High-luminous-efficiency LED light source structure and packaging method thereof

Abstract

The invention discloses a high-luminous-efficiency LED light source structure which comprises a substrate, an LED chip is arranged on the substrate, at least two adhesive layer groups are sequentially covered on the LED chip, and each adhesive layer group comprises a low-refractive-index adhesive layer, a high-refractive-index adhesive layer and a fluorescent powder layer which are sequentially laminated and covered from bottom to top. The refractive index of the high-refractive-index adhesive layer is higher than that of the low-refractive-index adhesive layer, and the fluorescent powder emission wavelength of the fluorescent powder layer located in the higher adhesive layer group is shorter. The invention provides the high-luminous-efficiency LED light source structure capable of improving the luminous efficiency and improving the product yield and the packaging method of the high-luminous-efficiency LED light source structure.

Description

Technical Field

[0001] The present invention specifically relates to a high-light-efficiency LED light source structure and a high-light-efficiency LED light source structure packaging method. Background Art

[0002] As a highly efficient, energy-saving and long-life light source, light-emitting diodes (LEDs) have been widely used in various lighting and display applications in recent years. With the continuous advancement of LED technology, the requirements for its important performance indicators such as light efficiency, color quality and reliability are also increasing. Especially in the field of high-brightness LEDs, how to effectively extract the light generated inside the chip and transmit it to the external environment has become one of the key issues in improving LED efficiency. Higher light efficiency requires optimization of packaging materials and structures, reducing the absorption of light by packaging materials, using reflective materials with appropriate reflectivity, and improving the transmittance of packaging glue, which are more effective means; and in order to obtain better color quality, including but not limited to improving the continuity of the spectrum, designing a more uniform light output effect, and simpler spectrum adjustment capabilities; higher reliability requires simple and easy-to-control sealing materials and good packaging process stability.

[0003] However, currently LED packaging generally uses a simple phosphor mixed glue to directly coat the chip, especially in full-spectrum light sources with higher light color requirements, often using three or even more phosphors, and the differences between different phosphors lead to serious reabsorption and scattering problems between them, which greatly affects the improvement of light efficiency and production yield of light sources.

[0004] The present invention is just produced based on the above-mentioned shortcomings. Summary of the invention

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a high-efficiency LED light source structure capable of improving light efficiency and product yield, and a packaging method for the high-efficiency LED light source structure.

[0006] The present invention is achieved through the following technical solutions:

[0007] The present invention provides a high-light-efficiency LED light source structure, comprising a substrate, an LED chip being arranged on the substrate, at least two adhesive layer groups being sequentially covered above the LED chip, each adhesive layer group comprising a low-refractive-index adhesive layer, a high-refractive-index adhesive layer, and a phosphor layer sequentially stacked and covered from bottom to top, the refractive index of the high-refractive-index adhesive layer being higher than the refractive index of the low-refractive-index adhesive layer, and the phosphor emission wavelength of the phosphor layer located in a higher adhesive layer group is shorter.

[0008] In the high-light-efficiency LED light source structure as described above, a high-reflection white glue layer is arranged on the substrate, and the high-reflection white glue layer is at least arranged around the LED chip.

[0009] In the high-light-efficiency LED light source structure described above, the refractive index of the high-refractive-index adhesive layer is higher than or equal to 1.55, and the refractive index of the low-refractive-index adhesive layer is lower than or equal to 1.42.

[0010] In the high-light-efficiency LED light source structure as described above, the adhesive layer group is provided with two or three layers.

[0011] In the high-light-efficiency LED light source structure as described above, a low-refractive-index surface adhesive layer is covered on the adhesive layer group located on the top layer.

[0012] In the high-efficiency LED light source structure as described above, in each adhesive layer group, the phosphor layer is sprayed on the upper surface of the high-refractive index adhesive layer by a powder spraying process, thereby forming a rough and uneven interface between the high-refractive index adhesive layer and the phosphor layer.

