Implementation device for batch test of radiation resistance of SMD (Surface Mount Device) packaged crystal oscillators

Abstract

The invention relates to the field of quartz crystal component testing, in particular to a batch test implementation device for radiation resistance of SMD (Surface Mount Device) packaged crystal oscillators, which is used for solving the problems of incapability of batch detection and low test efficiency in the prior art. According to the invention, a plurality of SMD packaged crystal oscillators to be tested are installed on a power-on part, and an electric connection and output signal transmission path is provided for the SMD packaged crystal oscillators; the radiation-resistant protection part is arranged below the power-on part, covers the monitoring control part and is used for isolating ionizing radiation for the monitoring control part; the monitoring control part is arranged below the radiation-resistant protection part and is mounted in the fixed part in an embedded manner; the power-on part, the radiation-resistant protection part and the fixing part are detachably and fixedly connected. According to the invention, the efficient batch performance test of the SMD packaged crystal oscillator is realized.

Description

Technical Field

[0001] This document relates to the field of quartz crystal component testing, and in particular to a device for batch testing of the radiation resistance performance of SMD packaged crystal oscillators. Background Art

[0002] Quartz crystal oscillator is an oscillator device based on quartz crystal resonator. Due to its small size, light weight, high reliability, excellent frequency stability and other excellent characteristics, quartz crystal oscillator is widely used in communications, medical, aerospace, weapons and equipment and other industries and fields.

[0003] After being exposed to high-energy electromagnetic waves and various cosmic ray ionizing radiation, some structures of the internal integrated circuit of the quartz crystal oscillator may be damaged, resulting in partial loss of function, or even extreme failures such as failure to oscillate, which will cause the entire machine using this product to not work properly. Therefore, it is very necessary to test and evaluate the radiation resistance of the crystal oscillator, that is, its performance after being exposed to high-energy electromagnetic waves and ionizing radiation.

[0004] The existing quartz crystal oscillator radiation resistance performance test device can only meet the needs of single monitoring, and cannot perform batch monitoring. The existing quartz crystal oscillator radiation resistance performance test device connects a single product from the radiation resistance test room to the outdoor instrument through a wire. When the number of products to be tested is large, the wiring operation is very cumbersome and messy, and the test efficiency is low.

[0005] Therefore, it is necessary to provide a device for batch testing the radiation resistance performance of SMD packaged crystal oscillators. Summary of the invention

[0006] This specification provides a device for batch testing of the radiation resistance performance of SMD packaged crystal oscillators, which is used to solve the problems of batch testing and low testing efficiency in the prior art.

[0007] The present invention proposes a device for batch testing of radiation resistance performance of SMD packaged crystal oscillators, the device comprising a power-on part, a radiation resistance protection part, a monitoring and control part and a fixing part;

[0008] The power-on part is provided with a plurality of SMD packaged crystal oscillators to be tested, and provides electrical connection and output signal transmission paths for the SMD packaged crystal oscillators;

[0009] The radiation-resistant protection part is arranged below the power-on part and covers above the monitoring and control part, and is used to isolate the monitoring and control part from ionizing radiation;

[0010] The monitoring and control part is arranged below the radiation-resistant protection part and is embedded in the fixed part;

[0011] The power-on part, the radiation-resistant protection part and the fixing part are detachably fixedly connected.

[0012] Further, the power-on part includes a printed circuit board, a special test socket for SMD packaging and a first communication cable interface;

[0013] A plurality of SMD package-specific test sockets are evenly arrayed on the printed circuit board, and the SMD package-specific test sockets are used to fix the SMD package crystal oscillator to be tested;

[0014] A first communication cable interface is installed on the printed circuit board, and the first communication cable interface is communicatively connected with the monitoring and control part.

[0015] Furthermore, the printed board is provided with a printed board fastening hole, through which the printed board is detachably fixedly connected to the radiation-resistant protection part and the fixing part.

[0016] Furthermore, the radiation-resistant protection part includes a lead metal plate and a lead metal plate fastening hole. The lead metal plate is provided with a lead metal plate fastening hole, and a detachable fixed connection with the power-on part and the fixed part is achieved through the lead metal plate fastening hole.

[0017] Further, the monitoring and control part includes a control circuit substrate, a second communication cable interface, a logic control cable line and a frequency output cable line;

[0018] The control circuit substrate is embedded in the fixed part, and a second communication cable interface is provided on the control circuit substrate, and the second communication cable interface is connected to the first communication cable interface;

[0019] The control circuit substrate is provided with a logic control cable and a frequency output cable, and the logic control cable is connected to an external control platform for controlling the control circuit substrate;

[0020] The frequency output cable is connected to an external monitoring frequency meter.

