A dual-channel cooling device and cooling method for semiconductor lasers

Abstract

This invention discloses a dual-channel cooling device and method for semiconductor lasers, belonging to the field of semiconductor laser cooling. The dual-channel cooling device for semiconductor lasers includes a cooling box and heat sink fins. This invention can adjust the motor's operating current according to the temperature generated during semiconductor laser operation, thereby adjusting the motor's output power. This results in different airflow speeds from the fan blades towards the heat sink fins, leading to varying degrees of cooling. This prevents the motor from operating at its rated output power for extended periods, which would reduce its lifespan, and also prevents insufficient motor output power from reducing the cooling efficiency of the semiconductor laser. This achieves effective cooling of the semiconductor laser and utilizes a single driving source for dual heat dissipation of the heat sink fins, thus realizing both water cooling and air cooling for the semiconductor laser, improving cooling efficiency and ensuring the lifespan of the semiconductor laser.

Description

Technical Field

[0001] This invention relates to the field of semiconductor laser cooling technology, and more particularly to a dual-channel cooling device and cooling method for semiconductor lasers. Background Technology

[0002] Semiconductor lasers are electronic components that generate a significant amount of heat during operation, thus requiring cooling to maintain their operating temperature. Here are some common methods for cooling semiconductor lasers: Heat sink: Using a heat sink made of metal or thermally conductive material, the heat generated by the laser is conducted away. This method is economical and simple, suitable for lower-power lasers. Air cooling: Air cooling uses a dedicated air-cooled heat sink (also called a cooling fan) to dissipate heat. Water cooling: A cooling medium (usually water) flows through the laser's heat sink or cooling plate, absorbing heat and carrying it away. Water cooling provides a relatively high heat absorption capacity and is suitable for higher-power lasers. Refrigerant cooling: Using a refrigerant (such as Freon) to cool the laser, absorbing heat through refrigerant circulation. This method is suitable for lasers with high temperature control requirements.

[0003] Currently, when using a heating sink to cool semiconductor lasers, the cooling efficiency is low, and a large amount of dust adheres to the outer surface of the heating sink, hindering its heat dissipation efficiency and thus affecting the cooling efficiency of the semiconductor laser. When using a combination of air cooling and water cooling, the motor and water pump need to run simultaneously to ensure cooling efficiency. Furthermore, during cooling, it is impossible to adjust the output power of the motor and water pump according to the heat generated by the semiconductor laser. If the output power is full, it will affect the service life of the motor and water pump. If the output power is low, the semiconductor laser cannot be adequately cooled. Based on this, a dual-channel cooling device and cooling method for semiconductor lasers is proposed. Summary of the Invention

[0004] The purpose of this invention is to solve the problem in the prior art that the output power of the motor and water pump cannot be adjusted according to the heat generated by the semiconductor laser. If the output power is full, it will affect the service life of the motor and water pump. If the operation is low, it will not be able to cool the semiconductor laser sufficiently. Therefore, a dual-channel cooling device and cooling method for semiconductor lasers are proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A dual-channel cooling device for a semiconductor laser includes a cooling box and a semiconductor laser mounted on top of the cooling box. It further includes: heat dissipation fins fixedly connected to the top of the cooling box; a motor fixedly connected to the bottom of the inner wall of the cooling box, the output end of the motor being fixedly connected to a shaft, the outer wall of the shaft being provided with reciprocating wires, fan blades fixedly connected to the outer wall of the shaft, and a main bevel gear fixedly connected to the top of the shaft; a first channel fixedly connected to both sides of the cooling box, the inner wall of the first channel being fixedly connected to a first filter plate; and a second channel fixedly connected to the other two sides of the cooling box, the inner wall of the second channel being fixedly connected to a second filter plate.

[0007] To improve the cooling quality and efficiency of the semiconductor laser by water cooling the heat sink fins, preferably, the system further includes: a water-cooled box fixedly connected to the bottom of the inner wall of the cooling box; a water-cooling pipe fixedly connected to the water-cooled box; a liquid-drawing tank fixedly connected to the end of the water-cooling pipe away from the water-cooled box; a turntable rotatably connected to the inner wall of the liquid-drawing tank; a liquid-drawing plate fixedly connected to the outer wall of the turntable; and a drain pipe fixedly connected to the outer wall of the liquid-drawing tank.

[0008] In order to allow the cleaning rack to slide along the outer surface of the heat sink fins to clean the heat sink fins and ensure the heat dissipation efficiency and quality of the heat sink fins, preferably, it also includes: a rotating rod rotatably connected to the inner side wall of the cooling box, the outer side wall of the rotating rod being fixedly connected to a bevel gear, and the outer side wall of the rotating rod being threadedly connected to the cleaning rack.

