Clamp suitable for electron beam remelting sample
By designing a fixture with lifting function and locking mechanism, the problems of inconsistent surface heights of samples of different thicknesses and easy fixture damage in the prior art are solved, and efficient remelting tests for samples of different thicknesses and the service life of the fixture are achieved.
Patent Information
- Application Number
- CN202510173883.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2025-04-15
AI Technical Summary
When the existing fixtures for electron beam remelting samples support fixed samples, it is difficult to ensure that the surfaces to be modified for different thicknesses are highly consistent, and the fixtures are easily damaged during electron beam remelting, shortening their service life.
A clamp including a base, a sample support assembly, a sample limiting member and a locking member is designed. The sample support assembly can drive the sample to rise and fall, and the locking member locks the sample limit when the sample reaches a specific height, ensuring that the focus of the electron beam is higher than the sample limit and avoiding damage.
The fixture can perform remelting tests on sample surfaces of different thicknesses while keeping the electron beam parameters the same, ensuring that the surface to be modified is consistent and extending the service life of the fixture.
Smart Images
Figure CN119824212A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of processing metal materials, and in particular to a fixture suitable for electron beam remelting samples. Background Art
[0002] The statements herein merely provide background information related to the present application and do not necessarily constitute prior art.
[0003] In some cases, in order to improve the performance of metal materials, it is necessary to modify the surface of the metal materials. The metal materials can be modified by electron beam remelting. When the metal materials are modified by electron beam remelting, a fixture can be set to support and fix the metal materials.
[0004] Currently, there are still many limitations in the fixtures used to support and fix electron beam remelted samples. Summary of the invention
[0005] A brief overview of the present application is provided below in order to provide a basic understanding of certain aspects of the present application. It should be understood that this overview is not an exhaustive overview of the present application. It is not intended to identify the key or important parts of the present application, nor is it intended to limit the scope of the present application. Its purpose is merely to present certain concepts in a simplified form as a prelude to a more detailed description discussed later.
[0006] The embodiment of the present application provides a fixture suitable for electron beam remelting samples, which includes a base, a sample support assembly, a sample stopper and a locking member. The sample support assembly is used to provide support for the sample and is configured to drive the sample to rise and fall relative to the base; the sample stopper is fixedly connected to the base and is used to limit the movement of the sample in the horizontal direction; the locking member is used to lock the sample and the sample stopper on the side of the sample when the sample support assembly drives the sample to rise above the upper surface of the sample stopper to fix the sample.
[0007] In the fixture provided by the embodiment of the present application, when the sample support assembly drives the sample to raise the surface of the sample to be modified to a level higher than the upper surface of the sample stopper, the sample and the sample stopper are locked on the side of the sample by a locking member, so that the focus of the electron beam can be higher than the upper surface of the sample stopper during electron beam remelting, so as to avoid the electron beam from damaging the sample stopper. Since the sample support assembly can drive the sample to rise and fall relative to the base, when the fixture supports and fixes samples of different thicknesses, the height of the surface of the sample to be modified of the samples of different thicknesses can be kept consistent and higher than the upper surface of the sample stopper, so that the surfaces of samples of different thicknesses can be remelted while keeping the electron beam parameters the same. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Other objects and advantages of the present application will become apparent from the following description of the embodiments of the present application with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the present application.
[0009] Figure 1 Schematic diagram of a fixture provided in an embodiment of the present application, in which a sample is schematically drawn.
[0010] Figure 2 yes Figure 1 A cross-sectional view of the fixture is shown.
[0011] Figure 3 yes Figure 1 An exploded schematic diagram of the clamp is shown.
[0012] Figure 4 yes Figure 1 The clamp is shown in an exploded schematic view at another angle.
