Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device.The display panel comprises a substrate, a dam, a first partition structure, a light-emitting device layer and a first insulation part, and the dam and the first partition structure are both arranged on the substrate and located in a packaging region; the first partition structure is arranged on the side, close to the display area, of the dam, and undercut openings are formed in the two sides of the first partition structure in the first direction. The light-emitting device layer is arranged on the substrate and comprises a first part located in the display area and a second part located in the packaging area, the first part and the second part are separated from each other, and the second part is located on the side, away from the substrate, of the first partition structure; the first insulating part is arranged between the second part of the light-emitting device layer and the first partition structure, the first insulating part covers part of the first partition structure, and the first insulating part is made of an inorganic material, so that corrosion of chemical treatment liquid to the first partition structure in the manufacturing process of the display panel is effectively isolated; and the stability and reliability of the first partition structure are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) displays have many advantages such as light weight, active light emission, fast response speed, large viewing angle, wide color gamut, high brightness and low power consumption, and have gradually become a new generation of display technology after liquid crystal displays (LCD). In order to realize the image acquisition function, laser cutting is usually performed in the display area of ​​the OLED display panel to form an open hole design (O-Cut), and photosensitive components such as cameras are set in the open hole area. However, the metal film layer at the edge of the cut in the open hole area has an uncontrollable side engraving problem, which seriously affects the performance and reliability of the device.

[0003] Specifically, in the photolithography process, the developer in the development (PHO Development) process and the etching acid in the anode layer etching process may affect the side etching amount of the metal film layer. Especially in the Ti-Al-Ti sandwich structure, the side wall of the aluminum layer (Al) is easily damaged due to excessive corrosion, resulting in the collapse of the top titanium layer (Top Ti) structure. This structural defect directly threatens the functional stability and long-term reliability of OLED devices. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device to alleviate the deficiencies in the related art.

[0005] To achieve the above functions, the technical solutions provided by the embodiments of the present application are as follows:

[0006] An embodiment of the present application provides a display panel, including a display area and a packaging area located on at least one side of the display area, wherein the display panel includes:

[0007] substrate;

[0008] A dam, disposed on the substrate and located within the packaging area;

[0009] A first partition structure, disposed on the substrate and located in the packaging area, the first partition structure is disposed on a side of the dam close to the display area, and the first partition structure is provided with undercut openings on both sides along a first direction, the first direction being a direction from the display area to the packaging area;

[0010] a light-emitting device layer, disposed on the substrate, the light-emitting device layer comprising a first portion located in the display area and a second portion located in the encapsulation area, the first portion and the second portion being separately disposed, and the second portion being located on a side of the first partition structure away from the substrate; and

[0011] The first insulating part is disposed between the second part and the first partition structure, and the first insulating part covers a portion of the first partition structure. The material of the first insulating part is an inorganic material.

[0012] Optionally, in one embodiment, the first partition structure includes at least two first partition portions spaced apart along the first direction;

[0013] The first insulating portion is disposed between two adjacent first partition portions and on a side of the two first partition portions away from the substrate.

[0014] Optionally, in one embodiment, along the first direction, a side surface of the first partition portion away from the first insulating portion is provided with the undercut opening, and a side surface of the first partition portion close to the first insulating portion is perpendicular to the base;

[0015] The first insulating portion extends from a region between two adjacent first partition portions to the tops of the two first partition portions, and the first insulating portion is in direct contact with a first side surface of the first partition portion;

[0016] The first side surface is a side surface of the first partition portion close to the first insulating portion.

[0017] Optionally, in one embodiment, the display panel further comprises a first insulating layer, the first insulating layer is disposed on the substrate, the first insulating layer comprises the first insulating portion and the second insulating portion which are spaced apart, and the second insulating portion is disposed between the dam and the substrate;

[0018] The orthographic projection of the dam on the substrate covers the orthographic projection of the second insulating portion on the substrate.

[0019] Optionally, in one embodiment, the display panel includes a second insulating layer, and the second insulating layer is provided between the substrate and the first insulating layer;

[0020] The first insulating layer contacts a side of the second insulating layer away from the substrate, and a material of the first insulating layer is the same as a material of the second insulating layer.

[0021] Optionally, in one embodiment, the display panel further includes a functional area, and the encapsulation area is arranged between the display area and the functional area; the display panel further includes:

[0022] A second partition structure is provided on the substrate and in the packaging area, the second partition structure is provided on a side of the dam close to the functional area, the second partition structure comprises a plurality of second partition portions spaced apart along the first direction, and each of the second partition portions is provided with the undercut openings on both sides along the first direction;

[0023] Wherein, the first insulating portion and the second partition structure are arranged non-overlappingly.

[0024] Optionally, in one embodiment, the display panel includes a thin film transistor layer, the thin film transistor layer is provided on the substrate, the thin film transistor layer includes a first metal layer, the first metal layer includes the first partition structure and the second partition structure, and the first partition structure and the second partition structure each include a first film layer, a second film layer and a third film layer that are stacked;

[0025] The undercut opening is opened at a side of the second film layer, and the first insulating portion covers the first film layer of the first partition structure.

[0026] An embodiment of the present application provides a method for manufacturing a display panel, wherein the display panel includes a display area and a packaging area located on at least one side of the display area. The method for manufacturing the display panel includes:

[0027] providing a substrate;

[0028] forming a first partition structure and a first insulating layer on the substrate in sequence, wherein the first partition structure is located in the encapsulation area, the first insulating layer covers the first partition structure, and the material of the first insulating layer is an inorganic material;

[0029] forming a dam on the substrate, wherein the dam is located in the encapsulation area and the dam is located on a side of the first partition structure close to the display area;

[0030] Patterning the first insulating layer to form a first insulating portion, wherein the first insulating portion covers a portion of the first partition structure;

[0031] The first partition structure is patterned to open undercut openings on both sides of the first partition structure along a first direction, where the first direction is a direction from the display area to the packaging area.

