Manufacturing method of bendable aluminum-based printed circuit board for LED lamp

Abstract

The application discloses a manufacturing method of a bendable aluminum-based printed circuit board for an LED lamp and belongs to the technical field of aluminum-based printed circuit boards. The method comprises the steps of raw material preparation, surface layer film coating, first blind groove cutting, second blind groove cutting, lap reinforcement and blind hole drilling. A single aluminum substrate is used as raw material. The aluminum substrate is composed of an aluminum base layer, a circuit layer and an insulating layer between the aluminum base layer and the circuit layer. A numerical control machine base is used as a processing device. A cutting pattern is preset in the machine tool. After removing oil stains and dust on the surface of the aluminum substrate, an adhesive is coated, a high-temperature protective film is attached to the surface of the aluminum substrate for hot pressing or hot melting, and the high-temperature protective film is tightly combined with the aluminum substrate. The aluminum plate back is processed with blind grooves, the bending difficulty is reduced, the stability and reliability of the circuit are maintained, the production process is optimized, the manufacturing process is simplified, and the material cost and processing period are reduced.

Description

Technical Field

[0001] This invention relates to the field of aluminum-based printed circuit board technology, and in particular to a method for manufacturing a bendable aluminum-based printed circuit board for LED lamps. Background Technology

[0002] Traditional aluminum substrates, due to their high rigidity, struggle to meet design requirements in environments demanding bending and deformation, easily leading to circuit damage and impacting product reliability and lifespan. With the continuous expansion of the smart lighting market, the demand for LED luminaires capable of adapting to various complex installation conditions is increasing. Therefore, developing an aluminum-based printed circuit board that guarantees circuit performance while possessing good bending characteristics has become an urgent need in the industry.

[0003] Existing solutions mainly include two approaches. One is to use flexible PCBs instead of traditional rigid aluminum substrates. This method can effectively increase the flexibility of the circuit board, but the heat dissipation performance of flexible PCBs is far inferior to that of aluminum substrates. Long-term operation may lead to heat accumulation, affecting the working efficiency and lifespan of LED lights.

[0004] The second approach involves physically treating the traditional aluminum substrate, such as scribing or embossing, to increase its bending performance. However, this method often compromises the integrity and stability of the aluminum substrate, leading to circuit instability or even breakage. Both methods have their advantages and disadvantages, but neither has completely solved the problem in practical applications.

[0005] Existing solutions either sacrifice heat dissipation performance or compromise the long-term stability and safety of the circuit, failing to fully meet the design requirements of high-performance LED luminaires. These shortcomings become even more apparent when pursuing high efficiency while also considering aesthetics and ease of installation.

[0006] Chinese invention patent CN113966083A discloses an LED lamp, a bendable aluminum-based printed circuit board, its manufacturing method, and its application, relating to the field of printed circuit board manufacturing technology. The manufacturing method includes: cutting a single-sided aluminum substrate; processing outer layer patterns, etching outer layers, drilling holes, applying solder mask, creating characters, and processing blind slots on the aluminum surface after solder masking; and shaping the circuit after processing the blind slots. The bendable aluminum-based printed circuit board for LEDs includes: a single-sided aluminum substrate, auxiliary patterns, auxiliary positioning holes, solder mask, characters, and a first and second blind slot. This invention uses a single-sided aluminum substrate and reduces the bending difficulty by deeply drilling blind slots in the holes on the back of the aluminum plate, thereby reducing the thickness of the bending area; it avoids the lamination process of flexible board + pure glue + aluminum plate, greatly reducing processing difficulty and time, and the use of only aluminum plate also significantly reduces material costs. Compared to existing technologies, this invention takes a different approach, with a more streamlined manufacturing process and simpler quality control points.

[0007] The technical solution disclosed in the above patent reduces the difficulty of bending to a certain extent through the design of two blind grooves. However, this structural design results in the second blind groove having no filling material, being too thin to provide support, having too low strength, and being easily damaged. Therefore, this application is filed. Summary of the Invention

[0008] Therefore, the present invention provides a method for manufacturing a bendable aluminum-based printed circuit board for LED lamps to solve the above-mentioned problems.

