Double-optical-path wafer displacement measuring device

Abstract

The invention relates to the technical field of wafer displacement measurement, in particular to a double-optical-path wafer displacement measuring device which comprises a measuring device, a supporting frame is fixedly connected to the top of the measuring device, and transverse linear modules are fixedly connected to the two sides of the top of the supporting frame. The surfaces of the two transverse linear modules are jointly connected with two longitudinal linear modules in a sliding mode. The device has the advantages that the stability in the wafer measurement process is improved, and the reliability of a measurement result is ensured, in the actual use process, when the transverse linear module and the longitudinal linear module are used for accurately adjusting the left-right position and the front-back position of the workbench, the wafer can also move along with the measured key object, and the measurement accuracy is improved. Under the action of the stabilizing assembly, the wafer can be firmly locked, any unnecessary relative displacement between the wafer and the workbench in the adjusting process is prevented, and it is ensured that an accurate and errorless result can be obtained in each time of measurement.

Description

Technical Field

[0001] The invention relates to the technical field of wafer displacement measurement, in particular to a dual-optical path wafer displacement measurement device. Background Art

[0002] The dual-optical path wafer displacement measurement device is based on optical principles. It uses two or more optical paths to simultaneously illuminate the wafer surface and uses the reflection or interference phenomenon of light on the wafer surface to measure the displacement change of the wafer. This method can achieve non-contact measurement and avoid damage to the wafer surface.

[0003] As an indispensable basic material for semiconductor manufacturing, the physical properties of wafers, especially surface quality and thickness uniformity, play a decisive role in the subsequent manufacturing process and the performance of the final product. These properties are not only related to the electrical performance of the chip, but also directly affect the reliability and service life of the chip. Therefore, in the entire process of wafer manufacturing, accurate and multiple measurements of wafers are a key step to ensure product quality.

[0004] However, in the actual measurement process, the position adjustment of the wafer has become an issue that requires careful consideration. In order to obtain accurate measurement data, the left and right, front and back positions of the wafer often need to be finely adjusted before measurement. However, this adjustment process can easily cause the wafer to undergo a slight displacement. Although this displacement may seem insignificant, it may have a significant impact on the measurement results, thereby misleading subsequent process adjustments, reducing the product yield, and greatly reducing the accuracy and reliability of the measurement results.

[0005] In addition, the placement of mirrors and lenses in the measurement system is also an important factor affecting measurement accuracy. In existing measurement devices, mirrors and lenses are usually fixed in specific positions. Although this fixed layout simplifies the installation and maintenance process, it also limits the flexibility and adaptability of the measurement system. With the continuous increase in wafer size and the increasing complexity of manufacturing processes, fixed-position mirrors and lenses may not be able to fully meet measurement requirements, resulting in limited measurement range or reduced measurement accuracy. The disadvantage at this time is that fixed-position mirrors and lenses limit the flexibility and accuracy of the measurement system, making it difficult for the measurement system to achieve optimal measurement results when facing wafers of different sizes and shapes.

[0006] Therefore, there is an urgent need for a dual-optical path wafer displacement measurement device to solve the above problems. Summary of the invention

[0007] The object of the present invention is to provide a dual-optical path wafer displacement measurement device, which has the advantages of improving the stability during wafer measurement and ensuring the reliability of measurement results, and solves the problems raised by the above-mentioned background technology.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a dual-optical path wafer displacement measurement device, comprising: a measuring device, the top of the measuring device is fixedly connected to a support frame, both sides of the top of the support frame are fixedly connected to horizontal linear modules, the surfaces of the two horizontal linear modules are slidably connected to two longitudinal linear modules, the surfaces of the two longitudinal linear modules are slidably connected to a workbench, and a stabilizing component is arranged above the workbench.

