Electronic device

Abstract

The invention discloses electronic equipment. The electronic equipment comprises a battery cover; a screen; the frame body is connected between the battery cover and the screen, a first cavity is defined by the screen and the frame body, and a second cavity is defined by the frame body and the battery cover; the circuit board group is arranged in the second cavity, and a functional device is arranged on the circuit board group; the first uniform temperature plate is arranged in the second cavity, and the first uniform temperature plate is located between the circuit board group and the battery cover; the second uniform temperature plate is arranged in the first chamber; and one end of the heat conduction piece is connected with the first uniform temperature plate, and the other end of the heat conduction piece penetrates through the frame body and is connected with the second uniform temperature plate.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic devices, and specifically relates to an electronic device. Background Art

[0002] With the rapid development of intelligent electronic devices, the performance parameters of electronic devices are improving year by year, and the heating problem of functional components of electronic devices is becoming more and more serious. Excessive temperature of functional components can easily cause electronic devices to freeze, delay, increase power consumption, etc. during use. In more serious cases, it may even cause accidents such as inability to use or burns.

[0003] In the related art, a temperature equalizer is set inside the electronic device. The temperature equalizer is attached to the frame of the electronic device by double-sided tape. The temperature equalizer and functional devices are located on opposite sides of the frame. The heat generated by the functional devices is conducted to the frame, part of the heat is diffused through the frame, and the other part of the heat is conducted to the temperature equalizer. Due to the high heat transfer efficiency of the temperature equalizer, the heat quickly diffuses to the entire temperature equalizer, and the heat is diffused and dissipated by the heat dissipation film of the electronic device, and finally dissipated to the external environment through the screen and battery cover of the electronic device. Due to the thickness of the electronic device, the heat dissipation path for heat conduction to the screen and battery cover is short, and the heat dissipation path is single, which affects the heat dissipation effect. Summary of the invention

[0004] The present application aims to provide an electronic device, which solves the problem of poor heat dissipation effect caused by a short heat dissipation path and a single heat dissipation path in the electronic device in the related art.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] An embodiment of the present application proposes an electronic device, comprising: a battery cover; a screen; a frame, wherein the frame is connected between the battery cover and the screen, the screen and the frame enclose a first chamber, and the frame and the battery cover enclose a second chamber; a circuit board group, disposed in the second chamber, on which functional components are arranged; a first temperature averaging plate, disposed in the second chamber, and the first temperature averaging plate is located between the circuit board group and the battery cover; a second temperature averaging plate, disposed in the first chamber; a heat conductor, wherein one end of the heat conductor is connected to the first temperature averaging plate, and the other end of the heat conductor passes through the frame and is connected to the second temperature averaging plate.

[0007] In an embodiment of the present application, the electronic device includes a battery cover, a screen, a frame, a circuit board group, a first temperature averaging plate, a heat conducting member, and a second temperature averaging plate.

[0008] The frame is connected between the battery cover and the screen, and the battery cover, the screen and the frame enclose a first cavity and a second cavity. Specifically, the frame and the battery cover enclose the second cavity, and the frame and the screen enclose the first cavity.

[0009] Functional devices are arranged on the circuit board group.

[0010] The circuit board group, the first temperature equalizing plate and the heat conducting member are all arranged in the second chamber.

[0011] The second temperature-averaging plate is arranged in the first chamber.

[0012] One end of the heat conductor is connected to the first temperature averaging plate, and the other end of the heat conductor passes through the frame and is connected to the second temperature averaging plate. That is, the heat conductor connects the first temperature averaging plate and the second temperature averaging plate, and the heat conductor is used to conduct the heat of the first temperature averaging plate to the second temperature averaging plate.

[0013] The functional components of the circuit board group will generate heat when working. Part of the heat is conducted to the frame (this is the first path of heat conduction), and the other part of the heat is conducted to the first temperature equalizing plate (this is the second path of heat conduction). After the heat is conducted to the first temperature equalizing plate, it will quickly diffuse to various parts of the first temperature equalizing plate for the first heat equalization. Part of the heat at the first temperature equalizing plate is conducted to the second temperature equalizing plate through the heat conductor (this is the first branch path of the second path of heat conduction). After the heat is conducted to the second temperature equalizing plate, it will quickly diffuse to various parts of the second temperature equalizing plate for the second temperature equalization. The heat after the second temperature equalization is diffused to the external environment through the screen. Another part of the heat at the first temperature equalizing plate is conducted to the battery cover, and dissipated to the external environment through the battery cover (this is the second branch path of the second path of heat conduction).

