Thermal expansion self-adjusting ceramic assembly and radio frequency resonator
By designing thermal expansion self-regulating ceramic components, using a ceramic cylinder, metal ring and ceramic seal ring structure, combined with the use of high-temperature brazing solder and thermal strips, the problem of easy damage to ceramic cups and difficulty in thermal management is solved, efficient vacuum sealing and heat export are achieved, and the service life of the equipment is extended.
Patent Information
- Application Number
- CN202510233901.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2025-04-15
AI Technical Summary
Existing ceramic cups are prone to damage in high-energy ion implantation machines, resulting in abnormal vacuum degree of the vacuum system, which in turn causes the machine to go down and it is difficult to effectively manage and cool.
A thermal expansion self-regulating ceramic assembly is designed, using a ceramic cylinder, metal ring and ceramic seal ring structure. Through the use of high-temperature brazing solder and thermal conduction strips, vacuum sealing and heat export are achieved, ensuring that the ceramic can stretch and shrink slightly and effectively conduct heat.
It improves the mechanical strength and vacuum sealing performance of ceramic components, reduces thermal resistance, realizes effective thermal management, extends the service life of the equipment and improves production efficiency.
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Figure CN119835856A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and more specifically, to a thermal expansion self-adjusting ceramic component and a radio frequency resonator. Background Art
[0002] In the semiconductor device manufacturing process, an important process is to add impurities to the crystal lattice of the semiconductor wafer by injecting ions into the semiconductor wafer in a vacuum, thereby changing its conductivity. The device used in this process is called an ion implanter, which ionizes the impurity atoms usually used for semiconductors into ions, accelerates them, and implants them into the semiconductor wafer.
[0003] With the high integration of semiconductor components, a high-energy ion implantation device is needed to penetrate deeper into the semiconductor wafer. This device is called a high-energy ion implanter, which is a method of using a serial electrostatic accelerator to form an ion beam acceleration system. The complexity of the electrostatic acceleration method increases with the increase of voltage. The increase of insulation distance will greatly increase the physical size of the equipment, and the electrostatic acceleration voltage is generally less than 1MV. For special high-energy implantation processes that require MeV energy, the electrostatic acceleration method cannot meet the needs ideally. The linear accelerator scheme using the radio frequency acceleration principle can accelerate ions to above MeV energy. At present, the models of this scheme are gradually being widely adopted. The ions generated by the ion source are extracted by the extraction voltage (generally positive ions), and then the required ions are screened out by the mass analyzer. Enter the radio frequency acceleration system to accelerate as many ion beams as possible to the required energy. The required energy is then screened out by the energy analyzer, and then scanned and parallelized and injected into the wafer in the target chamber.
[0004] In a radio frequency high energy ion implanter, the radio frequency acceleration system includes multiple radio frequency acceleration units (referred to as radio frequency barrels), such as Figure 1 As shown in the figure, 80 is the integrated alumina ceramic cup, and its general shape has been used until now. In the RF acceleration unit, the most vulnerable key part is the 80 ceramic cup. Since more than ten RF acceleration units are often set up in a high-energy ion implanter to work simultaneously, if one ceramic cup fails (leakage), the vacuum degree of the entire vacuum system will be abnormal, which will lead to machine downtime. Repairing this fault is often time-consuming. The simplest way is to replace the spare barrel, and the whole process takes more than half a day.
[0005] Existing ceramic cups mostly have the following defects:
[0006] The ceramic cup not only acts as an insulator to send a high-peak RF voltage into the vacuum, but also the ceramic cup itself and the sealing rubber ring between the ceramic cup and the metal are exposed to the irradiation of high-power RF power. It is difficult to maintain a constant temperature inside the RF acceleration unit. Although the internal main road has a cooling design, the heat loss generated by the ceramic cup under high-power RF cannot be directly cooled by air or water. When the machine is started and stopped and the recipe is switched, the different materials in the RF acceleration unit expand and contract when the temperature inside alternates between hot and cold, which constantly tests the rubber ring pressure-sealed vacuum sealing structure.