[0009] The stabilizing component includes an electric telescopic rod, the bottom of which is fixedly connected to the workbench, a disc is arranged above the workbench, four round blocks are fixedly connected to the bottom of the disc, the bottom of the round block is fixedly connected to the workbench, four sliders are slidably connected to the inner cavity of the disc, the bottom of the slider is rotatably connected to a transmission plate, one side of the four transmission plates is rotatably connected to a linkage plate, the top of the linkage plate is rotatably connected to the disc, the output end of the electric telescopic rod is fixedly connected to a connecting block, one side of the connecting block is fixedly connected to the slider on the left, and the top of the slider extends to the top of the disc and is fixedly connected to a clamping plate.

[0010] Reflectors and lenses are respectively arranged on both sides of the top of the measuring device, and lifting components are arranged on both sides of the top of the measuring device.

[0011] The lifting assembly includes a bevel gear 1 that is rotatably connected to the measuring device, a threaded tube is fixedly connected to the top of the bevel gear 1, a threaded rod is threadedly connected to the inner cavity of the threaded tube, a motor 1 is arranged on one side of the threaded tube, a bevel gear 2 is fixedly connected to the output shaft of the motor 1, the bevel gear 2 is meshed with the bevel gear 1, a lifting plate is fixedly connected to the top of the threaded rod, and the reflector and the lens are both located above the lifting plate.

[0012] A rotating assembly is arranged on the top of the lifting plate, and the rotating assembly is respectively matched with the reflector and the lens.

[0013] The rotating assembly includes a shell fixedly connected to the lifting plate, the inner cavity of the shell is fixedly connected to the second motor, the output shaft of the second motor is fixedly connected to the driving gear, the reflector and both sides of the rotating assembly are rotatably connected to the support plate, the bottom of the support plate is fixedly connected to the lifting plate, one side of the support plate and located above the driving gear is rotatably connected to a driven gear, one side of the two driven gears extends to one side of the support plate and is fixedly connected to the reflector and the lens, and the driving gear and the driven gear are meshed.

[0014] Furthermore, as a preferred embodiment of the present invention, rubber pads are fixedly connected to the four corners of the bottom of the measuring device, and the four rubber pads are symmetrically arranged.

[0015] Furthermore, as a preferred embodiment of the present invention, a rotating rod is fixedly connected to the bottom of the linkage plate, and a bottom end of the rotating rod is rotatably connected to the workbench.

[0016] Furthermore, as a preferred embodiment of the present invention, four sliding holes are opened on the surface of the disc, and the sliding block is located in the inner cavity of the sliding hole and is slidably connected with the sliding hole.

[0017] Furthermore, as a preferred embodiment of the present invention, a rubber block is fixedly connected to one side of the clamping plate, and the rubber block completely covers the one side of the clamping plate.

[0018] Furthermore, as a preferred embodiment of the present invention, two guide rods are fixedly connected to both sides of the bottom of the lifting plate, and a guide hole matched with the guide rod is opened on the top of the measuring device.

[0019] Furthermore, as a preferred embodiment of the present invention, a T-shaped plate is fixedly connected to the bottom of the motor 1, and the bottom of the T-shaped plate is fixedly connected to the measuring device.

[0020] Furthermore, as a preferred embodiment of the present invention, a plurality of heat dissipation holes are provided on the top of the shell, and the number of the heat dissipation holes is several.

[0021] In the present invention, a method for using a dual-optical path wafer displacement measurement device comprises the following steps:

[0022] Step 1: Move the wafer to the top of the disc, start the electric telescopic rod, and the output end of the electric telescopic rod drives the connecting block to move. When the connecting block moves, it drives the slider on the left to move. When the slider on the left moves, it drives the transmission plate on the left to rotate. The transmission plate on the left drives the linkage plate to rotate. The linkage plate rotates to drive the other three transmission plates to rotate. When the other three transmission plates rotate, they drive the other three sliders to move in the inner cavity of the slide hole. At this time, the four sliders gather toward the center of the disc, thereby realizing the positioning of the wafer and effectively preventing the wafer from shaking or displacing during the measurement process.