[0014] After the heat is transferred to the frame, part of the heat is diffused through the frame, and the other part of the heat is transferred to the second temperature equalizing plate for temperature equalization. The heat after temperature equalization is diffused to the external environment through the screen.

[0015] That is to say, the present application reasonably sets the structure of the electronic device so that most of the heat generated by the circuit board group is transferred to the second temperature equalizing plate via the first path and the first branch path, that is, part of the heat is first equalized by the first temperature equalizing plate, and then transferred to the second temperature equalizing plate through the heat conductive member and the frame for a second temperature equalization to improve the temperature equalization effect. At the same time, the battery cover, frame, circuit board group, first temperature equalizing plate, heat conductive member and second temperature equalizing plate cooperate to change the heat dissipation path of the heat transferred to the screen and battery cover, extend the heat dissipation path, and because it is equalized twice, this setting greatly improves the overall heat dissipation effect of the electronic device, can effectively solve the problem of heating of the electronic device in the application scenario of high power consumption of the electronic device, and improves the product's performance and market competitiveness.

[0016] It can be understood that both the first chamber and the rear chamber are provided with temperature equalizing plates, which can effectively and multiple times equalize the heat generated by the operation of the circuit board group, thereby providing structural support for improving the heat dissipation effect of the electronic equipment.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is an exploded view of an electronic device from a first perspective according to an embodiment of the present application;

[0020] Figure 2 is an exploded view of an electronic device from a second perspective according to an embodiment of the present application;

[0021] Figure 3 is a schematic structural diagram of a heat conducting member according to an embodiment of the present application;

[0022] Figure 4 is a partial structural schematic diagram of a heat conducting member according to an embodiment of the present application;

[0023] Figure 5 is a schematic structural diagram of a heat insulation member according to an embodiment of the present application;

[0024] Figure 6 It is a partial structural schematic diagram of a thermal insulation component of an embodiment of the present application.

[0025] Reference numerals:

[0026] Figures 1 to 6 The corresponding relationship between the reference numerals and component names in the figure is:

[0027] 10 electronic device, 100 battery cover, 200 screen, 300 frame, 400 first chamber, 500 second chamber, 600 circuit board group, 610 printed circuit board, 620 functional device, 630 first shielding cover, 640 second shielding cover, 700 first temperature equalizing plate, 800 second temperature equalizing plate, 900 thermal conductor, 910 first connecting plate, 920 second connecting plate, 930 tube body, 932 capillary structure, 934 channel, 1000 thermal insulation member, 1010 thermal insulation cavity, 1020 degassing pipe, 1030 protrusion, 1040 reflective layer, 1100 heat dissipation film, 1200 adhesive layer, 1300 battery. DETAILED DESCRIPTION

[0028] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0029] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0030] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] The following is combined with Figures 1 to 6 An electronic device 10 provided in an embodiment of the present application is described.

[0033] like Figure 1 and Figure 2As shown, the electronic device 10 according to some embodiments of the present application includes: a battery cover 100; a screen 200; a frame 300, the frame 300 is connected between the battery cover 100 and the screen 200, the screen 200 and the frame 300 enclose a first chamber 400, and the frame 300 and the battery cover 100 enclose a second chamber 500; a circuit board group 600, which is arranged in the second chamber 500, and a functional device 620 is arranged on the circuit board group 600; a first temperature averaging plate 700, which is arranged in the second chamber 500, and the first temperature averaging plate 700 is located between the circuit board group 600 and the battery cover 100; a second temperature averaging plate 800, which is arranged in the first chamber 400; a heat conductor 900, one end of the heat conductor 900 is connected to the first temperature averaging plate 700, and the other end of the heat conductor 900 passes through the frame 300 and is connected to the second temperature averaging plate 800.

[0034] In an embodiment of the present application, the electronic device 10 includes a battery cover 100 , a screen 200 , a frame 300 , a circuit board assembly 600 , a first temperature averaging plate 700 , a heat conducting member 900 , and a second temperature averaging plate 800 .

[0035] The frame 300 is connected between the battery cover 100 and the screen 200, and the battery cover 100, the screen 200 and the frame 300 enclose a first chamber 400 and a second chamber 500. Specifically, the frame 300 and the battery cover 100 enclose the second chamber 500, and the frame 300 and the screen 200 enclose the first chamber 400.

