Chip temperature test system and test method, electronic equipment and medium

Abstract

The invention provides a chip temperature testing system and method, electronic equipment and a medium, and relates to the technical field of chip testing. The system comprises a test board and a junction temperature acquisition board card, a test chip is installed on the test board, a temperature diode interface in the test chip is led out through an interface on the test board, and the temperature diode interface is connected with the junction temperature acquisition board card through a cable; the junction temperature acquisition board card acquires the temperature of the temperature diode, and the temperature can accurately represent the internal temperature of the test chip. According to the invention, the internal temperature of the test chip is collected to replace the original surface temperature of the chip, so that the accuracy of the temperature value is ensured.

Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and in particular to a chip temperature testing system, a testing method, an electronic device and a medium. Background Art

[0002] refer to Figure 1 As shown, in the existing temperature control system, the temperature of the test environment for the test chip is set by heating the ceramic heater, and the water flow in the water tank is used to cool the excess heat and balance the temperature. The temperature sensor is fixed on the connecting block, and the connecting block contacts the outer surface of the test chip. The temperature sensor measures the surface temperature of the test chip (T-Case temperature (A)). The temperature control system compares the measured value with the set target temperature value, and according to the comparison result, adjusts the flow rate of the heater and the water flow in the water tank through PID logic so that the temperature reaches a balance point.

[0003] It can be seen that the existing method of obtaining the temperature of the test chip is to directly use the temperature sensor to measure and obtain the surface temperature of the test chip (T-Case temperature (A)). The surface temperature T-Case temperature (A) of the test chip is greatly affected by the working environment. There may be a large deviation between the T-Case temperature (A) and the actual temperature TJ temperature (B) inside the chip, which cannot accurately reflect the internal temperature of the current test chip. As a result, the internal temperature of the chip may be too high, affecting the test yield. Summary of the invention

[0004] The present invention provides a chip temperature testing system, testing method, electronic equipment and medium, which are used to solve the problem of low accuracy of the test chip temperature obtained by the existing temperature control system. The technical solution is as follows:

[0005] In a first aspect, an embodiment of the present invention provides a chip temperature testing system, including a test board and a junction temperature acquisition board, wherein a test chip is mounted on the test board, and a temperature diode interface inside the test chip is led out through an interface on the test board, and the temperature diode interface is connected to the junction temperature acquisition board through a cable;

[0006] The junction temperature acquisition board acquires the temperature of the temperature diode, and the temperature represents the internal temperature of the test chip.

[0007] Optionally, the junction temperature acquisition board acquires the temperature of the temperature diode including:

[0008] The junction temperature acquisition board measures the temperature of the temperature diode via a system management bus SMBus temperature sensor.

[0009] Optionally, the chip temperature testing system further includes an automatic temperature control system ATC System;

[0010] The junction temperature acquisition board sends the acquired temperature value to the ATC System;

[0011] The ATC System controls the power of the heating plate and / or the water flow rate to achieve temperature balance through a software PID algorithm.

[0012] Optionally, the ATC System communicates with the junction temperature acquisition board via RS232.

[0013] Optionally, the ATC System controls the power of the heating plate and / or the water flow rate to achieve temperature balance through a software PID algorithm, including:

[0014] The ATC System compares the temperature value sent by the junction temperature acquisition board with the set temperature value to determine whether the temperature needs to be increased or decreased.

[0015] The ATC System calculates the power and / or water flow rate corresponding to the heating plate through a software PID algorithm according to the judgment result, and controls the power and / or water flow rate of the heating plate according to the calculation result;

[0016] The ATC System adjusts the power of the heating plate and / or the flow rate of the water flow in real time to achieve temperature balance by continuously comparing the temperature value sent by the junction temperature acquisition board with the set temperature value.

[0017] In a second aspect, an embodiment of the present invention provides a chip temperature testing method, which is applied to the chip temperature testing system of the first aspect, and the chip temperature testing method includes:

[0018] Start the chip to be tested;

[0019] Execute chip algorithms, start chip interfaces and internal modules;

[0020] Obtain the temperature value sent by the junction temperature acquisition board;

[0021] According to the acquired temperature value and the set temperature value, the software PID algorithm is used to control the heating plate power and / or water flow rate to achieve temperature balance.

