A multi-functional automatic chip testing device

Abstract

The present invention belongs to the field of chip testing, and particularly relates to a multifunctional chip automatic testing device, including an outer box body, a conveying mechanism, etc.; a conveying mechanism is connected inside the outer box body. The present invention realizes limiting the chip through a limiting mold, and scanning the chip from multiple angles during the movement by a 3D scanner, so as to obtain a complete 3D cloud point map, quickly detect the chip pins in a skew state, and be able to calculate the average width of the pins and the distance between two adjacent pins. By moving each pressing block between two corresponding pins on the chip and squeezing the pins on the chip, at the same time, squeezing the two adjacent pins by the paddles on each pressing block, and since the width of the straight plate is equal to the distance between two adjacent pins on the chip, limiting the two adjacent pins by the straight plate, thereby realizing the alignment of the pins on the chip and making the distance between every two adjacent pins consistent.

Description

Technical Field

[0001] The invention belongs to the field of chip testing, and in particular relates to a multifunctional chip automatic testing device. Background Art

[0002] Integrated circuit boards are one of the essential basic components in electronic products. The quality of chip pin welding on integrated circuit boards is an important factor in evaluating the quality of integrated circuit boards. The quality of chip pin welding directly determines the quality of integrated circuit boards and electronic products. Therefore, integrated circuit boards need to undergo multiple chip pin welding quality inspection processes during the production process.

[0003] Based on the existing technology, it is found that when inspecting the bonded frame and chip, the commonly used inspection items include: abnormal chip mounting (skewed, damaged, missing, wrong, etc.), abnormal wire welding (skewed welding, multiple wires, few wires, wrong wires, broken wires, etc.); the traditional inspection method is to manually load and unload the materials, and then perform an appearance inspection on the outer surface of the chip. This inspection method has certain limitations and cannot detect the welding quality between the wire and the chip. The inspection efficiency is low. In addition, when the existing inspection equipment transfers and grabs the chip, when the chip is adsorbed by hydraulic devices such as cylinders, it will cause downward pressure on the chip, which will cause the chip pins to warp, etc., resulting in the chip pins and the contacts of the power-on detection mechanism being misaligned during the subsequent power-on detection, which can easily affect the subsequent inspection operations. Summary of the invention

[0004] In order to overcome the shortcomings of existing chip testing equipment that the welding quality between the bonding wire and the chip cannot be detected when testing the chip and the detection efficiency is low, the present invention provides a multifunctional chip automatic testing equipment.

[0005] The technical implementation scheme of the present invention is: a multifunctional chip automatic testing equipment, including an outer box body, a conveying mechanism and a scanning mechanism; a reserved hole for installing an external conveyor belt is opened on the left side of the outer box body; a conveying mechanism for conveying chips is connected to the outer box body; a scanning mechanism for 3D scanning of chips is connected to the outer box body; it also includes a driving mechanism, a base plate, a limit mold, a fixed plate, an electric actuator I, an extrusion plate and a pressure block; a driving mechanism is connected to the outer box body, and the driving mechanism is connected to the base plate; the driving mechanism is used to drive the base plate to move; at least three limit molds are fixedly connected to the base plate; at least four fixed plates are fixedly connected to the base plate; at least two electric actuators I are fixedly connected to each fixed plate; all the telescopic parts of the electric actuators I on the same fixed plate are commonly fixedly connected to an extrusion plate; taking the middle part of the base plate as a reference, all the extrusion plates on the left are each fixedly connected to a plurality of pressure blocks.

[0006] Optionally, a paddle is provided on a side of the pressing block away from the corresponding extrusion plate.

[0007] Optionally, a straight plate is provided on one side of the briquette close to the corresponding extrusion plate, and the width of the straight plate is equal to the pitch between two adjacent pins on the chip.

[0008] Optionally, an antifriction coating is provided on the outer surface of the briquette.

