Backlight module, head-up display and motor vehicle

Abstract

The utility model provides a backlight module, a head-up display and a motor vehicle, which have a compact structure and can realize good heat dissipation. The backlight module (100) comprises: a substrate (110) comprising a first side and a second side opposite to the first side; a plurality of light-emitting elements (120) mounted on the first side of the substrate and each having a light-emitting surface (121) that emits light toward the first side of the substrate; a holder part (140) provided on the first side of the substrate and having a plurality of tube parts (142) for accommodating each of the plurality of light-emitting elements; and a light color conversion layer (150) that includes a phosphor, is disposed at least in each of the plurality of tube sections, and covers the light-emitting surface so as to be in contact with the light-emitting surface. Each of the plurality of tube portions opens on the light-emitting surface side, the opening edge of each tube portion is flush with or higher than the light-emitting surface, and the light color conversion layer covers the light-emitting surface and the opening of each tube portion.

Description

Technical Field

[0001] This disclosure relates to a backlight module, a head-up display, and a motor vehicle. Background Technology

[0002] As an important in-vehicle driving assistance device, the head-up display (HUD) projects key driving information onto the windshield in front of the driver, allowing the driver to obtain information without looking down, thereby improving driving safety.

[0003] In recent years, panoramic head-up displays (PHUDs) have begun to attract considerable attention. Compared to ordinary HUDs, such as... Figure 8 As shown, PHUD has a wider display area and richer information content. Because it needs to project information over a larger area and has a stronger requirement to prevent the projected light from being overwhelmed by ambient light, it has extremely high requirements for display brightness.

[0004] As a backlight module for a PHUD, a chip-on-board (COB) solution can be used, where bare blue LED chips are directly mounted on the substrate, with a quantum dot (QD) film configured in the optical path. In this solution, the blue light emitted by the LED (Light-emitting Diode) chip has high energy, generating a significant amount of heat during the color conversion process on the quantum dot film. However, the quantum dot film lacks an effective heat dissipation structure. Therefore, when this solution is applied to a PHUD, the backlight module operates at high power, causing a large amount of heat to accumulate on the quantum dot film. This leads to an increase in the quantum dot film temperature, resulting in reduced color conversion efficiency and color shift, while also posing a risk of ablation.

[0005] Therefore, the heat dissipation capacity of the light color conversion layer has become a bottleneck restricting the achievement of high brightness in PHUD.

[0006] This disclosure provides a new backlight module to solve the above problems. Utility Model Content

[0007] The purpose of this disclosure is to provide a backlight module, a head-up display, and a motor vehicle that have a compact structure and can achieve good heat dissipation.

[0008] In one embodiment of this disclosure, a backlight module is provided, comprising:

[0009] A substrate, comprising a first side and a second side opposite to the first side;

[0010] Multiple light-emitting elements are mounted on a first side of the substrate and each has a light-emitting surface that emits light toward the first side of the substrate;

[0011] The backlight module further includes:

[0012] A support portion, disposed on a first side of the substrate, and having multiple cylindrical portions for accommodating each of the plurality of light-emitting elements; and

[0013] A light-color conversion layer, comprising a phosphor, is disposed at least in each of the plurality of cylindrical portions to cover the light-emitting surface.

[0014] The backlight module according to this disclosure may also have one or more of the following features, individually or in combination.

[0015] In the aforementioned backlight module, the light color conversion layer is configured to contact the light-emitting surface.

[0016] In the aforementioned backlight module, each of the plurality of cylindrical portions has an opening on the light-emitting surface side, and the opening edge of each cylindrical portion is flush with or higher than the light-emitting surface. The light color conversion layer covers the light-emitting surface and the opening formed by the opening edge.

[0017] In the aforementioned backlight module, the bracket portion further comprises a plurality of transparent portions that respectively block the opening and cover the light-emitting surface, and the light color conversion layer is located on the transparent portions.

[0018] In the aforementioned backlight module, the support portion further includes a plurality of holes disposed around each of the plurality of cylindrical portions and penetrating the support portion to partially expose the substrate.