[0009] To adjust the motor current and thus the motor output power according to the temperature generated during the operation of the semiconductor laser, the device further includes: a temperature sensing box fixedly connected to the middle of the heat sink fins; a sliding plate slidably connected to the inner wall of the temperature sensing box; a return spring fixedly connected to the top of the sliding plate; an adjusting ring fixedly connected to the bottom of the sliding plate; and an electrode post slidably connected to the inner wall of the adjusting ring.

[0010] Furthermore, the outer wall of the reciprocating wire is connected to a reciprocating frame via a thread, and a cleaning rod is fixedly connected to the end of the reciprocating frame.

[0011] Furthermore, the inner wall of the turntable is fixedly connected to the outer wall of the rotating shaft, the end of the drain cooling pipe away from the liquid extraction tank is fixedly connected to the water cooling tank, and the rotating shaft passes through the liquid extraction tank and is rotatably connected to the liquid extraction tank.

[0012] Furthermore, the outer wall of the bevel gear meshes with the outer wall of the main bevel gear, and the cleaning rack is in contact with and slides against the heat dissipation fins.

[0013] Furthermore, the top of the return spring is fixedly connected to the top of the inner wall of the temperature sensing chamber, the bottom of the electrode post is fixedly connected to the bottom of the inner wall of the temperature sensing chamber, the space in the temperature sensing chamber where the return spring is installed is filled with carbon dioxide gas, and the electrode post and the adjusting ring are electrically connected to the motor.

[0014] Furthermore, the reciprocating frame passes through the first filter plate and the second filter plate and is slidably connected to the first filter plate and the second filter plate, and the cleaning rod is in contact with the first filter plate and the second filter plate and slides against each other on the side near the reciprocating frame.

[0015] A dual-channel cooling method for semiconductor lasers includes the following steps:

[0016] Step 1: Install the semiconductor laser on top of the cooling box;

[0017] Step 2: When the semiconductor laser is working, the motor is started to make the coolant circulate in the pumping and draining cooling pipes;

[0018] Step 3: The fan blades draw in outside air into the cooling box, carrying the heat from the heat dissipation fins.

[0019] Compared with the prior art, the present invention provides a dual-channel cooling device and cooling method for semiconductor lasers, which has the following advantages:

[0020] 1. The dual-channel cooling device used in this semiconductor laser conducts heat generated by the laser to the carbon dioxide filling the temperature sensing chamber during operation. This causes the carbon dioxide gas to expand and push the sliding plate, which in turn causes the adjusting ring to slide along the outer wall of the electrode post. This allows the operating current of the motor to be adjusted according to the temperature generated by the semiconductor laser, thereby regulating the motor's output power. This results in different airflow speeds from the fan blades towards the heat sink fins, leading to varying degrees of cooling. This prevents the motor from operating at its rated output power for extended periods, which would reduce its lifespan, and also prevents insufficient motor output power from reducing the cooling efficiency of the semiconductor laser. Thus, this device effectively cools the semiconductor laser.

[0021] 2. The dual-channel cooling device used in this semiconductor laser, when the motor is working, will cause the rotating shaft to drive the fan blades to work, so that the fan blades draw in outside air through the first and second channels and act on the heat dissipation fins. The rotating shaft will also drive the turntable to rotate, causing the liquid extraction plate to rotate, drawing out the coolant and circulating it in the water cooling pipe and the drain cooling pipe. This achieves dual heat dissipation of the heat dissipation fins using a single driving source, thereby realizing dual heat dissipation of the semiconductor laser by water cooling and air cooling, improving the cooling efficiency of the semiconductor laser, and thus ensuring the service life of the semiconductor laser.

[0022] 3. The dual-channel cooling device used in this semiconductor laser will cause the cleaning rod to slide up and down along the outer surfaces of the first and second filter plates when the motor is working, effectively cleaning the first and second filter plates and ensuring air intake efficiency. At the same time, the motor will also drive the cleaning frame to slide cyclically along the outer surface of the heat sink fins to clean the heat sink fins and prevent dust from adhering to the heat sink fins, which would affect the rate of heat conduction by the heat sink fins, thereby further improving the cooling efficiency of the semiconductor laser.

[0023] The parts of this device not described herein are the same as or can be implemented using existing technologies. This invention can adjust the operating current of the motor according to the temperature generated when the semiconductor laser is working, thereby adjusting the output power of the motor. This results in different wind speeds blowing from the fan blades onto the heat sink fins, leading to different degrees of cooling of the heat sink fins. This prevents the motor from operating at its rated output power for extended periods, which would reduce the motor's lifespan, and also prevents insufficient motor output power from reducing the cooling efficiency of the semiconductor laser. This achieves good cooling of the semiconductor laser and realizes dual heat dissipation of the heat sink fins using a single drive source. This achieves dual cooling of the semiconductor laser using both water and air cooling, improving the cooling efficiency of the semiconductor laser and thus ensuring its lifespan. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of a dual-channel cooling device for semiconductor lasers proposed in this invention;

[0025] Figure 2 This is a three-dimensional partial cross-sectional structural diagram of a dual-channel cooling device for semiconductor lasers proposed in this invention;

[0026] Figure 3 This is a frontal cross-sectional view of a dual-channel cooling device for semiconductor lasers proposed in this invention.

