LED packaging structure and LED light-emitting device

Abstract

The utility model provides an LED packaging structure and an LED light-emitting device, and relates to the technical field of LEDs, the LED packaging structure comprises a transparent support, and the transparent support is provided with an accommodating groove; the light-emitting chip is arranged in the containing groove of the transparent support, and the light-emitting chip is in a long strip shape; the fluorescent glue layer covers the light-emitting chip, the fluorescent glue layer is in an oval shape, and the fluorescent glue layer does not make contact with the side wall of the containing groove; and the convex lens layer is arranged on the transparent bracket and covers the accommodating groove. The LED light-emitting device comprises the LED packaging structure. According to the LED packaging structure provided by the utility model, the problems of insufficient light emitting angle and non-uniform light emitting of the LED packaging structure in the prior art are solved.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to an LED packaging structure and an LED light-emitting device. Background Technology

[0002] An LED (Light Emitting Diode) is a solid-state semiconductor device that converts electrical energy into light energy. It boasts advantages such as low power consumption, excellent light-focusing effect, fast response speed, strong controllability, ability to withstand high impacts, long lifespan, and environmental friendliness. LEDs are gradually replacing traditional light sources, becoming the fourth generation of light sources. For LED packaging devices, different packaging structures have a significant impact on LEDs, affecting aspects such as luminous efficiency and emission angle.

[0003] Currently, the commonly used packaged LED chips have a beam angle of around 120°. The smaller the beam angle, the more LED chips are needed for applications such as displays, lighting fixtures, and mobile phones. Furthermore, the light pattern is characterized by strong forward emission and weak lateral emission, resulting in uneven light distribution across different angles. This can lead to situations where a single point emits excessively strong light, making this type of light pattern unsuitable for the application of LED light sources in backlight products. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide an LED packaging structure and an LED light-emitting device, which aims to solve the problems of insufficient light emission angle and uneven light emission in the existing LED packaging structure.

[0005] The LED packaging structure proposed in this utility model includes

[0006] A transparent bracket, wherein the transparent bracket is provided with a receiving groove;

[0007] A light-emitting chip is disposed in the receiving groove of the transparent bracket, and the light-emitting chip is elongated.

[0008] A fluorescent adhesive layer covers the light-emitting chip, the fluorescent adhesive layer is elliptical and does not contact the sidewall of the receiving groove;

[0009] A convex lens layer is disposed on the transparent bracket and covers the receiving groove.

[0010] The aforementioned LED packaging structure, by using a transparent bracket with a receiving groove, allows the light-emitting chip to be placed within the groove and emit light as a light source. Furthermore, by making the bracket transparent, the light source can be emitted from the bracket, increasing the overall emission angle. In addition, since the light-emitting chip is elongated, its brightness along its length is much greater than its brightness along its width. By using an elliptical phosphor layer that does not contact the sidewall of the receiving groove, the angle and brightness of the light emitted from different areas of the chip can be adjusted by modifying the contour of the phosphor layer, thereby improving the brightness along the width of the chip and ensuring the uniformity of brightness across the chip. Furthermore, by using a convex lens layer, the light emitted from the chip is adjusted a second time, further improving the emission angle of the emitted light. Therefore, this invention solves the problems of insufficient light emission angle and uneven light emission in existing LED packaging structures.

[0011] In addition, the LED packaging structure proposed in this utility model may also have the following additional technical features:

[0012] Preferably, the convex lens layer has an arc-shaped side and a horizontal top.

[0013] Preferably, the distance between the outer contour of the fluorescent adhesive layer and the outer contour of the light-emitting chip is less than a preset value.

[0014] Preferably, the refractive index of the fluorescent adhesive layer is less than the refractive index of the convex lens layer.

[0015] Preferably, the refractive index of the fluorescent adhesive layer is 1.48-1.52, and the thixotropic coefficient of the fluorescent adhesive layer is 3-4.

[0016] Preferably, the LED packaging structure further includes a packaging layer for filling the gap between the phosphor layer and the receiving groove, and the top of the packaging layer is flush with the top of the bracket.

[0017] Preferably, the cross-sectional area of ​​the receiving groove gradually increases from the bottom to the top.

[0018] Preferably, the bottom of the bracket is provided with a first conductive part, a second conductive part, and a connecting part connecting the first conductive part and the second conductive part, and the light-emitting chip is connected to the first conductive part and the second conductive part respectively through wires.

[0019] Preferably, the height from the top of the convex lens layer to the top of the bracket is 800um-1000um.

[0020] In addition, this utility model also provides an LED light-emitting device, which includes the above-mentioned LED packaging structure. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the LED packaging structure proposed in the first embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the LED packaging structure proposed in the first embodiment of the present invention after concealing the fluorescent lens layer and the packaging layer;

[0023] Figure 3 This is a cross-sectional schematic diagram of the LED packaging structure proposed in the first embodiment of this utility model;

[0024] Figure 4 This is a schematic diagram of the light emission pattern of an LED packaging structure provided in an embodiment of the present invention.

