A miniLED packaging process and a packaging structure

Abstract

The present invention discloses a miniLED packaging process and a packaging structure. The miniLED packaging process includes the following steps: providing a die-bonding substrate, on which miniLED chips are fixedly mounted in an array arrangement; providing a phosphor glue layer for modulating the light-emitting color of the miniLED chips; providing a grid layer, disposing the grid layer on the front surface of the die-bonding substrate, and the mesh holes of the grid layer coincide with the miniLED chips; pressing the phosphor glue layer through the grid layer onto the die-bonding substrate, so that the phosphor glue layer is separated into multiple phosphor units, and the phosphor units are received in the mesh holes of the grid layer and are fixedly attached to the miniLED chips. The technical solution of the present invention aims to improve the display effect and enhance the stability and reliability of the packaging.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly relates to a miniLED packaging process and a packaging structure. Background Art

[0002] In the miniLED packaging process, the application of the fluorescent film realizes high-color gamut and high-brightness light output by uniformly dispersing phosphors in silicone or epoxy resin and covering blue LED chips. However, the existing fluorescent film packaging process still has significant defects: for example, the difference between the curing shrinkage rate of the fluorescent film and the thermal expansion coefficient of the substrate causes surface warping, increasing the surface roughness of the backlight panel and affecting the bonding yield of the touch screen; the color temperature shift caused by phosphor sedimentation and the increase in "haze" caused by interface light scattering reduce the display contrast. Summary of the Invention

[0003] The purpose of the present invention is to provide a miniLED packaging process, aiming to solve some technical problems of the existing fluorescent film packaging process in the background art.

[0004] To achieve this purpose, the present invention adopts the following technical solutions:

[0005] A miniLED packaging process, the miniLED packaging process includes the following steps:

[0006] Provide a die bonding substrate, and the die bonding substrate is fixedly attached with miniLED chips arranged in an array;

[0007] Provide a fluorescent glue layer, and the fluorescent glue layer is used to modulate the light-emitting color of the miniLED chips;

[0008] Provide a grid layer, set the grid layer on the front surface of the die bonding substrate, and the mesh holes of the grid layer coincide with the miniLED chips;

[0009] Press the fluorescent glue layer and the die bonding substrate through the grid layer, so that the fluorescent glue layer is separated into multiple fluorescent units, and the fluorescent units are received in the mesh holes of the grid layer and are fixedly attached to the miniLED chips.

[0010] Preferably, the step of providing a grid layer, setting the grid layer on the front surface of the die bonding substrate, and the mesh holes of the grid layer coincide with the miniLED chips includes:

[0011] Use a 3D printer to process a composite material to obtain a grid structure member with uniform mesh holes, and the center distance between adjacent mesh holes is the same as the center distance between adjacent miniLED chips;

[0012] Shape the grid structure member to obtain the grid layer;

[0013] Coat a composite adhesive on one side of the die bonding substrate, bond the grid layer to the die bonding substrate, and allow the mini LED chip to pass through the mesh holes.

[0014] Preferably, the step of coating a composite adhesive on one side of the die bonding substrate, bonding the grid layer to the die bonding substrate, and allowing the mini LED chip to pass through the mesh holes includes:

[0015] After the mini LED chips are fixedly mounted on the die bonding substrate, coat the composite adhesive on the surface of the die bonding substrate;

[0016] Position it according to the structure and size of the grid layer to ensure the coincidence of the mesh holes and the mini LED chips;

[0017] Heat the die bonding substrate to soften the composite adhesive;

[0018] Press the grid layer and perform UV curing on one side of the grid layer to bond the grid layer to the die bonding substrate.

[0019] Preferably, the step of heating the die bonding substrate to melt the composite adhesive and bond the grid layer to the die bonding substrate includes:

[0020] Continuously heat the die bonding substrate at a temperature of 80 °C to 180 °C for a heating time of 10 s to 100 s to soften the composite adhesive;

[0021] The step of pressing the grid layer and performing UV curing on one side of the grid layer to bond the grid layer to the die bonding substrate includes:

[0022] Use a pressing plate to press the grid layer and the die bonding substrate layer;

[0023] Use light with a wavelength of 365 nm to 405 nm and an intensity of 100 to 1000 mW / cm² to continuously irradiate the grid layer for an irradiation time of 10 s to 200 s to bond the grid layer to the die bonding substrate.

