Thermoelectric separation LED module and manufacturing method thereof

Abstract

The application discloses a thermoelectric separation LED device module and a manufacturing method thereof. The thermoelectric separation LED device module comprises a heat sink, an insulating layer, a PCB and an LED device. The top surface of the heat sink is provided with a groove for embedding the lower part of the PCB, and the bottom surface is provided with a plurality of heat dissipation fins. The groove is in the shape of a Chinese character 'kua' at one end and is provided with parallel first and second groove sections. The PCB is provided with a connecting part between the first and second groove sections. The LED device comprises a substrate mounted on the heat sink. The substrate is provided with an external pad, a light-emitting layer and a light conversion layer from bottom to top. A light blocking layer surrounds the side surfaces of the light-emitting layer and the light conversion layer. The end of the external pad away from the light-emitting layer abuts against the lower surface of the connecting part. The connecting part is provided with two conductive through holes, and the external pad can close the bottom of the two conductive through holes. The insulating layer surrounds the side surface of the substrate. The manufacturing method of the thermoelectric separation LED device module is simple, can realize the thermoelectric separation of the LED device and the PCB and has good heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of LED, and particularly relates to a thermoelectrically separated LED module and a manufacturing method thereof. BACKGROUND

[0002] At present, the electric connection mode of the existing high-power LED module is one of the lead bonding modes, which connects the lead from the LED lead bonding pad to the PCB pad. This mode requires high-precision bonding equipment and high-reliability wire arcs, which greatly limits the mass production and use of the LED module. Another mode is the soldering mode, which connects the LED bottom pad and the PCB electric pad with solder paste to realize conduction. However, the heat and electricity conduction are both through the solder paste layer. In the long-term use process, the solder paste layer is prone to cracking or even breaking.

[0003] Among them, the high-power ceramic LED has large heat, and its heat dissipation restricts the lumen maintenance rate of the LED under the thermal state. The high-power ceramic LED adopts separate heat dissipation and is electrically interconnected with the PCB only through external connection. For this thermoelectrically separated module, the electric connection between the PCB and the LED usually adopts the lead bonding mode. However, the lead bonding of the high-power LED requires high reliability of the bonding equipment and the wire arc, which is not convenient for production. In addition, the existing high-power LED module usually takes the PCB as a heat dissipation and circuit conduction carrier, and the LED lamp beads as a heat source are welded on the PCB. The PCB is usually made of FR-4 and other materials with poor heat dissipation performance. The heat emitted by the LED is difficult to be conducted away through the PCB in a heat transfer mode, and the heat dissipation effect is poor, which causes the heat to gather at the LED and leads to light decay or even dead lamp of the LED.

[0004] Therefore, a new technology is needed to solve the problems of the LED module in the prior art, such as inconvenience in production and poor heat dissipation effect. SUMMARY

[0005] To solve the above problems in the prior art, the present application provides a thermoelectrically separated LED module and a manufacturing method thereof, which can realize the separate connection of the PCB and the LED heat source, avoid the lead bonding between the PCB and the LED pad, thereby avoiding the risk of bonding failure such as line collapse or line breakage, shorten the heat conduction path of the LED heat source, greatly reduce the heat accumulation of the LED, and have simple structure and are convenient for production.

[0006] The present application adopts the following technical solutions:

[0007] A thermoelectrically separated LED module, comprising a heat sink, a PCB and an LED device, wherein the top surface of the heat sink is provided with a groove for embedding the lower part of the PCB, and the bottom surface is provided with a plurality of heat dissipation fins at intervals.

[0008] One end of the PCB is horizontally provided with a connecting portion, a horizontal section of the groove is in the shape of a Chinese character "Kou" at the end, the groove is provided with a first groove segment and a second groove segment which are parallel to each other at the end, and the connecting portion is located between the first groove segment and the second groove segment and above the heat sink.

[0009] The LED device is mounted on a top surface of the heat sink and one end thereof is located below the connecting portion, the LED device comprises a substrate and a light emitting layer, a light conversion layer and a light blocking layer which are arranged on a top portion of the substrate, the light emitting layer is arranged at an end of the substrate which is away from the PCB, the light conversion layer is arranged above the light emitting layer, and the light blocking layer is annularly arranged around the light emitting layer and the light conversion layer.