[0007] When the beam passes through the vacuum side, the edge of the beam hits materials such as graphite and causes sputtering, which gradually causes the inside of the ceramic cup to turn yellow and black. When it accumulates to a certain level, it will affect the insulation performance of the ceramic and even increase the RF loss tangent. Summary of the invention
[0008] In view of the deficiencies in the prior art, the present invention innovatively provides a thermal expansion self-adjusting ceramic component and a radio frequency resonator, which can solve the above-mentioned technical problems existing in the prior art.
[0009] To achieve the above technical objectives, the first aspect of the present invention discloses a thermal expansion self-adjusting ceramic component, which is used for a radio frequency resonator for ion beam acceleration, comprising: a ceramic cylinder, a first metal ring, a second metal ring, a first ceramic sealing ring and a second ceramic sealing ring.
[0010] The first ceramic sealing ring and the second ceramic sealing ring are connected to two ends of the ceramic tube respectively, the first metal ring is connected to the first ceramic sealing ring, and the second ceramic sealing ring is connected to the second metal ring.
[0011] Furthermore, the cross-sections of the first ceramic sealing ring and the second ceramic sealing ring are both L-shaped, including a first connecting edge and a second connecting edge that are perpendicular to each other.
[0012] The second connecting edge is used to connect to the end surface of the ceramic tube, and the first connecting edge is used to connect to the first metal ring or the second metal ring.
[0013] Furthermore, the first ceramic sealing ring and the second ceramic sealing ring are both metal stamping parts with a thickness of 0.5 mm-1.2 mm.
[0014] Furthermore, the end of the ceramic tube is metallized and then welded to the first connecting edge by brazing.
[0015] Furthermore, a connecting protrusion is formed on each of the first metal ring and the second metal ring, and a radial outer side wall of the connecting protrusion is used to be connected to the first connecting edge.
[0016] Furthermore, a welding groove is formed on the outer wall of the connecting protruding ring along its circumferential extension, and the welding groove is used to accommodate a solder wire. The first connecting edge is sleeved on the outside of the connecting protruding ring and covers the welding groove, and the first connecting edge is welded to the connecting protruding ring through the solder wire.
[0017] Furthermore, a heat-conducting convex ring is formed on the axial end surface of the connecting convex ring, and the heat-conducting convex ring abuts against the second connecting edge.
[0018] An annular groove is formed between the heat-conducting convex ring and the connecting convex ring.
[0019] Furthermore, the ceramic cylinder is a conical cylinder or a cylindrical cylinder.
[0020] Furthermore, the thermal expansion self-adjusting ceramic component further comprises a heat conducting strip, an end of which is connected to at least one of the first metal ring and the second metal ring, and the heat conducting strip is in contact with the outer side wall of the ceramic cylinder.
[0021] The second aspect of the present invention discloses a radio frequency resonator, comprising the above-mentioned thermal expansion self-adjusting ceramic component, wherein the first metal ring is connected to the high voltage electrode, the second metal ring is connected to the ground electrode,
[0022] A first vacuum sealing ring is arranged between the first metal ring and the high voltage electrode, and a second vacuum sealing ring is arranged between the second metal ring and the ground electrode.
[0023] The beneficial effects of the present invention are:
[0024] The ceramic tube of the present invention is in contact with the ceramic sealing ring, and high-temperature brazing solder has been used to ensure vacuum sealing, and the elastic ceramic sealing ring ensures that the ceramic can slightly expand and contract. When in use, the vacuum sealing is achieved by sealing the metal rings at both ends with rubber rings and the assembly parts. The rubber rings are protected by the metal rings, and no thermal resistance is formed around them, and they will not be directly exposed to high-power radio frequency, and the vacuum sealing function is completed without interference. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 A cross-sectional schematic diagram of a prior art radio frequency resonator is shown;
[0026] Figure 2 A schematic diagram showing the structure of a thermal expansion self-adjusting ceramic component according to an embodiment of the present invention;
[0027] Figure 3 A partial cross-sectional schematic diagram of an embodiment of the present invention is shown;
[0028] Figure 4 A schematic diagram showing the assembly state of a thermal expansion self-adjusting ceramic component, a high voltage electrode and a ground electrode according to an embodiment of the present invention;
[0029] Figure 5 Show Figure 4 A schematic cross-sectional view of the structure of the embodiment;
[0030] Figure 6 A schematic diagram showing the assembly state of a thermal expansion self-adjusting ceramic component, a high voltage electrode and a ground electrode according to an embodiment of the present invention;
[0031] Figure 7 Show Figure 6 Schematic cross-sectional view of the structure of the embodiment.
