Light-emitting device, light-emitting module and manufacturing method thereof

Abstract

The invention relates to the technical field of semiconductor preparation, and particularly discloses a light-emitting device, a light-emitting module and a manufacturing method thereof. The device comprises a light-emitting assembly, a first adhesive film and a second adhesive film, the light-emitting assembly comprises a first PCB substrate, a first light-emitting chip and a second light-emitting chip, one side of the first PCB substrate is provided with a setting surface, the first light-emitting chip and the second light-emitting chip are both arranged on the setting surface, and the light-emitting angle of the first light-emitting chip is smaller than that of the second light-emitting chip; the first adhesive film is arranged on the setting surface and covers the first light-emitting chip, and the first adhesive film and the second light-emitting chip are spaced; the second adhesive film covers the second light-emitting chip and covers and is connected to the light-emitting assembly and the first adhesive film, so that the first adhesive film is arranged between the second adhesive film and the light-emitting assembly, and the refractive index of the first adhesive film is larger than that of the second adhesive film. According to the device, the light-emitting angles of part of the light-emitting chips are enlarged by means of the first adhesive film, so that the light-emitting angles of all the light-emitting chips are close, and the problem of large light-emitting color cast under a large angle is solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a light-emitting device, a light-emitting module and a manufacturing method thereof. Background Art

[0002] At present, with the development of display technology, people have higher and higher requirements for the display effect of LED display screens. LED display screens are needed in more and more occasions to display advertising information, product display information, meeting information, etc. Compared with display devices such as calculators, monitors and household LCD TVs, LED display screens require high and uniform brightness and higher requirements for product reliability. In addition, in applications such as advertising, media and film and television, LED display screens require more gorgeous picture effects, higher color saturation, and better light uniformity.

[0003] Then, in the existing light-emitting devices, there are situations where the light emission angles of different light-emitting chips on the substrate are significantly different, which will result in differences in light color when the light emitted by the light-emitting device is observed at a large angle. In other words, the light-emitting device has a large color cast at a large angle, which seriously affects the light-emitting display effect of the light-emitting module including the light-emitting device. Summary of the invention

[0004] The first object of the present invention is to provide a light-emitting device, which uses the scattering effect of the first adhesive film to increase the light emission angle of some light-emitting chips so that the light emission angles of all light-emitting chips are similar, thereby alleviating the problem of large color cast of the light-emitting device at large angles.

[0005] The second object of the present invention is to provide a light-emitting module, which can alleviate the problem of display color cast at a large angle and improve the light-emitting display effect by using the above-mentioned light-emitting device.

[0006] The third object of the present invention is to provide a method for manufacturing a light-emitting device, which can manufacture the light-emitting device with a small deviation in the light-emitting angles of each light-emitting chip.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A light-emitting device comprises a light-emitting component, a first adhesive film and a second adhesive film; the light-emitting component comprises a first PCB substrate, a first light-emitting chip and a second light-emitting chip, one side of the first PCB substrate has a setting surface, the first light-emitting chip and the second light-emitting chip are both arranged on the setting surface, and the light-emitting angle of the first light-emitting chip is smaller than the light-emitting angle of the second light-emitting chip; the first adhesive film is arranged on the setting surface, and the first adhesive film covers the first light-emitting chip, and the first adhesive film is spaced from the second light-emitting chip; the second adhesive film covers the second light-emitting chip, and the second adhesive film covers and is connected to the light-emitting component and the first adhesive film, so that the first adhesive film is arranged between the second adhesive film and the light-emitting component, and the refractive index of the first adhesive film is greater than the refractive index of the second adhesive film.

[0009] As an optional technical solution for the light-emitting device, the first adhesive film includes a first adhesive film layer, the second adhesive film includes a second adhesive film layer, the first PCB substrate, the first adhesive film layer and the second adhesive film layer are stacked in sequence from bottom to top, the first adhesive film layer is penetrated by through holes, the number of the through holes is the same as the number of the second light-emitting chips, and each of the second light-emitting chips is placed in one of the through holes.

[0010] As an optional technical solution of the light-emitting device, the surface of the second adhesive film layer is provided with protrusions, the number of the protrusions is the same as the number of the through holes, and one protrusion and one second light-emitting chip fill one through hole.

[0011] As an optional technical solution of the light emitting device, the first adhesive film layer is bonded to the second adhesive film layer, and the first adhesive film layer is bonded to the first PCB substrate.