[0010] An external pad is further arranged on the upper surface of the substrate, an end of the external pad which is away from the light emitting layer is in abutment with a lower surface of the connecting portion, two conductive through holes are vertically arranged on the connecting portion, and an upper surface of the external pad can close bottom openings of the two conductive through holes.

[0011] An insulating layer is further arranged around the substrate.

[0012] As a further improvement of the technical scheme of the present application, a gap is arranged between a side of the light blocking layer which is close to the boss and a side surface of the boss.

[0013] As a further improvement of the technical scheme of the present application, a bottom pad is arranged on a bottom surface of the substrate.

[0014] As a further improvement of the technical scheme of the present application, an adhesive layer is further arranged between the bottom pad and the heat sink, and the adhesive layer is used to fix the substrate and the heat sink.

[0015] As a further improvement of the technical scheme of the present application, the heat sink has a first end and a second end which are oppositely arranged, the LED is located between the groove and an edge of the second end, and a side of the insulating layer which is away from the PCB has a spacing from the edge of the second end.

[0016] As a further improvement of the technical scheme of the present application, a first convex portion and a second convex portion are arranged on the PCB in sequence and correspond to the first groove segment and the second groove segment, upper surfaces of the first convex portion, the connecting portion and the second convex portion are flush with a top surface of the PCB, lower surfaces of the first convex portion and the second convex portion are flush with a bottom surface of the PCB, a lower portion of the first convex portion is embedded in the first groove segment, and a lower portion of the second convex portion is embedded in the second groove segment, and the first convex portion, the connecting portion and the second convex portion are connected in sequence to form a " " type structure which is open downward.

[0017] As a further improvement of the technical scheme of the present application, the groove bottom is provided with a first protruding column and a second protruding column at intervals, and the PCB is provided with a first limiting hole and a second limiting hole corresponding to the first protruding column and the second protruding column.

[0018] As a further improvement of the technical scheme of the present application, the heat sink is further provided with a first mounting hole between the first protruding column and the second protruding column, and the PCB is provided with a second mounting hole coaxial with the first mounting hole; the first protruding column is located on one side of the first mounting hole close to the first end, and the second protruding column is located on one side of the first mounting hole close to the second end.

[0019] The heat dissipation fins are distributed on both sides of the first mounting hole.

[0020] As a further improvement of the technical scheme of the present application, the heat sink is further provided with a first positioning hole and a second positioning hole, and the first positioning hole and the second positioning hole are located on both sides of the LED device close to the second end, and the center line of the light-emitting layer coincides with the center line of the first positioning hole and the second positioning hole.

[0021] A manufacturing method of a thermoelectrically separated LED module, for manufacturing the thermoelectrically separated LED module as described above, comprising the following steps:

[0022] S1. The LED device is first fixed by SMT die bonding, and then the LED device is fixed on the top surface of the heat sink by heat-conducting glue;

[0023] S2. The insulating layer is formed by surrounding the LED device with insulating glue;

[0024] S3. The PCB is placed in the groove of the heat sink, and then the PCB is pressed down to make the bottom surface of the PCB tightly attached to the groove bottom, and the lower surface of the connecting part is tightly attached to the upper surface of the external pad of the LED device;

[0025] S4. The conductive via holes of the PCB are filled with tin paste by dispensing or spraying, and then the LED device and the PCB are connected by reflow soldering, so that the LED device and the PCB are electrically connected.

[0026] Compared with the prior art, the present application has the following advantages:

[0027] This solution features a thermoelectrically separated LED module. The PCB board is electrically connected to the LED through conductive vias on the connecting part, enabling a separate connection between the PCB board and the LED device's heat source. This avoids the wire bonding between the PCB board and the LED pads, thus preventing the risk of bonding failure such as wire collapse or breakage. The LED device is directly connected to the heat sink, shortening the heat conduction path of the LED heat source and greatly reducing heat accumulation in the LED. Furthermore, the structure is simple, the manufacturing method is easy, and it is convenient to manufacture. Attached Figure Description

[0028] The technology of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0029] Figure 1 This is a top view of the thermoelectrically separated LED device module of the present invention;

[0030] Figure 2 yes Figure 1 Schematic diagram of section AA;

[0031] Figure 3 yes Figure 2 Enlarged view of a portion of the C-section structure;