[0009] Optionally, the conveying mechanism includes an electric slide rail I, an electric slider I, an electric actuator II and a suction cup; the electric slide rail I is fixedly connected to the upper part inside the outer box; at least two electric sliders I are slidably connected to the electric slide rail I; a electric actuator II is fixedly connected to the lower part of each electric slider I; a suction cup is fixedly connected to the telescopic part of each electric actuator II.

[0010] Optionally, the scanning mechanism includes an electric slide rail II, an electric slider II, an electric slide rail III, an electric slider III and a 3D scanner; at least two electric slide rails II are fixedly connected inside the outer box; an electric slider II is slidably connected to each electric slide rail II; an electric slide rail III is fixedly connected to each electric slider II; an electric slider III is slidably connected to each electric slide rail III; a 3D scanner is fixedly connected to the lower part of each electric slider III.

[0011] Optionally, a dust removal system is further included; the dust removal system is connected to the bottom plate; the dust removal system includes an L-shaped pipe, a conduit, a round pipe and a nozzle; the L-shaped pipe is fixedly connected to the bottom plate; the conduit is connected to the L-shaped pipe; at least two round pipes are connected to the conduit; a plurality of nozzles are fixedly connected and communicated with each round pipe; the L-shaped pipe and the conduit are arranged through the adjacent limiting molds.

[0012] Optionally, all the nozzles are inclined, and the end of the nozzle away from the round pipe is in the shape of a flared mouth.

[0013] Optionally, a secondary detection system is further included; the secondary detection system is connected to the bottom plate; the secondary detection system includes a push plate, an electric actuator IV, a pressure plate, a support, a connecting rod, a limiting plate and an elastic member; the push plate is fixedly connected to the suction cup on the right; taking the middle part of the bottom plate as a reference, an electric actuator IV is fixedly connected to all the fixing plates on the right; a pressure plate is fixedly connected to the telescopic part of each electric actuator IV; a support is fixedly connected to the right part of the bottom plate, and the support is located between two adjacent pressure plates; the connecting rod is rotatably connected to the upper part of the support; the limiting plate is fixedly connected to the connecting rod; at least two elastic members are sleeved outside the connecting rod, one end of the elastic member is fixedly connected to the support, and the other end of the elastic member is fixedly connected to the limiting plate.

[0014] Optionally, the left and right parts of the push plate protrude from the corresponding suction cups, and a rubber pad is arranged on the lower surface of the push plate.

[0015] The advantages and positive effects of the present invention are:

[0016] (1) Limit the chip through a positioning mold, and scan the chip from multiple angles during the movement by a 3D scanner, so as to obtain a complete 3D cloud point map, quickly detect the skewed chip pins, and be able to calculate the average width of the pins and the distance between two adjacent pins.

[0017] (2) Move each pressing block between two corresponding pins on the chip and squeeze the pins on the chip. At the same time, squeeze the two adjacent pins through the paddles on each pressing block. Since the width of the straight plate is equal to the distance between two adjacent pins on the chip, limit the two adjacent pins through the straight plate, so as to correct the position of the pins on the chip and make the distance between every two adjacent pins consistent.

[0018] (3) Clean the pins of the chip through the gas ejected from multiple nozzles, so that the pins of the chip are kept clean, thus avoiding the problem that the residual impurities on the pins of the chip affect the electrical connection stability between the chip and the subsequent power-on detection mechanism, interfere with the test operation, and cause large errors in the test results.