[0025] Explanation of key component symbols:

[0026] Transparent bracket 10 LED chip 20 Container slot 11 fluorescent adhesive layer 30 Convex lens layer 40 Encapsulation layer 50 First conductive part 60 Second conductive part 70 Connection part 80

[0027] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0028] To facilitate understanding of this utility model, a more complete description of it will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0029] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] Please see Figures 1 to 4The image shows an LED packaging structure in one embodiment of the present invention, including a transparent bracket 10, on which a receiving groove 11 is provided;

[0032] The light-emitting chip 20 is disposed in the receiving groove 11 of the transparent bracket 10, and the light-emitting chip 20 is elongated.

[0033] A fluorescent adhesive layer 30 covers the light-emitting chip 20. The fluorescent adhesive layer 30 is elliptical and does not contact the sidewall of the receiving groove 11.

[0034] A convex lens layer 40 is disposed on the transparent support 10 and covers the receiving groove 11.

[0035] Understandably, by setting a transparent bracket 10 with a receiving groove 11 on it, the light-emitting chip 20 can be placed inside the receiving groove 11 to emit light as a light source. Furthermore, by making the bracket transparent, the light source can be emitted from the bracket, increasing the overall light emission angle. In addition, since the light-emitting chip 20 is elongated, its brightness along its length is much greater than its brightness along its width. By setting an elliptical phosphor layer 30 that does not contact the sidewall of the receiving groove 11, the angle and brightness of the light emitted from different areas of the chip can be adjusted by modifying the outline of the phosphor layer 30, thereby increasing the brightness along the width of the light-emitting chip 20 and ensuring the uniformity of brightness across all parts of the chip. Furthermore, by setting a convex lens layer 40, the light emitted by the chip is adjusted a second time, further improving the light emission angle of the emitted light from the chip 20. Therefore, this invention solves the problems of insufficient light emission angle and uneven light emission in existing LED packaging structures.

[0036] It should be noted that the light transmittance of the transparent bracket 10 is greater than 60%. By setting the transparent bracket 10, the light emitted by the light-emitting chip 20 can be emitted from the side, thereby increasing the light emission angle. In addition, the light transmittance of the transparent bracket 10 is controlled to ensure the light intensity emitted from the light-emitting bracket.

[0037] Specifically, the convex lens layer 40 has an arc-shaped side and a horizontal top. In practice, by setting the top of the convex lens layer 40 to be horizontal, some of the light entering the convex lens layer 40 is reflected to the side of the convex lens layer 40 when it reaches the top, thereby reducing the front light emission intensity and increasing the side light emission intensity to achieve uniform light emission from all angles. Furthermore, through light refraction, the angle of light emission is increased, thus improving the overall light emission angle.

[0038] Furthermore, the distance between the outer contour of the phosphor layer 30 and the outer contour of the light-emitting chip 20 is less than a preset value. In specific implementations, the size of the phosphor layer 30 is adjusted to ensure that the thickness of the phosphor layer 30 on the outer side of the light-emitting chip 20 is consistent, thereby ensuring that the luminous intensity of the light-emitting chip 20 is consistent at all angles after passing through the phosphor layer 30. The emission angle of the light after passing through the phosphor layer 30 is improved by adjusting the curvature and size of the outer contour of the phosphor layer 30. In addition, in specific implementations, fluorescent particles are provided within the phosphor layer 30. By setting different fluorescent particles, the wavelength of the emitted light is adjusted, allowing the LED packaging structure to emit light of different wavelengths as required. Specifically, the material of the fluorescent particles can be one or more excitable materials such as oxynitrides, aluminates, silicates, nitrides, and sulfides.

[0039] Specifically, the refractive index of the fluorescent adhesive layer 30 is lower than that of the convex lens layer 40. In practice, by adjusting the refractive indices of the fluorescent adhesive layer 30 and the convex lens layer 40, the light emitted from the light-emitting chip 20 passes through the two layers with refractive indices increasing from low to high. This causes the light emission angle to be more oblique to the side, thereby indirectly enhancing the light emission intensity on the side. This ensures that the light emission intensity on the side is consistent with that on the front, guaranteeing uniform light emission, and also increases the light emission angle on the side by increasing the light emission intensity on the side.

[0040] Furthermore, the refractive index of the fluorescent adhesive layer 30 is 1.48-1.52, and its thixotropic coefficient is 3-4. In specific implementations, the fluorescent adhesive layer 30 can be made of phenyl vinyl-modified high-thixotropic silicone, which has good molding properties and is easy to adjust. The convex lens layer 40 can be made of vinyl-modified medium-refractive silicone, which has high heat resistance and a high refractive index.

[0041] Specifically, the LED packaging structure also includes a packaging layer 50, which fills the gap between the phosphor layer 30 and the receiving groove 11. The top of the packaging layer 50 is flush with the top of the support. In specific implementations, a convex lens layer 40 can be used to fill the gap between the phosphor layer 30 and the receiving groove 11. Alternatively, the packaging layer 50 can be additionally provided to fill the gap between the phosphor layer 30 and the receiving groove 11. By providing the packaging layer 50, the light emission angle and brightness can be further adjusted to improve the light emission angle and uniformity. Directly filling the gap using the convex lens layer 40 reduces the number of manufacturing steps and improves the production efficiency of the LED packaging structure.

