Thermoelectric refrigeration assembly and manufacturing process thereof

Abstract

The invention provides a thermoelectric refrigeration assembly and a manufacturing process thereof. The manufacturing process comprises the following steps: preparing a thermoelectric element; coating solder paste on the whole ceramic substrate; the thermoelectric element is integrated on the full-page ceramic substrate; welding the whole thermoelectric refrigeration assembly; and cutting the whole thermoelectric refrigeration assembly into a plurality of thermoelectric refrigeration assemblies. The method has the beneficial effects that the whole thermoelectric refrigeration assembly is prepared firstly and then cut into the multiple single-stage thermoelectric refrigeration assemblies, so that the welding difficulty is reduced, the badness generated in the welding process is effectively reduced, the welding quality is ensured, the welding yield is improved, and the production efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of thermoelectric refrigeration component manufacturing, and in particular relates to a thermoelectric refrigeration component and a manufacturing process thereof. Background Art

[0002] Thermoelectric cooling components are electronic components made using the Peltier effect, which can achieve heat transfer in a short time after power is turned on. Thermoelectric cooling components have the characteristics of small size, light weight, long life, pollution-free, and dual effects of hot and cold. With the continuous development of electronic information technology, the product volume and heat power density of various chips, controllers, and lasers are increasing. The demand for local precise temperature control through thermoelectric cooling components is increasing, and the size of thermoelectric cooling components is required to be continuously reduced. Thermoelectric cooling components are "sandwich" structures, and jigs need to be pressurized during welding. The heat capacity of small-sized cooling components is too large, welding is difficult, production efficiency is low, defects are prone to occur during the welding process, and the yield rate after welding is low. Summary of the invention

[0003] To solve the above technical problems, the present invention provides a thermoelectric cooling component and its manufacturing process, which effectively solves the technical problems of difficult welding of thermoelectric cooling components, low production efficiency and low yield after welding, and overcomes the shortcomings of the prior art.

[0004] The technical solution adopted by the present invention is: a manufacturing process of a thermoelectric refrigeration component, comprising the following steps:

[0005] preparing a thermoelectric element;

[0006] Apply solder paste on the entire ceramic substrate;

[0007] Integrating the thermoelectric element on the whole ceramic substrate;

[0008] Welding of the entire panel of thermoelectric cooling components;

[0009] The whole sheet of thermoelectric cooling components is cut into a plurality of thermoelectric cooling components.

[0010] Further, the step of preparing the thermoelectric element comprises:

[0011] cutting the thermoelectric material rod into thermoelectric material sheets;

[0012] Preparing a nickel layer and a solder layer on the thermoelectric material sheet;

[0013] The thermoelectric material sheet is cut into the thermoelectric elements.

[0014] Further, the step of coating solder paste on the entire ceramic substrate includes:

[0015] The solder paste is applied to the metallized patterns of the cold surface ceramic substrate and the hot surface ceramic substrate by dispensing, screen printing or spraying, wherein the cold surface ceramic substrate and the hot surface ceramic substrate are the whole-plate ceramic substrates formed by splicing the multiple thermoelectric cooling components.

[0016] Furthermore, the step of integrating the thermoelectric element on the whole ceramic substrate includes:

[0017] Arranging the thermoelectric elements in an array;

[0018] The thermoelectric element is mounted on the metallized pattern of the hot surface ceramic substrate coated with solder paste.

[0019] Further, the step of welding the entire thermoelectric cooling component includes:

[0020] The cold surface ceramic substrate and the hot surface ceramic substrate on which the thermoelectric element is mounted are buckled together to form the full-plate thermoelectric cooling component;

[0021] The whole-plate thermoelectric cooling component is welded by reflow welding, vapor phase welding or a heating platform.

[0022] Furthermore, during the process of buckling the cold surface ceramic substrate and the hot surface ceramic substrate on which the thermoelectric element is mounted, a pressure jig is used to apply pressure to the entire thermoelectric cooling assembly, and the applied pressure ranges from 10 MPa to 50 MPa.

[0023] Furthermore, the pressurizing jig includes an upper pressing plate and a lower pressing plate, a screw is provided between the upper pressing plate and the lower pressing plate, the whole-page temperature difference electric cooling component is placed between the upper pressing plate and the lower pressing plate, and pressure is applied to the whole-page temperature difference electric cooling component by adjusting the position of the upper pressing plate on the screw.

[0024] Furthermore, in the process of welding the entire thermoelectric cooling component, the heating time is 1 min to 5 min.

[0025] Furthermore, the step cuts the entire panel of thermoelectric cooling components into a plurality of thermoelectric cooling components by inner circle scribing or laser cutting.