[0019] (4) Squeeze and correct the position of the pins of the chip through the cooperation of the corresponding pressing plate and the corresponding pressurizing plate, so as to reduce the warping of the pins of the chip. Then, squeeze the right part of the chip through the pushing plate to make the chip rotate. All the pins on the left side of the chip are clamped and limited by the pressing plate and the pressurizing plate, so that all the pins on the left side of the chip are stretched. Then, scan and detect the chip through the 3D scanner on the right, so as to realize the physical test and detection of all the pins on the chip, ensure that only the chips meeting the quality requirements enter the market, improve the reliability and stability of the product, and at the same time reduce the costs of after-sales maintenance and replacement. And compared with the existing chip detection equipment, it can perform physical tests on the pins of the chip after the chip is corrected, making the chip detection more comprehensive and the functions more diverse. Brief Description of the Drawings

[0020] Figure 1 Schematic diagram of the three-dimensional structure of the multifunctional automatic chip testing equipment of the present invention;

[0021] Figure 2 Schematic diagram of the installation position of the conveying mechanism of the multifunctional automatic chip testing equipment of the present invention;

[0022] Figure 3 Schematic diagram of the combined three-dimensional structure of the conveying mechanism and the scanning mechanism of the multifunctional automatic chip testing equipment of the present invention;

[0023] Figure 4It is a schematic diagram of the three-dimensional structure of the multifunctional chip automatic testing equipment bottom plate, the limiting mold, the fixing plate, the electric actuator I and the extrusion plate of the present invention;

[0024] Figure 5 It is a schematic diagram of the three-dimensional structure of the multifunctional chip automatic testing equipment fixing plate, electric actuator I, extrusion plate and pressing block combination of the present invention;

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the combination of the extrusion plate, the pressing block, the paddle and the straight plate of the multifunctional chip automatic testing equipment of the present invention;

[0026] Figure 7 It is a schematic diagram of the three-dimensional structure of the chip and the limiting mold combination of the multifunctional chip automatic testing equipment of the present invention;

[0027] Figure 8 It is a schematic diagram of the three-dimensional structure of the multifunctional chip automatic testing equipment dust removal system of the present invention;

[0028] Figure 9 It is a three-dimensional structural schematic diagram of the secondary detection system of the multifunctional chip automatic test equipment of the present invention;

[0029] Figure 10 It is a schematic diagram of the three-dimensional structure of the multifunctional chip automatic testing equipment support, connecting rod, limiting plate and elastic member combination of the present invention;

[0030] Figure 11 A state diagram of the invented multifunctional chip automatic testing equipment in which a push plate squeezes the chip.

[0031] The meanings of the reference numerals in the figure are: 1-outer box, 2-chip, 21-electric slide rail I, 22-electric slider I, 23-electric actuator II, 24-suction cup, 31-electric slide rail II, 32-electric slider II, 33-electric slide rail III, 34-electric slider III, 35-3D scanner, 201-electric actuator III, 202-support frame, 203-bottom plate, 204-limiting mold, 205-fixing plate, 206-electric actuator I, 207-extrusion plate, 208-pressing block, 2081-pick, 2082-straight plate, 301-L-shaped tube, 302-conduit, 303-round tube, 304-nozzle, 401-pushing plate, 402-electric actuator IV, 403-pressure plate, 404-support, 405-connecting rod, 406-limiting plate, 407-elastic member. DETAILED DESCRIPTION

[0032] To make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. It is hereby declared that the orientation terms such as upper, lower, left, right, front, rear, inner and outer that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention and do not specifically limit the present invention.

[0033] Embodiment 1:

[0034] A multifunctional automatic chip testing device, according to Figures 1 - 7 as shown, includes an outer box body 1, a conveying mechanism and a scanning mechanism; a reserved hole for installing an external conveyor belt is opened in the left part of the outer box body 1; a conveying mechanism is connected inside the outer box body 1; a scanning mechanism is connected inside the outer box body 1;

[0035] It also includes a driving mechanism, a bottom plate 203, a limiting die 204, a fixing plate 205, an electric actuator I 206, a pressing plate 207 and a pressing block 208; a driving mechanism is connected inside the outer box body 1, and the driving mechanism is connected to the bottom plate 203; the driving mechanism is used to drive the bottom plate 203 to move; three limiting dies 204 are fixedly connected to the bottom plate 203; four fixing plates 205 are fixedly connected to the bottom plate 203; two electric actuators I 206 are fixedly connected to each fixing plate 205, and the electric actuator I 206 is an electric push rod; all the telescopic parts of the electric actuators I 206 on the same fixing plate 205 are jointly fixedly connected to a pressing plate 207; taking the middle part of the bottom plate 203 as a reference, a plurality of pressing blocks 208 are fixedly connected to each of the two pressing plates 207 located on the left.

