and bottom shell together and unloads them. During the pressing process, the pressure detection device monitors the pressure applied to the PCB board and bottom shell assembly by the pressing and unloading device in real time. It can be seen that the entire process of PCB board and bottom shell loading, gluing, bonding assembly to pressing and unloading is completed automatically by the equipment, replacing manual labor, effectively improving the efficiency of PCB board and bottom shell gluing and assembly, and ensuring the quality of the bonding assembly.

[0046] 2. In the adhesive bonding and assembly process, this invention, in conjunction with adhesive bonding detection devices, assembly positioning detection devices, and pressure detection devices, achieves precise material feeding, adhesive bonding, assembly, and pressing, further improving the accuracy of adhesive bonding and assembly of PCB boards and base shells, with a first-pass yield of up to 99.8%. The adhesive bonding detection device can also classify and transfer base shells, storing those with substandard adhesive bonding in the NG storage station, facilitating centralized scrapping or secondary processing of these shells by staff. This further ensures the quality of the PCB board and base shell assembly and bonding. The assembly positioning detection device can also classify and unload the PCB board and base shell assembly components.

[0047] 3. This invention can complete the transfer of PCB board and bottom shell between various devices through a single transfer device, which not only improves the success rate of the product but also effectively reduces the space occupied by the equipment. Attached Figure Description

[0048] Figure 1This is a perspective view of the PCB board and bottom shell adhesive application and assembly integrated machine in the embodiment;

[0049] Figure 2 This is a top view of the PCB board and bottom shell adhesive application and assembly integrated machine in the embodiment;

[0050] Figure 3 for Figure 1 Enlarged view of point A in the middle;

[0051] Figure 4 This is a schematic diagram of the transfer device and the pressing and unloading device in the embodiment;

[0052] Figure 5 This is a partial structural schematic diagram of the pressing and feeding device in the embodiment;

[0053] Figure 6 This is a schematic diagram of the bottom shell feeding device in the embodiment;

[0054] Figure 7 This is a schematic diagram of the PCB board loading device in the embodiment.

[0055] Icon labels:

[0056] 1. Rack; 11. PCB loading station; 12. Bottom shell loading station; 13. Adhesive application station; 14. Assembly station; 15. NG storage station;

[0057] 2. PCB board loading device; 21. PCB board conveyor line; 22. Material blocking mechanism;

[0058] 3. Bottom shell feeding device; 31. Bottom shell conveyor line; 32. Bottom shell lifting mechanism; 321. Lifting frame; 322. Lifting drive component;

[0059] 4. Adhesive application device; 41. Adhesive application mechanism; 411. Mounting frame; 412. Unwinding roller; 413. Rewinding roller; 414. Rewinding drive component; 415. Adhesive application head; 416. Adhesive cutting assembly; 42. Platform rotation mechanism; 43. Adhesive application platform; 431. Fixing mechanism; 44. Three-axis movement mechanism; 441. X-axis movement mechanism; 442. Y-axis movement mechanism; 443. Z-axis movement mechanism;

[0060] 5. Transfer device; 51. Robotic arm; 52. Telescopic drive component; 53. Suction cup; 54. Gripper;

[0061] 61. Adhesive application positioning camera; 62. Thickness measurement camera; 63. PCB board positioning camera; 64. Assembly inspection camera;

[0062] 7. Pressing and unloading device; 71. Unloading conveyor line; 72. Pressing mechanism; 721. First driving component; 722. Pressure plate; 723. Second driving component; 724. Support plate; 73. Pressure gauge;

[0063] 8. PCB board; 9. Bottom shell. Detailed Implementation

[0064] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0065] This invention provides an integrated machine for applying adhesive and assembling PCB board and bottom shell, addressing the issues of improving the efficiency of assembling and bonding PCB board 8 and bottom shell 9 while ensuring the quality of the assembly and bonding.

[0066] See Figure 1 and Figure 2 As shown, Figure 1 This is a perspective view of the PCB board and bottom shell adhesive application and assembly integrated machine in the embodiment. Figure 2 The above view shows the integrated PCB board and bottom shell gluing and assembly machine in the embodiment. The integrated PCB board and bottom shell gluing and assembly machine includes a frame 1, a PCB board feeding device 2, a bottom shell feeding device 3, a gluing detection device, a gluing device 4, an assembly positioning detection device, a transfer device 5, a pressing and unloading device 7, and a pressure detection device.