[0032] In the figure,
[0033] 10. Thermal expansion self-adjusting ceramic component; 101. Ceramic tube; 102. First metal ring; 103. Second metal ring; 1031. Connecting convex ring; 1032. Welding groove; 1033. Heat-conducting convex ring; 1034. Annular groove; 104. First ceramic sealing ring; 105. Second ceramic sealing ring; 1051. First connecting edge; 1052. Second connecting edge; 106. Heat-conducting strip; 20. High-voltage electrode; 30. Ground electrode; 40. First vacuum sealing ring; 50. Second vacuum sealing ring. DETAILED DESCRIPTION
[0034] The thermal expansion self-adjusting ceramic component and the radio frequency resonator provided by the present invention are explained and illustrated in detail below in conjunction with the drawings in the specification.
[0035] The traditional integrated ceramic cup end face and metal parts match. The ceramic cup is in direct contact with the metal parts and directly participates in the rubber ring to seal the vacuum. The ceramic cup end face must be subjected to strong mechanical pressure, otherwise it cannot be enough to squeeze the rubber ring to seal the vacuum. A part of the ceramic cup end face is in direct contact with the rubber ring, and electromagnetic waves can penetrate the ceramic material. The thermal conductivity of the alumina ceramic cup itself is poor, and at least one side of the rubber ring is not thermally conductive. When the tangent of the ceramic radio frequency loss is large, there is even a constant flow of heat from the ceramic to the rubber ring. Such a vacuum seal is worrying. Achieving a product shelf life of years requires extremely high structural processing, assembly level and material quality. There is a water cooling channel inside the metal part. The ceramic mainly guides the heat through the contact surface with the metal part, and at the same time generates a temperature gradient itself. If the ceramic cup does not rise in temperature under the action of high-power radio frequency, it will be fine. Once the temperature rise occurs, there will inevitably be a mismatch in linear expansion rate, relative friction between the metal parts and the ceramic, and thermal resistance will also be formed at the contact position between the ceramic cup and the rubber ring. The ceramic cup itself has no way to be ventilated or water-cooled. Because the inside of the ceramic cup is a vacuum, no flowing wind can be generated; the outside is SF6 with positive pressure (to prevent sparks between the electrodes inside the RF acceleration unit), and it is also very difficult to generate fast-flowing wind inside the closed RF acceleration unit. Even if it can be generated, it will have a great impact on the RF performance; if water flows inside the ceramic wall, the RF power can penetrate the ceramic, and the water will produce a strong attenuation of the RF, which in turn seriously affects the performance of the RF acceleration unit.
[0036] The ceramic tube of the present invention is in contact with the ceramic sealing ring, and a high temperature brazing solder (such as silver copper 72 solder, melting point 779°C) has been used to ensure vacuum sealing, and the elastic ceramic sealing ring ensures that the ceramic can slightly expand and contract. When in use, the vacuum seal is sealed by the metal rings at both ends and the assembly parts with rubber rings. The rubber rings are protected by the metal rings, and no thermal resistance is formed around them, nor will they face high-power radio frequency (because radio frequency cannot penetrate metal), and the vacuum sealing function is completed without interference.