[0019] In the aforementioned backlight module, the light color conversion layer successively covers the cylindrical portion and the hole portion in a continuous manner, and contacts the first side of the substrate.

[0020] In the aforementioned backlight module, the light color conversion layer is a strip-shaped film.

[0021] In the aforementioned backlight module, the light color conversion layer is a coating layer.

[0022] In the aforementioned backlight module, the backlight module further includes an encapsulation portion, which covers the light color conversion layer and contacts the substrate via the aperture portion.

[0023] In the aforementioned backlight module, the plurality of holes include at least an arc-shaped hole, the arc-shaped hole having an arc-shaped outer periphery, and the concave portion of the arc-shaped outer periphery pointing towards the adjacent cylindrical portion.

[0024] In another embodiment of this disclosure, a head-up display is provided, wherein the aforementioned backlight module is included as a light source.

[0025] In the above-mentioned head-up display, the head-up display is a panoramic head-up display.

[0026] In another embodiment of this disclosure, a motor vehicle is provided, including the aforementioned backlight module or the aforementioned head-up display. Attached Figure Description

[0027] Other features, details, and advantages of this disclosure may be inferred from the following description of this disclosure. A more comprehensive understanding of this disclosure and its many accompanying advantages will be readily obtained by referring to the following detailed description taken in conjunction with the accompanying drawings, in which:

[0028] Figure 1 This is a schematic cross-sectional view showing the backlight module 100 of this disclosure;

[0029] Figure 2 This is a schematic perspective view showing the bracket portion 140 of the backlight module 100 of this disclosure;

[0030] Figure 3 This is a schematic diagram showing one configuration of the support portion 140 of this disclosure;

[0031] Figure 4 This is a schematic diagram showing another configuration of the support portion 140 of this disclosure;

[0032] Figure 5 This is a schematic diagram showing another configuration of the support portion 140 of this disclosure;

[0033] Figure 6 This is a schematic perspective view showing another configuration of the hole portion of the bracket portion 140 of the backlight module 100 of this disclosure.

[0034] Figure 7 This is a plan view of the backlight module 100 with the bracket portion 140 omitted;

[0035] Figure 8 This is a schematic diagram illustrating the installation status and imaging position of a head-up display in a vehicle.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100. Backlight module;

[0038] 110. Substrate;

[0039] 120. Light-emitting element;

[0040] 121. Luminous surface;

[0041] 130. Radiator;

[0042] 140. Support section;

[0043] 141. Main body;

[0044] 142. Cylindrical section;

[0045] 143. Hole area;

[0046] 143a. Arc-shaped hole;

[0047] 144. Transparent areas;

[0048] 150. Light and color conversion layer;

[0049] 160. Packaging Department;

[0050] 200. Windshield;

[0051] 300. A standard head-up display;

[0052] 400. Panoramic head-up display. Detailed Implementation

[0053] The following describes the implementation of this disclosure through specific embodiments. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification.

[0054] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this disclosure. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effectiveness and purpose of this disclosure, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above" and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this disclosure. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this disclosure's implementation.

[0055] Furthermore, in the accompanying drawings, for multiple sets of repeating structures, in order to make the drawings concise and easy to understand, there are only one set of annotations. It is obvious to those skilled in the art that the repeating structures can be understood in the drawings by referring to the annotations of the set of annotations.

[0056] This disclosure provides a backlight module, a head-up display, and a motor vehicle. Specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0057] (Backlight module)

[0058] The backlight module 100 disclosed herein may be used, for example, as a light source for a head-up display (HUD), particularly a panoramic head-up display (PHUD), but is not limited thereto and may also be used as other light sources.

[0059] like Figure 1 As shown, the backlight module 100 includes a substrate 110, a light-emitting element 120, a heat sink 130, a support portion 140, a light color conversion layer 150, and a packaging portion 160.

