Packaging piece and packaging method of glass light-emitting device

Abstract

The invention belongs to the technical field of glass packaging, and particularly relates to a packaging piece and a packaging method of a glass light-emitting device, and the packaging piece and the packaging method of the glass light-emitting device comprise a top glass base layer, an ITO (Indium Tin Oxide) layer, a coating layer, a light-emitting organic matter layer, an anode layer and a bottom glass base layer which are sequentially evaporated from top to bottom, the areas of the ITO layer, the coating layer, the light-emitting organic matter layer and the anode layer are the same; the areas of the top glass base layer and the bottom glass base layer are larger than those of the ITO layer, the coating layer, the light-emitting organic matter layer and the anode layer, the side edges of the ITO layer, the coating layer, the light-emitting organic matter layer and the anode layer are provided with dispensing UV layers in a dispensing mode, and the dispensing UV layers are arranged in the space between the top glass base layer and the bottom glass base layer; the packaging piece and the packaging method of the glass light-emitting device have the advantages that the side edge of the glass substrate can be sealed, invasion of foreign matter or water vapor is prevented, the sealing performance of the side edge of the glass substrate is improved, and the overall service life is prolonged.

Description

Technical Field

[0001] The present invention belongs to the technical field of glass packaging, and in particular relates to a packaging component and a packaging method of a glass light-emitting device. Background Art

[0002] In the field of display technology, flat panel display technology (LCD, OLED) has gradually replaced CRT displays. Planar light source technology is a new type of light source. The packaging effect of the bonding and welding of two glass substrates will directly affect the performance of the device.

[0003] Glass substrates are generally packaged using UV curing technology and Frit packaging technology. UV curing technology: no solvent or a small amount of solvent, which reduces the pollution of solvents to the environment; low energy consumption, low temperature curing, suitable for heat-sensitive materials; fast curing speed, high efficiency, can be used on high-speed production lines, curing equipment occupies a small area, etc. However, since the UV glue used to bond the two glass substrates is an organic material, the molecular gap is large after curing, and water vapor and oxygen can easily penetrate the medium to reach the internal sealing area, so it is more suitable for application fields that are not very sensitive to water vapor and oxygen, such as LCD.

[0004] Frit packaging technology is a new glass substrate packaging technology currently under development. Glass powder is mixed into a solution with a certain viscosity, coated on the packaging glass, heated to remove the solvent, and then bonded to the glass to be packaged. The glass powder is instantly melted by laser to bond the two glass substrates together. Frit packaging technology uses inorganic packaging media, so it has a strong ability to block water vapor and oxygen, and is particularly suitable for OLED technology that is sensitive to water vapor and oxygen. At present, the technical patents of frit packaging are monopolized by a few foreign companies.

[0005] However, the use of UV curing technology requires the use of UV glue as an adhesive, which requires the coating of adhesive on the glass substrate during the manufacturing process, and increases the cost of adhesive materials. The use of Frit packaging technology requires the use of glass powder as an adhesive, which also increases the process of coating glass powder. If the glass powder has poor adhesiveness, it will also lead to packaging failure.

[0006] In the prior art, the sides of the glass substrate cured by ultraviolet light curing or glass powder glue are exposed to the outside and are easily invaded by external water vapor or foreign matter, causing damage or abnormality of the glass light-emitting device formed by the glass substrate. Summary of the invention

[0007] The object of the present invention is to provide a glass light-emitting device package and a packaging method to solve the technical problem that the sides of the glass substrate are exposed after being cured by ultraviolet light curing or glass powder glue, and are easily invaded by external water vapor or foreign matter, causing damage or abnormality of the glass light-emitting device formed by the glass substrate, so as to achieve the purpose of sealing the side of the glass substrate, preventing the invasion of foreign matter or water vapor, improving the sealing of the side of the glass substrate, and improving the overall service life.

[0008] In order to solve the above technical problems, the present invention provides a glass light-emitting device package, comprising:

[0009] A top glass substrate, an ITO layer, a coating layer, a light-emitting organic layer, an anode layer and a bottom glass substrate, wherein the ITO layer, the coating layer, the light-emitting organic layer and the anode layer have the same area;

[0010] The areas of the top glass substrate and the bottom glass substrate are larger than the ITO layer, the coating layer, the light-emitting organic layer and the anode layer. The side edges of the ITO layer, the coating layer, the light-emitting organic layer and the anode layer are glued with a glue-dispensing UV layer, and the glue-dispensing UV layer is arranged in the middle space between the top glass substrate and the bottom glass substrate;

[0011] A drying layer is arranged outside the glue-dispensing UV layer, and a UV water and oxygen barrier layer is arranged outside the drying layer.