[0022] Optionally, the step of controlling the power of the heating plate and / or the water flow rate to achieve temperature balance by using a software PID algorithm according to the acquired temperature value and the set temperature value includes:

[0023] According to the obtained temperature value and the set temperature value, it is determined whether the temperature needs to be raised or lowered.

[0024] According to the judgment result, the power and / or water flow rate corresponding to the heating plate are calculated by the software PID algorithm, and the power and / or water flow rate of the heating plate are controlled according to the calculation result;

[0025] The temperature value sent by the junction temperature acquisition board is continuously compared with the set temperature value, and the power of the heating plate and / or the flow rate of the water flow are adjusted in real time to achieve temperature balance.

[0026] In a third aspect, an embodiment of the present invention provides an electronic device, comprising: a transceiver, a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the steps of the chip temperature testing method described in the second aspect are implemented.

[0027] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the chip temperature testing method described in the second aspect are implemented.

[0028] In a fifth aspect, an embodiment of the present invention provides a computer program product, comprising computer instructions, which, when executed by a processor, implement the steps of the chip temperature testing method as described in the second aspect.

[0029] The beneficial effects of the above technical solution of the present invention are:

[0030] The chip temperature test system provided by the embodiment of the present invention includes a test board and a junction temperature acquisition board. The test chip is mounted on the test board, and the temperature diode interface inside the test chip is led out through the interface on the test board. The temperature diode interface is connected to the junction temperature acquisition board through a cable. The junction temperature acquisition board acquires the temperature of the temperature diode, and the acquired temperature can accurately characterize the internal temperature of the test chip. The embodiment of the present invention collects the internal temperature of the test chip instead of the original chip surface temperature, thereby ensuring the accuracy of the temperature value. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of an existing temperature control system;

[0032] Figure 2 A schematic diagram of the structure of a chip temperature testing system disclosed in an embodiment of the present invention;

[0033] Figure 3 A schematic diagram of the structure of another chip temperature testing system disclosed in an embodiment of the present invention;

[0034] Figure 4 A flow chart of a chip temperature testing method disclosed in an embodiment of the present invention;

[0035] Figure 5 The present invention is a schematic diagram of the structure of an electronic device disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help fully understand the embodiments of the present invention. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. In addition, for clarity and brevity, the description of known functions and structures is omitted.

[0037] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0038] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the following processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0039] like Figure 2 As shown, an embodiment of the present invention provides a chip temperature testing system, including a testing board 100 and a junction temperature collection board 200 .

[0040] The test chip 300 is mounted on the test board 100, and the temperature diode interface (Diode interface) inside the test chip 300 is brought out through the interface on the test board 100. The temperature diode interface (i.e., Diode interface) is connected to the junction temperature acquisition board 200 through a cable.

[0041] The junction temperature acquisition board 200 acquires the temperature of the temperature diode in real time, and the acquired temperature represents the internal temperature of the test chip 300 .

[0042] Specifically, the method for implementing the junction temperature acquisition board 200 to acquire the temperature of the temperature diode in real time may include: the junction temperature acquisition board 200 measures the temperature of the temperature diode through an SMBus (system management bus) temperature sensor.

[0043] In actual application, the chip to be tested 300 is mounted on the test board 100, and the diode interface inside the test chip 300 is brought out through the interface (+ / - pole position) on the test board 100. The negative pole (- pole) on the test board 100 is connected to the Ch1- interface on the junction temperature acquisition board 200 through a cable, and the positive pole (+ pole) is connected to the Ch1+ interface on the junction temperature acquisition board 200 through a cable.

[0044] The Diode interface is the temperature diode inside the test chip 300. Because the temperature diode inside the test chip 300 will generate different voltages according to different temperatures, the temperature of the temperature diode can be directly read through voltage measurement and conversion. The temperature accuracy can reach + / -1 degree, which can accurately represent the actual temperature inside the test chip 300. Therefore, the embodiment of the present invention uses the junction temperature acquisition board 200 to collect the temperature of the temperature diode (i.e., the Diode interface) in real time, and uses the temperature as the actual internal temperature value of the test chip 300. Compared with the existing temperature control system that directly uses the surface temperature of the test chip measured by the temperature sensor as the internal temperature of the test chip, the embodiment of the present invention collects the internal temperature of the test chip instead of the original chip surface temperature, thereby ensuring the accuracy of the temperature value.