[0060] The substrate 110 is, for example, a PCB board, with multiple light-emitting elements 120 mounted on the first side and a heat sink 130 mounted on the second side. The material of the substrate 110 is not particularly limited and can be an organic substrate, a metal substrate, or a ceramic substrate. From the viewpoint of achieving better heat dissipation, a metal substrate or a ceramic substrate is preferred, and a ceramic substrate with excellent thermal conductivity is more preferred.

[0061] The light-emitting element 120 is, for example, a bare LED chip, which is directly bonded to the substrate 110 to form a so-called chip-on-board (COB). The light-emitting element 120 is not limited to a bare LED chip, but can also be other light-emitting elements such as miniLED chips or MicroLED chips.

[0062] like Figure 2 As shown, preferably, multiple light-emitting elements 120 are arranged in an array on the substrate 110. As specific examples of the array, rectangular array, staggered array, hexagonal array, etc. can be given, but it is not limited to these. The multiple light-emitting elements 120 may also be arranged only in a part of the substrate or irregularly.

[0063] The preferred light emission color for the light-emitting element 120 is blue, but it is not limited to this and may emit light in other colors.

[0064] The heat sink 130 is tightly attached to the substrate 110 to dissipate heat from the substrate 110. It should be noted that if the heat dissipation capacity of the substrate 110 itself is sufficient to achieve heat dissipation, the heat sink 130 may not be required. Alternatively, the heat sink 130 may be provided only on one or a portion of both sides of the substrate 110, or it may be provided in a manner different from... Figure 1 Other heat sinks shown in heat sink 130.

[0065] like Figure 2 As shown, the support portion 140 has: a main body portion 141 that contacts the substrate 110; a cylindrical portion 142 that accommodates the light-emitting element 120 and surrounds the side of the light-emitting element 120; and a hole region 143 that is dispersedly formed on the main body portion 141, so that the substrate 110 is partially exposed from the main body portion 141 around each cylindrical portion 142.

[0066] Preferably, the support portion 140 is formed of a resin material, such as... Figure 3 As shown, the support portion 140 may further have a transparent portion 144 formed of a transparent material and covering the light-emitting surface 121 of the light-emitting element 120. It should be noted that this disclosure is not limited to the option where only the transparent portion 144 is formed of a transparent material; the entire support portion 140 may also be formed of a transparent material. Furthermore, the transparent portion 144 may be integrally formed with the cylindrical portion 142 in a manner that seals the opening of the cylindrical portion 142, or it may be separately formed from the cylindrical portion 142 and then bonded to the cylindrical portion 142 by means of adhesion or the like.

[0067] like Figure 4 As shown, the support portion 140 may also not have a transparent portion 144 covering the light-emitting surface 121 of the light-emitting element 120. When the support portion 140 does not have a transparent portion 144 covering the light-emitting surface 121 of the light-emitting element 120, the opening edge of the cylindrical portion 142 is flush with the light-emitting surface 121 of the light-emitting element 120 to facilitate the installation of the light color conversion layer 150 described later. Alternatively, as... Figure 5 As shown, the opening edge of the cylindrical portion 142 is higher than the light-emitting surface 121 of the light-emitting element 120 to form a space for accommodating the light color conversion layer 150, which will be described later.

[0068] It should be noted that, in Figures 3 to 5 The text indicates a gap between the support portion 140 and the light-emitting element 120, but it can also be interpreted as follows: Figure 1 As shown, the support portion 140 is in contact with the side of the light-emitting element 120 with virtually no gap.

[0069] The shape of the hole region 143 can be rectangular, or other shapes such as polygons. It should be noted that the multiple hole regions 143 of the bracket portion 140 do not need to be of the same size and shape.