[0036] Functional devices 620 are disposed on the circuit board assembly 600 .

[0037] The circuit board assembly 600 , the first temperature equalizing plate 700 and the heat conducting member 900 are all disposed in the second chamber 500 .

[0038] The second temperature uniform plate 800 is disposed in the first chamber 400 .

[0039] One end of the heat conducting member 900 is connected to the first temperature averaging plate 700, and the other end of the heat conducting member 900 passes through the frame 300 and is connected to the second temperature averaging plate 800. That is, the heat conducting member 900 connects the first temperature averaging plate 700 and the second temperature averaging plate 800, and the heat conducting member 900 is used to transfer the heat of the first temperature averaging plate 700 to the second temperature averaging plate 800.

[0040] The functional components of the circuit board group 600 generate heat when working. Part of the heat is conducted to the frame 300 (this is the first path of heat conduction), and the other part of the heat is conducted to the first temperature-averaging plate 700 (this is the second path of heat conduction). After the heat is conducted to the first temperature-averaging plate 700, it will quickly diffuse to various parts of the first temperature-averaging plate 700 for the first heat-averaging. Part of the heat at the first temperature-averaging plate 700 is conducted to the second temperature-averaging plate 800 through the heat conductor 900 (this is the first branch path of the second path of heat conduction). After the heat is conducted to the second temperature-averaging plate 800, it will quickly diffuse to various parts of the second temperature-averaging plate 800 for the second heat-averaging. The heat after the second heat-averaging is diffused to the external environment through the screen 200. Another part of the heat at the first temperature-averaging plate 700 is conducted to the battery cover 100, and is dissipated to the external environment through the battery cover 100 (this is the second branch path of the second path of heat conduction).

[0041] After the heat is transferred to the frame 300 , part of the heat is diffused through the frame 300 , and the other part of the heat is transferred to the second temperature equalizing plate 800 for temperature equalization. The heat after temperature equalization is diffused to the external environment through the screen 200 .

[0042] That is to say, the present application reasonably sets the structure of the electronic device 10 so that most of the heat generated by the circuit board group 600 is transferred to the second temperature equalizing plate 800 via the first path and the first branch path, that is, part of the heat is first equalized by the first temperature equalizing plate 700, and then transferred to the second temperature equalizing plate 800 through the heat conductive member 900 and the frame 300 for the second temperature equalization, so as to improve the temperature equalization effect. At the same time, the battery cover 100, the frame 300, the circuit board group 600, the first temperature equalizing plate 700, the heat conductive member 900 and the second temperature equalizing plate 800 cooperate to change the heat dissipation path of the heat conducted to the screen 200 and the battery cover 100, extend the heat dissipation path, and because of the two temperature equalizations, the setting greatly improves the overall heat dissipation effect of the electronic device 10, can effectively solve the problem of heating of the electronic device 10 in the high power consumption application scenario of the electronic device 10, and improves the product's performance and market competitiveness.

[0043] It is understandable that both the first chamber 400 and the rear chamber are provided with a temperature equalizing plate, which can effectively and multiple times equalize the heat generated by the circuit board assembly 600 during operation, thereby providing structural support for improving the heat dissipation effect of the electronic device 10 .

[0044] Optionally, the electronic device 10 can be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop, a mobile computer, an augmented reality device (also known as an AR (Augmented Reality) device), a virtual reality device (also known as a VR (Virtual Reality) device) and a handheld game console, etc.

[0045] Optionally, the functional device 620 includes a central processing unit and a power chip, etc., which are not listed here one by one. Optionally, the frame 300 is provided with an opening, and the heat conducting member 900 is connected to the opening.

[0046] Optionally, the connection methods between the frame 300 and the heat conducting member 900 include: snap connection, screw connection, welding, and fastening connection via fasteners (such as screws, bolts or rivets), etc., which are not listed here one by one.

[0047] in, Figure 2 The arrows in the figure indicate the heat conduction path. Figure 2 The number 1 in the figure is the first path. Figure 2 The number 2 in the figure is the second path. Figure 2 The number 2-1 in is the first branch path. Figure 2 2-2 in is the second branch path.

[0048] In some embodiments, Figure 1 As shown, the electronic device 10 further includes: a heat insulating member 1000 disposed in the second chamber 500 , and the heat insulating member 1000 is located between the first temperature homogenizing plate 700 and the battery cover 100 .

[0049] In this embodiment, the structure of the electronic device 10 is further defined.

