Heat dissipation system and projection device

By designing a heat dissipation system including liquid-cooled plates and multiple radiators in the projector, the problem of heat discharge in the high-brightness projector is solved, and the good heat dissipation effect of the projector device and the efficient operation of the light valve are achieved.

CN119828404APending Publication Date: 2025-04-15CORETRONIC CORPORATION
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Patent Information

Application Number
CN202510223516.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2020-05-29
Publication Date
2025-04-15

AI Technical Summary

Technical Problem

High-brightness projectors generate a large amount of heat during the luminescence process, which affects the efficiency and reliability of the light valve, and it is difficult for existing heat dissipation systems to effectively remove heat.

Method used

A heat dissipation system is designed, including a casing, a plurality of liquid-cooled plates, a first radiator and a second radiator. The first radiator is arranged next to the main air inlet and the second radiator is arranged next to the air outlet. The liquid-cooled plate and the radiator are connected to each other and heat exchange is performed using cooling fluid.

Benefits of technology

By effectively discharging the heat generated by the heat source, the good heat dissipation effect of the projection device is achieved, and the efficiency and reliability of the light valve are improved.

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Abstract

The invention provides a heat dissipation system and a projection device comprising the same. The heat dissipation system comprises a machine shell, a plurality of liquid cooling plates, a pipeline, a first fan, a second fan, a first radiator and a second radiator. The casing is provided with a main air inlet and an air outlet. The liquid cooling plate, the pipeline, the first fan, the second fan, the first radiator and the second radiator are arranged in the machine shell. The first radiator pair is located at the main air inlet and located between the first fan and the main air inlet. The second radiator is aligned with the air outlet and is located between the second fan and the air outlet. The liquid cooling plate, the first radiator and the second radiator are communicated with each other through the at least one pipeline. The LED lamp has a good heat dissipation effect.
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Description

[0001] This application is a divisional application of the Chinese patent application with application number 202010472850.7 filed on May 29, 2020 and invention name “Heat dissipation system and projection device”. Technical Field

[0002] The present invention relates to a heat dissipation system and a projection device, and more particularly to a heat dissipation system and a projection device comprising a liquid cooling plate and a radiator. Background Art

[0003] With the advancement of technology, projectors are increasingly used in our daily lives. For example, they can be used in different places such as indoors, in cinemas, and outdoors. In the projector market, high-brightness projectors have become a trend. Projectors can use high-power light-emitting elements to achieve high brightness, but high brightness is also accompanied by the generation of a large amount of heat energy. On the other hand, since core components, such as light valves, may receive light beams from high-power light-emitting elements, a large amount of heat energy can also seriously affect the performance and reliability of the light valve. Therefore, in the field of projectors, heat dissipation is an extremely important issue.

[0004] The "background technology" section is only used to help understand the content of the present invention. Therefore, the content disclosed in the "background technology" section may contain some known technologies that are not known to those skilled in the art. The content disclosed in the "background technology" section does not mean that the content or the problems to be solved by one or more embodiments of the present invention have been known or recognized by those skilled in the art before the application of the present invention. Summary of the invention

[0005] The invention provides a heat dissipation system and a projection device using the heat dissipation system, which has good heat dissipation effect.

[0006] Other purposes and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

[0007] In one embodiment of the present invention, a heat dissipation system is provided. The heat dissipation system includes a housing, a plurality of liquid cooling plates, at least one first heat sink and at least one second heat sink. The housing has a main air inlet and an air outlet. The liquid cooling plate is disposed in the housing. The at least one first heat sink is disposed in the housing and is opposite to the main air inlet. The at least one second heat sink is disposed in the housing and is opposite to the air outlet. The liquid cooling plate, the at least one first heat sink and the at least one second heat sink are interconnected.

[0008] In one embodiment of the present invention, a projection device is provided. The projection device includes a plurality of heat sources and the above-mentioned heat dissipation system. The heat dissipation system includes a plurality of liquid cooling plates, and the heat sources are thermally coupled to the liquid cooling plates.

[0009] Based on the above, in the heat dissipation system or projection device of the embodiment of the present invention, the first and second radiators can be respectively arranged beside the main air inlet and air outlet of the casing. Since the temperature at the main air inlet is relatively low and the air volume at the air outlet is large, the first and second radiators can effectively discharge the heat generated by the heat source, thereby having a good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 4 is a schematic diagram of a projection device according to an embodiment of the present invention.