[0023] Step 2: Use the horizontal linear module and the vertical linear module to drive the wafer to move left and right and front and back respectively for all-round measurement. Use the measuring device to make a preliminary measurement of the wafer. Then, use the reflector and lens to make a more precise measurement of the wafer. If the reflector and lens measurement height need to be adjusted, start the motor 1. The output shaft of the motor 1 drives the bevel gear 2 to rotate. The bevel gear 2 drives the bevel gear 1 to rotate. When the bevel gear 1 rotates, it drives the threaded rod to move upward with the cooperation of the thread. The rise of the threaded rod drives the synchronous movement of the lifting plate and the rotating components, reflectors and lenses installed thereon, thereby Flexible adjustment of the height of the reflector and the lens is achieved. By fine-tuning the height of the reflector and the lens, it is ensured that the light can be accurately focused on the wafer surface, thereby improving the measurement accuracy and efficiency. It is suitable for measuring wafers of different thicknesses or heights. If the pitch angle of the reflector and the lens needs to be adjusted, start the second motor, and the output shaft of the second motor drives the driving gear to rotate. The engagement of the driving gear and the driven gear causes the driven gear to rotate. The rotation of the driven gear drives the pitch angle adjustment of the reflector and the lens, thereby ensuring that the light can be incident on the wafer surface at the best angle, thereby improving the measurement accuracy and efficiency.

[0024] Beneficial effects: The technical solution of the present application has the following technical effects: the present invention has the advantages of improving the stability of the wafer measurement process and ensuring the reliability of the measurement results. In actual use, when the horizontal linear module and the vertical linear module are used to accurately adjust the left and right and front and back positions of the workbench, the wafer, as a key object to be measured, will also move accordingly. Under the action of the stabilizing component, the wafer can be firmly locked to prevent any unnecessary relative displacement between the wafer and the workbench during the adjustment process, ensuring that each measurement can obtain accurate and correct results;

[0025] Furthermore, in order to improve the flexibility and adaptability of the measurement system, the introduction of the lifting component provides height adjustment for the reflector and lens. By achieving fine adjustment of the height of the reflector and lens, it ensures that the light can be accurately focused on the wafer surface, improves the measurement accuracy and efficiency, and is suitable for measuring wafers of different thicknesses or heights. This enables the measurement system to easily cope with various complex scenarios, showing higher flexibility and practicality.

[0026] In addition, by rotating the components, the pitch angle of the reflector and lens can be adjusted. This function is particularly important when dealing with different tilt angles or complex shapes of the wafer surface. By adjusting the pitch angle of the reflector and lens, it can ensure that the light can be incident on the wafer surface at the optimal angle, thereby capturing more comprehensive and accurate measurement information. The design not only improves the measurement accuracy, but also greatly enhances the adaptability and flexibility of the measurement system. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0028] Figure 1 It is a schematic diagram of the structure of the present invention;

[0029] Figure 2 It is a bottom-up three-dimensional structural schematic diagram of the workbench and the stabilizing assembly of the present invention;

[0030] Figure 3 For the present invention Figure 1 A partial enlarged view of middle A;

[0031] Figure 4 It is a three-dimensional schematic diagram of the local structure of the present invention;

[0032] Figure 5 For the present invention Figure 4 A partial enlarged view of B in the middle;

[0033] Figure 6 It is a schematic diagram of the three-dimensional structure of the reflector and the rotating assembly of the present invention.

