Temperature sensor type device batch test method and device

Abstract

The invention discloses a batch test method and device for temperature sensor devices, and aims to solve the problem that the prior art cannot give consideration to precision, efficiency and compatibility at the same time. According to the method, to-be-tested devices are placed in a high-low temperature box, temperature points are set and kept for a certain time, calibration temperature is calibrated by adopting a standard device comparison test method, multi-station test is performed through ATE equipment, test data of each to-be-tested device at different temperature points are obtained, and the devices are screened according to test results. The device comprises a high and low temperature box, a test adapter and ATE equipment. According to the invention, through a multi-station test and standard device comparison test method, the test efficiency and accuracy are significantly improved, the device can adapt to temperature sensor devices of different types and different specifications, the test cost is reduced, and the requirements of temperature sensor performance detection in large-scale production are met.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic testing, and in particular to a batch testing method and device for temperature sensor devices. Background Art

[0002] As the core component of temperature measuring instruments, temperature sensors are widely used in industrial control, automotive electronics, consumer electronics, medical equipment, aerospace and other fields. With the development of emerging technologies such as the Internet of Things and intelligent manufacturing, higher requirements are placed on the accuracy, response speed, reliability and consistency of temperature sensors. There are many types of temperature sensors, including thermocouples, thermal resistors, semiconductor temperature sensors, etc., of which contact temperature sensors account for more than 60%. At present, the temperature sensor industry still has room for improvement in the development and production of high-precision products, especially in the independent development and production of high-precision temperature sensors.

[0003] In the field of temperature sensor testing, the commonly used testing methods currently rely mainly on traditional high and low temperature chambers with simple test circuits. As the most commonly used high and low temperature testing equipment on the production line, the high and low temperature chamber has the advantages of sufficient internal space and easy operation, and can realize batch testing. However, this traditional testing method has some limitations in terms of accuracy, efficiency and compatibility. The temperature control fluctuation range of the high and low temperature chamber is usually between plus or minus three degrees Celsius. Although it can meet some basic testing needs, it is not enough to meet the testing needs of high-precision temperature sensors. In addition, traditional test circuits are mostly single-channel designs, and only one sensor can be tested at a time. The test efficiency is low, and it is difficult to adapt to the needs of batch testing of temperature sensors in large-scale production. At the same time, the existing test equipment has deficiencies in compatibility and cannot adapt to temperature sensor devices of different types and specifications, resulting in increased testing costs.

[0004] In view of the limitations of existing testing methods in terms of accuracy, efficiency and compatibility, which seriously affect the production quality and efficiency of temperature sensors, a new testing method and device is urgently needed. Summary of the invention

[0005] The purpose of the present invention is to provide a batch testing method and device for temperature sensor devices, so as to overcome the shortcomings of the prior art that the accuracy, efficiency and compatibility cannot be taken into account at the same time.

[0006] In order to achieve the above object, the present invention adopts the following technical solution: In a first aspect, the present invention provides a batch testing method for temperature sensor devices, comprising: Place the device under test in a high and low temperature box, set the temperature point and maintain it for a certain period of time to obtain the device under test in the set temperature state; The calibration temperature is calibrated by using the standard device comparison method to obtain the calibrated temperature value; Perform multi-station testing with ATE equipment to obtain test data of each device under test at different temperature points; The devices are screened according to the test results to obtain temperature sensor devices of different levels.

[0007] The device under test is placed in a high and low temperature box, and the temperature points are set and maintained for a certain time to obtain the device under test in a set temperature state, wherein the setting interval of the temperature points is 10°C, and the holding time of each temperature point is thirty minutes.

[0008] The calibration temperature is calibrated by using the standard device comparison method to obtain the calibrated temperature value, including: The standard device is placed in a constant temperature bath, the temperature point is set and maintained for a certain period of time, and the standard device is obtained at the set temperature state; Measuring the output value of the standard device and forming a test result lookup table of the standard device; Place the standard device and the device under test in a high and low temperature box at the same time to keep them in the same temperature environment; The output values ​​of the standard device and the device under test are measured, and the actual temperature of the high and low temperature chamber is calibrated by the output value of the standard device to obtain the calibrated temperature value.

[0009] Standard devices are rated over the -55°C to 125°C temperature range.