[0067] The frame 1 is equipped with a PCB loading station 11, a bottom shell loading station 12, an adhesive application station 13, an assembly station 14, and an NG storage station 15.

[0068] The PCB board loading device 2 is installed on the frame 1 and is used to transport the PCB board 8 to the PCB loading station 11.

[0069] The bottom shell feeding device 3 is installed on the frame 1 and is used to transport the bottom shell 9 to the bottom shell feeding station 12.

[0070] Both the adhesive application detection device and the adhesive application device 4 are mounted on the frame 1. The adhesive application detection device is used to detect the position of the bottom shell 9 where adhesive is to be applied and the position where adhesive has already been applied. The adhesive application device 4 is used to apply adhesive to the bottom shell 9 according to the position of adhesive to be applied detected by the adhesive application detection device, and then transfer the bottom shell 9 to the adhesive application station 13.

[0071] Both the assembly positioning and detection device and the transfer device 5 are mounted on the frame 1. The assembly positioning and detection device is used to detect the position of the PCB board 8 before and after assembly. The transfer device 5 is used to transfer the bottom shell 9 on the bottom shell loading station 12 to the adhesive applicator 4, and to transfer the glued bottom shell 9 on the adhesive applicator station 13 to the assembly station 14 or the NG storage station 15 according to the glued position detected by the adhesive applicator detection device. Then, it picks up the PCB board 8 on the PCB loading station 11 and transfers the PCB board 8 to the assembly station 14 according to the position of the PCB board 8 before assembly detected by the assembly positioning and detection device.

[0072] The pressing and unloading device 7 is mounted on the frame and is used to press the PCB board 8 and the bottom shell 9 together before unloading. A pressure detection device is mounted on the pressing and unloading device 7 and is used to monitor the pressure applied by the pressing and unloading device 7.

[0073] When using the PCB board and base shell gluing and assembly integrated machine of the above technical solution, firstly, the base shell feeding device 3 transports the base shell 9 to the base shell feeding station 12, while the PCB board feeding device 2 transports the PCB board 8 to the PCB feeding station 11; then, the transfer device 5 picks up the base shell 9 from the base shell feeding station 12 and transfers it to the gluing device 4. The gluing detection device detects the gluing position of the base shell 9, and the gluing device 4 applies double-sided tape to the gluing position of the base shell 9 according to the detection result of the gluing detection device; after gluing is completed, the gluing device 4 transfers the glued base shell 9 to the gluing station 13, and the gluing detection device detects the gluing position of the base shell 9 to determine whether the gluing quality of the base shell 9 meets the requirements; then, the transfer device 5 classifies and transfers the base shell 9 on the gluing station 13 according to the detection result of the gluing detection device, and transfers the qualified gluing base shell 9 to... At assembly station 14, the unqualified bottom shell 9 is transferred to NG storage station 15. After the bottom shell 9 is transferred to assembly station 14, the transfer device 5 picks up the PCB board 8 from PCB loading station 11. After the assembly positioning detection device detects the position of the PCB board 8, the transfer device 5 transfers the PCB board 8 to the glued position of the bottom shell 9 at assembly station 14 according to the position of the PCB board 8 before assembly detected by the assembly positioning detection device, thereby bonding the PCB board 8 and the bottom shell 9 together. Finally, the assembly positioning detection device detects the position of the PCB board 8 after assembly to determine whether the assembly quality of the PCB board 8 and the bottom shell 9 meets the requirements. The pressing and unloading device 7 presses the qualified PCB board 8 and the bottom shell 9 together and unloads them. During the pressing process, the pressure detection device monitors the pressure applied by the pressing and unloading device 7 to the assembly of the PCB board 8 and the bottom shell 9 in real time.

[0074] As can be seen from the above usage process, compared with the prior art, the present invention has the following advantages:

[0075] 1) From the loading, gluing, bonding and assembly of PCB board 8 and bottom shell 9 to pressing and unloading, the entire process is completed automatically by the equipment, replacing manual labor, effectively improving the efficiency of gluing and assembling PCB board 8 and bottom shell 9, and ensuring the quality of bonding and assembly of the two.