[0036] A dial 2081 is arranged on the side of the pressing block 208 away from the corresponding pressing plate 207, and is used for squeezing the pins of the chip 2.

[0037] A straight plate 2082 is arranged on the side of the pressing block 208 close to the corresponding pressing plate 207, and the width of the straight plate 2082 is equal to the distance between two adjacent pins on the chip 2, and is used for positioning the pins on the chip 2.

[0038] A friction reducing coating is provided on the outer surface of the pressing block 208, and is used for reducing the friction between the pressing block 208 and the pins of the chip 2.

[0039] The conveying mechanism includes an electric slide rail I 21, an electric slider I 22, an electric actuator II 23 and a suction cup 24; the electric slide rail I 21 is fixedly connected to the upper part inside the outer box body 1; two electric sliders I 22 are slidably connected to the electric slide rail I 21; an electric actuator II 23 is fixedly connected to the lower part of each electric slider I 22, and the electric actuator II 23 is an electric push rod; a suction cup 24 is fixedly connected to the telescopic part of each electric actuator II 23.

[0040] The scanning mechanism includes an electric slide rail II 31, an electric slider II 32, an electric slide rail III 33, an electric slider III 34, and a 3D scanner 35. Two electric slide rails II 31 are fixedly connected inside the outer box body 1. An electric slider II 32 is slidably connected to each electric slide rail II 31. An electric slide rail III 33 is fixedly connected to each electric slider II 32. An electric slider III 34 is slidably connected to each electric slide rail III 33. A 3D scanner 35 is fixedly connected to the lower part of each electric slider III 34.

[0041] The driving mechanism includes an electric actuator III 201 and a support frame 202. Two electric actuators III 201 are fixedly connected to the inner bottom of the outer box body 1. The electric actuator III 201 is an electric push rod. The telescopic parts of all the electric actuators III 201 are jointly fixedly connected to the bottom plate 203. Two support frames 202 are fixedly connected to the inner bottom of the outer box body 1. All the support frames 202 are slidably connected to the bottom plate 203.

[0042] The descriptions of "located on the left" or "located on the right" in the following description are all based on the middle of the bottom plate 203 as shown in Figure 3 to distinguish the parts located in the left area and the right area of the bottom plate 203.

[0043] The following is the working process of detecting the pins of the chip 2: Control the operation of the peripheral conveyor belt to convey the neatly placed whole plate of chips 2 to the left of the bottom plate 203. Then, control the electric slider II 32 located on the left to start and move left along the electric slide rail II 31. The movement of the electric slider II 32 drives the synchronous movement of the electric slide rail III 33, the electric slider III 34, and the 3D scanner 35, so as to avoid the movement of the electric actuator II 23. Then, control the electric slider I 22 located on the left to move left along the electric slide rail I 21. The movement of the electric slider I 22 drives the corresponding electric actuator II 23 to move. The movement of the electric actuator II 23 drives the suction cup 24 to move until the suction cup 24 moves above the chip 2. Then, control the electric actuator II 23 to start and drive the suction cup 24 to move downward, so that the suction cup 24 adsorbs the chip 2. Then, return and reset according to the above opposite working principle. After the electric slider I 22 moves back to its original position, control the electric actuator II 23 to start and drive the suction cup 24 to move downward, so that the chip 2 is placed in the leftmost limiting die 204, as shown in Figure 7As shown, then control the electric slider II 32 on the left to move back to its original position, so that the 3D scanner 35 moves closer to the chip 2. Then control the 3D scanner 35 to operate, and control the electric slider III 34 to start reciprocating movement along the electric slide rail III 33. The movement of the electric slider III 34 drives the 3D scanner 35, so that the 3D scanner 35 scans the chip 2 from multiple angles during the movement, thereby obtaining a complete 3D cloud point map, quickly detecting the pins of the skewed chip 2, and being able to calculate the average width of the pins and the distance between two adjacent pins. Then place the chip 2 with pins meeting the process standards on the limiting die 204 between the two pressing plates 207 on the left.