[0037] The present invention is described in detail below in conjunction with specific embodiments:
[0038] In some embodiments, Figure 2As shown, the present invention provides a thermal expansion self-adjusting ceramic component 10, which is used for a radio frequency resonator for ion beam acceleration. It includes: a ceramic tube 101, a first metal ring 102, a second metal ring 103, a first ceramic sealing ring 104 and a second ceramic sealing ring 105, wherein the first ceramic sealing ring 104 and the second ceramic sealing ring 105 are respectively connected to the two ends of the ceramic tube 101, the first metal ring 102 is connected to the first ceramic sealing ring 104, and the second ceramic sealing ring 105 is connected to the second metal ring 103. The sizes of the first ceramic sealing ring 104 and the second ceramic sealing ring 105 are determined according to the sizes of the two ends of the ceramic tube 101, the size of the first metal ring 102 is adapted to the size of the first ceramic sealing ring 104, and the size of the second metal ring 103 is adapted to the size of the second ceramic sealing ring 105. Optionally, the ceramic tube 101 is cylindrical, that is, the sizes of the two ends are the same, or the ceramic tube 101 is a conical barrel, that is, the diameter of the first end is smaller than the diameter of the second end, and the specific structure of the ceramic tube 101 can be determined according to the actual use scenario.
[0039] Alternatively, if Figure 3 As shown, the first ceramic sealing ring 104 and the second ceramic sealing ring 105 have the same structure, and both have L-shaped cross-sections. Optionally, the first ceramic sealing ring 104 and the second ceramic sealing ring 105 are both made of kovar alloy materials, such as copper-nickel alloys such as 4J33 and 4J34. The structure of the second ceramic sealing ring 105 is introduced below by taking the second ceramic sealing ring 105 as an example, including a first connecting edge 1051 and a second connecting edge 1052 perpendicular to each other, wherein the second connecting edge 1052 is used to connect to the end face of the ceramic tube 101, and the first connecting edge 1051 is used to connect to the first metal ring 102 or the second metal ring 103. In this embodiment, the second ceramic sealing ring 105 is an integrated stamping structure, and the second ceramic sealing ring 105 is a metal structure with a thickness of 0.5mm-1.2mm, which has a certain elasticity, so that it can achieve a relatively ideal connection function under the premise of ensuring mechanical strength, which is very suitable for such a scene with high frequency and large amplitude of temperature changes.
[0040] In some embodiments, the ceramic tube 101 is an alumina ceramic one-piece molded structure. Since there are no folded edges, countersunk holes or other structures at its two ends, the precision requirements in the molding process are greatly reduced, processing is more convenient, and the cost can be greatly reduced. It also effectively solves the problem of residual complex stress in the traditional integrated ceramic tube 101.
[0041] The end of the ceramic tube 101 is metallized to form a metallized layer, which is then welded to the second connection edge 1052 via a brazing solder sheet. During the brazing process, the brazing solder (solder) melts and flows into the joint, and solidifies after cooling, forming a tight connection between metals and between metal and ceramic.
[0042] In some embodiments, a connecting protrusion 1031 is formed on both the first metal ring 102 and the second metal ring 103, and the radial outer side wall of the connecting protrusion 1031 is used to connect with the first connecting edge 1051. The structure of the second metal ring 103 is described below by taking the second metal ring 103 as an example:
[0043] like Figure 3 As shown, a connecting protruding ring 1031 is formed on the second metal ring 103, and a welding groove 1032 is formed on the outer wall of the connecting protruding ring 1031 along its circumferential direction. The welding groove 1032 constitutes a circular groove, and the welding groove 1032 is used to accommodate the solder wire. When welding, the solder wire is embedded in the welding groove 1032, and the first connecting edge 1051 is sleeved on the outside of the connecting protruding ring 1031 and covers the welding groove 1032. After the solder wire melts and cools, the first connecting edge 1051 is welded to the connecting protruding ring 1031.
[0044] The second ceramic sealing ring 105 is connected to the second metal ring 103 and the ceramic tube 101 by brazing, which can ensure the reliability of the connection and ensure that the connection position meets the vacuum sealing standard.
