Resin composition for sealing, cured product, electronic component device, and method for manufacturing electronic component device

Abstract

The invention relates to a resin composition for sealing, a cured product, an electronic component device, and a method for manufacturing the electronic component device. A sealing resin composition containing (A) an epoxy resin, (B) a curing agent having at least one amino group, (C) a resin having a phenoxy structure, and (D) an inorganic filler. The sealing resin composition according to the present invention is capable of suppressing the occurrence of a bleeding phenomenon.

Description

[0001] This application is a divisional application of an invention patent application with an international application date of December 7, 2016, an international application number of PCT / JP2016 / 086387, a Chinese application number of 201680091380.1, and an invention name of "Sealing resin composition, cured product, electronic component device, and method for manufacturing an electronic component device". Technical Field

[0002] The present invention relates to a sealing resin composition, a cured product, an electronic component device, and a method for producing the electronic component device. Background Art

[0003] In recent years, there has been a demand for high integration of electronic components such as semiconductor chips. For example, a flip chip package in which a semiconductor chip and a substrate are bonded via solder bumps is often used in a semiconductor module.

[0004] Such semiconductor modules are installed in small mobile devices such as mobile phones and smartphones, and the market demand is increasing year by year. In flip-chip packages, bottom fill materials are used as sealing materials to ensure their insulation. The bottom fill material shows fluidity at room temperature, so it is filled between the chip and the substrate by utilizing the capillary phenomenon, and then the sealing of the flip-chip package is obtained by curing the bottom fill material.

[0005] In the manufacturing process of such a semiconductor module, when the uncured bottom filling material is cured, there is a problem of a seepage phenomenon in which a highly fluid component contained in the bottom filling material seeps out of the bottom filling material. If the seepage phenomenon occurs, there is a problem that the highly fluid component seeping out of the bottom filling material contaminates the wiring on the substrate, and the reliability and bonding of the semiconductor module are reduced.

[0006] As a method for solving the bleeding phenomenon, for example, a method of using an insulating paste containing an epoxy resin (A) having a number average molecular weight of 600 to 1000, a curing agent (B), an organic solvent (C), a coupling agent (D), and an inorganic filler (E) is disclosed (for example, Patent Document 1).

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Application Publication No. 2000-178342 Summary of the invention

[0010] Problems to be solved by the invention

[0011] However, in recent years, there has been an increasing demand for miniaturization of electronic components such as semiconductor chips, and the distance to the wiring disposed around the electronic components has become shorter. In a semiconductor module having such miniaturized electronic components, the method described in Patent Document 1 is insufficient for suppressing the occurrence of the bleeding phenomenon, and a composition capable of more strictly suppressing the occurrence of the bleeding phenomenon is desired.

[0012] Here, the bleeding phenomenon is caused by the bleeding of components with high fluidity on the surface of the solder resist substrate (Japanese: ソルダーレジスト基板) used in the semiconductor module. In the bleeding phenomenon, the degree of bleeding of the components with high fluidity also depends on the type of the substrate. In addition, when the surface of the substrate is subjected to plasma treatment, the bleeding phenomenon is particularly likely to occur. Therefore, from the viewpoint of suppressing the occurrence of the bleeding phenomenon, it is preferable not to perform plasma treatment on the surface of the substrate. However, plasma treatment is used for washing the surface of the substrate in the pre-sealing process of the semiconductor module, so in most cases it is unavoidable in manufacturing, and it is desired to suppress the occurrence of the bleeding phenomenon even when the surface of the substrate is subjected to plasma treatment.

[0013] An object of one aspect of the present invention is to provide a sealing resin composition capable of suppressing the occurrence of the bleeding phenomenon, a cured product obtained by curing the sealing resin composition, an electronic component device including the cured product, and a method for manufacturing an electronic component device using the sealing resin composition.

[0014] Means for Solving the Problems

[0015] In order to achieve the above object, the present inventors conducted intensive studies and found that a sealing resin composition capable of suppressing the occurrence of the bleeding phenomenon can be obtained by using a resin containing a phenoxy structure for the sealing resin composition.

[0016] Specific means for achieving the above problems are as follows.

[0017] <1> A sealing resin composition comprising (A) an epoxy resin, (B) a curing agent having at least one amino group, (C) a resin having a phenoxy structure, and (D) an inorganic filler.

[0018] <2> The sealing resin composition according to <1>, wherein the weight average molecular weight M of the resin (C) having a phenoxy structure w is 500 or more and 100,000 or less.

[0019] <3> The sealing resin composition according to <1>, wherein the weight average molecular weight M of the resin (C) having a phenoxy structure w is 2,000 or more and 100,000 or less.

[0020] <4> The sealing resin composition according to any one of <1> to <3>, wherein the (C) resin having a phenoxy structure includes a compound represented by the following general formula (1).

[0021] [Chemistry 1]

[0022]

[0023] (In the general formula (1), A represents the structure represented by the general formula (2), the terminal group B represents a hydroxyl group or a group represented by the general formula (3); in the general formula (2), R1 and R2 each independently represent a hydrogen atom or a methyl group; n represents an integer of 1 to 1000; when n is an integer of 2 or more, two or more A's may be the same or different; and two terminal groups B may be the same or different.)

[0024] <5> The sealing resin composition according to any one of <1> to <4>, wherein the content of the (C) resin having a phenoxy structure is 0.05% by mass to 2.0% by mass based on the sealing resin composition.

[0025] <6> The sealing resin composition according to any one of <1> to <5>, which is used for sealing an electronic component device.

[0026] <7> A cured product obtained by curing the sealing resin composition according to any one of <1> to <6>.

[0027] <8> An electronic component device comprising:

[0028] a substrate having a circuit layer;

[0029] An electronic component disposed on the substrate and electrically connected to the circuit layer; and

[0030] The cured product according to <7> disposed in the gap between the substrate and the electronic component.

[0031] <9> A method for producing an electronic component device, comprising the step of sealing a substrate having a circuit layer and an electronic component disposed on the substrate and electrically connected to the circuit layer with the sealing resin composition according to any one of <1> to <6>.

[0032] Effects of the Invention

[0033] According to one aspect of the present invention, there can be provided a sealing resin composition capable of suppressing the occurrence of bleed-out, a cured product obtained by curing the sealing resin composition, an electronic component device including the cured product, and a method for producing an electronic component device using the sealing resin composition. DETAILED DESCRIPTION

[0034] The following is a detailed description of the method for implementing the present invention. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not necessary unless otherwise stated. The same is true for numerical values ​​and their ranges, which are not intended to limit the present invention.