[0044] The following is the working process of straightening the pins of the chip 2: When the 3D scanner 35 detects that the pins of the chip 2 are skewed, that is, the distances between two adjacent pins on the chip 2 are different, control all the electric actuators I 206 on the two fixed plates 205 on the left to start, so that the two pressing plates 207 on the left move towards each other. The movement of the two pressing plates 207 drives the corresponding pressing blocks 208 to move, so that each pressing block 208 moves to between the corresponding two pins on the chip 2 and presses the pins on the chip 2. At the same time, use the paddles 2081 on each pressing block 208 to press the two adjacent pins. And because the outer surface of the pressing block 208 is provided with an antifriction coating, the friction between the pressing block 208 and the pins of the chip 2 can be reduced. Thus, when the pressing block 208 presses the pins of the chip 2, the pressing block 208 pushes the pins to move in the direction of the movement of the pressing block 208. When the pressing block 208 continuously moves to press the pins on the chip 2, since the width of the straight plate 2082 is equal to the distance between two adjacent pins on the chip 2, limit the pins through the straight plate 2082 on the pressing block 208 and the pressing plate 207, so as to straighten the pins on the chip 2 and make the distances between every two adjacent pins consistent.

[0045] Embodiment 2:

[0046] On the basis of Embodiment 1, according to Figure 4 and Figure 8 As shown, it further includes a dust removal system; a dust removal system is connected to the bottom plate 203; the dust removal system includes an L-shaped pipe 301, a conduit 302, a round pipe 303 and a nozzle 304; the L-shaped pipe 301 is fixedly connected to the bottom plate 203; the conduit 302 is fixedly connected and communicated with the L-shaped pipe 301; two round pipes 303 are fixedly connected and communicated with the conduit 302; a plurality of nozzles 304 are fixedly connected and communicated with each round pipe 303; the L-shaped pipe 301 and the conduit 302 pass through the adjacent limiting die 204.

[0047] All the nozzles 304 are inclined, and the end of the nozzle 304 away from the circular tube 303 is in the shape of a flared opening for increasing the coverage range of the gas.

[0048] The following is the working process of dust removal for the chip 2: The peripheral pump is pre-connected to the L-shaped tube 301. Since the production process of the chip 2 is carried out in a highly controlled dust-free workshop, even with an efficient filtration system, there may still be a very small amount of particulate matter in the air, especially during the air exchange process in the dust-free workshop, which may still cause the chip 2 to be contaminated with dust impurities. The impurities will interfere with the electrical connection stability between the chip 2 and the subsequent power-on detection mechanism, thus interfering with the test operation and resulting in a large error in the test results. After the chip 2 is placed on the limiting mold 204, the peripheral pump is controlled to start and pump gas into the L-shaped tube 301. The gas flows along the L-shaped tube 301 into the conduit 302 and then flows to the two circular tubes 303, and finally is sprayed onto the pins of the chip 2 through multiple nozzles 304. Thus, the pins of the chip 2 are cleaned by the gas ejected from the multiple nozzles 304, so that the pins of the chip 2 are kept clean, thereby avoiding the problem that the residual impurities on the pins of the chip 2 affect the electrical connection stability between the chip 2 and the subsequent power-on detection mechanism, thus interfering with the test operation and resulting in a large error in the test results.