[0013] The present invention also provides a method for packaging a high-light-efficiency LED light source structure, which is used to package a high-light-efficiency LED light source structure according to claim 1, and comprises the following steps:

[0014] S1. Arrange LED chips on a substrate;

[0015] S2. Set a layer of highly reflective white glue around the LED chip;

[0016] S3, disposing a first low refractive index adhesive layer above the substrate;

[0017] S4, providing a first high refractive index adhesive layer on the first low refractive index adhesive layer;

[0018] S5, spraying powder to form a first phosphor layer on the first high refractive index glue layer, and forming a rough non-flat surface on the upper surface of the first high refractive index glue layer by spraying the first phosphor layer;

[0019] S6, disposing a second low refractive index adhesive layer on the first phosphor layer;

[0020] S7, providing a second high refractive index adhesive layer covering the second low refractive index adhesive layer;

[0021] S8, spraying powder to form a second phosphor layer on the second high refractive index glue layer, and forming a rough non-flat surface on the upper surface of the second high refractive index glue layer by spraying the second phosphor layer.

[0022] The high light efficiency LED light source structure packaging method described above, after step S8, further includes the following steps:

[0023] S9, disposing a third low refractive index adhesive layer on the second phosphor layer;

[0024] S10, providing a third high refractive index adhesive layer covering the third low refractive index adhesive layer;

[0025] S11, spraying powder to form a third phosphor layer on the third high refractive index glue layer, and forming a rough non-flat surface on the upper surface of the third high refractive index glue layer by spraying the third phosphor layer.

[0026] The high-light-efficiency LED light source structure packaging method described above, after step S11, further includes the following steps: S12, providing a low-refractive-index surface adhesive layer covering the third phosphor layer.

[0027] The high-light-efficiency LED light source structure packaging method described above, after step S12, further includes the following steps: S13, heating and curing.

[0028] In the high-efficiency LED light source structure packaging method as described above, the first phosphor layer is red phosphor glue, the second phosphor layer is yellow phosphor glue with a shorter emission wavelength than the red phosphor glue, and the third phosphor layer is green phosphor glue with a shorter emission wavelength than the yellow phosphor glue.

[0029] In the high-light-efficiency LED light source structure packaging method described above, in steps S5, S8, and S11, each phosphor layer is made by mixing phosphor with low-refractive-index glue.

[0030] Compared with the prior art, the present invention has the following advantages:

[0031] The LED light source structure of the present invention has a multi-layer structure, which is divided into multiple glue layer groups, each of which includes a low refractive index glue layer, a high refractive index glue layer, and a phosphor layer stacked and covered in sequence from bottom to top. The Fresnel theorem is applied, that is, light is reflected more and refracted less from a light-dense medium to a light-sparse medium. Combined with the flat high refractive index glue / low refractive index glue interface, the light can be reflected upward with a high probability when propagating from top to bottom and emitted from the light source, and the light emitted from bottom to top can be effectively emitted upward at the interface of the high refractive index glue / low refractive index phosphor glue due to the presence of phosphor and uneven interface. Therefore, the light emitted from the LED light source, that is, part of the light that is refracted and reflected and propagates upward, has a higher probability of passing through each glue layer and finally emitting from the top of the light source, thereby greatly improving the light output efficiency of the light source structure. Its packaging process operation difficulty is low, and the production efficiency and product yield of the product are improved. In addition, the wavelength of light emitted by the phosphor becomes shorter and shorter from bottom to top, which effectively suppresses the decrease in light efficiency caused by the secondary absorption of the upward emitted light by the phosphor located in the upper layer, thereby effectively improving the light output efficiency and heat dissipation efficiency of the light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural schematic diagram of a high light efficiency LED light source structure of the present invention;

[0033] Figure 2 It is a schematic diagram of the principle of the high light efficiency LED light source structure of the present invention;

[0034] Figure 3 It is a schematic diagram of the principle of the powder spraying process of the present invention;

[0035] Figure 4 It is a schematic diagram of the principle of the second embodiment. DETAILED DESCRIPTION

[0036] The invention will be further described below in conjunction with the accompanying drawings:

[0037] The directions described in the specification of the present invention, such as "up", "down", "left", "right", "front", "back", etc., are based on the directions of the drawings and are intended to facilitate the description of the relationship between the various components. They do not indicate the unique or absolute positional relationship between the various components. They are only one of the implementation methods of the invention and are not a limitation on its implementation method.