[0027] Figure 4 This is a schematic diagram of the side-section of a dual-channel cooling device for semiconductor lasers proposed in this invention.

[0028] Figure 5 This invention proposes a dual-channel cooling device for semiconductor lasers. Figure 4 Enlarged structural diagram at point A in the middle;

[0029] Figure 6 This is a three-dimensional structural diagram of the cooling box of a dual-channel cooling device for semiconductor lasers proposed in this invention;

[0030] Figure 7This is a three-dimensional structural diagram of a cleaning rack for a dual-channel cooling device for semiconductor lasers proposed in this invention.

[0031] Figure 8 This is a three-dimensional structural diagram of the liquid extraction plate of a dual-channel cooling device for semiconductor lasers proposed in this invention;

[0032] Figure 9 This is a three-dimensional partial cross-sectional view of the temperature sensing box of a dual-channel cooling device for semiconductor lasers proposed in this invention;

[0033] Figure 10 This is a cross-sectional view of the cleaning frame of a dual-channel cooling device for semiconductor lasers proposed in this invention.

[0034] Figure 11 This invention proposes a dual-channel cooling device for semiconductor lasers. Figure 10 Enlarged structural diagram at point B;

[0035] Figure 12 This is a schematic diagram of the cross-sectional structure of the cleaning rod in the middle of a dual-channel cooling device for semiconductor lasers proposed in this invention;

[0036] Figure 13 This is a partial cross-sectional view of the middle side of a dual-channel cooling device for semiconductor lasers proposed in this invention.

[0037] Figure 14 This invention proposes a dual-channel cooling device for semiconductor lasers. Figure 13 Enlarged structural diagram at point C;

[0038] Figure 15 This invention proposes a dual-channel cooling device for semiconductor lasers. Figure 13 Enlarged structural diagram at point D;

[0039] Figure 16 This is a schematic diagram of the negative pressure port structure of a dual-channel cooling device for semiconductor lasers proposed in this invention;

[0040] Figure 17 This is a schematic diagram of the processing cavity structure of a dual-channel cooling device for semiconductor lasers proposed in this invention;

[0041] Figure 18 This invention proposes a dual-channel cooling device for semiconductor lasers. Figure 17 A partial structural diagram.

[0042] In the diagram: 1. Cooling box; 2. Semiconductor laser; 3. Heat sink fins; 4. Water-cooled box; 5. First channel; 6. First filter plate; 7. Second channel; 8. Second filter plate; 9. Motor; 10. Shaft; 11. Reciprocating screw; 12. Reciprocating frame; 13. Cleaning rod; 14. Fan blade; 15. Turntable; 16. Liquid extraction plate; 17. Liquid extraction tank; 18. Water extraction cooling pipe; 19. Water drainage cooling pipe; 20. Main bevel gear; 21. Driven bevel gear; 22. Rotating rod; 23. Cleaning frame; 24. Temperature sensing box; 25. Slide plate; 26. Return spring; 27. Adjusting ring; 28. Electrode post; 29. ​​Piston plate; 30. Air inlet; 31. Connecting groove; 32. Air blowing plate; 33. Air blowing hole; 34. Connecting pipe; 35. Air jet hole; 36. Magnetic plate; 37. First spring; 38. Connecting rope; 39. Second spring; 40. Striking block; 41. Piston cylinder; 42. Negative pressure port; 43. First negative pressure pipe; 44. Processing chamber; 45. Dust cover; 46. Air inlet; 47. Dust collection cover; 48. Funnel cover; 49. First external interface; 50. Second external interface; 51. Second negative pressure pipe; 52. Adjusting pipe; 53. Dust cover. Detailed Implementation

[0043] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0044] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Example

[0045] Reference Figures 1-4 , Figures 6-8 A dual-channel cooling device for a semiconductor laser includes a cooling box 1 and a semiconductor laser 2 mounted on top of the cooling box 1. It also includes: heat dissipation fins 3 fixedly connected to the top of the cooling box 1; a motor 9 fixedly connected to the bottom of the inner wall of the cooling box 1, with a rotating shaft 10 fixedly connected to the output end of the motor 9; a reciprocating wire 11 provided on the outer wall of the rotating shaft 10; a reciprocating frame 12 threadedly connected to the outer wall of the reciprocating wire 11; a cleaning rod 13 fixedly connected to the end of the reciprocating frame 12; a fan blade 14 fixedly connected to the outer wall of the rotating shaft 10; and a main bevel gear 20 fixedly connected to the top of the rotating shaft 10; and first channels 5 fixedly connected to both sides of the cooling box 1, with a first filter plate 6 fixedly connected to the inner wall of the first channel 5.