[0010] Multi-station testing is performed using ATE equipment to obtain test data for each device under test at different temperature points, with sixty-four stations.

[0011] The devices are screened according to the test results to obtain temperature sensor devices of different levels, including classifying the devices into three levels: high precision, medium precision and low precision according to the difference between the test results and the standard values.

[0012] In another aspect, the present invention provides a batch testing device for temperature sensor devices, comprising: High and low temperature chamber, used to accommodate the devices under test and standard devices and provide different temperature environments; The test adapter is placed in the high and low temperature box during testing and is used to place the device to be tested and the standard device in the high and low temperature box; ATE equipment, connected with the test adapter, is used for multi-station testing.

[0013] Test adapter includes: Resource introduction and control area, used to introduce test resources and control the test process; The multi-station test area includes a plurality of test fixtures, each of which includes a standard device placement position and a plurality of device placement positions for testing.

[0014] The test fixture is connected to the ATE equipment via long cables to achieve multi-station testing.

[0015] The lateral dimensions of the test adapter place the multi-station test area in the middle of the high and low temperature chamber.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: A batch testing method for temperature sensor devices is proposed. The multi-station test is carried out by ATE equipment. The number of stations can reach 64. Multiple devices under test can be tested at the same time, which significantly improves the test efficiency and meets the needs of batch testing of temperature sensors in large-scale production. The calibration temperature is calibrated by the standard device comparison method, and the actual temperature of the high and low temperature box is calibrated by the known characteristics of the standard device, so as to improve the accuracy of the test results and meet the test requirements of high-precision temperature sensors. A special test adapter is designed to adapt to temperature sensor devices of different types and specifications, which reduces the test cost and improves the flexibility and adaptability of the test. The device under test is placed in the high and low temperature box, and the temperature point is set and maintained for a certain time to ensure that the device under test fully adapts to different temperature environments. At the same time, the actual temperature of the high and low temperature box is calibrated by the output value of the standard device, so that the test results are more reliable. According to the difference between the test results and the standard values, the devices are divided into three levels of high precision, medium precision and low precision, which meets the requirements of temperature sensor accuracy in different application scenarios and improves the market competitiveness of the products.

[0017] A batch testing device for temperature sensor devices has sufficient internal space in the high and low temperature chamber, which can hold multiple devices to be tested and standard devices at the same time, meeting the needs of batch testing and improving production efficiency. The standard device comparison method is used to calibrate the actual temperature of the high and low temperature chamber using the known characteristics of the standard device, thereby improving the accuracy of the test results and ensuring the reliability of the test. A special test adapter is designed to adapt to temperature sensor devices of different types and specifications, reducing the test cost and improving the flexibility and adaptability of the test. The lateral size of the test adapter is reasonably designed, so that the multi-station test area is located in the middle of the high and low temperature chamber, avoiding the uneven temperature caused by proximity to the chamber wall to affect the test results, ensuring the consistency and accuracy of the test. The test fixture is connected to the ATE equipment through a long cable to realize multi-station testing, and can test multiple devices to be tested at the same time, greatly improving the test efficiency and meeting the needs of large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of a batch testing method for temperature sensor devices in an embodiment of the present invention.

[0019] Figure 2 Schematic diagram of a batch testing device for temperature sensor devices in an embodiment of the present invention.

[0020] Figure 3 This is a test adapter layout in an embodiment of the present invention.

[0021] Figure 4 The present invention is a schematic diagram of a batch testing method for temperature sensor devices according to an embodiment of the present invention. DETAILED DESCRIPTION

[0022] In the field of temperature sensor testing, the commonly used testing methods currently rely mainly on traditional high and low temperature chambers with simple test circuits. As the most commonly used high and low temperature testing equipment on the production line, the high and low temperature chamber has the advantages of sufficient internal space and easy operation, and can realize batch testing. However, this traditional testing method has some limitations in terms of accuracy, efficiency and compatibility. The temperature control fluctuation range of the high and low temperature chamber is usually between plus or minus three degrees Celsius. Although it can meet some basic testing needs, it is not enough to meet the testing needs of high-precision temperature sensors. In addition, traditional test circuits are mostly single-channel designs, and only one sensor can be tested at a time. The test efficiency is low, and it is difficult to adapt to the needs of batch testing of temperature sensors in large-scale production. At the same time, the existing testing equipment has deficiencies in compatibility and cannot adapt to temperature sensor devices of different types and specifications, resulting in increased testing costs.