[0011] Figure 2 FIG. 4 is a schematic diagram of the structure of a heat dissipation system according to an embodiment of the present invention.

[0012] Figures 3 to 5 Schematic diagrams of the heat dissipation system according to different embodiments of the present invention. Fig. 6A and 6B FIG. 4 is a schematic diagram of the heat dissipation system of a comparative embodiment. DETAILED DESCRIPTION

[0013] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions in the accompanying drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

[0014] Figure 1 FIG. 1 is a schematic diagram of a projection device according to an embodiment of the present invention. Figure 1 , the projection device 200 includes an illumination system 210, a light valve 220, a heat dissipation system 100 and a projection lens 230. The illumination system 210 is used to provide an illumination beam IB, and may include an excitation light source 212, a fluorescent color wheel 214, a filter color wheel 216, a supplementary light source 218 and other elements. In some embodiments, the illumination system 210 may include an optical element or a combination of optical elements having a light-emitting function. For example, the illumination system 210 may include a combination of a light-emitting element (for example, a laser diode or a light-emitting diode), a reflector, a lens, etc., but the present invention is not limited thereto. In this embodiment, the light-emitting element is, for example, an excitation light source 212 for emitting an excitation beam EB, and the excitation beam EB is, for example, blue light. For example, the excitation light source 212 is a blue laser diode. In other embodiments, the supplementary light source 218 is used to emit a supplementary light beam CB, and the supplementary light beam CB is, for example, red light. For example, the supplementary light source 218 is a red laser diode.

[0015] In this embodiment, the fluorescent color wheel 214 and the filter color wheel 216 can transform the excitation light beam EB into different colors of light in different time intervals, wherein the fluorescent color wheel 214 is provided with a fluorescent area and a light-transmitting area (or a reflective area), and the filter color wheel 216 can be provided with a red light filter, a green light filter, and a light-transmitting area (which can be doped with diffusion particles). For example, in a first time interval, the excitation light beam EB is transmitted to the fluorescent area of ​​the fluorescent color wheel 214, so that the fluorescent material in the fluorescent area is excited to emit a yellow light beam, and the yellow light beam can be further transmitted to the red light filter or the green light filter of the filter color wheel 216 to output a red light beam or a green light beam. Furthermore, the supplementary light source 218 can also emit red light to enhance the intensity of the red light. In a second time interval, the excitation light beam EB can be transmitted to the light-transmitting area (or a reflective area) of the fluorescent color wheel 214, and after penetrating (or reflecting) through the light-transmitting area (or a reflective area), it is further transmitted to the light-transmitting area of ​​the filter color wheel 216 to output blue light. Therefore, the illumination system 210 can sequentially provide light beams of different colors at different times to form the illumination light beam IB.

[0016] In some embodiments, the light valve 220 may include a spatial light modulator such as a digital micro-mirror device (DMD), a liquid crystal on silicon panel (LCOS Panel), or a liquid crystal panel (LCD), but is not limited thereto. In this embodiment, the light valve 220 may be used to convert the illumination light beam IB into the image light beam IMB.

[0017] In some embodiments, the projection lens 230 may include a combination of multiple optical lenses with the same or different refractive powers. For example, the optical lens may include non-planar lenses such as a biconcave lens, a biconvex lens, a concave-convex lens, a convex-concave lens, a plano-convex lens, and a plano-concave lens, and may also include a plane mirror. The present invention does not limit the type and type of the projection lens 230.

[0018] In the above embodiment, the heat dissipation system 100 is used to dissipate heat from the heat source HS of the projection device 200. For example, the heat source HS may include an element that generates heat during operation. In the projection device 200, for example, the excitation light source 212 and the supplementary light source 218 may generate heat during the light emission process. Furthermore, the fluorescent color wheel 214 and the filter color wheel 216 may also generate heat during the process of being irradiated by the excitation light beam EB. Furthermore, the light valve 220 may also generate heat during the process of converting the illumination light beam IB into the image light beam IMB. Therefore, the excitation light source 212, the supplementary light source 218, the fluorescent color wheel 214, the filter color wheel 216, and the light valve 220 may be used as the heat source HS separately or in combination, but the present invention is not limited thereto.