[0038] Embodiment 1

[0039] The present invention provides a high light efficiency LED light source structure, such as Figure 1 As shown, it includes a substrate, an LED chip 2 is arranged on the substrate 1, and at least two adhesive layer groups 3 are sequentially covered on the LED chip 2, each adhesive layer group 3 includes a low refractive index adhesive layer 31, a high refractive index adhesive layer 32, and a phosphor layer 33 stacked and covered in sequence from bottom to top, the refractive index of the high refractive index adhesive layer 32 is higher than the refractive index of the low refractive index adhesive layer 31, and the phosphor emission wavelength of the phosphor layer 33 located in the higher adhesive layer group 3 is shorter. In this embodiment, three adhesive layer groups 3 are arranged, and the first adhesive layer group 3 includes The first low refractive index glue layer 31a, the first high refractive index glue layer 32a, and the first phosphor layer 33a are sequentially covered upwards, the second glue layer group 3 includes the second low refractive index glue layer 31b, the second high refractive index glue layer 32b, and the second phosphor layer 33b, which are sequentially covered from bottom to top, and the third glue layer group 3 includes the third low refractive index glue layer 31c, the third high refractive index glue layer 32c, and the third phosphor layer 33c, which are sequentially covered from bottom to top. In practical applications, two glue layer groups 3 can be set, or more than three glue layer groups 3 can be set. Among them, the refractive index of the high refractive index glue layer 32 is higher than or equal to 1.55, and the refractive index of the low refractive index glue layer 31 is lower than or equal to 1.42. The refractive index difference between the adjacent low refractive index glue and high refractive index glue is maintained to improve the reflection ability of the interface between the two.

[0040] As a preferred solution, Figure 1 and Figure 2 As shown, a high-reflective white glue layer 5 is arranged on the substrate 1 , and the high-reflective white glue layer 5 is at least arranged around the LED chip 2 .

[0041] As a preferred solution, Figure 1 and Figure 2 As shown, a low-refractive-index surface adhesive layer 4 is covered on the adhesive layer group 3 located on the top layer.

[0042] Working principle: Figure 2 As shown, after the light is emitted from the LED chip 2 and extracted to the first low refractive index glue layer 31a, because the first high refractive index glue layer 32a is located above the layer, and its refractive index is not less than 1.55, there is a large refractive index difference between the two layers of materials. According to the Fresnel theorem, the light is reflected less and refracted more from the optically sparse medium to the optically dense medium, and most of the light can be directly incident on the first high refractive index glue layer 32a of the upper layer, and the second and third glue layer groups 3 are the same. Specifically, as Figure 2 As shown, the light P2 directly penetrates and emits from the gap between the phosphors, while the light P3 can be incident on the first phosphor layer 33a and then absorbed by the phosphors therein. Here, since the contact surface between the first phosphor layer 33a and the first high-refractive index glue layer 32a is impacted by the phosphors in the powder spraying process to become an uneven interface a1, the refractive index of the interface is changed, which increases the efficiency of light extraction, similar to the LED chip 2 made with a rough surface to improve the efficiency of light output, change the incident angle of the light incident on the interface to within the critical angle, and increase the area that the light actually passes through, thereby improving the light output efficiency. Similarly, substantially the same interfaces b1 and c1 are formed in the second layer glue group 3 and the third layer glue group 3, respectively. In addition, the wavelength of the light emitted by the phosphor becomes shorter and shorter from bottom to top, which effectively suppresses the decrease in light efficiency caused by the secondary absorption of the upwardly emitted light by the phosphors located in the upper layer, thereby effectively improving the light output efficiency and heat dissipation efficiency of the light source.

[0043] The phosphor absorbs the light emitted by the chip, which will cause the phosphor that receives the light to excite various colors of light. The directions of the emitted light include upward and downward directions. Generally, the light propagating upward has a high probability of being emitted in the end, while the light propagating downward will be continuously absorbed and scattered and a large part of it will be consumed. In order to reduce the consumption of light energy and reduce heat accumulation, in the high-efficiency LED light source structure of this embodiment, such as Figure 2As shown, the light P4 propagating upward can directly penetrate the gap between the phosphors and emit. Although the light P6 is reflected by the phosphors on the upper layer, when the reflected light reaches the connection interface between the second high refractive index adhesive layer 32b and the second low refractive index adhesive layer 31b during the downward propagation, according to the Fresnel principle, this part of the light will be reflected from the plane's optically dense medium to the optically sparse medium with a greater probability, and even when the incident angle is large, the light is totally reflected, eventually causing the light P6 propagating downward to be reflected back to propagate upward. Similarly, the same is true for the light P5. Ultimately, more light is controlled in the direction of upward propagation, thereby improving the final light output effect.