[0026] The present invention also provides a thermoelectric refrigeration component, which is prepared by using the manufacturing process of the thermoelectric refrigeration component as described above.

[0027] The advantages and positive effects of the present invention are as follows: due to the adoption of the above technical scheme, by first preparing a whole plate of thermoelectric cooling components and then cutting the whole plate of thermoelectric cooling components into multiple single-stage thermoelectric cooling components, the welding difficulty is reduced, the defects generated during the welding process are effectively reduced, the welding quality is guaranteed, the welding yield is improved, and the production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The present invention is a process flow chart of manufacturing a thermoelectric cooling component according to an embodiment of the present invention.

[0029] Figure 2 The present invention is a schematic diagram of a manufacturing process of a thermoelectric cooling component, in which a thermoelectric element is mounted on a whole hot surface ceramic substrate.

[0030] Figure 3 It is a schematic diagram of a pressurizing fixture for the manufacturing process of a thermoelectric cooling component according to an embodiment of the present invention.

[0031] In the figure:

[0032] 1. Hot surface ceramic substrate 2. Thermoelectric element 3. Upper pressure plate

[0033] 4. Lower pressure plate 5. Screw 6. Positioning slot DETAILED DESCRIPTION

[0034] The embodiment of the present invention provides a thermoelectric cooling component and a manufacturing process thereof. The embodiment of the present invention is described below in conjunction with the accompanying drawings.

[0035] In the description of the embodiments of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "set" and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0036] like Figure 1As shown, a manufacturing process of a thermoelectric cooling component according to an embodiment of the present invention includes the following steps: preparing a thermoelectric element; coating solder paste on a whole-plate ceramic substrate; integrating the thermoelectric element on the whole-plate ceramic substrate; welding the whole-plate thermoelectric cooling component; and cutting the whole-plate thermoelectric cooling component into a plurality of thermoelectric cooling components. Firstly, a whole-plate thermoelectric cooling component is prepared and then the whole-plate thermoelectric cooling component is cut into a plurality of single-stage thermoelectric cooling components, which reduces the difficulty of welding, ensures the welding quality and improves the production efficiency.

[0037] The following is a detailed introduction:

[0038] S1, preparing a thermoelectric element;

[0039] The following steps are involved:

[0040] S11, cutting the thermoelectric material rod into thermoelectric material sheets;

[0041] The thermoelectric material rod is made of bismuth telluride-based thermoelectric material, and is cut into thermoelectric material sheets of a certain thickness by wire cutting or inner circle cutting.

[0042] S12, preparing a nickel layer and a solder layer on the thermoelectric material sheet;

[0043] A nickel layer and a solder layer are prepared on the cut thermoelectric material sheet by chemical plating or electroplating, wherein the thickness of the nickel layer is greater than 1 μm, and the thickness of the solder layer is greater than 2 μm.

[0044] S13, cutting the thermoelectric material sheet into thermoelectric elements;

[0045] The thermoelectric material sheet with the nickel layer and the solder layer prepared is cut into thermoelectric elements of a certain size by an inner circle cutting method. The size of the thermoelectric element is determined according to the performance requirements of the thermoelectric refrigeration component.

[0046] S2, coating solder paste on the entire ceramic substrate;

[0047] Solder paste is applied to the metallized patterns of the cold surface ceramic substrate and the hot surface ceramic substrate by dispensing, screen printing or spraying. The cold surface ceramic substrate and the hot surface ceramic substrate are large-area full-plate ceramic substrates spliced ​​with multiple temperature difference electric cooling components. The thickness of the applied solder paste is 0.05 to 0.2 mm.

[0048] S3, integrating the thermoelectric element on the whole ceramic substrate;

[0049] The following steps are involved:

[0050] S31, arranging the thermoelectric elements in an array;

[0051] First, the prepared thermoelectric element is inspected for appearance, and then the array of the inspected thermoelectric elements is arranged on the mucosa.

[0052] S32, mounting a thermoelectric element on the metallized pattern of the hot surface ceramic substrate coated with solder paste;

[0053] The prepared thermoelectric element is mounted on the metallized pattern of the whole hot surface ceramic substrate coated with solder paste. The whole hot surface ceramic substrate 1 after mounting the thermoelectric element 2 is as shown in FIG. Figure 2 shown.

[0054] S4, welding the whole board of thermoelectric cooling components;

[0055] S41, buckling the cold surface ceramic substrate and the hot surface ceramic substrate on which the thermoelectric element is mounted to form a full-plate thermoelectric cooling component;

[0056] During the fastening process, in order to ensure the fastening effect, a pressurized fixture is used to apply pressure to the entire thermoelectric cooling component. The amount of applied pressure is determined according to the area of ​​the thermoelectric cooling component, and the applied pressure ranges from 10MPa to 50Mpa.