[0035] In the present disclosure, the term "process" includes not only a process that is independent of other processes, but also a process that cannot be clearly distinguished from other processes as long as the purpose of the process is achieved.

[0036] In the present disclosure, a numerical range expressed using "to" includes the numerical values ​​before and after "to", and these are respectively regarded as the minimum value and the maximum value.

[0037] In the numerical range recorded in stages in the present disclosure, the upper limit or lower limit recorded in one numerical range can also be replaced by the upper limit or lower limit of the numerical range recorded in other stages. In addition, in the numerical range recorded in the present disclosure, the upper limit or lower limit of the numerical range can also be replaced by the value shown in the embodiment.

[0038] In the present disclosure, when two or more substances corresponding to each component are present in a composition, unless otherwise specified, the content rate or content of each component in the composition refers to the total content rate or content of the two or more substances present in the composition.

[0039] In the present disclosure, when two or more particles corresponding to each component are present in the composition, unless otherwise specified, the particle size of each component in the composition refers to a value related to a mixture of the two or more particles present in the composition.

[0040] In the present disclosure, the term "layer" includes not only a case where the layer is formed in the entire region when the region where the layer exists is observed, but also a case where the layer is formed in only a part of the region.

[0041] [Sealing resin composition]

[0042] The sealing resin composition disclosed herein comprises (A) an epoxy resin, (B) a curing agent having at least one amino group, (C) a resin having a phenoxy structure, and (D) an inorganic filler. The sealing resin composition can be used, for example, for sealing electronic components. The sealing resin composition can suppress the occurrence of oozing out. The reason for this is presumed to be as follows.

[0043] The phenoxy resin contained in the sealing resin composition has a high affinity with a high-fluidity component that may cause the bleeding phenomenon. We believe that, therefore, when the sealing resin composition is applied to the substrate, the separation of a portion of the sealing resin composition on the substrate is suppressed, and the occurrence of the bleeding phenomenon is suppressed. In addition, we believe that when the sealing resin composition contains a liquid component such as an epoxy resin that is liquid at 25°C as a high-fluidity component, the phenoxy resin has a high affinity with the liquid component, so the occurrence of the bleeding phenomenon is appropriately suppressed.

[0044] In addition, when the substrate surface is subjected to plasma treatment, the bleeding phenomenon tends to occur. However, by using the above-mentioned sealing resin composition, the bleeding phenomenon can be suppressed even when the substrate surface is subjected to plasma treatment.

[0045] Hereinafter, each component contained in the sealing resin composition will be described.

[0046] <(A)Epoxy resin>

[0047] The sealing resin composition of the present disclosure contains (A) an epoxy resin. The (A) epoxy resin imparts curability and adhesiveness to the sealing resin composition, and imparts durability and heat resistance to a cured product of the sealing resin composition.

[0048] From the viewpoint of fluidity, the epoxy resin (A) preferably contains an epoxy resin that is liquid at 25° C. Alternatively, an epoxy resin that is solid at 25° C. may be used in combination, but preferably an epoxy resin that is solid at 25° C. is used in combination within a range that does not affect the fluidity of the sealing resin composition.

[0049] In addition, in this disclosure, regarding each component contained in the sealing resin composition, the component whose viscosity at 25° C. is 50 Pa·s or less is referred to as "liquid at 25° C.".

[0050] By including an epoxy resin that is liquid at 25° C. as the (A) epoxy resin, the fluidity of the sealing resin composition tends to be improved.

[0051] The viscosity of the epoxy resin (A) at 25° C. is preferably 50 Pa·s or less, more preferably 0.01 Pa·s to 40 Pa·s, and even more preferably 0.5 Pa·s to 30 Pa·s.

[0052] In the present disclosure, the viscosity at 25° C. of each component contained in the sealing resin composition (A) such as an epoxy resin refers to a value measured using an E-type viscometer (cone angle 3°) at 25° C. and a rotation speed of 10 rpm.

[0053] (A) There is no particular limitation on the type of epoxy resin. Examples of the epoxy resin include naphthalene-type epoxy resins; diglycidyl ether-type epoxy resins such as bisphenol A, bisphenol F, bisphenol AD, bisphenol S, and hydrogenated bisphenol A; epoxy resins obtained by epoxidizing phenolic resins of phenols and aldehydes, typified by o-cresol novolac-type epoxy resins; glycidyl ester-type epoxy resins obtained by the reaction of polybasic acids such as phthalic acid and dimer acid with epichlorohydrin; glycidylamine-type epoxy resins obtained by the reaction of amine compounds such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin, etc.

[0054] Regarding the epoxy equivalent of the (A) epoxy resin, from the viewpoint of viscosity adjustment, it is preferably 80 g / eq to 250 g / eq, more preferably 85 g / eq to 240 g / eq, and still more preferably 90 g / eq to 230 g / eq.

[0055] The method for measuring the epoxy equivalent in the present disclosure is described below.

[0056] Dissolve the epoxy resin in methyl ethyl ketone. Add glacial acetic acid, cetyltrimethylammonium bromide, and a masking indicator (Japanese: スクリーン指示薬) (a solution prepared by mixing a solution obtained by dissolving 0.3 g of patent blue in 100 mL of glacial acetic acid and a solution obtained by dissolving 1.5 g of thymol blue in 500 mL of methanol) to the dissolved solution, and titrate with a perchloric acid solution adjusted to 0.1 N. The time when the color of the solution turns pink and the pink color persists for 1 minute is taken as the end point. In addition, a blank test is performed, and the epoxy equivalent is calculated by the following formula.

[0057] Epoxy equivalent (g / eq) = (1000 × W) / {(S - B) × N}

[0058] W: Mass of the sample

[0059] B: Amount of 0.1 N perchloric acid solution used in the blank test

[0060] S: Amount of 0.1 N perchloric acid solution used in the titration of the sample

[0061] N: Normal concentration of the perchloric acid solution (0.1 N)

[0062] The weight-average molecular weight of the (A) epoxy resin is not particularly limited. As the weight-average molecular weight of the (A) epoxy resin, it is preferably 100 to 1,000, more preferably 150 to 800, and still more preferably 200 to 500.

[0063] The method for measuring the weight-average molecular weight (Mw) and number-average molecular weight (Mn) in the present disclosure is described below.