[0012] As an optional technical solution for the light-emitting device, the first adhesive film includes an adhesive film block, the second adhesive film includes a third adhesive film layer, the number of the adhesive film blocks is the same as the number of the first light-emitting chips, the third adhesive film layer is provided with blind holes, the blind holes extend along the thickness direction of the first PCB substrate, and the number of the blind holes is the same as the number of the first light-emitting chips, and one adhesive film block and one first light-emitting chip fill one blind hole.

[0013] As an optional technical solution for the light-emitting device, the adhesive film block is concavely provided with a receiving groove, and the first light-emitting chip fills the receiving groove.

[0014] As an optional technical solution of the light emitting device, the third adhesive film layer is bonded to the first PCB substrate, and the third adhesive film layer is bonded to the adhesive film block.

[0015] As an optional technical solution for the light-emitting device, the scattering distance is greater than the thickness of the first light-emitting chip, wherein the scattering distance is the distance between the end of the first light-emitting chip away from the first PCB substrate and the end of the first adhesive film away from the first PCB substrate in the thickness direction of the first PCB substrate.

[0016] As an optional technical solution for the light-emitting device, the material of the first adhesive film includes organic silicone, epoxy resin and light-guiding adhesive; and / or the material of the second adhesive film includes organic silicone, epoxy resin and light-guiding adhesive.

[0017] As an optional technical solution for the light-emitting device, first scattering powder is added to the first adhesive film, and the refractive index of the first adhesive film is in the range of 2.0-2.5.

[0018] As an optional technical solution of the light-emitting device, the first scattering powder includes zinc oxide, titanium oxide or zirconium oxide.

[0019] As an optional technical solution for the light-emitting device, second scattering powder is added to the second adhesive film, and the refractive index of the second adhesive film is in the range of 1.3-1.7.

[0020] As an optional technical solution for the light-emitting device, the second scattering powder includes silicon dioxide, silicone resin microspheres and epoxy resin microspheres.

[0021] As an optional technical solution of the light-emitting device, there is a gap between the second light-emitting chip and the first light-emitting chip, and the gap is at least filled with the first adhesive film.

[0022] As an optional technical solution of the light-emitting device, the light-emitting component includes one first light-emitting chip and two second light-emitting chips, the first light-emitting chip is a red light chip, and one of the two second light-emitting chips is a blue light chip and the other is a green light chip.

[0023] A light-emitting module comprises a second PCB substrate and at least one light-emitting device as described above, wherein the light-emitting device is arranged on the second PCB substrate, and a side of the first PCB substrate away from the setting surface is connected to the second PCB substrate.

[0024] A method for manufacturing a light emitting device, used to manufacture the above-mentioned light emitting device, comprises the following steps:

[0025] S1. Provide a main body panel, the first light-emitting chip and the second light-emitting chip, wherein the main body panel includes a plurality of the first PCB substrates, the plurality of the first PCB substrates are arranged in an array and connected, the setting surfaces of the plurality of the first PCB substrates are all facing the same side, and the first light-emitting chip and the second light-emitting chip are arranged on the setting surfaces of the first PCB substrates;

[0026] S2, forming the first adhesive film on the setting surface and the first light-emitting chip;

[0027] S3, forming a second adhesive film on the first adhesive film and the second light-emitting chip;

[0028] S4, cutting the main body plate and the adhesive film to separate the first PCB substrates to obtain the light-emitting device.

[0029] As an optional technical solution of the method for manufacturing a light-emitting device, the first adhesive film includes a thermosetting resin, and S2 includes the following detailed steps:

[0030] S21, the first adhesive film is molded and bonded to the first adhesive film by thermoplastic curing; and / or the second adhesive film includes a thermosetting resin, and S3 includes the following detailed steps:

[0031] S31, using thermoplastic curing to mold and bond the second adhesive film to the first adhesive film and the light-emitting component.

