Display module and display device

Abstract

The invention provides a display module and a display device, the display module comprises a driving circuit chip and an array circuit layer, the driving circuit chip comprises a function module, and a first side of the driving circuit chip is provided with a plurality of connection contacts; the array circuit layer is located on the first side of the driving circuit chip and comprises a plurality of functional circuits; the plurality of functional circuits are arranged corresponding to the plurality of connecting contacts; and the functional modules are connected with the corresponding functional circuits through the connecting contacts. Thus, the driving circuit chip can be used as the substrate, the substrate is compatible with the functional module, an integrated chip does not need to be additionally arranged, the thickness of the display module can be effectively reduced, the functional module is in direct contact connection with the array circuit layer through the connecting contact, a frame area and a binding area do not need to be arranged in the display module, the higher screen-to-body ratio can be achieved, and the display effect is improved. Therefore, ultrathin and full-screen display of the display module is realized.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the development of display technology, display modules are increasingly widely used in people's production and life. At the same time, people's requirements for display modules are getting higher and higher. Among them, how to improve the thinness and screen-to-body ratio of display modules has always attracted people's attention. Summary of the invention

[0003] In view of this, the present application is dedicated to providing a display module and a display device, which can realize an ultra-light and full-screen display of the display module.

[0004] In a first aspect, the present application provides a display module, comprising: a driving circuit chip and an array circuit layer;

[0005] The driving circuit chip includes a functional module; a first side of the driving circuit chip exposes a plurality of connection contacts of the functional module;

[0006] The array circuit layer is located on the first side of the driving circuit chip, and includes a plurality of functional circuits; the plurality of functional circuits are arranged corresponding to the plurality of connection contacts;

[0007] The functional module is connected to the corresponding functional circuit via the connection contacts.

[0008] Optionally, a power contact is provided on a second side of the driving circuit chip corresponding to the first side;

[0009] The functional module is connected to an external power source via the power contact;

[0010] Optionally, the functional contacts of the multiple functional circuits are arranged corresponding to the multiple connection contacts.

[0011] Optionally, the driving circuit chip includes a plurality of functional areas; the functional module includes a plurality of functional units;

[0012] The multiple functional units are respectively located in the multiple functional areas.

[0013] Optionally, the driving circuit chip includes a substrate structure; the substrate structure includes a substrate and a functional film layer located on one side of the substrate;

[0014] The functional unit includes a plurality of connection units arranged in a stacked manner;

[0015] The connection unit includes a metal layer and an insulating layer stacked in sequence in a direction away from the substrate.

[0016] Optionally, the plurality of connection contacts are located on a side of the target insulating layer away from the substrate; the target insulating layer is the insulating layer on the substrate structure that is farthest from the substrate;

[0017] The power contact is located on a side of the target metal layer close to the substrate; the target metal layer is the metal layer on the substrate structure that is closest to the substrate.

[0018] Optionally, the driving circuit chip further includes a packaging structure;

[0019] The packaging structure wraps the substrate structure, and the packaging structure exposes the plurality of connection contacts and the power contacts.

[0020] Optionally, the multiple functional units include at least one of a system processor, a storage module, a system power module, a screen power module, a screen driving module and a touch control module.

[0021] A second aspect of the present application provides a display device, comprising the display module as described in the first aspect of the present application.

[0022] Optionally, a battery module is also included;

[0023] The battery module is located on the second side of the driving circuit chip of the display module; the second side of the driving circuit chip is the other side corresponding to the first side of the driving circuit chip;

[0024] The output port of the battery module contacts the power supply contact of the display module accordingly.

[0025] Optionally, the battery module is detachably connected to the display module.

[0026] In the solution of the present application, the display module includes a driving circuit chip and an array circuit layer, the driving circuit chip includes a functional module, and a first side of the driving circuit chip is provided with a plurality of connection contacts; the array circuit layer is located on the first side of the driving circuit chip, and includes a plurality of functional circuits; the plurality of functional circuits are provided corresponding to the plurality of connection contacts; the functional module is connected to the corresponding functional circuit through the connection contacts. In this way, the driving circuit chip can be used as a substrate, and the substrate can be used to be compatible with the functional module, and there is no need to set up an integrated chip separately, which can effectively reduce the thickness of the display module, and the functional module is directly connected to the array circuit layer through the connection contacts, so that there is no need to set up a border area and a binding area in the display module, and a higher screen-to-body ratio can be achieved, thereby realizing an ultra-thin and full-screen display of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0028] Figure 1 is a structural schematic diagram of a display panel provided by an embodiment of the present application;

