Efficient heat dissipation device capable of naturally dissipating heat

Abstract

The efficient heat dissipation device capable of naturally dissipating heat is suitable for heat dissipation of intermittent high-power devices and comprises an installation shell and protrusions arranged on the top face of the installation shell, the protrusions are of a hollow structure, the protrusions are filled with phase change material layers, and the phase change material layers are arranged in the installation shell. The phase-change material layer is used for absorbing and storing heat dissipated when the high-power device works, a cavity is formed in the position close to the top face of the mounting shell, heat dissipation fins are arranged on the bottom face of the mounting shell at intervals, and a graphene heat conduction mixing layer is arranged in the cavity. The graphene heat conduction mixing layer is used for transmitting heat stored by the phase change material layer to the heat dissipation fins in a heat expansion mode when the high-power device does not work, heat dissipation is carried out through the heat dissipation fins, and the heat dissipation efficiency of the high-power device is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic component heat dissipation devices, and in particular relates to a high-efficiency heat dissipation device with natural heat dissipation. Background Art

[0002] In the application scenarios of electronic equipment, there are many high-power, intermittent working electronic equipment that can only use natural heat dissipation due to installation environment restrictions, such as power converters, TR modules, etc. As the requirements for integration continue to increase, the heat flux density continues to increase, and the heat dissipation problem becomes prominent. It is necessary to meet the heat dissipation needs of such electronic hot standby by expanding new technologies, new materials, new processes, and new structures. Aluminum and copper fin heat sinks are a commonly used heat dissipation device with a simple structure and low cost. They can greatly increase the heat exchange area and improve the efficiency of natural heat dissipation. The disadvantage is that the thermal conductivity is low, and the heat dissipation capacity is insufficient under natural heat dissipation conditions, which cannot meet the requirements of electronic equipment integration and high heat flux density.

[0003] Phase change heat dissipation devices such as phase change temperature equalizer and heat pipe are now widely used. The device is mainly composed of a vacuum chamber, a working fluid, a capillary, etc. It uses the phase change enthalpy of the working fluid to transfer heat. The heat transfer efficiency is high, and the equivalent thermal conductivity of the device can reach 800-2000W / (m·k). The disadvantage is that the thermal conductivity is greatly affected by the environment and gravity. Summary of the invention

[0004] In view of this, the high-efficiency heat dissipation device with natural heat dissipation provided by the present invention solves the heat dissipation problem of existing high-power electronic equipment that works intermittently and can only use natural heat dissipation due to installation environment restrictions, ensures that the operating temperature of the device is within the allowable range, and has low heat dissipation efficiency.

[0005] A high-efficiency heat dissipation device with natural heat dissipation is suitable for heat dissipation of intermittent high-power devices, comprising a mounting shell and a protrusion arranged on the top surface of the mounting shell, wherein the protrusion is arranged in a hollow structure, wherein:

[0006] The protrusion is filled with a phase change material layer, and the phase change material layer is used to absorb and store the heat emitted when the high-power device is working;

[0007] A cavity is arranged near the top surface of the mounting shell and heat sink fins are arranged at intervals on the bottom surface. A graphene thermal conductive mixed layer is arranged in the cavity. The graphene thermal conductive mixed layer is used to transfer the heat stored in the phase change material layer to the heat sink fins in a heat expansion manner when the high-power device is not working, so as to dissipate heat through the heat sink fins.

[0008] The technical beneficial effects of the present invention are:

[0009] The present invention combines phase change energy storage and solid-state graphene high-efficiency thermal conductivity technology through structural design and process design, which is suitable for solving the heat dissipation problem of some high-power electronic devices that work intermittently and can only use natural heat dissipation due to installation environment restrictions, ensuring that the operating temperature of the device is within the allowable range. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0011] Figure 1 It is a schematic diagram of the overall structure;

[0012] Figure 2 Schematic diagram of the performance of phase change materials and graphene;

[0013] Figure 3 Schematic diagram of graphene heat-conducting hybrid layer;