[0032] Beneficial effects of the present invention:

[0033] Since there is a difference in refractive index between the first adhesive film and the second adhesive film of the light-emitting device, and the first adhesive film covers the first light-emitting chip but does not cover the second light-emitting chip, the light path can be effectively and accurately controlled, thereby increasing the light emission angle of the first light-emitting chip and avoiding the first adhesive film from interfering with the light emission of the second light-emitting chip, thereby effectively reducing the difference between the light emission angle of the first light-emitting chip and the light emission angle of the second light-emitting chip in the light emitted by the light-emitting device as a whole, thereby reducing the color cast of the light emitted by the light-emitting device at a large angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a schematic diagram of the structure of the light-emitting components provided in Embodiment 1 and Embodiment 2 of the present invention;

[0035] Figure 2 is a schematic structural diagram of a first adhesive film layer provided in Embodiment 1 of the present invention;

[0036] Figure 3 is a schematic structural diagram of a second adhesive film layer provided in Embodiment 1 of the present invention;

[0037] Figure 4 is a partial cross-sectional view of the light-emitting component and the first adhesive film layer provided in the first embodiment of the present invention;

[0038] Figure 5 is a partial top view of the light emitting component and the first adhesive film layer provided in the first embodiment of the present invention;

[0039] Figure 6 is a partial cross-sectional view of a light-emitting component, a first adhesive film layer, and a second adhesive film layer provided in Embodiment 1 of the present invention;

[0040] Figure 7 is a partial top view of the light-emitting component, the first adhesive film layer and the second adhesive film layer provided in the first embodiment of the present invention;

[0041] Figure 8 is a schematic structural diagram of a third adhesive film layer provided in Embodiment 2 of the present invention;

[0042] Fig. 9 is a partial cross-sectional view of a light-emitting component and an adhesive film block provided in Embodiment 2 of the present invention;

[0043] Fig.10 is a partial top view of the light emitting assembly and the adhesive film block provided in the second embodiment of the present invention;

[0044] Fig.11 is a partial cross-sectional view of the light-emitting component, the adhesive film block and the third adhesive film layer provided in the second embodiment of the present invention;

[0045] Fig.12 It is a partial top view of the light-emitting component, the adhesive film block and the third adhesive film layer provided in the second embodiment of the present invention.

[0046] In the figure:

[0047] 110, first PCB substrate; 120, second light emitting chip; 140, first light emitting chip;

[0048] 200, first adhesive film layer; 201, through hole;

[0049] 300, second adhesive film layer; 301, protrusion;

[0050] 400, film block;

[0051] 500, a third adhesive film layer; 501, a blind hole. DETAILED DESCRIPTION

[0052] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0054] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0056] Embodiment 1

[0057] like Figures 1 to 7As shown, this embodiment provides a light-emitting device, including a light-emitting component, a first adhesive film and a second adhesive film; the light-emitting component includes a first PCB substrate 110, a first light-emitting chip 140 and a second light-emitting chip 120, one side of the first PCB substrate 110 has a setting surface, the first light-emitting chip 140 and the second light-emitting chip 120 are both arranged on the setting surface, and the light-emitting angle of the first light-emitting chip 140 is smaller than the light-emitting angle of the second light-emitting chip 120; the first adhesive film is arranged on the setting surface, and the first adhesive film covers the first light-emitting chip 140, and the first adhesive film is spaced from the second light-emitting chip 120; the second adhesive film covers the second light-emitting chip 120, and the second adhesive film covers and is connected to the light-emitting component and the first adhesive film, so that the first adhesive film is arranged between the second adhesive film and the light-emitting component, and the refractive index of the first adhesive film is greater than the refractive index of the second adhesive film.

[0058] Since there is a difference in refractive index between the first adhesive film and the second adhesive film of the light-emitting device, and the first adhesive film covers the first light-emitting chip 140 but does not cover the second light-emitting chip 120, the light path can be effectively and precisely controlled, thereby increasing the light emission angle of the first light-emitting chip 140 and avoiding the first adhesive film from interfering with the light emission of the second light-emitting chip 120, thereby effectively reducing the difference between the light emission angle of the first light-emitting chip 140 and the light emission angle of the second light-emitting chip 120 in the light emitted by the light-emitting device as a whole, thereby reducing the color cast of the light emitted by the light-emitting device at a large angle.

[0059] By providing a first adhesive film and a second adhesive film with different refractive indices, it is possible to achieve effective control and scattering of light, thereby improving the light extraction efficiency and light uniformity of the light-emitting device. The second adhesive film covers and connects the light-emitting component and the first adhesive film, and the first adhesive film is provided between the second adhesive film and the light-emitting component. This double adhesive film structure improves the sealing and durability of the light-emitting device. The above-mentioned light-emitting device, through the structural design of the multi-layer film, makes the light extraction angles of the first light-emitting chip 140 and the second light-emitting chip 120 similar, thus achieving efficient and stable light control and transmission effects, and has broad application prospects and economic benefits.