[0032] Figure 4 yes Figure 1 Schematic diagram of the cross-section of section BB;

[0033] Figure 5 This is a top view of the PCB board structure of the present invention;

[0034] Figure 6 This is a top view of the radiator structure;

[0035] Figure 7 yes Figure 6 Schematic diagram of section AA;

[0036] Figure 8 This is a top view of LED devices mounted on a heat sink;

[0037] Figure 9 yes Figure 8 Schematic diagram of section AA;

[0038] Figure 10 This is a top view after an insulating barrier has been erected around the LED device;

[0039] Figure 11 yes Figure 10 Schematic diagram of section AA.

[0040] Figure label:

[0041] 1 - heat sink; 11 - heat dissipation fin; 12 - groove; 121 - first groove segment; 122 - second groove segment; 13 - first protrusion; 14 - second protrusion; 15 - first mounting hole; 16 - first end; 17 - second end; 18 - first positioning hole; 19 - second positioning hole; 20 - placement area;

[0042] 2 - PCB board; 21 - connecting part; 211 - conductive through hole; 2111 - copper layer; 22 - first limiting hole; 23 - second limiting hole; 24 - second mounting hole; 25 - FR-4 flat plate; 26 - circuit layer; 27 - solder resist layer; 28 - first protrusion; 29 - second protrusion;

[0043] 3 - LED device; 31 - light conversion layer; 32 - light emitting layer; 33 - light blocking layer; 34 - substrate; 35 - external pad; 36 - bottom pad;

[0044] 4 - adhesion layer;

[0045] 5 - insulation layer. DETAILED DESCRIPTION

[0046] The concept, specific structure and generated technical effects of the present application will be described clearly and completely in combination with the embodiments and the accompanying drawings, so as to fully understand the purpose, scheme and effects of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The same reference signs used in the drawings indicate the same or similar parts.

[0047] It should be noted that, unless otherwise specified, when a certain feature is referred to as being "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. In addition, the up, down, left, right and the like used in the present application are only relative to the mutual position relationship of the components of the present application in the drawings.

[0048] REFERENCE Figures 1 to 11 A thermoelectric separation LED module, comprising a heat sink 1, a PCB board 2 and an LED device 3, the top surface of the heat sink 1 is provided with a groove 12 for embedding the lower part of the PCB board 2, and the bottom surface is provided with a plurality of heat dissipation fins 11 at intervals. The side surface of one end of the PCB board 2 is horizontally provided with a connecting part 21, the horizontal section of the groove 12 at this end is in the shape of a concave, the groove 12 at this end is provided with a first groove segment 121 and a second groove segment 122 which are parallel to each other, and the connecting part 21 is located between the first groove segment 121 and the second groove segment 122 and above the heat sink 1. The top surface of the connecting part 21 is flush with the top surface of the PCB board 2, and the bottom surface is higher than the bottom surface of the PCB board 2.

[0049] The LED device 3 is mounted on the top surface of the heat sink 1 and one end is below the connecting portion 21, the LED device 3 comprises a substrate 34 and a light emitting layer 32, a light conversion layer 31 and a light blocking layer 33 arranged on the top of the substrate 34, the light emitting layer 32 is arranged on the end of the substrate 34 away from the PCB 2, the light conversion layer 31 covers the top of the light emitting layer 32, and the light blocking layer 33 is annularly arranged around the side of the light emitting layer 32 and the light conversion layer 31. The side of the light emitting layer 32 and the lower part of the side of the light conversion layer 31 are wrapped by the light blocking layer 33, and only the top end or top surface of the light conversion layer 31 emits light, wherein the upper end surface of the light conversion layer 31 is higher than the top surface of the PCB 2, and the upper end surface of the light conversion layer 31 is at the highest position of the overall structure, so as to avoid the light being blocked by other parts. The light emitting layer 32 is arranged on the substrate 34, and the substrate 34 of the LED is directly fixed on the heat sink 1, forming a heat dissipation path directly to the heat sink 1, shortening the heat conduction path of the LED heat source, and greatly reducing the heat accumulation of the LED.

