Epoxy molding compound and preparation method and application thereof

Abstract

The invention relates to the field of epoxy molding compounds, and discloses an epoxy molding compound and a preparation method and application thereof, the epoxy molding compound contains epoxy resin, phenolic resin, a curing accelerator, an inorganic filler, a release agent, a coupling agent, an ion capturing agent, a low stress modifier, a coloring agent and a release agent stabilizer; the release agent stabilizer comprises a main release agent stabilizer and an auxiliary release agent stabilizer, wherein the main release agent stabilizer is selected from one or more than two of a tertiary amine compound, a diaryl secondary amine compound and a p-phenylenediamine compound; and the auxiliary release agent stabilizer is selected from one or more than two of a thiol compound, a thioester compound, a dithio organic phosphate compound and a phosphite compound. The epoxy molding compound provided by the invention can realize continuous packaging, has excellent continuous packaging formability, reduces the number of packaged defective products in the continuous packaging process, improves the continuous packaging efficiency, and has huge industrial application prospects.

Description

Technical Field

[0001] The invention relates to the field of epoxy molding compounds, and in particular to an epoxy molding compound and a preparation method and application thereof. Background Art

[0002] Epoxy molding compound is a packaging material based on epoxy resin, which is used for packaging and protection of electronic devices. Epoxy resin is a bifunctional compound, which contains epoxy groups in its molecules, so that epoxy resin can react with active groups in other compounds to form a polymer material with a three-dimensional network structure, so it has excellent mechanical properties, good insulation properties, good chemical resistance, flexibility, and good adhesion.

[0003] With the continuous miniaturization and functional enhancement of microelectronic devices, the packaging structure requires higher integration and performance, which has prompted packaging technology to continuously explore new packaging forms and levels, and develop from traditional two-dimensional packaging to three-dimensional packaging, stacked packaging, etc. In this process, epoxy molding compound, as an important packaging material, is also facing increasing performance requirements. In order to meet the needs of new packaging structures, epoxy molding compound needs to have higher heat resistance, thermal conductivity and adhesion properties to achieve a more compact and higher performance packaging structure.

[0004] However, while ensuring the reliability of epoxy molding compound, the operability of the packaging process also faces huge challenges. Epoxy molding compound has high reliability and needs to have high adhesion to the chip and frame, which also means that the bonding force of epoxy molding compound to the mold surface is also increased accordingly, but it cannot affect the continuous packaging moldability of the molding compound. At the same time, in order to improve production efficiency, each packaging factory is gradually increasing the mold number requirements for the mold cleaning cycle, from the original 200 molds to 500 molds or even more molds, which also puts higher requirements on the continuous packaging moldability of the molding compound.

[0005] The demolding mechanism of epoxy molding compound itself in the continuous encapsulation process mainly relies on the continuous precipitation of the release agent in the molding compound, forming a layer of isolation wax layer between the mold and the molding body. During the demolding process, part of the wax adheres to the surface of the molding body and is taken away, and part of the wax remains on the surface of the mold cavity, and this process is repeated. The stable demolding state is that the wax layer remaining in the mold cavity maintains a uniform amount after each mold encapsulation, and will not increase or decrease with the increase of the number of encapsulation molds. The release agent remaining on the surface of the mold cavity will gradually deteriorate under high temperature conditions of about 175°C for a long time, affecting the demolding effect, resulting in problems such as sticking, cracking, and missing corners. It will also affect the appearance of the molding body, causing problems such as uneven surface color, whitening, blackening, and wax marks.

[0006] At present, the method to improve the continuous encapsulation formability of epoxy molding compounds is usually to optimize the type and amount of release agent, but this method can only improve the continuous encapsulation formability of the molding compound within a small number of encapsulation molds. However, in the case of the current high number of encapsulation molds, changing the composition and amount of the release agent cannot solve the problem of poor encapsulation due to oxidation and deterioration of the release agent. Therefore, how to improve the continuous encapsulation formability of epoxy molding compounds is an urgent problem to be solved. Summary of the invention

[0007] The purpose of the present invention is to overcome the problems in the prior art that the release agent deteriorates during the continuous encapsulation process using epoxy encapsulation material, resulting in poor encapsulation performance, and to provide an epoxy encapsulation material and its preparation method and application. The epoxy encapsulation material of the present invention can achieve continuous encapsulation, and has excellent continuous encapsulation formability, reduces the number of encapsulation defective products during the continuous encapsulation process, improves the efficiency of continuous encapsulation, and has great industrial application prospects.