[0064] The weight average molecular weight and number average molecular weight were measured by gel permeation chromatography (GPC), and derived by conversion using a calibration curve of standard polystyrene. The conditions of GPC are as follows.

[0065] - GPC conditions -

[0066] Pump: Hitachi L-6000 type (manufactured by Hitachi Manufacturing Co., Ltd.)

[0067] Chromatographic columns: 3 in total

[0068] Gelpack GL-R420

[0069] Gelpack GL-R430

[0070] Gelpack GL-R440

[0071] (The above are product names manufactured by Hitachi Chemical Co., Ltd.)

[0072] Eluent: Tetrahydrofuran

[0073] Measurement temperature: 25℃

[0074] Flow rate: 2.05mL / min

[0075] Detector: Hitachi L-3300 RI (manufactured by Hitachi, Ltd.)

[0076] As the (A) epoxy resin, a commercial product can be used. As commercially available (A) epoxy resins, examples include: bisphenol F epoxy resin (product name: YDF-8170C) manufactured by Nippon Steel & Sumitomo Metal Chemicals, Inc., bisphenol A epoxy resin (product name: YD-128) manufactured by Nippon Steel & Sumitomo Metal Chemicals, Inc., bisphenol A epoxy resin (product name: R-140P) manufactured by Mitsui Chemicals, Inc., amine epoxy resin (product name: jER-630) manufactured by Mitsubishi Chemical Corporation, naphthalene epoxy resin (product name: HP-4032) manufactured by DIC Corporation, etc. (A) epoxy resin is not limited to these specific examples. (A) epoxy resins can be used alone or in combination of two or more.

[0077] The content of the epoxy resin (A) is preferably 10% by mass to 50% by mass, more preferably 15% by mass to 40% by mass, and even more preferably 20% by mass to 35% by mass based on the sealing resin composition.

[0078] <(B) Curing agent having at least one amino group (specific curing agent)>

[0079] The sealing resin composition of the present disclosure contains (B) a curing agent having at least one amino group (hereinafter also referred to as "(B) specific curing agent"). The (B) specific curing agent tends to be able to prepare a sealing resin composition having excellent fluidity and pot life compared to other curing agents described below.

[0080] The specific curing agent (B) is not particularly limited as long as it can cure the epoxy resin (A). The specific curing agent (B) may be any curing agent that cures by polymerization with the epoxy resin, and may be any specific curing agent that is liquid at 25°C or any specific curing agent that is solid at 25°C as long as the sealing resin composition has fluidity when prepared as the sealing resin composition. The specific curing agent (B) includes a curing agent that is liquid at 25°C, which tends to improve the fluidity of the sealing resin composition.

[0081] (B) The specific curing agent includes amine curing agents such as chain aliphatic amines, cyclic aliphatic amines, aliphatic aromatic amines, and aromatic amines. As the amine curing agent, aromatic amines are preferred from the viewpoint of heat resistance and electrical properties.

[0082] Specific examples of the amine curing agent include aromatic amine curing agents having one aromatic ring, such as m-phenylenediamine, 1,3-diaminotoluene, 1,4-diaminotoluene, 2,4-diaminotoluene, 3,5-diethyl-2,4-diaminotoluene, 3,5-diethyl-2,6-diaminotoluene, and 2,4-diaminoanisole; 2,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 4,4'-methylenebis(2-ethylaniline), 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetramethyl-4 Aromatic amine curing agents having two aromatic rings, such as 4'-diaminodiphenylmethane and 3,3',5,5'-tetraethyl-4,4'-diaminodiphenylmethane; hydrolysis condensation products of aromatic amine curing agents; aromatic amines having a polyether structure, such as polytetrahydrofuran bis-p-aminobenzoate (Japanese: ポリテトラメチレンオキシドジ-p-aminobenzoic acid ester) and polytetrahydrofuran bis-p-aminobenzoate (Japanese: ポリテトラメチレンオキシドジ-p-aminobenzoate); condensation products of aromatic diamines and epichlorohydrin; reaction products of aromatic diamines and styrene, etc.

[0083] As the (B) specific curing agent, a commercial product can be used. As commercial products of the (B) specific curing agent, there can be listed: amine curing agent (product name: Kayahard-AA) manufactured by Nippon Kayaku Co., Ltd., amine curing agent (product name: jER cure (registered trademark) W, jER cure (registered trademark) 113, etc.) manufactured by Mitsubishi Chemical Corporation, amine curing agent (product name: ETHACURE 300) manufactured by ALBEMARLE JAPAN CORPORATION, etc. The (B) specific curing agent is not limited to these specific examples. The (B) specific curing agent can be used alone or in combination of two or more.

[0084] The content ratio of the epoxy resin (A) and the specific curing agent (B) in the sealing resin composition is not particularly limited, and the ratio of the equivalent number of epoxy groups contained in the epoxy resin (A) to the equivalent number of amino groups contained in the specific curing agent (B) is also not particularly limited. In order to suppress the unreaction of each, the ratio of the equivalent number of amino groups contained in the specific curing agent (B) to the equivalent number of epoxy groups contained in the epoxy resin (A) (equivalent number of amino groups / equivalent number of epoxy groups) is preferably in the range of 0.6 to 1.4, more preferably in the range of 0.7 to 1.3, and further preferably in the range of 0.8 to 1.2.

[0085] The content of the specific curing agent (B) in the sealing resin composition is not particularly limited. From the viewpoint of fluidity, insulation reliability, etc., the content of the specific curing agent (B) is preferably 5 to 60 parts by mass, and more preferably 10 to 50 parts by mass, relative to 100 parts by mass of the epoxy resin (A).

[0086] The sealing resin composition may contain other curing agents in addition to the (B) specific curing agent. Examples of other curing agents include phenolic curing agents, acid anhydride curing agents, imidazole curing agents, and carboxylic acid dihydrazide curing agents.

[0087] When other curing agents other than the (B) specific curing agent are used in combination, the content of the other curing agent in the sealing resin composition is preferably 0.5 to 5.0 parts by mass, more preferably 1.0 to 3.0 parts by mass, based on 100 parts by mass of the (A) epoxy resin, from the viewpoints of fluidity, insulation reliability, etc.

[0088] When other curing agents other than the (B) specific curing agent are used in combination, the content of the other curing agent in the sealing resin composition is preferably 1% by mass to 50% by mass, more preferably 5% by mass to 35% by mass, and even more preferably 8% by mass to 20% by mass relative to the total amount of the curing agent component from the viewpoints of fluidity, insulation reliability, etc.