[0045] like Figure 3 As shown, the chip temperature testing system provided by the embodiment of the present invention may further include an ATC System (automatic temperature control system) 400 .

[0046] The junction temperature acquisition board 200 sends the acquired temperature value to the ATC System 400, and the ATC System 400 controls the power of the heating plate and / or the water flow rate to achieve temperature balance through a software PID algorithm.

[0047] In actual applications, the ATC System 400 communicates with the junction temperature acquisition board 200 via RS232.

[0048] The ATC System 400 uses a software PID algorithm to control the heater power and / or water flow rate to achieve temperature balance. The implementation method may include:

[0049] The ATC System 400 compares the temperature value sent by the junction temperature acquisition board 200 with the set temperature value to determine whether the temperature needs to be increased or decreased.

[0050] According to the judgment result, the ATC System 400 calculates the power and / or water flow rate corresponding to the heating plate through the software PID algorithm, and controls the power and / or water flow rate of the heating plate according to the calculation result;

[0051] The ATC System 400 continuously compares the temperature value sent by the junction temperature acquisition board 200 with the set temperature value, and adjusts the power of the heating plate and / or the flow rate of the water flow in real time to achieve temperature balance.

[0052] In practical applications, the more accurate test environment temperature of the chip is the internal temperature of the chip (also called junction temperature). In the embodiment of the present invention, the set temperature value is the test environment temperature value required for chip testing. In the specific implementation process, if the temperature value (referred to as the current temperature value) sent by the junction temperature acquisition board 200 is less than the set temperature value, it is judged that the current temperature needs to be increased, and the power and water flow of the heating plate are calculated by the software PID algorithm. Here, the power of the heating plate will increase, and the water flow will decrease, so that the test environment temperature increases; if the current temperature value is greater than the set temperature value, it is judged that the current temperature needs to be reduced, and the power and water flow of the heating plate are calculated by the software PID algorithm. Here, the power of the heating plate will decrease, and the water flow will increase, so that the test environment temperature decreases. The present invention continuously compares the current temperature value and the set temperature value, and adjusts the power of the heating plate and / or the flow of the water flow in real time, so that the current temperature value and the set temperature value are basically the same or the difference is within a very small range, and then it is determined that the temperature balance is achieved. At this time, the chip junction temperature is adjusted to the set temperature value, which represents the current accurate temperature value inside the chip.

[0053] In the embodiment of the present invention, the temperature control processing logic of the ATC System 400 is changed from the original chip surface temperature calculation to control the heating plate temperature rise and fall, etc. to control the temperature control work by the internal temperature change of the chip to prevent the internal temperature of the chip from being too high and affecting the test yield.

[0054] Based on the chip temperature testing system provided in the above embodiment of the present invention, the present invention also provides a chip temperature testing method, which is applied to the chip temperature testing system described above. Figure 4 As shown, it may include:

[0055] Step 101, start the chip to be tested.

[0056] Starting the chip to be tested may include: Power-On Self Test (POST). When the power is turned on, the chip will first perform a self-test to confirm whether the hardware is working properly; loading the boot loader. If the POST passes, the chip will load the boot loader into the memory. The boot loader is a small piece of code that is responsible for loading the operating system kernel from an external storage medium. Starting the operating system (OS), after the boot loader is successfully loaded, it will hand over control to the operating system kernel.

[0057] Step 102, execute chip algorithm, start chip interface and internal modules.

[0058] Start executing various software algorithms of the chip, such as data processing or control logic, and enable interfaces to the external environment (such as input / output ports) and various internal functional modules, such as memory, processor, etc.). The chip will heat up due to increased power consumption during normal operation. After operation, there is a temperature difference between the chip itself and the ambient temperature. As the ambient temperature increases, the chip junction temperature also increases. The chip power consumption is increased by running computing power and / or interface functions and / or internal modules through chip software. As power consumption increases, the chip junction temperature also increases. Under the combined effect of ambient temperature and software programs, the chip reaches a preset temperature (for example, 125°C).

[0059] Step 103, obtaining the temperature value sent by the junction temperature acquisition board.

[0060] Step 104, based on the acquired temperature value and the set temperature value, the heating plate power and / or water flow rate are controlled by software PID algorithm to achieve temperature balance.