[0050] The upper surface of the substrate 34 is further provided with an external pad 35, one end of the external pad 35 away from the light emitting layer 32 is below the connecting portion 21 and abuts against the lower surface of the connecting portion 21. Two conductive vias 211 are vertically arranged on the connecting portion 21, and the two conductive vias 211 are arranged symmetrically and spaced apart on the connecting portion 21, and the upper surface of the external pad 35 can close the bottom openings of the two conductive vias 211, wherein the tin paste is filled in each conductive via 211. The thermoelectrically separated LED module of the present solution further comprises an insulating layer 5, as shown in Figure 10 , the insulating layer 5 surrounds the side of the substrate 34, and the substrate 34 has a spacing with the side of the PCB 2, part of the insulating layer 5 is located between the substrate 34 and the PCB 2, so as to avoid the conduction and leakage of the substrate 34 and the top surface of the heat sink 1. The connecting portion 21 is protruded above the heat sink 1, after the connecting portion 21 is pressed onto the external pad 35 of the LED, the PCB 2 and the LED are welded and fastened by the tin paste, and are electrically connected through the conductive via 211, so as to avoid wire bonding, and the LED is directly fixed on the upper surface of the heat sink 1, realizing the thermoelectric separation of the LED heat source.

[0051] The heat-electricity separated LED module of the present scheme realizes the electrical connection between the PCB 2 and the LED device 3 through the conductive through hole 211 on the connecting part 21, so as to realize the separate connection with the LED heat source. The lead bonding between the PCB and the LED pad is avoided, and the bonding failure risks such as wire collapse or wire breakage are avoided. The electrical connection mode between the PCB 2 and the LED is simplified, the welding is realized through the conventional patch mode, which is beneficial to mass production and the manufacturing of the LED module. The substrate 34 of the LED is directly fixed on the heat sink 1, the heat conduction path of the LED heat source is shortened, and the heat accumulation of the LED is greatly reduced.

[0052] Specifically, the light blocking layer 33 has a gap between the side of the connecting part 21 and the side of the connecting part 21.

[0053] Specifically, the bottom surface of the substrate 34 is provided with a bottom pad 36, referring to Figure 3 The heat-electricity separated LED module of the present scheme further comprises an adhesive layer 4 located between the bottom pad 36 and the heat sink 1, and the adhesive layer 4 is used to fix the substrate 34 and the heat sink 1. The adhesive layer 4 is made of heat-conducting glue, the LED and the heat sink 1 are connected through the heat-conducting glue, and the heat-conducting glue has a high thermal conductivity, including but not limited to 6.5 W / mk and the like.

[0054] Specifically, the heat sink 1 has a first end 16 and a second end 17 arranged opposite to each other, the LED is located between the groove 12 and the edge of the second end 17, and the side of the insulating layer 5 away from the PCB 2 has a spacing with the edge of the second end 17.

[0055] Specifically, the PCB 2 is provided with a first protrusion 28 and a second protrusion 29 corresponding to the first groove section 121 and the second groove section 122 in sequence, referring to Figure 4 The upper surfaces of the first protrusion 28, the connecting part 21 and the second protrusion 29 are flush with the top surface of the PCB 2, the lower surfaces of the first protrusion 28 and the second protrusion 29 are flush with the bottom surface of the PCB 2, the lower part of the first protrusion 28 is embedded in the first groove section 121, and the lower part of the second protrusion 29 is embedded in the second groove section 122. The cross section of the first protrusion, the connecting part and the second protrusion in the vertical direction is a downwardly open V-shaped structure.

[0056] Specifically, the groove 12 is provided with a first protruding column 13 and a second protruding column 14 at intervals. The PCB 2 is provided with a first limiting hole 22 and a second limiting hole 23 corresponding to the first protruding column 13 and the second protruding column 14, respectively. The first limiting hole 22 and the second limiting hole 23 are in interference fit with the first protruding column 13 and the second protruding column 14 of the heat sink 1, respectively. The PCB 2 is connected to the first protruding column 13 and the second protruding column 14 of the heat sink 1 through the first limiting hole 22 and the second limiting hole 23, thereby positioning the PCB 2 and the heat sink 1, and accurately fixing the PCB 2 in the groove 12 of the heat sink 1.