[0089] <(C) Resins having a phenoxy structure (phenoxy resins)>

[0090] The sealing resin composition disclosed herein contains (C) a resin having a phenoxy structure (hereinafter also referred to as "(C) phenoxy resin"). The sealing resin composition containing the (C) phenoxy resin has an effect of suppressing the occurrence of a bleed phenomenon, and has excellent heat resistance and excellent moisture resistance, and tends to contribute to improving the reliability of the package after sealing.

[0091] It should be noted that in the present disclosure, the "phenoxy structure" refers to a structure in which an oxygen atom is bonded to a benzene ring, and includes not only a phenoxy group (C6H5-O-) but also a structure in which a part of the phenoxy group is substituted, a structure in which a part of the phenoxy group is reacted by hydrogenation, etc.

[0092] As for the (C) phenoxy resin, both a liquid phenoxy resin and a solid phenoxy resin at 25°C can be used. When the (C) phenoxy resin is in a liquid state, it tends to be easily dissolved in the sealing resin composition. On the other hand, when the (C) phenoxy resin is in a solid state, by dissolving the (C) phenoxy resin in at least one of the (A) epoxy resin and the (B) specific curing agent, the sealing resin composition tends to become uniform and stable properties tend to be obtained. As the (C) phenoxy resin, it is preferred to include a phenoxy resin that is liquid at 25°C, thereby tending to improve the fluidity of the sealing resin composition.

[0093] The (C) phenoxy resin in the sealing resin composition can be detected by gel permeation chromatography, pyrolysis gas chromatography, infrared spectroscopy, or the like.

[0094] As the (C) phenoxy resin, there is no particular limitation as long as it is a phenoxy resin having a phenoxy structure in the molecular structure. The (C) phenoxy resin preferably has at least one of an epoxy group and a hydroxyl group in the skeleton. Examples of the (C) phenoxy resin include: a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a phenolic skeleton, a phenoxy resin having a naphthalene skeleton, a phenoxy resin having a biphenyl skeleton, and the like. Examples of the bisphenol structure in the phenoxy resin having a bisphenol skeleton include a bisphenol A type structure, a bisphenol F type structure, a bisphenol S type structure, a brominated bisphenol A type structure, and a hydrogenated bisphenol A type structure. The phenoxy resin may have an epoxy group, in which case the epoxy equivalent of the phenoxy resin may be more than 250 g / eq, and may be more than 1000 g / eq, or more than 3,000 g / eq.

[0095] In addition, the resin having a phenoxy structure and an epoxy group is included in the (A) epoxy resin when the epoxy equivalent is 250 eq or less, and is included in the (C) phenoxy resin when the epoxy equivalent exceeds 250 eq.

[0096] The phenoxy resin (C) preferably contains at least one selected from bisphenol F epoxy resin, bisphenol A epoxy resin, and copolymerized epoxy resins of bisphenol F and bisphenol A, and more preferably contains a compound represented by the following general formula (1), from the viewpoints of cost, fluidity, and heat resistance.

[0097] [Chemistry 2]

[0098]

[0099] In the general formula (1), A represents the structure represented by the general formula (2), and the terminal group B represents a hydroxyl group or a group represented by the general formula (3). In the general formula (2), R1 and R2 each independently represent a hydrogen atom or a methyl group. n represents an integer of 1 to 1000. When n is an integer greater than 2, two or more A's may be the same or different. Two terminal groups B may be the same or different.

[0100] Regarding the weight average molecular weight (M) of the phenoxy resin (C) w ), from the viewpoint of more appropriately suppressing bleeding, it is preferably 500 or more, and more preferably 2,000 or more. w From the viewpoint of heat resistance, it is preferably 5,000 or more, and from the viewpoint of more preferably suppressing bleed-out, it is more preferably 20,000 or more. w From the viewpoint of fluidity, it is preferably 100,000 or less.

[0101] As the (C) phenoxy resin, a commercial product can be used. Examples of commercially available (C) phenoxy resins include jER1256, jER4250, and jER4275 manufactured by Mitsubishi Chemical Corporation, and YP-50, YP-50S, YP-70, ZX-1356-2, FX-316, YPB-43C, and YPB-43M manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd. (C) phenoxy resins are not limited to these specific examples. (C) Phenoxy resins can be used alone or in combination of two or more.

[0102] The content of the phenoxy resin (C) in the sealing resin composition is not particularly limited. From the viewpoint of appropriately suppressing the occurrence of bleed-out while maintaining high fluidity and high heat resistance, the content of the phenoxy resin (C) is preferably 0.1 to 15 parts by mass, more preferably 0.5 to 10 parts by mass, and even more preferably 1.5 to 6 parts by mass relative to 100 parts by mass of the epoxy resin (A).

[0103] The content of the (C) phenoxy resin in the sealing resin composition is not particularly limited as long as it is within the range that can obtain the effect of suppressing the occurrence of the exudation phenomenon. For example, with respect to the content of the (C) phenoxy resin, from the viewpoint of heat resistance, it is preferably 3.0% by mass or less, and more preferably 2.0% by mass or less relative to the sealing resin composition. In addition, with respect to the content of the (C) phenoxy resin, from the viewpoint of fluidity, it is preferably 2.0% by mass or less, more preferably 1.5% by mass or less, and further preferably 0.05% by mass to 1.0% by mass. In addition, with respect to the content of the (C) phenoxy resin, from the viewpoint of appropriately suppressing the occurrence of the exudation phenomenon while maintaining high fluidity and high heat resistance, it is preferably 0.05% by mass to 2.0% by mass, more preferably 0.1% by mass to 1.5% by mass, and further preferably 0.3% by mass to 1.2% by mass relative to the sealing resin composition.

[0104] The higher the content and content ratio of the phenoxy resin (C), the greater the effect of suppressing the occurrence of the bleed-out phenomenon tends to be, while the lower the content and content ratio of the phenoxy resin (C), the greater the decrease in fluidity due to the thickening effect tends to be suppressed.

[0105] <(D)Inorganic fillers>

[0106] The sealing resin composition of the present disclosure contains (D) an inorganic filler.

[0107] The cured product of the sealing resin composition containing the (D) inorganic filler tends to be excellent in heat cycle resistance, moisture resistance, and stress reduction.

[0108] The (D) inorganic filler is not particularly limited. Specific examples of the (D) inorganic filler include silica such as colloidal silica, hydrophobic silica, spherical silica, and talc. Spherical silica is preferred from the viewpoint of fluidity during coating.