[0019] Specifically, according to different desired operating temperatures, the heat source HS may include a first heat source HS1 and a second heat source HS2. Generally speaking, the desired operating temperature refers to the operating temperature required for different components to achieve their optimal operating efficiency. In the above embodiment, the first heat source HS1 includes, for example, an excitation light source 212 and a supplementary light source 218, and the desired operating temperature of the supplementary light source 218 may be lower than the desired operating temperature of the excitation light source 212. Further, the second heat source HS2 includes, for example, a light valve 220, and the desired operating temperature of the excitation light source 212 may be lower than the desired operating temperature of the light valve 220.

[0020] Figure 2 This is a schematic diagram of the heat dissipation system according to an embodiment of the present invention. Figure 2 The heat dissipation system 100 includes a housing 110 , a plurality of liquid cooling plates 120 , at least one first heat sink 130 and a second heat sink 140 .

[0021] In some embodiments, the housing 110 is used to protect the components inside the projection device 200. Specifically, the housing 110 may include first to fourth side walls SW1-SW4 connected end to end. The first side wall SW1 is opposite to the third side wall SW3, and the second side wall SW2 is opposite to the fourth side wall SW4. Further, the projection lens 230 may be disposed at the first side wall SW1. In this case, the first side wall SW1 may be referred to as the front cover of the housing 110, and correspondingly, the third side wall SW3 may be referred to as the back cover of the housing 110. However, this is only used for distance description and is not intended to limit the present invention.

[0022] In this embodiment, the housing 110 has an air inlet and an air outlet. Figure 2 As shown, the housing 110 has a main air inlet 112, three air inlets AI and an air outlet 114. The main air inlet 112 and the air inlet AI allow air flow to enter the housing 110, and the air outlet 114 allows air flow to leave the housing 110. In this embodiment, the main air inlet 112, the air inlet AI and the air outlet 114 are openings arranged on the side wall of the housing 110, the main air inlet 112 is arranged on the second side wall SW2, the two air inlets AI are arranged on the first side wall SW1, the one air inlet AI is arranged on the fourth side wall SW4, and the air outlet 114 is arranged on the third side wall SW3. The main air inlet 112 is defined as, for example, an opening for transmitting external air flow to the first heat sink. It should be noted that a person skilled in the art can change the number and position of the air inlet / air outlet according to needs, and the present invention is not limited thereto. In other embodiments, the number of the main air inlet 112 and the air inlet AI can be, for example, five.

[0023] In the present embodiment, the first heat sink 130 and the second heat sink 140 may be disposed in the housing 110, and may be respectively located at the main air inlet 112 and the air outlet 114. For example, the first heat sink 130 may be disposed next to the main air inlet 112, and the second heat sink 140 may be disposed next to the air outlet 114. In some embodiments, the first heat sink 130 and / or the second heat sink 140 may include, for example, a heat sink plate or heat sink fins. In the present embodiment, the number of the first heat sink 130 is one, and the number of the second heat sink 140 is one, but it is not limited thereto.

[0024] In some embodiments, the liquid cooling plate 120 may include an internal flow channel and have a high thermal conductivity. The material of the liquid cooling plate 120 includes metal, for example, but is not limited thereto. In the present embodiment, the number of the liquid cooling plates 120 is multiple, for example, three, and the liquid cooling plate 120 may be at least partially thermally coupled to at least one heat source HS, for example, in thermal contact (conduction). Corresponding to the first heat source HS1 and the second heat source HS2, the liquid cooling plate 120 may include a first liquid cooling plate 122 and a second liquid cooling plate 124, wherein the first heat source HS1 (for example, the excitation light source 212 and the supplementary light source 218) is thermally coupled to the first liquid cooling plate 122, and the second heat source HS2 (for example, the light valve 220) is thermally coupled to the second liquid cooling plate 124. In more detail, the first liquid cooling plate 122 coupled to the excitation light source 212 is labeled 1222, and the first liquid cooling plate 122 thermally coupled to the supplementary light source 218 is labeled 1221. In this embodiment, a plurality of liquid cooling plates 120 may be disposed in the housing 110, and the plurality of liquid cooling plates 120 are interconnected with the first radiator 130 and the second radiator 140. It should be noted that a person skilled in the art may change the material, position and number of the liquid cooling plates 120 according to needs, and the present invention is not limited thereto.