[0034] In the figure, the meanings of the various reference numerals are as follows: 1. measuring device; 2. support frame; 3. horizontal linear module; 4. longitudinal linear module; 5. workbench; 6. stabilizing component; 61. electric telescopic rod; 62. disc; 63. round block; 64. slider; 65. transmission plate; 66. linkage plate; 67. connecting block; 68. clamping plate; 7. reflector; 8. lens; 9. lifting component; 91. bevel gear one; 92. threaded pipe; 93. threaded rod; 94. motor one; 95. bevel gear two; 96. lifting plate; 10. rotating component; 101. housing; 102. motor two; 103. driving gear; 104. support plate; 105. driven gear; 11. rubber pad; 12. rotating rod; 13. sliding hole; 14. rubber block; 15. guide rod; 16. guide hole; 17. T-shaped plate; 18. heat dissipation hole. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. In order to better understand the technical content of the present invention, specific embodiments are cited and explained in conjunction with the drawings as follows. Various aspects of the present invention are described in this disclosure with reference to the drawings, in which many illustrative embodiments are shown. It should be understood that the various concepts and embodiments introduced above, as well as those described in more detail below, can be implemented in any of many ways. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] As attached Figure 1 To Attachment Figure 6 As shown: This embodiment provides a dual-optical path wafer displacement measurement device, including: a measuring device 1, the top of the measuring device 1 is fixedly connected to a support frame 2, both sides of the top of the support frame 2 are fixedly connected to horizontal linear modules 3, the surfaces of the two horizontal linear modules 3 are slidably connected to two longitudinal linear modules 4, the surfaces of the two longitudinal linear modules 4 are slidably connected to a workbench 5, and a stabilizing component 6 is arranged above the workbench 5.

[0037] The stabilizing component 6 includes an electric telescopic rod 61, the bottom of which is fixedly connected to the workbench 5, a disc 62 is arranged above the workbench 5, the bottom of the disc 62 is fixedly connected to four round blocks 63, the bottom of the round block 63 is fixedly connected to the workbench 5, the inner cavity of the disc 62 is slidably connected to four sliders 64, the bottom of the slider 64 is rotatably connected to a transmission plate 65, one side of the four transmission plates 65 is rotatably connected to a linkage plate 66, the top of the linkage plate 66 is rotatably connected to the disc 62, the output end of the electric telescopic rod 61 is fixedly connected to a connecting block 67, one side of the connecting block 67 is fixedly connected to the slider 64 on the left, the top of the slider 64 extends to the top of the disc 62 and is fixedly connected to a clamping plate 68.

[0038] A reflector 7 and a lens 8 are respectively arranged on both sides of the top of the measuring device 1 , and a lifting assembly 9 is arranged on both sides of the top of the measuring device 1 .

[0039] The lifting assembly 9 includes a bevel gear 91 rotatably connected to the measuring device 1, a threaded tube 92 is fixedly connected to the top of the bevel gear 91, a threaded rod 93 is threadedly connected to the inner cavity of the threaded tube 92, a motor 94 is arranged on one side of the threaded tube 92, an output shaft of the motor 94 is fixedly connected to a bevel gear 95, the bevel gear 95 is meshed with the bevel gear 91, a lifting plate 96 is fixedly connected to the top of the threaded rod 93, and the reflector 7 and the lens 8 are both located above the lifting plate 96.

[0040] A rotating assembly 10 is disposed on the top of the lifting plate 96 , and the rotating assembly 10 is matched with the reflector 7 and the lens 8 respectively.

[0041] The rotating assembly 10 includes a shell 101 fixedly connected to the lifting plate 96, the inner cavity of the shell 101 is fixedly connected to a motor 2 102, the output shaft of the motor 2 102 is fixedly connected to a driving gear 103, the reflector 7 and both sides of the rotating assembly 10 are rotatably connected to support plates 104, the bottom of the support plate 104 is fixedly connected to the lifting plate 96, one side of the support plate 104 and located above the driving gear 103 is rotatably connected to a driven gear 105, one side of the two driven gears 105 extends to one side of the support plate 104 and is fixedly connected to the reflector 7 and the lens 8, and the driving gear 103 and the driven gear 105 are meshed.

[0042] Specifically, four corners of the bottom of the measuring device 1 are fixedly connected with rubber pads 11, and the four rubber pads 11 are symmetrically arranged.

[0043] In this embodiment, the rubber pad 11 is provided to support the measuring device 1 and also to provide a buffer for the measuring device 1 . The rubber pad 11 can absorb vibrations from the ground or other equipment.