[0109] In the present disclosure, the term "silica is spherical" means the following.

[0110] First, when natural silica or synthetic silica is heat-treated and spheroidized, there is a situation where the shape of the particles that are not completely melted does not become a true sphere. In addition, there is a situation where particles formed by two or more melted particles are fused to each other and mixed therein. In addition, there is a situation where evaporated silica vapor adheres to the surface of other particles and solidifies, resulting in spherical silica particles with microparticles attached thereto. Although the so-called silica is substantially spherical, particles of such a shape are allowed to be mixed therein, but for example, when the sphericity of the particles is expressed by Wadell's sphericity [(diameter of a circle equal to the projected area of ​​the particle) / (diameter of the smallest circle circumscribed with the projection of the particle)], when the value is 0.9 or more, the particles are more than 90% by mass of the entire inorganic filler silica, then the silica is called "spherical".

[0111] As the (D) inorganic filler, from the viewpoint of fluidity, spherical silica having an average particle diameter of 0.01 μm to 20 μm is preferred, and spherical silica having an average particle diameter of 0.02 μm to 10 μm is more preferred.

[0112] The method for measuring the average particle size in the present disclosure is described below.

[0113] The average particle size refers to the value obtained by measuring the particle size distribution based on the number of particles and their frequency using a laser diffraction / scattering particle size distribution measuring device LA-920 (manufactured by Horiba, Ltd.). As a dispersion solvent, any of water, acetone or ethanol is preferably used to disperse the particles. As measurement conditions, the particle concentration is set to tens of ppm to hundreds of ppm on a mass basis, the ultrasonic treatment time is set to 30 minutes, and the measurement temperature is set to room temperature (25°C).

[0114] The specific surface area of ​​the inorganic filler (D) is not particularly limited. However, from the viewpoint of fluidity and reliability, the specific surface area of ​​the inorganic filler (D) is preferably 0.3 mm 2 / g~300mm 2 / g, more preferably 1.0 mm 2 / g~100mm 2 In addition, the specific surface area of ​​the (D) inorganic filler is measured based on the nitrogen adsorption capacity at 77K in accordance with JIS Z 8830.

[0115] As the (D) inorganic filler, a commercially available product can be used. As a commercially available (D) inorganic filler, spherical silica manufactured by Admatechs Co., Ltd. (product names: SO-E2, SE2300, SE2200-SEJ, etc.) can be cited. The (D) inorganic filler is not limited to these specific examples. The (D) inorganic filler can be used alone or in combination of two or more.

[0116] The (D) inorganic filler may be an inorganic filler that has been surface-treated in advance using at least one of the following (F) coupling agents, or a combination of an (D) inorganic filler that has been surface-treated using a (F) coupling agent and an (D) inorganic filler that has not been surface-treated may be used. By using an (D) inorganic filler that has been surface-treated using a (F) coupling agent, the affinity between the (D) inorganic filler and the resin component is improved, and there is a tendency that the handling and fluidity of the sealing resin composition, as well as the toughness, elastic modulus, and adhesive strength of the cured product can be improved.

[0117] When the surface of the inorganic filler (D) is treated with the coupling agent (F), the ratio of the inorganic filler (D) to the coupling agent (F) is preferably 0.2% by mass to 5.0% by mass, more preferably 0.3% by mass to 3.0% by mass, and even more preferably 0.4% by mass to 2.0% by mass, relative to the inorganic filler (D).

[0118] The content of the (D) inorganic filler is preferably 5 to 80 parts by mass, more preferably 20 to 70 parts by mass, based on 100 parts by mass of the (A) epoxy resin, from the viewpoint of fluidity, insulation reliability, and the like.

[0119] The content of the (D) inorganic filler is preferably 40 to 85 mass %, more preferably 50 to 75 mass %, and even more preferably 55 to 70 mass % based on the sealing resin composition from the viewpoint of fluidity and insulation reliability.

[0120] When the sealing resin composition contains the (D) inorganic filler previously surface-treated with the (F) coupling agent, the content of the (D) inorganic filler previously surface-treated with the (F) coupling agent is preferably 5 to 80 parts by mass, more preferably 20 to 70 parts by mass, based on 100 parts by mass of the (A) epoxy resin, from the viewpoints of fluidity, adhesion, etc.

[0121] When the sealing resin composition contains the (D) inorganic filler that has been surface-treated in advance with the (F) coupling agent, the content thereof is preferably 40% by mass to 85% by mass, more preferably 50% by mass to 75% by mass, and even more preferably 55% by mass to 70% by mass relative to the sealing resin composition from the viewpoints of fluidity, adhesion, etc.

[0122] <(E)Rubber additives>

[0123] The sealing resin composition of the present disclosure may contain (E) a rubber additive as necessary.

[0124] The cured product of the sealing resin composition containing the (E) rubber additive tends to be excellent in stress relaxation.

[0125] The type of the (E) rubber additive is not particularly limited and can be appropriately selected from conventionally known rubber additives. Specific examples of the (E) rubber additive include acrylic rubber, urethane rubber, silicone rubber, butadiene rubber, etc. As for the (E) rubber additive, both a rubber additive that is liquid at 25°C and a rubber additive that is solid at 25°C can be used.

[0126] When the (E) rubber additive is solid at 25°C, the form of the (E) rubber additive is not particularly limited, and examples thereof include particles, powders, and pellets. From the viewpoint of heat resistance, the (E) rubber additive is preferably in the form of particles. When the (E) rubber additive is in the form of particles, the average particle size of the (E) rubber additive is preferably 0.01 μm to 20 μm, more preferably 0.02 μm to 10 μm, and even more preferably 0.03 μm to 5 μm.

[0127] When the (E) rubber additive is liquid at 25° C., examples of the (E) rubber additive include low molecular weight components such as polybutadiene, butadiene-acrylonitrile copolymer, polyisoprene, polypropylene oxide, and polydiorganosiloxane. The weight average molecular weight of the low molecular weight component is preferably 5,000 to 80,000, and more preferably 8,000 to 50,000.

[0128] When the rubber additive (E) is solid at 25°C, it is preferably heated and dissolved in the epoxy resin (A) or the specific curing agent (B) before use. In addition, the rubber additive (E) may use a rubber additive having a group reactive with an epoxy group at the end. As for the rubber additive (E) having a group reactive with an epoxy group at the end, both a rubber additive that is liquid at 25°C and a rubber additive that is solid at 25°C may be used. Examples of the group reactive with the epoxy group include a carboxyl group, a hydroxyl group, and an amino group.