[0050] The electronic device 10 further includes a heat insulating member 1000 . The heat insulating member 1000 is disposed in the second chamber 500 , and the heat insulating member 1000 is located between the first temperature homogenizing plate 700 and the battery cover 100 .

[0051] The thermal insulation member 1000 has a thermal insulation function. Most of the heat at the first temperature equalizing plate 700 is blocked, so that most of the heat is conducted to the second temperature equalizing plate 800 through the thermal conductive member 900. A small amount of heat at the first temperature equalizing plate 700 will diffuse to the external environment through the battery cover 100.

[0052] The reason why the heat insulating member 1000 is limited to be located between the first temperature averaging plate 700 and the battery cover 100 is that when the user holds the electronic device 10, the contact area between the hand and the battery cover 100 is large, and the heat at the battery cover 100 can be more directly felt by the user. Therefore, a small amount of heat at the first temperature averaging plate 700 is diffused to the external environment through the battery cover 100, while ensuring the heat dissipation effect of the electronic device 10, it will not reduce the user's experience.

[0053] In some embodiments, Figure 5 and Figure 6As shown, a heat-insulating cavity 1010 is provided in the heat-insulating element 1000 ; the heat-insulating cavity 1010 is a vacuum cavity, and the heat-insulating element 1000 is further provided with a degassing pipe 1020 , which is connected to the heat-insulating cavity 1010 .

[0054] In this embodiment, the structure of the thermal insulation member 1000 is further defined.

[0055] A heat insulating cavity 1010 is provided in the heat insulating element 1000 .

[0056] When the heat insulation cavity 1010 is a vacuum cavity, the heat insulation member 1000 is further provided with a degassing pipe 1020, and the degassing pipe 1020 is connected to the heat insulation cavity 1010. The degassing pipe 1020 can be used to evacuate the heat insulation cavity 1010 to make it a vacuum cavity.

[0057] The vacuum chamber has excellent heat preservation and insulation properties, which can reduce heat transfer and convective heat transfer and heat conduction, so that most of the heat is blocked and only a small amount of heat will diffuse into the external environment through the battery cover 100.

[0058] In some embodiments, a heat-insulating cavity 1010 is provided in the heat-insulating element 1000 ; and a heat-insulating material is provided in the heat-insulating cavity 1010 .

[0059] In this embodiment, the structure of the thermal insulation member 1000 is further defined.

[0060] The heat insulating member 1000 is provided with a heat insulating cavity 1010. The heat insulating material is provided in the heat insulating cavity 1010. That is, by filling the heat insulating cavity 1010 with a material that can block the heat flow transfer, the heat diffused to the external environment through the battery cover 100 is reduced, so that more heat is conducted to the second temperature equalizing plate 800 through the heat conducting member 900.

[0061] Optionally, the thermal insulation material includes: glass fiber, gold, silver, nickel, aluminum foil, water, etc., which are not listed here one by one.

[0062] In some embodiments, Figure 5 and Figure 6 As shown, a plurality of convex portions 1030 arranged at intervals are provided on one side of the heat insulating member 1000 facing the first temperature homogenizing plate 700 , and the convex portions 1030 abut against the first temperature homogenizing plate 700 .

[0063] In this embodiment, the structure of the thermal insulation member 1000 is further defined.

[0064] A plurality of convex portions 1030 are disposed on one side of the heat insulating member 1000 facing the first temperature uniform plate 700 . The plurality of convex portions 1030 are arranged at intervals, and any one of the plurality of convex portions 1030 abuts against the first temperature uniform plate 700 .

[0065] The plurality of protrusions 1030 have a function of enhancing the structural strength of the thermal insulation element 1000 .

[0066] In addition, a plurality of convex portions 1030 are arranged at intervals, and the convex portions 1030 abut against the first temperature evaporating plate 700. This arrangement can reduce the contact area between the thermal insulation member 1000 and the first temperature evaporating plate 700, thereby increasing the thermal resistance between the thermal insulation member 1000 and the first temperature evaporating plate 700 and enhancing the thermal insulation effect of the thermal insulation member 1000.

[0067] Optionally, the plurality of protrusions 1030 are arranged in a matrix.

[0068] In some embodiments, Figure 6 As shown, along the direction from the circuit board group 600 to the first temperature homogenizing plate 700 , the thermal insulation member 1000 has a first end surface and a second end surface, and both the first end surface and the second end surface are provided with a reflective layer 1040 .