[0008] In order to achieve the above object, the present invention provides an epoxy molding compound on one hand, wherein the epoxy molding compound contains epoxy resin, phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier, colorant, release agent stabilizer;

[0009] The release agent stabilizer includes a primary release agent stabilizer and an auxiliary release agent stabilizer;

[0010] The primary release agent stabilizer is selected from one or more of tertiary amine compounds, diaryl secondary amine compounds, and p-phenylenediamine compounds.

[0011] Preferably, the auxiliary mold release agent stabilizer is selected from one or more of thiol compounds, thioester compounds, dithio organic phosphate compounds, and phosphite compounds. Preferably, based on the total amount of the epoxy molding compound as 100wt%, the content of the epoxy resin is 6-19wt%, the content of the phenolic resin is 3-9wt%, the content of the curing accelerator is 0.1-0.5wt%, the content of the inorganic filler is 60-90wt%, the content of the mold release agent is 0.2-1.0wt%, the content of the coupling agent is 0.2-0.8wt%, the content of the ion capture agent is 0.05-1.0wt%, the content of the low stress modifier is 0.1-2.0wt%, the content of the colorant is 0.05-1.0wt%, the content of the main mold release agent stabilizer is 0.1%-3%, and the content of the auxiliary mold release agent stabilizer is 0.05-3%.

[0012] Preferably, the weight ratio of the primary release agent stabilizer to the auxiliary release agent stabilizer is 1 to 5:1.

[0013] Preferably, the primary release agent stabilizer is selected from one or more of N-phenyl N'-isopropyl p-phenylenediamine, N,N'-diisooctyl p-phenylenediamine, N-phenyl-N'-isopropyl p-phenylenediamine, phenyl-α-naphthylamine and phenyl-β-naphthylamine.

[0014] The auxiliary release agent stabilizer is preferably selected from one or more of distearyl thiodipropionate, diisodecyl phenyl phosphite, and trilauryl phosphite.

[0015] Preferably, the epoxy resin is selected from one or more of o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, ester ring epoxy resin, heterocyclic epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, dicyclopentadiene epoxy resin, naphthalene ring epoxy resin and multifunctional epoxy resin.

[0016] Preferably, the phenolic resin is selected from one or more of phenol linear phenolic resin and its derivatives, biphenyl phenolic resin, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthol phenolic resin and its derivatives, condensation products of p-xylene and phenol or naphthol, and copolymers of dicyclopentadiene and phenol;

[0017] Preferably, the curing accelerator is selected from one or two of triphenylphosphine and its derivatives, imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1,8-diazabicycloundec-7-ene and an organic amine accelerator.

[0018] Preferably, the coupling agent is selected from one or more of γ-glycidyl ether trimethoxy silane, γ-aminopropyl triethoxy silane, γ-mercaptopropyl trimethoxy silane and γ-aminopropyl trimethoxy silane;

[0019] Preferably, the inorganic filler is selected from any one or more of aluminum oxide, titanium oxide, silicon nitride, aluminum nitride and silicon dioxide;

[0020] Preferably, the silicon dioxide is crystalline silicon dioxide and / or fused silicon dioxide.

[0021] Preferably, the ion capture agent is selected from one or more of an anion capture agent, a cation capture agent, an anion-cation composite ion capture agent and a hydrotalcite compound;

[0022] Preferably, the low stress modifier is selected from one or more of silicone-modified epoxy resin, silicone resin, liquid carboxyl-terminated nitrile rubber and triblock copolymer containing silicone component;

[0023] Preferably, the colorant is selected from one or more of carbon black, titanium dioxide and zinc oxide.

[0024] Preferably, the release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, polypropylene wax and fatty acid wax.

[0025] A second aspect of the present invention provides a method for preparing the epoxy molding compound, the method comprising the following steps:

[0026] (1) heating and melting the phenolic resin, and then mixing it with a primary release agent stabilizer and an auxiliary release agent stabilizer, and then mixing the mixture with a release agent, and then cooling and crushing and sieving;

[0027] (2) mixing the sieve undersize obtained in step (1), epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant, and then kneading;

[0028] Preferably, the heating and melting temperature is 110-170°C;

[0029] Preferably, the mixing temperature is 70-110°C.