[0032] Optionally, in one embodiment, the step of patterning the first insulating layer further includes:

[0033] A second insulating portion is formed, wherein the second insulating portion is disposed between the dam and the substrate; wherein an orthographic projection of the dam on the substrate covers an orthographic projection of the second insulating portion on the substrate.

[0034] An embodiment of the present application provides a display device, comprising any of the display panels described above.

[0035] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device, wherein the display panel includes a substrate, a dam, a first partition structure, a light-emitting device layer and a first insulating portion, wherein the dam and the first partition structure are both arranged on the substrate and located in the packaging area; the first partition structure is arranged on a side of the dam close to the display area, and bottom cut openings are arranged on both sides thereof along the first direction; the light-emitting device layer is arranged on the substrate, including a first part located in the display area and a second part located in the packaging area, the first part and the second part are separated from each other, and the second part is located on a side of the first partition structure away from the substrate; by arranging a first insulating portion between the second part of the light-emitting device layer and the first partition structure, and making the first insulating portion cover part of the first partition structure, the material of the first insulating portion is an inorganic material, thereby effectively isolating the first partition structure from the erosion of the chemical treatment liquid during the manufacturing process of the display panel, improving the stability and reliability of the first partition structure, and thereby improving the manufacturing process stability and service life of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0038] Figure 2 The embodiments of the present application provide Figure 1 The enlarged schematic diagram at A in the middle;

[0039] Figure 3 The embodiments of the present application provide Figure 2 Schematic diagram of the cross section corresponding to B-Bˋ;

[0040] Figure 4 The embodiments of the present application provide Figure 3 The enlarged schematic diagram of the center C;

[0041] Figure 5 The embodiments of the present application provide Figure 3 The enlarged schematic diagram of point D in the middle;

[0042] Figure 6 The embodiments of the present application provide Figure 3 The enlarged schematic diagram of point E in the middle;

[0043] Figure 7 A flowchart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0044] FIG. 8A to FIG. 8E for Figure 7 The structural process flow chart of panel production is shown in the figure;

[0045] Fig. 9 A schematic diagram of the structure of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the actual use or working mode of the device, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only, and the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] The disclosure below provides many different embodiments to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0050] See also Figure 1 , Figure 2 and Figure 3 ;in, Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application; Figure 2 The embodiments of the present application provide Figure 1 The enlarged schematic diagram at A in the middle; Figure 3 The embodiments of the present application provide Figure 2 Schematic diagram of the cross section corresponding to B-Bˋ; Figure 4 The embodiments of the present application provide Figure 3 Enlarged schematic diagram of point C in the middle.

[0051] The present embodiment provides a display panel 1, which includes a display area 1000, a functional area 2000 and a packaging area 3000 located between the display area 1000 and the functional area 2000; wherein, laser cutting can be used to form an open hole design (O-Cut) in the functional area 2000, and a mounting hole 1a is opened in the functional area 2000, and a photosensitive component such as a camera can be correspondingly arranged in the mounting hole 1a.

[0052] The display panel 1 includes a stacked substrate 11, a light-shielding layer 12, a thin-film transistor layer 13, a light-emitting device layer 14, a spacer layer 15 and an encapsulation layer (not shown in the figure); wherein the thin-film transistor layer 13 includes a first thin-film transistor 1301 and a second thin-film transistor 1302 arranged at intervals, the first thin-film transistor 1301 includes a polycrystalline silicon semiconductor layer located on the substrate 11, and the second thin-film transistor 1302 includes an oxide semiconductor layer located on the substrate 11.

[0053] Specifically, the base 11 includes a first substrate 111, a spacer layer 112, a second substrate 113, a buffer layer 114 and a covering layer 115 which are stacked in sequence, and the shading layer 12 is arranged between the second substrate 113 and the buffer layer 114; wherein, the first substrate 111 and the second substrate 113 can both be rigid substrates or flexible substrates. When the first substrate 111 and the second substrate 113 are both rigid substrates, the material can be metal or glass. When the first substrate 111 and the second substrate 113 are both flexible substrates, the material can include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane-based resin, cellulose resin, siloxane resin, polyimide-based resin and polyamide-based resin; the material of the spacer layer 112 includes but is not limited to silicon nitride, silicon oxide and other materials with water absorption properties. This embodiment does not limit the materials of the first substrate 111, the second substrate 113 and the spacer layer 112.

[0054] The thin film transistor layer 13 includes a first semiconductor layer 131 stacked on the substrate 11, a first gate insulating layer 132, a first electrode layer 133, a second gate insulating layer 134, a second electrode layer 135, a first interlayer insulating layer 136, a second semiconductor layer 137, a third gate insulating layer 138, a third electrode layer 139, a second interlayer insulating layer 1310, a first metal layer 1311, a first flat layer 1312, a second metal layer 1313, a second flat layer 1314 and a third flat layer 1315; wherein the first electrode layer 133 includes a first gate 1 331, the second electrode layer 135 includes a second gate 1351 and a third gate 1352 which are spaced apart, the third electrode layer 139 includes a fourth gate 1391, the first metal layer 1311 includes a first source-drain electrode 13111 and a second source-drain electrode 13112, and the second metal layer 1313 includes a bridging layer 13131; wherein the first flat layer 1312, the second flat layer 1314 and the third flat layer 1315 all include organic materials, and the first interlayer insulating layer 136 and the second interlayer insulating layer 1310 all include inorganic materials.

[0055] The material of the first semiconductor layer 131 includes but is not limited to polysilicon, and the material of the second semiconductor layer 137 includes but is not limited to oxide. The first semiconductor layer 131 forms a polysilicon semiconductor layer of each low-temperature polysilicon transistor, and the second semiconductor layer 137 forms an oxide semiconductor layer of each oxide transistor; wherein the first semiconductor layer 131 and the second semiconductor layer 137 are both arranged corresponding to the light-shielding layer 12.