[0025] Please refer again Figure 2 The cooling system 100 may further include a first fan 150, a second fan 160, at least one pipe PL, a pump P, a storage tank T, and a cooling fluid. The liquid cooling plate 120, the first radiator 130, and the second radiator 140 are interconnected through the pipe PL, and the cooling fluid flows in the pipe PL and the above components.

[0026] In some embodiments, the first fan 150 and the second fan 160 can provide airflow. In this embodiment, the number of the first and second fans 150, 160 can be, for example, three respectively, and the three first fans 150 are arranged to be located in pairs on the first heat sink 130, and the three second fans 160 are arranged to be located in pairs on the second heat sink 140. In detail, the first fan 150 is arranged on one side of the first heat sink 130, and the second fan 160 is arranged on one side of the second heat sink 140. In this configuration, the first and second fans 150, 160 are respectively used to provide airflow to dissipate heat for the first and second heat sinks 130, 140. In other embodiments not shown, the number of the first and second fans 150, 160 can also be one, two, or more than three. The technicians in the relevant technical field can change the number or position of the first and second fans 150, 160 according to the needs, and the present invention is not limited thereto.

[0027] In some embodiments, a pump P is connected to the pipeline PL to draw a cooling fluid (not shown) to flow in the pipeline. The pump P includes a mechanical device that can do work on the fluid to move the fluid. In some embodiments, a storage tank T is connected to the pipeline PL to store the cooling fluid (not shown). Figure 2 As shown, in the cooling fluid flow path, the pump P is disposed between the first radiator 130 and the second radiator 140, and the storage tank T is disposed between the pump P and the second radiator 140. The cooling fluid may flow inside the pipe PL, wherein the cooling fluid may be water, for example, but not limited thereto.

[0028] In some embodiments, please refer to Figure 2 In the path of the cooling fluid flow, the first liquid cooling plate 122 (e.g., the first liquid cooling plates 1221, 1222) may be connected between the first radiator 130 and the second radiator 140 via the pipeline PL. The second liquid cooling plate 124 is disposed at the downstream pipeline PL of the second radiator 140 via the pipeline PL. Further, the pump P may be disposed at the pipeline PL between the first radiator 130 and the second radiator 140, and the storage tank T may be disposed at the pipeline PL between the pump P and the second radiator 140. In the present embodiment, the pipeline PL is a closed pipeline, and is connected to the liquid cooling plate 120 (e.g., the first liquid cooling plate 1221, 1222 and the second liquid cooling plate 124), the first radiator 130, the second radiator 140, the pump P, and the storage tank T, so that the cooling fluid can flow between the above-mentioned components.

[0029] In some embodiments, for illustration, five locations along the pipeline PL may be labeled as P1 to P5 , and their temperatures are T1 to T5 , respectively.

[0030] Please refer to Figure 2, the cooling fluid stored in the storage tank T can flow to the position P1 through the pipeline PL by the traction of the pump P, and then flow into the first liquid cold plate 1221. The heat emitted by the first heat source HS1 (for example, the supplementary light source 218) is conducted to the cooling fluid flowing through it through the first liquid cold plate 1221, so as to achieve the effect of heat dissipation of the first heat source HS1. Correspondingly, the temperature of the cooling fluid in the first liquid cold plate 1221 can be increased. Therefore, the temperature T2 of the cooling fluid at the position P2 downstream of the first liquid cold plate 1221 is greater than the temperature T1 at the position P1. In this embodiment, the liquid cold plate can be regarded as a heat exchanger between the cooling fluid and the heat source HS.

[0031] Further, by the traction of the pump P, the cooling fluid flows into the first liquid cold plate 1222, and its heat dissipation effect on the first heat source HS1 (for example, the excitation light source 212) is similar to the description of the first liquid cold plate 1221, which will not be repeated here. Similarly, the temperature T3 of the cooling fluid at the position P3 downstream of the first liquid cold plate 1222 is greater than the temperature T2 at the position P2. Further, the cooling fluid flows into the second radiator 140, and at the second radiator 140, the second fan 160 can provide airflow to the second radiator 140, so that the second radiator 140 dissipates heat. Correspondingly, the temperature T4 of the cooling fluid at the position P4 downstream of the second radiator 140 can be lower than the temperature T3 at the position P3.