[0070] In addition, such as Figure 6 As shown, in addition to the rectangular hole region 143 described above, an arc-shaped hole 143a is further provided as a hole that partially exposes the substrate 110 from the main body 141. This arc-shaped hole 143a has an arc-shaped outer periphery with a recess pointing towards the adjacent cylindrical portion 142. By providing the arc-shaped hole 143a, it is helpful to guide the flow of encapsulating adhesive in subsequent encapsulation processes, thereby making the encapsulation portion into an arched shape and forming the lens structure required for light emission. For ease of explanation, the rectangular hole region 143 and the arc-shaped hole 143a may be collectively referred to as a "hole portion". The term "hole portion" may include at least one of the rectangular hole region 143 and the arc-shaped hole 143a, and is not limited to either. The term "hole portion" may also include holes of other shapes that partially expose the substrate 110 from the main body 141.

[0071] The light color conversion layer 150 contains a phosphor, which can be selected according to the emission color of the light-emitting element 120. For example, when the light-emitting element 120 emits blue light, a combination of a yellow phosphor such as a YAG (Yttrium Aluminum Garnet) phosphor or a green phosphor such as a β-type silron (SiAlON) phosphor and a red phosphor such as a fluoride phosphor can be used to convert the blue light into white light. Specifically, for example, blue light excites a yellow phosphor and is converted into yellow light. The converted yellow light mixes with the blue light passing through the light color conversion layer 150 to ultimately form white light.

[0072] The light-color conversion layer 150 can be a film containing phosphor, such as a thin film of uniformly mixed yellow phosphor. By attaching this film to at least a portion of the transparent portion 144 of the cylindrical portion 142 and the substrate 110, a heat conduction path of light-color conversion layer 150 → substrate 110 → heat sink 130 is formed.

[0073] Figure 7 This is a plan view of the backlight module 100 with the bracket portion 140 omitted.

[0074] like Figure 7 As shown, as an example of the light color conversion layer 150, it can be a continuous strip-shaped film that simultaneously covers multiple light-emitting elements 120 and the substrate 110 located between them. Such a strip-shaped film easily ensures sufficient contact area with the substrate 110 and has the advantage of high production efficiency due to the ease of bonding multiple light-emitting elements 120 at once. However, it is not limited to this; other forms of film capable of achieving the same effect can also be used. It should be noted that when using a strip-shaped film as the light color conversion layer 150, it is preferable that the opening edge of the cylindrical portion 142 is flush with the light-emitting surface of the light-emitting element 120. However, this disclosure is not limited to this; even when the opening edge of the cylindrical portion 142 is higher than the light-emitting surface of the light-emitting element 120, heat conduction can be achieved by pressing the light color conversion layer 150 against the light-emitting surface of the light-emitting element 120 during bonding. Furthermore, even when a transparent portion 144 is provided that seals the opening of the cylindrical portion 142, the upper surface of the transparent portion 144 can be covered by the light color conversion layer 150.

[0075] And, as Figure 3 As shown, the light color conversion layer 150 can also be formed by coating the transparent portion 144 with a colloid containing phosphor powder, and then coating the colloid up to the position where it contacts the substrate 110. In this case, a heat conduction path is formed: light color conversion layer 150 → substrate 110 → heat sink 130. It should be noted that the light color conversion layer 150 can be formed as follows: Figure 3As shown, it can cover multiple light-emitting elements 120 at the same time, or it can be set for only one light-emitting element 120 without being continuous with the light color conversion layer 150 set for other light-emitting elements 120.

[0076] Alternatively, the color conversion layer 150 can also be formed by directly coating a colloid containing phosphor powder onto the entire emitting surface 121 of the light-emitting element 120. In this case, a heat conduction path is formed: color conversion layer 150 → light-emitting element 120 → heat sink 130. From the perspective of ease of coating, it is preferable that the opening edge of the cylindrical portion 142 is higher than the emitting surface 121 of the light-emitting element 120, so that a cavity can be formed between the side wall of the cylindrical portion 142 and the emitting surface 121 of the light-emitting element 120 to accommodate the coated colloid containing phosphor powder.