[0046] The second channel 7 is fixedly connected to the other two sides of the cooling box 1. The inner wall of the second channel 7 is fixedly connected to the second filter plate 8. The reciprocating frame 12 passes through the first filter plate 6 and the second filter plate 8 and is slidably connected to the first filter plate 6 and the second filter plate 8. The cleaning rod 13 is close to the first filter plate 6 and the second filter plate 8 on the side near the reciprocating frame 12 and slides against each other.

[0047] In use, the semiconductor laser 2 is installed on the top of the cooling box 1. When the semiconductor laser 2 is working, the heat generated by the semiconductor laser 2 will be conducted to the heat dissipation fins 3. When the semiconductor laser 2 is working, the motor 9 is started so that the motor 9 works at minimum power. The operation of the motor 9 will drive the rotating shaft 10 to rotate, which in turn drives the fan blades 14 and the reciprocating wire 11 to rotate. The fan blades 14 will draw in outside air through the first channel 5 and the second channel 7. The outside air entering the first channel 5 and the second channel 7 will be filtered by the first filter plate 6 and the second filter plate 8. The air entering the cooling box 1 will be discharged to the outside after passing through the heat dissipation fins 3, which will cool the heat dissipation fins 3. The rotation of the reciprocating wire 11 will drive the cleaning rod 13 to slide up and down along the outer surface of the first filter plate 6 and the second filter plate 8 through the reciprocating frame 12 to clean the filter plates.

[0048] This achieves air cooling of the semiconductor laser 2, preventing dust from clogging the first filter plate 6 and the second filter plate 8 and affecting the air intake efficiency, thereby ensuring the cooling efficiency of the semiconductor laser 2.

[0049] Reference Figure 2 , Figure 3 , Figure 5 , Figure 7 , Figure 8 It also includes: a water-cooled box 4 fixedly connected to the bottom of the inner wall of the cooling box 1; a water-cooling pipe 18 fixedly connected to the water-cooled box 4; a liquid extraction box 17 fixedly connected to the end of the water-cooling pipe 18 away from the water-cooled box 4; the liquid extraction box 17 is cylindrical and consists of a quarter-circle arc and a three-quarter-circle arc, with the radius of the quarter-circle arc being greater than the radius of the three-quarter-circle arc; a turntable 15 is rotatably connected to the inner wall of the liquid extraction box 17; the inner wall of the turntable 15 is fixedly connected to the outer wall of the rotating shaft 10; the turntable 15... A liquid extraction plate 16 is fixedly connected to the outer wall. The liquid extraction plate 16 is made of rubber. When the liquid extraction plate 16 passes through a large arc with a quarter radius, it will be squeezed by the liquid extraction box 17, squeezing the refrigerant in the liquid extraction box 17 into the drain cold pipe 19. The outer wall of the liquid extraction box 17 is fixedly connected to the drain cold pipe 19. The end of the drain cold pipe 19 away from the liquid extraction box 17 is fixedly connected to the water cooling box 4. The rotating shaft 10 passes through the liquid extraction box 17 and is rotatably connected to the liquid extraction box 17. The liquid extraction box 17 is fixedly connected to the inner wall of the cooling box 1.

[0050] When the rotating shaft 10 rotates, it will drive the turntable 15 to rotate, and the turntable 15 will drive the liquid extraction plate 16 to rotate. When the liquid extraction plate 16 passes through a large quarter-radius arc, it will be squeezed by the liquid extraction box 17, squeezing the refrigerant in the liquid extraction box 17 into the drain cooling pipe 19. When the liquid extraction plate 16 passes through the water cooling pipe 18, it will draw the refrigerant in the water cooling box 4 into the liquid extraction box 17. The refrigerant that enters the drain cooling pipe 19 will be discharged into the water cooling box 4, so that the refrigerant circulates and further cools the air entering the cooling box 1.

[0051] This achieves dual heat dissipation of the heat sink fins 3 using a single driving source, thereby realizing dual heat dissipation of the semiconductor laser 2 through water cooling and air cooling, improving the cooling efficiency of the semiconductor laser 2, and thus ensuring the service life of the semiconductor laser 2.

[0052] Reference Figure 2 , Figure 5 , Figure 7 , Figure 8 It also includes: a rotating rod 22 rotatably connected to the inner wall of the cooling box 1, a reciprocating screw 11 provided on the outer wall of the rotating rod 22, a driven bevel gear 21 fixedly connected to the outer wall of the rotating rod 22, the outer wall of the driven bevel gear 21 meshing with the outer wall of the main bevel gear 20, and a cleaning frame 23 connected to the outer wall of the rotating rod 22 by a thread, the cleaning frame 23 being in contact with the heat dissipation fins 3 and sliding against each other;

[0053] When the rotating shaft 10 rotates, it will drive the main bevel gear 20 to rotate, which in turn drives the driven bevel gear 21 to rotate, causing the rotating rod 22 to rotate. The rotating rod 22 will drive the cleaning frame 23 to slide along the outer surface of the heat dissipation fins 3 in a circular motion to clean the heat dissipation fins 3.