[0044] Specifically, the bottom of the linkage plate 66 is fixedly connected with a rotating rod 12 , and the bottom end of the rotating rod 12 is rotatably connected to the workbench 5 .

[0045] In this embodiment, through the setting of the rotating rod 12 , the linkage plate 66 will drive the rotating rod 12 to rotate on the top of the workbench 5 , thereby playing a role in supporting the linkage plate 66 .

[0046] Specifically, four sliding holes 13 are opened on the surface of the disk 62 , and the sliding block 64 is located in the inner cavity of the sliding hole 13 and is slidably connected with the sliding hole 13 .

[0047] In this embodiment, through the setting of the sliding hole 13 , the sliding block 64 will slide in the inner cavity of the sliding hole 13 when it moves, which plays a role in limiting and guiding the sliding block 64 .

[0048] Specifically, a rubber block 14 is fixedly connected to one side of the clamping plate 68 , and the rubber block 14 completely covers the one side of the clamping plate 68 .

[0049] In this embodiment, by providing the rubber block 14 , the rubber block 14 is used to contact the wafer instead of the clamping plate 68 , which is beneficial to protecting the wafer and further improving the safety of the wafer.

[0050] Specifically, two guide rods 15 are fixedly connected to both sides of the bottom of the lifting plate 96 , and a guide hole 16 matched with the guide rod 15 is opened on the top of the measuring device 1 .

[0051] In this embodiment, by using the guide rod 15 and the guide hole 16 in coordination, when the lifting plate 96 moves, the guide rod 15 will be driven to slide in the inner cavity of the guide hole 16, thereby guiding the lifting plate 96.

[0052] Specifically, a T-shaped plate 17 is fixedly connected to the bottom of the motor 94 , and the bottom of the T-shaped plate 17 is fixedly connected to the measuring device 1 .

[0053] In this embodiment, the T-shaped plate 17 is provided to support and fix the motor 94, which is beneficial to improving the stability of the T-shaped plate 17 during operation.

[0054] Specifically, a plurality of heat dissipation holes 18 are formed on the top of the housing 101 . The number of the heat dissipation holes 18 is several.

[0055] In this embodiment, the heat dissipation holes 18 are provided to dissipate heat from the inner cavity of the housing 101 , thereby creating a good working environment for the motor 2 102 .

[0056] In the present invention, a method for using a dual-optical path wafer displacement measurement device comprises the following steps:

[0057] Step 1: Shift the wafer to the top of the disc 62, start the electric telescopic rod 61, the output end of the electric telescopic rod 61 drives the connecting block 67 to move, and when the connecting block 67 moves, it drives the slider 64 on the left to move, and when the slider 64 on the left moves, it drives the transmission plate 65 on the left to rotate, and the transmission plate 65 on the left drives the linkage plate 66 to rotate, and the other three transmission plates 65 can be driven to rotate by the rotation of the linkage plate 66, and when the other three transmission plates 65 rotate, they drive the other three sliders 64 to move in the inner cavity of the slide hole 13, and at this time, the four sliders 64 gather toward the center of the disc 62, thereby realizing the positioning of the wafer and effectively preventing the wafer from shaking or displacement during the measurement process;