[0069] In this embodiment, the structure of the thermal insulation member 1000 is further defined.

[0070] The heat insulating member 1000 has a first end surface and a second end surface, which are arranged along the direction from the circuit board group 600 to the first temperature homogenizing plate 700 . The first end surface is provided with a reflective layer 1040 , and the second end surface is provided with a reflective layer 1040 .

[0071] The reflective layer 1040 can reflect infrared radiation and weaken the path of thermal radiation.

[0072] It is understood that the modes of heat transfer include heat conduction, heat convection and heat radiation.

[0073] The heat insulating member 1000 is provided with a heat insulating cavity 1010. The heat insulating cavity 1010 is a vacuum cavity. The heat insulating member 1000 is further provided with a degassing pipe 1020, and the degassing pipe 1020 is connected to the heat insulating cavity 1010, or a heat insulating material is provided in the heat insulating cavity 1010. The heat insulating cavity 1010 can effectively block the heat convection and heat conduction of the air. The reflective layer 1040 has the function of blocking heat radiation.

[0074] It can be seen that by reasonably setting the structure of the thermal insulation component 1000, the three paths of heat transfer can be effectively blocked, where the three paths include heat conduction, heat convection and heat radiation.

[0075] In some embodiments, Figure 1 As shown, the functional device 620 is disposed on a side of the circuit board assembly 600 facing the first temperature homogenizing plate 700 .

[0076] In this embodiment, the structure of the circuit board group 600 is further defined.

[0077] The functional device 620 is arranged on the side of the circuit board group 600 facing the first temperature equalizing plate 700. That is, the setting position of the functional device 620 is limited. This setting allows the heat generated by the circuit board group 600 to be more transferred to the second temperature equalizing plate 800 via the first path and the first branch path, that is, most of the heat is firstly transferred to the first temperature equalizing plate 700 for the first time, and then transferred to the second temperature equalizing plate 800 through the heat conducting member 900 and the frame 300 for the second time, so as to improve the temperature equalization effect and the heat dissipation effect of the electronic device 10.

[0078] In some embodiments, Figure 1 As shown, the circuit board group 600 includes: a first shielding cover 630; a second shielding cover 640, a printed circuit board 610, a functional device 620 connected to the printed circuit board 610, the printed circuit board 610 is connected between the first shielding cover 630 and the second shielding cover 640, and at least a portion of the functional device 620 is located between the first shielding cover 630 and the second shielding cover 640.

[0079] In this embodiment, the structure of the circuit board group 600 is further defined.

[0080] The circuit board assembly 600 includes a first shielding cover 630, a printed circuit board 610, and a second shielding cover 640. The printed circuit board 610 is connected between the first shielding cover 630 and the second shielding cover 640, the functional device 620 is connected to the printed circuit board 610, and at least a portion of the functional device 620 is located between the first shielding cover 630 and the second shielding cover 640. In other words, a portion of the functional device 620 is located between the first shielding cover 630 and the second shielding cover 640. Or the entire functional device 620 is located between the first shielding cover 630 and the second shielding cover 640.

[0081] The first shielding cover 630 and the second shielding cover 640 cooperate with each other to have an anti-interference function, which can prevent external radiation and also prevent the influence of external interference signals on the inside.

[0082] Optionally, the first shielding cover 630 is connected to the printed circuit board 610 by welding.

[0083] Optionally, the second shielding cover 640 is connected to the printed circuit board 610 by welding.

[0084] In some embodiments, there are multiple heat conducting members 900 , and the multiple heat conducting members 900 are arranged at intervals around the printed circuit board 610 .

[0085] In this embodiment, the number and arrangement positions of the heat conducting members 900 are further defined.

[0086] There are multiple heat conducting members 900, which are arranged at intervals around the circuit board group 600. In each heat conducting member 900, one end of the heat conducting member 900 is connected to the first temperature averaging plate 700, and the other end of the heat conducting member 900 passes through the frame 300 and is connected to the second temperature averaging plate 800.

[0087] This arrangement increases the contact area between the heat conducting member 900 and the first and second temperature averaging plates 700 and 800, and can transfer heat from the first temperature averaging plate 700 to the second temperature averaging plate 800 from multiple directions and multiple positions, which is beneficial to improving the efficiency of heat transfer.

[0088] Optionally, the heat conducting member 900 is spaced apart from an outer edge of the printed circuit board 610 of the circuit board assembly 600 .