[0014] Figure 4 is a top view of the convexity, where

[0015] 1. Mounting shell; 2. Protrusion; 21. Phase change material layer; 3. Graphene thermal conductive mixed layer; 4. Heat dissipation fins; 5. Cylinder. DETAILED DESCRIPTION

[0016] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0017] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0018] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0019] like Figures 1 to 4 The high-efficiency heat dissipation device with natural heat dissipation shown is suitable for heat dissipation of intermittent high-power devices. The device of the present invention is designed for heat dissipation of intermittent high-power electronic components, and quickly dissipates heat in a contact manner when the components are not working, thereby improving the use efficiency of the electronic components. The device of the present invention includes a mounting shell 1 and a protrusion 2 arranged on the top surface of the mounting shell 1, wherein the protrusion 2 is arranged in a hollow structure, wherein the protrusion 2 is filled with a phase change material layer 21, and preferably, the phase change material layer 21 is made of an alkane phase change material, which belongs to the solid-liquid phase change material, such as paraffin. The phase change material layer 21 is used for absorbing and storing the heat dissipated by the high-power device when it is working;

[0020] A cavity is arranged at the top surface of the adjacent mounting shell 1 and heat sink fins 4 are arranged at intervals on the bottom surface. A graphene thermal conductive mixed layer 3 is arranged in the cavity. The graphene thermal conductive mixed layer 3 is used to transfer the heat stored in the phase change material layer 21 to the heat sink fins 4 in a heat expansion manner when the high-power device is not working, and the heat is dissipated through the heat sink fins 4, thereby dissipating the heat generated by the electronic components.

[0021] As a specific implementation method provided in this case, the cross-sectional size of the cavity is larger than the cross-sectional size of the protrusion 2, which can increase the heat dissipation area. The cross-sectional size of the cavity is equal to or smaller than the cross-sectional size of the mounting shell 1. The protrusion 2 is regarded as a point heat source, and the role of the graphene thermal conductive mixed layer 3 is to expand the point heat source into a surface heat source, which can improve the heat dissipation efficiency of the heat sink 4.

[0022] Furthermore, a plurality of cylinders 5 are arranged at intervals inside the protrusion 2, and the two ends of the cylinder 5 extend to the top and bottom surfaces of the protrusion 2 respectively, that is, flush with the top and bottom surfaces of the protrusion 2. The functions of the cylinder 5 are, first, supporting, and second, increasing the transfer of heat dissipated by the high-power device when working, and absorbing it through the graphene thermal conductive mixed layer 3. The working principle is: the phase change material layer 21 has high heat absorption and heat storage capabilities, but poor thermal conductivity. In order to achieve rapid conduction of heat generated by electronic components, a plurality of cylinders 5 made of aluminum alloy are arranged. The heat of the electronic components is quickly thermally conducted to the phase change material layer 21 in a surface contact manner through the cylinder 5, and the phase change material layer 21 absorbs and stores the heat, and transfers the heat to the heat dissipating fins 4 through the graphene thermal conductive mixed layer 3, that is, improving the thermal conductivity of the internal space of the phase change energy storage material, and at the same time increasing the structural strength of the entire heat dissipation device.

[0023] Further, the graphene heat-conducting mixed layer 3 is formed by a plurality of aluminum foils and graphene by hot pressing process, wherein a graphene heat-conducting layer is formed between two adjacent layers of aluminum foil, i.e., a layered graphene layer, and the top and bottom surfaces of the graphene heat-conducting mixed layer 3 are both aluminum foils. The layered graphene high thermal conductivity material is used as a heat transfer part to quickly conduct heat to the heat sink fins 4. The graphene heat-conducting mixed layer 3 uses graphene and aluminum as raw materials, breaks through the key technology of graphene / metal composite, and gives full play to the high thermal conductivity of graphene. The upper and lower surfaces of the layered graphene composite material are aluminum alloy, and the middle is graphene-aluminum alloy-graphene composited in sequence, which is composited under high temperature and high pressure, and a compound transition layer is formed at the interface to ensure that the composite material is a whole. The upper and lower surfaces of the layered graphene composite material are aluminum alloy layers, which are convenient for welding with the aluminum alloy shell. After welding, the thermal conductive material and the surface of the aluminum alloy shell are in good contact, and the heat transfer thermal resistance is small.