[0076] 2) During the adhesive application and assembly process, the use of adhesive application detection devices, assembly positioning detection devices, and pressure detection devices enables precise material feeding, adhesive application, assembly, and pressing, further improving the accuracy of adhesive application and assembly of PCB board 8 and bottom shell 9, achieving a first-pass yield of up to 99.8%. The adhesive application detection device also allows for the categorized transfer of bottom shell 9, storing defective bottom shell 9 in the NG storage station 15. This facilitates centralized scrapping or secondary processing of defective bottom shell 9 by staff, further ensuring the quality of the assembly and bonding of PCB board 8 and bottom shell 9. The assembly positioning detection device also enables the categorized unloading of PCB board 8 and bottom shell 9 assemblies.

[0077] 3) The PCB board 8 and the bottom shell 9 can be transferred between various devices by a transfer device 5, which not only improves the success rate of the product but also effectively reduces the space occupied by the equipment.

[0078] See Figure 4 As shown, Figure 4 The diagram illustrates the structure of the transfer device and the pressing and unloading device in one embodiment. In one implementation of the transfer device 5, the transfer device 5 includes a robotic arm 51, a telescopic drive component 52, a suction cup 53, and a chuck 54. Either the suction cup 53 or the chuck 54 is mounted to the output end of the telescopic drive component 52 via screwing or welding, while the other is mounted to the output end of the robotic arm 51 via screwing or welding, together with the telescopic drive component 52. Thus, the robotic arm 51, in conjunction with the suction cup 53, can precisely grip the PCB board 8, and the robotic arm 51, in conjunction with the chuck 54, can precisely grip the bottom shell 9. That is, a single robotic arm 51 can precisely grip both the PCB board 8 and the bottom shell 9, significantly reducing equipment costs and improving alignment and assembly accuracy. Furthermore, the telescopic drive component 52 can drive the suction cup 53 and the chuck 54 to move relative to each other, providing clearance and preventing interference that could affect the gripping of the PCB board 8 or the bottom shell 9.

[0079] The aforementioned robotic arm 51 can use an existing four-axis robot. The aforementioned suction cup 53 can use an existing vacuum suction cup 53 to grip the PCB board 8 by negative pressure adsorption. The aforementioned gripper 54 can use an existing gripper cylinder.

[0080] See Figure 1 and Figure 2As shown, in one embodiment of the adhesive application detection device, the device includes an adhesive application positioning camera 61 and a thickness detection camera 62. Both the adhesive application positioning camera 61 and the thickness detection camera 62 are mounted on the frame 1 by screwing or welding. The adhesive application positioning camera 61 is located above the adhesive application station 13 and is used to detect the position to be adhesive applied and the already applied position on the horizontal plane of the bottom shell 9. The thickness detection camera 62 is located on one side of the bottom shell loading station 12 and is used to detect the thickness of the bottom shell 9 to determine the position to be adhesive applied in the height direction of the bottom shell 9. Thus, the adhesive application positioning camera 61 and the thickness detection camera 62 work together to detect and determine the position to be adhesive applied on the bottom shell 9 in three dimensions. After the position is determined, the adhesive application device 4 applies adhesive to the bottom shell 9 according to the detected position, effectively improving the adhesive application accuracy and thus increasing the yield rate.

[0081] Both the adhesive application positioning camera 61 and the thickness detection camera 62 mentioned above can use existing CCD cameras, which can visually and quickly locate the position of the bottom shell 9 where the adhesive is to be applied.