[0013] Description of reference numerals:
[0014] 100. Clamp;
[0015] 10. base; 101. through hole; 102. guide hole; 103. positioning fitting;
[0016] 20. Sample support assembly;
[0017] 21. Support body; 2101. Cooling medium channel; 2102. Mounting slot; 211. Cooling medium inlet; 212. Cooling medium outlet; 210. Temperature measuring element;
[0018] 22. lifting mechanism; 221. rotating shaft; 222. lifting member; 2221. cam; 2222. roller; 223. operating member;
[0019] 23. Fixing part; 24. Guide part; 25. Heat-resistant part;
[0020] 30. Sample stopper; 311. First plate; 312. Second plate; 32. Locking member; 301. U-shaped groove;
[0021] 200. Samples.
[0022] It should be noted that the drawings are not necessarily drawn to scale, but are merely shown in a schematic manner that does not affect the reader's understanding. DETAILED DESCRIPTION
[0023] Exemplary embodiments of the present application will be described below in conjunction with the accompanying drawings. For the sake of clarity and conciseness, not all features of the actual implementation are described in the specification. However, it should be understood that many implementation-specific decisions must be made in the process of developing any such actual implementation in order to achieve the developer's specific goals, such as meeting those constraints related to the system and business, and these constraints may vary from implementation to implementation. In addition, it should be understood that although the development work may be very complex and time-consuming, it is only a routine task for those skilled in the art who benefit from the content of this application.
[0024] It is also necessary to explain here that, in order to avoid obscuring the present application due to unnecessary details, only the device structure and / or processing steps closely related to the scheme according to the present application are shown in the accompanying drawings, while other details that are not very relevant to the present application are omitted.
[0025] In the related art, the fixture used for electron beam remelting samples usually clamps the sample on the surface to be processed, thereby affecting the remelting of the entire surface to be modified by the electron beam; in addition, during electron beam remelting, the electron beam will cause certain damage to the fixture, shortening the service life of the fixture. In addition, the inventors of the present application found that when electron beam remelting samples of different thicknesses, the fixture in the related art is difficult to ensure that the height of the surface to be modified of each sample remains consistent. When remelting test is performed on the surface of samples of different thicknesses while keeping the electron beam parameters the same, the focus parameters of the electron beam need to be adjusted separately, which is inconvenient to operate.
[0026] In view of the above problems, an embodiment of the present application provides a fixture suitable for electron beam remelting samples.
[0027] See also Figure 1 and Figure 2 , Figure 1 is a schematic structural diagram of a clamp 100 provided in an embodiment of the present application, Figure 2 yes Figure 1 The cross-sectional view of the clamp 100 is shown. The clamp 100 includes a base 10, a sample support assembly 20, a sample stopper 30 and a locking member 32. The sample support assembly 20 is used to provide support for the sample 200, and is configured to drive the sample 200 to rise and fall relative to the base 10. The sample stopper 30 is fixedly connected to the base 10, and is used to limit the movement of the sample 200 in the horizontal direction. The locking member 32 is used to lock the sample 200 with the sample stopper 30 on the side of the sample 200 when the sample support assembly 20 drives the sample 200 to rise to a level higher than the upper surface of the sample stopper 30, so as to fix the sample 200.
[0028] The clamp 100 provided in the embodiment of the present application, when the sample support assembly 20 drives the sample 200 to rise to the point where the surface to be modified of the sample 200 is higher than the upper surface of the sample limiter 30, the sample 200 is locked with the sample limiter 30 by the locking member 32, so that the focus of the electron beam can be higher than the upper surface of the sample limiter 30 during electron beam remelting, so as to avoid the electron beam from damaging the sample limiter 30; since the sample 200 and the sample limiter 30 are locked on the side of the sample 200 by the locking member 32, the surface to be modified of the sample 200 will not be blocked, thereby affecting the modification of the sample 200; since the sample support assembly 20 can drive the sample 200 to rise and fall relative to the base 10, when the clamp 100 supports and fixes samples 200 of different thicknesses, the heights of the surfaces to be modified of samples 200 of different thicknesses can be kept consistent and higher than the upper surface of the sample limiter 30, so that the surfaces of samples 200 of different thicknesses can be remelted while keeping the electron beam parameters the same.