[0061] The implementation method of step 104 may specifically include:

[0062] Step 1041, judging whether to perform temperature increase or temperature decrease according to the acquired temperature value and the set temperature value;

[0063] Step 1042, according to the judgment result, the power and / or water flow rate corresponding to the heating plate is calculated by the software PID algorithm, and the power and / or water flow rate of the heating plate is controlled according to the calculation result;

[0064] Step 1043, continuously comparing the temperature value sent by the junction temperature acquisition board with the set temperature value, and adjusting the power of the heating plate and / or the flow rate of the water flow in real time to achieve temperature balance.

[0065] The present invention continuously compares the temperature value sent by the junction temperature acquisition board with the set temperature value, adjusts the power of the heating plate and / or the flow rate of the water flow in real time, and realizes that the current temperature value and the set temperature value are basically the same or the difference is within a very small range, and determines that the temperature balance is achieved. At this time, the chip junction temperature is adjusted to the set temperature value, which represents the current accurate temperature value inside the chip, ensuring the accuracy of the detected temperature value.

[0066] It should be noted that the chip temperature testing method is applied to the chip temperature testing system in the aforementioned embodiment, which corresponds to the chip temperature testing system in the aforementioned embodiment. All implementation means in the aforementioned chip temperature testing system embodiment are applicable to the embodiment of the chip temperature testing method, and can also achieve the same technical effect.

[0067] like Figure 5 As shown, an embodiment of the present invention further provides an electronic device, including:

[0068] A processor 1000; and a memory 1020 connected to the processor 1000 via a bus interface, wherein the memory 1020 is used to store programs and data used by the processor 1000 when performing operations, and the processor 1000 calls and executes the programs and data stored in the memory 1020.

[0069] The transceiver 1010 is connected to the bus interface and is used to receive and send data under the control of the processor 1000; the processor 1000 is used to read the program in the memory 1020 to implement the following steps:

[0070] Start the chip to be tested;

[0071] Execute chip algorithms, start chip interfaces and internal modules;

[0072] Obtain the temperature value sent by the junction temperature acquisition board;

[0073] According to the acquired temperature value and the set temperature value, the software PID algorithm is used to control the heating plate power and / or water flow rate to achieve temperature balance.

[0074] Optionally, the step of controlling the power of the heating plate and / or the water flow rate to achieve temperature balance by using a software PID algorithm according to the acquired temperature value and the set temperature value includes:

[0075] According to the obtained temperature value and the set temperature value, it is determined whether the temperature needs to be raised or lowered.

[0076] According to the judgment result, the power and / or water flow rate corresponding to the heating plate are calculated by the software PID algorithm, and the power and / or water flow rate of the heating plate are controlled according to the calculation result;

[0077] The temperature value sent by the junction temperature acquisition board is continuously compared with the set temperature value, and the power of the heating plate and / or the flow rate of the water flow are adjusted in real time to achieve temperature balance.

[0078] Among them, Figure 5In the embodiment, the bus architecture may include any number of interconnected buses and bridges, specifically one or more processors represented by the processor 1000 and various circuits of the memory represented by the memory 1020 are linked together. The bus architecture may also link together various other circuits such as peripheral devices, voltage regulators, and power management circuits, which are well known in the art and are therefore not further described herein. The bus interface provides an interface. The transceiver 1010 may be a plurality of components, namely, a transmitter and a transceiver, providing a unit for communicating with various other devices on a transmission medium. For different terminals, the user interface 1030 may also be an interface capable of externally connecting or internally connecting required devices, and the connected devices include but are not limited to a keypad, a display, a speaker, a microphone, a joystick, and the like. The processor 1000 is responsible for managing the bus architecture and general processing, and the memory 1020 may store data used by the processor 1000 when performing operations.

[0079] Those skilled in the art will understand that all or part of the steps to implement the above embodiments may be accomplished by hardware, or may be accomplished by instructing relevant hardware through a computer program, wherein the computer program includes instructions for executing part or all of the steps of the above method; and the computer program may be stored in a readable storage medium, and the storage medium may be any form of storage medium.

[0080] In addition, an embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the steps of the method in the above embodiment are implemented and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0081] The embodiment of the present application also provides a computer program product, including computer instructions. When the computer instructions are executed by a processor, the various processes of the above-mentioned method embodiment are implemented and the same technical effect can be achieved. To avoid repetition, they are not described here.