[0012] Furthermore, the dispensing UV layer has a thickness of 12-13 microns and a width of 0.1-0.2 millimeters.

[0013] Furthermore, the thickness of the top glass substrate and the bottom glass substrate is 0.1-0.7 mm.

[0014] Furthermore, the upper portion of the UV water and oxygen barrier layer is connected to the side of the top glass substrate to cover the top glass substrate, the ITO layer, the coating layer, the light-emitting organic layer, and the anode layer.

[0015] Another object of the present invention is to provide a packaging method for a glass light emitting device package.

[0016] The packaging method of the package comprising the glass light-emitting device as described above comprises the following steps:

[0017] Step 1: sequentially depositing an ITO layer, a coating layer, a light-emitting organic layer, and an anode layer;

[0018] Step 2: Evaporating a bottom glass substrate under the evaporated ITO layer, coating layer, light-emitting organic layer, and anode layer;

[0019] Step 3: Evaporating a top glass substrate on the upper part of the evaporated ITO layer, the coating layer, the light-emitting organic layer, and the anode layer;

[0020] Step 4: Apply UV glue to the circumference of the evaporated ITO layer, the coating layer, the light-emitting organic layer, and the anode layer to form a UV glue layer;

[0021] Step 5: Apply on the outside of the dispensing UV layer to form a dry layer;

[0022] Step six, coating the outside of the dry layer to form a UV water and oxygen barrier layer.

[0023] Furthermore, in step 4, the energy of dispensing is 365 nanometers in wavelength, 8000-9000 mj / cm2.

[0024] The beneficial effects of the present invention are:

[0025] 1. By dispensing the UV layer on the sides of the ITO layer, coating layer, light-emitting organic layer, and anode layer, a side protection layer is formed, which can reduce the invasion of external foreign matter, initially improve the strength of the product side, and reduce the structural dislocation in the middle of the glass substrate, thereby improving the overall strength and stability of use, and also prolonging the service life.

[0026] 2. Through the drying layer, a double-layer structure can be formed on the outer layer, which can not only improve the structural stability and waterproofness of the external protection, but also absorb excess moisture from the internal UV layer and the external UV water and oxygen barrier layer, and absorb both the internal and external moisture into the drying layer, thus playing a double drying role.

[0027] 3. Through the UV water and oxygen barrier layer, not only can a three-layer structure be formed to further enhance the overall strength of the structure, but it can also protect against external water vapor and oxygen, improve internal dryness and safety, and extend the service life of the overall product.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a structural schematic diagram of a packaging component and a packaging method of a glass light-emitting device of the present invention.

[0031] In the figure:

[0032] 1. Top glass base layer;

[0033] 2. ITO layer;

[0034] 3. Coating layer;

[0035] 4. Light-emitting organic layer;

[0036] 5. Anode layer;

[0037] 6. Bottom glass substrate;

[0038] 7. Glue UV layer;

[0039] 8. Drying layer;

[0040] 9. UV water and oxygen barrier layer. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] Example:

[0043] like Figure 1 As shown, a package of a glass light-emitting device includes, from top to bottom, the following: a top glass substrate 1, an ITO layer 2, a coating layer 3, a light-emitting organic layer 4, an anode layer 5, and a bottom glass substrate 6, wherein the areas of the ITO layer 2, the coating layer 3, the light-emitting organic layer 4, and the anode layer 5 are the same. The thickness of the top glass substrate 1 and the bottom glass substrate 6 is 0.1-0.7 mm.

[0044] The top glass substrate 1 and the bottom glass substrate 6 have larger areas than the ITO layer 2, the coating layer 3, the light-emitting organic layer 4 and the anode layer 5. The side edges of the ITO layer 2, the coating layer 3, the light-emitting organic layer 4 and the anode layer 5 are glued with a glue-dispensing UV layer 7, which is disposed in the middle space between the top glass substrate 1 and the bottom glass substrate 6. The glue-dispensing UV layer 7 has a thickness of 12-13 microns and a width of 0.1-0.2 millimeters.

[0045] like Figure 1 As shown, a drying layer 8 is disposed outside the dispensing UV layer 7, and a UV water and oxygen barrier layer 9 is disposed outside the drying layer 8. The upper part of the UV water and oxygen barrier layer 9 is connected to the side of the top glass substrate 1 to cover the top glass substrate 1, the ITO layer 2, the coating layer 3, the light-emitting organic layer 4, and the anode layer 5.