[0029] For example, when the thickness of the sample 200 is relatively small, the sample support assembly 20 can be used to drive the sample 200 to rise relative to the base 10 so that the surface to be modified of the sample 200 is higher than the upper surface of the sample stopper 30 .
[0030] In some embodiments, the surface to be modified of the sample 200 is higher than the upper surface of the sample stopper 30 by more than 0.05 mm, for example, higher than 1 mm. The thickness of the sample 200 may be greater than or equal to 4 mm. For samples 200 of different thicknesses, the height can be fine-tuned by the sample support assembly 20 so that the surfaces to be modified of the samples 200 of different thicknesses are all higher than the upper surface of the sample stopper 30 by the same height.
[0031] In some embodiments, the sample 200 may be in the form of a plate.
[0032] See also Figure 3 and Figure 4 , Figure 3 and Figure 4The exploded schematic diagrams of the clamp 100 are shown from different angles. In some embodiments, the sample support assembly 20 may include a support body 21, a lifting mechanism 22, and a fixing member 23. The support body 21 is used to support the sample 200, the lifting mechanism 22 is used to drive the support body 21 to move up and down relative to the base 10, and the fixing member 23 is used to fix the support body 21 when the support body 21 drives the sample 200 to rise above the upper surface of the sample stopper 30. In such an embodiment, for samples 200 with different thicknesses, the height can be fine-tuned by the lifting mechanism 22, so that the surfaces to be modified of the samples 200 with different thicknesses are all higher than the upper surface of the sample stopper 30 and have the same height; at the same time, the support body 21 can be fixed by the fixing member 23, so that the surface to be modified of the sample 200 can be kept at a position higher than the upper surface of the sample stopper 30.
[0033] The inventors of the present application have found that electron beam remelting is performed in a vacuum environment. During the electron beam remelting process, the heat of the electron beam will accumulate in the sample 200, causing the temperature of the sample 200 to rise, thereby causing the temperature of the support body 21 to rise. In this case, the support body 21 may evaporate, which may cause the vacuum degree of the vacuum environment to change. In response to this problem, in some embodiments, a cooling medium channel 2101 is formed inside the support body 21 to use a cooling medium to cool the support body 21, thereby preventing the support body 21 from evaporating, thereby preventing the vacuum degree of the vacuum environment from changing.
[0034] The support body 21 can not only support the sample 200, but also conduct heat from the sample 200 to increase the cooling rate of the sample 200. In some embodiments, the support body 21 can be made of copper so that the support body 21 can have a good thermal conductivity. Since copper has a low melting point, the cooling medium in the cooling medium channel 2101 can be used to cool the support body 21 made of copper, thereby effectively preventing copper evaporation.
[0035] See also Figure 1 In some embodiments, the support body 21 is provided with a cooling medium inlet 211 and a cooling medium outlet 212, and both the cooling medium inlet 211 and the cooling medium outlet 212 are connected to the cooling medium channel 2101; when the support body 21 is cooled, the cooling medium can enter the cooling medium channel 2101 through the cooling medium inlet 211 and circulate out through the cooling medium channel 2101.
[0036] In some embodiments, the cooling medium may be water.
[0037] See also Figure 1In some embodiments, the fixture 100 may further include a temperature measuring element 210 for measuring the temperature of the support body 21, so as to control the temperature and / or flow rate of the cooling medium entering the cooling medium channel 2101 according to the parameters of the electron beam remelting and the temperature measured by the temperature measuring element 210, so as to avoid evaporation of the support body 21.
[0038] In some embodiments, the cooling medium may also be cooled using a refrigerator according to the temperature measured by the temperature measuring element 210. For example, when the temperature measured by the temperature measuring element 210 is greater than the set temperature of the support body 21, the refrigerator starts cooling to reduce the temperature of the cooling medium; when the temperature measured by the temperature measuring element 210 is less than or equal to the set temperature of the support body 21, the refrigerator stops cooling. The set temperature of the support body 21 may be, for example, 20°C.