[0077] It should be noted that the aforementioned colloid containing fluorescent powder can be obtained by premixing the fluorescent powder with an encapsulating gel (usually silicone or epoxy resin). This colloid can be coated, for example, using a dispensing process. When coating the aforementioned colloid, in situations such as... Figure 4 and Figure 5 As shown, when there is a gap between the support portion 140 and the light-emitting element 120, the adhesive will enter the gap, thereby forming a heat conduction path of light color conversion layer 150 → substrate 110 → heat sink 130. Furthermore, if in Figure 3 In the structure shown, the aforementioned colloid and the phosphor-containing film are disposed on the inner surfaces of the transparent portion 144 and the cylindrical portion 142, thus forming a heat conduction path from the color conversion layer 150 to the substrate 110 to the heat sink 130. Alternatively, the color conversion layer 150 can be obtained by bonding individual phosphors with silicone, epoxy resin, or other colloids or adhesives. In this case, although there is a colloid or adhesive between the light-emitting element 120 and the phosphor, thermal conductivity can still be achieved between the phosphor and the light-emitting element 120, and it is considered that the light-emitting element 120 and the color conversion layer 150 are in direct contact.

[0078] The encapsulation portion 160 is formed by dispensing transparent encapsulating adhesive from above. Specifically, adhesive is applied to the light-emitting element 120, to which the light color conversion layer 150 has been formed, and to the cylindrical portion 142 surrounding the light-emitting element 120. The transparent encapsulating adhesive can be the same as the aforementioned adhesive, such as silicone or epoxy resin, but other types of transparent encapsulating adhesives are also possible. By forming the encapsulation portion, the light-emitting element 120 and the light color conversion layer 150 can be encapsulated together. This not only fixes the light color conversion layer 150 but also protects the light-emitting element 120. Furthermore, the transparent encapsulating adhesive can be used to form the desired lens structure.

[0079] Furthermore, a perforated area 143 is formed in the support portion 140, and transparent encapsulant is bonded to the substrate 110 by flowing into the perforated area 143, thereby fixing the support portion 140 to the substrate 110.

[0080] From the viewpoint that the encapsulation part 160 can easily form the required lens structure, it is possible to... Figure 6 As shown, a portion of the hole area 143 is changed into an arc-shaped hole 143a. Therefore, during dispensing, the arc-shaped hole 143a can guide the encapsulating adhesive, thereby forming an arched encapsulation portion 160.

[0081] Furthermore, the backlight module 100 of this disclosure may further include reflectors, diffusers, collimating lenses, etc., on the light-emitting surface side of each light-emitting element 120 as needed.

[0082] In the above description, for ease of explanation, only a portion of the backlight module 100 is shown in the accompanying drawings, with other parts omitted. Therefore, this disclosure should not be construed as limited to the configuration shown in the drawings.

[0083] (Head-up display)

[0084] Figure 8 This is a schematic diagram illustrating the installation status and imaging position of a head-up display (HUD) in a vehicle. The HUD includes a standard HUD 300 and a panoramic head-up display (PHUD) 400. The standard HUD 300 projects content onto a portion of the windshield 200 directly in front of the driver, while the panoramic head-up display 400 projects content onto a long strip area or even a larger area at the bottom of the windshield 200. Compared to the standard HUD 300, the panoramic head-up display 400 requires higher brightness, thus generating more heat in the light color conversion layer. The backlight module described above can be used as a light source in both standard and panoramic head-up displays. Due to its excellent heat dissipation, the backlight module described above is particularly suitable for use as a light source in panoramic head-up displays.

[0085] (Motor vehicles)

[0086] As described above, a head-up display (HUD) or PHUD having the backlight module described herein is included in a motor vehicle.

[0087] It will be understood by those skilled in the art that various modifications and alterations can be made to the above specific embodiments without departing from the spirit of this disclosure, and various combinations can be made to the various technical features and structures proposed in this disclosure without exceeding the protection scope of this disclosure, the protection scope of which is determined by the appended claims.

[0088] The technical concept of this disclosure is summarized below, and the technical effects are explained.