[0089] Optionally, a notch is provided at the outer edge of the printed circuit board 610 of the circuit board assembly 600, and the heat conducting member 900 is passed through the notch.

[0090] Optionally, the printed circuit board 610 of the circuit board assembly 600 is provided with a via hole, and the heat conducting member 900 is connected through the via hole.

[0091] Optionally, the number of heat conducting members 900 includes 2, 3, 4, etc., which are not listed here one by one.

[0092] In some embodiments, Figure 3 and Figure 4 As shown, the heat conductor 900 includes: a first connecting plate 910, connected to the first temperature averaging plate 700; a second connecting plate 920, connected to the second temperature averaging plate 800; a tube body 930, the tube body 930 is connected between the first connecting plate 910 and the second connecting plate 920, and a capillary structure 932 and a channel 934 are provided in the tube body 930, the channel 934 extends from the first connecting plate 910 to the second connecting plate 920, and the capillary structure 932 is arranged around the channel 934.

[0093] In this embodiment, the structure of the heat conducting member 900 is further defined.

[0094] The heat conducting member 900 includes a first connecting plate 910 , a second connecting plate 920 and a tube body 930 .

[0095] The tube body 930 is connected between the first connecting plate 910 and the second connecting plate 920, and a capillary structure 932 and a channel 934 are provided in the tube body 930. It is understandable that liquid working fluid is stored in the channel 934. When heat is transferred to the heat-conducting member 900, the heat is transferred to the liquid working fluid in the channel 934 through the capillary structure 932, causing the liquid working fluid to boil due to the heat and turn into a vapor-state working fluid, which absorbs a large amount of heat and then transfers the vapor to the second connecting plate 920. After releasing the heat, the vapor-state working fluid condenses into a liquid working fluid again. The liquid working fluid flows back to the first connecting plate 910 under the action of the capillary structure 932, completing a working cycle, and repeating this process, thereby achieving the purpose of rapidly diffusing heat from a concentrated area to the second temperature equalizing plate 800.

[0096] In some embodiments, Figure 1 As shown, the electronic device 10 further includes: a heat dissipation film 1100 disposed in the first chamber 400 , and the heat dissipation film 1100 is located between the second temperature homogenizing plate 800 and the screen 200 .

[0097] In this embodiment, the structure of the electronic device 10 is further defined.

[0098] The electronic device 10 further includes a heat dissipation film 1100 , which is located in the first chamber 400 and between the second temperature vapor chamber 800 and the screen 200 .

[0099] The heat dissipation film 1100 has the function of effectively diffusing heat to the screen 200 , so that the heat can be effectively diffused to the environment through the screen 200 .

[0100] Optionally, the heat dissipation film 1100 includes a graphite heat dissipation film.

[0101] The electronic device 10 of the present application includes a battery cover 100 , a screen 200 , a frame 300 , a circuit board assembly 600 , a first temperature averaging plate 700 , a heat conducting member 900 , and a second temperature averaging plate 800 . The circuit board assembly 600 includes a printed circuit board 610 and a functional device 620 .

[0102] For example, the number of the functional device 620 including the central processing unit and the heat conducting member 900 is two.

[0103] The central processing unit is arranged on the back side of the printed circuit board 610 , that is, the central processing unit is arranged on a side of the printed circuit board 610 facing the first temperature homogenizing plate 700 .

[0104] The two heat conducting members 900 pass through the printed circuit board 610 , and each heat conducting member 900 connects the first temperature averaging plate 700 and the second temperature averaging plate 800 . The heat insulating member 1000 is arranged between the first temperature averaging plate 700 and the battery cover 100 .

[0105] Most of the heat generated by the circuit board group 600 is firstly averaged by the first temperature plate 700 with high heat transfer efficiency, and then transferred to the second temperature plate 800 through the frame 300 and the heat conductive member 900 for the second average temperature, thereby improving the average temperature effect. By properly setting the matching structure of the first temperature plate 700, the heat conductive member 900 and the heat insulating member 1000, the heat dissipation path of the heat generated by the circuit board group 600 to the screen 200 and the battery cover 100 is changed, thereby improving the heat dissipation effect of the whole device, and effectively solving the heating problem of the electronic device 10 in high power consumption application scenarios.