[0009] This invention provides the following technical solution: a method for manufacturing a bendable aluminum-based printed circuit board for LED lights, comprising the following steps:

[0010] S1. Raw material preparation: Single-sided aluminum substrate is used as raw material. Aluminum substrate with high thermal conductivity and good mechanical properties is selected as substrate to ensure the heat dissipation efficiency of the final product, avoid heat accumulation during long-term operation, and prevent the LED lamp's working efficiency and service life from being affected. The aluminum substrate is composed of an aluminum base layer, a circuit layer and an insulating layer located between the aluminum base layer and the circuit layer. A CNC machine base is used as processing equipment, and a cutting pattern is preset in the machine tool.

[0011] S2. Surface coating: After removing oil and dust from the surface of the aluminum substrate, an adhesive is applied and a high-temperature protective film is attached to the surface of the aluminum substrate by hot pressing or hot melting. This ensures that the high-temperature protective film is tightly bonded to the aluminum substrate, preventing the aluminum substrate from being corroded or scratched by chemicals during processing. It effectively resists chemical corrosion during processing, avoids scratches, and further enhances the durability and appearance quality of the product.

[0012] S3. Cut the first blind groove: Use a CNC machine tool to precisely cut the first blind groove on the back of the aluminum substrate according to the predetermined pattern.

[0013] S4. Cut the second blind groove. The second blind groove is machined within the first blind groove. First, a CNC machine tool is used to precisely cut the back of the aluminum substrate according to a predetermined pattern to form the first blind groove. The edge of the first blind groove is approximately 5mm wider on each side than the final product's outer shape. Then, a second blind groove is machined in the same area. The edge of the second blind groove is 5mm narrower on each side than the first blind groove, and its depth is approximately 0.5mm deeper than the first blind groove. This multi-layered blind groove design not only significantly reduces the hardness of the aluminum substrate in the designated area, facilitating subsequent manual or mechanical bending operations, but also does not damage the integrity and continuity of the circuit, thus maintaining good circuit performance.

[0014] S5. Add reinforcing ribs: Add reinforcing ribs to the second blind groove. Use a flexible substrate as raw material and cut it into strips so that the length of the reinforcing ribs is the same as the length of the second blind groove. Then, glue the reinforcing ribs to the second blind groove. By adding reinforcing ribs, the second blind groove has a certain reinforcing structure. The stepped blind groove structure design effectively reduces the hardness of the central area of ​​the aluminum substrate. The addition of reinforcing ribs avoids the hardness being too low due to the large area coverage of the second blind groove. The combination of the two makes the final finished aluminum substrate easy to bend without being too hard and easily damaged.

[0015] S6. Drill blind holes. Switch to a drilling CNC machine tool and use the machine tool to process blind holes on the reinforcing rib. By setting blind holes, the overall hardness of the reinforcing rib is reduced to a certain extent, while the local bending performance of the reinforcing rib is improved. Finally, the excess part of the aluminum substrate is removed to form the finished aluminum substrate.

[0016] As a preferred embodiment of the present invention, in step S1, the width of the single-sided aluminum substrate is at least 5mm wider than the width of the finished circuit board, so as to reserve sufficient processing space for the finished aluminum substrate and facilitate processing operations.

[0017] As a preferred embodiment of the present invention, the specific steps of step S2 are as follows: remove the oil and dust from the surface of the aluminum substrate, then remove the oxide layer from the surface of the aluminum substrate to ensure that the bonding surface is flat and clean, cut the high temperature protective film to the size of the aluminum substrate, then coat one side of the high temperature protective film with an adhesive, and finally bond the high temperature protective film to the surface of the aluminum substrate by hot pressing or hot melting to make the high temperature protective film and the aluminum substrate tightly bonded.