[0056] The first gate 1331, the second gate 1351, the third gate 1352, the fourth gate 1391, the first source-drain electrode 13111 and the second source-drain electrode 13112 may all include low-resistance metal materials, such as conductive materials such as molybdenum (Mo), aluminum (Al), copper (Cu) and / or titanium (Ti), and may include a single-layer structure or a multi-layer composite structure having the above materials; wherein the first gate 1331 and the second gate 1351 are both set corresponding to the first semiconductor layer 131, and the third gate 1352 and the fourth gate 1391 are both set corresponding to the second semiconductor layer 137.

[0057] The first source-drain electrode 13111 includes a first source 13111A and a first drain 13111B which are spaced apart from each other, and the first source 13111A and the first drain 13111B are electrically connected to the first semiconductor layer 131; the second source-drain electrode 13112 includes a second source 13112A and a second drain 13112B which are spaced apart from each other, and the second source 13112A and the second drain 13112B are electrically connected to the second semiconductor layer 137; wherein the first semiconductor layer 131 and the second semiconductor layer 137 may be electrically connected via the second source 13112A.

[0058] Specifically, the first thin film transistor 1301 includes the first semiconductor layer 131, the first gate 1331, the second gate 1351 and the first source-drain electrode 13111 which are stacked; the second thin film transistor 1302 includes the third gate 1352, the second semiconductor layer 137, the fourth gate 1391 and the second source-drain electrode 13112 which are stacked.

[0059] The mounting hole 1a may pass through a plurality of film layers located on / above the substrate 11, such as a buffer layer 114, a first gate insulating layer 132, a second gate insulating layer 134, a first interlayer insulating layer 136, a third gate insulating layer 138, a second interlayer insulating layer 1310, a first flat layer 1312, a second flat layer 1314 and a third flat layer 1315, or may pass through the substrate 11, and this embodiment does not impose any specific restrictions on this; wherein the mounting hole 1a may have any one of various suitable shapes, such as a rectangle and an ellipse, and the number of the mounting holes 1a is not limited to one; it should be noted that this embodiment uses the partial film layer of the display panel 1 corresponding to the functional area 2000 for cutting the shaped mounting hole 1a as an example to illustrate the technical solution of the present application, wherein the partial film layer to be cut is not specifically limited.

[0060] The light-emitting device layer 14 includes an anode layer 141, a pixel definition layer 142, a light-emitting layer 143 and a cathode layer 144. The anode layer 141 is arranged on a side of the third flat layer 1315 away from the second flat layer 1314, and the anode layer 141 includes an anode 1411 electrically connected to the thin film transistor layer 13; the pixel definition layer 142 is arranged on a side of the anode layer 141 away from the third flat layer 1315, and a pixel opening 1421 is opened in the pixel definition layer 142 at a position corresponding to the anode 1411. The pixel definition layer 142 includes The light-emitting layer 143 is provided in the pixel opening 1421, the cathode layer 144 is provided on the side of the light-emitting layer 143 away from the anode 1411, and one side of the light-emitting layer 143 is connected to the anode 1411, and the other side of the light-emitting layer 143 is connected to the cathode layer 144; wherein one side of the bridge layer 13131 is connected to the second drain 13112B, and the other side of the bridge layer 13131 is connected to the anode 1411, so as to realize the electrical connection between the anode 1411 and the thin film transistor layer 13.

[0061] In one embodiment, the display panel 1 includes a dam 16 arranged on the substrate 11, and the dam 16 is located in the packaging area 3000. The number of the dam 16 can be one or more, and the dam 16 is arranged around the functional area 2000; wherein the dam 16 is arranged above the second interlayer insulating layer 1310, and the dam 16 may include one or more layers of the first flat layer 1312, the second flat layer 1314, the pixel definition layer 142 and the spacer layer 15 that are stacked. The dam 16 can block water vapor and oxygen from invading the interior of the display panel 1, and can reduce the possibility of cracks that may be formed when cutting the mounting hole 1a extending toward the display panel 1, thereby further improving the packaging reliability.

[0062] Specifically, the dam 16 may include a first dam sub-portion 161, a second dam sub-portion 162 and a third dam sub-portion 163 which are stacked; wherein at least one of the first flat layer 1312, the second flat layer 1314 and the third flat layer 1315 includes the first dam sub-portion 161, the pixel definition layer 142 may include the second dam sub-portion 162, and the spacer layer 15 may include the third dam sub-portion 163.

[0063] The display panel 1 also includes a first partition structure 171, which is arranged on the substrate 11 and located in the packaging area 3000. The first partition structure 171 is arranged on a side of the dam 16 close to the display area 1000. The first partition structure 171 is provided with bottom cut openings 170 on both sides along a first direction, and the first direction is the direction from the display area 1000 to the packaging area 3000. It should be noted that, in the present embodiment, the display area 1000 is arranged around the packaging area 3000, and the direction from the display area 1000 to the packaging area 3000 is a radial direction, rather than a single straight line direction.

[0064] The light emitting device layer 14 includes a first portion 1401 located in the display area 1000 and a second portion 1402 located in the encapsulation area 3000 . The first portion 1401 and the second portion 1402 are separately arranged, and the second portion 1402 is located on a side of the first partition structure 171 away from the substrate 11 .

[0065] It can be understood that in this embodiment, a first partition structure 171 is provided on a side of the dam 16 close to the display area 1000, and bottom cut openings 170 are provided on both sides of the first partition structure 171 along the first direction, thereby effectively preventing water and oxygen from invading the display panel 1 from around the mounting hole 1a; specifically, the first partition structure 171 is provided around the mounting hole 1a, thereby ensuring that during the manufacturing process of the display panel 1, the light-emitting device layer 14 is disconnected from the outside of the area enclosed by the first partition structure 171, that is, the light-emitting device layer 14 includes a first part 1401 located in the display area 1000 and a second part 1402 located in the packaging area 3000; when the mounting hole 1a is opened in the functional area 2000 enclosed by the first partition structure 171, water and oxygen cannot invading the light-emitting device layer 14 from around the mounting hole 1a, thereby effectively protecting the light-emitting device layer 14 from being damaged by water and oxygen, thereby improving the reliability and stability of the display panel 1.