[0032] Please refer to Figure 2 , the cooling fluid then flows into the second liquid cooling plate 124, and its heat dissipation effect on the second heat source HS2 (for example, the light valve 220) is similar to the description of the first liquid cooling plate 122, and will not be repeated here. In some embodiments, the first desired operating temperature of the first heat source HS1 may be lower than the second desired operating temperature of the second heat source HS2. Before the cooling fluid flows into the first cooling plate 1221, the temperature at position P1 is T1, and before the cooling fluid flows into the second cooling plate 124, the temperature at position P4 is T4, and T1≤T4. In this embodiment, the temperature T5 of the cooling fluid at position P5 may be the highest.

[0033] Furthermore, after the cooling fluid flows through the second cooling plate 124, it can continue to flow into the first radiator 130. Further, by means of the first fan 150, the cooling fluid performs heat exchange in the first radiator 130 to transfer the heat energy of the first radiator 130 to the space in the housing 110. Since the first radiator 130 is disposed adjacent to the main air inlet 112, after the cooling fluid flows through the first radiator 130, the temperature T1 of the cooling fluid at the position P1 downstream of the first radiator 130 can be the lowest. In this way, the cooling fluid flows to the pump P, thus forming a heat dissipation cycle.

[0034] exist Figure 2In the illustrated embodiment, during the projection process of the projection device 200, air flows into the housing 110 from the main air inlet 112 and the air inlet AI, undergoes heat exchange in the housing 110, and leaves the housing 110 through the air outlet 114. in1 、F in2 、F in3 、F in4 The sum of the air volume F of the air outlet 114 is substantially equal to out , that is, F in1 +F in2 +F in3 +F in4 =F out Since the air volume F of the air outlet 114 is out The second heat sink 140 is relatively large, so the heat of the second heat sink 140 can be quickly taken away from the heat dissipation system 100 .

[0035] Figures 3 to 5 Schematic diagram of the heat dissipation system of different embodiments of the present invention. Figure 3 , Figure 3 The heat dissipation system 100a is similar to Figure 1 The heat dissipation system 100 of the embodiment of the present invention mainly differs in that: in the housing 110a, the main air inlet 112 is disposed on the fourth side wall SW4, and an air inlet AI is disposed on the first side wall SW1. In this embodiment, the second side wall SW2 is not provided with an air inlet. In other embodiments, the first side wall may be provided with more air inlets or no air inlet, and the second side wall may be provided with one or more air inlets, and the present invention is not limited thereto.

[0036] Please refer to Figure 4 , Figure 4 The heat dissipation system 100b is similar to Figure 1 The main difference of the heat dissipation system 100 is that: in the housing 110b, the air inlet AI, the first main air inlet 1121 (112) and the second main air inlet 1122 (112) are respectively provided on the first side wall SW1, the second side wall SW2 and the fourth side wall SW4. Two first radiators 130 are respectively provided corresponding to the first main air inlet 1121 (112) and the second main air inlet 1122 (112). In this embodiment, after the cooling fluid leaves the first liquid cold plate 1222, it flows to the second radiator 140 and the other first radiator 130 for heat exchange, so that the heat dissipation system 100b of this embodiment can meet higher heat dissipation requirements.

[0037] Please refer to Figure 5 , Figure 5 The cooling system 100c is similar to Figure 4The main difference between the heat dissipation system 100 and the heat dissipation system 100 is that in the casing 110c, the first main air inlet 1121 (112) is arranged on the first side wall SW1, that is, it is arranged on the same side as the air inlet AI. Correspondingly, another first radiator 130 is arranged corresponding to the first main air inlet 1121 (112). It is worth mentioning that in the above-mentioned embodiments, at least one first fan 150 can be arranged on one side of each first radiator 13, and at least one second fan 160 can be arranged on one side of the second radiator 140. However, the position and number of the first fan 150 or the second fan 160 are not limited thereto. In other embodiments not shown, the first fan can also be arranged on the other side or both sides of the first radiator 130, or the first fan can be omitted.

