Surface test processing method for conductor slice

Abstract

The invention discloses a surface test processing method for a conductor slice. The surface test processing method comprises the following steps: providing a conductor slice; coating metal powder paint on the surface of the conductor slice to obtain a conductor slice with a surface metal layer; performing cold inlaying treatment on the conductor slice with the surface metal layer by using blended epoxy resin glue to obtain a cured conductor slice; carrying out rough grinding treatment on the cured conductor slice by using a preset type of abrasive paper to obtain a roughly ground conductor slice; carrying out fine grinding treatment on the conductor slice by using a preset type of polishing cloth to obtain a finely ground conductor slice; and shooting and testing the conductor slice by using a scanning electron microscope. According to the method, the slice manufacturing process is optimized, and no layering exists between the slice sample and the metal powder paint; it is ensured that when the sample is observed, the sample abnormity can be clearly recognized, it is ensured that the section does not extend and is free of scratches in a secondary electronic imaging mode of the scanning electron microscope, and the section of the grinding layer is close to the ion cutting effect.

Description

Technical Field

[0001] The invention relates to the field of metallographic slice testing, and in particular to a surface testing and processing method for a conductor slice. Background Art

[0002] In the prior art, before making slice samples for SEM observation, the slice glue and the slice samples need to be separated, and the slices are easily scratched. Therefore, the slices need to be pre-treated with platinum or gold coating before SEM photography, which increases the cost budget.

[0003] The chemical nickel-palladium-gold plating of the conductive slices was observed under a scanning electron microscope. Since the main inlay material of the conductive slices is a slice made of epoxy resin, which is a non-conductive material, the conductivity of the sliced ​​sample is poor, which will cause the accumulation of excess electrons or free particles on the sample surface and cannot be conducted away in time. After a certain degree, the charging and discharging phenomenon will occur repeatedly, affecting the transmission of electronic signals, causing image distortion, deformation, and shaking. Therefore, samples with poor conductivity need to be sprayed with gold to increase the conductivity of the sample and avoid accumulation of electricity. Therefore, after the slices are made, they are sprayed with gold according to the conventional process and then observed by a scanning electron microscope for secondary electron imaging. Since the surface of the slice is no longer the original material after spraying with gold, the element contrast information is lost. Spraying gold on the surface may cause distortion of the sample surface morphology or present false composition information of the sample. In addition, when observing the coating, the coating is severely extended and the boundaries of each coating are unclear, which leads to poor quality of the slice image taken by the scanning electron microscope. Summary of the invention The embodiment of the present invention provides a surface testing and processing method for a conductor slice to solve the problem that the coating of the conductive slice produced by the existing method is severely extended, the boundaries of each coating layer are unclear, resulting in poor output slice image quality, and the slice processing cost is high.

[0004] Based on the above considerations, in one embodiment, a surface testing and processing method for a conductor slice is provided, the surface testing and processing method comprising: Providing a conductor slice; Applying metal powder paint on the surface of the conductor slice to obtain a conductor slice having a surface metal layer; Using the prepared epoxy resin glue to cold mount the conductor slice with the surface metal layer to obtain a solidified conductor slice; Using at least one preset type of sandpaper to perform rough grinding on the cured conductor slice to obtain a roughly ground conductor slice; Using at least one preset type of polishing cloth to perform fine grinding on the conductor slice to obtain a finely ground conductor slice; The conductor slice is photographed and tested by using a scanning electron microscope.

[0005] In one embodiment, the cold embedding treatment of the conductor slice having the surface metal layer by using the prepared epoxy resin glue to obtain the solidified conductor slice includes: The epoxy resin curing agent and the metal powder paint are mixed and prepared to obtain the prepared epoxy resin glue; Using the epoxy resin glue to embed the conductor slice with the surface metal layer; After the embedding treatment, the conductor slice is solidified for a preset solidification time to obtain a solidified conductor slice.

[0006] In one embodiment, the cold mounting process is a vacuum cold mounting process.

[0007] In one embodiment, the metal powder paint is silver powder paint.

[0008] In one embodiment, the step of rough grinding the cured conductor slice using at least one preset type of sandpaper to obtain the rough ground conductor slice comprises: The conductor slice is subjected to a first rough grinding process using metallographic sandpaper with a grain size of 180#; The conductor slices were subjected to a second rough grinding process using metallographic sandpaper with a grain size of 1200#.