[0066] Furthermore, the display panel 1 also includes a first insulating part 181, which is arranged between the second part 1402 and the first partition structure 171, and the first insulating part 181 covers part of the first partition structure 171. The material of the first insulating part 181 is an inorganic material, and the inorganic material includes but is not limited to silicon nitride or silicon oxide. It can be understood that inorganic materials have high chemical inertness and strong tolerance to water, oxygen, acid, alkali and other chemical reagents. By arranging the first insulating part 181 between the second part 1402 and the first partition structure 171, the current path between the external environment and the light-emitting device layer 14 can be effectively blocked, thereby avoiding structural damage caused by electrochemical corrosion.

[0067] Specifically, during operation of the display panel 1, leakage or short circuit of electrical signals may occur between the first part 1401 and the second part 1402 of the light-emitting device layer 14 due to the intrusion of moisture or oxygen from the external environment. By arranging the first insulating part 181 between the second part 1402 and the first partition structure 171, electrical insulation between the second part 1402 and the external environment can be ensured, thereby maintaining stable operation of the light-emitting device layer 14.

[0068] It should be noted that in a display panel using the O-CUT process, the high temperature and high humidity environment will accelerate the aging and performance degradation of inorganic or organic materials. For example, the material in the encapsulation layer may expand, crack or delaminate, resulting in reduced sealing, water and oxygen invading the interior of the display panel, and electrochemical reactions occurring on the surface of the second part, accelerating the occurrence of electrochemical corrosion, thereby further weakening the encapsulation effect.

[0069] It can be understood that in this embodiment, the first insulating part 181 is arranged between the second part 1402 and the first partition structure 171, and the material of the first insulating part 181 is an inorganic material, thereby forming a protective barrier between the first part 1401 and the second part 1402, which can effectively block the diffusion path of water and oxygen and reduce the possibility of electrochemical corrosion.

[0070] At the same time, since the first insulating part 181 is made of inorganic material, this material will not react with the chemical treatment liquid (such as developer, etching liquid) used in the production process of the display panel 1, thereby effectively isolating the chemical treatment liquid from the production process of the display panel 1 from corroding the first partition structure 171, ensuring the stability and integrity of the partition structure, thereby improving the functional stability and life of the final product.

[0071] Please continue to combine Figures 1 to 4In one embodiment, the first partition structure 171 includes at least two first partition portions 1711 spaced apart along the first direction. By arranging a plurality of first partition portions 1711 spaced apart along the first direction, the diffusion path of water and oxygen is extended, and the possibility of water and oxygen intruding into the interior of the display panel 1 is effectively reduced, thereby improving the sealing performance of the packaging area 3000.

[0072] Among them, the first insulating part 181 is arranged between two adjacent first partition parts 1711, and on the side of the two first partition parts 1711 away from the substrate 11, thereby forming a multi-level barrier structure; specifically, at least part of the first insulating part 181 and the first partition part 1711 are stacked, so that the first insulating part 181 and the first partition part 1711 are tightly combined, which can isolate the surface of the second part 1402 in the light-emitting device layer 14 from contact with external water and oxygen, prevent the occurrence of electrochemical reactions, and further avoid structural damage caused by electrochemical corrosion, thereby extending the service life of the display panel 1.

[0073] Please continue to combine Figures 1 to 4 In one embodiment, along the first direction, the side surface of the first partition portion 1711 away from the first insulating portion 181 is provided with the bottom cut opening 170, and the side surface of the first partition portion 1711 close to the first insulating portion 181 is perpendicular to the base 11.

[0074] The light-emitting device layer 14 is disconnected at the bottom cut opening 170 to form a first part 1401 located in the display area 1000 and a second part 1402 located in the packaging area 3000. The first part 1401 and the second part 1402 are separately arranged, and the second part 1402 is located on the side of the first partition structure 171 away from the substrate 11, thereby preventing water and oxygen from invading the light-emitting device layer 14 from the periphery of the mounting hole 1a when the mounting hole 1a is opened in the area enclosed by the first partition portion 1711, thereby ensuring the water and oxygen blocking performance of the display panel 1.

[0075] Furthermore, the side surface of the first partition portion 1711 close to the first insulating portion 181 is a first side surface, and the first insulating portion 181 extends from the area between two adjacent first partition portions 1711 to the tops of the two first partition portions 1711, and the first insulating portion 181 is in direct contact with the first side surface of the first partition portion 1711, and the first insulating portion 181 is not in contact with the bottom cut opening 170, so that the first insulating portion 181 forms a complete and continuous barrier structure, improves the water and oxygen barrier capacity of the packaging area 3000, and avoids the intrusion of water and oxygen; at the same time, it avoids the first insulating portion 181 being arranged on the first partition portion 1711 in its entirety, and the first insulating portion 181 covers the bottom cut opening 170, which affects the molding process of the bottom cut and maintains the normal function of the bottom cut.

[0076] Please combine Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ;in, Figure 5 The embodiments of the present application provide Figure 3 Enlarged schematic diagram of point D in the middle.

[0077] In one embodiment, the display panel 1 also includes a first insulating layer 18, which is disposed on the substrate 11, and the first insulating layer 18 includes a first insulating portion 181 and a second insulating portion 182 that are spaced apart, and the second insulating portion 182 is disposed between the dam 16 and the substrate 11; wherein the orthographic projection of the dam 16 on the substrate 11 covers the orthographic projection of the second insulating portion 182 on the substrate 11, thereby improving the stability and water-proof oxygen capability of the dam 16, and further reducing the risk of water and oxygen invading the display panel 1 from the mounting hole 1a.

