Accounting method for copper electroplating consumption of PCB (Printed Circuit Board)

Abstract

The invention discloses an accounting method for PCB electroplating copper plating consumption. The accounting method comprises the steps that the whole board electroplating copper consumption amount is calculated, wherein the sizes of a, b and h of a PCB are determined; determining the drilling number and the drilling radius of the PCB as n and r respectively; the minimum hole copper, the reserved value and the deep plating capacity of the PCB are determined to be d, e and T respectively; determining the number f of jointed boards of the PCBs; pi is a circumference constant, p is a copper plating density, and the pattern electroplating copper consumption calculation step comprises the steps of determining corresponding plated area proportions as c1 and c2 respectively; determining the number and aperture of pattern electroplating holes; the minimum hole copper, the reserved value and the deep plating capacity corresponding to pattern electroplating are determined; and the pattern electroplating copper consumption is calculated through a formula. According to the invention, the problem that accurate copper consumption calculation cannot be carried out for different PCB designs in the prior art is solved.

Description

Technical Field

[0001] The invention relates to the field of PCB technology, and in particular to a method for calculating the copper plating consumption of PCB electroplating. Background Art

[0002] PCB plating, or printed circuit board plating, refers to the process of covering the surface of a circuit board with a layer of metal film. This metal film is usually made of conductive materials such as copper, nickel, and gold, and is intended to enhance the conductivity of the circuit board and protect and beautify the circuit board. Through the electroplating process, the metal layer on the surface of the circuit board can be evenly distributed, thereby improving the reliability and stability of the circuit board.

[0003] At present, in the electroplating process, formulas such as Coulomb's law are often used for calculation. Although accurate data can be obtained, it is difficult to be compatible with PCB designs of different specifications and functions (different customers have different needs) through empirical formulas. It is difficult to confirm the copper consumption of a certain board material for small batches of PCBs, and it is impossible to accurately calculate the copper consumption through PCB design.

[0004] In view of this, the present technical solution proposes a method for calculating the copper plating consumption of PCB electroplating, which can easily calculate the required copper consumption according to different PCB designs while ensuring the stability of the equipment, and has the advantages of easy calculation and high compatibility. Summary of the invention

[0005] The technical solution of the present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, the main purpose of the present invention is to provide a method for calculating the copper consumption of PCB electroplating, aiming to solve the problem that the prior art cannot accurately calculate the copper consumption for different PCB designs.

[0006] To achieve the above object, the present invention provides a method for calculating the copper plating consumption of PCB electroplating, including A. calculating the copper consumption of full-board electroplating: Determine the dimensions of the PCB as a, b, and h; determine the number of holes drilled on the PCB and the radius of the holes drilled as n and r respectively; determine the minimum hole copper, reserved value, and deep plating capacity of the PCB as d, e, and T respectively; determine the number of panels on the PCB as f; and use the formula

[0007] Calculate the copper consumption of the whole board electroplating, where pi is the pi constant, p is the copper plating density, Calculation steps for copper consumption of graphic electroplating: determine the corresponding plating area ratios c1 and c2 respectively; determine the number and diameter of graphic electroplating holes; confirm the minimum hole copper, reserved value and deep plating capacity corresponding to graphic electroplating; use the formula

[0008] Calculate the copper consumption for graphic electroplating.

[0009] As a further solution of the present invention, the step of calculating the copper consumption of the whole plate electroplating also includes the step of calculating the copper consumption of the whole plate after electroplating: determining the number and diameter of the resin plug holes; confirming the minimum hole copper, the reserved value and the deep plating capacity; using the formula

[0010] Calculate the copper consumption of the plated holes in the entire board after electroplating.

[0011] As a further solution of the present invention, the step of calculating the copper consumption of full-board electroplating further includes a second step of calculating the copper consumption of full-board electroplating: a6. The copper consumption of the plated holes after the whole board is obtained by the formula

[0012] The copper consumption of the second full-board electroplating was obtained.

[0013] As a further solution of the present invention, the copper consumption of the full-board electroplating is the copper consumption after the first drilling, and the copper consumption of the second full-board electroplating is the copper consumption after the second drilling.