[0082] See Figure 1 and Figure 2As shown, in one embodiment of the assembly positioning and detection device, the device includes a PCB board positioning camera 63 and an assembly detection camera 64. Both the PCB board positioning camera 63 and the assembly detection camera 64 are mounted on the frame 1 by means of screws or welding. The PCB board positioning camera 63 is located between the assembly station 14 and the PCB loading station 11. The PCB board positioning camera 63 is used to detect whether the transfer device 5 has picked up the PCB board 8, and the position of the picked-up PCB board 8, i.e., the position of the PCB board 8 before assembly. The assembly detection camera 64 is located above the assembly station 14. The assembly detection camera 64 is used to detect the installation position of the PCB board 8 on the bottom shell 9, i.e., the position of the PCB board 8 after assembly, to determine whether the PCB board 8 and the bottom shell 9 are properly assembled. Thus, when the PCB board and bottom shell adhesive bonding and assembly machine assembles the PCB board 8 and bottom shell 9, the transfer device 5 picks up the PCB board 8 from the PCB loading station 11 and transfers it to the detection range of the PCB board positioning camera 63. The PCB board positioning camera 63 can not only quickly detect the position of the PCB board 8 before assembly, but also effectively avoid the transfer device 5 from missing material. Then, according to the position information of the PCB board 8 provided by the PCB board positioning camera 63, the transfer device 5 aligns the PCB board 8 and places it on the adhesive-bonded position of the bottom shell 9 at the assembly station 14, so as to accurately bond and assemble the PCB board 8 and bottom shell 9. After the PCB board 8 and bottom shell 9 are assembled, the PCB board and bottom shell adhesive bonding and assembly machine can determine the assembly quality of the PCB board 8 and bottom shell 9 through the assembly detection camera 64. Thus, the combined use of the PCB board positioning camera 63 and the assembly detection camera 64 can effectively improve the bonding and assembly quality of the PCB board 8 and bottom shell 9, and further improve the yield rate.

[0083] Both the PCB board positioning camera 63 and the assembly inspection camera 64 mentioned above can use existing CCD cameras, which can visually and quickly and accurately position the PCB board 8 and the bottom shell 9.

[0084] See Figure 1 and Figure 2As shown, in one embodiment of the pressing and unloading device 7 and the pressure detection device, the pressing and unloading device 7 includes a feeding conveyor line 71 and a pressing mechanism 72, both of which are mounted on the frame 1 by screwing or welding. The pressure detection device includes a pressure gauge 73. The feeding conveyor line 71 is used to convey the assembled PCB board 8 and the bottom shell 9, which have passed the assembly test camera 64, to the pressing mechanism 72 for pressing before outputting the unloaded parts. The pressing mechanism 72 is used to press the assembled PCB board 8 and the bottom shell 9. The pressure gauge 73 is used to detect the pressure applied by the pressing mechanism 72 to the assembly of the PCB board 8 and the bottom shell 9. Thus, the pressing and unloading device 7 can press the PCB board 8 and the bottom shell 9 together through the pressing mechanism 72 to ensure the strong adhesion between the two. Automatic unloading can be achieved through the unloading conveyor line 71. During the pressing process, the pressure value applied by the pressing mechanism 72 can be monitored in real time by the pressure gauge 73. This effectively avoids insufficient pressure applied by the pressing mechanism 72, which would result in insufficient adhesion between the PCB board 8 and the bottom shell 9, or excessive pressure applied by the pressing mechanism 72, which would result in the PCB board 8 or the bottom shell 9 being crushed. This further improves the adhesive application quality.

[0085] The pressure gauge 73 mentioned above can be any existing pressure-holding gauge 73.

[0086] See Figure 4 and Figure 5 As shown, Figure 5This is a partial structural diagram of the pressing and unloading device in one embodiment. In one implementation of the pressing mechanism 72, the pressing mechanism 72 includes a first driving member 721, a pressure plate 722, a second driving member 723, and a support plate 724. Both the first driving member 721 and the second driving member 723 are mounted on the frame 1 by screwing or welding. The first driving member 721 is located above the unloading conveyor line 71 and is driveably connected to the pressure plate 722. The first driving member 721 drives the pressure plate 722 to move up and down towards or away from the unloading conveyor line 71. The second driving member 723 is located below the unloading conveyor line 71 and is driveably connected to the support plate 724. The second driving member 723 drives the support plate 724 to move up and down towards or away from the unloading conveyor line 71. Thus, when the unloading conveyor 71 transports the assembled PCB board 8 and bottom shell 9 to the pressing mechanism 72, the second driving component 723 drives the support plate 724 to rise towards the unloading conveyor 71. The support plate 724 lifts the assembly away from the unloading conveyor 71. At the same time, the first driving component 721 drives the pressure plate 722 to descend towards the unloading conveyor 71. The pressure plate 722 presses down on the assembly, cooperating with the support plate 724 to press the PCB board 8 and bottom shell 9 firmly to ensure their adhesion. During this pressing process, the support plate 724 can support... The combination of PCB board 8 and bottom shell 9 increases the contact area with the assembly, effectively avoiding stress concentration and thus protecting the assembly from being easily crushed. After pressing PCB board 8 and bottom shell 9, the first drive component 721 drives the pressure plate 722 to rise against the material conveying line 71, while the second drive component 723 drives the support plate 724 to descend against the material conveying line 71, thereby releasing the assembly and placing it back onto the material conveying line 71 so that the material conveying line 71 can output the assembly to the PCB board and bottom shell gluing and assembly integrated machine.