[0078] Specifically, the first insulating layer 18 is arranged between the second interlayer insulating layer 1310 and the first flat layer 1312. The material of the first insulating layer 18 can be an inorganic material. Inorganic materials usually have high rigidity and compressive resistance. By overlapping the second insulating part 182 with the dam 16, the mechanical strength and stability of the dam 16 can be increased, and the dam 16 can be effectively prevented from being deformed or tilted during the manufacturing and use process, thereby enhancing the overall stability of the dam 16.

[0079] At the same time, the second insulating part 182 can also increase the height of the dam 16, thereby improving the isolation effect of the dam 16 and the external environment, further enhancing the water and oxygen barrier performance of the display panel 1, preventing water and oxygen from penetrating into the light-emitting device layer 14 or other sensitive parts, reducing the risk of electrochemical corrosion, and extending the service life of the display panel 1.

[0080] Furthermore, during the production process of the display panel 1, the height of the dam 16 may be inconsistent due to manufacturing tolerances, processing errors or material unevenness, resulting in the dam 16 being unable to completely cover the area to be protected, thereby affecting the packaging effect; by arranging the second insulating portion 182 between the dam 16 and the substrate 11, it is possible to avoid the height inconsistency or excessive lowness of the dam 16 during the packaging process, thereby improving the packaging accuracy of the display panel 1 and making the product more stable and reliable during long-term use.

[0081] Please continue to combine Figures 1 to 5 In one embodiment, the display panel 1 includes a second insulating layer 19, which is disposed between the substrate 11 and the first insulating layer 18; wherein the first insulating layer 18 is in contact with a side of the second insulating layer 19 away from the substrate 11, and the material of the first insulating layer 18 is the same as that of the second insulating layer 19, thereby helping to ensure the compatibility and consistency of materials during the manufacturing process of the first insulating layer 18 and avoiding problems such as poor contact or insufficient bonding strength between different materials.

[0082] Specifically, the second insulating layer 19 includes but is not limited to the second interlayer insulating layer 1310, the first insulating layer 18 is arranged on the side of the second interlayer insulating layer 1310 away from the substrate 11, the first insulating layer 18 is in contact with the side of the second interlayer insulating layer 1310 away from the substrate 11, and the material of the first insulating layer 18 is the same as the material of the second interlayer insulating layer 1310.

[0083] It can be understood that, in this embodiment, by setting the material of the first insulating layer 18 to be the same as the material of the second interlayer insulating layer 1310, the manufacture of the first insulating layer 18 and the second interlayer insulating layer 1310 becomes simpler during the production process of the display panel 1, the incompatibility problem between the two materials is reduced, the manufacturing process is optimized, and the production efficiency is improved; at the same time, the use of the same material helps to maintain the uniformity of the structure, further reduces the potential risk of failure, and thus improves the stability and reliability of the display panel 1.

[0084] Please combine Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 ;in, Figure 6 The embodiments of the present application provide Figure 3 Enlarged schematic diagram of point E in the middle.

[0085] In one embodiment, the display panel 1 also includes a second partition structure 172, the second partition structure 172 is arranged on the substrate 11 and located in the packaging area 3000, the second partition structure 172 is arranged on the side of the dam 16 close to the functional area 2000, the second partition structure 172 includes a plurality of second partition portions 1721 arranged at intervals along the first direction, and each of the second partition portions 1721 is provided with the bottom cut opening 170 on both sides along the first direction; wherein the first insulating portion 181 and the second partition structure 172 are arranged non-overlappingly.

[0086] The light-emitting device layer 14 includes a third part 1403 and a fourth part 1404 located in the packaging area 3000, the third part 1403 is located on the side of the second partition part 1721 away from the substrate 11, the fourth part 1404 is located between two adjacent second partition parts 1721, and the first part 1401, the second part 1402, the third part 1403 and the fourth part 1404 are separately arranged.

[0087] It can be understood that in this embodiment, a second partition structure 172 is provided on the side of the dam 16 close to the functional area 2000. The second partition structure 172 includes a plurality of second partition portions 1721 spaced apart along the first direction. Each of the second partition portions 1721 is provided with the bottom cut openings 170 on both sides along the first direction, thereby further preventing water and oxygen from invading the display panel 1 from the periphery of the mounting hole 1a.

[0088] Specifically, the second partition structure 172 is arranged around the mounting hole 1a, so as to ensure that during the manufacturing process of the display panel 1, the light-emitting device layer 14 is disconnected from the outside of the area enclosed by the second partition structure 172, that is, the light-emitting device layer 14 includes a third part 1403 and a fourth part 1404 located in the packaging area 3000, the third part 1403 is located on the side of the second partition part 1721 away from the substrate 11, and the fourth part 1404 is located between two adjacent second partition parts 1721; when the mounting hole 1a is opened in the functional area 2000 enclosed by the second partition structure 172, water and oxygen cannot invade the light-emitting device layer 14 from around the mounting hole 1a, thereby effectively protecting the light-emitting device layer 14 from being damaged by water and oxygen, thereby improving the reliability and stability of the display panel 1.

[0089] At the same time, by arranging the first insulating part 181 and the second partition structure 172 to be non-overlapping, it can be avoided that the first insulating part 181 is arranged entirely on the second partition structure 172, and the first insulating part 181 covers the bottom cut opening 170, affecting the molding process of the bottom cut and maintaining the normal function of the bottom cut.