[0060] Exemplarily, the scattering distance is greater than the thickness of the first light-emitting chip 140 , wherein the scattering distance is the distance between one end of the first light-emitting chip 140 away from the first PCB substrate 110 and one end of the first adhesive film away from the first PCB substrate 110 in the thickness direction of the first PCB substrate 110 .

[0061] By limiting the scattering distance to be greater than the thickness of the first light-emitting chip 140, the scattering effect of light is optimized, which helps to achieve effective control of light propagation, improves the light uniformity and brightness of the light-emitting device, and helps to achieve a more uniform lighting effect.

[0062] In one implementation of this embodiment, the material of the first adhesive film includes organic silicone, epoxy resin and light-guiding adhesive; the material of the second adhesive film includes organic silicone, epoxy resin and light-guiding adhesive.

[0063] The material selection of the first adhesive film and the second adhesive film provides a variety of possibilities, including organic silicone, epoxy resin and light-guiding adhesive, etc. These materials have excellent optical properties and thermal stability, can meet different usage requirements, and make the light-emitting device have a wider range of applicability and good durability.

[0064] In another implementation of this embodiment, only the material of the first adhesive film includes organic silicone, epoxy resin and light-guiding adhesive. In another implementation of this embodiment, only the material of the second adhesive film includes organic silicone, epoxy resin and light-guiding adhesive.

[0065] Specifically, the first adhesive film and the second adhesive film can be made of bisphenol A epoxy, silicone resin or inorganic silicone resin. The first adhesive film and the second adhesive film made of bisphenol A epoxy, silicone resin or inorganic silicone resin can improve the performance stability and service life of the light-emitting device and optimize the light transmission effect. Bisphenol A epoxy, silicone resin or inorganic silicone resin are conventional materials in the field, and the beneficial effects of their application are common knowledge in the field, and will not be elaborated here.

[0066] In this embodiment, first scattering powder is added to the first adhesive film, and the refractive index of the first adhesive film is in the range of 2.0-2.5.

[0067] The design of the first scattering powder added to the first adhesive film can enhance the scattering effect of light, guide the light, and thus regulate the propagation and scattering of light, and enhance the overall effect of the light-emitting device. At the same time, by controlling the refractive index of the first adhesive film within a certain range, effective scattering and regulation of light is achieved, the uniformity of light distribution and visual effect of the light-emitting device are improved, and it helps to achieve the best light performance.

[0068] Furthermore, the first scattering powder includes zinc oxide, titanium oxide or zirconium oxide.

[0069] The first scattering powder is selected from zinc oxide, titanium oxide or zirconium oxide, providing a variety of material possibilities to help optimize the scattering effect of light.

[0070] In this embodiment, second scattering powder is added into the second adhesive film, and the refractive index of the second adhesive film is in the range of 1.3-1.7.

[0071] The design of adding the second scattering powder to the second adhesive film can enhance the scattering effect of light, guide the light, and thus regulate the propagation and scattering of light, and enhance the overall effect of the light-emitting device. At the same time, by controlling the refractive index of the second adhesive film within a certain range, effective scattering and regulation of light is achieved, and the light distribution uniformity and visual effect of the light-emitting device are improved, so that the best light effect performance can be achieved in combination with the first adhesive film.

[0072] Furthermore, the second scattering powder includes silicon dioxide, silicone resin microspheres and epoxy resin microspheres.

[0073] The second scattering powder is selected from silica, silicone microspheres and epoxy resin microspheres, providing a variety of light control methods to help optimize the light scattering effect.

[0074] The first scattering powder and the second scattering powder mentioned above both play a role in changing the scattering performance, which helps to increase the angle of light emission. However, the wrong proportion of scattering powder added will lead to light absorption and refractive index matching problems, which will cause the light energy emitted by the light-emitting device to be lost, affecting its luminous performance and light efficiency. In addition, the price of scattering powder materials is relatively high and they are rarely used, so the requirements for the proportion and mixing uniformity are relatively high.

[0075] In this embodiment, there is a gap between the second light emitting chip 120 and the first light emitting chip 140 , and the gap is at least filled with the first adhesive film.