[0018] As a preferred embodiment of the present invention, in step S3, the edge of the first blind groove is 5mm wider on one side than the outer edge of the aluminum substrate of the final product.

[0019] As a preferred embodiment of the present invention, in step S4, the edge of the second blind groove is 5mm narrower than the single side of the first blind groove, and its depth is 0.5mm deeper than the first layer. The multi-layer blind groove design not only significantly reduces the hardness of the aluminum plate in the specified area, making it easier for subsequent manual or mechanical bending operations, but also does not damage the integrity and continuity of the circuit, thereby maintaining the good performance of the circuit.

[0020] As a preferred embodiment of the present invention, in step S6, the diameter of the blind hole is 0.5 mm.

[0021] As a preferred embodiment of the present invention, in step S6, the distance between each blind hole on a single reinforcing rib is 10mm. The setting of blind holes further improves the bending ability of the reinforcing rib without excessively affecting its strength, making the final product easy to bend.

[0022] As a preferred embodiment of the present invention, in step S5, the flexible substrate is made of polyimide, polyester or polyvinyl chloride, which has excellent heat resistance, mechanical strength, chemical stability and flexibility. As a supplement to the aluminum substrate, it still meets the relevant usage requirements.

[0023] The beneficial effects of this invention are as follows:

[0024] 1. This invention uses a single-sided aluminum substrate. The back of the aluminum substrate is specially designed with blind grooves to form a multi-layered stepped structure. The multi-layered blind groove design not only significantly reduces the hardness of the aluminum plate in the designated area, making it easier for subsequent manual or mechanical bending operations, but also does not damage the integrity and continuity of the circuit, thereby maintaining the good performance of the circuit.

[0025] 2. The present invention covers the surface of the aluminum substrate with a high-temperature protective film. This film can effectively resist chemical corrosion during processing, avoid scratches, and further enhance the durability and appearance quality of the product.

[0026] 3. The present invention further fills the second blind groove with reinforcing ribs, and the reinforcing ribs have blind holes. Under the support of the reinforcing ribs with blind holes, the strength of the aluminum substrate is still guaranteed while making it easy to bend, and it will not be easily damaged. Attached Figure Description

[0027] The invention will now be further described with reference to the accompanying drawings.

[0028] Figure 1 This is a schematic diagram of the overall structure of the circuit board of the present invention before it is cut;

[0029] Figure 2 This is a schematic diagram of the bottom structure of the circuit board of the present invention before it is cut;

[0030] Figure 3 This is a schematic diagram of the circuit board structure after cutting according to the present invention;

[0031] Figure 4 This is a schematic diagram of the bottom structure of the circuit board after it has been cut according to the present invention;

[0032] Figure 5 This is a front view of the circuit board after it has been cut according to the present invention.

[0033] Legend:

[0034] 1. Aluminum base layer; 101. First blind groove; 102. Second blind groove; 2. Insulation layer; 3. Circuit layer; 4. High temperature protective film; 5. Reinforcing rib; 501. Blind hole. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] like Figures 1-5 As shown, a method for manufacturing a bendable aluminum-based printed circuit board for LED lights includes the following steps:

[0037] S1. Raw material preparation: Single-sided aluminum substrate is used as raw material. Aluminum substrate with high thermal conductivity and good mechanical properties is selected as substrate to ensure the heat dissipation efficiency of the final product, avoid heat accumulation during long-term operation, and prevent affecting the working efficiency and service life of LED lights. The width of the single-sided aluminum substrate is at least 5mm greater than the width of the finished circuit board to reserve sufficient processing space for the finished aluminum substrate and facilitate processing operation. The aluminum substrate is composed of aluminum base layer 1, circuit layer 3 and insulating layer 2 located between aluminum base layer 1 and circuit layer 3. A CNC machine base is used as processing equipment, and the cutting pattern is preset in the machine tool.