[0129] As the (E) rubber additive, a commercial product can be used. As commercially available (E) rubber additives, examples include: CTBN1300, ATBN1300-16, CTBN1008-SP, etc. manufactured by Ube Industries, Ltd.; silicone rubber powder (product name: AY42-119) manufactured by TORAY DOWCORNING Co., Ltd.; rubber powder (product name: XER81) manufactured by JSR Corporation, etc. (E) rubber additives are not limited to these specific examples. (E) Rubber additives can be used alone or in combination of two or more.

[0130] When the sealing resin composition contains the (E) rubber additive, the content of the (E) rubber additive is preferably 0.2 to 5.0 parts by mass, more preferably 0.5 to 3.0 parts by mass, based on 100 parts by mass of the (A) epoxy resin, from the viewpoint of fluidity, adhesion, etc.

[0131] When the sealing resin composition contains the (E) rubber additive, the content of the (E) rubber additive is preferably 0.05% by mass to 5.0% by mass, more preferably 0.1% by mass to 4.0% by mass, and even more preferably 0.4% by mass to 3.0% by mass relative to the sealing resin composition from the viewpoints of fluidity, adhesion, etc.

[0132] <(F)Coupling agent>

[0133] The sealing resin composition may contain (F) a coupling agent as necessary.

[0134] The sealing resin composition containing the (F) coupling agent tends to be excellent in adhesion.

[0135] The type of the (F) coupling agent is not particularly limited and can be appropriately selected from conventionally known coupling agents. Specific examples of the (F) coupling agent include: silane compounds having at least one selected from primary amino groups, secondary amino groups and tertiary amino groups, silane compounds having epoxy groups, silane compounds having mercapto groups, silane compounds having alkyl groups, silane compounds having phenyl groups, silane compounds having urea groups, silane compounds having methacryloyl groups, silane compounds having acryl groups, silane compounds having vinyl groups, and the like; titanate compounds, etc. Among these, silane compounds having epoxy groups are preferred from the viewpoint of the adhesion of the sealing resin composition.

[0136] As the (F) coupling agent, a commercial product can be used. Examples of commercially available (F) coupling agents include KBM-303, KBM-402, KBM-403, KBE-403, KBE-903, KBE-9103, KBM-573, KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-1003, KBE-585, KBM-9659, KBM-803, KBE-846, KBE-9007, X-12-967C, KBM-103, and KBM-202SS manufactured by Shin-Etsu Chemical Co., Ltd. The (F) coupling agent is not limited to these specific examples. The (F) coupling agent may be used alone or in combination of two or more.

[0137] The (F) coupling agent may be contained in the sealing resin composition in a state of being attached to the surface of the (D) inorganic filler as a surface treatment agent for the (D) inorganic filler.

[0138] When the sealing resin composition contains the coupling agent (F), the content of the coupling agent (F) is preferably 0.2 to 5.0 parts by mass, more preferably 0.5 to 3.0 parts by mass, based on 100 parts by mass of the epoxy resin (A), from the viewpoint of fluidity, heat resistance, etc.

[0139] When the sealing resin composition contains the coupling agent (F), the content of the coupling agent (F) is preferably 0.05% by mass to 5% by mass, more preferably 0.1% by mass to 4.0% by mass, and even more preferably 0.4% by mass to 3.0% by mass based on the sealing resin composition from the viewpoints of fluidity, heat resistance, etc.

[0140] <Other ingredients>

[0141] The sealing resin composition may further contain a thixotropic agent for improving workability, a pigment such as carbon black, a dye, an ion trapping agent, a defoaming agent, a leveling agent, an antioxidant, a curing accelerator, a reactive diluent, an organic solvent, etc. as needed within the range in which the effect of suppressing the occurrence of the bleed phenomenon is obtained.

[0142] <Method for preparing sealing resin composition>

[0143] The sealing resin composition disclosed in the present invention can be obtained as follows: (A) epoxy resin, (B) specific curing agent, (C) phenoxy resin and (D) inorganic filler, and (E) rubber additives, (F) coupling agents and other additives are heated at one time or separately as needed, and stirred, melted, mixed, dispersed, etc., thereby obtained. In particular, when (A) epoxy resin, (B) specific curing agent, (C) phenoxy resin, etc. are solid, sometimes if they are mixed in a solid state, the viscosity increases and the operability decreases, so it is preferably mixed after pre-heating and liquefaction. There is no particular limitation on the devices for mixing, stirring, dispersing, etc., and examples include: a crusher equipped with a stirring device, a heating device, etc., a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc. Using these devices, the above-mentioned components are mixed, kneaded, and defoamed as needed, thereby obtaining a sealing resin composition.

[0144] <Physical properties of sealing resin composition>

[0145] The viscosity of the sealing resin composition is not particularly limited. From the viewpoint of fluidity, the viscosity of the sealing resin composition is preferably 0.1 Pa·s to 100.0 Pa·s at 25°C, and more preferably 0.1 Pa·s to 50.0 Pa·s at 25°C. It should be noted that the viscosity of the sealing resin composition at 25°C can be measured using an E-type viscometer (cone angle 3°, rotation speed 10 rpm).

[0146] When the sealing resin composition is used for the bottom filling material for flip chip, etc., the viscosity of the sealing resin composition is preferably 0.40 Pa·s or less at 110°C, as an index for filling a narrow gap of tens to hundreds of μm at around 100°C to 120°C, more preferably 0.25 Pa·s or less at 110°C, further preferably 0.15 Pa·s or less at 110°C, particularly preferably 0.12 Pa·s or less at 110°C, and further preferably 0.10 Pa·s or less at 110°C. It should be noted that the viscosity of the sealing resin composition at 110°C can be measured using a rheometer AR2000 (manufactured by TA Instrument Japan Co., Ltd., aluminum cone 40 mm, shear rate 32.5 / sec).

[0147] For the sealing resin composition, the ratio of the viscosity at a rotation speed of 2.5 rpm to the viscosity at a rotation speed of 10 rpm measured at 25°C using an E-type viscometer [(viscosity at a rotation speed of 2.5 rpm) / (viscosity at a rotation speed of 10 rpm)], i.e., the thixotropic index is preferably 0.5 to 1.5, and more preferably 0.8 to 1.2. When the thixotropic index is within the above range, there is a tendency to further improve the fillet formation when the sealing resin composition is used as a bottom filling material. It should be noted that the viscosity and thixotropic index of the sealing resin composition can be set to the desired range by appropriately selecting the composition ratio of each component.