[0021] Further, the fixing part includes a metal seat and a metal seat fastening hole;

[0022] The metal seat is provided with a groove, a control circuit substrate is installed in the groove, and the metal seat is provided with a metal seat fastening hole;

[0023] The diameters of the metal seat fastening hole, the lead metal plate fastening hole and the printed circuit board fastening hole are the same and their axes coincide, and fastening is achieved by screws.

[0024] Furthermore, the metal seat fastening hole is a bolt hole, and the screw passes through the lead metal plate fastening hole, the printed circuit board fastening hole and the gasket to be threadedly connected to the metal seat fastening hole.

[0025] Furthermore, the device for batch testing of the radiation resistance performance of SMD packaged crystal oscillators is placed on a radiation resistance test center control platform, and a radiation source is provided on the radiation resistance test center control platform.

[0026] Furthermore, a power interface is provided on the control circuit substrate, and the power interface is connected to the wiring terminal of the outdoor monitoring power supply through a cable.

[0027] Furthermore, the frequency output cable is used to output the frequency and power supply current data of the SMD packaged crystal oscillator after power-on.

[0028] At least one of the above technical solutions adopted in the embodiments of this specification can achieve the following beneficial effects:

[0029] Improve test efficiency: By designing the power-up section that can accommodate multiple SMD packaged crystal oscillators at the same time, multiple products can be tested at one time, greatly reducing the time for repeated settings and connections, and improving overall test efficiency.

[0030] Enhanced test safety: The radiation-resistant protection part uses lead metal plates to isolate ionizing radiation, protecting the monitoring and control part from radiation, ensuring the accuracy of test data and safe operation of the equipment.

[0031] Simplified connection and operation: The crystal oscillator to be tested is fixed by the special test socket on the printed circuit board, and the connection with the monitoring and control part is realized through the communication cable interface, which simplifies the connection operation and avoids the problem of messy connection in the traditional method.

[0032] Easy to disassemble and maintain: The detachable fixed connection design between each part not only facilitates installation and disassembly, but also facilitates later maintenance and upgrades.

[0033] Optimize space utilization: The monitoring and control part is embedded in the fixed part, which saves space and makes the whole device more compact, suitable for placement in limited space such as the control platform of the radiation resistance test center.

[0034] Accurate data collection: The frequency output cable can transmit the frequency and power supply current data after power-on to the external monitoring frequency meter in real time, ensuring the timeliness and accuracy of the test results.

[0035] Remote control capability: The logic control cable is connected to an external control platform, allowing technicians to control the test process from a safe distance, increasing operational flexibility and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0037] Figure 1 It is a schematic diagram of the various parts of a device for batch testing of radiation resistance performance of SMD packaged crystal oscillators of the present invention;

[0038] Figure 2 The present invention is a schematic diagram of the assembly of a device for batch testing of the radiation resistance performance of SMD packaged crystal oscillators. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0040] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0041] The first embodiment of the present invention is as follows Figure 1-Figure 2 As shown, a device for batch testing of radiation resistance performance of SMD packaged crystal oscillators is proposed, the device includes a power-on part 1, a radiation resistance protection part 2, a monitoring and control part 3 and a fixing part 4;

[0042] The power-on part 1 is provided with a plurality of SMD packaged crystal oscillators to be tested, and provides electrical connection and output signal transmission paths for the SMD packaged crystal oscillators;

[0043] The radiation-resistant protection part 2 is arranged below the power-on part 1 and covers above the monitoring and control part 3, and is used to isolate the monitoring and control part 3 from ionizing radiation;

[0044] The monitoring and control part 3 is arranged below the radiation-resistant protection part 2 and is embedded in the fixing part 4;

[0045] The power-on part 1 , the radiation-resistant protection part 2 and the fixing part 4 are detachably fixedly connected.

[0046] The SMD in the SMD packaged crystal oscillator of the present invention is the abbreviation of "Surface Mount Device". SMD packaging technology is a component packaging method in the electronics industry, which allows electronic components to be directly mounted on the surface of a printed circuit board (PCB), rather than requiring pins to pass through holes in the circuit board and then be soldered as in traditional through-hole technology.