[0054] To prevent dust from adhering to the heat dissipation fins 3 and affecting the rate of heat conduction by the heat dissipation fins 3, thereby further improving the cooling efficiency of the semiconductor laser 2.

[0055] Reference Figure 2 , Figure 5 , Figures 7-9 It also includes: a temperature sensing box 24 fixedly connected to the middle position of the heat dissipation fins 3, a sliding plate 25 slidably connected to the inner side wall of the temperature sensing box 24, a return spring 26 fixedly connected to the top of the sliding plate 25, carbon dioxide gas filling the space in the temperature sensing box 24 where the return spring 26 is installed, the top of the return spring 26 being fixedly connected to the top of the inner side wall of the temperature sensing box 24, an adjusting ring 27 fixedly connected to the bottom of the sliding plate 25, an electrode post 28 slidably connected to the inner side wall of the adjusting ring 27, the bottom of the electrode post 28 being fixedly connected to the bottom of the inner side wall of the temperature sensing box 24, and the electrode post 28 and the adjusting ring 27 being electrically connected to the motor 9;

[0056] When the semiconductor laser 2 is working, the heat generated by the semiconductor laser 2 will be conducted to the carbon dioxide gas in the temperature sensing box 24. When the heat generated by the semiconductor laser 2 increases, the carbon dioxide gas expands due to heat, pushing the slide plate 25 to slide downward, which in turn causes the adjusting ring 27 to slide downward along the outer surface of the electrode post 28, thereby increasing the operating current of the motor 9, increasing the speed of the fan blade 14 and the flow rate of the coolant. When the heat generated by the semiconductor laser 2 decreases, the slide plate 25 will drive the adjusting ring 27 to slide upward along the outer surface of the electrode post 28 under the action of the return spring 26, thereby reducing the operating current of the motor 9, reducing the speed of the fan blade 14 and the flow rate of the coolant.

[0057] The system adjusts the operating current of the motor 9 based on the temperature generated during the operation of the semiconductor laser 2, thereby regulating the output power of the motor 9. This results in different air speeds from the fan blades 14 blowing onto the heat sink 3, leading to different degrees of cooling of the heat sink 3. This prevents the motor 9 from operating at its rated output power for extended periods, which would reduce its lifespan, and also prevents insufficient output power from reducing the cooling efficiency of the semiconductor laser 2. As a result, the system achieves good cooling of the semiconductor laser 2.

[0058] Reference Figures 1-9 A dual-channel cooling method for semiconductor lasers includes the following steps:

[0059] Step 1: Install the semiconductor laser 2 on top of the cooling box 1;

[0060] Step 2: When the semiconductor laser 2 is working, the motor 9 is started to make the coolant circulate in the water pumping pipe 18 and the drain pipe 19;

[0061] When the semiconductor laser 2 is working, the heat generated by the semiconductor laser 2 will be conducted to the carbon dioxide gas in the temperature sensing box 24. When the heat generated by the semiconductor laser 2 increases, the carbon dioxide gas expands due to heat, pushing the slide plate 25 to slide downward, which in turn causes the adjusting ring 27 to slide downward along the outer surface of the electrode post 28, thereby increasing the operating current of the motor 9, increasing the speed of the fan blade 14 and the flow rate of the coolant. When the heat generated by the semiconductor laser 2 decreases, the slide plate 25 will drive the adjusting ring 27 to slide upward along the outer surface of the electrode post 28 under the action of the return spring 26, thereby reducing the operating current of the motor 9, reducing the speed of the fan blade 14 and the flow rate of the coolant.

[0062] The operating current of the motor 9 is adjusted according to the temperature generated when the semiconductor laser 2 is working, thereby adjusting the output power of the motor 9. This results in different wind speeds of the fan blades 14 blowing onto the heat sink 3, leading to different degrees of cooling of the heat sink 3. This prevents the motor 9 from being used at its rated output power for a long time, which would reduce the service life of the motor 9. It also prevents insufficient output power of the motor 9 from reducing the cooling efficiency of the semiconductor laser 2, thus achieving good cooling of the semiconductor laser 2.

[0063] When the semiconductor laser 2 is working, the heat generated by the semiconductor laser 2 will be conducted to the heat sink fins 3. When the semiconductor laser 2 is working, the motor 9 will be started so that the motor 9 works at minimum power. The operation of the motor 9 will drive the rotating shaft 10 to rotate, which in turn drives the fan blades 14 and the reciprocating wire 11 to rotate.