[0090] Furthermore, the depth of the bottom cut opening 170 of the second partition portion 1721 is greater than the depth of the bottom cut opening 170 of the first partition portion 1711; it can be understood that the bottom cut opening 170 of the first partition portion 1711 is shallower, which can avoid excessive erosion of the first partition portion 1711 and enhance the mechanical support capacity and anti-deformation capacity of the first partition portion 1711; the second partition portion 1721 is located on the side of the dam 16 close to the functional area 2000. By setting the bottom cut opening 170 of the second partition portion 1721 to be deeper, the physical isolation capacity of the second partition portion 1721 is improved, which can provide a larger physical spacing for electrical isolation and reduce the possibility of leakage paths; the two complement each other to ensure the balance between overall structural strength and functionality.

[0091] In one embodiment, the first metal layer 1311 includes the first partition structure 171 and the second partition structure 172, and the first partition structure 171 and the second partition structure 172 both include a first metal sublayer 1311A, a second metal sublayer 1311B and a third metal sublayer 1311C that are stacked; wherein the bottom cut opening 170 is opened on the side of the second metal sublayer 1311B, and the first insulating portion 181 covers the first metal sublayer 1311A of the first partition structure 171.

[0092] The orthographic projection of the third metal sublayer 1311C on the substrate 11 covers the orthographic projection of the second metal sublayer 1311B on the substrate 11, and the orthographic projection of the first metal sublayer 1311A on the substrate 11 covers the orthographic projection of the second metal sublayer 1311B on the substrate 11; wherein, the first metal sublayer 1311A, the second metal sublayer 1311B and the third metal sublayer 1311C all include metal materials, for example, the material of the first metal sublayer 1311A can be titanium (Ti), the material of the second metal sublayer 1311B can be aluminum (Al), the material of the third metal sublayer 1311C can be titanium (Ti), and the first partition structure 171 and the second partition structure 172 are both "sandwich" structures of Ti-Al-Ti.

[0093] It can be understood that in this embodiment, a first insulating part 181 is set between the second part 1402 of the light-emitting device layer 14 and the first partition structure 171, and the first insulating part 181 covers the first metal sublayer 1311A of the first partition structure 171. The material of the first insulating part 181 is an inorganic material, thereby effectively isolating the first partition structure 171 from corrosion by chemical treatment liquids that may be used in the production process of the display panel 1, improving the stability and reliability of the first partition structure 171, preventing the second metal sublayer 1311B in the first partition structure 171 from collapsing the first metal sublayer 1311A due to excessive side engraving, and improving the stability and reliability of the first partition structure 171.

[0094] See also Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , FIG. 8A to FIG. 8E ;in, Figure 7 A flowchart of a method for manufacturing a display panel 1 provided in an embodiment of the present application; FIG. 8A to FIG. 8E for Figure 7 The structural process flow chart of the panel 1 is shown in FIG.

[0095] This embodiment provides a method for manufacturing a display panel 1, wherein the display panel 1 includes a display area 1000 and a packaging area 3000 located at at least one side of the display area 1000, and the method for manufacturing the display panel 1 includes:

[0096] Step S10: providing a substrate 11, wherein the substrate 11 comprises a first substrate 111, a spacer layer 112, a second substrate 113, a buffer layer 114 and a cover layer 115 which are stacked in sequence; wherein a light shielding layer 12 is formed between the second substrate 113 and the buffer layer 114.

[0097] The step S10 further includes: forming a first semiconductor layer 131, a first gate insulating layer 132, a first electrode layer 133, a second gate insulating layer 134, a second electrode layer 135, a first interlayer insulating layer 136, a second semiconductor layer 137, a third gate insulating layer 138, a third electrode layer 139, and a second interlayer insulating layer 1310 in sequence on the substrate 11; Fig. 8A shown.

[0098] Among them, the first electrode layer 133 includes a first gate 1331; the second electrode layer 135 includes a second gate 1351 and a third gate 1352 arranged at intervals; the third electrode layer 139 includes a fourth gate 1391; wherein the first gate 1331 and the second gate 1351 are both arranged corresponding to the first semiconductor layer 131, and the third gate 1352 and the fourth gate 1391 are both arranged corresponding to the second semiconductor layer 137.

[0099] Step S20: forming a first partition structure 171 and a first insulating layer 18 in sequence on the substrate 11, wherein the first partition structure 171 is located in the packaging area 3000, and the first insulating layer 18 covers the first partition structure 171, and the material of the first insulating layer 18 is an inorganic material.

[0100] Specifically, the step S20 includes:

[0101] Step S21: forming a first metal layer 1311 on a side of the second interlayer insulating layer 1310 away from the third electrode layer 139, and patterning the first metal layer 1311 to form a first partition structure 171, a second partition structure 172, a first source-drain electrode 13111 and a second source-drain electrode 13112, wherein the first partition structure 171 and the second partition structure 172 are located in the encapsulation area 3000, and the first source-drain electrode 13111 and the second source-drain electrode 13112 are located in the display area 1000.

[0102] The first partition structure 171 is disposed on a side of the second partition structure 172 close to the display area 1000, the first partition structure 171 includes at least two first partition portions 1711 spaced apart along a first direction, the second partition structure 172 includes a plurality of second partition portions 1721 spaced apart along the first direction, the first direction being the direction from the display area 1000 to the packaging area 3000; Figure 8B shown.

[0103] The first source-drain electrode 13111 includes a first source 13111A and a first drain 13111B which are spaced apart from each other, and the first source 13111A and the first drain 13111B are electrically connected to the first semiconductor layer 131; the second source-drain electrode 13112 includes a second source 13112A and a second drain 13112B which are spaced apart from each other, and the second source 13112A and the second drain 13112B are electrically connected to the second semiconductor layer 137; wherein the first semiconductor layer 131 and the second semiconductor layer 137 may be electrically connected via the second source 13112A.

[0104] Specifically, in step S21, the first metal layer 1311 includes a first metal sublayer 1311A, a second metal sublayer 1311B and a third metal sublayer 1311C which are stacked; wherein the material of the first metal sublayer 1311A may be titanium (Ti), the material of the second metal sublayer 1311B may be aluminum (Al), and the material of the third metal sublayer 1311C may be titanium (Ti).