[0038] S2. Surface coating: After removing oil and dust from the surface of the aluminum substrate, an adhesive is applied, and the high-temperature protective film 4 is attached to the surface of the aluminum substrate by hot pressing or hot melting to ensure a tight bond between the high-temperature protective film 4 and the aluminum substrate. The high-temperature protective film 4 is made of polyimide (PI) or polyethylene terephthalate (PET), which are resistant to high temperatures and chemical corrosion, to prevent the aluminum substrate from being corroded or scratched by chemicals during processing. It effectively resists chemical corrosion during processing, avoids scratches, and further enhances the durability and appearance quality of the product.

[0039] S3. Cut the first blind groove 101. Use a CNC machine tool to precisely cut the back of the aluminum substrate according to the predetermined pattern to form the first blind groove 101. The edge of the first blind groove 101 is 5mm wider on one side than the outer edge of the aluminum substrate of the final product.

[0040] S4. Cut the second blind groove 102. The second blind groove 102 is machined within the first blind groove 101. First, a CNC machine tool is used to precisely cut the back of the aluminum substrate according to a predetermined pattern to form the first blind groove 101. The edge of the first blind groove 101 is approximately 5mm wider on one side than the final product's outline. Then, the second blind groove 102 is machined again in the same area. The edge of the second blind groove 102 is 5mm narrower on one side than the first blind groove 101, and its depth is approximately 0.5mm deeper than the first blind groove 101. This multi-layered blind groove design not only significantly reduces the hardness of the aluminum substrate in the designated area, facilitating subsequent manual or mechanical bending operations, but also does not damage the integrity and continuity of the circuit, thus maintaining good circuit performance.

[0041] S5. Overlapping reinforcing rib 5: Reinforcing rib 5 is installed in the second blind groove 102. The flexible substrate is used as the raw material and cut into strips so that the length of the reinforcing rib 5 is the same as the length of the second blind groove 102. The reinforcing rib 5 is then bonded to the second blind groove 102. By supplementing the reinforcing rib 5, the second blind groove 102 has a certain reinforcing structure. The stepped blind groove structure design effectively reduces the hardness of the central area of ​​the aluminum substrate. The supplementing of the reinforcing rib 5 avoids the hardness being too low due to the large area coverage of the second blind groove 102. The combination of the two makes the final finished aluminum substrate easy to bend while not being easily damaged due to low hardness.

[0042] S6. Drill blind holes 501, switch to drilling CNC machine tool, and process blind holes 501 on reinforcing rib 5 through the machine tool. By setting blind holes 501, the overall hardness of reinforcing rib 5 is reduced to a certain extent, while improving the local bending performance of reinforcing rib 5. Finally, the excess part of the aluminum substrate is removed to form the finished aluminum substrate.

[0043] The specific steps of step S2 are as follows: remove the oil and dust from the surface of the aluminum substrate, then remove the oxide layer from the surface of the aluminum substrate to ensure that the bonding surface is flat and clean, cut the high temperature protective film 4 to the size of the aluminum substrate, then apply an adhesive to one side of the high temperature protective film 4, and finally bond the high temperature protective film 4 to the surface of the aluminum substrate by hot pressing or hot melting to make the high temperature protective film 4 tightly bonded to the aluminum substrate.

[0044] In step S4, the edge of the second blind groove 102 is 5mm narrower than the single side of the first blind groove 101, and its depth is 0.5mm deeper than the first layer. The multi-layer blind groove design not only significantly reduces the hardness of the aluminum plate in the designated area, making it easier for subsequent manual or mechanical bending operations, but also does not damage the integrity and continuity of the circuit, thus maintaining the good performance of the circuit.

[0045] In step S6, the diameter of the blind hole 501 is 0.5mm. In step S6, the distance between each blind hole 501 on a single reinforcing rib 5 is 10mm. The setting of the blind hole 501 does not excessively affect the strength of the reinforcing rib 5, and further improves the bending ability of the reinforcing rib 5, making the final product easy to bend.

[0046] In step S5, the flexible substrate is made of polyimide, polyester, or polyvinyl chloride, which has excellent heat resistance, mechanical strength, chemical stability, and flexibility. As a supplement to the aluminum substrate, it still meets the relevant usage requirements.