[0024] Preferably, the step of pressing the fluorescent glue layer through the grid layer and the die bonding substrate so that the fluorescent glue layer is separated into multiple fluorescent units, and the fluorescent units are received in the mesh holes of the grid layer and are fixedly attached to the mini LED chips includes:

[0025] Set the fluorescent glue layer above the grid layer;

[0026] Use a preset tool to press the fluorescent glue layer through the grid layer into the mesh holes of the grid layer to obtain a plurality of fluorescent units;

[0027] Cure the fluorescent units so that the fluorescent units are adhesively fixed to the surface of the miniLED chip.

[0028] Preferably, the step of curing the fluorescent units so that the fluorescent units are adhesively fixed to the surface of the miniLED chip includes:

[0029] Continuously irradiate the fluorescent units with light having a wavelength of 365 nm to 405 nm and a light intensity of 100 to 1000 mW / cm² for an irradiation time of 10 s to 200 s so that the fluorescent units are adhesively fixed to the miniLED chip.

[0030] Preferably, it further includes the step of:

[0031] Coat a flexible protective layer above the fluorescent units and the grid layer;

[0032] Perform an embossing treatment on the flexible protective layer to obtain a flexible light guide layer with a light guide structure.

[0033] Preferably, it further includes the step of:

[0034] Adopt a sol-gel process on the surface of the flexible light guide layer formed with a light guide structure to obtain an antioxidant film.

[0035] The present invention also provides a miniLED packaging structure, which is prepared by using any one of the above-mentioned miniLED packaging processes; the miniLED packaging structure includes:

[0036] A die bonding substrate, on which an array of miniLED chips is fixedly mounted;

[0037] A grid layer, which is disposed on the front surface of the die bonding substrate, and the mesh holes of the grid layer coincide with the miniLED chips;

[0038] A plurality of fluorescent units, which are received in the mesh holes of the grid layer and are fixedly attached to the miniLED chips.

[0039] Preferably, the miniLED packaging structure further includes:

[0040] A flexible protective layer, which is disposed above the fluorescent units and the grid layer, and a light guide structure is formed on the upper surface of the flexible protective layer;

[0041] An antioxidant film, which is disposed on the surface of the light guide structure.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] Through the design of the grid layer in the technical solution of the present invention, the fluorescent glue layer is divided into multiple fluorescent units, and it is ensured that the fluorescent glue layer is closely attached to the miniLED chip, thereby reducing the warping phenomenon caused by the difference in the shrinkage of the fluorescent glue layer and the thermal expansion coefficient of the substrate during the curing process, and ensuring the flatness of the surface of the backlight panel.

[0044] The grid layer effectively divides the fluorescent glue layer, avoids the sedimentation of the phosphor powder, ensures the uniform distribution of the fluorescent glue layer, reduces the color temperature shift caused by the sedimentation of the phosphor powder, and thus improves the consistency and stability of the display.

[0045] Furthermore, through the structural design of the grid layer, the fluorescent glue layer can be evenly divided, avoiding thickness non-uniformity, thereby reducing light scattering, reducing the "haze" phenomenon, and improving the display contrast. The fluorescent glue layer is fixed to the miniLED chip by lamination with the grid layer, enhancing the stability of the package and improving the overall reliability of the package. Description of the Drawings

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0047] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have a technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention.

[0048] Figure 1 It is a schematic flow chart of the first embodiment of the miniLED packaging process of the present invention;

[0049] Figure 2 It is a schematic flow chart of the second embodiment of the miniLED packaging process of the present invention;

[0050] Figure 3 For Figure 2 A schematic flow chart of an embodiment of step S33 in

[0051] Figure 4 It is a schematic flow chart of the third embodiment of the miniLED packaging process of the present invention;

[0052] Figure 5 It is a schematic flow chart of the fourth embodiment of the miniLED packaging process of the present invention;

[0053] Figure 6 It is a schematic structural diagram when the fluorescent glue is laminated in the present invention;

[0054] Figure 7 It is a schematic structural diagram of an embodiment of the miniLED packaging structure of the present invention;

[0055] Figure 8 It is a schematic structural diagram of another embodiment of the miniLED packaging structure of the present invention;

[0056] Illustration: 100, miniLED packaging structure; 110, die bonding substrate; 111, substrate; 112, miniLED chip; 120, grid layer; 130, fluorescent glue layer; 131, fluorescent unit; 140, flexible protective layer; 141, light guiding structure; 150, antioxidant film; 20, preset tool. Detailed implementation manners

[0057] To make the technical objectives, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0058] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be an intermediate component present at the same time.