[0047] In this embodiment, Figure 1 As shown, the power-on part 1 includes a printed circuit board 101, a SMD package dedicated test socket 102 and a first communication cable interface 104;

[0048] A plurality of SMD package dedicated test sockets 102 are evenly arrayed on the printed board 101, and the SMD package dedicated test sockets 102 are used to fix the SMD package crystal oscillator to be tested;

[0049] The printed circuit board 101 is provided with a first communication cable interface 104 , and the first communication cable interface 104 is in communication connection with the monitoring and control part 3 .

[0050] Among them, multiple SMD package dedicated test sockets 102 are evenly distributed in a predetermined matrix arrangement on the printed circuit board 101. The position of each SMD package dedicated test socket 102 needs to be accurately calculated to ensure that the distance between all test sockets is equal, which is convenient for subsequent data collection and analysis.

[0051] The SMD package dedicated test socket 102 is installed on the printed circuit board 101 by welding or other reliable fixing methods to ensure that it will not loosen or shift during the test process. At the same time, the design of the SMD package dedicated test socket 102 should take into account easy disassembly to facilitate replacement of damaged test sockets or maintenance.

[0052] Each test socket is equipped with specially designed pins, which are directly connected to the circuit on the printed board 101 to provide the necessary power supply and signal input and output paths for the SMD packaged crystal oscillator. The pins must have good conductivity and corrosion resistance to ensure long-term stable operation.

[0053] The first communication cable interface 104 is usually installed on one side edge of the printed circuit board 101, which can simplify the connection with the monitoring and control part 3 and also facilitate access by operators.

[0054] Select the appropriate communication interface type according to actual needs, such as RS232, USB, Ethernet interface, etc. For large-volume data transmission scenarios, it is recommended to use a high-speed interface to improve efficiency.

[0055] The radiation-resistant protection part 2 in this embodiment includes a lead metal plate 201 and a lead metal plate fastening hole 202. The lead metal plate 201 is provided with a lead metal plate fastening hole 202, and a detachable fixed connection with the power-on part 1 and the fixed part 4 is achieved through the lead metal plate fastening hole 202.

[0056] Calculate the minimum required lead thickness based on the expected radiation source intensity and type. Typically, for high-energy radiation such as gamma rays, a lead thickness of at least 10 mm is recommended, while for lower-energy X-rays, 5 mm may be sufficient. Make sure the lead provides adequate protection while minimizing weight and volume.

[0057] The lead metal plate 201 should completely cover the monitoring and control part 3 and match the power-on part 1 and the fixed part 4. Accurately measure the dimensions of the relevant components, and design the length, width and height of the lead plate on this basis to ensure that there will be no gaps after installation, which will affect the shielding effect.

[0058] The printed circuit board 101 is provided with a printed circuit board fastening hole 103 , through which the printed circuit board 101 is detachably fixedly connected to the radiation-resistant protection part 2 and the fixing part 4 .

[0059] A plurality of fastening holes are evenly distributed around the lead metal plate 201, and the positions of these holes need to be aligned with the fastening holes of the printed circuit board on the power-on part 1 and the fastening holes of the metal seat on the fixing part 4. This ensures a stable connection between the three.

[0060] In this embodiment, Figure 1 As shown, the monitoring and control part 3 includes a control circuit substrate 301, a second communication cable interface 302, a logic control cable line 303 and a frequency output cable line 304;

[0061] The control circuit substrate 301 is embedded in the fixed part 4, and a second communication cable interface 302 is provided on the control circuit substrate 301, and the second communication cable interface 302 is connected to the first communication cable interface 104;

[0062] The control circuit substrate 301 is provided with a logic control cable 303 and a frequency output cable 304, and the logic control cable 303 is connected to an external control platform for controlling the control circuit substrate 301;

[0063] The frequency output cable 304 is connected to an external monitoring frequency meter.

[0064] As a communication bridge between the power-on part 1 and the monitoring and control part 3, the second communication cable interface 302 is responsible for bidirectional data transmission. It receives status information, test data, etc. from multiple SMD packaged crystal oscillators from the first communication cable interface 104. It sends the control command or configuration parameter generated by the monitoring and control part to the power-on part to adjust or set the working mode of each crystal oscillator.

[0065] The logic control cable 303 realizes the interaction between the monitoring control part 3 and the external control platform, and is used to receive control signals and feedback status information. Specifically:

[0066] Receive control signals: receive operation instructions from the external control platform, such as starting test, stopping test, setting test parameters, etc.

[0067] Feedback status information: Report the current test progress, equipment status and other relevant information to the external control platform to facilitate monitoring and management by technical personnel.