[0057] Specifically, the heat sink 1 is further provided with a first mounting hole 15 between the first protruding column 13 and the second protruding column 14. The PCB 2 is provided with a second mounting hole 24 having the same diameter and coaxial with the first mounting hole 15. The first protruding column 13 is located on one side of the first mounting hole 15 close to the first end 16, and the second protruding column 14 is located on the other side of the first mounting hole 15 close to the second end 17. A plurality of heat dissipation fins 11 are distributed on both sides of the first mounting hole 15. The first mounting hole 15 and the second mounting hole 24 are provided to facilitate mounting and fixing with other structures.

[0058] Specifically, the heat sink 1 has a rectangular shape, and the horizontal cross section of the heat sink 1 is rectangular. The first mounting hole 15 is located at the center of the heat sink 1, and the heat dissipation fins 11 are distributed on both sides of the first mounting hole 15. There is no heat dissipation fin 11 below the first mounting hole 15. The first protruding column 13 and the second protruding column 14 are distributed on both sides of the first mounting hole 15. The first protruding column 13 is located on the left side close to the first end 16, and the second protruding column 14 is located on the right side close to the second end 17. The height of the first protruding column 13 and the second protruding column 14 is not higher than the top surface of the light emitting layer 32 of the LED device 3.

[0059] Specifically, the heat sink 1 is provided with an LED placement area 20 on the upper surface for placing the LED. The left side of the placement area 20 is located between the first groove segment 121 and the second groove segment 122, and the right side is close to the second end 17. The placement area 20 is rectangular, and the area of the placement area 20 is greater than the area of the LED. The PCB 2 and the groove 12 on the heat sink 1 are in clearance fit. The depth of the groove 12 on the heat sink 1 for mounting the PCB 2 is greater than or equal to half the thickness of the PCB 2. The shape of the groove 12 is consistent with the shape of the PCB, and the horizontal dimension is wider than the size of the PCB, so that the PCB 2 can be smoothly mounted in the groove 12.

[0060] Specifically, the heat sink 1 is further provided with a first positioning hole 18 and a second positioning hole 19, both of which are close to the second end 17 and are respectively located on both sides of the LED device 3. The center line of the light-emitting layer 32 coincides with the center lines of the first positioning hole 18 and the second positioning hole 19, and is parallel to the edge of the heat sink 1 at the second end 17. Both the first positioning hole 18 and the second positioning hole 19 can be round holes, or the first positioning hole 18 is a round hole and the second positioning hole 19 is an oval hole. The center lines of the first positioning hole 18 and the second positioning hole 19 coincide and are symmetrically distributed on both sides of the LED placement area 20. The distance between the first positioning hole 18, the second positioning hole 19 and the edge of the heat sink 1 at the second end 17 is equal. When the LED device 3 is attached, the center line of the light-emitting layer 32 coincides with the center lines of the first positioning hole 18 and the second positioning hole 19, so that the positioning of the LED in the placement area 20 of the heat sink 1 can be realized.

[0061] Specifically, the PCB 2 includes an FR-4 flat plate 25, a circuit layer 26 and a solder mask layer 27 arranged in sequence from bottom to top, and the circuit of the PCB 2 is located on the front surface. The solder mask layer 27 covers the circuit layer 26, and the circuit layer 26 and the FR-4 flat plate 25 are laminated. The thickness of the circuit layer 26 is 1 oz, and the material of the solder mask layer 27 is white oil.

[0062] Specifically, the light-emitting layer 32 can be a fluorescent sheet or a fluorescent film, and only the top surface emits light. The composition of the light-blocking layer 33 includes but is not limited to TiO2 powder + silicone mixture and other materials with fluidity and high reflectivity. The plating layer of the external pad 35 and the bottom pad is consistent and can be well soldered with tin paste, and the composition includes but is not limited to nickel-palladium-gold or nickel-gold alloy.

[0063] Specifically, the soldering tin paste of the PCB 2 and the LED is consistent with the circuit on the front surface of the PCB, and both use medium-temperature tin paste. The attachment is realized by the point-tin patch method, and then soldered by one-time reflow soldering. The composition of the tin paste includes but is not limited to Sn3.0Ag0.5Cu or Sn0.7Cu.