[0106] The thermal insulation member 1000 includes an upper cover plate and a lower cover plate, both of which are stainless steel plates. The upper cover plate and the lower cover plate constitute the outer shell of the thermal insulation member 1000. A thermal insulation cavity 1010 is provided in the thermal insulation member 1000, and the thermal insulation cavity 1010 is a vacuum cavity. A plurality of convex portions 1030 arranged at intervals are provided on one side of the thermal insulation member 1000 facing the first temperature equalizing plate 700, and the plurality of convex portions 1030 can enhance the structural strength of the thermal insulation member 1000. In addition, the plurality of convex portions 1030 can reduce the contact area between the thermal insulation member 1000 and the first temperature equalizing plate 700, and increase the thermal resistance between the thermal insulation member 1000 and the first temperature equalizing plate 700. In addition, a reflective layer 1040 is provided on both the first end face and the second end face of the thermal insulation member 1000. Optionally, the reflective layer 1040 includes a silver layer. The reflective layer 1040 has a high reflectivity, and the reflective layer 1040 can reflect infrared radiation.

[0107] The heat conducting member 900 includes a first connecting plate 910, a second connecting plate 920 and a tube body 930. The tube body 930 includes a copper tube. A capillary structure 932 and a channel 934 are arranged in the tube body 930. The capillary structure 932 is arranged around the channel 934.

[0108] The capillary structure 932 is a capillary core with pores formed by high-temperature sintering of pure copper powder to melt and bond the surface of the copper powder. The first connecting plate 910, the second connecting plate 920 and the tube body 930 are welded to form a closed cavity. An exhaust pipe is welded on at least one of the first connecting plate 910 and the second connecting plate 920, and a working fluid is injected into the channel 934 through the exhaust pipe, so that the channel 934 forms a vacuum channel 934. The first connecting plate 910 is used to contact with the first temperature averaging plate 700 to evaporate the working fluid in the channel 934, and the second connecting plate 920 is used to dissipate heat to condense the working fluid, so that the heat is quickly diffused to the entire second temperature averaging plate 800.

[0109] When the electronic device 10 is working, the heat of the circuit board group 600 is first transferred to the first temperature equalizing plate 700 through the thermal conductive gel. Due to the presence of the thermal insulation member 1000, only a small part of the heat is transferred to the battery cover 100 through the thermal insulation member 1000, and diffused to the external environment through the battery cover 100. Most of the heat on the back of the printed circuit board 610 is transferred to the second temperature equalizing plate 800 through the first temperature equalizing plate 700 and the thermal conductive member 900 connected to the first temperature equalizing plate 700. Therefore, the heat generated by the circuit board group 600 during operation is firstly equalized by the first temperature equalizing plate 700 with high heat transfer efficiency, and then the heat is transferred to the second temperature equalizing plate 800 through the thermal conductive member 900 for the second temperature equalization, thereby improving the temperature equalization effect.

[0110] By reasonably arranging the matching structure of the battery cover 100, the screen 200, the frame 300, the circuit board group 600, the first temperature equalizing plate 700, the heat conductor 900 and the second temperature equalizing plate 800, the heat dissipation path of the heat transferred to the screen 200 and the battery cover 100 is changed, and the heat dissipation effect of the whole machine is improved by equalizing the heat of the heat equalizing plate twice, which can effectively solve the heating problem of the electronic device 10 in high power consumption application scenarios.

[0111] The functional device 620 is arranged on the back of the printed circuit board 610. The heat generated by the operation of the circuit board group 600 is first conducted to the first temperature equalizing plate 700 through the thermal conductive gel. Due to the high heat transfer efficiency of the first temperature equalizing plate 700, the heat quickly diffuses to all parts of the first temperature equalizing plate 700 for the first heat equalization. Part of the heat is conducted to the thermal insulation 1000. Since the interior of the thermal insulation 1000 is evacuated into a vacuum and the four sides of the thermal insulation 1000 are coated with a high reflectivity silver layer, the three heat transfer modes (heat conduction, heat convection and heat radiation) of heat transfer are greatly weakened. Finally, most of the heat on the back of the printed circuit board 610 is conducted to the front of the printed circuit board 610 through the two thermal conductive members 900, and only a small part of the heat is transferred to the battery cover 100 through the thermal insulation 1000 and diffused to the external environment through the battery cover 100.

[0112] The heat conducting member 900 includes a first connecting plate 910, a second connecting plate 920 and a tube body 930. The tube body 930 is a copper cylinder with a capillary structure 932 on the inner wall, and the interior of the tube body 930 is evacuated. The first connecting plate 910 is connected to the first temperature averaging plate 700, and the second connecting plate 920 is connected to the second temperature averaging plate 800. The heat conducting member 900 has a large heat transfer capacity.