[0076] The gap between the second light-emitting chip 120 and the first light-emitting chip 140 is filled with the first adhesive film, which ensures the tightness and consistency of the entire light-emitting component, ensures the structural stability of the light-emitting device and the uniformity of light distribution, and improves the overall durability and reliability.

[0077] Exemplarily, the light emitting component includes a first light emitting chip 140 and two second light emitting chips 120 , wherein the first light emitting chip 140 is a red light chip, and one of the two second light emitting chips 120 is a blue light chip and the other is a green light chip.

[0078] Through the combination of red light chips, blue light chips and green light chips, multiple colors can be mixed and adjusted, the emission of colored light can be realized, the color expression and visual effects of the light-emitting device are improved, and the application requirements of the display screen can be met.

[0079] In this embodiment, the first adhesive film includes a first adhesive film layer 200, the second adhesive film includes a second adhesive film layer 300, the first PCB substrate 110, the first adhesive film layer 200 and the second adhesive film layer 300 are stacked from bottom to top, the first adhesive film layer 200 is penetrated by through holes 201, the number of through holes 201 is the same as the number of second light-emitting chips 120, and each second light-emitting chip 120 is placed in a through hole 201.

[0080] Through the stacking structure of the first adhesive film layer 200 and the second adhesive film layer 300, and the setting of the through hole 201, the first adhesive film layer 200 and the second light-emitting chip 120 are accurately matched, so that the second light-emitting chip 120 can be effectively fixed, and the effective fixation and light regulation of the second light-emitting chip 120 are achieved. At the same time, it is also ensured that the first adhesive film covers the first light-emitting chip 140 and does not cover the second light-emitting chip 120, so that the precise control of light propagation and scattering is achieved, and the stability of the light-emitting device and the uniformity of light distribution are improved. In addition, the first adhesive film layer 200 covering the entire first PCB substrate 110 has a simple structure and is easy to manufacture, which helps to improve the production efficiency of the light-emitting device.

[0081] Furthermore, a protrusion 301 is protruded from the surface of the second adhesive film layer 300 . The number of the protrusions 301 is the same as the number of the through holes 201 , and one protrusion 301 and one second light emitting chip 120 fill one through hole 201 .

[0082] The protrusion 301 structure on the surface of the second adhesive film layer 300 corresponds to the through hole 201, so that the second light-emitting chip 120 can be more stably filled in the through hole 201, ensuring good adhesion between the second adhesive film layer 300 and the first adhesive film layer 200, while preventing the second light-emitting chip 120 from shifting or falling off, which helps to regulate the propagation direction of light, thereby enhancing the structural stability and light scattering effect of the light-emitting device.

[0083] Furthermore, the first adhesive film layer 200 is bonded to the second adhesive film layer 300 , and the first adhesive film layer 200 is bonded to the first PCB substrate 110 .

[0084] Through the firm bonding between the first adhesive film layer 200 and the second adhesive film layer 300, and between the first adhesive film layer 200 and the first PCB substrate 110, the firmness of the entire light-emitting component is ensured, the firm connection between the components of the light-emitting device is achieved, the stability and durability of the overall structure are improved, the yield and reliability of the light-emitting device are improved, and the accuracy of light effect transmission is ensured.

[0085] This embodiment further provides a light-emitting module, including a second PCB substrate and at least one of the above-mentioned light-emitting devices, the light-emitting device is arranged on the second PCB substrate, and the side of the first PCB substrate 110 away from the setting surface is connected to the second PCB substrate.

[0086] The light-emitting module realizes a stable connection between the light-emitting device and the substrate by setting the light-emitting device on the second PCB substrate, thereby improving the structural integrity and stability of the entire light-emitting module. By connecting the side of the first PCB substrate 110 away from the setting surface to the second PCB substrate, convenient installation and modular design of the light-emitting device are realized, making the light-emitting module easier to assemble and use, and improving production efficiency and installation efficiency.

[0087] This embodiment also provides a method for manufacturing a light emitting device, which is used to manufacture the above-mentioned light emitting device, and includes the following steps:

[0088] Step 1: Provide a main body panel, a first light emitting chip 140 and a second light emitting chip 120. The main body panel includes a plurality of first PCB substrates 110. The plurality of first PCB substrates 110 are arranged in an array and connected. The setting surfaces of the plurality of first PCB substrates 110 are all facing the same side. The first light emitting chip 140 and the second light emitting chip 120 are arranged on the setting surfaces of the first PCB substrates 110.