[0029] Figure 2 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0030] Figure 3 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0031] Figure 4 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0032] Figure 5 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0033] Figure 6 is a structural schematic diagram of a flexible substrate structure provided by an embodiment of the present application;

[0034] Figure 7 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0035] Figure 8 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0036] Fig. 9 is a structural schematic diagram of a display device provided by an embodiment of the present application;

[0037] Fig.10 It is a schematic diagram of the structure of a display device provided in another embodiment of the present application. DETAILED DESCRIPTION

[0038] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification shall have the common meanings understood by persons with ordinary skills in the field to which this specification belongs. The words "first", "second" and similar words used in the embodiments of this specification do not indicate any order, quantity or importance, but are only used to avoid confusion of constituent elements.

[0039] Unless the context requires otherwise, throughout the specification, "plurality" means "at least two", and "including" is interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the specification. The schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0040] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0041] With the development and progress of display technology, the high screen-to-body ratio and thinness of display modules have become one of the important trends in the development of display technology in recent years. Accordingly, how to improve the high screen-to-body ratio and thinness of display modules has always been the focus of people's attention.

[0042] To this end, the present application provides a solution that can effectively improve the thinness and screen-to-body ratio of the display module. By using the driving circuit chip as a substrate and utilizing the substrate-compatible functional module, there is no need to set up an integrated chip separately, which can effectively reduce the thickness of the display module. In addition, the functional module can be directly connected to the array circuit layer through connecting contacts, greatly reducing the number of wirings, so that there is no need to set up a border area and a binding area in the display module, thereby realizing an ultra-thin, full-screen display of the display module.

[0043] Specifically, as an optional implementation of the contents disclosed in this application, an embodiment of this application provides a display module. Figure 1 is a schematic diagram of a display module provided by an embodiment of the present application. Figure 1 As shown, the display module may at least include: a driving circuit chip 101 and an array circuit layer 102 .

[0044] The driving circuit chip 101 may include functional modules.

[0045] Specifically, the functional module is mainly used to control the state of the light-emitting device in the display module so that the display module displays the picture.

[0046] During implementation, the driving circuit chip 101 may exist in the form of a substrate. In this way, the substrate can be used together with a functional module to realize light emission control of each light emitting device, thus laying a structural foundation for the lightweight and thin setting of the display module.

[0047] like Figure 2 As shown, the first side of the driving circuit chip 101 exposes a plurality of connection contacts L1 of the functional module. The plurality of connection contacts L1 facilitates the electrical connection between the functional module and other devices.

[0048] like Figure 1 As shown, the array circuit layer 102 is located on the first side of the driving circuit chip 101, and includes a plurality of functional circuits; the plurality of functional circuits are arranged corresponding to a plurality of connection contacts.

[0049] A plurality of functional contacts of functional circuits are arranged on one side of the array circuit layer 102 close to the driving circuit chip 101 . The functional contacts also facilitate the connection between the functional circuits and other devices.

[0050] During implementation, the functional contacts of the multiple functional circuits are arranged correspondingly to the multiple connection contacts. The corresponding arrangement of the multiple functional contacts and the multiple connection contacts can facilitate the connection between the corresponding functional contacts and the connection contacts, thereby providing a control path for the functional module to control the light-emitting device.

[0051] The functional module is connected to the corresponding functional circuit via the connection contact L1.

[0052] Among them, the connection contact L1 can be in direct contact with the corresponding functional contact. Specifically, the array circuit layer 102 can be attached to the first side of the driving circuit chip 101 to achieve corresponding contact between the functional contact and the connection contact L1, which can not only achieve electrical connection between the functional module and the functional circuit, but also reduce the film thickness of the display module. In addition, there is no need to use wires to achieve electrical connection, which can also save preparation costs. Of course, the present application is not limited to this. In some other embodiments, multiple functional contacts and multiple connection contacts L1 may not correspond one to one, and the connection contact L1 may also be electrically connected to the corresponding functional contact through a wire to achieve electrical connection between the functional module and multiple functional circuits.

[0053] In order to ensure the electrical connection between the functional module and the plurality of functional circuits, the connection contacts L1 and the functional contacts may both be conductive metal contacts, such as copper contacts.

[0054] In some embodiments, Figure 2 As shown, a power contact L2 is also provided on the second side of the driving circuit chip 101 corresponding to the first side; the functional module is connected to an external power supply through the power contact L2.