[0038] exist Figure 4 and Figure 5 In the embodiment shown, two first radiators 130 are provided, so the cooling fluid can perform heat exchange twice in sequence in the two first radiators 130, thereby making the temperature difference between the cooling fluid flowing into the second liquid cold plate 124 and the second heat source HS2 larger. Therefore, the heat dissipation systems 100B and 100c of this embodiment can meet higher heat dissipation requirements.

[0039] Fig. 6A and 6B FIG. 1 is a schematic diagram of the structure of the heat dissipation system 10 ′ and 10 ″ of the comparative example (known). Please refer to Fig. 6A The heat dissipation system 10 includes a housing 1, a plurality of liquid cooling plates 2, a radiator 3, a fan 4, a pump 5, a storage tank 6 and a pipeline 7. The housing 1 has an air inlet 112. Starting from the pump 5, the pump 5, the storage tank 6, the plurality of liquid cooling plates 2 and the radiator 3 are sequentially arranged along the pipeline 7. The plurality of fans 4 can be arranged beside the radiator 3. The plurality of heat sources HS of the projection device (for example, the supplementary light source 218, the excitation light source 212, the light valve 220) can be thermally coupled to the liquid cooling plates 2 respectively. Figure 6B The embodiment shown and Fig. 6A Similar, the difference is: Figure 6B In the embodiment, the volume of the radiator 3 is relatively large (for example, longer), thereby providing a larger heat dissipation area, and more fans 4 can be arranged around the radiator 3. In the comparative example, since no radiator is arranged at the pipe 7 between the liquid cooling plates 2, when the cooling fluid flows in the pipe 7 between the multiple liquid cooling plates 2, the temperature of the cooling fluid will gradually rise from the upstream to the downstream of the pipe 7. In this case, after the cooling fluid flows through the liquid cooling plate of the first heat source HS1, when it flows into the liquid cooling plate corresponding to the second heat source HS2, its temperature is relatively high, so it is impossible to effectively discharge heat from the second heat source HS2 in a short time, resulting in poor cooling effect of the second heat source HS2. Figure 6B In the comparative example, due to the arrangement of the heat dissipation system 10 ′, the overall space utilization of the housing 1 is poor.

[0040] Referring back to the heat dissipation system of the embodiment of the present invention, the first and second heat sinks 130 and 140 are provided, which can respectively be located at the main air inlet 112 and the air outlet 114 of the housing 110. Since the air flow temperature at the main air inlet 112 is relatively low and the air volume at the air outlet 114 is large, the cooling fluid can perform more effective heat exchange when flowing through the first and second heat sinks 130 and 140, thereby more effectively removing heat. Further, by providing the second heat sink 140, the cooling fluid is cooled by heat dissipation at the second heat sink 140 before entering the second liquid cold plate 124 to dissipate heat for the second heat source HS2, so that the heat dissipation system 100 and the projection device 200 can have a good heat dissipation effect in a smaller volume.

[0041] In summary, in the heat dissipation system and the projection device of the embodiment of the present invention, the first and second radiators are respectively arranged beside the main air inlet and the air outlet of the casing. Since the temperature at the air inlet is relatively low and the air volume at the air outlet is large, the first and second radiators can effectively remove the heat from the heat source, so the heat dissipation system and the projection device have a good heat dissipation effect.

[0042] However, the above is only the preferred embodiment of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. That is, all simple equivalent changes and modifications made according to the claims and the content of the invention of the present invention are still within the scope of the patent of the present invention. In addition, any embodiment or claim of the present invention does not need to achieve all the purposes, advantages or features disclosed by the present invention. In addition, the abstract and the name of the invention are only used to assist in the retrieval of patent documents, and are not used to limit the scope of rights of the present invention. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name the name of the element or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

[0043] Description of reference numerals:

[0044] 200: Projection device

[0045] 210: Lighting system

[0046] 212: Excitation light source

[0047] 214: Fluorescent Color Wheel

[0048] 216: Filter Color Wheel

[0049] 218: Supplementary light source

[0050] 220: Light valve

[0051] 230: Projection lens

[0052] 10, 10', 10", 100, 100a~100c: Cooling system

[0053] 1.110: Casing

[0054] 112: Main air inlet

[0055] 1121: First main air inlet

[0056] 1122: Second main air inlet

[0057] 114: Air outlet

[0058] 2: Liquid cooling plate

[0059] 3: Radiator

[0060] 4: Fan

[0061] 5: Pump

[0062] 6: Storage tank

[0063] 7. PL: Pipeline

[0064] 120: Liquid cooling plate

[0065] 122, 1221, 1222: The first liquid cooling plate

[0066] 124: Second liquid cooling plate

[0067] 130: First Radiator

[0068] 140: Second radiator

[0069] 150: First Fan

[0070] 160: Second Fan

[0071] AI: Air Inlet

[0072] CB: Filling beam

[0073] D: Specific direction

[0074] F in1 、F in2 、F in3 、F in4 : Air volume

[0075] F out : Air volume

[0076] HS: Heat Source

[0077] HS1: First Heat Source

[0078] HS2: The second heat source

[0079] IB: Illumination beam

[0080] IMB: Image beam

[0081] P1~P5:Location

[0082] SW1~SW4: First to fourth side walls

[0083] T: Storage tank.

Claims

1. A heat dissipation system, characterized in that: The heat dissipation system includes a housing, a plurality of liquid cooling plates, at least one pipeline, at least one first fan, at least one second fan, at least one first radiator and at least one second radiator, wherein: The housing comprises a first side wall, a second side wall, a third side wall and a fourth side wall connected to each other, wherein the first side wall is opposite to the third side wall, and the second side wall is opposite to the fourth side wall, the housing has at least one main air inlet and an air outlet, the at least one main air inlet is arranged on one of the fourth side wall and the second side wall, and the air outlet is arranged on the third side wall; The plurality of liquid cooling plates, the at least one first fan, the at least one second fan, the at least one first radiator and the at least one second radiator are disposed in the housing; The at least one first heat sink is located at the at least one main air inlet and between the at least one first fan and the at least one main air inlet, wherein no other components are disposed between the at least one first heat sink and the at least one main air inlet, so that the external airflow entering the housing through the at least one main air inlet is first transferred to the at least one first heat sink; and The at least one second heat sink is located at the air outlet and between the at least one second fan and the air outlet. The plurality of liquid cooling plates, the at least one first radiator and the at least one second radiator are connected to each other via the at least one pipeline.

2. The heat dissipation system according to claim 1, characterized in that: The heat dissipation system further comprises: The cooling fluid is a liquid cooling plate, wherein the plurality of liquid cooling plates, the at least one first radiator and the at least one second radiator are connected to each other through the at least one pipeline, and the cooling fluid flows in the at least one pipeline.

3. The heat dissipation system according to claim 2, characterized in that: The heat dissipation system further comprises: a pump connected to the at least one pipeline, the pump being used to draw the cooling fluid to flow in the at least one pipeline, wherein the pump is disposed between the at least one first radiator and the at least one second radiator; and A storage tank is connected to the at least one pipeline, and is used to store the cooling fluid, wherein the storage tank is disposed between the pump and the at least one second radiator.

4. The heat dissipation system according to claim 2, characterized in that: The plurality of liquid cooling plates include at least one first liquid cooling plate and at least one second liquid cooling plate, the at least one first liquid cooling plate is connected between the at least one first radiator and the at least one second radiator through the at least one pipeline, and the at least one second liquid cooling plate is connected downstream of the at least one second radiator through the at least one pipeline.

5. The heat dissipation system according to claim 1, characterized in that: The number of the at least one main air inlet is one.

6. The heat dissipation system according to claim 1, characterized in that: The number of the at least one main air inlet is multiple, and the multiple main air inlets include a first main air inlet and a second main air inlet. The first main air inlet is arranged on the second side wall, and the second main air inlet is arranged on the fourth side wall.

7. The heat dissipation system according to claim 1, characterized in that: The at least one main air inlet is in a plurality of numbers, and the plurality of main air inlets include a first main air inlet and a second main air inlet. The first main air inlet is disposed on the first side wall, and the second main air inlet is disposed on at least one of the second side wall and the fourth side wall.

8. The heat dissipation system according to claim 1, characterized in that: The housing has at least one air inlet, and the at least one air inlet is disposed on one of the first side wall, the second side wall, and the fourth side wall.

9. The heat dissipation system according to claim 1, characterized in that: The orthographic projection of the at least one first fan on one of the side walls overlaps with the orthographic projection of the at least one first radiator on one of the side walls, and the orthographic projection of the at least one second fan on the third side wall overlaps with the orthographic projection of the at least one second radiator on the third side wall.