[0059] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation manners.

[0060] The embodiments of the present invention provide a miniLED packaging process.

[0061] First Embodiment:

[0062] Please refer to Figure 1 , which is a schematic flowchart of an embodiment of the miniLED packaging process of the present invention. The miniLED packaging process includes the following steps:

[0063] Step S1: Provide a die-bonding substrate 110, on which an array of miniLED chips 112 is fixedly attached.

[0064] Please refer to Figure 6 and Figure 7 , the die-bonding substrate 110 refers to a substrate 111 carrying the miniLED chips 112. The substrate 111 is usually made of materials with good thermal conductivity and mechanical strength, such as ceramics, silicon, or metal materials. The function of the substrate 111 is to provide stable support for the miniLED chips 112 and ensure that they can be reliably soldered on the substrate 111. The miniLED chips 112 are used as light sources for emitting light or backlight display. The array arrangement ensures the accurate spacing and position between each miniLED chip 112, which is beneficial to the uniformity of the light source and the display effect.

[0065] Step S2: Provide a phosphor glue layer 130, which is used to modulate the light-emitting color of the miniLED chips 112.

[0066] Please continue to refer to Figure 6 , Figure 7 and Figure 8 , the phosphor glue layer 130 is a film or gel made of a colloidal substance containing phosphor powder. The function of the phosphor glue layer 130 is to change the color output by adjusting the wavelength of the blue or violet light emitted by the miniLED chips 112. The phosphor glue layer 130 is made of materials such as silica gel or epoxy resin and uniformly disperses the phosphor powder. After covering the surface of the miniLED chips 112, the phosphor glue layer 130 can convert blue or violet light into light of different colors to meet different display requirements, enhance the color gamut and brightness of the display screen, and optimize the visual effect. Preferably, the phosphor glue layer 130 is gel-like.

[0067] Step S3: Provide a grid layer 120, set the grid layer 120 on the front surface of the die-bonding substrate 110, and make the mesh holes of the grid layer 120 coincide with the miniLED chips 112.

[0068] Please refer to Figure 6 and Figure 7, the grid layer 120 refers to a laminate structure composed of a structure with uniform mesh holes. The grid layer 120 is disposed between the miniLED chip 112 and the fluorescent glue layer 130 to provide physical support, position accuracy, and heat conduction. The grid layer 120 is usually made of a material with appropriate hardness, such as plastic or metal or a composite of metal and plastic, and the grid layer 120 can be precisely manufactured by methods such as three-dimensional printing to ensure the uniformity and accuracy of the mesh holes. The grid layer 120 is arranged on the front side of the die bonding substrate 110, and its mesh holes are precisely aligned with the arrangement of the miniLED chips 112. The position of each mesh hole corresponds to a miniLED chip 112 to ensure that each miniLED chip 112 is closely attached to and reliably supported by the corresponding unit of the fluorescent glue layer 130.

[0069] Step S4, press the fluorescent glue layer 130 and the die bonding substrate 110 through the grid layer 120, so that the fluorescent glue layer 130 is separated into a plurality of fluorescent units 131, and the fluorescent units 131 are received in the mesh holes of the grid layer 120 and are attached and fixed to the miniLED chips 112.

[0070] Please refer to Figure 6 and Figure 7 , pressing means that through the applied mechanical pressure or a squeegee, the fluorescent glue layer 130 is tightly bonded to the die bonding substrate 110 through the mesh holes of the grid layer 120, and the fluorescent glue layer 130 is separated into a plurality of small units under the action of the grid layer 120 to ensure that each fluorescent unit 131 can correspond to a miniLED chip 112. After the fluorescent glue layer 130 is pressed into the mesh holes of the grid layer 120, each fluorescent unit 131 is fixed in the mesh hole and is attached to the corresponding miniLED chip 112. Thereby improving the overall quality of the package. The attachment of the fluorescent glue layer 130 and the miniLED chip 112 ensures that the fluorescent glue layer 130 will not displace or deform during the curing process, guaranteeing the consistency and stability of the light output.