[0030] A third aspect of the present invention provides an application of the epoxy molding compound in the packaging process of electronic devices.

[0031] The epoxy molding compound of the present invention can effectively prevent the deterioration of the mold release agent in the epoxy molding compound by using the main mold release agent stabilizer and the auxiliary mold release agent stabilizer, thereby further effectively improving the moldability of the epoxy molding compound in the continuous packaging process and improving the mold times of continuous packaging. Further, by regulating the dosage of the main mold release agent stabilizer and the auxiliary mold release agent stabilizer, the molding performance of the epoxy molding compound can be further improved, so that the continuous molding performance of the epoxy molding compound is more excellent, and it can be better used in the continuous packaging process of electronic devices. The epoxy molding compound of the present invention still has a uniform and good appearance after continuous packaging of 500 molds, and after continuous packaging of multiple molds, it is still not easy to have problems such as sticking, cracking, missing corners and yellowing, which improves the mold cleaning cycle. And after the epoxy molding compound of the present invention is continuously packaged for a mold cleaning cycle, there are few pollutants on the surface of the mold cavity, it is easy to clean the mold, and the mold cleaning cycle can be extended at the same time. DETAILED DESCRIPTION

[0032] The specific embodiments of the present invention are described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0033] The endpoints and any values ​​of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of each range, the endpoint values ​​of each range and the individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.

[0034] In the present invention, the epoxy molding compound contains epoxy resin, phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier, colorant, and release agent stabilizer.

[0035] In a specific embodiment, during the continuous encapsulation process using epoxy molding compound, the release agent generates free radicals ROO· at the unstable structure under the action of heat and oxygen, and the active free radicals can trigger chain growth, chain transfer, and chain termination reactions, forming various impurity groups that affect the performance of the release agent itself. In the present invention, by adding a main release agent stabilizer, it is possible to capture the function of the ROO· free radical to form a relatively stable ROOH group, thereby preventing the release agent from further oxidation and deterioration; at the same time, the auxiliary release agent stabilizer added can decompose the macromolecular hydrogen peroxide to turn it into a stable hydroxyl compound, thereby further preventing the release agent from oxidation and deterioration. Therefore, in the present invention, the oxidation and deterioration of the release agent can be delayed by adding the main release agent stabilizer and the auxiliary release agent stabilizer, so that the epoxy molding compound can still have excellent packaging formability during the continuous packaging process.

[0036] In the present invention, the primary release agent stabilizer is selected from one or more of tertiary amine compounds, diaryl secondary amine compounds, and p-phenylenediamine compounds, and more preferably one or more of N-phenyl N'-isopropyl p-phenylenediamine, N,N'-diisooctyl p-phenylenediamine, N-phenyl-N'-isopropyl p-phenylenediamine, phenyl-α-naphthylamine, and phenyl-β-naphthylamine.

[0037] In the present invention, the auxiliary release agent stabilizer is selected from one or more of thiol compounds, thioester compounds, dithioorganophosphate compounds, and phosphite compounds, and more preferably one or more of distearyl thiodipropionate, diisodecyl phenyl phosphite, and trilauryl phosphite.

[0038] In a preferred embodiment, the weight ratio of the primary mold release stabilizer to the auxiliary mold release stabilizer is 1-5: 1, and most preferably 3: 1. In the present invention, by further limiting the amount of the primary mold release stabilizer and the auxiliary mold release stabilizer, the continuous packaging molding performance of the epoxy molding compound can be further improved, the packaging success rate and the number of packaging times in the continuous packaging process can be improved, and the efficiency of continuous packaging can be improved.

[0039] In a preferred embodiment, the epoxy resin is selected from one or more of o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, ester ring epoxy resin, heterocyclic epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, dicyclopentadiene epoxy resin, naphthalene ring epoxy resin and multifunctional epoxy resin.

[0040] In a preferred embodiment, the phenolic resin is selected from one or more of phenol linear phenolic resin and its derivatives, biphenyl phenolic resin, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthol phenolic resin and its derivatives, condensation products of p-xylene and phenol or naphthol, and copolymers of dicyclopentadiene and phenol.