[0055] Among them, the power contact L2 can be a positive and negative contact.

[0056] Through the power contact L2, an external power source can be used to supply power to the functional module, that is, to provide power for the functional module to control the light-emitting device to emit light.

[0057] In some implementations, the driving circuit chip 101 may include multiple functional areas; correspondingly, the functional module may include multiple functional units; and the multiple functional units are respectively located in the multiple functional areas.

[0058] That is to say, in the display module, the substrate of the driving circuit chip 101 is divided into multiple functional areas, and multiple functional units of the display module are respectively located in the multiple functional areas, thus providing structural convenience for realizing multiple functional units on the substrate.

[0059] During implementation, the plurality of functional units may include at least two of a system processor, a storage module, a system power module, a screen power module, a screen driving module and a touch control module.

[0060] Of course, the present application only illustrates that the multiple functional units of the display module may include at least two of the system processor, storage module, system power module, screen power module, screen drive module and touch module, but the present application is not limited to this. In some other implementations, the multiple functional units may also include other modules, such as auxiliary function modules, and so on.

[0061] Specifically, the multiple functional units can be arranged according to the application scenario of the display module, which is not specifically limited here.

[0062] Take the display module used in mobile phones as an example. Figure 3 As shown, the multiple functional units may include a system processor, a storage module, a system power module, a screen power module, a screen driver module and a touch module. Among them, the system processor is used to implement the operating system function of the mobile phone, the storage module is used to store mobile phone data, the system power module is used to provide power to the system processor, the screen driver module is used to drive the light-emitting device to emit light, the screen power module is used to provide power to the screen driver module and the touch module, and the touch module is used to implement the touch function of the mobile phone.

[0063] In some embodiments, Figure 4 As shown, the driving circuit chip 101 may include a substrate structure T; the substrate structure T includes a base material T1 and a functional film layer T2 located on one side of the base material T1.

[0064] The substrate T1 mainly plays the role of supporting and bearing. Specifically, the substrate T1 may include a rigid substrate such as a glass substrate or a silicon substrate, or may include a flexible substrate such as stainless steel (SUS) or flexible polyimide (PI). In other words, the display module in the embodiment of the present application may include a non-bendable rigid display module, or may include a bendable flexible display module.

[0065] The functional film layer T2 located in the functional area is a functional unit, such as Figure 5 As shown, the functional unit G includes a plurality of connection units T21 stacked in layers; the connection unit T21 includes metal layers and insulating layers stacked in sequence in a direction away from the substrate T1.

[0066] like Figure 6 The figure shows a schematic structural diagram of a flexible substrate structure, wherein the flexible substrate structure includes a flexible substrate T1 and a plurality of stacked flexible connection units T21, and the flexible connection units include a metal layer T211 and a flexible insulating layer T212 stacked in sequence in a direction away from the flexible substrate T1.

[0067] During specific implementation, the functions of the functional units located in different functional areas may be the same or different.

[0068] The functional unit G may include a plurality of electronic components. When the functional units G are located in different functional areas, the electronic components included in each functional unit G may also be different.

[0069] In the process of preparing the display module, a substrate can be first prepared by evaporation, and then a circuit composed of various electronic components (such as diodes, transistors, capacitors, inductors and resistors, etc.) that can realize corresponding functions is evaporated on the substrate using metal materials and insulating materials. The number of layers of the connection unit T21 can be designed according to the circuit requirements and is not specifically limited here.

[0070] Correspondingly, the plurality of connection contacts L1 are located on a side of the target insulating layer away from the substrate T1 ; the target insulating layer is the insulating layer on the substrate structure T that is farthest from the substrate T1 .

[0071] The power contact L2 is located on a side of the target metal layer close to the substrate T1 ; the target metal layer is the metal layer on the substrate structure T that is closest to the substrate T1 .

[0072] Specifically, a through hole may be provided on the substrate T1, and the position of the through hole is corresponding to the position of the power contact L2. The power contact L2 is exposed through the through hole, or the power contact L2 extends through the through hole to the surface of the substrate T1 away from the metal layer.

[0073] When the driving circuit chip 101 is used as a substrate, in order to ensure the stability of the substrate and the safety of various functions in the driving circuit chip 101, in some implementations, such as Figure 7 As shown, the driving circuit chip 101 may further include a packaging structure F.