[0023] In view of the limitations of existing testing methods in terms of accuracy, efficiency and compatibility, which seriously affect the production quality and efficiency of temperature sensors, a new testing method and device is urgently needed.

[0024] The technical solution proposed in the present application solves the shortcomings of the existing testing methods by the following means: batch testing is achieved through a high and low temperature chamber, and the advantages of sufficient internal space and simple operation are utilized to meet the needs of batch testing of temperature sensors in large-scale production; the test accuracy is improved through the comparison test method, and the standard device comparison test method is adopted. The standard device and the device to be tested are placed in the high and low temperature chamber at the same time, and the known characteristics of the standard device are used to calibrate the actual temperature of the high and low temperature chamber, thereby improving the accuracy of the test results; compatibility is improved through a dedicated test adapter, and a dedicated test adapter is designed to make full use of the channel resources of the ATE system to achieve multi-station batch testing, which can adapt to temperature sensor devices of different types and specifications and reduce testing costs.

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] like Figure 1 A batch testing method for temperature sensor devices in a specific embodiment of the present invention is shown, comprising: S1, place the device under test in a high and low temperature box, set the temperature point and keep it for a certain time, and obtain the device under test in the set temperature state. Specifically, the temperature point is set at an interval of 10°C, and each temperature point is kept for 30 minutes to ensure that the device under test is fully adapted to different temperature environments.

[0029] S2, calibrating the calibration temperature using a standard device comparison method to obtain a calibrated temperature value. Specifically, this step includes: Place the standard device in a high-precision thermostat, set the temperature point and maintain it for a certain period of time to allow the standard device to reach the set temperature state. The calibration temperature range of the standard device is -55℃ to 125℃ to cover the operating temperature range of the device to be tested.

[0030] The output value of the standard device is measured, and a test result lookup table of the standard device is formed. The lookup table records the output value of the standard device at different temperature points, providing a reference for subsequent calibration.

[0031] Place the standard device and the device under test in a high and low temperature chamber at the same time to ensure that they are in the same temperature environment.

[0032] The output values ​​of the standard device and the device under test are measured, and the actual temperature of the high and low temperature chamber is calibrated by comparing the output value of the standard device with the corresponding value in the lookup table to obtain the calibrated temperature value, thereby improving the accuracy of the temperature test.

[0033] S3, perform multi-station testing through ATE equipment to obtain test data of each device under test at different temperature points. Specifically, the number of stations is 64, and each station corresponds to a test fixture, which can test multiple devices under test at the same time, greatly improving the test efficiency.

[0034] S4, based on the difference between the test results and the standard values, the devices to be tested are screened and classified into different levels. Specifically, the devices are classified into three levels: high precision, medium precision and low precision to meet the requirements of temperature sensor accuracy in different application scenarios.

[0035] On the other hand, refer to Figure 2 As shown, a batch testing device for temperature sensor devices provided in a specific embodiment of the present invention includes: The high and low temperature chamber is used to accommodate the DUT and standard devices and provide different temperature environments. It has sufficient internal space to place multiple DUTs and standard devices at the same time to meet the needs of batch testing.

[0036] The test adapter is placed in the high and low temperature box during testing and is used to place the device under test and the standard device in the high and low temperature box. Specifically includes: The resource introduction and control area is responsible for introducing test resources, such as power supplies, signal generators, etc., and controlling the test process to ensure the smooth progress of the test process.

[0037] The multi-station test area includes several test fixtures, each of which includes a standard device placement position and several device placement positions for the device to be tested. The test fixture is connected to the ATE equipment through a long cable to achieve multi-station testing. The lateral size of the test adapter is reasonably designed to place the multi-station test area in the middle of the high and low temperature chamber to avoid uneven temperature caused by proximity to the chamber wall affecting the test results.

[0038] ATE equipment, connected with the test adapter, is used for multi-station testing. It has powerful test functions and efficient test speed, can test multiple devices under test at the same time, and accurately collect and analyze test data to provide a basis for device screening.