[0044] At the same time, in this embodiment, the phosphor layer 33 is sprayed on the upper surface of the high refractive index glue layer 32 through a powder spraying process, thereby forming a rough and uneven interface between the high refractive index glue layer 32 and the phosphor layer 33. Figure 3 As shown, since the phosphor mixed glue is generally a low refractive index glue, when the upward light passes through the first high refractive index glue layer 32a and enters the first phosphor layer 33a, a part of the light is still reflected by the interface between the two layers and propagates downward. Therefore, in this embodiment, the first phosphor layer 33a is sprayed onto the surface of the first high refractive index glue layer 32a through a powder spraying process, and an uneven interface a1 is formed. The uneven interface a1 can effectively suppress the light reflection loss, improve the light extraction efficiency, and increase the probability of the light continuing to propagate upward.

[0045] A highly reflective white glue layer 5 is arranged around the bottom LED chip 2, so that when light is reflected from above, due to the small incident angle of some light, there is a certain probability that it will be refracted from the optically dense medium to the optically sparse medium, and this part of the light can be reflected back through the highly reflective white glue layer 5, such as Figure 2 Light P1.

[0046] This embodiment provides a high-light-efficiency LED light source structure packaging method, which is used to package the above-mentioned high-light-efficiency LED light source structure, including the following steps:

[0047] S1. LED chip 2 is arranged on substrate 1. In this step, a packaging substrate is prepared. It is best to use an insulating ceramic substrate with high thermal conductivity. Then, an electrode 21 with a size no larger than the chip by no more than 100um is arranged on the ceramic substrate. The thickness of electrode 21 is not less than 50um. Eutectic process is preferably used. Eutectic process has two inherent advantages. One advantage is that the electrode has good thermal conductivity and low void rate. The second advantage is that the electrode has less tin overflow. Unlike the traditional silver glue, a lot of solder paste will not overflow from the side. The overflowed large amount of solder paste will not only affect the light output but also may overflow to the outside of the electrode and affect the setting of the high-reflective white glue layer 5 behind.

[0048] S2. Set a layer of high-reflective white glue layer 5 around the LED chip 2. In this step, apply high-reflective white glue in the gap between the electrodes 21 to form a high-reflective white glue layer 5. The high-reflective white glue can be sprayed, dispensed, etc. For electrodes 21 with a thickness of less than 50um, spraying is preferred. For thicker electrodes 21, the electrodes 21 are generally spaced larger, so dispense is preferred. Since the high-reflective white glue has good fluidity and is generally thin, in this step and subsequent steps, the sample needs to be kept level as much as possible, so that it is not easy to cause glue creeping and poor glue flatness.

[0049] S3, a first low-refractive index glue layer 31a is arranged on the substrate 1. In this step and the subsequent steps, the same fixture is preferably used to ensure the surface flatness and levelness of each glue layer. In this step, the first low-refractive index glue layer 31a is made by glue dispensing. In order to ensure that the colloid has good fluidity, the required indicator is that the viscosity does not exceed 4000mPa·s. At the same time, in order to better level the colloid, it can be heated at a low temperature of 40-60℃ for 5-20min to reduce the viscosity of the colloid. In addition, in order to ensure that the colloid surface is 50um higher than the chip, it is best not to exceed 150um. If it is too thin, the flatness of the colloid is poor. If it is too thick, the heat dissipation of the phosphor is poor and the subsequent steps are difficult to operate. After the colloid is leveled, the colloid can be basically cured. The curing process is heating at 120-160℃ for 20-40min to ensure that the colloid has formed a stable plane.

[0050] S4, a first high refractive index glue layer 32a is provided on top of the first low refractive index glue layer 31a. In this step, a high refractive index glue is applied on the plane low refractive index glue. The thickness of the high refractive index glue is in the range of 100um-300um. The viscosity of the high refractive index glue should not be too high, otherwise it will not be easy to level. The viscosity can be set to not exceed 4000mPa·s, and low temperature heating is used to accelerate leveling at the beginning. After leveling, medium temperature heating is required to increase the viscosity to facilitate the subsequent powder spraying. The heating condition is set at 90-110℃ and heated for 6-20min. The colloid is not completely cured and has a certain fluidity.