[0045] Optionally, a heat-conducting protruding ring 1033 is formed on the axial end face of the connecting protruding ring 1031, and the heat-conducting protruding ring 1033 abuts against the second connecting edge 1052. An annular groove 1034 is formed between the heat-conducting protruding ring 1033 and the connecting protruding ring 1031, so that the cross section of the heat-conducting protruding ring 1033 forms an L-shaped structure. Optionally, the heat-conducting protruding ring 1033 and the second metal ring 103 are integrally formed and both are made of oxygen-free copper. Further, the thickness of the heat-conducting protruding ring 1033 is 0.5mm-1.2mm. The heat conduction can be increased by supporting the second connecting edge 1052 by the heat-conducting protruding ring 1033, because the thermal conductivity of oxygen-free copper is higher than that of the second ceramic sealing ring 105 made of Kovar alloy, so as to minimize the thermal resistance on the heat transfer channel without losing the elasticity of the second ceramic sealing ring 105.
[0046] In some embodiments, Figure 6 , Figure 7As shown, the thermal expansion self-adjusting ceramic component 10 also includes a heat-conducting strip 106. Optionally, the heat-conducting strip 106 is made of aluminum nitride. The end of the heat-conducting strip 106 is connected to at least one of the first metal ring 102 and the second metal ring 103. The heat-conducting strip 106 contacts the outer wall of the ceramic tube 101. The heat-conducting strip 106 does not affect the electrical performance, nor does it participate in the vacuum seal, but provides a good channel for heat, so that the heat of the ceramic tube 101 can be exported to the first metal ring 102 and / or the second metal ring 103. Optionally, a slot is formed on the first metal ring 102 and the second metal ring 103, and the two ends of the heat-conducting strip 106 are respectively inserted into the slots on the first metal ring 102 and the second metal ring 103 and fixedly connected. The heat-conducting strip 106 is at least partially in contact with the outer peripheral wall of the ceramic tube 101. Preferably, the heat-conducting strip 106 is attached to the outer peripheral wall of the ceramic ring. The heat of the ceramic cylinder 101 is transferred to the first metal ring 102 and the second metal ring 103 through the heat conducting strip 106, which effectively suppresses the temperature rise of the ceramic cylinder 101. Optionally, a plurality of heat conducting strips 106 can be provided along the circumference of the ceramic cylinder 101.
[0047] In some embodiments, one of the heat-conducting strip 106 and the heat-conducting convex ring 1033 can be selected to conduct heat to the ceramic tube 101. For example, when the ceramic tube 101 is conical, the heat-conducting convex ring 1033 structure is selected, and when the ceramic tube 101 is cylindrical, the heat-conducting strip 106 structure is selected. Optionally, under the premise that the structure allows, both the heat-conducting convex ring 1033 and the heat-conducting strip 106 can be provided to further improve the heat conduction effect.
[0048] In some implementations, the present invention further provides a radio frequency resonator (eg Figure 1 ) key components, such as Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown, the thermal expansion self-adjusting ceramic component 10 is included, the first metal ring 102 is connected to the high voltage electrode 20, and the second metal ring 103 is connected to the ground electrode 30. A first vacuum seal ring 40 is provided between the first metal ring 102 and the high voltage electrode 20, and a second vacuum seal ring 50 is provided between the second metal ring 103 and the ground electrode 30. The first vacuum seal ring 40 and the second vacuum seal ring 50 are shielded by the first metal ring 102 and the second metal ring 103, respectively, to shield the external radio frequency, and there is no thermal resistance around the rubber ring, and it will not face high-power radio frequency directly (because radio frequency cannot penetrate metal), and the vacuum sealing function can be completed without interference.
[0049] In this embodiment, if Figure 4 , Figure 5As shown, the ceramic tube 101 is only in contact with the first ceramic sealing ring 104 and the second ceramic sealing ring 105. The high-temperature brazing solder (such as silver-copper 72 solder, melting point 779°C) has been used to ensure the vacuum seal of the connection, and the elastic ceramic sealing ring ensures that the ceramic can slightly expand and contract. Ceramics may also produce temperature rise, but all thermal expansion self-adjusting ceramic components 10 that are welded to be leak-proof have themselves experienced the test of high temperatures exceeding 700°C. The high melting point of the brazing solder is not afraid of temperatures within a few hundred degrees Celsius. The expansion and contraction of the ceramic has been elastically absorbed by the ceramic sealing ring, but in order to minimize the temperature rise, the thermal conductivity of the surrounding area must be increased. For example, the thermal conductive convex ring 1033 is fully in contact with the ceramic sealing ring on the ceramic end face, increasing the heat transfer capacity without losing the elasticity of the ceramic sealing ring, so that ordinary alumina can also be competent for this working scene, and no special alumina material is required.