[0039] See also Figure 3 and Figure 4 In some embodiments, the sample support assembly 20 may further include a guide member 24, which is configured to guide the support body 21 to only move up and down when the lifting mechanism 22 drives the support body 21 to move up and down relative to the base 10. In such an embodiment, the above configuration can prevent the support body 21 from tilting when the lifting mechanism 22 drives the support body 21 to move up and down, thereby causing the sample 200 to tilt and affecting the electron beam remelting effect.
[0040] See also Figure 3 and Figure 4 In some embodiments, the base 10 forms a plurality of guide holes 102; the guide members 24 are a plurality of guide rods connected to the support body 21, the guide rods enter the guide holes 102, and are configured to be able to move vertically relative to the guide holes 102. In such an embodiment, the guide rods enter the guide holes 102 and move vertically relative to the guide holes 102, so that the guide rods can only move up and down, and further the support body 21 connected to the guide rods can only move up and down, thereby preventing the support body 21 from tilting during the lifting process.
[0041] In other embodiments, the support body 21 forms a plurality of guide holes, which are respectively located on both radial sides of the rotating shaft 221; the guide members 24 are a plurality of guide rods connected to the base 10, which enter the guide holes and are configured to be able to move vertically relative to the guide holes.
[0042] In some embodiments, there is a clearance fit between the guide hole 102 and the guide rod to ensure that the support body 21 can be stably lifted and lowered.
[0043] In some cases, the space for accommodating the fixture 100 in the electron beam remelting equipment is small, requiring the overall thickness of the fixture 100 to be 4-5 cm. In this case, common lifting mechanisms 22 such as lead screws and cylinders are not suitable for use in the fixture 100.
[0044] In some embodiments, the lifting mechanism 22 may include a rotating shaft 221, a lifting member 222, and an operating member 223. The rotating shaft 221 is rotatably connected to the base 10; the lifting member 222 is connected to the rotating shaft 221, and is used to contact the support body 21; when the rotating shaft 221 rotates, the lifting member 222 rotates around the rotating shaft 221 to drive the support body 21 to rise and fall; the operating member 223 is fixedly connected to the rotating shaft 221, and is used to drive the rotating shaft 221 to rotate. The fixing member 23 can be used to fix the rotating shaft 221 when the rotating shaft 221 rotates to make the support body 21 rise to a preset height, so as to prevent the rotating shaft 221 from rotating. In such an embodiment, the above arrangement can satisfy the requirement of driving the support body 21 to rise and fall relative to the base 10, and at the same time, it can also make the overall height of the clamp 100 before and after the support body 21 rises and falls smaller, so that it is suitable for use in electron beam remelting equipment with a smaller space.
[0045] The plurality of guide holes 102 are respectively located on both sides of the rotating shaft 221 in a radial direction, so as to facilitate the stable lifting and lowering of the supporting body 21 .
[0046] The inventor of the present application has found that if there is sliding friction between the lifting member 222 and the supporting body 21, when the rotating shaft 221 rotates, the friction force will provide a lateral force to the supporting body 21, causing the supporting body 21 and the guide rod to move in the lateral direction, thereby increasing the friction between the guide rod and the guide hole 102, making it difficult for the guide rod to move vertically relative to the guide hole 102. For this problem, see Figure 2 and Figure 3 In some embodiments, the lifting member 222 may include a cam 2221 and a roller 2222. The cam 2221 is fixedly connected to the rotating shaft 221; the roller 2222 is rotatably connected to the cam 2221, and the roller 2222 is used to roll in contact with the support body 21. In the embodiment of the present application, the roller 2222 rolls in contact with the support body 21. When the rotating shaft 221 rotates, the friction between the roller 2222 and the support body 21 is small, so that the support body 21 and the guide rod are prevented from moving laterally, thereby preventing the friction between the guide rod and the guide hole 102 from being too large to affect the relative movement between the guide rod and the guide hole 102 along the axial direction.
[0047] In some embodiments, the cross section of the cam 2221 along a plane perpendicular to the axis of the rotating shaft 221 has an eggshell shape. A rotating hole is formed on the side with a larger eggshell size, and the rotating shaft 221 passes through the rotating hole and is fixedly connected to the cam 2221. The side with a smaller eggshell size is connected to the roller 2222. The rotation direction of the roller 2222 is perpendicular to the rotation direction of the rotating shaft 221.