[0039] Furthermore, a specific implementation scenario of a batch testing method and device for temperature sensor devices is provided in a specific embodiment of the present invention. Figure 4 As shown, the wafer is laser trimmed by M350 laser trimmer for on-chip thin film resistors. At the wafer stage, the M350 laser trimmer is used for on-chip laser trimming. The M350 laser trimmer performs laser trimming on on-chip thin film resistors for device calibration. After on-chip trimming, the wafer is packaged to form a finished circuit.

[0040] The AD590M temperature sensor chip is used as a standard device for constant temperature chamber calibration. The AD590M is placed in a constant temperature chamber for calibration, and a corresponding lookup table is generated to provide standard data for subsequent comparison method screening.

[0041] The packaged finished circuit is screened by comparison test with the standard device AD590M. The performance of the finished circuit is evaluated by comparison test using the previously generated lookup table. The finished circuit is tested under three temperature conditions to ensure its performance under various temperature environments. According to the test results, the finished circuit is divided into qualified circuits and unqualified circuits.

[0042] The specific test process is as follows. Before batch testing of temperature sensor devices, the test environment needs to be prepared. The high and low temperature chamber commonly used on the production line is selected as the test equipment. It has sufficient internal space and can realize batch testing. Although there is a difference between the temperature screen display value of the high and low temperature chamber and the actual temperature, the actual temperature can be calibrated through the subsequent comparison method. At the same time, in order to ensure the calibration accuracy of the standard device, a high-precision constant temperature bath is selected, including the FLUKE 7380 low temperature bath (-80℃~+100℃, the medium is anhydrous ethanol, and the equipment temperature control accuracy is ±0.01℃) and the FLUKE 7320 high temperature bath (-50℃~+150℃, the medium is oil, and the equipment temperature control accuracy is ±0.01℃), which are used for temperature calibration in the range of -55℃~+25℃ and +25℃~+150℃ respectively.

[0043] Perform the standard parts comparison method to improve the test accuracy. First, use the sample circuit of the same model, such as AD590M, as a standard device, and calibrate it in a constant temperature bath over the full temperature range (-55°C~125°C) with an interval of 10°C. Distribute the foreign sample devices to be calibrated evenly on the test board, connect them to the test resource board via long wires, and place the devices directly in the medium. After the constant temperature bath reaches the set temperature, leave it for another 10 minutes to ensure that the junction temperature of the circuit reaches the set temperature completely, then perform the first measurement, and then wait for 1 minute for the second measurement. The difference between the two test results is less than 0.05, proving that the circuit state is stable and the test results are credible. Through the above steps, a test result lookup table of the standard device is formed to provide a basis for subsequent comparison tests. The sample calibration lookup table in this specific implementation is as follows:

[0044] From left to right in the table are temperature, device number, pass mark, and output current.

[0045] During the test, the standard device and the device to be tested are placed in a high and low temperature box set to a specific temperature at the same time. In this specific embodiment, 125°C is used, and the test is performed after 30 minutes. Assuming that the calibration value of the standard device at 125°C in the constant temperature bath is x, and the measured value is a, it can be inferred that the difference between the actual temperature in the high and low temperature box and 125°C is (xa). The measured value of the device to be tested is b, and the temperature difference (xa) is added to the measured value of the device to be tested, and the test value of the device to be tested at 125°C is b+(xa). It can be seen from the device manual that the ideal value is y when the temperature is 125°C, and the error of the device to be tested is calculated to be (y-(b+(xa))), and devices of different grades are screened out according to whether the error is within the index range.

[0046] During the test, wafer trimming is achieved through comparison test. The standard device is made near the central probe on the probe card. During the test, the probe contacts the wafer PAD. The standard device is very close to the wafer to be tested and is in the same temperature environment. The test value of the standard device is used as the center value for comparison. The parameter value of the wafer to be tested is adjusted to gradually approach the target value through laser trimming to ensure that the temperature characteristics of the wafer meet the requirements.

[0047] In order to improve test efficiency and compatibility, a special test adapter is designed. The test adapter layout is as follows: Figure 3As shown. Combining the capabilities of ATE test equipment and batch test requirements, 64-station multi-station testing is achieved. The adapter layout is divided into 5 areas along the vertical lines. The middle part is the resource introduction and control area, which is used to introduce test resources and control the test process. The 4 vertical columns on both sides are multi-station test areas, including several test fixtures. Each test fixture includes a standard device placement position and several device placement positions for testing.