[0049] Embodiment Three:

[0050] On the basis of Embodiment Two, according to Figures 9 - 11 As shown, it further includes a secondary detection system; a secondary detection system is connected to the bottom plate 203; the secondary detection system includes a push plate 401, an electric actuator IV 402, a pressure plate 403, a support 404, a connecting rod 405, a limiting plate 406 and an elastic member 407; a push plate 401 is fixedly connected to the suction cup 24 on the right; taking the middle part of the bottom plate 203 as a reference, an electric actuator IV 402 is fixedly connected to each of the fixing plates 205 on the right, and the electric actuator IV 402 is an electric push rod; a pressure plate 403 is fixedly connected to the telescopic part of each electric actuator IV 402; a support 404 is fixedly connected to the right part of the bottom plate 203, and the support 404 is located between two adjacent pressure plates 403; the upper part of the support 404 is rotatably connected to a connecting rod 405; a limiting plate 406 is fixedly connected to the connecting rod 405; two elastic members 407 are sleeved outside the connecting rod 405, the elastic member 407 is a torsion spring, one end of the elastic member 407 is fixedly connected to the support 404, and the other end of the elastic member 407 is fixedly connected to the limiting plate 406.

[0051] Both the left and right parts of the push plate 401 protrude from the corresponding suction cup 24, and a rubber pad is provided on the lower surface of the push plate 401 for pressing the chip 2 and preventing scratching of the chip 2.

[0052] The following is the work description of the secondary detection of Chip 2: After Chip 2 is properly positioned, the electric slider I 22 on the right is controlled to start and drive the corresponding electric actuator II 23 to move leftward. The movement of the electric actuator II 23 drives the movement of the suction cup 24, so that the suction cup 24 moves above the properly positioned Chip 2. Then, the electric actuator II 23 is controlled to start and drive the suction cup 24 to move downward, so that the suction cup 24 adsorbs Chip 2. Then, in the same way as above, the electric slider I 22 on the right is controlled to start and move rightward. Since the existing detection equipment does not conduct physical tests on Chip 2 during the detection of Chip 2, and physical testing is an essential step before the commercial mass production of Chip 2. Through physical testing, chips 2 with physical defects can be screened out to ensure that only chips 2 meeting the quality requirements enter the market. This can not only improve the reliability and stability of the product, but also reduce the costs of after-sales repair and replacement, thereby increasing the company's profits. Moreover, when the existing detection equipment adsorbs Chip 2 through hydraulic devices such as cylinders, it will cause a downward pressure on Chip 2, which will in turn cause the pins of Chip 2 to warp, etc. As a result, when Chip 2 is subjected to subsequent power-on detection, the pins of Chip 2 will be misaligned with the contacts of the power-on detection mechanism, which will extremely easily affect the subsequent detection operations. By controlling all the electric actuators I 206 on the right to start, the two pressing plates 207 on the right are driven to move towards each other, so that the two pressing plates 207 on the right move towards the support 404. Then, the electric actuator II 23 on the right is controlled to start and drive the suction cup 24 to move downward, and then drive Chip 2 to move downward, so as to place Chip 2 on the limit plate 406. At this time, the inner sides of the pins on both sides of Chip 2 are limited by one pressing plate 207 each. Then, the two electric actuators IV 402 are controlled to start and drive one pressing plate 403 each to move, so that the two pressing plates 403 move towards each other and press against the pins of Chip 2, as Figure 10 shown, so as to squeeze and align the pins of Chip 2 through the cooperation of the corresponding pressing plate 207 and the corresponding pressing plate 403, thereby reducing the warping of the pins of Chip 2.