[0074] Specifically, the packaging structure F can wrap the substrate structure T. In this way, the performance safety of each electronic component in the substrate structure T can be protected, and the electronic components can be prevented from being corroded and damaged by the outside world, and the stability of the connection between each film layer in the substrate structure T can be improved, thereby improving the stability of the substrate.

[0075] Furthermore, in order to facilitate the connection between the driving circuit chip 101 and other devices, the package structure F may expose a plurality of connection contacts L1 and power contacts L2.

[0076] The packaging structure F exposes multiple connection contacts L1 and power contacts L2, so that the first side of the driving circuit chip 101 is provided with multiple connection contacts L1 and the second side is provided with power contacts L2, which facilitates the connection between the driving circuit chip 101 and each functional circuit in the array circuit layer 102, and the connection between the driving circuit chip 101 and an external power supply.

[0077] In practical applications, the driving circuit chip 101 and the external power source can be connected by plugging or pasting.

[0078] In some embodiments, Figure 8 As shown, the display module may further include a light emitting layer 103 .

[0079] The light emitting layer 103 is located on the side of the array circuit layer 102 away from the driving circuit chip 101 and has multiple light emitting devices (such as R, G, B in the figure). Each functional circuit in the array circuit layer 102 is connected to the corresponding light emitting device, laying a structural foundation for the functional module to control the light emitting device to emit light.

[0080] The light emitting device may include a first electrode, a light emitting function layer, and a second electrode which are sequentially stacked in a direction away from the driving circuit chip 101 .

[0081] Specifically, the light-emitting functional layer may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer and an electron injection layer stacked in sequence on the side of the first electrode away from the driving circuit chip 101. A second electrode is disposed on the side of the electron injection layer away from the driving circuit chip 101.

[0082] Among them, the light-emitting material layer may include a material with electroluminescence (EL) properties (hereinafter referred to as the light-emitting material). The first electrode may also be called an anode, which is used to provide holes to the light-emitting material layer, and the second electrode may also be called a cathode, which is used to provide electrons to the light-emitting material layer. The holes provided by the first electrode and the electrons provided by the second electrode can excite the light-emitting material of the light-emitting material layer to emit light after the light-emitting material layer is recombined. The hole injection layer and the hole transport layer can be made of a material with high hole mobility, so that the holes generated by the first electrode can be better transferred to the light-emitting material layer. Similarly, the electron injection layer and the electron transport layer can be made of a material with high electron mobility, so that the electrons generated by the second electrode can be better transferred to the light-emitting material layer.

[0083] In practical applications, the plurality of functional circuits may include a data driving circuit and a data scanning circuit. The light emitting device may include a first color light emitting device, a second color light emitting device, and a third color light emitting device. Specifically, the first color light emitting device, the second color light emitting device, and the third color light emitting device may be light emitting devices of three different colors among a red light emitting device (R), a green light emitting device (G), and a blue light emitting device (B).

[0084] In some implementations, still Figure 8 As shown, the display module may further include an encapsulation layer 104 .

[0085] The encapsulation layer 104 is located on the side of the light emitting layer 103 away from the driving circuit chip 101, and the orthographic projection of the encapsulation layer 104 on the driving circuit chip 101 covers the orthographic projection of the light emitting layer 103 on the driving circuit chip 101. In this way, the encapsulation layer 104 can be used to encapsulate the light emitting layer 103, thereby protecting each light emitting device and preventing damage to the light emitting device caused by water vapor intrusion, thereby improving the product yield of the display module and ensuring the display effect of the display module.

[0086] The material of the encapsulation layer 104 may be an inorganic material, such as silicon oxide or silicon oxynitride, etc. Specifically, the encapsulation layer 104 may be formed by chemical vapor deposition (CVD).

[0087] In some embodiments, Figure 8 As shown, the display module may further include a polarizer (POL) 105 .

[0088] The polarizer 105 is located on a side of the packaging layer 104 away from the driving circuit chip 101 and is used to control the passing direction of light to realize image display of the display module.

[0089] In some embodiments, Figure 8 As shown, the display module may further include an optical adhesive layer 106 and a cover plate 107 .

[0090] The side of the polarizer 105 facing away from the driving circuit chip 101 is connected to the cover plate 107 via an optical adhesive layer 106 .

[0091] Exemplarily, the optical adhesive layer 106 can be selected from any one of an optically clear adhesive (OCA), an optically clear resin (OCR), and an optically clear film (OCF). The cover plate 107 can be a rigid cover plate, for example, a cover glass (CG); the cover plate 107 can also be a flexible cover plate, for example, ultra-thin glass (UFG) of unequal thickness or ultra-thin glass (UTG). At the same time, the cover plate 107 can also be added with a corresponding surface coating according to design requirements, for example, the surface of the cover plate 107 can also be provided with a surface coating structure such as an anti-reflection coating and an enhancement coating.