[0087] The first driving member 721 and the second driving member 723 mentioned above can use existing linear displacement driving mechanisms such as telescopic pneumatic rods or telescopic electric rods. The output end of the first driving member 721 is connected to the pressure plate 722 by welding or integral connection, and the output end of the second driving member 723 is connected to the support plate 724 by welding or integral connection.

[0088] See Figure 1 and Figure 2As shown, in one embodiment of the adhesive application device 4, the adhesive application device 4 includes an adhesive application mechanism 41, a platform rotation mechanism 42, an adhesive application platform 43, and a three-axis moving mechanism 44. The adhesive application platform 43 is mounted on the output end of the platform rotation mechanism 42 by means of screwing or welding, and is used to load and position the base shell 9. The platform rotation mechanism 42 drives the adhesive application platform 43 to rotate. The three-axis moving mechanism 44 is mounted on the frame 1 by means of screwing or welding, and is connected to the adhesive application mechanism 41 and / or the platform rotation mechanism 42 by transmission. The three-axis moving mechanism 44 drives the adhesive application mechanism 41 and the adhesive application platform 43 to move relative to each other. Thus, the cooperation of the three-axis moving mechanism 44 and the platform rotation mechanism 42 allows the adhesive application mechanism 41 to easily apply adhesive to any position of the base shell 9 on the adhesive application platform 43.

[0089] See Figure 3 As shown, Figure 3 for Figure 1The enlarged schematic diagram at point A shows that, in one embodiment of the adhesive applicator 4, the adhesive applicator mechanism 41 includes a mounting frame 411, an unwinding roller 412, a winding roller 413, a winding drive 414, an applicator head 415, and an adhesive cutting assembly 416. The mounting frame 411 is mounted on the output end of the three-axis moving mechanism 44. A displacement sensor (not shown in the figure) is mounted on the mounting frame 411, which is used to detect the position of the double-sided adhesive. The unwinding roller 412 is rotatably connected to the mounting frame 411 and is used to load the double-sided adhesive roll. The winding roller 413 is rotatably connected to the mounting frame 411, and the winding drive 414 is mounted on the mounting frame 411 by screwing or welding. The winding drive 414 is drively connected to the winding roller 413 and is used to drive the winding roller 413 to rotate and wind up the release paper of the double-sided adhesive. The applicator head 415 is used to press the adhesive of the double-sided adhesive onto the position to be applied on the base shell 9. The tape-cutting assembly 416 is used to cut the adhesive of the double-sided tape. Thus, one end of the double-sided tape roll on the unwinding roller 412 passes over the application head 415 and is fixed to the take-up roller 413. During application, the three-axis moving mechanism 44 drives the application mechanism 41 and the application platform 43 to move relative to each other, causing the application head 415 to contact and move relative to the bottom shell 9, thereby adhering the adhesive of the double-sided tape to the application position on the bottom shell 9. Simultaneously, the take-up drive 414 drives the take-up roller 413 to rotate, peeling off and winding the release paper of the double-sided tape, thereby driving the unwinding roller 412 to rotate and unwind the double-sided tape roll. During the application process, the displacement sensor detects the position of the double-sided tape in real time. If the tape is tilted or misaligned, the application device 4 can immediately adjust the relative position of the tape and the bottom shell 9, as well as the application speed, to ensure accurate application of the double-sided tape and improve the application effect. After application, the tape-cutting assembly 416 cuts the adhesive of the double-sided tape, but retains the release paper. It can be seen that the adhesive application device 4, through the cooperation of the winding drive 414 and the three-axis moving mechanism 44, can adjust the speed of the double-sided tape winding and unwinding, thereby adjusting the application speed of the double-sided tape to ensure that the application speed of the adhesive application device 4 is the same at all parts of the bottom shell 9, thus ensuring flat application. Combined with the displacement sensor, it can greatly reduce the application error and further improve the application quality.