[0064] When the rotating shaft 10 rotates, it will drive the turntable 15 to rotate, and the turntable 15 will drive the liquid extraction plate 16 to rotate. When the liquid extraction plate 16 passes through a large quarter-radius arc, it will be squeezed by the liquid extraction box 17, squeezing the refrigerant in the liquid extraction box 17 into the drain cooling pipe 19. When the liquid extraction plate 16 passes through the water cooling pipe 18, it will draw the refrigerant in the water cooling box 4 into the liquid extraction box 17. The refrigerant that enters the drain cooling pipe 19 will be discharged into the water cooling box 4, so that the refrigerant circulates and further cools the air entering the cooling box 1.

[0065] When the rotating shaft 10 rotates, it will drive the main bevel gear 20 to rotate, which in turn drives the driven bevel gear 21 to rotate, causing the rotating rod 22 to rotate. The rotating rod 22 will drive the cleaning frame 23 to slide along the outer surface of the heat dissipation fins 3 in a circular motion to clean the heat dissipation fins 3.

[0066] Step 3: The fan blades 14 draw in outside air into the cooling box 1, carrying the heat from the heat dissipation fins 3.

[0067] The fan blade 14 will draw in outside air through the first channel 5 and the second channel 7. The outside air entering the first channel 5 and the second channel 7 will be filtered by the first filter plate 6 and the second filter plate 8. The air entering the cooling box 1 will pass through the heat dissipation fins 3 and then be discharged to the outside, cooling the heat dissipation fins 3. The rotation of the reciprocating wire 11 will drive the cleaning rod 13 to slide up and down along the outer surface of the first filter plate 6 and the second filter plate 8 through the reciprocating frame 12, cleaning the filter plates. Example

[0068] Reference Figure 3 , Figure 4 , Figures 10-15A dual-channel cooling device for semiconductor lasers further includes: a piston cylinder 41 fixedly connected to the bottom of the inner wall of a cooling box 1; a piston plate 29 slidably connected to the inner wall of the piston cylinder 41; the piston plate 29 fixedly connected to the bottom of a reciprocating frame 12; an air inlet 30 provided on the outer wall of the piston cylinder 41; a one-way valve provided in the air inlet 30, allowing outside air to enter the piston cylinder 41 only through the air inlet 30; a connecting groove 31 provided in the middle of the piston plate 29; a one-way valve provided in the connecting groove 31, allowing air in the piston cylinder 41 to be discharged only through the connecting groove 31; the connecting groove 31 is located inside the reciprocating frame 12 and communicates with a blowing plate 32; the blowing plate 32 is fixedly connected to the outer wall of the reciprocating frame 12; and a blowing groove is provided on the side of the blowing plate 32 near the first filter plate 6. A connecting pipe 34 is fixedly connected to the top of the reciprocating frame 12. The connecting pipe 34 is connected to the connecting groove 31. The end of the connecting pipe 34 away from the reciprocating frame 12 is fixedly connected to the outer wall of the cleaning frame 23. The connecting pipe 34 is in the form of a flexible hose. An air vent 35 is opened at the part of the cleaning frame 23 that is in contact with the heat dissipation fins 3. The air vent 35 is connected to the connecting pipe 34. A magnetic plate 36 is slidably connected inside the side wall of the cooling box 1. The magnetic plate 36 is attracted to the side wall of the cleaning frame 23. A first spring 37 and a connecting rope 38 are fixedly connected to the side of the magnetic plate 36 away from the cleaning frame 23. A striking block 40 is fixedly connected to the end of the connecting rope 38 away from the magnetic plate 36. A second spring 39 is fixedly connected to the top of the striking block 40. The outer wall of the striking block 40 is slidably connected to the inside of the side wall of the cooling box 1.

[0069] The up-and-down movement of the reciprocating frame 12 will cause the piston plate 29 to slide up and down along the inner wall of the piston cylinder 41. When the piston plate 29 slides upward along the inner wall of the piston cylinder 41, it will draw outside air into the piston cylinder 41 through the air inlet 30. When the piston plate 29 slides downward, it will cause the air in the piston cylinder 41 to enter the connecting groove 31. Part of the air will enter the blowing plate 32 and be blown towards the first filter plate 6 and the second filter plate 8 through the blowing hole 33 to clear the filter holes of the first filter plate 6 and the second filter plate 8 and clean the cleaning rod 13. The other part of the air will enter the cleaning frame 23 through the connecting pipe 34 and then be sprayed towards the heat dissipation fins 3 through the jet hole 35 to improve the cleaning efficiency of the heat dissipation fins 3, prevent dust from adhering to the cleaning frame 23 and the heat dissipation fins 3, which would reduce the heat dissipation efficiency of the heat dissipation fins 3, and improve the heat dissipation efficiency of the heat dissipation fins 3, thereby improving the cooling quality and cooling efficiency of the semiconductor laser 2.