[0089] Step 2: forming a first adhesive film on the setting surface and the first light emitting chip 140;

[0090] Step 3: forming a second adhesive film on the first adhesive film and the second light emitting chip 120;

[0091] Step 4: Cut the main board and the adhesive film to separate the first PCB substrates 110 to obtain a light-emitting device.

[0092] The light-emitting device manufacturing method provides a main body plate including a plurality of first PCB substrates 110, arranges and connects the plurality of first PCB substrates 110 in an array, realizes batch manufacturing of a plurality of light-emitting devices, and improves production efficiency. The first adhesive film and the second adhesive film are formed through detailed steps, ensuring stable adhesion between the adhesive film and the light-emitting component, improving the reliability of the manufacturing process and the stability of product quality. Independent light-emitting devices are obtained by cutting the main body plate and the adhesive film, thereby simplifying the production process and improving production efficiency.

[0093] In this embodiment, the first adhesive film includes a thermosetting resin, and step two includes the following detailed steps: using a thermoplastic curing method to mold and bond the first adhesive film to the first adhesive film; and the second adhesive film includes a thermosetting resin, and step three includes the following detailed steps: using a thermoplastic curing method to mold and bond the second adhesive film to the first adhesive film and the light-emitting component.

[0094] Thermosetting resin is used as the film material, and the film is firmly molded and bonded by thermoplastic curing, which improves the adhesion and durability of the film, helps to simplify the production process and improve production efficiency, and helps to extend the service life. The detailed curing steps ensure the uniformity and consistency of the thermosetting resin during the curing process, improving product quality and reliability. Moreover, the overall thermal curing process is easy to control and suitable for large-scale production.

[0095] Specifically, the main materials of the first adhesive film and the second adhesive film both include thermosetting resins, which have high bonding strength and can maintain good performance in high temperature environments. The added curing agent is mixed to exert its bonding properties, promote the cross-linking reaction of the epoxy resin, and form an insoluble thermosetting polymer. The resulting chemical bonding and physical entanglement allow the first adhesive film and the second adhesive film to form a strong bond, thereby allowing them to be directly molded and bonded using a thermoplastic curing method.

[0096] Embodiment 2

[0097] like Figure 1 , Figures 8 to 12 As shown, the light-emitting device of the second embodiment is basically the same as the first embodiment, and the difference between the two is that the first adhesive film includes an adhesive film block 400, the second adhesive film includes a third adhesive film layer 500, the number of the adhesive film blocks 400 is the same as the number of the first light-emitting chips 140, the third adhesive film layer 500 is provided with blind holes 501, the blind holes 501 extend along the thickness direction of the first PCB substrate 110, and the number of the blind holes 501 is the same as the number of the first light-emitting chips 140, and one adhesive film block 400 and one first light-emitting chip 140 fill one blind hole 501.

[0098] By providing the same number of adhesive film blocks 400 as the first light-emitting chip 140 and opening a blind hole 501 in the third adhesive film layer 500, accurate positioning and light guiding of the first light-emitting chip 140 are achieved, thereby optimizing the propagation path of the light and completing the optimization design of the light efficiency utilization rate and overall light uniformity of the first light-emitting chip 140. Moreover, the arrangement of multiple adhesive film blocks 400 can reduce the demand for the first adhesive film, which helps to reduce the production cost of the light-emitting device.

[0099] Furthermore, the film block 400 is concavely provided with a receiving groove, and the first light emitting chip 140 fills the receiving groove.

[0100] The design of the recessed receiving groove of the film block 400 can ensure that the first light-emitting chip 140 is completely embedded in the receiving groove, thereby ensuring the structural stability of the first light-emitting chip 140 and the effective transmission and scattering of light, improving the light efficiency guidance of the light-emitting device and enhancing the overall light-emitting effect.

[0101] In this embodiment, the third adhesive film layer 500 is bonded to the first PCB substrate 110 , and the third adhesive film layer 500 is bonded to the adhesive film block 400 .

[0102] The design of bonding the third adhesive film layer 500 to the first PCB substrate 110 and bonding the third adhesive film layer 500 to the adhesive film block 400 ensures the stability and consistency of the light-emitting device and realizes overall light regulation.

[0103] This embodiment further provides a light-emitting module, including a second PCB substrate and at least one of the above-mentioned light-emitting devices, the light-emitting device is arranged on the second PCB substrate, and the side of the first PCB substrate 110 away from the setting surface is connected to the second PCB substrate.