[0090] The aforementioned adhesive cutting assembly 416 can be combined with existing cutters and linear displacement drive mechanisms such as telescopic pneumatic rods or telescopic electric rods. The adhesive of the double-sided tape passes around the applicator head 415 and then around the cutter of the adhesive cutting assembly 416, while the release paper of the double-sided tape does not pass around the cutter of the adhesive cutting assembly 416. In this way, the adhesive cutting assembly 416 can cut the adhesive of the double-sided tape by telescopically driving the cutter, but can retain the release paper.

[0091] The aforementioned platform rotation mechanism 42 can use existing rotary motors or rotary cylinders or other rotary drive mechanisms.

[0092] See Figure 1 and Figure 2As shown, in one embodiment of the three-axis moving mechanism 44, the three-axis moving mechanism 44 includes an X-axis moving mechanism 441, a Y-axis moving mechanism 442, and a Z-axis moving mechanism 443. The X-axis moving mechanism 441 and the Y-axis moving mechanism 442 are both mounted on the frame 1 by means of screwing or welding. The output end of the X-axis moving mechanism 441 is connected to the adhesive application platform 43 by means of screwing or welding. The output end of the Y-axis moving mechanism 442 is connected to the Z-axis moving mechanism 443 by means of screwing or welding. The output end of the Z-axis moving mechanism 443 is connected to the adhesive application mechanism 41 by means of screwing or welding. There are two of each of the following mechanisms: adhesive application mechanism 41, Y-axis moving mechanism 442, and Z-axis moving mechanism 443. Thus, the two adhesive application mechanisms 41, the Y-axis moving mechanism 442, and the Z-axis moving mechanism 443 can form two sets of adhesive application components. Different sizes of double-sided tape can be installed on the two adhesive application mechanisms 41. When different sizes of double-sided tape need to be applied, the adhesive application platform 43 can be moved directly under the corresponding adhesive application mechanism 41 through the X-axis moving mechanism 441 to apply the other size of double-sided tape without stopping the machine to replace the double-sided tape on the adhesive application mechanism 41, which greatly improves the adhesive application efficiency.

[0093] The X-axis and Y-axis are two mutually perpendicular directions on the horizontal plane, and the Z-axis is the vertical direction. The X-axis, Y-axis and Z-axis are mutually perpendicular to each other.

[0094] See Figure 1 and Figure 2 As shown, based on the above embodiment, the adhesive application platform 43 is provided with a fixing mechanism 431 by means of screwing or welding. The fixing mechanism 431 is used to fix the bottom shell 9 to the adhesive application platform 43. In this way, the fixing mechanism 431 can achieve positioning of the bottom shell 9, effectively preventing the bottom shell 9 from moving during the adhesive application process and causing the adhesive application position to shift, thus ensuring the adhesive application quality.

[0095] The aforementioned fixing mechanism 431 can use existing linear telescopic drive mechanisms such as telescopic pneumatic rods or telescopic electric poles. In this way, when the fixing mechanism 431 extends, the bottom shell 9 can be tightly fixed against the adhesive application platform 43. Conversely, when the fixing mechanism 431 shortens, the bottom shell 9 can be released so that the transfer device 5 can grab it.

[0096] See Figure 1 , Figure 2 and Figure 6 As shown, Figure 6This is a schematic diagram of the bottom shell feeding device in one embodiment. The bottom shell feeding device 3 includes a bottom shell conveying line 31 and a bottom shell lifting mechanism 32, which are mounted on the frame 1 by screwing or welding. The bottom shell conveying line 31 transports the bottom shells 9 one by one and / or stack by stack to the bottom shell lifting mechanism 32. The bottom shell lifting mechanism 32 drives one or a stack of bottom shells 9 to move up and down, transporting the bottom shell 9 or the uppermost bottom shell 9 to the bottom shell feeding station 12. It can be seen that this bottom shell feeding device 3, through the bottom shell conveying line 31 and the bottom shell lifting mechanism 32, can feed the bottom shells 9 one by one or stack by stack, offering flexible usage and significantly improving feeding efficiency.