[0071] Therefore, in this embodiment, through the design of the grid layer 120, the fluorescent glue layer 130 is separated into a plurality of fluorescent units 131, and it is ensured that the fluorescent glue layer 130 is closely attached to the miniLED chips 112, thereby reducing the warping phenomenon of the fluorescent glue layer 130 caused by the difference in shrinkage and the thermal expansion coefficient of the substrate 111 during the curing process, and ensuring the flatness of the backlight panel surface. The grid layer 120 effectively separates the fluorescent glue layer 130, avoids the sedimentation of the phosphor powder, ensures the uniform distribution of the fluorescent glue layer 130, reduces the color temperature shift caused by the sedimentation of the phosphor powder, and thereby improves the consistency and stability of the display.

[0072] Furthermore, through the structural design of the grid layer 120, the fluorescent glue layer 130 can be evenly separated, avoiding thickness non-uniformity, thereby reducing light scattering, reducing the "haze" phenomenon, and improving the display contrast. The fluorescent glue layer 130 is fixed to the miniLED chip 112 by pressing through the grid layer 120, enhancing the stability of the package and improving the overall reliability of the package.

[0073] Second Embodiment:

[0074] Please refer to Figure 2 , based on the above first embodiment, the step S3 includes:

[0075] Step S31, using a 3D printer to process the composite material to obtain a grid structure member with uniform mesh holes, and the center distance between adjacent mesh holes is the same as the center distance between adjacent miniLED chips 112;

[0076] It can be understood that in this step, the composite material is processed by 3D printing technology to manufacture a grid structure member. The grid structure member has uniformly distributed mesh holes, and the center distance of each mesh hole is the same as the center distance of the miniLED chip 112. This ensures that the grid structure member can be accurately docked with the miniLED chip 112, guarantees the corresponding relationship between the separated fluorescent glue layer 130 and the chip, and enables each mesh hole to accurately accommodate a fluorescent unit 131. Optionally, the composite material is a mixture of epoxy resin material, alumina, photosensitive material, etc. While playing a supporting role, the grid layer 120 can also improve the heat conduction efficiency.

[0077] Step S32, performing a shaping process on the grid structure member to obtain the grid layer 120;

[0078] In this step, a shaping process is performed on the grid structure member, that is, through methods such as UV curing or cooling, the grid structure member is stably formed to reach the required size and shape, thereby obtaining the final grid layer 120. The shaping process ensures that the size and structure of the grid layer 120 will not be affected by external environment or deformation during the processing, which may affect the subsequent packaging process.

[0079] Step S33, coating a composite glue on one side of the die bonding substrate 110, bonding the grid layer 120 to the die bonding substrate 110, and enabling the miniLED chip 112 to pass through the mesh holes.

[0080] In this step, a composite glue is coated on the surface of the die bonding substrate 110, and then the grid layer 120 is bonded to the die bonding substrate 110. The purpose of coating the composite glue is to ensure that the grid layer 120 is firmly pasted to the surface of the substrate 111, and at the same time, the miniLED chip 112 passes through the mesh holes of the grid layer 120. This process ensures the stable position of the grid layer 120.

[0081] Optionally, the composite glue is a photo-curable glue or a common hot melt glue.

[0082] Based on the above second embodiment, the step S33 includes:

[0083] Step S331, after the mini-LED chip 112 is fixedly mounted on the die bonding substrate 110, coat the composite glue on the surface of the die bonding substrate 110;

[0084] Specifically, the composite glue is a kind of glue that can provide good adhesion. The purpose of coating the composite glue is to provide adhesion for the next bonding of the grid layer 120 and the die bonding substrate 110. Before the mini-LED chip 112 is fixed on the die bonding substrate 110, coating the composite glue can ensure that the grid layer 120 is firmly bonded to the substrate 111 in subsequent operations, avoiding deviation or instability during the pressing process. In this embodiment, the composite glue is a hot melt photo-curable glue.

[0085] Specifically, the composite glue can melt when heated, so that the die bonding substrate 110 and the grid layer 120 are preliminarily bonded. It can be temporarily cured after cooling to provide preliminary bonding strength. Finally, under UV light irradiation, the glue will be finally cured to form a permanent bond.