[0070] When the cleaning frame 23 slides outward, it attracts the magnetic plate 36 to slide towards one side of the cleaning frame 23, which in turn pulls the striking block 40 upward through the connecting rope 38. When the cleaning frame 23 slides inward, it causes the magnetic plate 36 to move along with the cleaning frame 23. When the elastic force of the first spring 37 is greater than the magnetic attraction between the magnetic plate 36 and the cleaning frame 23, the magnetic plate 36 will slide inward under the action of the first spring 37, causing the connecting rope 38 to loosen. At this time, the striking block 40 will suddenly move downward under the action of the second spring 39, striking the reciprocating frame 12 and causing the reciprocating frame 12 to vibrate. This, in turn, causes the cleaning rod 13, the first filter plate 6, and the second filter plate 8 to shake, further shaking off the dust on the cleaning rod 13, the first filter plate 6, and the second filter plate 8, ensuring the air intake efficiency and the cleanliness of the air, thereby improving the cooling efficiency of the semiconductor laser 2.

[0071] like Figures 16-18 The inner wall of the cooling box 1 is fixedly connected to a processing chamber 44 and a dust collection hood 47. The processing chamber 44 is equipped with 4-8 dust baffles 45. The dust baffles 45 are funnel-shaped and have an air inlet 46 at the small end. The dust collection hood 47 is located at the bottom of the processing chamber 44. The bottom between every two dust baffles 45 and the bottom between the dust baffles 45 and the inner wall of the processing chamber 44 are all connected to the top of the dust collection hood 47 through a funnel cover 48.

[0072] The cleaning rod 13 is provided with a negative pressure port 42 on the side near the side wall of the cooling box 1. The negative pressure port 42 and one end of the processing chamber 44 are provided with a first negative pressure pipe 43. The end of the processing chamber 44 away from the first negative pressure pipe 43 is connected to the air inlet 30 through a second negative pressure pipe 51.

[0073] The small end of the dust cover 45 faces the first negative pressure pipe 43.

[0074] When air is introduced, the air inlet 30 generates negative pressure at the negative pressure port 42 through the second negative pressure pipe 51 and the first negative pressure pipe 43, which sucks up the dust from the first filter plate 6 and the second filter plate 8. This works in conjunction with the cleaning rod 13 to improve the dust removal efficiency.

[0075] Dust enters the processing chamber 44 through the first negative pressure pipe 43. After being filtered layer by layer by the dust cover 45, some dust is adsorbed on the side wall of the dust cover 45, and some enters the dust collection cover 47 through the funnel cover 48, ensuring that the dust in the piston cylinder 41 is reduced as much as possible.

[0076] An adjusting pipe 52 is connected between the second negative pressure pipe 51 and the top of the dust collection hood 47. A dust baffle 53 is provided at the connection between the adjusting pipe 52 and the dust collection hood 47. The dust baffle 53 is located inside the dust collection hood 47.

[0077] The design of the regulating pipe 52 ensures that it is connected in parallel with the processing chamber 44, effectively preventing the dust cover 45 from becoming clogged and unable to work. Even if several sections of the regulating pipe 52 become clogged, emergency operation can still be ensured, followed by immediate maintenance by workers. Furthermore, during operation, the piston cylinder 41 generates negative pressure in the dust collection hood 47 via the regulating pipe 52, accelerating the entry of dust into the dust collection hood 47. Simultaneously, the dust baffle 53 effectively prevents dust from entering the regulating pipe 52.

[0078] A first external interface 49 is provided at the top between each pair of dust covers 45, and at the top between the dust cover 45 and the inner wall of the processing chamber 44. A second external interface 50 is provided at the bottom of the dust collection cover 47. Valves are provided on both the first external interface 49 and the second external interface 50.

[0079] When a large amount of dust accumulates on the inner wall of the dust cover 45 and inside the dust collection cover 47 after prolonged use, the second external interface 50 is connected to an external suction pump, and the first external interface 49 is opened in sequence, one or two at a time. The suction pump connected to the second external interface 50 sucks away all the dust inside, achieving the purpose of cleaning.