[0051] S5, spraying powder on the first high refractive index glue layer 32a to set the first phosphor layer 33a. In this step, spraying powder is performed on the first high refractive index glue layer 32a that has become sticky. The long-wavelength red phosphor is sprayed. The phosphor needs to be mixed with glue. The mixed glue is low-refractive index glue. The powder is sprayed at a higher speed, generally not less than 100 cm / s. The purpose is to increase the powder spraying speed to give the phosphor greater kinetic energy, so that it can be sprayed onto the surface of the high-viscosity first high refractive index glue layer 32a and form an uneven surface. Interface a1, since the phosphor mixed glue is a low refractive index glue, and the equivalent refractive index of the glue is slightly increased after mixing with the phosphor, combined with the uneven interface a1, the light reflection loss is suppressed, and the light extraction efficiency is improved. When the light enters the interface between the phosphor and the first high refractive index glue layer 32a from the first high refractive index glue layer 32a, most of the light can be directly injected, and a small part is injected after being reflected at the rough interface a1, so that the light can be transmitted from the first high refractive index glue layer 32a to the second low refractive index glue layer 31b without hindrance;

[0052] S6, disposing a second low refractive index adhesive layer 31b on the first phosphor layer 33a. The operation principle and subdivision steps are the same as those of step S3, and will not be described in detail.

[0053] S7, a second high refractive index adhesive layer 32b is provided on the second low refractive index adhesive layer 31b to cover the second low refractive index adhesive layer 31b. The operation principle and subdivision steps are the same as those of step S4 and will not be described in detail.

[0054] S8, spraying powder on the second high refractive index glue layer 32b to form a second phosphor layer 33b. The operation principle and subdivision steps are the same as those of step S5, except that in this step, medium wavelength yellow phosphor is sprayed;

[0055] When the manufactured high-light-efficiency LED light source structure has only two adhesive layer groups 3, it is only necessary to complete step S8. For optimization, the following steps S12 and S13 may be added. When the manufactured high-light-efficiency LED light source structure has three adhesive layer groups 3, the following steps are also required:

[0056] S9, disposing a third low refractive index adhesive layer 31c on the second phosphor layer 33b. The operation principle and subdivision steps are the same as those of step S3, and will not be described in detail.

[0057] S10, a third high refractive index adhesive layer 32c is provided on the third low refractive index adhesive layer 31c to cover the third low refractive index adhesive layer 31c. The operation principle and subdivided steps are the same as those of step S4 and will not be described in detail.

[0058] S11, spray powder on the third high refractive index glue layer 32c to form a third phosphor layer 33c. The operation principle and subdivision steps are the same as those of step S5, except that short-wavelength green phosphor is sprayed in this step;

[0059] S12, a low-refractive-index surface glue layer 4 is provided on the third phosphor layer 33c, and a low-refractive-index surface glue is applied to form a low-refractive-index surface glue layer 4. It is preferred that the surface glue is formed into a convex shape to avoid the problem of up and down back and forth reflection caused by the high and low refractive-index silicone plane interface. In detail, if the surface of the low-refractive-index surface glue layer 4 is horizontal and flat, and the interface where the glue layer below it intersects with it is also flat, it is easy to form back and forth total reflection, and the slight convexity can change the incident angle of light at each interface; of course, it is also possible if the surface glue is not convex, but the convex shape is better;

[0060] S13, heating and curing, and finally baking and heating to cure each adhesive layer.

[0061] In detail, the first phosphor layer 33a is red phosphor glue, that is, the form of phosphor mixed glue. Similarly, the second phosphor layer 33b is yellow phosphor glue with a shorter emission wavelength than the red phosphor glue, and the third phosphor layer 33c is green phosphor glue with a shorter emission wavelength than the yellow phosphor glue.

[0062] Embodiment 2

[0063] In this embodiment, the process method of the first embodiment is still used, the difference is that the process method of the first embodiment is applied to the COB dual-color packaging structure, such as Figure 4 As shown, this packaging structure includes a substrate P1, a solder pad P2 is provided on the substrate P1, and a cold white chip P3 and a warm white chip P4 are arranged on the substrate P1. The area where the chips are arranged is the light source area. Red phosphor glue P5 is first sprayed at the position of each warm white chip P4, and then yellow phosphor glue P6 is sprayed in the entire light source area. Finally, green phosphor glue is sprayed in the light source area in sequence as needed. Preferably, a dam rubber ring P7 can be set at the edge of the light source area. Through this arrangement, combined with the control of the upward emitting light and the downward reflected light by the aforementioned high and low refractive index glue setting, the light excited by each phosphor layer is basically not affected by other phosphor layers. It is reflected in the light output of the LED light source that the green, yellow, red and other spectral compositions can be finely controlled, thereby realizing various pre-designed light output spectrum compositions, solving the current problem of COB two-color control difficulties; preventing the current mixed powder and traditional powder spraying processes from changing the phosphor ratio due to reabsorption between phosphors and making it difficult to accurately control the light output spectrum.