[0014] As a further solution of the present invention, in the step of calculating the copper consumption of graphic electroplating, the number and diameter of the corresponding electroplated holes in the graphic electroplating are statistically confirmed by using the non-metallized holes and the metallized holes.

[0015] As a further solution of the present invention, in the step of calculating the copper consumption for full-board electroplating, the size of the PCB board is determined by pressing and milling the edge size.

[0016] As a further solution of the present invention, in the step of calculating the copper consumption of graphic electroplating, the plated area is the area after deducting the dry film coverage.

[0017] The beneficial effects of the present invention are as follows: The method for calculating the copper plating consumption of PCB electroplating proposed in the present invention can easily and accurately calculate the required copper consumption according to different PCB designs under the premise of ensuring the stability of the equipment. The calculation is performed by determining T (deep plating capacity), e (reserved value), and f (number of panels), and has the characteristics of being compatible with various differentiated PCB designs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the technical solutions of the present invention or the technical solutions of the present invention in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the technical solutions of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of drilling (once) using this calculation method.

[0020] Figure 2 It is a schematic diagram of the drilling (secondary) involved in the present invention.

[0021] Figure 3 Schematic diagram of the resin plug hole involved in the present invention.

[0022] Figure 4 Schematic diagram of graphic electroplating using this calculation method.

[0023] Figure 5 This is a schematic diagram of graphic electroplating (bl surface) using this calculation method.

[0024] Figure 6 It is a schematic diagram of the jigsaw puzzle in the present invention.

[0025] Figure 7 It is a schematic diagram of the specifications of the non-plated holes and the plated holes in the present invention. DETAILED DESCRIPTION

[0026] as follows: Please see attached Figure 1-7 , The main implementation steps include: the calculation steps of the copper consumption of the whole board electroplating: determine the size of the PCB board as a, b, h; determine the number of holes and the radius of the holes in the PCB board as n and r respectively; determine the minimum hole copper, reserved value and deep plating capacity of the PCB board as d, e, T respectively; determine the number of panels of the PCB board as f (the steps of determining the size, specification, reserved value and deep plating capacity can be carried out separately); through the formula Calculate the copper consumption of the whole board electroplating, in is the circumference constant (π), and Then (height), that is, the inner wall area of ​​the hole, is the copper plating density; To get the average thickness, we need to multiply; In order to meet the hole copper d, it is necessary to reserve the copper consumption of the subsequent process, and the surface copper that needs to be plated with d must be plated After determining the copper plating volume, the mass can be calculated by multiplying the volume density.

[0027] Combined with the current technology: Pressing - drilling target - milling edge (size confirmation: a, b) - drilling PIN - drilling (one drill: , can be obtained through Figure 1(determined by the first drill) - drilling and PIN removal - copper pre-treatment - vertical copper deposition - full board electroplating (d, e, T1) - dry film before plating - plating - film removal - resin plugging - ceramic grinding plate - drilling target - drilling (second drill: , please refer to Figure 2 )—copper deposition pretreatment—vertical copper deposition—full board electroplating (d, e, T2)—outer layer film—outer layer exposure—outer layer development—graphic copper deposition (c1, c2, T3)—graphic electroplating.

[0028] Calculation steps for copper consumption of graphic electroplating: Determine the corresponding plating area ratios c1 and c2 (reference Figure 4 , Figure 5 ); Determine the number and diameter of pattern plating holes (reference Figure 7 ); confirm the minimum hole copper, reserved value and deep plating capacity corresponding to the graphic electroplating; through the formula Calculate the copper consumption for graphic electroplating.

[0029] A preferred embodiment of the present invention: the step of calculating the copper consumption of the whole board electroplating also includes the step of calculating the copper consumption of the plated holes after the whole board electroplating: 1. Determine the number and diameter of resin plug holes (reference Figure 3 ); 2. Confirm the minimum hole copper, reserved value and deep plating capacity; 3. Through the formula Calculate the copper consumption of the plated holes after the whole board is electroplated. The steps for calculating the copper consumption of the second full board electroplating are: The copper consumption of the plated holes after the whole board is obtained by the formula The copper consumption of the second full-board electroplating was obtained.