[0086] It can be understood that when the composite glue is a hot melt glue, since the mini-LED chip 112 is prone to generate heat during operation, it is easy to cause poor thermal stability of the mini-LED packaging structure. If the composite glue is a photo-curable glue, the curing speed of the photo-curable glue is relatively fast, resulting in poor bonding yield between the grid layer 120 and the die bonding substrate 110.

[0087] Optionally, it can also be that before the mini-LED chip 112 is fixedly mounted on the die bonding substrate 110, the composite glue is coated on the surface of the die bonding substrate 110, so as to reduce the contamination of the mini-LED chip 112.

[0088] Step S332, position the grid layer 120 according to its structure and size to ensure that the mesh holes coincide with the mini-LED chips 112;

[0089] It can be understood that the purpose of this step is to ensure that each mesh hole precisely corresponds to a mini-LED chip 112, ensuring the accurate corresponding relationship between each fluorescence unit 131 and the mini-LED chip 112 when the subsequent fluorescence glue layer 130 is separated, and avoiding uneven or unstable distribution of the fluorescence glue layer 130.

[0090] Step S333, heat the die bonding substrate 110 to soften the composite glue;

[0091] It is understandable that the temporarily solidified composite adhesive can better bond with the surface of the grid layer 120 and the die bonding substrate 110 after softening, providing a more reliable bond.

[0092] Step S334: Press the grid layer 120 and perform UV curing on one side of the grid layer 120 to bond the grid layer 120 to the die bonding substrate 110.

[0093] By applying pressure, the grid layer 120 and the die bonding substrate 110 are pressed together to achieve a firm bond. At this time, pressing can ensure a tight fit between the grid layer 120 and the die bonding substrate 110. Through UV light curing, the bond between the grid layer 120 and the substrate 111 becomes stronger. UV curing causes the composite adhesive to undergo a curing reaction by irradiating ultraviolet light of a specific wavelength, enhancing the bond strength and ensuring that the grid layer 120 maintains a stable position throughout the encapsulation process.

[0094] Furthermore, step S333 includes:

[0095] Step S3331: Continuously heat the die bonding substrate 110 at a temperature of 80°C to 180°C for a heating time of 10s to 100s to soften the composite adhesive;

[0096] Specifically, the composite adhesive can be melted by setting a heating plate below the die bonding substrate 110. Or a hot air gun can be used to melt the composite adhesive.

[0097] Step S334 includes:

[0098] Step S3341: Use a pressing plate to press the grid layer 120 and the die bonding substrate 110 layers together;

[0099] Step S3342: Continuously irradiate the grid layer 120 with light having a wavelength of 365nm to 405nm and a light intensity of 100 to 1000 mW / cm² for an irradiation time of 10s to 200s to bond the grid layer 120 to the die bonding substrate 110.

[0100] It is understandable that the composite adhesive after UV curing is converted into an irreversible solid state, so it can show a more stable connection.

[0101] Third Embodiment:

[0102] Based on the above first embodiment or second embodiment, step S4 includes:

[0103] Step S41: Set the fluorescent adhesive layer 130 above the grid layer 120;

[0104] In step S42, use a preset tool 20 to press the fluorescent glue layer 130 through the grid layer 120 into the mesh holes of the grid layer 120 to obtain a plurality of fluorescent units 131;

[0105] In this step, by using a pressing die or a mechanical squeegee, the fluorescent glue layer 130 is pressed into the mesh holes of the grid layer 120. The purpose of this operation is to divide the fluorescent glue layer 130 into multiple small units, each of which can accurately fill a mesh hole, so as to ensure the uniform distribution of the fluorescent units 131 and docking with the miniLED chip 112. When implementing this step, it is necessary to ensure that the pressure is evenly distributed to avoid excessive pressing causing the glue film to overflow or be too thin, affecting the separation effect. This process requires precise control of pressure and position to ensure that each fluorescent unit 131 is completely accommodated in the mesh hole and is in close contact with the grid layer 120 and the miniLED chip 112;

[0106] In step S43, cure the fluorescent units 131 so that the fluorescent units 131 are adhesively fixed to the surface of the miniLED chip 112.

[0107] In this step, the purpose of curing the fluorescent units 131 is to ensure that they are firmly adhered to the surface of the miniLED chip 112 to achieve stable optical performance and effective light emission regulation. The curing process is usually completed by heating or UV curing.