[0048] Specifically, each column of the multi-station test area is arranged with 4 test fixtures. Each test fixture can measure 5 circuits at the same time, with a standard device in the middle and the other 4 devices to be tested. The standard device and the device to be tested are placed in the same fixture to ensure that the distance between the two is less than 3cm and they are in the same temperature environment. The 4 middle fixtures are connected to the ATE equipment through long cables, and the switching of test resources is controlled by relay editing to achieve simultaneous power-on of the devices to be tested, ensuring the accuracy and consistency of the test results. The horizontal size of the test board is designed to be in the middle of the high and low temperature box, with holes on both sides for supporting aluminum bars to avoid direct contact with the high and low temperature box.

[0049] The temperature sensor device testing scheme of the present invention is aimed at the screening of temperature sensor devices, greatly improving the testing efficiency while ensuring the testing accuracy, and saving production costs. By using high and low temperature boxes to achieve batch testing, using the standard parts comparison method to improve the testing accuracy, and designing a special test adapter to improve compatibility, the limitations of existing testing methods are effectively solved, the demand for temperature sensor performance testing in large-scale production is met, and the production level and product quality of the entire temperature sensor industry are improved.

[0050] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A batch testing method for temperature sensor devices, characterized in that: include: Place the device under test in a high and low temperature box, set the temperature point and maintain it for a certain period of time to obtain the device under test in the set temperature state; The calibration temperature is calibrated by using the standard device comparison method to obtain the calibrated temperature value; Perform multi-station testing with ATE equipment to obtain test data of each device under test at different temperature points; The devices are screened according to the test results to obtain temperature sensor devices of different levels.

2. A batch testing method for temperature sensor devices according to claim 1, characterized in that: The device under test is placed in a high and low temperature box, and the temperature points are set and maintained for a certain time to obtain the device under test in a set temperature state, wherein the setting interval of the temperature points is 10° C., and the holding time of each temperature point is thirty minutes.

3. A batch testing method for temperature sensor devices according to claim 1, characterized in that: The method of calibrating the calibration temperature by using the standard device comparison method to obtain the calibrated temperature value includes: The standard device is placed in a constant temperature bath, the temperature point is set and maintained for a certain period of time, and the standard device is obtained at the set temperature state; Measuring the output value of the standard device and forming a test result lookup table of the standard device; Place the standard device and the device under test in a high and low temperature box at the same time to keep them in the same temperature environment; The output values ​​of the standard device and the device under test are measured, and the actual temperature of the high and low temperature chamber is calibrated by the output value of the standard device to obtain the calibrated temperature value.

4. A batch testing method for temperature sensor devices according to claim 3, characterized in that: Standard devices are rated over the -55°C to 125°C temperature range.

5. A batch testing method for temperature sensor devices according to claim 1, characterized in that: The multi-station test is performed by ATE equipment to obtain test data of each device under test at different temperature points, wherein the number of stations is sixty-four.

6. A batch testing method for temperature sensor devices according to claim 1, characterized in that: The devices are screened according to the test results to obtain temperature sensor devices of different levels, including classifying the devices into three levels of high precision, medium precision and low precision according to the difference between the test results and the standard values.

7. A batch testing device for temperature sensor devices, characterized in that: include: High and low temperature chamber, used to accommodate the devices under test and standard devices and provide different temperature environments; A test adapter, placed in the high and low temperature box during testing, used to place the device to be tested and the standard device in the high and low temperature box; ATE equipment is connected to the test adapter and is used for performing multi-station testing.

8. A batch testing device for temperature sensor devices according to claim 7, characterized in that: The test adapter comprises: Resource introduction and control area, used to introduce test resources and control the test process; The multi-station test area includes a plurality of test fixtures, each of which includes a standard device placement position and a plurality of device placement positions for testing.

9. A batch testing device for temperature sensor devices according to claim 8, characterized in that: The test fixture is connected to the ATE device via a long cable to achieve multi-station testing.

10. A batch testing device for temperature sensor devices according to claim 8, characterized in that: The transverse dimension of the test adapter enables the multi-station test area to be located in the middle of the high and low temperature chamber.

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