[0064] Reference Figures 1 to 11 A method for manufacturing a thermoelectrically separated LED module, which can be used to manufacture the thermoelectrically separated LED module as described above, comprising the following steps:

[0065] S1. First, the LED device 3 is fixed by SMT die bonding, and then the LED device 3 is fixed on the top surface of the heat sink 1 by heat-conducting glue to form an LED heat dissipation path. The bottom surface pad is fixed on the LED placement area 20 of the heat sink 1 by glue bonding, and the glue can use heat-conducting glue with good heat-conducting coefficient. The material of the heat sink 1 is aluminum alloy, and the groove 12 and the first and second protruding columns 13 and 14 can be formed by stamping and casting. Each heat dissipation fin 11 is riveted or welded to the bottom of the heat sink 1. The first mounting hole 15, the first and second positioning holes 18 and 19 can be formed by precise drilling.

[0066] S2. Insulating glue is used to form the insulating layer 5 around the LED device 3 to achieve the insulation of the LED and the PCB board 2, and also to avoid tin paste flowing to the heat sink 1 to cause leakage. After the insulating glue is used to form the insulating layer 5 around the outer connecting pad 35, part of the insulating layer 5 is located in the gap between the substrate 34 and the PCB board 2.

[0067] S3. The PCB board 2 is placed in the groove 12 of the heat sink 1 by suction or mechanical grabbing, and then the PCB board 2 is pressed down or riveted by a pressure head to tightly attach the bottom surface of the PCB board 2 to the groove bottom of the groove 12, and to tightly fasten the PCB board 2 and the first and second protruding columns 13 and 14 of the heat sink 1. At the same time, the lower surface of the connecting part 21 is tightly attached to the upper surface of the outer connecting pad 35 of the LED device 3. The connecting part 21 is in the shape of a right-angle step, the side surface of the connecting part 21 near the second end is perpendicular to the lower surface of the connecting part 21, the connecting part 21 can be formed by a milling groove process, and the perpendicular depth of the connecting part 21 is equal to the sum of the thickness of the LED substrate 34 and the depth of the groove 12, that is, the vertical distance between the lower surface of the connecting part 21 and the lower surface of the PCB is equal to the vertical gap between the upper surface of the LED substrate 34 and the groove bottom 12. The length of the water platform surface of the connecting part 21 is greater than the length of the outer connecting pad 35 of the LED, that is, in the direction perpendicular to the first end 16 and the second end 17, the length of the lower surface of the connecting part 21 is greater than the length of the outer connecting pad 35, and the right side boundary of the connecting part 21 does not contact the LED light blocking layer 33, and the distance between the right side surface of the connecting part 21 and the left side surface of the LED light blocking layer 33 is at least 0.5 mm.

[0068] The bottom surface of each conductive via 211 directly adheres to the LED external pad 35, and the diameter of each conductive via 211 is smaller than the length of the LED external pad 35. The two conductive vias 211 are arranged in a linear type, and the linear structure is parallel to the edge of the second end 17 of the heat sink 1. The leftmost side of the hole wall of each conductive via 211 can be connected to the left boundary of the external pad 35, or the leftmost side of the hole wall of each conductive via 211 is inside the left boundary of the external pad 35. The distance between the rightmost side of the hole wall of the conductive via 211 and the right side of the PCB 2 is greater than 2.5mm. The conductive via 211 is electroplated with a copper layer 2111, and the thickness of the copper layer 2111 is not less than 50um.

[0069] The external pad 35 is pressed by the lower surface of the connecting part 21 on the PCB, and the conductive via 211 is aligned at the external pad 35. The tin is filled in the conductive via 211, and the reflow soldering process is used to realize the electrical connection between the two. In order to avoid the tin paste flowing to the surface of the heat sink 1, a good thixotropy insulating glue is used to surround and block the LED external pad 35 before the PCB 2 is installed on the heat sink 1.

[0070] S4. The tin paste is filled in each conductive via 211 of the PCB by the dispensing method, and the LED device 3 and the PCB 2 are connected by the reflow soldering method or vacuum reflow soldering, so that the LED device 3 and the PCB are electrically connected. The conductive via 211 can be formed by the process of drilling and electroplating copper.

[0071] The other contents of the heat-electricity separated LED module and the manufacturing method thereof are described in the prior art, and will not be repeated here.

[0072] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Any modification, equivalent change and modification of the above embodiment based on the technical essence of the present application, without departing from the technical solution of the present application, are still within the scope of the present application.