[0108] Specifically, first, it is necessary to ensure that the fluorescent units 131 are evenly distributed and their surfaces are in perfect contact with the miniLED chip 112. Subsequently, curing is carried out by heating or irradiating ultraviolet rays of a specific wavelength. Heating can be carried out in the temperature range of 80°C to 150°C, and the duration is generally 40 seconds to 100 seconds. The specific time and temperature depend on the characteristics of the fluorescent material used.

[0109] Optionally, if UV curing is adopted, an ultraviolet lamp with a corresponding wavelength is used to irradiate the fluorescent units 131, and the irradiation time is controlled so that the photosensitive components in the fluorescent material undergo a curing reaction and form a strong adhesive layer.

[0110] It can be understood that through this curing step, the fluorescent units 131 can be firmly attached to the surface of the miniLED chip 112, ensuring stable light emission for a long time, reducing the problem of uneven light emission that may be caused by poor physical contact, and improving the overall performance and reliability of the display.

[0111] Preferably, step S43 includes:

[0112] Step S431: Continuously irradiate the fluorescent unit 131 with light having a wavelength of 365 nm to 405 nm and a light intensity of 100 to 1000 mW / cm² for 10 s to 200 s, so as to bond and fix the fluorescent unit 131 to the miniLED chip 112.

[0113] It can be understood that adopting UV curing can improve the environmental adaptability and optical performance of the miniLED packaging structure, and ensure the stability of the miniLED packaging structure 100 during long-term use. It can also be understood that both the fluorescent unit 131 and the composite adhesive require UV curing. Therefore, the curing process of the fluorescent unit 131 reduces the equipment cost and realizes the efficient utilization of the equipment.

[0114] Fourth Embodiment:

[0115] Based on any of the above embodiments, the packaging process of the miniLED further includes:

[0116] Step S5: Coat a flexible protective layer 140 above the fluorescent unit 131 and the grid layer 120;

[0117] In this step, it is necessary to coat a flexible protective layer 140 above the fluorescent unit 131 and the grid layer 120. The function of the flexible protective layer 140 is to protect the fluorescent unit 131 and the grid layer 120 from damage by the external environment, such as moisture, dust, mechanical shock, etc. The flexible protective layer 140 is usually made of flexible materials, such as flexible plastic films, polyester films or other transparent polymer materials. During implementation, it should be ensured that the coating is uniform and the coverage is sufficient to protect the entire fluorescent unit 131 and grid layer 120. The coating process can use spraying, coating or other coating methods to ensure the uniformity of the protective layer and avoid bubbles or defects, so as to guarantee the effect in subsequent steps.

[0118] Step S6: Perform an imprinting process on the flexible protective layer 140 to obtain a flexible light guide layer with a light guide structure 141.

[0119] In this step, the flexible protective layer 140 is processed through an imprinting process to form a flexible light guide layer with a light guide structure 141. The purpose of the light guide structure 141 is to guide light and optimize the light output, making its distribution more uniform, thereby enhancing the display effect. The imprinting process usually uses a mold and mechanical pressure to press a specific light guide pattern into the flexible protective layer 140. During implementation, the pattern design of the mold needs to determine the shape and size of the light guide structure 141 according to actual requirements, such as microstructures, optical lenses, or concave-convex surfaces, etc. During the imprinting process, temperature, pressure, and time need to be precisely controlled to ensure the clarity and stability of the light guide pattern. Through this process, the flexible protective layer 140 can not only protect the internal components but also effectively control the light propagation path, enhancing the display effect and brightness uniformity.

[0120] Furthermore, the encapsulation process of the miniLEDs further includes:

[0121] Step 7, on the surface of the flexible light guide layer formed with the light guide structure 141, a sol-gel process is adopted to obtain an antioxidant film 150.

[0122] In this step, an antioxidant film 150 is formed on the surface of the flexible light guide layer through a sol-gel process. The main function of the antioxidant film 150 is to prevent oxygen and moisture in the environment from causing oxidative damage to the materials on the surface of the flexible light guide layer, thereby improving its long-term use stability and durability. It should be noted that during specific implementation, a sol-gel solution needs to be prepared first, which is usually composed of metal oxide precursors (such as silicon dioxide, titanium dioxide, etc.) and solvents (such as alcohols, acids). The sol-gel solution will form a thin film under specific environmental conditions (such as temperature and humidity control).