[0030] After the resin plugging, the drill hole is filled with resin (the default is to fill it completely, non-selective resin plugging), as shown in the above formula, which is similar to the full-board electroplating of one drill, but it is necessary to consider that the drill hole is filled with resin, so only the electroplating of the empty surface of the drill hole is considered, and the wall of the drill hole is not considered. The number and diameter of the two drill holes are considered (reference Figure 2 ).

[0031] A preferred embodiment of the present invention: the copper consumption of the whole board electroplating is the copper consumption after the first drilling, and the copper consumption of the second whole board electroplating is the copper consumption after the second drilling.

[0032] A preferred embodiment of the present invention: In the step of calculating the copper consumption of pattern electroplating, the number and diameter of the corresponding electroplated holes in the pattern electroplating are statistically confirmed by the non-metallized holes and the metallized holes, and the reference Figure 7 .

[0033] A preferred embodiment of the present invention: in the step of calculating the copper consumption for full-board electroplating, the size of the PCB board is determined by pressing and milling the edge size.

[0034] A preferred embodiment of the present invention: in the step of calculating the copper consumption of graphic electroplating, the plated area is the area after deducting the dry film coverage.

[0035] The above are only preferred embodiments of the technical solution of the present invention, and do not limit the patent scope of the technical solution of the present invention. All equivalent structural changes made by using the contents of the technical solution description and drawings of the present invention under the conception of the technical solution of the present invention, or directly / indirectly used in other related technical fields are included in the patent protection scope of the technical solution of the present invention.

Claims

1. A method for calculating the copper plating cost of PCB electroplating, characterized in that: include A. Calculation steps for copper consumption of full board electroplating: a1. Determine the dimensions of the PCB board as a, b, and h; a2. Determine the number of holes drilled on the PCB and the drilling radius, which are n and r respectively; a3. Determine the minimum hole copper, reserved value and deep plating capacity of the PCB board as d, e and T respectively; a4. Determine the number of PCB panels to be f; a5. Through the formula Calculate the copper consumption of the whole board electroplating, where pi is the pi constant, p is the copper plating density, B. Calculation steps for copper consumption of graphic electroplating: b1, determine the corresponding plating area ratios c1 and c2 respectively; b2. Determine the number and diameter of patterned electroplating holes; b3. Confirm the minimum hole copper, reserved value and deep plating capacity corresponding to the graphic electroplating; b4. Through the formula Calculate the copper consumption for graphic electroplating.

2. The method for calculating the copper plating cost of PCB electroplating according to claim 1, characterized in that: The step of calculating the copper consumption of the whole board electroplating also includes the step of calculating the copper consumption of the plated holes after the whole board electroplating: a31. Determine the number and diameter of the resin plug holes; a32. Confirm the minimum hole copper, reserved value and deep plating capacity; By formula Calculate the copper consumption of the plated holes in the entire board after electroplating.

3. The method for calculating the copper plating cost of PCB electroplating according to claim 2, characterized in that: The step of calculating the copper consumption of full-board electroplating also includes a second step of calculating the copper consumption of full-board electroplating: a6. The copper consumption of the plated holes after the whole board is obtained by the formula The copper consumption of the second full-board electroplating was obtained.

4. The method for calculating the copper plating cost of PCB electroplating according to claim 3, characterized in that: The copper consumption of the full-board electroplating is the copper consumption after the first drilling, and the copper consumption of the second full-board electroplating is the copper consumption after the second drilling.

5. The method for calculating the copper plating cost of PCB electroplating according to claim 1, characterized in that: In the step of calculating the copper consumption of pattern electroplating, the number and diameter of the corresponding electroplated holes in the pattern electroplating are statistically confirmed through the non-metallized holes and the metallized holes.

6. The method for calculating the copper plating cost of PCB electroplating according to claim 1, characterized in that: In the step of calculating the copper consumption for full-board electroplating, the size of the PCB board is determined by pressing and milling the edge size.

7. The method for calculating the copper plating cost of PCB electroplating according to claim 1, characterized in that: In the step of calculating the copper consumption of pattern electroplating, the plated area is the area after deducting the dry film coverage.

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