[0080] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A dual-channel cooling device for a semiconductor laser, comprising a cooling chamber (1) and a semiconductor laser (2) mounted on top of the cooling chamber (1), characterized in that, Also includes: The heat dissipation fins (3) on the top of the cooling box (1) are fixedly connected; A motor (9) is fixedly connected to the bottom of the inner wall of the cooling box (1). The output end of the motor (9) is fixedly connected to a rotating shaft (10). A reciprocating screw (11) is provided on the outer wall of the rotating shaft (10). A fan blade (14) is fixedly connected to the outer wall of the rotating shaft (10). A main bevel gear (20) is fixedly connected to the top of the rotating shaft (10). The first channel (5) is fixedly connected to both sides of the cooling box (1), and the inner sidewall of the first channel (5) is fixedly connected to the first filter plate (6). A second channel (7) is fixedly connected to the other two sides of the cooling box (1), and a second filter plate (8) is fixedly connected to the inner side wall of the second channel (7). It also includes: a water-cooled box (4) fixedly connected to the bottom of the inner wall of the cooling box (1), a water-cooling pipe (18) fixedly connected to the water-cooled box (4), a liquid-drawing box (17) fixedly connected to the end of the water-cooling pipe (18) away from the water-cooled box (4), a turntable (15) rotatably connected to the inner wall of the liquid-drawing box (17), a liquid-drawing plate (16) fixedly connected to the outer wall of the turntable (15), and a drain pipe (19) fixedly connected to the outer wall of the liquid-drawing box (17); the liquid-drawing box (17) is cylindrical and is composed of a quarter-circle arc and a three-quarter-circle arc, and the radius of the quarter-circle arc is greater than the radius of the three-quarter-circle arc; the liquid-drawing plate (16) is made of rubber; a rotating rod (22) rotatably connected to the inner wall of the cooling box (1), a bevel gear (21) fixedly connected to the outer wall of the rotating rod (22), and a cleaning device connected to the outer wall of the rotating rod (22) by a thread. The reciprocating wire (11) has a reciprocating frame (12) connected to its outer side wall by a thread, and a cleaning rod (13) is fixedly connected to the end of the reciprocating frame (12); the inner side wall of the turntable (15) is fixedly connected to the outer side wall of the rotating shaft (10); the end of the drain cooling pipe (19) away from the liquid extraction tank (17) is fixedly connected to the water cooling tank (4); the rotating shaft (10) passes through the liquid extraction tank (17) and is rotatably connected to the liquid extraction tank (17). The outer wall of the bevel gear (21) meshes with the outer wall of the main bevel gear (20); the cleaning frame (23) is in contact with the heat dissipation fins (3) and slides against each other; the reciprocating frame (12) passes through the first filter plate (6) and the second filter plate (8) and is slidably connected with the first filter plate (6) and the second filter plate (8); the cleaning rod (13) is in contact with the first filter plate (6) and the second filter plate (8) on the side near the reciprocating frame (12) and slides against each other;A piston cylinder (41) is fixedly connected to the bottom of the inner wall of the cooling box (1). A piston plate (29) is slidably connected to the inner wall of the piston cylinder (41). The piston plate (29) is fixedly connected to the bottom of the reciprocating frame (12). An air inlet (30) is provided on the outer wall of the piston cylinder (41). A one-way valve is provided in the air inlet (30) so that outside air can only enter the piston cylinder (41) through the air inlet (30). A connecting groove (31) is provided in the middle of the piston plate (29). A one-way valve is provided in the connecting groove (31) so that the air in the piston cylinder (41) can only be discharged through the connecting groove (31). The connecting groove (31) is opened inside the reciprocating frame (12) and is connected to the air blowing plate (32). An air blowing plate (32) is fixedly connected to the outer wall of the reciprocating frame (12). An air blowing hole (33) is provided on the side of the air blowing plate (32) near the first filter plate (6). The top of the reciprocating frame (12) is fixedly connected to the air blowing plate (32). A connecting pipe (34) is fixedly connected to the connecting groove (31). The end of the connecting pipe (34) away from the reciprocating frame (12) is fixedly connected to the outer wall of the cleaning frame (23). The connecting pipe (34) is set as a flexible hose. An air jet hole (35) is opened at the part of the cleaning frame (23) that is in contact with the heat dissipation fins (3). The air jet hole (35) is connected to the connecting pipe (34). A magnetic plate (36) is slidably connected inside the side wall of the cooling box (1). The magnetic plate (36) is attracted to the side wall of the cleaning frame (23). A first spring (37) and a connecting rope (38) are fixedly connected to the side of the magnetic plate (36) away from the cleaning frame (23). A striking block (40) is fixedly connected to the end of the connecting rope (38) away from the magnetic plate (36). A second spring (39) is fixedly connected to the top of the striking block (40). The outer wall of the striking block (40) is slidably connected to the inside of the side wall of the cooling box (1). It also includes: a temperature sensing box (24) fixedly connected to the middle position of the heat dissipation fins (3), a sliding plate (25) slidably connected to the inner wall of the temperature sensing box (24), a return spring (26) fixedly connected to the top of the sliding plate (25), an adjusting ring (27) fixedly connected to the bottom of the sliding plate (25), and an electrode post (28) slidably connected to the inner wall of the adjusting ring (27); the top of the return spring (26) is fixedly connected to the top of the inner wall of the temperature sensing box (24), the bottom of the electrode post (28) is fixedly connected to the bottom of the inner wall of the temperature sensing box (24), the space in the temperature sensing box (24) where the return spring (26) is installed is filled with carbon dioxide gas, and the electrode post (28) and the adjusting ring (27) are electrically connected to the motor (9).

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