[0053] Then control all the electric actuators Ⅳ402 to start and drive the corresponding pressure plates 403 to move back to their original positions, control the electric actuator Ⅱ23 on the right to start and drive the suction cup 24 to move upward, thereby driving the chip 2 to move upward. Then control all the electric actuators Ⅰ206 on the right side of the support 404 to start and drive the corresponding pressing plates 207 to move, so that the pressing plates 207 on the right side of the support 404 move away from the support 404, facilitating sufficient movement space for the pins on the right side of the chip 2. Then place the chip 2 on the limiting plate 406 in the same way as above. And the pressing plates 207 and pressure plates 403 on the left side of the support 404 still clamp and limit the pins on the left side of the chip 2. Then control the suction cup 24 to release the chip 2, and then control the electric slider Ⅰ22 on the right to start and drive the corresponding electric actuator Ⅱ23 to move, thereby driving the suction cup 24 on the right to move. The movement of the suction cup 24 drives the push plate 401 to move, so that the left part of the push plate 401 moves to the right side of the chip 2, as Figure 10 shown. Then control the electric actuator Ⅱ23 on the right to start and drive the suction cup 24 to move downward. The movement of the suction cup 24 drives the push plate 401 to move downward, thereby squeezing the right part of the chip 2 through the push plate 401, driving the limiting plate 406 to rotate. The rotation of the limiting plate 406 drives the connecting rod 405 to rotate, so that the two elastic members 407 store energy, causing the chip 2 to rotate. And all the pins on the left side of the chip 2 are clamped and limited by the pressing plates 207 and pressure plates 403. Thus, when the chip 2 rotates, all the pins on the left side of the chip 2 can be stretched. Then control the electric actuator Ⅱ23 on the right to start and drive the suction cup 24 to move upward and reset, so that the push plate 401 no longer squeezes the right part of the chip 2. At the same time, the connecting rod 405 and the limiting plate 406 rotate and reset due to the elastic force generated by the two elastic members 407, driving the chip 2 to reset. Then stretch all the pins on the right side of the chip 2 in the same way as above. Then transfer the chip 2 that has passed the stretching test to the rightmost limiting mold 204 and perform a scanning test through the 3D scanner 35 on the right. If none of the pins on the chip 2 fall off, break, etc. after the stretching test, it means that all the pins on the chip 2 are firmly welded and meet the production standards. If several pins on the chip 2 fall off, break, etc., it means that the production quality of the chip 2 does not meet the standards. Then remove the non-compliant chip 2, thereby realizing the physical detection of the chip 2, ensuring that only the chips 2 that meet the quality requirements enter the market, improving the reliability and stability of the product while also reducing the costs of after-sales maintenance and replacement. And compared with the existing chip 2 detection equipment, this multifunctional chip 2 automatic testing equipment can perform physical tests on the pins of the chip 2 after the chip 2 is correctly positioned, making the detection of the chip 2 more comprehensive and the functions more diverse.

[0054] The above are only embodiments of the present invention, and thus do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification of the present invention, or directly or indirectly applied in other related technical fields, shall be similarly included within the patent protection scope of the present invention.