[0097] See Figure 1 , Figure 2 and Figure 6 As shown, in one embodiment of the bottom shell lifting mechanism 32, the bottom shell lifting mechanism 32 includes a lifting frame 321 and a lifting drive component 322. The lifting drive component 322 is mounted on the frame 1 by means of screwing or welding, and is connected to the lifting frame 321 in a transmission manner. The lifting drive component 322 is used to drive the lifting frame 321 to move up and down. It can be seen that when the bottom shell conveyor line 31 conveys the bottom shells 9 one by one or stack by stack to the lifting frame 321, the lifting drive component 322 drives the lifting frame 321 to rise, thereby lifting the bottom shells 9 or the uppermost bottom shells 9 on the lifting frame 321 to the assembly station 14 so that the transfer device 5 can pick them up.

[0098] The aforementioned lifting drive component 322 can use existing linear motor linear modules or ball screw linear modules and other linear displacement drive mechanisms, and its output end is connected to the lifting frame 321 by means of screwing or welding.

[0099] See Figure 1 , Figure 2 and Figure 7 As shown, Figure 7 This is a schematic diagram of the PCB board loading device in one embodiment. The PCB board loading device 2 includes a PCB board conveyor line 21 and a blocking mechanism 22, both mounted on the frame 1 via screws or welding. The PCB board conveyor line 21 transports PCB boards 8 one by one to the PCB loading station 11. The blocking mechanisms 22 are paired to separate adjacent PCB boards 8 on the PCB board conveyor line 21. Thus, the blocking mechanisms 22, in conjunction with the PCB board conveyor line 21, ensure that the PCB boards 8 on the PCB board conveyor line 21 enter the PCB loading station 11 one by one for the transfer device 5 to pick them up.

[0100] The aforementioned unloading conveyor line 71, bottom shell conveyor line 31, and PCB board conveyor line 21 can all use existing adjustable-width conveyors. An adjustable-width conveyor consists of two symmetrically spaced conveyor belts, driven by a bidirectional screw-nut linear drive assembly, to adjust the spacing between them to match the width of the conveyed workpiece. The unloading conveyor line 71 and bottom shell conveyor line 31 can also use existing conveyor chains or transfer mechanisms. Furthermore, the unloading conveyor line 71 can be equipped with several pairs of stop mechanisms 22 to convey the PCB board 8 and bottom shell 9 assembly one by one.

[0101] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PCB board and bottom shell gluing and assembling all-in-one machine, characterized in that, The application relates to a PCB and bottom shell assembling device. The device comprises: a rack, which is provided with a PCB loading station, a bottom shell loading station, a rubberizing station, an NG storage station and an assembling station; a PCB loading device, which is arranged on the rack and used for conveying a PCB to the PCB loading station; a bottom shell loading device, which is arranged on the rack and used for conveying a bottom shell to the bottom shell loading station; a rubberizing detection device and a rubberizing device, both of which are arranged on the rack, the rubberizing detection device is used for detecting a position to be rubberized and a rubberized position of the bottom shell, and the rubberizing device is used for transferring the bottom shell to the rubberizing station after rubberizing the bottom shell according to the position to be rubberized detected by the rubberizing detection device; an assembling position detection device and a transferring device, both of which are arranged on the rack, the assembling position detection device is used for detecting positions before and after assembling the PCB, the transferring device is used for transferring the bottom shell on the bottom shell loading station to the rubberizing device, transferring the bottom shell on the rubberizing station to the assembling station or the NG storage station according to the rubberized position detected by the rubberizing detection device, grabbing the PCB on the PCB loading station, and transferring the PCB to the assembling station according to the position before assembling the PCB detected by the assembling position detection device; a pressing and discharging device, which is arranged on the rack and used for pressing the PCB and the bottom shell and discharging them after pressing; a pressure detection device, which is arranged on the pressing and discharging device and used for monitoring the pressure applied by the pressing and discharging device; the rubberizing detection device comprises: a rubberizing positioning camera, which is arranged on the rack and located above the rubberizing station, and used for detecting the position to be rubberized and the rubberized position on the horizontal plane of the bottom shell; a thickness detection camera, which is arranged on the rack and located on one side of the bottom shell loading station, and used for detecting the thickness of the bottom shell to determine the position to be rubberized in the height direction of the bottom shell; the assembling position detection device comprises: a PCB positioning camera, which is arranged on the rack and located between the assembling station and the PCB loading station, and used for detecting whether the PCB is grabbed by the transferring device and the position of the grabbed PCB, i.e. the position before assembling the PCB; an assembling detection camera, which is arranged on the rack and located above the assembling station, and used for detecting the mounting position of the PCB on the bottom shell, i.e. the position after assembling the PCB, to determine whether the combination of the PCB and the bottom shell is qualified; the pressing and discharging device comprises a discharging conveying line and a pressing mechanism arranged on the rack, the discharging conveying line is used for conveying the combination of the PCB and the bottom shell qualified in the assembling station to the pressing mechanism for pressing, and then discharging; 2. The PCB board and bottom shell gluing and assembling all-in-one machine according to claim 1, characterized in that, the pressure detection device comprises a pressure gauge, which is used for detecting the pressure applied by the pressing mechanism to the combination of the PCB and the bottom shell. the pressing mechanism comprises: The first driving member and the pressing plate, the first driving member is arranged on the rack and is located above the blank conveying line, the first driving member is in transmission connection with the pressing plate, and is used for driving the pressing plate to move up or down towards or away from the blank conveying line; The second driving member and the supporting plate, the second driving member is arranged on the rack and is located below the blank conveying line, the second driving member is in transmission connection with the supporting plate, and is used for driving the supporting plate to move up or down towards or away from the blank conveying line.