[0042] Furthermore, the cross-sectional area of ​​the receiving groove 11 gradually increases from the bottom to the top. By setting the receiving groove 11 into a conical shape, the light emission angle and brightness emitted from the inside of the receiving groove 11 are further improved, and the light emission from the inside of the receiving groove 11 can be adjusted by multiple layers of silicone, making it easier to adjust the light emission angle and intensity.

[0043] Specifically, the bottom of the bracket is provided with a first conductive part 60, a second conductive part 70, and a connecting part 80 connecting the first conductive part 60 and the second conductive part 70. The light-emitting chip 20 is connected to the first conductive part 60 and the second conductive part 70 respectively through wires. In specific implementation, the first conductive part 60 and the second conductive part 70 are symmetrically arranged about the connecting part 80. The light-emitting chip 20 is fixed in the middle area of ​​the receiving groove 11 and spans across the connecting part 80. It should be noted that the first conductive part 60 and the second conductive part 70 are both silver-plated copper materials, which are conductive materials, while the connecting part 80 is an insulating material, which can be white or transparent plastic. Specifically, in order to fix the positive and negative electrodes of the light-emitting chip 20 to the first conductive part 60 and the second conductive part 70 respectively, solder paste is applied to the corresponding first conductive part 60 and the second conductive part 70 according to the size of the light-emitting chip 20, and the light-emitting chip 20 is pressed on the solder paste. The solder paste is melted by heating to achieve the purpose of soldering, thereby making the light-emitting LED chip conductively connected to the first conductive part 60 and the second conductive part 70 respectively.

[0044] Additionally, the height from the top of the convex lens layer 40 to the top of the support is 800um-1000um. In practical implementation, by controlling the height of the top horizontal plane of the convex lens layer 40, the area of ​​the region where the light emission intensity needs to be reduced at the front light-emitting point can be controlled, thereby adjusting the intensity and emission angle of the light reflected from the front to the side, thus achieving the desired emission angle and intensity conditions.

[0045] In summary, the LED packaging structure in the above embodiments of this utility model, by setting a transparent bracket 10 with a receiving groove 11 on the bracket, allows the light-emitting chip 20 to be placed in the receiving groove 11 to emit light as a light source. Furthermore, by making the bracket transparent, the light source can be emitted from the bracket, increasing the overall light emission angle. In addition, since the light-emitting chip 20 is elongated, its brightness in the length direction is much greater than its brightness in the width direction. By setting an elliptical phosphor layer 30 that does not contact the sidewall of the receiving groove 11, the angle and brightness of the light emitted from different areas of the chip can be adjusted by modifying the outline of the phosphor layer 30, thereby improving the brightness in the width direction of the light-emitting chip 20 and ensuring the uniformity of brightness across all parts of the chip. Furthermore, by setting a convex lens layer 40, the light emitted by the chip is adjusted a second time, further improving the light emission angle of the light emitted by the chip 20. Therefore, this utility model solves the problems of insufficient light emission angle and uneven light emission in existing LED packaging structures.

[0046] In addition, this utility model also provides an LED light-emitting device, which includes the above-mentioned LED packaging structure and a lamp cover disposed on the outside of the lamp bead.

[0047] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0048] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED package structure, characterized in that, include A transparent bracket, wherein the transparent bracket is provided with a receiving groove; A light-emitting chip is disposed in the receiving groove of the transparent bracket, and the light-emitting chip is elongated. A fluorescent adhesive layer covers the light-emitting chip, the fluorescent adhesive layer is elliptical and does not contact the sidewall of the receiving groove; A convex lens layer is disposed on the transparent bracket and covers the receiving groove.

2. The LED package structure of claim 1, wherein, The convex lens layer has an arc-shaped side and a horizontal top.

3. The LED package structure of claim 1, wherein, The distance between the outer contour of the fluorescent adhesive layer and the outer contour of the light-emitting chip is less than a preset value.

4. The LED package structure of claim 1, wherein, The refractive index of the fluorescent adhesive layer is less than that of the convex lens layer.

5. The LED package structure of claim 4, wherein, The refractive index of the fluorescent adhesive layer is 1.48-1.52, and the thixotropic coefficient of the fluorescent adhesive layer is 3-4.

6. The LED package structure of claim 1, wherein, The LED packaging structure further includes a packaging layer, which is used to fill the gap between the phosphor layer and the receiving groove, and the top of the packaging layer is flush with the top of the bracket.

7. The LED package structure of claim 1, wherein, The cross-sectional area of ​​the receiving groove gradually increases from the bottom to the top.

8. The LED package structure of claim 1, wherein, The bottom of the bracket is provided with a first conductive part, a second conductive part, and a connecting part connecting the first conductive part and the second conductive part. The light-emitting chip is connected to the first conductive part and the second conductive part respectively through wires.

9. The LED packaging structure according to claim 2, characterized in that, The height from the top of the convex lens layer to the top of the bracket is 800um-1000um.

10. An LED light-emitting device, characterized in that, Includes the LED packaging structure according to any one of claims 1 to 9.

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