[0105] Step S22: forming a first insulating layer 18 on a side of the first metal layer 1311 away from the second interlayer insulating layer 1310, wherein the first insulating layer 18 covers the first partition structure 171 and the second partition structure 172; Figure 8C shown.

[0106] Step S30 : forming a dam 16 on the substrate 11 , wherein the dam 16 is located in the encapsulation area 3000 , and the dam 16 is located on a side of the first partition structure 171 close to the display area 1000 .

[0107] Specifically, the step S30 includes:

[0108] Step S31: A first flat layer 1312, a second metal layer 1313, a second flat layer 1314 and a third flat layer 1315 are sequentially formed on the side of the second interlayer insulating layer 1310 away from the third electrode layer 139; wherein at least one of the first flat layer 1312, the second flat layer 1314 and the third flat layer 1315 includes a first dam sub-portion 161 located in the packaging area 3000, the first dam sub-portion 161 is arranged between the second partition structure 172 and the first partition structure 171, and the first dam sub-portion 161 is located on the side of the first insulating layer 18 away from the second interlayer insulating layer 1310.

[0109] Step S32: forming an anode layer 141 and a pixel definition layer 142 in sequence on a side of the third flat layer 1315 away from the second flat layer 1314; wherein the pixel definition layer 142 includes a second dam sub-portion 162 located in the encapsulation area 3000, the second dam sub-portion 162 is located on a side of the first dam sub-portion 161 away from the first insulating layer 18, and the first dam sub-portion 161 and the second dam sub-portion 162 constitute the dam 16; Fig.8D shown.

[0110] It should be noted that, in the related art, the processes of the first flat layer 1312, the second metal layer 1313, the second flat layer 1314 and the third flat layer 1315 all involve a development (PHO Development) process, while the process of the anode layer 141 requires the use of an etching acid to accurately etch the anode pattern to achieve the definition and optimization of the conductive path; in these processes, the developer and the etching acid may have an impact on the isolation structure; specifically, the developer in the development process and the acid in the anode etching process may cause side etching problems on the side walls of the partition structure; for example, the second metal sublayer 1311B (usually made of aluminum material) is susceptible to excessive corrosion by the developer or etching acid during the process, resulting in the weakening of the side wall integrity of the second metal sublayer 1311B, causing its thickness to gradually become thinner, thereby causing the first metal sublayer 1311A located above it to collapse, affecting the overall functionality and reliability of the device.

[0111] It can be understood that in this embodiment, a first insulating layer 18 is formed on the partition structure (the first isolation structure and the second isolation structure), the first insulating layer 18 covers the partition structure, and the first insulating layer 18 is made of inorganic material. The inorganic material has good chemical inertness and can resist the corrosion of chemical treatment liquids (such as developer and etching liquid) during the manufacturing process of the display panel 1, thereby isolating the contact between the chemical treatment liquid and the partition structure, ensuring the stability and integrity of the partition structure, and preventing the side walls of the partition structure from being damaged.

[0112] Step S40 : patterning the first insulating layer 18 to form a first insulating portion 181 , wherein the first insulating portion 181 covers a portion of the first partition structure 171 .

[0113] Specifically, in the step S40, the first insulating layer 18 is patterned to form a first insulating portion 181 and a second insulating portion 182, wherein the first insulating portion 181 is arranged between two adjacent first partition portions 1711 and on the side of the two first partition portions 1711 away from the substrate 11, and the second insulating portion 182 is arranged between the dam 16 and the substrate 11; wherein the orthographic projection of the dam 16 on the substrate 11 covers the orthographic projection of the second insulating portion 182 on the substrate 11.

[0114] Step S50 : patterning the first partition structure 171 to form undercut openings 170 on both sides of the first partition structure 171 along the first direction.

[0115] Specifically, in the step S50, the partition structure can be patterned by a wet etching process. Wet etching uses a chemical solution to selectively remove materials, and can open bottom cut openings 170 on both sides of the first partition portion 1711 along the first direction. At the same time, the bottom cut openings 170 are provided on both sides of the second partition portion 1721 along the first direction.

[0116] Furthermore, the side surface of the first partition portion 1711 close to the first insulating portion 181 is the first side surface, and the first insulating portion 181 extends from the area between two adjacent first partition portions 1711 to the tops of the two first partition portions 1711, and the first insulating portion 181 is in direct contact with the first side surface of the first partition portion 1711, and the first insulating portion 181 is not in contact with the bottom cut opening 170, so that the first insulating portion 181 forms a complete and continuous barrier structure, thereby improving the water and oxygen barrier capability of the packaging area 3000 and avoiding the intrusion of water and oxygen; Fig. 8E shown.

[0117] It can be understood that in the present embodiment, the first insulating layer 18, due to the use of inorganic materials with high chemical corrosion resistance, can effectively resist the erosion of chemical treatment liquids (such as developers and etching solutions) during the manufacturing process of the display panel 1. Therefore, during the manufacturing process of the display panel 1, the chemical treatment liquid can be isolated from the first isolation structure and the second isolation structure, thereby ensuring that the stability and integrity of the first isolation structure and the second isolation structure are not destroyed before the bottom cut opening 170 is opened; therefore, in the step S50, the depth and side wall shape of the bottom cut opening 170 can be precisely controlled by controlling the process parameters of the wet etching (such as the composition, concentration, temperature and time of the etching solution), thereby reducing the occurrence of process defects such as over-etching or uneven etching, thereby meeting the design requirements.

[0118] To sum up, in this embodiment, through the protective effect of the first insulating layer 18 and the optimized coordination of the wet etching process, not only the processing accuracy of the isolation structure is ensured, but also the controllability of the overall process is enhanced, thereby improving the functionality and reliability of the device, further meeting the high quality requirements of the display panel 1 manufacturing.