[0041] In a preferred embodiment, the curing accelerator is selected from one or two of triphenylphosphine and its derivatives, imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1,8-diazabicycloundec-7-ene and an organic amine accelerator.

[0042] In a preferred embodiment, the coupling agent is selected from one or more of γ-glycidyl ether trimethoxy silane, γ-aminopropyl triethoxy silane, γ-mercaptopropyl trimethoxy silane and γ-aminopropyl trimethoxy silane.

[0043] In a preferred embodiment, the inorganic filler is selected from any one or more of aluminum oxide, titanium oxide, silicon nitride, aluminum nitride and silicon dioxide. Further preferably, the silicon dioxide is crystalline silicon dioxide and / or fused silicon dioxide. Specifically, the crystalline silicon dioxide is a silicon dioxide powder having a crystalline component, which can be a common commercial product in the art, and the fused silicon dioxide can be a common commercial product in the art.

[0044] In a preferred embodiment, the ion capture agent is selected from one or more of an anion capture agent, a cation capture agent, an anion-cation composite ion capture agent and a hydrotalcite compound.

[0045] In a preferred embodiment, the low stress modifier is selected from one or more of silicone-modified epoxy resin, silicone resin, liquid carboxyl-terminated nitrile rubber and triblock copolymer containing silicone component.

[0046] In a preferred embodiment, the colorant is selected from one or more of carbon black, titanium dioxide and zinc oxide.

[0047] In a preferred embodiment, the release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, polypropylene wax, and fatty acid wax.

[0048] In the present invention, in order to make the continuous packaging molding performance of the epoxy molding compound better, based on the total amount of the epoxy molding compound as 100wt%, the content of the epoxy resin is 6-19wt%, the content of the phenolic resin is 3-9wt%, the content of the curing accelerator is 0.1-0.5wt%, the content of the inorganic filler is 60-90wt%, the content of the release agent is 0.2-1.0wt%, the content of the coupling agent is 0.2-0.8wt%, the content of the ion capture agent is 0.05-1.0wt%, the content of the low stress modifier is 0.1-2.0wt%, the content of the colorant is 0.05-1.0wt%, the content of the main release agent stabilizer is 0.1%-3%, and the content of the auxiliary release agent stabilizer is 0.05-3%.

[0049] The present invention further provides a method for preparing the epoxy molding compound, the method comprising the following steps:

[0050] (1) heating and melting the phenolic resin, and then mixing it with a primary release agent stabilizer and an auxiliary release agent stabilizer, and then mixing the mixture with a release agent, and then cooling and crushing and sieving;

[0051] (2) The sieve residue obtained in step (1), epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant are mixed and then kneaded.

[0052] In the method described in the present invention, the main release agent stabilizer, the auxiliary release agent stabilizer and the phenolic resin are firstly mixed evenly, and then the obtained mixture is further mixed with the remaining components. By adopting a two-step mixing method for preparation, the release agent can be more accurately protected from oxidation, and the uniformity of the release agent in the epoxy molding compound is also improved, which has a significant improvement effect on the continuous packaging moldability of the epoxy molding compound.

[0053] In a preferred embodiment, in step (1), the temperature of the heating and melting is 110-170°C. Specifically, the temperature of the heating and melting may be 110°C, 120°C, 130°C, 140°C, 150°C, 160°C or 170°C.

[0054] In a specific embodiment, the specific process of step (1) includes: heating the phenolic resin to 110-170°C to melt, then stirring and mixing the molten material with the main release agent stabilizer and the auxiliary release agent stabilizer, then stirring and mixing the mixed material with the release agent, and then cooling and crushing and sieving. Specifically, the stirring time when the molten material is stirred and mixed with the main release agent stabilizer and the auxiliary release agent stabilizer is 5-10 minutes; the stirring time when the molten material is stirred and mixed with the main release agent stabilizer and the auxiliary release agent stabilizer is 30-90 minutes.

[0055] In a preferred embodiment, in step (2), the mixing temperature is 70-110° C. Specifically, the mixing temperature may be 70° C., 80° C., 90° C., 100° C. or 110° C.