[0089] This disclosure provides a backlight module, including:

[0090] The substrate 110 includes a first side and a second side opposite to the first side;

[0091] Multiple light-emitting elements 120 are mounted on a first side of the substrate and each has a light-emitting surface that emits light toward the first side of the substrate;

[0092] The backlight module further includes:

[0093] A support portion 140 is disposed on a first side of the substrate and has a plurality of cylindrical portions 142 for accommodating each of the plurality of light-emitting elements; and

[0094] A light conversion layer 150 includes a phosphor and is disposed at least in each of the plurality of cylindrical portions to cover the light-emitting surface;

[0095] The light color conversion layer 150 is configured to be in contact with the light-emitting surface.

[0096] Each of the plurality of cylindrical portions 142 has an opening on the light-emitting surface side, and the opening edge of each cylindrical portion is flush with or higher than the light-emitting surface. The light color conversion layer 150 covers the light-emitting surface and the opening formed by the opening edge.

[0097] According to the aforementioned backlight module, by providing a support portion 140 with a cylindrical portion 142, the light color conversion layer 150 can be easily disposed on the light-emitting surface of the light-emitting element 120. Furthermore, by disposing the light color conversion layer 150 on the cylindrical portion 142, the heat generated by the light color conversion layer 150 can be transferred to the substrate 110 via the light-emitting element 120 or the cylindrical portion 142, thereby achieving a good heat dissipation effect. In addition, since it is not necessary to provide a quantum dot film in the optical path for light color conversion as in the past, the backlight module structure can be made more compact.

[0098] Furthermore, by contacting the light-emitting surface of the light-emitting element 120 with the light-emitting layer 150, the heat generated by the light-emitting layer 150 can be transferred to the substrate 110 through the light-emitting element 120, and finally dissipated through the heat sink 130.

[0099] Moreover, the light-emitting surface can be positioned through the opening of the cylindrical part 142, and the light color conversion layer can be set by coating or pasting, which has the advantage of high production efficiency.

[0100] In particular, by making the opening edge of each cylinder higher than the light-emitting surface, when the light color conversion layer 150 is formed by coating, the colloid containing phosphor can be coated inside the opening edge, making it easy to position the light-emitting surface and easy to coat, resulting in high production efficiency.

[0101] In the aforementioned backlight module, the bracket portion 140 further has a plurality of transparent portions 144 that respectively block the opening and cover the light-emitting surface, and the light color conversion layer 150 is located on the transparent portions 144.

[0102] According to the backlight module described above, a light color conversion layer 150 can be pre-formed on the transparent portion 144 or the light color conversion layer 150 can be set by coating or pasting, which can improve the production efficiency of setting the light color conversion layer 150.

[0103] In the aforementioned backlight module, the bracket portion 140 further includes a plurality of holes disposed around each of the plurality of cylindrical portions 142 and penetrating the bracket portion to partially expose the substrate.

[0104] According to the backlight module described above, by providing the above-mentioned hole, the substrate can be exposed, the light color conversion layer 150 contacts the substrate 110 through the hole to form a heat dissipation path, and the encapsulation part 160 is bonded to the substrate 110 through the hole to fix the support part 140 and the light color conversion layer 150.

[0105] In the aforementioned backlight module, the light color conversion layer 150 successively covers the cylindrical portion 142 and the hole portion in a continuous manner, and contacts the first side of the substrate 110.

[0106] According to the aforementioned backlight module, by successively covering the cylindrical portion 142 and the hole portion in a continuous manner, the production efficiency when setting the light color conversion layer 150 can be improved.

[0107] In the aforementioned backlight module, the light color conversion layer 150 is a strip-shaped film.

[0108] According to the aforementioned backlight module, by making the light color conversion layer 150 into a strip-shaped film, the light color conversion layer 150 can be easily attached to the support portion 140, thereby improving production efficiency.

[0109] In the aforementioned backlight module, the light color conversion layer 150 is a coating layer.

[0110] According to the backlight module described above, a colloid containing phosphors can be continuously coated onto the cylindrical portion 142 and the aperture portion of the support portion 140, and the light color conversion layer 150 can be easily formed.