[0058] Step 2: Use the horizontal linear module 3 and the vertical linear module 4 to drive the wafer to move left and right and front and back respectively for all-round measurement. Use the measuring device 1 to perform preliminary measurement on the wafer. Then, use the reflector 7 and the lens 8 to perform more precise measurement on the wafer. If it is necessary to adjust the reflector 7 and the lens 8 to measure the height, start the motor 1 94. The output shaft of the motor 1 94 drives the bevel gear 2 95 to rotate. The bevel gear 2 95 drives the bevel gear 1 91 to rotate. When the bevel gear 1 91 rotates, it drives the threaded rod 93 to move upward with the cooperation of the thread. The rise of the threaded rod 93 drives the synchronous movement of the lifting plate 96 and the rotating assembly 10, the reflector 7 and the lens 8 installed thereon, thereby Flexible adjustment of the height of the reflector 7 and the lens 8 is achieved. By achieving fine adjustment of the height of the reflector 7 and the lens 8, it is ensured that the light can be accurately focused on the wafer surface, thereby improving the measurement accuracy and efficiency. It is suitable for measuring wafers of different thicknesses or different heights. If the pitch angle of the reflector 7 and the lens 8 needs to be adjusted, the motor 102 is started, and the output shaft of the motor 102 drives the driving gear 103 to rotate. The engagement of the driving gear 103 with the driven gear 105 causes the driven gear 105 to rotate. The rotation of the driven gear 105 drives the pitch angle adjustment of the reflector 7 and the lens 8, thereby ensuring that the light can be incident on the wafer surface at an optimal angle, thereby improving the measurement accuracy and efficiency.

[0059] It should be noted that, in this document, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0060] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. A person with ordinary knowledge in the technical field to which the present invention belongs may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. A dual-optical path wafer displacement measurement device, comprising: A measuring device (1), characterized in that: the top of the measuring device (1) is fixedly connected to a support frame (2), both sides of the top of the support frame (2) are fixedly connected to transverse linear modules (3), the surfaces of the two transverse linear modules (3) are slidably connected to two longitudinal linear modules (4), the surfaces of the two longitudinal linear modules (4) are slidably connected to a workbench (5), and a stabilizing component (6) is arranged above the workbench (5); The stabilizing component (6) comprises an electric telescopic rod (61), the bottom of which is fixedly connected to the workbench (5), a disc (62) is arranged above the workbench (5), the bottom of which is fixedly connected to four round blocks (63), the bottom of which is fixedly connected to the workbench (5), the inner cavity of which is slidably connected to four sliders (64), the bottom of which is rotatably connected to a transmission plate (65), one side of which is jointly rotatably connected to a linkage plate (66), the top of which is rotatably connected to the disc (62), the output end of the electric telescopic rod (61) is fixedly connected to a connecting block (67), one side of which is fixedly connected to the slider (64) on the left side, the top of which extends to the top of the disc (62) and is fixedly connected to a clamping plate (68); A reflector (7) and a lens (8) are respectively arranged on both sides of the top of the measuring device (1), and a lifting assembly (9) is arranged on both sides of the top of the measuring device (1); The lifting assembly (9) comprises a bevel gear (91) rotatably connected to the measuring device (1); a threaded tube (92) is fixedly connected to the top of the bevel gear (91); a threaded rod (93) is threadedly connected to the inner cavity of the threaded tube (92); a motor (94) is arranged on one side of the threaded tube (92); an output shaft of the motor (94) is fixedly connected to a bevel gear (95); the bevel gear (95) is meshed with the bevel gear (91); a lifting plate (96) is fixedly connected to the top of the threaded rod (93); and the reflector (7) and the lens (8) are both located above the lifting plate (96); A rotating assembly (10) is provided on the top of the lifting plate (96), and the rotating assembly (10) is respectively adapted to the reflector (7) and the lens (8); The rotating assembly (10) comprises a shell (101) fixedly connected to the lifting plate (96); a second motor (102) is fixedly connected to the inner cavity of the shell (101); an output shaft of the second motor (102) is fixedly connected to a driving gear (103); both sides of the reflecting mirror (7) and the rotating assembly (10) are rotatably connected to a supporting plate (104); the bottom of the supporting plate (104) is fixedly connected to the lifting plate (96); one side of the supporting plate (104) and located above the driving gear (103) is rotatably connected to a driven gear (105); one side of the two driven gears (105) extends to one side of the supporting plate (104) and is fixedly connected to the reflecting mirror (7) and the lens (8); the driving gear (103) and the driven gear (105) are meshed.

2. The dual-optical path wafer displacement measurement device according to claim 1, characterized in that: The four corners of the bottom of the measuring device (1) are all fixedly connected with rubber pads (11), and the four rubber pads (11) are symmetrically arranged.