Claims

1. A thermoelectrically separated LED module, characterized by: The heat sink is provided with a groove on the top surface for embedding the lower part of the PCB board, and a plurality of heat dissipation fins are provided on the bottom surface at intervals. One end of the PCB board is provided with a connecting part, the horizontal section of the groove is in the shape of a Chinese character "Kou" at this end, the groove is provided with a first groove segment and a second groove segment which are parallel to each other at this end, and the connecting part is located between the first groove segment and the second groove segment and above the heat sink. The LED device is installed on the top surface of the heat sink and one end of the LED device is located below the connecting part, the LED device comprises a substrate and a light-emitting layer, a light conversion layer and a light blocking layer arranged on the top of the substrate, the light-emitting layer is arranged at one end of the substrate away from the PCB board, the light conversion layer is arranged above the light-emitting layer, and the light blocking layer is annularly arranged around the side surface of the light-emitting layer and the light conversion layer. The upper surface of the substrate is further provided with an external pad, one end of the external pad away from the light-emitting layer abuts against the lower surface of the connecting part, two conductive through holes are vertically arranged on the connecting part, and the upper surface of the external pad can close the bottom openings of the two conductive through holes. Further comprising an insulating layer which surrounds the side surface of the substrate.

2. The thermoelectrically separated LED module of claim 1, wherein: The light blocking layer has a gap between one side close to the connecting part and the side surface of the connecting part.

3. The thermoelectrically separated LED module of claim 2, wherein: The bottom surface of the substrate is provided with a bottom pad.

4. The thermoelectrically separated LED module of claim 3, wherein: Further comprising an adhesive layer between the bottom pad and the heat sink, and the adhesive layer is used to fix the substrate and the heat sink.

5. The thermoelectrically separated LED module of claim 4, wherein: The heat sink has a first end and a second end arranged oppositely, the LED is located between the groove and the edge of the second end, and the side of the insulating layer away from the PCB board has a spacing from the edge of the second end.

6. The thermoelectrically separated LED module of claim 4, wherein: The PCB board is provided with a first protrusion and a second protrusion corresponding to the first groove segment and the second groove segment in sequence, the upper surfaces of the first protrusion, the connecting part and the second protrusion are flush with the top surface of the PCB board, the lower surfaces of the first protrusion and the second protrusion are flush with the bottom surface of the PCB board, the lower part of the first protrusion is embedded in the first groove segment, the lower part of the second protrusion is embedded in the second groove segment, and the first protrusion, the connecting part and the second protrusion are connected in sequence to form a "Kou" type structure with an opening downward.

7. The thermoelectrically separated LED module of claim 5, wherein: The groove bottom is provided with a first protruding column and a second protruding column at intervals, and the PCB board is provided with a first limiting hole and a second limiting hole corresponding to the first protruding column and the second protruding column in sequence.

8. The thermoelectrically separated LED module of claim 7, wherein: The heat sink is further provided with a first mounting hole between the first protruding column and the second protruding column, and the PCB board is provided with a second mounting hole with the same diameter and coaxial with the first mounting hole; the first protruding column is located on one side of the first mounting hole close to the first end, and the second protruding column is located on one side of the first mounting hole close to the second end. A plurality of heat dissipation fins are distributed on both sides of the first mounting hole.

9. The thermoelectrically separated LED module of claim 7, wherein: The heat sink is further provided with a first positioning hole and a second positioning hole, the first positioning hole and the second positioning hole are close to the second end and are respectively located on two sides of the LED device, and the center line of the light-emitting layer coincides with the center line of the first positioning hole and the second positioning hole.

10. A method for manufacturing a thermoelectrically separated LED module, for manufacturing a thermoelectrically separated LED module according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: S1. The LED device is fixed by SMT fixed crystal method, and the LED device is fixed on the top surface of the heat sink by heat-conducting glue; S2. The insulating layer is formed by surrounding the periphery of the LED device with insulating glue; S3. The PCB board is placed in the groove of the heat sink, and the bottom surface of the PCB board is attached to the groove bottom by pressing the PCB board downward, and the lower surface of the connecting part is attached to the upper surface of the external pad of the LED device; S4. The tin paste is filled in each conductive via of the PCB board by glue dispensing or glue spraying, and the LED device is connected to the PCB board by reflow soldering, so that the LED device is electrically connected to the PCB board.

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