[0064] The above is only an embodiment of the present invention, and the common knowledge such as the known specific structure and characteristics in the scheme is not described in detail here. It should be pointed out that for those skilled in the art, several deformations and improvements can be made without departing from the structure of the present invention, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A high light efficiency LED light source structure, characterized in that: The invention comprises a substrate, wherein an LED chip (2) is arranged on the substrate (1), and at least two adhesive layer groups (3) are sequentially covered on the top of the LED chip (2), each adhesive layer group (3) comprising a low-refractive index adhesive layer (31), a high-refractive index adhesive layer (32), and a phosphor layer (33) sequentially stacked from bottom to top, the refractive index of the high-refractive index adhesive layer (32) being higher than the refractive index of the low-refractive index adhesive layer (31), and the phosphor emission wavelength of the phosphor layer (33) located in a higher adhesive layer group (3) is shorter.

2. The high light efficiency LED light source structure according to claim 1, characterized in that: A high-reflective white glue layer (5) is provided on the substrate (1), and the high-reflective white glue layer (5) is at least provided around the LED chip (2).

3. The high light efficiency LED light source structure according to claim 1, characterized in that: The refractive index of the high-refractive-index adhesive layer (32) is greater than or equal to 1.55, and the refractive index of the low-refractive-index adhesive layer (31) is less than or equal to 1.

42.

4. The high light efficiency LED light source structure according to claim 1, characterized in that: The adhesive layer group (3) is provided with two layers or three layers.

5. The high light efficiency LED light source structure according to claim 1, characterized in that: A low-refractive-index surface adhesive layer (4) is covered on the adhesive layer group (3) located on the top layer.

6. The high light efficiency LED light source structure according to claim 1, characterized in that: In each adhesive layer group (3), the phosphor layer (33) is sprayed onto the upper surface of the high refractive index adhesive layer (32) by a powder spraying process, thereby forming a rough non-flat interface between the high refractive index adhesive layer (32) and the phosphor layer (33).

7. A method for packaging a high-light-efficiency LED light source structure, the method being used to package a high-light-efficiency LED light source structure according to claim 1, characterized in that: The following steps are involved: S1, arranging an LED chip (2) on a substrate (1); S2, disposing a layer of highly reflective white glue (5) around the LED chip (2); S3, disposing a first low-refractive-index adhesive layer (31a) above the substrate (1); S4, disposing a first high refractive index adhesive layer (32a) on the first low refractive index adhesive layer (31a) to cover the first low refractive index adhesive layer (31a); S5, spraying powder to form a first phosphor layer (33a) above the first high-refractive index glue layer (32a), and forming a rough non-flat surface on the upper surface of the first high-refractive index glue layer (32a) by spraying the first phosphor layer (33a); S6, disposing a second low refractive index adhesive layer (31b) above the first phosphor layer (33a); S7, disposing a second high refractive index adhesive layer (32b) on the second low refractive index adhesive layer (31b) to cover the second low refractive index adhesive layer (31b); S8, spraying powder to form a second phosphor layer (33b) above the second high refractive index glue layer (32b), and forming a rough non-flat surface on the upper surface of the second high refractive index glue layer (32b) by spraying the second phosphor layer (33b).

8. The high light efficiency LED light source structure packaging method according to claim 7, characterized in that: After step S8, the following steps are also included: S9, disposing a third low refractive index adhesive layer (31c) above the second phosphor layer (33b); S10, providing a third high refractive index adhesive layer (32c) on the third low refractive index adhesive layer (31c) to cover the third low refractive index adhesive layer (31c); S11, spraying powder to form a third phosphor layer (33c) above the third high refractive index glue layer (32c), and forming a rough non-flat surface on the upper surface of the third high refractive index glue layer (32c) by spraying the third phosphor layer (33c).

9. The high light efficiency LED light source structure packaging method according to claim 7, characterized in that: After step S11, the following steps are also included: S12, a low refractive index surface adhesive layer (4) is provided on top of the third phosphor layer (33c) to cover it. S13, heating and curing.

10. The high light efficiency LED light source structure packaging method according to claim 7, characterized in that: In steps S5, S8 and S11, each phosphor layer (33) is made by mixing phosphor with low refractive index glue.

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