[0119] Furthermore, the manufacturing method of the display panel 1 further includes:

[0120] Step S60 : forming a light emitting layer 143 , a spacer layer 15 and a cathode layer 144 in sequence on a side of the anode layer 141 away from the pixel definition layer 142 .

[0121] In the step S60, the anode layer 141, the pixel definition layer 142, the light-emitting layer 143 and the cathode layer 144 constitute a light-emitting device layer 14, the light-emitting device layer 14 includes a first portion 1401 located in the display area 1000 and a second portion 1402 located in the encapsulation area 3000, the first portion 1401 and the second portion 1402 are separately arranged, and the second portion 1402 is located on a side of the first partition structure 171 away from the substrate 11; wherein the spacer layer 15 may include a third dam sub-portion 163, the third dam sub-portion 163 is arranged on a side of the second dam sub-portion 162 away from the first dam sub-portion 161, and the third dam sub-portion 163, the second dam sub-portion 162 and the first dam sub-portion 161 constitute the dam 16; Figure 2 shown.

[0122] See also Fig. 9 , is a schematic diagram of the structure of the display device provided in an embodiment of the present application.

[0123] This embodiment further provides a display device 2, which includes the display panel 1 described in any of the above embodiments. It can be understood that the display panel 1 has been described in detail in the above embodiments and will not be repeated here.

[0124] The display device 2 may further include a middle frame 21 , and the middle frame 21 is integrated with the display panel 1 to provide support, fixation and protection for the display panel 1 .

[0125] In specific applications, the display device can be at least one of a smart phone, tablet computer, mobile phone, video phone, e-book reader, desktop computer, laptop, netbook, workstation, server, personal digital assistant, portable media player, MP3 player, mobile medical machine, camera, game console, digital camera, car navigation system, electronic billboard, ATM or wearable device, etc., which has a display function.

[0126] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0127] The above is a detailed introduction to a display panel and its manufacturing method, and a display device provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and a packaging area located at least on one side of the display area, and the display panel comprises: substrate; A dam, disposed on the substrate and located within the packaging area; A first partition structure, disposed on the substrate and located in the packaging area, the first partition structure is disposed on a side of the dam close to the display area, and the first partition structure is provided with undercut openings on both sides along a first direction, the first direction being a direction from the display area to the packaging area; a light-emitting device layer, disposed on the substrate, the light-emitting device layer comprising a first portion located in the display area and a second portion located in the encapsulation area, the first portion and the second portion being separately disposed, and the second portion being located on a side of the first partition structure away from the substrate; and The first insulating part is disposed between the second part and the first partition structure, and the first insulating part covers a portion of the first partition structure. The material of the first insulating part is an inorganic material.

2. The display panel according to claim 1, characterized in that: The first partition structure includes at least two first partition portions spaced apart along the first direction; The first insulating portion is disposed between two adjacent first partition portions and on a side of the two first partition portions away from the substrate.

3. The display panel according to claim 2, characterized in that: Along the first direction, the side surface of the first partition portion away from the first insulating portion is provided with the undercut opening, and the side surface of the first partition portion close to the first insulating portion is perpendicular to the base; The first insulating portion extends from a region between two adjacent first partition portions to the tops of the two first partition portions, and the first insulating portion is in direct contact with a first side surface of the first partition portion; The first side surface is a side surface of the first partition portion close to the first insulating portion.

4. The display panel according to any one of claims 1 to 3, characterized in that: The display panel further includes a first insulating layer, the first insulating layer is disposed on the substrate, the first insulating layer includes the first insulating portion and the second insulating portion which are spaced apart, and the second insulating portion is disposed between the dam and the substrate; The orthographic projection of the dam on the substrate covers the orthographic projection of the second insulating portion on the substrate.

5. The display panel according to claim 4, characterized in that: The display panel comprises a second insulating layer, wherein the second insulating layer is arranged between the substrate and the first insulating layer; The first insulating layer contacts a side of the second insulating layer away from the substrate, and a material of the first insulating layer is the same as a material of the second insulating layer.

6. The display panel according to any one of claims 1 to 3, characterized in that: The display panel further includes a functional area, and the encapsulation area is arranged between the display area and the functional area; the display panel further includes: A second partition structure is provided on the substrate and in the packaging area, the second partition structure is provided on a side of the dam close to the functional area, the second partition structure comprises a plurality of second partition portions spaced apart along the first direction, and each of the second partition portions is provided with the undercut openings on both sides along the first direction; Wherein, the first insulating portion and the second partition structure are arranged non-overlappingly.

7. The display panel according to claim 6, wherein: The display panel includes a thin film transistor layer, the thin film transistor layer is arranged on the substrate, the thin film transistor layer includes a first metal layer, the first metal layer includes the first partition structure and the second partition structure, and the first partition structure and the second partition structure each include a first film layer, a second film layer and a third film layer that are stacked; The undercut opening is opened at a side of the second film layer, and the first insulating portion covers the first film layer of the first partition structure.

8. A method for manufacturing a display panel, characterized in that: The display panel includes a display area and a packaging area located at least on one side of the display area. The manufacturing method of the display panel includes: providing a substrate; forming a first partition structure and a first insulating layer on the substrate in sequence, wherein the first partition structure is located in the encapsulation area, the first insulating layer covers the first partition structure, and the material of the first insulating layer is an inorganic material; forming a dam on the substrate, wherein the dam is located in the encapsulation area and the dam is located on a side of the first partition structure close to the display area; Patterning the first insulating layer to form a first insulating portion, wherein the first insulating portion covers a portion of the first partition structure; The first partition structure is patterned to open undercut openings on both sides of the first partition structure along a first direction, where the first direction is a direction from the display area to the packaging area.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The step of patterning the first insulating layer further comprises: A second insulating portion is formed, wherein the second insulating portion is disposed between the dam and the substrate; wherein an orthographic projection of the dam on the substrate covers an orthographic projection of the second insulating portion on the substrate.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 7.

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