[0123] During the implementation process, the sol-gel solution is evenly coated on the surface of the flexible light guide layer that has already formed the light guide structure 141. This process can be completed by methods such as spraying, dipping, or spin coating to ensure the uniformity and thickness consistency of the sol-gel coating. After coating, appropriate heat treatment is required, usually in the temperature range of 120°C to 200°C, for baking or drying, so that the solvent in the sol-gel volatilizes and the metal oxide precursor forms a solid antioxidant film 150. This film layer can not only effectively resist oxidation but also improve the wear resistance and corrosion resistance of the light guide layer to a certain extent, further enhancing the reliability and service life of the encapsulation.

[0124] Through this process, the antioxidant film 150 can effectively protect the light guide layer, improve the environmental adaptability and optical performance of the encapsulation, and ensure the stability of the miniLED display during long-term use.

[0125] Please refer to Figure 7 and Figure 8, an embodiment of the present invention also provides a miniLED packaging structure 100, which is obtained by using any one of the above-mentioned miniLED packaging processes; the miniLED packaging structure 100 includes:

[0126] A die bonding substrate 110, on which an array of miniLED chips 112 is fixedly attached;

[0127] A grid layer 120, which is disposed on the front surface of the die bonding substrate 110, and the mesh holes of the grid layer 120 coincide with the miniLED chips 112;

[0128] A plurality of fluorescent units 131, which are received in the mesh holes of the grid layer 120 and are fixedly attached to the miniLED chips 112.

[0129] Specifically, the miniLED packaging structure 100 improves the display effect of the miniLED packaging structure 100 by setting the die bonding substrate 110, the grid layer 120, a plurality of fluorescent units 131 and through the functional cooperation of each feature. First, the die bonding substrate 110 provides stable support and fixation for the miniLED chips 112, so that the entire packaging structure can maintain stability during long-term use, and the arrayed miniLED chips 112 ensure uniform light source distribution and optimize the uniformity of light output. The grid layer 120 ensures precise docking between the fluorescent units 131 and the miniLED chips 112 through precise design, avoiding color temperature deviation or uneven light emission caused by uneven adhesive film, thereby improving the light conversion efficiency and color consistency of the display. At the same time, a plurality of fluorescent units 131 are closely attached to the miniLED chips 112, enhancing the reliability of the packaging structure, reducing light loss, and further improving the stability of the display effect.

[0130] Furthermore, as Figure 8 shown, the miniLED packaging structure 100 further includes:

[0131] A flexible protective layer 140, which is disposed above the fluorescent units 131 and the grid layer 120, and a light guiding structure 141 is formed on the upper surface of the flexible protective layer 140;

[0132] An antioxidant film 150, which is disposed on the surface of the light guiding structure 141.

[0133] Optionally, the cross-section of the light guiding structure 141 is a continuously arranged triangular cross-section. It can be understood that the setting of the light guiding structure 141 can improve the lateral light output effect and improve the display quality of the miniLED.

[0134] It can be understood that the flexible protective layer 140 not only protects the fluorescent unit 131 and the grid layer 120 from the external environment, but also the light guiding structure 141 formed on its surface can effectively guide light, making the light distribution more uniform and further improving the display effect. The addition of the antioxidant film 150 can prevent the corrosion of the light guiding structure 141 by oxygen and moisture, thereby enhancing the durability of the encapsulation structure in high-temperature and humid environments, ensuring the stability of the encapsulation material during long-term use, and avoiding the decline of optical performance caused by oxidation. Through the cooperation of these features, this encapsulation structure not only improves the optical performance but also enhances its ability to resist environmental factors, ensuring the long-term stable operation of the miniLED backlight or display system in complex environments and significantly improving the display quality and service life.