10. A projection device, characterized in that: The projection device includes multiple heat sources and a heat dissipation system, wherein: The heat dissipation system includes a housing, a plurality of liquid cooling plates, at least one pipeline, at least one first fan, at least one second fan, at least one first radiator and at least one second radiator, wherein: The housing comprises a first side wall, a second side wall, a third side wall and a fourth side wall connected to each other, wherein the first side wall is opposite to the third side wall, and the second side wall is opposite to the fourth side wall, the housing has at least one main air inlet and an air outlet, the at least one main air inlet is arranged on one of the fourth side wall and the second side wall, and the air outlet is arranged on the third side wall; The plurality of liquid cooling plates, the at least one first fan, the at least one second fan, the at least one first heat sink, and the at least one second heat sink are disposed in the housing, wherein the plurality of liquid cooling plates are thermally coupled to at least a portion of the plurality of heat sources; The at least one first heat sink is located at the at least one main air inlet and between the at least one first fan and the at least one main air inlet, wherein no other components are disposed between the at least one first heat sink and the at least one main air inlet, so that the external airflow entering the housing through the at least one main air inlet is first transferred to the at least one first heat sink; and The at least one second heat sink is located at the air outlet and between the at least one second fan and the air outlet. The plurality of liquid cooling plates, the at least one first radiator and the at least one second radiator are connected to each other via the at least one pipeline.

11. The projection device according to claim 10, characterized in that: The projection device also includes: The cooling fluid is a liquid cooling plate, wherein the plurality of liquid cooling plates, the at least one first radiator and the at least one second radiator are connected to each other through the at least one pipeline, and the cooling fluid flows in the at least one pipeline.

12. The projection device according to claim 11, characterized in that: The projection device also includes: a pump connected to the at least one pipeline, the pump being used to draw the cooling fluid to flow in the at least one pipeline, wherein the pump is disposed between the at least one first radiator and the at least one second radiator; and A storage tank is connected to the at least one pipeline, and is used to store cooling fluid, wherein the storage tank is arranged between the pump and the at least one second radiator.

13. The projection device according to claim 11, characterized in that: The multiple liquid cooling plates include at least one first liquid cooling plate and at least one second liquid cooling plate, the at least one first liquid cooling plate is connected between the at least one first radiator and the at least one second radiator through the at least one pipeline, and the at least one second liquid cooling plate is connected downstream of the second radiator through the at least one pipeline, wherein the multiple heat sources include at least one first heat source and at least one second heat source, the at least one first heat source is thermally coupled to the at least one first liquid cooling plate, and the at least one second heat source is thermally coupled to the at least one second liquid cooling plate, wherein a first desired operating temperature of the first heat source is less than a second desired operating temperature of the second heat source.

14. The projection device according to claim 10, characterized in that: The projection device further includes a projection lens, and the projection lens is disposed on the first side wall, wherein the number of the at least one main air inlet is one.

15. The projection device according to claim 10, characterized in that: The projection device also includes a projection lens, and the projection lens is arranged on the first side wall, wherein the number of the at least one main air inlet is multiple, and the multiple main air inlets include a first main air inlet and a second main air inlet, the first main air inlet is arranged on the second side wall, and the second main air inlet is arranged on the fourth side wall.

16. The projection device according to claim 10, characterized in that: The projection device also includes a projection lens, and the projection lens is arranged on the first side wall, wherein the at least one main air inlet is multiple in number, and the multiple main air inlets include a first main air inlet and a second main air inlet, the first main air inlet is arranged on the first side wall, and the second main air inlet is arranged on the second side wall or the fourth side wall.

17. The projection device according to claim 10, characterized in that: The plurality of heat sources include light emitting elements and light valves in the projection device.

18. The projection device according to claim 10, characterized in that: The housing has at least one air inlet, and the at least one air inlet is disposed on one of the first side wall, the second side wall, and the fourth side wall.

19. The projection device according to claim 10, characterized in that: The orthographic projection of the at least one first fan on one of the side walls overlaps with the orthographic projection of the at least one first radiator on one of the side walls, and the orthographic projection of the at least one second fan on the third side wall overlaps with the orthographic projection of the at least one second radiator on the third side wall.

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