3. The dual-optical path wafer displacement measurement device according to claim 1, characterized in that: The bottom of the linkage plate (66) is fixedly connected to a rotating rod (12), and the bottom end of the rotating rod (12) is rotatably connected to the workbench (5).

4. The dual-optical path wafer displacement measurement device according to claim 1, characterized in that: Four sliding holes (13) are formed on the surface of the disk (62), and the sliding block (64) is located in the inner cavity of the sliding hole (13) and is slidably connected to the sliding hole (13).

5. The dual-optical path wafer displacement measurement device according to claim 1, characterized in that: A rubber block (14) is fixedly connected to one side of the clamping plate (68), and the rubber block (14) completely covers one side of the clamping plate (68).

6. The dual-optical path wafer displacement measurement device according to claim 1, characterized in that: Two guide rods (15) are fixedly connected to both sides of the bottom of the lifting plate (96), and a guide hole (16) adapted to the guide rod (15) is provided on the top of the measuring device (1).

7. The dual-optical path wafer displacement measurement device according to claim 1, characterized in that: The bottom of the motor 1 (94) is fixedly connected to a T-shaped plate (17), and the bottom of the T-shaped plate (17) is fixedly connected to the measuring device (1).

8. The dual-optical path wafer displacement measurement device according to claim 1, characterized in that: A plurality of heat dissipation holes (18) are provided on the top of the shell (101), and the number of the heat dissipation holes (18) is several.

9. A method for using a dual-optical path wafer displacement measurement device, characterized in that: The method comprises the following steps: Step 1: The wafer is shifted to the top of the disc (62), and the electric telescopic rod (61) is started. The output end of the electric telescopic rod (61) drives the connecting block (67) to move. When the connecting block (67) moves, it drives the slider (64) on the left to move. When the slider (64) on the left moves, it drives the transmission plate (65) on the left to rotate. The transmission plate (65) on the left drives the linkage plate (66) to rotate. When the linkage plate (66) rotates, the other three transmission plates (65) can be driven to rotate. When the other three transmission plates (65) rotate, they drive the other three sliders (64) to move in the inner cavity of the slide hole (13). At this time, the four sliders (64) gather toward the center of the disc (62), thereby realizing the positioning of the wafer and effectively preventing the wafer from shaking or shifting during the measurement process. Step 2: Use the transverse linear module (3) and the longitudinal linear module (4) to respectively drive the wafer to move left and right and front and back so as to perform all-round measurement. Use the measuring device (1) to perform preliminary measurement on the wafer. Then, use the reflector (7) and the lens (8) to perform more precise measurement on the wafer. If it is necessary to adjust the measuring height of the reflector (7) and the lens (8), start the motor 1 (94). The output shaft of the motor 1 (94) drives the bevel gear 2 (95) to rotate. The bevel gear 2 (95) drives the bevel gear 1 (91) to rotate. When the bevel gear 1 (91) rotates, it drives the threaded rod (93) to move upward in cooperation with the thread. The rise of the threaded rod (93) drives the synchronous movement of the lifting plate (96) and the rotating assembly (10) installed thereon, the reflector (7) and the lens (8). The invention can be moved to realize flexible adjustment of the height of the reflector (7) and the lens (8). By realizing fine adjustment of the height of the reflector (7) and the lens (8), it is ensured that the light can be accurately focused on the wafer surface, thereby improving the measurement accuracy and efficiency. The invention is suitable for measuring wafers of different thicknesses or different heights. If it is necessary to adjust the pitch angle of the reflector (7) and the lens (8), the second motor (102) is started, and the output shaft of the second motor (102) drives the driving gear (103) to rotate. The driving gear (103) is meshed with the driven gear (105) so that the driven gear (105) rotates. The rotation of the driven gear (105) drives the pitch angle adjustment of the reflector (7) and the lens (8), thereby ensuring that the light can be incident on the wafer surface at an optimal angle, thereby improving the measurement accuracy and efficiency.

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