[0113] When the heat conducting member 900 is working, the heat is transferred to the liquid working medium in the channel 934 through the capillary structure 932, causing the liquid working medium to boil due to the heat and turn into a vapor working medium. After absorbing a large amount of heat, the vapor is transferred to the second connecting plate 920. The vapor working medium releases heat and re-condenses into a liquid working medium. The liquid working medium relies on the capillary force in the capillary structure 932 to flow back to the first connecting plate 910, completing a working cycle. This process is repeated, thereby achieving rapid diffusion of heat from a concentrated area to the entire second temperature equalizing plate 800.

[0114] Heat transfer includes heat conduction, heat convection and heat radiation. The vacuum chamber or heat insulation material of the heat insulation member 1000 can block the heat convection and heat conduction of the air, and the reflective layer 1040 of the heat insulation member 1000 can reflect infrared radiation, thus weakening the path of heat radiation.

[0115] Alternatively, if Figure 1 As shown, the electronic device 10 further includes an adhesive layer 1200 and a battery 1300 , and the adhesive layer 1200 connects the second temperature homogenizing plate 800 and the frame 300 .

[0116] Optionally, the first temperature vapor chamber 700 is a vacuum chamber temperature vapor chamber.

[0117] Optionally, the second temperature homogenizing plate 800 is a vacuum chamber temperature homogenizing plate.

[0118] Optionally, Figure 4 In the figure, the arrow at the capillary structure indicates the direction of liquid reflux, the arrow at the channel indicates the direction of steam flow, and the arrows at the first connecting plate and the second connecting plate indicate the direction of heat conduction.

[0119] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0120] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: Battery cover; Screen; A frame body, wherein the frame body is connected between the battery cover and the screen, the screen and the frame body enclose a first cavity, and the frame body and the battery cover enclose a second cavity; A circuit board group is arranged in the second chamber, and functional devices are arranged on the circuit board group; A first temperature averaging plate, disposed in the second chamber, and located between the circuit board assembly and the battery cover; A second temperature-averaging plate, disposed in the first chamber; A heat conducting member, one end of which is connected to the first temperature averaging plate, and the other end of which passes through the frame and is connected to the second temperature averaging plate.

2. The electronic device according to claim 1, characterized in that: The heat conducting member comprises: A first connecting plate connected to the first temperature homogenizing plate; A second connecting plate connected to the second temperature homogenizing plate; A tube body is connected between the first connecting plate and the second connecting plate. A capillary structure and a channel are provided in the tube body. The channel extends from the first connecting plate to the second connecting plate. The capillary structure is arranged around the channel.

3. The electronic device according to claim 1 or 2, characterized in that: There are multiple heat-conducting members, and the multiple heat-conducting members are arranged at intervals around the circuit board group.

4. The electronic device according to claim 1 or 2, characterized in that: Also includes: A heat insulating member is disposed in the second chamber, and the heat insulating member is located between the first temperature averaging plate and the battery cover.

5. The electronic device according to claim 4, characterized in that: A heat insulation cavity is provided in the heat insulation member; The heat insulation cavity is a vacuum cavity, and the heat insulation member is further provided with a degassing pipe, and the degassing pipe is connected to the heat insulation cavity; or A heat insulation material is arranged in the heat insulation cavity.

6. The electronic device according to claim 4, characterized in that: A plurality of convex portions arranged at intervals are provided on a side of the heat insulating member facing the first temperature uniform plate, and the convex portions abut against the first temperature uniform plate.

7. The electronic device according to claim 4, characterized in that: Along the direction from the circuit board group to the first temperature homogenizing plate, the thermal insulation component has a first end surface and a second end surface, and both the first end surface and the second end surface are provided with a reflective layer.

8. The electronic device according to claim 1 or 2, characterized in that: The functional device is arranged on a side of the circuit board group facing the first temperature homogenizing plate.

9. The electronic device according to claim 1 or 2, characterized in that: The circuit board assembly comprises: a first shielding cover; The second shielding cover, A printed circuit board, the functional device is connected to the printed circuit board, the printed circuit board is connected between the first shielding cover and the second shielding cover, and at least a part of the functional device is located between the first shielding cover and the second shielding cover.

10. The electronic device according to claim 1 or 2, characterized in that: Also includes: A heat dissipation film is disposed in the first chamber, and the heat dissipation film is located between the second temperature homogenizing plate and the screen.

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