3. The PCB board and bottom shell gluing and assembling all-in-one machine according to claim 1 or 2, characterized in that, The glue sticking device comprises: A glue sticking platform and a platform rotating mechanism, the glue sticking platform is arranged on the output end of the platform rotating mechanism and is used for loading and positioning the bottom shell, and the platform rotating mechanism is used for driving the glue sticking platform to rotate; A glue sticking mechanism and a three-axis moving mechanism, the three-axis moving mechanism is arranged on the rack and is in transmission connection with the glue sticking mechanism and / or the platform rotating mechanism, and the three-axis moving mechanism is used for driving the relative movement of the glue sticking mechanism and the glue sticking platform.

4. The PCB board and bottom shell gluing and assembling all-in-one machine according to claim 3, characterized in that, The glue sticking mechanism comprises: A mounting rack arranged on the output end of the three-axis moving mechanism, the mounting rack is provided with a displacement sensor, and the displacement sensor is used for detecting the position of the adhesive of the double-sided adhesive tape; An unwinding wheel rotatably arranged on the mounting rack and used for loading a double-sided adhesive tape roll; A winding wheel and a winding driving member, both arranged on the mounting rack, the winding driving member is in transmission connection with the winding wheel and is used for driving the winding wheel to rotate and wind the release paper of the double-sided adhesive tape; A glue sticking head used for pressing the adhesive of the double-sided adhesive tape to the position to be glued on the bottom shell; A glue cutting assembly used for cutting the adhesive of the double-sided adhesive tape.

5. The PCB board and bottom shell gluing and assembling all-in-one machine of claim 3, wherein, The three-axis moving mechanism comprises an X-axis moving mechanism, a Y-axis moving mechanism and a Z-axis moving mechanism, the X-axis moving mechanism and the Y-axis moving mechanism are both arranged on the rack, the output end of the X-axis moving mechanism is connected with the glue sticking platform, the output end of the Y-axis moving mechanism is connected with the Z-axis moving mechanism, and the output end of the Z-axis moving mechanism is connected with the glue sticking mechanism, the glue sticking mechanism, the Y-axis moving mechanism and the Z-axis moving mechanism are all provided with two; Wherein, the X-axis and the Y-axis are two mutually perpendicular directions in the horizontal plane, and the Z-axis is a vertical direction.

6. The PCB board and bottom shell gluing and assembling all-in-one machine according to any one of claims 1, 2, 4 and 5, characterized in that, The bottom shell loading device comprises a bottom shell conveying line and a bottom shell lifting mechanism arranged on the rack, the bottom shell conveying line is used for conveying the bottom shells one by one and / or one by one to the bottom shell lifting mechanism, and the bottom shell lifting mechanism is used for driving one or a stack of the bottom shells to move up or down to convey the bottom shell or the uppermost bottom shell to the bottom shell loading station.

7. The PCB board and bottom shell gluing and assembling all-in-one machine according to any one of claims 1, 2, 4 and 5, characterized in that, The PCB loading device comprises: A PCB conveying line arranged on the rack and used for conveying the PCBs one by one to the PCB loading station; A material blocking mechanism arranged on the rack, the material blocking mechanisms are paired, and are used for separating adjacent PCBs on the PCB conveying line.

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