[0048] See also Figure 3 and Figure 4 In some embodiments, the base 10 may form two through holes 101 for the rotating shaft 221 to pass through. The operating member 223 is connected to one end of the rotating shaft 221, and the other end of the rotating shaft 221 is formed with a thread. The fixing member 23 is threadedly connected to the rotating shaft 221 outside the base 10, and the fixing member 23 is tightened along the axial direction to prevent the rotating shaft 221 from rotating by friction. The fixing member 23 is, for example, a nut.
[0049] In some embodiments, the operating member 223 may be a handle.
[0050] See also Figure 2 and Figure 3 In some embodiments, the sample support assembly 20 may further include a plurality of heat-resistant parts 25, which are used to support the sample 200, and the melting point of the heat-resistant parts 25 is higher than that of the support body 21. A plurality of mounting grooves 2102 are formed on the upper surface of the support body 21, and each heat-resistant part 25 is arranged in a corresponding mounting groove 2102. The inventors of the present application have found that in some cases (for example, when the support body 21 is copper), when the surface to be modified of the sample 200 is electron beam remelted, the heat accumulated by the electron beam in the sample 200 may cause the upper surface of the support body 21 to melt and adhere to the sample 200. Therefore, the embodiment of the present application sets the heat-resistant part 25 so that the support body 21 does not directly contact the sample 200, and the melting of the upper surface of the support body 21 is avoided, which is conducive to ensuring the integrity of the sample 200. At the same time, it is ensured that the sample 200 does not tilt due to the melting of the upper surface of the support body 21. In such an embodiment, the support body 21 can cool the sample 200 by thermal radiation, thereby increasing the cooling rate of the sample 200 and removing excess heat in a timely manner.
[0051] The melting point of the heat-resistant member 25 may be higher than 2000° C. In some embodiments, the heat-resistant member 25 may be made of alumina ceramic or other high melting point heat-conductive metals (such as tungsten, tantalum and other metals).
[0052] In some embodiments, the heat-resistant member 25 is strip-shaped, and multiple heat-resistant members 25 are evenly spaced in corresponding mounting grooves 2102. In such an embodiment, the above arrangement can provide better support for the sample 200, and the support body 21 can evenly cool down all parts of the sample 200.
[0053] In some embodiments, the heat-resistant member 25 is 1-5 mm higher than the upper surface of the support body 21 .
[0054] See also Figure 1 and Figure 2 In some embodiments, the sample limiter 30 may be a limiter frame. The sample limiter 30 may include two first plates 311 arranged opposite to each other and a second plate 312 connected to the two first plates 311 on the same side; the second plate 312 and the two first plates 311 together form a U-shaped groove 301. When the sample support assembly 20 drives the sample 200 to rise and fall, the sample 200 can move up and down in the U-shaped groove 301. In such an embodiment, the U-shaped groove 301 can limit the movement of the sample 200 in the horizontal direction, and can also adapt to samples 200 with slightly different sizes.
[0055] In some embodiments, a locking hole is formed on one side of the first plate 311, and the locking member 32 can enter the locking hole to press the side of the sample 200 against the other first plate 311, so as to lock the sample 200 with the sample stopper 30. When the locking member 32 locks the sample 200 with the sample stopper 30, the surface to be modified of the sample 200 is higher than the first plate 311 and the second plate 312. The clamp 100 provided in the embodiment of the present application can avoid damage to the surface to be modified of the sample 200 during the process of clamping the sample 200.
[0056] The locking member 32 is, for example, a jackscrew.
[0057] See also Figure 4 In some embodiments, the lower surface of the base 10 is further formed with a plurality of positioning fittings 103, which are used to cooperate with a plurality of positioning fittings of the sample stage of the electron beam remelting device to position the fixture 100. The positioning fittings 103 are, for example, positioning holes, and the positioning fittings of the sample stage of the electron beam remelting device are, for example, positioning pins.