[0046] Embodiment 2: A packaging method for a glass light-emitting device package, including the above glass light-emitting device package, the packaging method comprising the following steps:

[0047] Step 1: sequentially depositing an ITO layer 2, a coating layer 3, a light-emitting organic layer 4, and an anode layer 5;

[0048] Step 2: Evaporating a bottom glass substrate 6 under the evaporated ITO layer 2, the coating layer 3, the light-emitting organic layer 4, and the anode layer 5;

[0049] Step 3: Evaporating the top glass substrate 1 on the upper part of the evaporated ITO layer 2, the coating layer 3, the light-emitting organic layer 4, and the anode layer 5;

[0050] Step 4: Apply UV glue in the circumferential direction of the evaporated ITO layer 2, the coating layer 3, the light-emitting organic layer 4, and the anode layer 5 to form a UV glue layer 7; the energy of the glue application is 365 nanometers in wavelength, 8000-9000mj / cm2.

[0051] Step 5: coating the outside of the dispensing UV layer 7 to form a drying layer 8;

[0052] Step six: coating the outside of the drying layer 8 to form a UV water and oxygen barrier layer 9.

[0053] In summary: by dispensing the UV layer 7 on the sides of the ITO layer 2, the coating layer 3, the light-emitting organic layer 4, and the anode layer 5, a side protection layer is formed, which can reduce the invasion of external foreign matter, preliminarily improve the strength of the product side, and reduce the structural dislocation in the middle of the glass substrate, improve the overall strength and stability of use, and also improve the service life. Through the drying layer 8, a double-layer structure can be formed on the outer layer, which can not only improve the structural stability and waterproofness of the external protection, but also absorb excess moisture from the internal dispensing UV layer 7 and the external UV water and oxygen barrier layer 9, and absorb both the internal and external moisture into the drying layer 8, playing a double drying role. Through the UV water and oxygen barrier layer 9, not only can a three-layer structure be formed to further improve the overall strength of the structure, but it can also protect against external water vapor and oxygen, improve internal dryness and safety, and improve the service life of the overall product.

[0054] The various devices selected in this application are all universal standard parts or parts known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0055] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0057] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A glass light emitting device package, characterized in that: Including evaporation from top to bottom: A top glass substrate (1), an ITO layer (2), a coating layer (3), a light-emitting organic layer (4), an anode layer (5) and a bottom glass substrate (6), wherein the ITO layer (2), the coating layer (3), the light-emitting organic layer (4) and the anode layer (5) have the same area; The areas of the top glass substrate (1) and the bottom glass substrate (6) are larger than those of the ITO layer (2), the coating layer (3), the light-emitting organic layer (4) and the anode layer (5); the sides of the ITO layer (2), the coating layer (3), the light-emitting organic layer (4) and the anode layer (5) are glued with a glue-dispensing UV layer (7); and the glue-dispensing UV layer (7) is arranged in the middle space between the top glass substrate (1) and the bottom glass substrate (6); A drying layer (8) is arranged on the outside of the glue-dispensing UV layer (7), and a UV water and oxygen barrier layer (9) is arranged on the outside of the drying layer (8).

2. A glass light emitting device package as claimed in claim 1, characterized in that: The dispensing UV layer (7) has a thickness of 12-13 micrometers and a width of 0.1-0.2 millimeters.

3. A glass light emitting device package as claimed in claim 2, characterized in that: The thickness of the top glass substrate (1) and the bottom glass substrate (6) is 0.1-0.7 mm.

4. A glass light emitting device package as claimed in claim 3, characterized in that: The upper part of the UV water and oxygen barrier layer (9) is connected to the side of the top glass substrate (1) to cover the top glass substrate (1), the ITO layer (2), the coating layer (3), the light-emitting organic layer (4), and the anode layer (5).

5. A method for packaging a glass light-emitting device package, characterized in that: A packaging component comprising a glass light emitting device as claimed in any one of claims 1 to 4, wherein the packaging method comprises the following steps: Step 1: sequentially evaporating an ITO layer (2), a coating layer (3), a light-emitting organic layer (4), and an anode layer (5); Step 2: vapor-depositing a bottom glass substrate (6) below the vapor-deposited ITO layer (2), the coating layer (3), the light-emitting organic layer (4), and the anode layer (5); Step 3: vapor-depositing a top glass substrate (1) on the vapor-deposited ITO layer (2), the coating layer (3), the light-emitting organic layer (4), and the anode layer (5); Step 4: applying UV glue in the circumferential direction of the vapor-deposited ITO layer (2), the coating layer (3), the light-emitting organic layer (4), and the anode layer (5) to form a UV glue-applied layer (7); Step 5: coating the outside of the UV coating (7) to form a drying layer (8); Step six, coating the outside of the drying layer (8) to form a UV water and oxygen barrier layer (9).

6. A method for packaging a glass light emitting device package as claimed in claim 5, characterized in that: In step 4, the energy of dispensing is 365 nanometers in wavelength, 8000-9000 mj / cm2.

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