[0009] In one embodiment, it further includes: The conductor slice is subjected to a third rough grinding process using metallographic sandpaper with a particle size of 2500#; The conductor slice is subjected to a fourth rough grinding process using metallographic sandpaper with a grain size of 4000#. In one embodiment, the fine grinding of the conductor slice using at least one preset type of polishing cloth to obtain the finely ground conductor slice includes: Performing a first fine grinding process on the conductor slice using a metallographic polishing cloth having a polishing capacity greater than or equal to 6 μm; The conductor slice is subjected to a second fine grinding process using a metallographic polishing cloth having a polishing capacity greater than or equal to 3 um and less than 6 um.

[0010] In one embodiment, it further includes: The conductor slice is subjected to a third fine grinding process using a metallographic polishing cloth having a polishing capacity of less than 3 μm.

[0011] In one embodiment, the curing time ranges from four hours to ten hours.

[0012] In one embodiment, the conductor slices are slices made from isolated fingers on a circuit board.

[0013] The surface testing and processing method of the conductor slices mentioned above is to obtain a conductor slice with a surface metal layer by coating the metal powder paint on the surface of the conductor slices; then the conductor slices with the surface metal layer are cold-mounted using the prepared epoxy resin glue, and then the conductor slices are subjected to multi-step grinding and multi-step polishing, and finally the samples are obtained without stratification, the grinding slices have no obvious scratches, the slice coating has no extension, and the slices have good conductivity. The present invention optimizes the slicing production process, and can achieve no stratification between the sliced ​​samples and the metal powder paint; at the same time, it ensures that when observing the samples, the slice samples can be clearly identified for sample abnormalities, and ensures that the slices are not extended, scratch-free, and the cross-section of the grinding layer is close to the ion cutting effect in the secondary electron imaging mode of the scanning electron microscope. In addition, during the slicing process of the present invention, no additional platinum coating is required, which reduces the processing cost compared to the prior art of coating the slices with platinum and then performing scanning electron microscope imaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0015] Figure 1 It is a schematic flow chart of a surface testing and processing method for a conductor slice in one embodiment of the present invention; Figure 2 The figure is a schematic diagram of a cold embedding process for a conductor slice in one embodiment of the present invention. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0018] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0019] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0020] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0021] In order to fully understand the present invention, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0022] In one embodiment, if Figure 1As shown, a surface testing and processing method for a conductor slice is provided, and the surface testing and processing method comprises: S101, providing a conductor slice; Among them, the conductor slice can be a chemical nickel-palladium-gold plated slice, or a gold finger slice on a circuit board. The chemical nickel-palladium-gold plated slice adopts the chemical nickel-palladium-gold process. This process adds a dense chemical palladium layer in the middle of the nickel-gold layer, which can effectively prevent the mutual diffusion of the gold layer and the nickel layer. The chemical nickel and palladium layers are both reduced deposition methods, which will not destroy the base metal layer lattice. Compared with the replacement method of the chemical nickel-gold process to deposit the gold layer, the chemical nickel-palladium-gold process adopts a semi-replacement and semi-reduction gold deposition process to reduce the erosion of the nickel layer and effectively ensure the reliability of the nickel layer.

[0023] S102, coating a metal powder paint on the surface of the conductor slice to obtain a conductor slice having a surface metal layer; Among them, coating the outer surface of the conductor slice with metal powder paint, such as quick-drying metal powder paint, can be used as a conductor of the inorganic packaging substrate and the scanning electron microscope during the test process, so as to achieve the effect of normal conductive imaging without platinum spraying on the surface of the slice sample.

[0024] S103, using the prepared epoxy resin glue to cold mount the conductor slice with the surface metal layer to obtain a solidified conductor slice; Among them, the conductor slices are cold-mounted using epoxy resin glue. This process is to enhance the tightness of the combination between the sample and the epoxy resin glue to ensure that the slices produced are free of stratification.

[0025] S104, using at least one preset type of sandpaper to perform rough grinding on the solidified conductor slice to obtain a rough ground conductor slice; The conductor slices may be subjected to multiple rough grinding processes using a plurality of metallographic sandpapers of different grain sizes.

[0026] S105, fine-grinding the conductor slice using at least one preset type of polishing cloth to obtain a fine-grinded conductor slice; Among them, metallographic polishing cloths with different polishing capabilities can be used to perform multiple fine grinding treatments on the conductor slices.

[0027] S106, using a scanning electron microscope to perform photographic testing on the conductor slice.