[0058] The following describes the use of the clamp 100 provided in the embodiment of the present application in conjunction with a specific embodiment.
[0059] Rotate the handle 223 to lower the support body 21 to the lowest position, place the sample 200 on the support body 21, and make one side of the sample 200 contact the second plate 312 of the sample limiter 30; rotate the handle 223 to adjust the height of the sample 200 so that the surface to be modified of the sample 200 is 1 mm higher than the upper surface of the sample limiter 30; fix the rotating shaft 221 by the nut 23 to fix the height of the support body 21, thereby fixing the height of the sample 200; press the sample 200 against the first plate 311 by the top screw 32 to complete the fixation of the sample 200; introduce cooling water into the cooling medium channel 2101 of the support body 21 to cool the support body 21.
[0060] Regarding the embodiments of the present application, it should also be noted that, in the absence of conflict, the embodiments of the present application and the features therein can be combined with each other to obtain new embodiments.
[0061] The above are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. The protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A fixture suitable for electron beam remelting samples, characterized in that: include: Base; A sample support assembly, used to provide support for the sample and configured to drive the sample to rise and fall relative to the base; A sample limiting member, fixedly connected to the base, and used to limit the movement of the sample in the horizontal direction; The locking member is used to lock the sample and the sample limiting member at the side of the sample to fix the sample when the sample support assembly drives the sample to rise above the upper surface of the sample limiting member.
2. The clamp according to claim 1, characterized in that: The sample support assembly includes: a support body, a lifting mechanism and a fixing member. The support body is used to support the sample, the lifting mechanism is used to drive the support body to move up and down relative to the base, and the fixing member is used to fix the support body when the support body drives the sample to rise above the upper surface of the sample limiting member.
3. The clamp according to claim 2, characterized in that: A cooling medium channel is formed inside the support body so as to utilize the cooling medium to cool the support body.
4. The clamp according to claim 2, characterized in that: The sample support assembly further includes: a guide member, which is configured to guide the support body to move only up and down when the lifting mechanism drives the support body to move up and down relative to the base.
5. The clamp according to claim 4, characterized in that: One of the base or the support body is formed with a plurality of guide holes; The guide members are a plurality of guide rods connected to the other of the support body or the base, the guide rods enter the guide holes, and are arranged to be able to move vertically relative to the guide holes.
6. The clamp according to claim 2, characterized in that: The lifting mechanism comprises: A rotating shaft, the rotating shaft is rotatably connected to the base; A lifting member connected to the rotating shaft and used for contacting the supporting body; when the rotating shaft rotates, the lifting member rotates around the rotating shaft to drive the supporting body to rise and fall; An operating member, fixedly connected to the rotating shaft, and used to drive the rotating shaft to rotate; The fixing member is used to fix the rotating shaft when the rotating shaft rotates to make the supporting body rise to a preset height, so as to prevent the rotating shaft from rotating.
7. The clamp according to claim 6, characterized in that The lifting member comprises: A cam, wherein the cam is fixedly connected to the rotating shaft; A roller is rotatably connected to the cam, and the roller is used for rolling contact with the supporting body.
8. The clamp according to claim 2, characterized in that: The sample support assembly further comprises: a plurality of heat-resistant parts for supporting the sample, wherein the melting point of the heat-resistant parts is higher than that of the support body; A plurality of mounting grooves are formed on the upper surface of the support body, and each of the heat-resistant components is arranged in a corresponding one of the mounting grooves.
9. The clamp according to claim 8, characterized in that The heat-resistant member is in a strip shape, and the plurality of heat-resistant members are arranged in the corresponding installation grooves at equal intervals.
10. The clamp according to any one of claims 1 to 9, characterized in that: The sample limiting member comprises: two first plates arranged opposite to each other and a second plate connected to the two first plates on the same side, wherein the second plate and the two first plates together form a U-shaped groove; When the sample supporting assembly drives the sample to move up and down, the sample can move up and down in the U-shaped groove.