[0068] The frequency output cable 304 is used to transmit the monitored frequency data to an external monitoring frequency meter or other analysis tools. It is used to transmit the precise frequency value generated by each SMD packaged crystal oscillator when it is working through the cable for subsequent data processing and analysis. In addition to the frequency, data related to the power supply current is also transmitted to help evaluate the performance of the device under different working conditions.

[0069] The three components of the second communication cable interface 302, the logic control cable 303 and the frequency output cable 304 together constitute the core communication link of the monitoring and control part, enabling the system to effectively collect, process and transmit key test data, while allowing external control systems to manage and monitor it. Through the application of reasonable selection and technical means, it can be ensured that these interfaces and cables can work stably and reliably in various environments, providing a solid guarantee for the radiation resistance performance test of the quartz crystal oscillator.

[0070] The control circuit substrate 301 is provided with a power interface 305 , and the power interface 305 is connected to the wiring terminal of the outdoor monitoring power supply through a cable.

[0071] In this embodiment, Figure 1 As shown, the fixing part 4 includes a metal seat 401 and a metal seat fastening hole 402;

[0072] The metal seat 401 is provided with a groove, in which the control circuit substrate 301 is installed, and the metal seat 401 is provided with a metal seat fastening hole 402;

[0073] The diameters of the metal seat fastening hole 402 , the lead metal plate fastening hole 202 and the printed circuit board fastening hole 103 are the same and their axes coincide, and fastening is achieved by means of screws 403 .

[0074] The metal seat fastening hole 402 is a bolt hole, and the screw 403 passes through the lead metal plate fastening hole 202, the printed circuit board fastening hole 103 and the gasket 404 to be threadedly connected with the metal seat fastening hole 402.

[0075] The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators is placed on a radiation resistance test center control platform, and a radiation source is arranged on the radiation resistance test center control platform.

[0076] The second embodiment of the present invention provides a method for batch testing of the radiation resistance performance of SMD packaged crystal oscillators. Based on the device for batch testing of the radiation resistance performance of SMD packaged crystal oscillators in the first embodiment, the method includes the following steps:

[0077] Step 1: Install the product to be monitored

[0078] Preparation stage: Confirm that all SMD packaged crystal oscillators to be tested have passed the appearance inspection and have no obvious physical damage.

[0079] Install the product: Install the products to be tested one by one in the SMD package dedicated test socket 102 of the power-on part 1 in the correct direction, and fasten the upper cover to fix it. Ensure that each product is installed in the correct direction to avoid damage caused by reverse installation.

[0080] Step 2: Install the test monitoring fixture

[0081] Entering the radiation resistance test room: Carefully carry the assembled test monitoring fixture into the radiation resistance test room to ensure that no damage is caused to the device during transportation.

[0082] Positioning and fixing: According to the irradiation amount and rate required by the test, select a suitable distance to fix the test fixture on the wall at an appropriate position away from the radiation source, and ensure that the product surface of the fixture faces vertically to the radiation source to obtain a uniform irradiation effect.

[0083] Step 3: Connect the cables

[0084] Internal connection: Use a dedicated cable to connect the first communication cable interface 104 of the power-on part 1 and the second communication cable interface 302 of the monitoring and control part 3 to ensure a stable connection and good contact.

[0085] External connection: Connect the power cable on the monitoring control board to the wiring terminal of the outdoor monitoring power supply to ensure stable power supply. Connect the logic control cable 303 to the wiring terminal of the control module to ensure that it can receive instructions from the external control platform. Connect the frequency output cable 304 to the outdoor monitoring frequency meter to collect and record frequency data in real time.

[0086] Step 4: System initialization and status check

[0087] Turn on the power supply: Turn on the power supply of the monitoring and control part 3 and start the radiation resistance monitoring test program.

[0088] Enter initialization data: Enter necessary initialization parameters, such as test number, preset irradiation dose, time interval, etc.

[0089] System status check: Perform a system operation status check before the formal test run. After confirming that all components are working properly, the program enters the waiting to start state.

[0090] Step 5: Start the radiation resistance test

[0091] Start the control platform: Start the control platform of the radiation resistance test center, raise the radiation source from the storage well to the ground in accordance with safety regulations, and prepare to start the irradiation test.

[0092] Confirm safety measures: Ensure that all personnel evacuate the test area, close the protective doors, and confirm that all safety interlocks are activated.

[0093] Step 6: Implement the test monitoring program

[0094] Run the monitoring program: According to the pre-set requirements, the program powers on the products to be tested in turn, and monitors data such as frequency and power current within the specified time to evaluate product performance in real time.