[0028] The surface testing and processing method of the conductor slice of the present embodiment is to obtain a conductor slice with a surface metal layer by coating the metal powder paint on the surface of the conductor slice; then the conductor slice with the surface metal layer is cold-mounted using the prepared epoxy resin glue, and then the conductor slice is subjected to multi-step grinding and multi-step polishing, and finally a slice with no stratification, no obvious scratches on the ground slice, no extension of the slice coating, and good conductivity is obtained. The present invention optimizes the slicing production process, and can achieve no stratification between the sliced ​​sample and the metal powder paint; at the same time, it ensures that when the sample is observed, the slice sample can be clearly identified for sample abnormalities. It is ensured that the slice is not extended or scratched in the secondary electron imaging mode of the scanning electron microscope, and the cross section of the grinding layer is close to the ion cutting effect. In addition, in the slicing process of the present invention, no additional platinum coating is required, which reduces the processing cost compared with the prior art of coating the slice with platinum and then performing scanning electron microscope imaging.

[0029] In one embodiment, in the above step S103, the conductor slice with the surface metal layer is cold-mounted by using the prepared epoxy resin glue to obtain a solidified conductor slice. Figure 2 As shown, specifically including: S201, mixing and preparing epoxy resin curing agent and metal powder paint to obtain prepared epoxy resin glue; The mixing ratio between the epoxy resin curing agent and the metal powder paint can be set according to specific needs.

[0030] S202, embedding the conductor slice having the surface metal layer by using the epoxy resin glue; The embedding treatment may be performed by embedding the conductor slices into epoxy resin glue using a cold embedding treatment method, for example, a natural cold embedding treatment method may be used.

[0031] S203, after the embedding process, the conductor slice is solidified for a preset solidification time to obtain a solidified conductor slice.

[0032] The sliced ​​samples are cured, and the curing time of the slices can be set according to the type and proportion of the epoxy resin glue.

[0033] The surface testing and processing method of the conductor slice of the present embodiment uses epoxy resin curing agent and metal powder paint to mix and prepare to obtain a prepared epoxy resin glue, and then uses the epoxy resin glue to embed the conductor slice with a surface metal layer and perform a curing treatment to produce a non-layered sample, a grinded slice without obvious scratches, a slice coating without ductility, and a slice sample with good conductivity, which is convenient for photographing and testing the conductor slice using a scanning electron microscope.

[0034] In one embodiment, the cold mounting process is a vacuum cold mounting process. As another implementation, a pressure cold mounting process can also be used.

[0035] In one embodiment, the metal powder paint is silver powder paint.

[0036] In one embodiment, in the above step S104, that is, using at least one preset type of sandpaper to roughly grind the solidified conductor slice to obtain the roughly ground conductor slice, includes: The conductor slice is subjected to a first rough grinding process using metallographic sandpaper with a grain size of 180#; The conductor slices were subjected to a second rough grinding process using metallographic sandpaper with a grain size of 1200#.

[0037] The surface testing and processing method of the conductor slice of the present embodiment is as follows: the metal powder paint is applied on the surface of the conductor slice to obtain a conductor slice with a surface metal layer; then the conductor slice with the surface metal layer is cold-mounted using the prepared epoxy resin glue, and then the conductor slice is grinded in two steps using metallographic sandpaper with a particle size of 180# and 1200#, and then polished in multiple steps, and finally a slice with no stratification of the sample, no obvious scratches on the grinded slice, no extension of the slice coating, and good conductivity is obtained.

[0038] In one embodiment, the above step S104 further includes: The conductor slice is subjected to a third rough grinding process using metallographic sandpaper with a particle size of 2500#; The conductor slice is subjected to a fourth rough grinding process using metallographic sandpaper with a grain size of 4000#.

[0039] The surface testing and processing method of the conductor slice of this embodiment is to use the prepared epoxy resin glue to cold-mount the conductor slice with the surface metal layer, and then use metallographic sandpaper with particle sizes of 180#, 1200#, 2500#, and 4000# to grind the conductor slice in four steps, and then perform multi-step polishing, and finally obtain a sample without stratification, grinding slices without obvious scratches, slice coating without extension, and good conductivity. In addition, multi-step grinding is selected during the grinding process to minimize the difference between sandpapers of different meshes, so as to achieve the goal of outputting high-order slices without scratches. In one embodiment, in the above step S105, that is, using at least one preset type of polishing cloth to finely grind the conductor slice to obtain the finely ground conductor slice, includes: Performing a first fine grinding process on the conductor slice using a metallographic polishing cloth having a polishing capacity greater than or equal to 6 μm; The conductor slice is subjected to a second fine grinding process using a metallographic polishing cloth having a polishing capacity greater than or equal to 3 um and less than 6 um.

[0040] The surface testing and processing method of the conductor slice of the present embodiment is as follows: after the conductor slice having a surface metal layer is cold-mounted by using the prepared epoxy resin glue, the conductor slice is grinded in multiple steps in succession, and then the conductor slice is polished in two steps by using a metallographic polishing cloth having a polishing capacity greater than or equal to 6um and a polishing capacity greater than or equal to 3um and less than 6um, and finally a slice is obtained in which the sample is not delaminated, the grinded slice has no obvious scratches, the slice coating has no extension, and the conductivity is good.