[0082] In addition, it should be noted that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. Moreover, the steps of performing the above-mentioned series of processing can naturally be performed in chronological order according to the order of description, but it is not necessary to perform them in chronological order, and some steps can be performed in parallel or independently of each other. For those of ordinary skill in the art, it is understood that all or any steps or components of the method and apparatus of the present invention can be implemented in any computing device (including processors, storage media, etc.) or a network of computing devices in hardware, firmware, software or a combination thereof, which can be achieved by those of ordinary skill in the art using their basic programming skills after reading the description of the present invention.

[0083] Therefore, the purpose of the present invention can also be achieved by running a program or a group of programs on any computing device. The computing device can be a well-known general device. Therefore, the purpose of the present invention can also be achieved by simply providing a program product containing a program code that implements the method or device. That is to say, such a program product also constitutes the present invention, and the storage medium storing such a program product also constitutes the present invention. Obviously, the storage medium can be any well-known storage medium or any storage medium developed in the future. It should also be pointed out that in the device and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. In addition, the steps of performing the above-mentioned series of processing can naturally be performed in chronological order according to the order of description, but it is not necessary to perform them in chronological order. Some steps can be performed in parallel or independently of each other.

[0084] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A chip temperature testing system, characterized in that: It includes a test board and a junction temperature acquisition board, a test chip is mounted on the test board, and a temperature diode interface inside the test chip is led out through an interface on the test board, and the temperature diode interface is connected to the junction temperature acquisition board through a cable; The junction temperature acquisition board acquires the temperature of the temperature diode, and the temperature represents the internal temperature of the test chip.

2. The warm chip temperature test system according to claim 1, characterized in that: The junction temperature acquisition board acquires the temperature of the temperature diode including: The junction temperature acquisition board measures the temperature of the temperature diode through a system management bus SMBus temperature sensor.

3. The chip temperature testing system according to claim 1, characterized in that: The chip temperature testing system also includes an automatic temperature control system ATC System; The junction temperature acquisition board sends the acquired temperature value to the ATC System; The ATC System controls the power of the heating plate and / or the water flow rate to achieve temperature balance through a software PID algorithm.

4. The chip temperature testing system according to claim 3, characterized in that: The ATC System communicates with the junction temperature acquisition board via RS232.

5. The temperature control system according to claim 3, characterized in that: The ATC System controls the power of the heating plate and / or the water flow rate to achieve temperature balance through the software PID algorithm, including: The ATC System compares the temperature value sent by the junction temperature acquisition board with the set temperature value to determine whether the temperature needs to be increased or decreased. The ATC System calculates the power and / or water flow rate corresponding to the heating plate through a software PID algorithm according to the judgment result, and controls the power and / or water flow rate of the heating plate according to the calculation result; The ATC System adjusts the power of the heating plate and / or the flow rate of the water flow in real time to achieve temperature balance by continuously comparing the temperature value sent by the junction temperature acquisition board with the set temperature value.

6. A chip temperature testing method, characterized in that: Applicable to the chip temperature testing system according to any one of claims 1 to 5, the chip temperature testing method comprises: Start the chip to be tested; Execute chip algorithms, start chip interfaces and internal modules; Obtain the temperature value sent by the junction temperature acquisition board; According to the acquired temperature value and the set temperature value, the software PID algorithm is used to control the heating plate power and / or water flow rate to achieve temperature balance.

7. The temperature control system according to claim 6, characterized in that: The method of controlling the heating plate power and / or water flow rate to achieve temperature balance by software PID algorithm according to the acquired temperature value and the set temperature value includes: According to the obtained temperature value and the set temperature value, it is determined whether the temperature needs to be raised or lowered. According to the judgment result, the power and / or water flow rate corresponding to the heating plate are calculated by the software PID algorithm, and the power and / or water flow rate of the heating plate are controlled according to the calculation result; The temperature value sent by the junction temperature acquisition board is continuously compared with the set temperature value, and the power of the heating plate and / or the flow rate of the water flow are adjusted in real time to achieve temperature balance.

8. An electronic device comprising: A transceiver, a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the chip temperature testing method as claimed in claim 6 or 7 when executing the computer program.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the chip temperature testing method according to claim 6 or 7 are implemented.

10. A computer program product, characterized in that It comprises computer instructions, which, when executed by a processor, implement the steps of the chip temperature testing method as claimed in claim 6 or 7.

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