[0047] Example 1

[0048] A method for manufacturing a bendable aluminum-based printed circuit board for LED lights includes the following steps: raw material preparation, surface coating, cutting a first blind slot 101, cutting a second blind slot 102, overlapping reinforcing ribs 5, and drilling blind holes 501. A single-sided aluminum substrate is used as the raw material. The aluminum substrate consists of an aluminum base layer 1, a circuit layer 3, and an insulating layer 2 located between the aluminum base layer 1 and the circuit layer 3. A CNC machine is used as the processing equipment. A cutting pattern is preset in the machine tool. After removing oil and dust from the surface of the aluminum substrate, an adhesive is applied. A high-temperature protective film 4 is then bonded to the surface of the aluminum substrate and subjected to hot pressing or hot melting. The high-temperature protective film 4 is tightly bonded to the aluminum substrate. A CNC machine tool is used to precisely cut the back of the aluminum substrate according to a predetermined pattern to form a first blind groove 101. A second blind groove 102 is processed in the first blind groove 101. A reinforcing rib 5 is added in the second blind groove 102. A flexible substrate is used as the raw material and cut into strips so that the length of the reinforcing rib 5 is the same as the length of the second blind groove 102. The reinforcing rib 5 is then bonded to the second blind groove 102. A drilling CNC machine tool is switched to process blind holes 501 on the reinforcing rib 5. Finally, the excess part of the aluminum substrate is removed to form the finished aluminum substrate.

[0049] In step S1, the width of the single-sided aluminum substrate is at least 5mm wider than the width of the finished circuit board.

[0050] The specific steps of step S2 are as follows: remove the oil and dust from the surface of the aluminum substrate, then remove the oxide layer from the surface of the aluminum substrate to ensure that the bonding surface is flat and clean, cut the high temperature protective film 4 to the size of the aluminum substrate, then apply an adhesive to one side of the high temperature protective film 4, and finally bond the high temperature protective film 4 to the surface of the aluminum substrate by hot pressing or hot melting to make the high temperature protective film 4 tightly bonded to the aluminum substrate.

[0051] In step S3, the edge of the first blind groove 101 is 5mm wider on one side than the aluminum substrate outline of the final product.

[0052] In step S4, the edge of the second blind groove 102 is 5mm narrower than the single side of the first blind groove 101, and its depth is 0.5mm deeper than the first layer.

[0053] In step S6, the diameter of the blind hole 501 is 0.5 mm, and the distance between each blind hole 501 on a single reinforcing rib 5 is 10 mm.

[0054] In step S5, the flexible substrate is made of polyimide.

[0055] The circuit board manufactured according to this embodiment remained intact after being bent, with no cracks on the surface, and all its performance remained intact, meeting the requirements for circuit board use.

[0056] Example 2

[0057] A method for manufacturing a bendable aluminum-based printed circuit board for LED lights includes the following steps: raw material preparation, surface coating, cutting a first blind slot 101, cutting a second blind slot 102, overlapping reinforcing ribs 5, and drilling blind holes 501. A single-sided aluminum substrate is used as the raw material. The aluminum substrate consists of an aluminum base layer 1, a circuit layer 3, and an insulating layer 2 located between the aluminum base layer 1 and the circuit layer 3. A CNC machine is used as the processing equipment. A cutting pattern is preset in the machine tool. After removing oil and dust from the surface of the aluminum substrate, an adhesive is applied. A high-temperature protective film 4 is then bonded to the surface of the aluminum substrate and subjected to hot pressing or hot melting. The high-temperature protective film 4 is tightly bonded to the aluminum substrate. A CNC machine tool is used to precisely cut the back of the aluminum substrate according to a predetermined pattern to form a first blind groove 101. A second blind groove 102 is processed in the first blind groove 101. A reinforcing rib 5 is added in the second blind groove 102. A flexible substrate is used as the raw material and cut into strips so that the length of the reinforcing rib 5 is the same as the length of the second blind groove 102. The reinforcing rib 5 is then bonded to the second blind groove 102. A drilling CNC machine tool is switched to process blind holes 501 on the reinforcing rib 5. Finally, the excess part of the aluminum substrate is removed to form the finished aluminum substrate.