[0041] In one embodiment, the above step S105 further includes: The conductor slice is subjected to a third fine grinding process using a metallographic polishing cloth having a polishing capacity of less than 3 μm.

[0042] The surface testing and processing method of the conductor slice of the present embodiment is as follows: after the conductor slice having a surface metal layer is cold-mounted by using the prepared epoxy resin glue, the conductor slice is grinded in multiple steps in succession, and then the conductor slice is polished in three steps by using a metallographic polishing cloth having a polishing capacity greater than or equal to 6um, a polishing capacity greater than or equal to 3um and less than 6um, and a polishing capacity less than 3um, so as to reduce the difference between polishing cloths of different particle sizes to achieve the goal of grinding the slice without obvious scratches and without extension of the slice coating.

[0043] In one embodiment, in the above step S103, the curing time ranges from four hours to ten hours. After the slices are cured, the cured slices are further ground.

[0044] In one embodiment, in the above step S101, the conductor slice is a slice made of isolated fingers on a circuit board. The isolated fingers on the circuit board refer to the gold fingers in isolated areas on the circuit board. By using a slicing pre-treatment method for implementing SEM (scanning electron microscope) testing on isolated conductors without spraying, a non-stratified sample, a grinding slice without obvious scratches, a slice coating without extension, and a slice with good conductivity of isolated fingers of the sample are produced.

[0045] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A surface testing and processing method for a conductor slice, characterized in that: The surface testing treatment method comprises: Providing a conductor slice; Applying metal powder paint on the surface of the conductor slice to obtain a conductor slice having a surface metal layer; Using the prepared epoxy resin glue to cold mount the conductor slice with the surface metal layer to obtain a solidified conductor slice; Using at least one preset type of sandpaper to perform rough grinding on the cured conductor slice to obtain a roughly ground conductor slice; Using at least one preset type of polishing cloth to perform fine grinding on the conductor slice to obtain a finely ground conductor slice; The conductor slice is photographed and tested by using a scanning electron microscope.

2. The surface testing and processing method of a conductor slice according to claim 1, characterized in that: The method of cold-mounting the conductor slice with the surface metal layer by using the prepared epoxy resin glue to obtain a solidified conductor slice comprises: The epoxy resin curing agent and the metal powder paint are mixed and prepared to obtain the prepared epoxy resin glue; Using the epoxy resin glue to embed the conductor slice with the surface metal layer; After the embedding treatment, the conductor slice is solidified for a preset solidification time to obtain a solidified conductor slice.

3. The surface testing and processing method for a conductor slice according to claim 1 or 2, characterized in that: The cold mounting process is a vacuum cold mounting process.

4. The surface testing and processing method of a conductor slice according to claim 1 or 2, characterized in that: The metal powder paint is silver powder paint.

5. The surface testing and processing method for a conductor slice according to claim 1 or 2, characterized in that: The method of using at least one preset type of sandpaper to roughly grind the cured conductor slice to obtain the roughly ground conductor slice includes: The conductor slice is subjected to a first rough grinding process using metallographic sandpaper with a grain size of 180#; The conductor slices were subjected to a second rough grinding process using metallographic sandpaper with a grain size of 1200#.

6. The surface testing and processing method of a conductor slice according to claim 5, characterized in that: Also includes: The conductor slice is subjected to a third rough grinding process using metallographic sandpaper with a particle size of 2500#; The conductor slice is subjected to a fourth rough grinding process using metallographic sandpaper with a grain size of 4000#.

7. The surface testing and processing method for a conductor slice according to claim 1 or 2, characterized in that: The method of fine grinding the conductor slice using at least one preset type of polishing cloth to obtain the finely ground conductor slice comprises: Performing a first fine grinding process on the conductor slice using a metallographic polishing cloth having a polishing capacity greater than or equal to 6 μm; The conductor slice is subjected to a second fine grinding process using a metallographic polishing cloth having a polishing capacity greater than or equal to 3 um and less than 6 um.

8. The surface testing and processing method of a conductor slice according to claim 7, characterized in that: Also includes: The conductor slice is subjected to a third fine grinding process using a metallographic polishing cloth having a polishing capacity of less than 3 μm.

9. The surface testing and processing method of a conductor slice according to claim 2, characterized in that: The curing time ranges from four hours to ten hours.

10. The surface testing and processing method of a conductor slice according to claim 1 or 2, characterized in that: The conductor slices are slices made from isolated fingers on a circuit board.

Images