[0056] The epoxy molding compound of the present invention can have excellent continuous packaging molding performance in the continuous packaging process of electronic devices, can meet the current requirements for continuous packaging of electronic devices, and the products after 500 continuous packaging can still have a uniform and good appearance. Moreover, after multiple continuous packaging times, the packaged products are still not prone to mold sticking, cracking and corner chipping problems, which improves the mold cleaning cycle and the efficiency of continuous packaging.

[0057] The present invention will be described in detail below through examples, but the protection scope of the present invention is not limited thereto.

[0058] The experimental methods in the following examples, unless otherwise specified, are all conventional methods in the art. The experimental materials used in the following examples, unless otherwise specified, are all commercially available.

[0059] In the following examples and comparative examples, the o-cresol epoxy resin used was purchased from Jinan Shengquan Group Co., Ltd., brand: SQCN700-3;

[0060] Phenol linear phenolic resin was purchased from Jinan Shengquan Group Co., Ltd. with the brand name PF-8011;

[0061] The curing accelerator 2-ethyl-4-methylimidazole was purchased from Nanjing Lanbi'an Biochemical Technology Co., Ltd.;

[0062] The coupling agent Y-glycidyl ether trimethoxysilane was purchased from Jiangsu Chenguang Company;

[0063] The low stress modifier is silicone oil purchased from Dow Corning, brand SF-8241EG;

[0064] Ion scavenger hydrotalcite was purchased from Kyowa Chemical Industry Co., Ltd., Japan, with the brand name DHT-4C;

[0065] The main release agent stabilizer phenyl-β-naphthylamine was purchased from Tianjin Lab Additives Co., Ltd.;

[0066] The auxiliary release agent stabilizer, distearyl thiodipropionate, was purchased from Jihong Chemical.

[0067] In the following examples and comparative examples, please see Table 1 for the specific selection of ingredients and specific amounts of each raw material used in the preparation of epoxy molding compound.

[0068] Example 1

[0069] (1) heating the phenolic resin to 130° C. to melt, then adding the primary release agent stabilizer and the auxiliary release agent stabilizer and stirring for 8 minutes to mix, then adding the release agent to the mixture, stirring for 60 minutes to mix evenly, then cooling the obtained material, then crushing and sieving;

[0070] (2) The sieve material obtained in step (1) is mixed with epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant, and then the obtained mixture is added to an open mill for mixing at a mixing temperature of 100°C.

[0071] Example 2

[0072] (1) heating the phenolic resin to 130° C. to melt, then adding the primary release agent stabilizer and the auxiliary release agent stabilizer and stirring for 10 minutes to mix, then adding the release agent to the mixture, stirring for 90 minutes to mix evenly, then cooling the obtained material, then crushing and sieving;

[0073] (2) The sieve material obtained in step (1) is mixed with epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant, and then the obtained mixture is added to an open mill for mixing at a mixing temperature of 90°C.

[0074] Example 3

[0075] (1) heating the phenolic resin to 140° C. to melt, then adding the primary release agent stabilizer and the auxiliary release agent stabilizer and stirring for 6 minutes to mix, then adding the release agent to the mixture, stirring for 40 minutes to mix evenly, then cooling the obtained material, then crushing and sieving;

[0076] (2) The sieve material obtained in step (1) is mixed with epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant, and then the obtained mixture is added to an open mill for mixing at a mixing temperature of 100°C.

[0077] Example 4

[0078] (1) heating the phenolic resin to 150° C. to melt, then adding the primary release agent stabilizer and the auxiliary release agent stabilizer and stirring for 5 minutes to mix, then adding the release agent to the mixture, stirring for 40 minutes to mix evenly, then cooling the obtained material, then crushing and sieving;

[0079] (2) The sieve material obtained in step (1) is mixed with epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant, and then the obtained mixture is added to an open mill for mixing at a mixing temperature of 100°C.

[0080] Example 5

[0081] (1) heating the phenolic resin to 130° C. to melt, then adding the primary release agent stabilizer and the auxiliary release agent stabilizer and stirring for 10 minutes to mix, then adding the release agent to the mixture, stirring for 90 minutes to mix evenly, then cooling the obtained material, then crushing and sieving;

[0082] (2) The sieve material obtained in step (1) is mixed with epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant, and then the obtained mixture is added to an open mill for mixing at a mixing temperature of 80°C.