[0058] In step S1, the width of the single-sided aluminum substrate is at least 5mm wider than the width of the finished circuit board.

[0059] The specific steps of step S2 are as follows: remove the oil and dust from the surface of the aluminum substrate, then remove the oxide layer from the surface of the aluminum substrate to ensure that the bonding surface is flat and clean, cut the high temperature protective film 4 to the size of the aluminum substrate, then apply an adhesive to one side of the high temperature protective film 4, and finally bond the high temperature protective film 4 to the surface of the aluminum substrate by hot pressing or hot melting to make the high temperature protective film 4 tightly bonded to the aluminum substrate.

[0060] In step S3, the edge of the first blind groove 101 is 5mm wider on one side than the aluminum substrate outline of the final product.

[0061] In step S4, the edge of the second blind groove 102 is 5mm narrower than the single side of the first blind groove 101, and its depth is 0.5mm deeper than the first layer.

[0062] In step S6, the diameter of the blind hole 501 is 0.5 mm, and the distance between each blind hole 501 on a single reinforcing rib 5 is 10 mm.

[0063] In step S5, the flexible substrate is made of polyester.

[0064] The circuit board manufactured according to this embodiment remained intact after being bent during testing, with no cracks on its surface, and all its performance remained excellent, meeting the requirements for circuit board use.

[0065] Example 3

[0066] A method for manufacturing a bendable aluminum-based printed circuit board for LED lights includes the following steps: raw material preparation, surface coating, cutting a first blind slot 101, cutting a second blind slot 102, overlapping reinforcing ribs 5, and drilling blind holes 501. A single-sided aluminum substrate is used as the raw material. The aluminum substrate consists of an aluminum base layer 1, a circuit layer 3, and an insulating layer 2 located between the aluminum base layer 1 and the circuit layer 3. A CNC machine is used as the processing equipment. A cutting pattern is preset in the machine tool. After removing oil and dust from the surface of the aluminum substrate, an adhesive is applied. A high-temperature protective film 4 is then bonded to the surface of the aluminum substrate and subjected to hot pressing or hot melting. The high-temperature protective film 4 is tightly bonded to the aluminum substrate. A CNC machine tool is used to precisely cut the back of the aluminum substrate according to a predetermined pattern to form a first blind groove 101. A second blind groove 102 is processed in the first blind groove 101. A reinforcing rib 5 is added in the second blind groove 102. A flexible substrate is used as the raw material and cut into strips so that the length of the reinforcing rib 5 is the same as the length of the second blind groove 102. The reinforcing rib 5 is then bonded to the second blind groove 102. A drilling CNC machine tool is switched to process blind holes 501 on the reinforcing rib 5. Finally, the excess part of the aluminum substrate is removed to form the finished aluminum substrate.

[0067] In step S1, the width of the single-sided aluminum substrate is at least 5mm wider than the width of the finished circuit board.

[0068] The specific steps of step S2 are as follows: remove the oil and dust from the surface of the aluminum substrate, then remove the oxide layer from the surface of the aluminum substrate to ensure that the bonding surface is flat and clean, cut the high temperature protective film 4 to the size of the aluminum substrate, then apply an adhesive to one side of the high temperature protective film 4, and finally bond the high temperature protective film 4 to the surface of the aluminum substrate by hot pressing or hot melting to make the high temperature protective film 4 tightly bonded to the aluminum substrate.

[0069] In step S3, the edge of the first blind groove 101 is 5mm wider on one side than the aluminum substrate outline of the final product.

[0070] In step S4, the edge of the second blind groove 102 is 5mm narrower than the single side of the first blind groove 101, and its depth is 0.5mm deeper than the first layer.