[0135] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A miniLED packaging process, characterized in that: The miniLED packaging process includes the following steps: Providing a die-bonding substrate, on which array-arranged miniLED chips are fixedly mounted; Providing a fluorescent glue layer, wherein the fluorescent glue layer is used to modulate the light emission color of the miniLED chip; Providing a grid layer, disposing the grid layer on the front side of the die-bonding substrate, and the mesh holes of the grid layer overlap with the mini LED chip; The fluorescent glue layer is pressed onto the die-bonding substrate through the grid layer, so that the fluorescent glue layer is divided into a plurality of fluorescent units, and the fluorescent units are accommodated in the meshes of the grid layer and are bonded and fixed to the miniLED chip; The step of providing a grid layer, disposing the grid layer on the front side of the die-bonding substrate, and overlapping the mesh holes of the grid layer with the mini LED chip comprises: Processing the composite material using a 3D printer to obtain a grid structure having uniform meshes, wherein the center distance between adjacent meshes is the same as the center distance between adjacent miniLED chips; Performing shaping processing on the grid structure to obtain the grid layer; Coating a composite adhesive on one side of the die-bonding substrate, bonding the mesh layer to the die-bonding substrate, and passing the miniLED chip through the mesh hole; The step of heating the solid crystal substrate to melt the composite adhesive and bond the grid layer to the solid crystal substrate comprises: Continuously heating the die-bonding substrate at a temperature of 80° C. to 180° C. for a heating time of 10 seconds to 100 seconds to soften the composite adhesive; The step of laminating the grid layer and UV curing one side of the grid layer to bond the grid layer to the die-bonding substrate comprises: Using a pressing plate to press the grid layer and the solid crystal substrate layer; The grid layer is continuously irradiated with light of 365nm~405nm wavelength and 100~1000 mW / cm² light intensity for 10s~200s to bond the grid layer to the solid crystal substrate.

2. The miniLED packaging process according to claim 1, characterized in that: The step of coating a composite adhesive on one side of the die-bonding substrate, bonding the mesh layer to the die-bonding substrate, and passing the miniLED chip through the mesh hole comprises: After the miniLED chip is fixedly mounted on the die-bonding substrate, the composite adhesive is applied to the surface of the die-bonding substrate; Positioning the mesh layer according to its structure and size to ensure that the mesh holes overlap with the miniLED chip; Heating the die-bonding substrate to soften the composite adhesive; The grid layer is pressed, and UV curing is performed on one side of the grid layer to bond the grid layer to the die-bonding substrate.

3. The miniLED packaging process according to claim 1, characterized in that: The step of pressing the fluorescent glue layer to the die-bonding substrate through the grid layer so that the fluorescent glue layer is divided into a plurality of fluorescent units, and the fluorescent units are accommodated in the mesh holes of the grid layer and fixedly bonded to the mini LED chip comprises: Disposing the fluorescent glue layer above the grid layer; Using a preset tool, the fluorescent glue layer is passed through the mesh layer and pressed into the mesh holes of the mesh layer to obtain a plurality of fluorescent units; The fluorescent unit is cured so that the fluorescent unit is bonded and fixed to the surface of the mini LED chip.

4. The miniLED packaging process according to claim 3, characterized in that: The step of curing the fluorescent unit so that the fluorescent unit is bonded and fixed to the surface of the miniLED chip comprises: The fluorescent unit is continuously irradiated with light of a wavelength of 365nm to 405nm and a light intensity of 100 to 1000 mW / cm² for a time of 10s to 200s so that the fluorescent unit is bonded and fixed to the miniLED chip.

5. The miniLED packaging process according to any one of claims 1 to 4, characterized in that: Also includes the steps: Coating a flexible protective layer on the fluorescent unit and the grid layer; The flexible protective layer is subjected to embossing treatment to obtain a flexible light-guiding layer with a light-guiding structure.

6. The miniLED packaging process according to claim 5, characterized in that: Also includes the steps: The surface of the flexible light-guiding layer having the light-guiding structure is subjected to a sol-gel process to obtain an anti-oxidation film.

7. A miniLED packaging structure, characterized in that: The miniLED packaging structure is manufactured by the miniLED packaging process described in any one of claims 1 to 6; the miniLED packaging structure comprises: A die-bonding substrate, on which array-arranged miniLED chips are fixedly mounted; A grid layer, the grid layer is arranged on the front side of the die-bonding substrate, and the mesh holes of the grid layer overlap with the miniLED chip; A plurality of fluorescent units are housed in the meshes of the grid layer and are bonded and fixed to the mini LED chip.

8. The miniLED packaging structure according to claim 7, characterized in that: Also includes: A flexible protective layer, the flexible protective layer is arranged above the fluorescent unit and the grid layer, and a light guide structure is formed on the upper surface of the flexible protective layer; An anti-oxidation film is disposed on the surface of the light-guiding structure.

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