[0083] Example 6

[0084] The method of Example 1 is used for implementation, except that in the epoxy molding compound, the weight ratio of the main release agent stabilizer to the auxiliary release agent stabilizer is 5.5:1, that is, the content of the main release agent stabilizer is 0.253%, and the content of the auxiliary release agent stabilizer is 0.046%.

[0085] Comparative Example 1

[0086] The method of Example 1 is used for implementation, except that the epoxy molding compound does not contain a primary mold release agent stabilizer and an auxiliary mold release agent stabilizer, and the primary mold release agent stabilizer and the auxiliary mold release agent stabilizer are replaced with fused silica of equal weight.

[0087] Comparative Example 2

[0088] Phenolic resin, primary release agent stabilizer, auxiliary release agent stabilizer, epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant are mixed, and then the obtained mixture is added into an open mill for mixing at a mixing temperature of 100° C.;

[0089] The dosage and composition of phenolic resin, primary release agent stabilizer, auxiliary release agent stabilizer, epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant are the same as those in Example 1.

[0090] Comparative Example 3

[0091] The method of Example 5 was followed, except that the content of the primary release agent stabilizer and the auxiliary release agent stabilizer were both 4%, the content of the o-cresol epoxy resin was changed to 6.3%, and the content of the phenol linear phenolic resin was changed to 4.5%.

[0092] Comparative Example 4

[0093] The method of Example 1 is used for implementation, except that the epoxy molding compound does not contain an auxiliary mold release agent stabilizer, and the auxiliary mold release agent stabilizer is replaced with an equal weight of a main mold release agent stabilizer.

[0094] Table 1

[0095]

[0096]

[0097] Test Case

[0098] The properties of the materials prepared in Examples 1-6 and Comparative Examples 1-4 were tested using the following test methods:

[0099] Gelation time: tested according to the method of national standard GB / T 40564-2021, the test results are shown in Table 2;

[0100] Spiral flow length: tested according to the method of national standard GB / T 40564-2021, the test results are shown in Table 2;

[0101] Continuous packaging test: The packaging press is Suzhou Shouken TO-220F, the packaging process is mold temperature 175℃, mold pressure 40-60kg / cm 2 , injection pressure is 50-70kg / cm2, and curing time is 120s. Observe whether there are problems such as sticking, cracking, missing corners, uneven color of the appearance, whitening, blackening, wax marks, etc. during the packaging process. If any problem occurs, it is determined that normal packaging cannot continue. The normal continuous packaging mold of the sample is the mold that was packaged before the abnormality occurred. At the same time, observe the residual contaminants on the surface of the mold cavity after the packaging is completed, and judge the dirty mold by observing the color and residual amount of the contaminants.

[0102] Table 2

[0103]

[0104]

[0105] It can be seen from the results of Table 2 that the epoxy molding compound of the present invention can effectively improve the continuous packaging moldability of the epoxy molding compound by adding the main mold release agent stabilizer and the auxiliary mold release agent stabilizer, and further by regulating the dosage of the main mold release agent stabilizer and the auxiliary mold release agent stabilizer, the normal continuous packaging mold times of the epoxy molding compound can basically reach 500 molds and above, and at the same time, after the packaging is completed, the residual amount of pollutants in the mold cavity is small, the color is normal, the mold is easy to clean, and the mold cleaning cycle can be extended. In addition, by using the compound use of the main mold release agent stabilizer and the auxiliary mold release agent stabilizer, the normal continuous packaging mold times can reach 600 molds and above.

[0106] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited thereto. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, including the combination of various technical features in any other suitable manner, and these simple modifications and combinations should also be regarded as the contents disclosed by the present invention and belong to the protection scope of the present invention.

Claims

1. An epoxy molding compound, characterized in that: The epoxy molding compound contains epoxy resin, phenolic resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier, colorant, and release agent stabilizer; The release agent stabilizer includes a primary release agent stabilizer and an auxiliary release agent stabilizer; The primary release agent stabilizer is selected from one or more of tertiary amine compounds, diaryl secondary amine compounds, and p-phenylenediamine compounds; The auxiliary release agent stabilizer is selected from one or more of thiol compounds, thioester compounds, dithioorganophosphate compounds, and phosphite compounds.