[0148] The pot life, which is an index related to the storage stability of the sealing resin composition, is the viscosity change rate before and after storage under an environment of 25° C. for 24 hours, and is calculated by the following formula.

[0149] Pot life (%) = 100 × [(viscosity after storage - viscosity before storage) / viscosity before storage]

[0150] The smaller the value of the pot life is, the higher the storage stability is, and it is preferably 150% or less, more preferably 130% or less, and further preferably 100% or less.

[0151] [cured material]

[0152] The cured product disclosed herein is obtained by curing a sealing resin composition that can suppress the occurrence of oozing out. The sealing resin composition is cured by, for example, heating the sealing resin composition at 80°C to 165°C for 1 minute to 150 minutes to produce a cured product, which is used as a sealing material for sealing electronic components as described below.

[0153] [Electronic component devices]

[0154] The electronic component device disclosed in the present invention comprises: a substrate having a circuit layer; an electronic component disposed on the substrate and electrically connected to the circuit layer; and a cured product of the present invention disposed in a gap between the substrate and the electronic component. The electronic component device disclosed in the present invention can be obtained by sealing the electronic component using the sealing resin composition disclosed in the present invention. By sealing the electronic component using the sealing resin composition disclosed in the present invention, the electronic component device disclosed in the present invention has excellent resistance to temperature cycling.

[0155] Examples of electronic component devices include: electronic component devices in which active elements such as semiconductor chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, resistor arrays, coils, and switches are mounted on a substrate having a circuit layer such as a lead frame, a wired tape carrier, a rigid wiring board, a flexible wiring board, glass, or a silicon wafer, and necessary parts are sealed with the sealing resin composition disclosed herein.

[0156] As one of the objects to which the present disclosure can be applied, in particular, a semiconductor device obtained by flip-chip bonding a semiconductor element using bump connection on wiring formed on a rigid wiring board, a flexible wiring board or glass can be cited. As specific examples, electronic component devices such as flip-chip BGA (Ball Grid Array), LGA (Land Grid Array), COF (Chip On Film) can be cited.

[0157] The sealing resin composition disclosed in the present invention is suitable as a bottom filling material for flip chips with excellent reliability. As a flip chip field that is particularly suitable for applying the sealing resin composition disclosed in the present invention, there are the following components: flip chip semiconductor components in which the bump material connecting the wiring substrate and the semiconductor element does not use the conventional lead-containing solder, but uses lead-free solder such as Sn-Ag-Cu system. For flip chips obtained by using lead-free solder, which is relatively brittle in terms of physical properties compared to conventional lead solder, for bump connection, the sealing resin composition disclosed in the present invention can also maintain good reliability. In addition, when a chip-level package such as a wafer-level CSP is mounted on a substrate, the reliability can be improved by applying the sealing resin composition disclosed in the present invention.

[0158] [Method for manufacturing electronic component device]

[0159] The method for producing an electronic component device of the present disclosure includes the step of sealing a substrate having a circuit layer and an electronic component disposed on the substrate and electrically connected to the circuit layer with the sealing resin composition of the present disclosure.

[0160] The process of sealing the substrate and electronic components with the circuit layer using the sealing resin composition disclosed in the present invention is not particularly limited. Examples include: a post-injection method, in which after connecting the electronic component and the substrate with the circuit layer, the sealing resin composition is applied to the gap between the electronic component and the substrate by using the capillary phenomenon, and then the curing reaction of the sealing resin composition is carried out; and a pre-coating method, in which the sealing resin composition disclosed in the present invention is first applied to the surface of at least one of the substrate with the circuit layer and the electronic component, and when the electronic component is connected to the substrate by thermal compression, the connection between the electronic component and the substrate and the curing reaction of the sealing resin composition are carried out at one time.

[0161] Examples of a method for applying the sealing resin composition include a casting method, a dispensing method, and a printing method.

[0162] The curing conditions when curing the sealing resin composition applied to the gap between the electronic component and the substrate are not particularly limited, but for example, a heat treatment at 80° C. to 165° C. for 1 minute to 150 minutes is preferably performed.

[0163] By using the sealing resin composition of the present disclosure, it is possible to easily produce an electronic component device such as a flip chip package in which the occurrence of a bleed-out phenomenon is suppressed.

[0164] Example

[0165] The present invention will be described below based on examples, but the present invention is not limited to the following examples. It should be noted that in the following examples, parts and % represent parts by mass and % by mass unless otherwise specified.

[0166] (Examples 1 to 14, Comparative Example 1)

[0167] The components were mixed in a manner to form the compositions shown in Tables 1 and 2, and kneaded and dispersed using a three-roll mill and a vacuum crusher to prepare the sealing resin compositions of Examples 1 to 14 and Comparative Example 1. It should be noted that the mixing unit in the table is parts by mass, and "-" means "not mixed". In addition, the content (mass %) of the inorganic filler in the sealing resin composition is calculated from the mixing amount of each component.

[0168] As (A) epoxy resin, the following materials were prepared.

[0169] Epoxy resin 1: an amine-type epoxy resin having a trifunctional epoxy group (manufactured by Mitsubishi Chemical Corporation, trade name "jER-630", epoxy equivalent: 96 g / eq, weight average molecular weight: 290)

[0170] Epoxy resin 2: Bisphenol F type epoxy resin (manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., trade name "YDF-8170C", epoxy equivalent: 160 g / eq, weight average molecular weight: 350)

[0171] As (B) a specific curing agent, the following materials were prepared.

[0172] · Amine curing agent 1: diaminotoluene type amine curing agent (Mitsubishi Chemical Corporation, trade name "jER CureW")

[0173] · Amine curing agent 2: diaminophenylmethane type amine curing agent (manufactured by Nippon Kayaku Co., Ltd., trade name "Kayahard-AA")

[0174] As (C) phenoxy resin, the following materials were prepared.