[0092] Of course, in other embodiments, other film layers of the display module may be provided as needed. For example, when touch control is required, a touch function layer may be provided on the side of the packaging layer 104 away from the driving circuit chip 101 to realize the touch function of the display module, etc., which will not be elaborated here.

[0093] In the implementation of the present application, the driving circuit chip is combined with the substrate, and the functional module of the substrate compatible with the driving circuit chip is utilized, so that the display control function of the display module can be realized without setting up an additional integrated chip. In addition, the display module provided by the present application does not require structures such as a middle frame and a peripheral circuit board, and can achieve a more ultra-thin display with a larger screen-to-body ratio compared to existing display modules. In addition, the display module of the present application is combined with flexible display technology, which can be curled and folded more easily, reflecting the characteristics of high curling performance, ultra-thinness and full screen.

[0094] As another optional implementation of the content disclosed in this application, the embodiment of this application also provides a display device, such as Fig. 9 As shown, the display device may include a display module as described in any of the above embodiments.

[0095] In some embodiments, Fig.10 As shown, the display device may further include a battery module 1002 .

[0096] The battery module 1002 is located on the second side of the driving circuit chip 101 of the display module 1001; the second side of the driving circuit chip 101 is the other side corresponding to the first side of the driving circuit chip 101; the output port of the battery module 1002 is in corresponding contact with the power contact of the display module 1001.

[0097] The battery module 1002 is detachably connected to the display module 1001. In this way, the battery module 1002 and the display module 1001 can be independently arranged, which is more convenient to carry.

[0098] Of course, the present application is not limited thereto, and in some other implementations, the display device may further include other modules, such as a kinetic energy conversion electrical energy module (ie, a module for converting kinetic energy into electrical energy), and so on.

[0099] In practical applications, the display device may be a smart phone, a tablet computer, a digital camera, etc., which will not be described in detail here.

[0100] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0101] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that: include: Driving circuit chip and array circuit layer; The driving circuit chip includes a functional module; a first side of the driving circuit chip exposes a plurality of connection contacts of the functional module; The array circuit layer is located on the first side of the driving circuit chip, and includes a plurality of functional circuits; the plurality of functional circuits are arranged corresponding to the plurality of connection contacts; The functional module is connected to the corresponding functional circuit via the connection contacts.

2. The display module according to claim 1, characterized in that: A power contact is provided on a second side of the driving circuit chip corresponding to the first side; The functional module is connected to an external power source via the power contact; Optionally, the functional contacts of the multiple functional circuits are arranged corresponding to the multiple connection contacts.

3. The display module according to claim 2, characterized in that: The driving circuit chip includes a plurality of functional areas; the functional module includes a plurality of functional units; The multiple functional units are respectively located in the multiple functional areas.

4. The display module according to claim 3, characterized in that: The driving circuit chip comprises a substrate structure; the substrate structure comprises a substrate and a functional film layer located on one side of the substrate; The functional unit includes a plurality of connection units arranged in a stacked manner; The connection unit includes a metal layer and an insulating layer stacked in sequence in a direction away from the substrate.

5. The display module according to claim 4, characterized in that: The plurality of connection contacts are located on a side of the target insulating layer away from the substrate; the target insulating layer is the insulating layer on the substrate structure that is farthest from the substrate; The power contact is located on a side of the target metal layer close to the substrate; the target metal layer is the metal layer on the substrate structure that is closest to the substrate.

6. The display module according to claim 5, characterized in that: The driving circuit chip also includes a packaging structure; The packaging structure wraps the substrate structure, and the packaging structure exposes the plurality of connection contacts and the power contacts.

7. The display module according to claim 3, characterized in that: The multiple functional units include at least two of a system processor, a storage module, a system power module, a screen power module, a screen driving module and a touch control module.

8. A display device, characterized in that: Comprising a display module as described in any one of claims 1-7.

9. The display device according to claim 8, further comprising a battery module; The battery module is located on the second side of the driving circuit chip of the display module; the second side of the driving circuit chip is the other side corresponding to the first side of the driving circuit chip; The output port of the battery module contacts the power supply contact of the display module accordingly. 10 . The display device according to claim 9 , wherein the battery module is detachably connected to the display module.

Images