[0050] Or, if Figure 6 , Figure 7 As shown, by providing the heat conducting strip 106, the heat conducting strip 106 made of aluminum nitride does not affect the electrical performance, nor does it participate in the vacuum seal, but provides a good heat channel. In addition, due to the provision of the first metal ring 102 and the second metal ring 103, the two ends of the thermal expansion self-adjusting ceramic assembly 10 can be connected to the high voltage electrode 20 and the ground electrode 30 by means of bolt penetration, which can increase the reliability of the sealing surface.
[0051] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0052] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0053] In the description of this specification, the description with reference to the terms "this embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any at least one embodiment or example. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.
[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0055] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and simple improvements made to the essential contents of the present invention should be included in the protection scope of the present invention.
Claims
1. A thermal expansion self-adjusting ceramic component, used as a radio frequency resonator for ion beam acceleration, characterized in that: include: Ceramic cylinder, first metal ring, second metal ring, first ceramic sealing ring and second ceramic sealing ring, The first ceramic sealing ring and the second ceramic sealing ring are connected to two ends of the ceramic tube respectively, the first metal ring is connected to the first ceramic sealing ring, and the second ceramic sealing ring is connected to the second metal ring.
2. The thermal expansion self-adjusting ceramic component according to claim 1, characterized in that: The first ceramic sealing ring and the second ceramic sealing ring are both L-shaped in cross section, including a first connecting edge and a second connecting edge perpendicular to each other. The second connecting edge is used to connect to the end surface of the ceramic tube, and the first connecting edge is used to connect to the first metal ring or the second metal ring.
3. The thermal expansion self-adjusting ceramic component according to claim 2, characterized in that: The first ceramic sealing ring and the second ceramic sealing ring are both metal stamping parts with a thickness of 0.5 mm-1.2 mm.
4. The thermal expansion self-adjusting ceramic component according to claim 2, characterized in that: The end of the ceramic tube is metallized and then welded to the first connecting edge by brazing.
5. The thermal expansion self-adjusting ceramic component according to claim 2, characterized in that: A connecting protrusion is formed on the first metal ring and the second metal ring, and a radial outer side wall of the connecting protrusion is used to be connected to the first connecting edge.
6. The thermal expansion self-adjusting ceramic component according to claim 5, characterized in that: A welding groove is formed on the outer wall of the connecting protruding ring along its circumferential extension, and the welding groove is used to accommodate a solder wire. The first connecting edge is sleeved on the outside of the connecting protruding ring and covers the welding groove. The first connecting edge is welded to the connecting protruding ring through the solder wire.
7. The thermal expansion self-adjusting ceramic component according to claim 5, characterized in that: A heat-conducting convex ring is formed on the axial end surface of the connecting convex ring, and the heat-conducting convex ring abuts against the second connecting edge. An annular groove is formed between the heat-conducting convex ring and the connecting convex ring.
8. The thermal expansion self-adjusting ceramic component according to any one of claims 1 to 7, characterized in that: The ceramic cylinder is a conical cylinder or a cylindrical cylinder.
9. The thermal expansion self-adjusting ceramic component according to claim 8, characterized in that: The thermal expansion self-adjusting ceramic component further includes a heat-conducting strip, an end of which is connected to at least one of the first metal ring and the second metal ring, and the heat-conducting strip is in contact with the outer side wall of the ceramic cylinder.
10. A radio frequency resonator, characterized in that: The thermal expansion self-adjusting ceramic component comprises the thermal expansion self-adjusting ceramic component according to any one of claims 1 to 9, wherein the first metal ring is connected to the high voltage electrode, the second metal ring is connected to the ground electrode, A first vacuum sealing ring is arranged between the first metal ring and the high voltage electrode, and a second vacuum sealing ring is arranged between the second metal ring and the ground electrode.