Claims

1. A multifunctional chip automatic testing device, comprising an outer box (1), a conveying mechanism and a scanning mechanism; a reserved hole for installing an external conveyor belt is opened on the left side of the outer box (1); a conveying mechanism for conveying a chip (2) is connected inside the outer box (1); a scanning mechanism for performing a 3D scan on the chip (2) is connected inside the outer box (1); the characteristics are as follows: It also includes a driving mechanism, a bottom plate (203), a limiting mold (204), a fixed plate (205), an electric actuator I (206), an extrusion plate (207) and a pressing block (208); the outer box body (1) is connected to the driving mechanism, and the driving mechanism is connected to the bottom plate (203); the driving mechanism is used to drive the bottom plate (203) to move; at least three limiting molds (204) are fixedly connected to the bottom plate (203); at least four fixed plates (205) are fixedly connected to the bottom plate (203); at least two electric actuators I (206) are fixedly connected to each fixed plate (205); the telescopic parts of all electric actuators I (206) on the same fixed plate (205) are fixedly connected to an extrusion plate (207); with the middle of the bottom plate (203) as a reference, all the extrusion plates (207) located on the left are each fixedly connected to a plurality of pressing blocks (208); The transmission mechanism comprises an electric slide rail I (21), an electric slider I (22), an electric actuator II (23) and a suction cup (24); the electric slide rail I (21) is fixedly connected to the upper inner portion of the outer box body (1); at least two electric sliders I (22) are slidably connected to the electric slide rail I (21); an electric actuator II (23) is fixedly connected to the lower portion of each electric slider I (22); and a suction cup (24) is fixedly connected to the telescopic portion of each electric actuator II (23); The secondary detection system is also included; the secondary detection system is connected to the bottom plate (203); the secondary detection system includes a push plate (401), an electric actuator IV (402), a pressure plate (403), a support (404), a connecting rod (405), a limit plate (406) and an elastic member (407); the push plate (401) is fixedly connected to the suction cup (24) located on the right; with the middle of the bottom plate (203) as a reference, an electric actuator IV (402) is fixedly connected to all the fixed plates (205) located on the right; each electric actuator The telescopic parts of the device IV (402) are fixedly connected to a pressure plate (403); the right part of the bottom plate (203) is fixedly connected to a support (404), and the support (404) is located between two adjacent pressure plates (403); the upper part of the support (404) is rotatably connected to a connecting rod (405); the connecting rod (405) is fixedly connected to a limiting plate (406); at least two elastic members (407) are sleeved on the outer side of the connecting rod (405), one end of the elastic member (407) is fixedly connected to the support (404), and the other end of the elastic member (407) is fixedly connected to the limiting plate (406).

2. A multifunctional chip automatic testing equipment according to claim 1, characterized in that: A paddle (2081) is provided on one side of the pressing block (208) away from the corresponding extrusion plate (207).

3. The multifunctional chip automatic testing equipment according to claim 1, characterized in that: A straight plate (2082) is provided on one side of the pressing block (208) close to the corresponding extrusion plate (207), and the width of the straight plate (2082) is equal to the distance between two adjacent pins on the chip (2).

4. The multifunctional chip automatic testing equipment according to claim 1, characterized in that: The outer surface of the pressing block (208) is provided with a friction-reducing coating.

5. The multifunctional chip automatic testing equipment according to claim 1, characterized in that: The scanning mechanism comprises an electric slide rail II (31), an electric slider II (32), an electric slide rail III (33), an electric slider III (34) and a 3D scanner (35); at least two electric slide rails II (31) are fixedly connected inside the outer box (1); each electric slide rail II (31) is slidably connected to an electric slider II (32); each electric slider II (32) is fixedly connected to an electric slide rail III (33); each electric slide rail III (33) is slidably connected to an electric slider III (34); and a 3D scanner (35) is fixedly connected to the lower part of each electric slider III (34).

6. A multifunctional chip automatic testing equipment according to any one of claims 1 to 5, characterized in that: The device also comprises a dust removal system; the dust removal system is connected to the bottom plate (203); the dust removal system comprises an L-shaped tube (301), a conduit (302), a circular tube (303) and a nozzle (304); the L-shaped tube (301) is fixedly connected to the bottom plate (203); the conduit (302) is connected to the L-shaped tube (301); at least two circular tubes (303) are connected to the conduit (302); each circular tube (303) is fixedly connected to and communicated with a plurality of nozzles (304); the L-shaped tube (301) and the conduit (302) are inserted into adjacent limiting molds (204).

7. The multifunctional chip automatic testing equipment according to claim 6, characterized in that: All nozzles (304) are arranged at an inclination, and one end of the nozzle (304) away from the circular tube (303) is arranged in a bell-mouth shape.

8. The multifunctional chip automatic testing equipment according to claim 1, characterized in that: The left and right parts of the push plate (401) both protrude from the corresponding suction cups (24), and a rubber pad is provided on the lower surface of the push plate (401).

Images