[0024] Furthermore, the method for forming the mounting shell and the graphene heat-conducting mixed layer includes:

[0025] S1: The top surface of the mounting shell is provided with a groove matching the shape of the graphene heat-conducting mixed layer;

[0026] S2: The graphene heat-conductive mixed layer formed by the hot pressing process is welded in the groove by sealing welding.

[0027] Overall working principle: After high-power, intermittent working devices generate heat during working hours, the heat is transferred to the paraffin phase change material through heat conduction from the device mounting surface. The phase change energy storage material changes from solid to liquid, and quickly absorbs heat through the phase change enthalpy value to reduce the surface temperature of the device. During the intermittent rest time of the device, the heat in the energy storage material is transferred to the layered graphene thermal conductive material through heat conduction. The high-efficiency thermal conductivity characteristics are used to quickly diffuse the heat to the entire heat dissipation fin area. The heat exchange area is increased through the heat dissipation fins, and the heat is quickly transferred to the surrounding air through natural heat dissipation. It can be used in conjunction with an exhaust fan. In the above, the mounting shell is made of aluminum alloy.

[0028] See also Figure 2 Through experimental tests on intermittent working devices with a size of 70×70mm and a power of 400W, it was found that the device can work intermittently for about 4 minutes under natural heat dissipation conditions, and the surface temperature of the device is less than 120℃, which is more than double the heat dissipation performance of traditional radiators.

[0029] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A highly efficient heat dissipation device with natural heat dissipation, suitable for heat dissipation of intermittent high-power devices, characterized in that: It includes a mounting shell and a protrusion arranged on the top surface of the mounting shell, wherein the protrusion is arranged in a hollow structure, wherein: The protrusion is filled with a phase change material layer, and the phase change material layer is used to absorb and store the heat emitted when the high-power device is working; A cavity is arranged near the top surface of the mounting shell and heat sink fins are arranged at intervals on the bottom surface. A graphene thermal conductive mixed layer is arranged in the cavity. The graphene thermal conductive mixed layer is used to transfer the heat stored in the phase change material layer to the heat sink fins in a heat expansion manner when the high-power device is not working, so as to dissipate heat through the heat sink fins.

2. The high-efficiency heat dissipation device according to claim 1, characterized in that: The cross-sectional size of the cavity is larger than the cross-sectional size of the protrusion, which can increase the heat dissipation area. The cross-sectional size of the cavity is equal to or smaller than the cross-sectional size of the mounting shell.

3. The high-efficiency heat dissipation device according to claim 1, characterized in that: The phase change material layer is made of alkane phase change material.

4. The high-efficiency heat dissipation device according to claim 3, characterized in that: A plurality of cylinders are arranged at intervals inside the protrusion, and the two ends of the cylinders extend to the top and bottom surfaces of the protrusion respectively, that is, they are flush with the top and bottom surfaces of the protrusion. The cylinders are used to increase the transfer of heat dissipated by the high-power device when it is working, and absorb it through the graphene thermal conductive mixed layer.

5. The high-efficiency heat dissipation device according to claim 4, characterized in that: The phase change material layer is made of paraffin.

6. The high-efficiency heat dissipation device according to claim 4, characterized in that: The graphene heat-conducting mixed layer is formed by multi-layer aluminum foil and multi-layer graphene using a hot pressing process, wherein: A graphene heat-conducting layer is formed between two adjacent layers of aluminum foil, and the top surface and the bottom surface of the graphene heat-conducting mixed layer are both the aluminum foil.

7. The high-efficiency heat dissipation device according to claim 6, characterized in that: The molding method of the mounting shell provided with the graphene heat-conducting mixed layer comprises: The top surface of the mounting shell is provided with a groove matching the shape of the graphene heat-conducting mixed layer; The graphene heat-conducting mixed layer formed by the hot pressing process is welded in the groove in a sealed welding manner.

8. The high-efficiency heat dissipation device according to claim 6, characterized in that: The installation shell is made of aluminum alloy material.

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