[0175] Phenoxy resin 1: a phenoxy resin having a bisphenol A type structure (manufactured by Mitsubishi Chemical Corporation, trade name "1001", weight average molecular weight: 900)

[0176] Phenoxy resin 2: a phenoxy resin having a bisphenol A type structure (manufactured by Mitsubishi Chemical Corporation, trade name "1007", weight average molecular weight 2900)

[0177] Phenoxy resin 3: a phenoxy resin having a bisphenol A type structure (manufactured by Mitsubishi Chemical Corporation, trade name "1010", weight average molecular weight 5500)

[0178] · Phenoxy resin 4: a phenoxy resin having a bisphenol A type structure (manufactured by Mitsubishi Chemical Corporation, trade name "1256", weight average molecular weight 50,000)

[0179] · Phenoxy resin 5: a phenoxy resin having a bisphenol F type structure (manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., trade name “ZX-1356-2”, weight average molecular weight 50,000)

[0180] As (D) the inorganic filler, the following materials were prepared.

[0181] Inorganic filler 1: Spherical silica treated with a silane compound having an epoxy group and having an average particle size of 0.5 μm (manufactured by Admatechs Co., Ltd., trade name “SE2200-SEJ”)

[0182] As a colorant, carbon black (manufactured by Mitsubishi Chemical Corporation, trade name “MA-100”) was prepared.

[0183] The sealing resin composition obtained using the above materials was evaluated for various properties as follows. In addition, various numerical values ​​are shown in Tables 1 and 2 below.

[0184] (1) Fluidity: viscosity and thixotropic index

[0185] The viscosity of the sealing resin composition at 25°C (normal temperature viscosity, Pa·s) was measured with a sample amount of 2.5 mL using an E-type viscometer (cone angle 3°, rotation speed 10 rpm). The thixotropic index at 25°C was defined as the ratio of the viscosity at a rotation speed of 2.5 rpm to the viscosity at a rotation speed of 10 rpm [(viscosity at a rotation speed of 2.5 rpm) / (viscosity at a rotation speed of 10 rpm)].

[0186] The viscosity (Pa·s) at 110° C. was measured using a rheometer AR2000 (aluminum cone 40 mm, shear rate 32.5 / sec) with a sample amount of 0.7 mL.

[0187] (2) Heat resistance: glass transition temperature (Tg) and coefficient of thermal expansion (CTE)

[0188] The sealing resin composition was cured at 150°C for 120 minutes to prepare a test piece (φ4 mm×20 mm). The prepared test piece was measured for glass transition temperature (Tg) and thermal expansion coefficient (CTE) using a thermomechanical analyzer (TA Instrument Japan Co., Ltd., trade name TMAQ400) under conditions of a load of 15 g, a measurement temperature of -50°C to 220°C, and a heating rate of 5°C / min.

[0189] The thermal expansion coefficient in the temperature range below Tg is defined as CTE1, and the thermal expansion coefficient in the temperature range above Tg is defined as CTE2. Tg and CTE indicate thermal stability, and Tg is preferably about 100°C to 130°C. The lower the CTE1 and CTE2, the more preferable.

[0190] (3) Determination of seepage length

[0191] The solder resist substrate was subjected to Ar2 plasma treatment (400W, 2 minutes), and 30 mg of the sealing resin composition filled in the syringe was ejected onto the solder resist substrate subjected to Ar2 plasma treatment with a 25G needle for potting, and cured at 150°C for 120 minutes. After curing, the length of the seepage was measured with an optical microscope. The substrates used were substrates having solder resist 1 (PSR-4000-AUS308 manufactured by Taiyo Ink Manufacturing Co., Ltd.) and solder resist 2 (PSR-4000-AUS703 manufactured by Taiyo Ink Manufacturing Co., Ltd.) formed on FR-4 (made by Hitachi Chemical Co., Ltd., MRC-E-679). For both substrates, the shorter the seepage length, the better.

[0192] [Table 1]

[0193]

[0194] [Table 2]

[0195]

[0196] From the results in Tables 1 and 2, it can be seen that the sealing resin compositions of Examples 1 to 14 are excellent in heat resistance and fluidity, and have shorter oozing than the sealing resin composition of Comparative Example 1. It can be seen that the sealing resin composition of this example can suppress the occurrence of oozing while maintaining high heat resistance and high fluidity.

[0197] All documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each document, patent application, and technical standard was specifically and individually described.

Claims

1. A sealing resin composition comprising (A) an epoxy resin, (B) a curing agent having at least one amino group, (C) a resin having a phenoxy structure, and (D) an inorganic filler, The (A) epoxy resin comprises an epoxy resin having a viscosity of 50 Pa·s or less at 25° C., The curing agent (B) having at least one amino group is at least one selected from the following: m-phenylenediamine, 2,4-diaminotoluene, 3,5-diethyl-2,4-diaminotoluene, 3,5-diethyl-2,6-diaminotoluene, 2,4-diaminoanisole, an aromatic amine curing agent having one aromatic ring other than the above compounds, 2,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 4,4'-methylenebis(2-ethylaniline), 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetraethyl-4,4'-diaminodiphenylmethane, a hydrolysis condensate of an aromatic amine curing agent, an aromatic amine having a polyether structure, a condensate of an aromatic diamine and epichlorohydrin, and a reaction product of an aromatic diamine and styrene. The weight average molecular weight M of the resin (C) having a phenoxy structure w It is 500 or more and 5,500 or less.

2. The sealing resin composition according to claim 1, wherein The weight average molecular weight M of the resin (C) having a phenoxy structure w It is 2,000 or more and 5,500 or less.

3. The sealing resin composition according to claim 1 or claim 2, wherein The resin (C) having a phenoxy structure includes a compound represented by the following general formula (1): In the general formula (1), A represents the structure represented by the general formula (2), and the terminal group B represents a hydroxyl group or a group represented by the general formula (3); in the general formula (2), R1 and R2 each independently represent a hydrogen atom or a methyl group; n represents an integer of 1 to 1000; when n is an integer greater than 2, two or more A's are the same or different; and two terminal groups B are the same or different. 4 . The sealing resin composition according to claim 1 , wherein the content of the resin (C) having a phenoxy structure is 0.05% by mass to 2.0% by mass based on the sealing resin composition. 5 . 5 . The sealing resin composition according to claim 1 or 2 , which is used for sealing electronic component devices. 6 . A cured product obtained by curing the sealing resin composition according to claim 1 .

7. An electronic component device comprising: a substrate having a circuit layer; An electronic component disposed on the substrate and electrically connected to the circuit layer; and The cured product according to claim 6, arranged in the gap between the substrate and the electronic component. 8 . A method for producing an electronic component device, comprising: sealing a substrate having a circuit layer and an electronic component disposed on the substrate and electrically connected to the circuit layer with the sealing resin composition according to claim 1 .

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