[0095] Monitoring and recording: Monitor various indicators throughout the entire process in real time to ensure that the data is recorded accurately until all products are monitored.

[0096] Step 7: End of testing and cleanup

[0097] Stop the test: After the test is completed, the control platform of the radiation resistance test center stops running, and the radiation source automatically drops to the storage well to ensure that the laboratory returns to a safe state.

[0098] Power off and disassembly: Turn off all power supplies, disconnect all cables, and then carefully remove the test device from the radiation resistance test chamber.

[0099] Retrieve products: Open the SMD test sockets one by one on the operating table, carefully take out the tested products, and carry out subsequent processing or analysis.

[0100] Through the above detailed steps, the safety, accuracy and efficiency of batch testing of quartz crystal oscillator radiation resistance can be ensured. Each step emphasizes the safety of operation and the accuracy of technical details to ensure the reliability of test results.

[0101] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A device for batch testing of radiation resistance performance of SMD packaged crystal oscillators, characterized in that: The device comprises a power-on part (1), a radiation-resistant protection part (2), a monitoring and control part (3) and a fixing part (4); The power-on part (1) is equipped with a plurality of SMD packaged crystal oscillators to be tested, and provides electrical connection and output signal transmission paths for the SMD packaged crystal oscillators; The radiation-resistant protection part (2) is arranged below the power-on part (1) and covers above the monitoring and control part (3), and is used to isolate the monitoring and control part (3) from ionizing radiation; The monitoring and control part (3) is arranged below the radiation-resistant protection part (2) and is embedded in the fixing part (4); The power-on part (1), the radiation-resistant protection part (2) and the fixing part (4) are detachably fixedly connected.

2. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 1, characterized in that: The power-on part (1) comprises a printed circuit board (101), a special test socket for SMD packaging (102) and a first communication cable interface (104); A plurality of the SMD package-specific test sockets (102) are evenly arrayed on the printed board (101), and the SMD package-specific test sockets (102) are used to fix the SMD package crystal oscillator to be tested; A first communication cable interface (104) is installed on the printed circuit board (101), and the first communication cable interface (104) is communicatively connected with the monitoring control part (3).

3. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 2, characterized in that: The printed board (101) is provided with a printed board fastening hole (103), and the printed board (101) is detachably fixedly connected to the radiation-resistant protection part (2) and the fixing part (4) through the printed board fastening hole (103).

4. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 3 is characterized in that: The radiation-resistant protection part (2) comprises a lead metal plate (201) and a lead metal plate fastening hole (202); the lead metal plate fastening hole (202) is provided on the lead metal plate (201), and a detachable fixed connection with the power-on part (1) and the fixed part (4) is achieved through the lead metal plate fastening hole (202).

5. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 2, characterized in that: The monitoring and control part (3) comprises a control circuit substrate (301), a second communication cable interface (302), a logic control cable (303) and a frequency output cable (304); The control circuit substrate (301) is embedded in the fixed part (4), and a second communication cable interface (302) is provided on the control circuit substrate (301), and the second communication cable interface (302) is connected to the first communication cable interface (104); The control circuit substrate (301) is provided with a logic control cable (303) and a frequency output cable (304), and the logic control cable (303) is connected to an external control platform and is used to control the control circuit substrate (301); The frequency output cable (304) is connected to an external monitoring frequency meter.

6. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 4, characterized in that: The fixing part (4) comprises a metal seat (401) and a metal seat fastening hole (402); The metal seat (401) is provided with a groove, a control circuit substrate (301) is installed in the groove, and the metal seat (401) is provided with a metal seat fastening hole (402); The metal seat fastening hole (402), the lead metal plate fastening hole (202) and the printed circuit board fastening hole (103) have the same diameter and coincident axes, and are fastened by means of screws (403).

7. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 6, characterized in that: The metal seat fastening hole (402) is a bolt hole, and the screw (403) passes through the lead metal plate fastening hole (202), the printed circuit board fastening hole (103) and the gasket (404) to be threadedly connected to the metal seat fastening hole (402).

8. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 1, characterized in that: The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators is placed on a radiation resistance test center control platform, and a radiation source is arranged on the radiation resistance test center control platform.

9. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 5, characterized in that: The control circuit substrate (301) is provided with a power interface (305), and the power interface (305) is connected to a wiring terminal of an outdoor monitoring power supply via a cable.

10. The device for batch testing the radiation resistance performance of SMD packaged crystal oscillators according to claim 5, characterized in that: The frequency output cable (304) is used to output the frequency and power supply current data of the SMD packaged crystal oscillator after power-on.

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