2. The epoxy molding compound according to claim 1, characterized in that: Taking the total amount of the epoxy molding compound as 100wt%, the content of the epoxy resin is 6-19wt%, the content of the phenolic resin is 3-9wt%, the content of the curing accelerator is 0.1-0.5wt%, the content of the inorganic filler is 60-90wt%, the content of the release agent is 0.2-1.0wt%, the content of the coupling agent is 0.2-0.8wt%, the content of the ion capture agent is 0.05-1.0wt%, the content of the low stress modifier is 0.1-2.0wt%, the content of the colorant is 0.05-1.0wt%, the content of the main release agent stabilizer is 0.1%-3%, and the content of the auxiliary release agent stabilizer is 0.05-3%.

3. The epoxy molding compound according to claim 1 or 2, characterized in that: The weight ratio of the main release agent stabilizer to the auxiliary release agent stabilizer is 1 to 5:

1.

4. The epoxy molding compound according to claim 1 or 2, characterized in that: The primary release agent stabilizer is selected from one or more of N-phenyl N'-isopropyl p-phenylenediamine, N,N'-diisooctyl p-phenylenediamine, N-phenyl-N'-isopropyl p-phenylenediamine, phenyl-α-naphthylamine, and phenyl-β-naphthylamine; and / or The auxiliary release agent stabilizer is selected from one or more of distearyl thiodipropionate, diisodecyl phenyl phosphite, and trilauryl phosphite.

5. The epoxy molding compound according to any one of claims 1 to 3, characterized in that: The epoxy resin is selected from one or more of o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, ester ring epoxy resin, heterocyclic epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, dicyclopentadiene epoxy resin, naphthalene ring epoxy resin and multifunctional epoxy resin.

6. The epoxy molding compound according to any one of claims 1 to 3, characterized in that: The phenolic resin is selected from one or more of phenol linear phenolic resin and its derivatives, biphenyl phenolic resin, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthol phenolic resin and its derivatives, condensation products of p-xylene and phenol or naphthol, and copolymers of dicyclopentadiene and phenol; and / or The curing accelerator is selected from one or two of triphenylphosphine and its derivatives, imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1,8-diazabicycloundec-7-ene and organic amine accelerators.

7. The epoxy molding compound according to any one of claims 1 to 3, characterized in that: The coupling agent is selected from one or more of γ-glycidyl ether trimethoxy silane, γ-aminopropyl triethoxy silane, γ-mercaptopropyl trimethoxy silane and γ-aminopropyl trimethoxy silane; and / or The inorganic filler is selected from any one or more of aluminum oxide, titanium oxide, silicon nitride, aluminum nitride and silicon dioxide; and / or The silicon dioxide is crystalline silicon dioxide and / or fused silicon dioxide.

8. The epoxy molding compound according to any one of claims 1 to 3, characterized in that: The ion capture agent is selected from one or more of an anion capture agent, a cation capture agent, an anion-cation composite ion capture agent and a hydrotalcite compound; and / or The low stress modifier is selected from one or more of silicone-modified epoxy resin, silicone resin, liquid carboxyl-terminated nitrile rubber and triblock copolymer containing silicone component; and / or The colorant is selected from one or more of carbon black, titanium dioxide and zinc oxide; and / or The release agent is selected from one or more of carnauba wax, polyethylene wax, oxidized polyethylene wax, Fischer-Tropsch wax, polypropylene wax and fatty acid wax.

9. A method for preparing the epoxy molding compound according to any one of claims 1 to 8, characterized in that: The method comprises the following steps: (1) heating and melting the phenolic resin, and then mixing it with a primary release agent stabilizer and an auxiliary release agent stabilizer, and then mixing the mixture with a release agent, and then cooling and crushing and sieving; (2) mixing the sieve undersize obtained in step (1), epoxy resin, curing accelerator, inorganic filler, release agent, coupling agent, ion capture agent, low stress modifier and colorant, and then kneading; Preferably, the heating and melting temperature is 110-170°C; Preferably, the mixing temperature is 70-110°C.

10. Use of the epoxy molding compound according to any one of claims 1 to 8 in the packaging process of electronic devices.

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