[0104] The light-emitting module realizes a stable connection between the light-emitting device and the substrate by setting the light-emitting device on the second PCB substrate, thereby improving the structural integrity and stability of the entire light-emitting module. By connecting the side of the first PCB substrate 110 away from the setting surface to the second PCB substrate, convenient installation and modular design of the light-emitting device are realized, making the light-emitting module easier to assemble and use, and improving production efficiency and installation efficiency.

[0105] This embodiment also provides a method for manufacturing a light emitting device, which is used to manufacture the above-mentioned light emitting device, and includes the following steps:

[0106] Step 1: Provide a main body panel, a first light emitting chip 140 and a second light emitting chip 120. The main body panel includes a plurality of first PCB substrates 110. The plurality of first PCB substrates 110 are arranged in an array and connected. The setting surfaces of the plurality of first PCB substrates 110 are all facing the same side. The first light emitting chip 140 and the second light emitting chip 120 are arranged on the setting surfaces of the first PCB substrates 110.

[0107] Step 2: forming a first adhesive film on the setting surface and the first light emitting chip 140;

[0108] Step 3: forming a second adhesive film on the first adhesive film and the second light emitting chip 120;

[0109] Step 4: Cut the main board and the adhesive film to separate the first PCB substrates 110 to obtain a light-emitting device.

[0110] The light-emitting device manufacturing method provides a main body plate including a plurality of first PCB substrates 110, arranges and connects the plurality of first PCB substrates 110 in an array, realizes batch manufacturing of a plurality of light-emitting devices, and improves production efficiency. The first adhesive film and the second adhesive film are formed through detailed steps, ensuring stable adhesion between the adhesive film and the light-emitting component, improving the reliability of the manufacturing process and the stability of product quality. Independent light-emitting devices are obtained by cutting the main body plate and the adhesive film, thereby simplifying the production process and improving production efficiency.

[0111] In this embodiment, the first adhesive film includes a thermosetting resin, and step two includes the following detailed steps: using a thermoplastic curing method to mold and bond the first adhesive film to the first adhesive film; and the second adhesive film includes a thermosetting resin, and step three includes the following detailed steps: using a thermoplastic curing method to mold and bond the second adhesive film to the first adhesive film and the light-emitting component.

[0112] Thermosetting resin is used as the film material, and the film is firmly molded and bonded by thermoplastic curing, which improves the adhesion and durability of the film, helps to simplify the production process and improve production efficiency, and helps to extend the service life. The detailed curing steps ensure the uniformity and consistency of the thermosetting resin during the curing process, improving product quality and reliability. Moreover, the overall thermal curing process is easy to control and suitable for large-scale production.

[0113] Specifically, the main materials of the first adhesive film and the second adhesive film both include thermosetting resins, which have high bonding strength and can maintain good performance in high temperature environments. The added curing agent is mixed to exert its bonding properties, promote the cross-linking reaction of the epoxy resin, and form an insoluble thermosetting polymer. The resulting chemical bonding and physical entanglement allow the first adhesive film and the second adhesive film to form a strong bond, thereby allowing them to be directly molded and bonded using a thermoplastic curing method.

[0114] Obviously, the above embodiments of the present invention are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A light emitting device, characterized in that: include: A light-emitting component, comprising a first PCB substrate, a first light-emitting chip and a second light-emitting chip, wherein one side of the first PCB substrate has a setting surface, the first light-emitting chip and the second light-emitting chip are both arranged on the setting surface, and a light-emitting angle of the first light-emitting chip is smaller than a light-emitting angle of the second light-emitting chip; A first adhesive film is disposed on the installation surface, and the first adhesive film covers the first light-emitting chip, and the first adhesive film is spaced apart from the second light-emitting chip; A second adhesive film, wherein the second adhesive film covers the second light-emitting chip, and the second adhesive film covers and is connected to the light-emitting component and the first adhesive film, so that the first adhesive film is arranged between the second adhesive film and the light-emitting component, and the refractive index of the first adhesive film is greater than the refractive index of the second adhesive film.

2. The light emitting device according to claim 1, characterized in that: The first adhesive film includes a first adhesive film layer, the second adhesive film includes a second adhesive film layer, the first PCB substrate, the first adhesive film layer and the second adhesive film layer are stacked in sequence from bottom to top, the first adhesive film layer is penetrated by through holes, the number of the through holes is the same as the number of the second light-emitting chips, and each of the second light-emitting chips is placed in one of the through holes.