[0071] In step S6, the diameter of the blind hole 501 is 0.5 mm, and the distance between each blind hole 501 on a single reinforcing rib 5 is 10 mm.

[0072] In step S5, the flexible substrate is made of polyvinyl chloride.

[0073] The circuit board made according to this embodiment remained intact after being bent, with no cracks on the surface, and all its performance remained intact, meeting the requirements for use as a circuit board. Based on the test structures of various embodiments, it can be seen that the circuit board made by this method has effectively improved performance, and its strength is guaranteed while being bendable, showing a significant technical improvement.

[0074] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method for manufacturing a bendable aluminum-based printed circuit board for LED lights, characterized in that, Includes the following steps: S1. Raw material preparation: Single-sided aluminum substrate is used as raw material. The aluminum substrate is composed of aluminum base layer (1), circuit layer (3) and insulating layer (2) located between the aluminum base layer (1) and circuit layer (3). CNC machine base is used as processing equipment, and cutting patterns are preset in the machine tool. S2. Surface coating: After removing oil and dust from the surface of the aluminum substrate, apply adhesive and attach the high temperature protective film (4) to the surface of the aluminum substrate by hot pressing or hot melting, so that the high temperature protective film (4) is tightly bonded to the aluminum substrate. S3. Cut the first blind groove (101). The first blind groove (101) is formed by precisely cutting the back of the aluminum substrate according to the predetermined pattern using a CNC machine tool. S4. Cut the second blind groove (102) and process the second blind groove (102) in the first blind groove (101). S5. Overlapping reinforcing rib (5): A reinforcing rib (5) is installed in the second blind groove (102). A flexible substrate is used as the raw material and cut into strips so that the length of the reinforcing rib (5) is the same as the length of the second blind groove (102). The reinforcing rib (5) is then bonded to the second blind groove (102). S6. Drill blind holes (501), switch to drilling CNC machine tool, process blind holes (501) on reinforcing rib (5) by machine tool, and finally cut off the excess part of aluminum substrate to form finished aluminum substrate.

2. The method for manufacturing a bendable aluminum-based printed circuit board for LED lamps according to claim 1, characterized in that: In step S1, the width of the single-sided aluminum substrate is at least 5mm wider than the width of the finished circuit board.

3. The method for manufacturing a bendable aluminum-based printed circuit board for LED lamps according to claim 1, characterized in that: The specific steps of step S2 are as follows: remove the oil and dust from the surface of the aluminum substrate, remove the oxide layer from the surface of the aluminum substrate to ensure that the bonding surface is flat and clean, cut the high temperature protective film (4) to the size of the aluminum substrate, then coat one side of the high temperature protective film (4) with an adhesive, and finally bond the high temperature protective film (4) to the surface of the aluminum substrate for hot pressing or hot melting to make the high temperature protective film (4) tightly bonded to the aluminum substrate.

4. The method for manufacturing a bendable aluminum-based printed circuit board for LED lamps according to claim 1, characterized in that: In step S3, the edge of the first blind groove (101) is 5mm wider on one side than the aluminum substrate outline of the final product.

5. The method for manufacturing a bendable aluminum-based printed circuit board for LED lamps according to claim 1, characterized in that: In step S4, the edge of the second blind groove (102) is 5mm narrower than the single side of the first blind groove (101), and its depth is 0.5mm deeper than the first layer.

6. The method for manufacturing a bendable aluminum-based printed circuit board for LED lamps according to claim 1, characterized in that: In step S6, the diameter of the blind hole (501) is 0.5 mm.

7. The method for manufacturing a bendable aluminum-based printed circuit board for LED lamps according to claim 6, characterized in that: In step S6, the distance between each blind hole (501) on a single reinforcing rib (5) is 10 mm.

8. The method for manufacturing a bendable aluminum-based printed circuit board for LED lamps according to claim 1, characterized in that: In step S5, the flexible substrate is made of polyimide, polyester, or polyvinyl chloride.

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