[0111] In the aforementioned backlight module, the backlight module further includes an encapsulation portion 160, which covers the light color conversion layer 150 and contacts the substrate 110 via the aperture portion.

[0112] According to the backlight module described above, the light color conversion layer 150 and the bracket portion 140 can be fixed to the substrate 110 through the encapsulation portion 160.

[0113] In the aforementioned backlight module, the plurality of holes include at least an arc-shaped hole 143a, which has an arc-shaped outer periphery, and the recess of the arc-shaped outer periphery points toward the adjacent cylindrical portion 142.

[0114] According to the backlight module described above, during the process of forming the encapsulation part 160 by dispensing adhesive, the adhesive can be guided through the arc-shaped hole 143a with an arc-shaped outer periphery to form an arch shape, which not only achieves a good appearance but also forms the lens structure required for light emission.

[0115] This disclosure provides a head-up display, wherein the aforementioned backlight module is included as a light source.

[0116] According to the above head-up display, since it is no longer necessary to set up a quantum dot film in the optical path for light color conversion as in the past, the overall structure of the head-up display can be made more compact.

[0117] In the above-mentioned head-up display, the head-up display is a panoramic head-up display.

[0118] Therefore, by using this backlight module with good heat dissipation properties in the color conversion layer of the panoramic head-up display, the limitation of the heat dissipation capacity of the color conversion layer can be overcome, and higher brightness can be achieved.

[0119] This disclosure provides a motor vehicle including the aforementioned backlight module or head-up display.

Claims

1. A backlight module (100), characterized in that, include: A substrate (110) includes a first side and a second side opposite to the first side; Multiple light-emitting elements (120) are mounted on a first side of the substrate and each has a light-emitting surface (121) that emits light toward the first side of the substrate. The backlight module further includes: The support portion (140) is disposed on the first side of the substrate and has a plurality of cylindrical portions (142) for accommodating each of the plurality of light-emitting elements. and A light conversion layer (150) includes a phosphor and is disposed at least in each of the plurality of cylindrical portions to cover the light-emitting surface; The light color conversion layer (150) is configured to contact the light-emitting surface; Each of the plurality of cylindrical portions (142) has an opening on the light-emitting surface side, and the opening edge of each cylindrical portion is flush with or higher than the light-emitting surface. The light color conversion layer (150) covers the light-emitting surface and the opening formed by the opening edge.

2. The backlight module according to claim 1, characterized in that, The support portion (140) further has a plurality of transparent portions (144) that respectively block the opening and cover the light-emitting surface, and the light color conversion layer (150) is located on the transparent portions (144).

3. The backlight module according to claim 1, characterized in that, The support portion (140) further includes a plurality of holes disposed around each of the plurality of cylindrical portions (142) and penetrating the support portion to partially expose the substrate.

4. The backlight module according to claim 3, characterized in that, The light color conversion layer (150) successively covers the cylindrical portion (142) and the hole portion in a continuous manner, and contacts the first side of the substrate (110).

5. The backlight module according to claim 4, characterized in that, The light-color conversion layer (150) is a strip-shaped film.

6. The backlight module according to claim 4, characterized in that, The light color conversion layer (150) is a coating layer.

7. The backlight module according to claim 3, characterized in that, The backlight module (100) also includes a packaging section (160). The encapsulation portion covers the light conversion layer (150) and contacts the substrate (110) via the aperture.

8. The backlight module according to claim 3, characterized in that, The plurality of holes include at least an arc-shaped hole (143a) having an arc-shaped outer periphery, the recess of which points toward the adjacent cylindrical portion (142).

9. A head-up display, characterized in that, The backlight module (100) according to any one of claims 1 to 8 is used as a light source.

10. The head-up display according to claim 9, characterized in that, The head-up display is a panoramic head-up display (400).

11. A motor vehicle, characterized in that, Includes the backlight module according to any one of claims 1 to 8, or the head-up display according to claim 9 or 10.

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