3. The light emitting device according to claim 2, characterized in that: The surface of the second adhesive film layer is provided with protrusions, the number of the protrusions is the same as the number of the through holes, and one protrusion and one second light-emitting chip fill one through hole.

4. The light emitting device according to claim 3, characterized in that: The first adhesive film layer is bonded to the second adhesive film layer, and the first adhesive film layer is bonded to the first PCB substrate.

5. The light emitting device according to claim 1, characterized in that: The first adhesive film includes an adhesive film block, the second adhesive film includes a third adhesive film layer, the number of the adhesive film blocks is the same as the number of the first light-emitting chips, the third adhesive film layer is provided with blind holes, the blind holes extend along the thickness direction of the first PCB substrate, and the number of the blind holes is the same as the number of the first light-emitting chips, and one adhesive film block and one first light-emitting chip fill one blind hole.

6. The light emitting device according to claim 5, characterized in that: The film block is concavely provided with a receiving groove, and the first light-emitting chip fills the receiving groove.

7. The light emitting device according to claim 5, characterized in that: The third adhesive film layer is bonded to the first PCB substrate, and the third adhesive film layer is bonded to the adhesive film block.

8. The light emitting device according to claim 1, characterized in that: The scattering distance is greater than the thickness of the first light-emitting chip, wherein the scattering distance is the distance between an end of the first light-emitting chip away from the first PCB substrate and an end of the first adhesive film away from the first PCB substrate in the thickness direction of the first PCB substrate.

9. The light emitting device according to claim 1, characterized in that: The material of the first adhesive film includes organic silicone, epoxy resin and light-guiding adhesive; and / or, The material of the second adhesive film includes organic silicone, epoxy resin and light-guiding adhesive.

10. The light emitting device according to claim 1, characterized in that: The first adhesive film contains first scattering powder, and the refractive index of the first adhesive film is in the range of 2.0-2.

5.

11. The light emitting device according to claim 10, characterized in that: The first scattering powder includes zinc oxide, titanium oxide or zirconium oxide.

12. The light emitting device according to claim 1, characterized in that: The second adhesive film contains second scattering powder, and the refractive index of the second adhesive film is in the range of 1.3-1.

7.

13. The light emitting device according to claim 12, characterized in that: The second scattering powder includes silicon dioxide, silicone resin microspheres and epoxy resin microspheres.

14. The light emitting device according to claim 1, characterized in that: There is a gap between the second light-emitting chip and the first light-emitting chip, and the gap is at least filled with the first adhesive film.

15. The light emitting device according to any one of claims 1 to 14, characterized in that: The light-emitting component includes one first light-emitting chip and two second light-emitting chips, wherein the first light-emitting chip is a red light chip, and one of the two second light-emitting chips is a blue light chip and the other is a green light chip.

16. A light emitting module, characterized in that: It comprises a second PCB substrate and at least one light-emitting device according to any one of claims 1 to 15, wherein the light-emitting device is arranged on the second PCB substrate, and a side of the first PCB substrate facing away from the setting surface is connected to the second PCB substrate.

17. A method for manufacturing a light emitting device, characterized in that: The method for manufacturing a light emitting device according to any one of claims 1 to 16 comprises the following steps: S1. Provide a main body panel, the first light-emitting chip and the second light-emitting chip, wherein the main body panel includes a plurality of the first PCB substrates, the plurality of the first PCB substrates are arranged in an array and connected, the setting surfaces of the plurality of the first PCB substrates are all facing the same side, and the first light-emitting chip and the second light-emitting chip are arranged on the setting surfaces of the first PCB substrates; S2, forming the first adhesive film on the setting surface and the first light-emitting chip; S3, forming a second adhesive film on the first adhesive film and the second light-emitting chip; S4, cutting the main body plate and the adhesive film to separate the first PCB substrates to obtain the light-emitting device.

18. The method for manufacturing a light emitting device according to claim 17, characterized in that: The first adhesive film includes a thermosetting resin, and S2 includes the following detailed steps: S21, using thermoplastic curing to mold and adhere the first adhesive film to the first adhesive film; and / or, The second adhesive film includes a thermosetting resin, and S3 includes the following detailed steps: S31, using thermoplastic curing to mold and bond the second adhesive film to the first adhesive film and the light-emitting component.

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