[0057] like Figure 3 As shown, the pressurizing fixture includes an upper pressing plate 3 and a lower pressing plate 4. The upper pressing plate 3 is placed above the whole-page thermoelectric cooling component, and the lower pressing plate 4 is placed below the whole-page thermoelectric cooling component. In order to position the whole-page thermoelectric cooling component, positioning slots 6 are provided at relative positions on the upper pressing plate 3 and the lower pressing plate 4 for placing the whole-page thermoelectric cooling component.

[0058] The pressurization method can be to directly place a weight block on the upper pressing plate 3 for pressurization, or to use a screw 5 for pressurization. The screw 5 is fixed on the lower pressing plate 4, and the screw 5 passes through the upper pressing plate 3. The upper pressing plate 3 is fastened with a nut. By adjusting the position of the nut on the screw 5, the upper pressing plate 3 is pressurized, thereby applying pressure to the entire thermoelectric refrigeration component, and the pressure value can be determined by the tightening torque of the nut. In some embodiments, a spring is sleeved on the outside of the screw 5, and the spring is set between the upper pressing plate 3 and the lower pressing plate 4. By adjusting the position of the nut on the screw 5, the upper pressing plate 3 is pressurized to cause the spring to contract, and the pressure value is determined by the contraction amount of the spring.

[0059] S42. Use reflow soldering, vapor phase soldering or a heating table to solder the entire panel of thermoelectric cooling components.

[0060] The whole panel of thermoelectric cooling components that have been fastened together are welded by reflow soldering, vapor phase soldering or heating table. The heating time of the welding process is 1min to 5min, and the pressurization is maintained throughout the heating process by the pressurization fixture.

[0061] S5, cutting the entire sheet of thermoelectric cooling components into a plurality of thermoelectric cooling components.

[0062] The whole thermoelectric cooling component after welding is cut into multiple single-stage thermoelectric cooling components by inner circle scribing or laser cutting.

[0063] The present invention also provides a thermoelectric refrigeration component, which is prepared by using the manufacturing process of the thermoelectric refrigeration component as described above.

[0064] Embodiment: A manufacturing process of a thermoelectric cooling component comprises the following steps:

[0065] S1, preparing a thermoelectric element;

[0066] The following steps are involved:

[0067] S11, cutting the thermoelectric material rod into thermoelectric material sheets;

[0068] The thermoelectric material rod is made of bismuth telluride-based thermoelectric material, and the thermoelectric material rod is cut into thermoelectric material sheets of a certain thickness by wire cutting.

[0069] S12, preparing a nickel layer and a solder layer on the thermoelectric material sheet;

[0070] A nickel layer and a solder layer are prepared on the cut thermoelectric material sheet by chemical plating, the nickel layer has a thickness of 1.5 μm, and the solder layer has a thickness of 3 μm.

[0071] S13, cutting the thermoelectric material sheet into thermoelectric elements;

[0072] The thermoelectric material sheet with the nickel layer and the solder layer prepared is cut into thermoelectric elements of a certain size by an inner circle cutting method. The size of the thermoelectric element is determined according to the performance requirements of the thermoelectric refrigeration component.

[0073] S2, coating solder paste on the entire ceramic substrate;

[0074] The solder paste is applied to the metallized patterns of the cold surface ceramic substrate and the hot surface ceramic substrate by screen printing. The cold surface ceramic substrate and the hot surface ceramic substrate are large-area full-plate ceramic substrates spliced ​​with multiple temperature difference electric cooling components. The thickness of the applied solder paste is 0.1 mm.

[0075] S3, integrating the thermoelectric element on the whole ceramic substrate;

[0076] The following steps are involved:

[0077] S31, arranging the thermoelectric elements in an array;

[0078] First, the prepared thermoelectric element is inspected for appearance, and then the array of the inspected thermoelectric elements is arranged on the mucosa.

[0079] S32, mounting a thermoelectric element on the metallized pattern of the hot surface ceramic substrate coated with solder paste;

[0080] The prepared thermoelectric element is mounted on the metallized pattern of the whole hot surface ceramic substrate coated with solder paste. The whole hot surface ceramic substrate 1 after mounting the thermoelectric element 2 is as shown in FIG. Figure 2 shown.

[0081] S4, welding the whole board of thermoelectric cooling components;

[0082] S41, buckling the cold surface ceramic substrate and the hot surface ceramic substrate on which the thermoelectric element is mounted to form a full-plate thermoelectric cooling component;

[0083] A pressurized fixture is used to apply pressure to the entire thermoelectric cooling component, and the applied pressure is 30Mpa.

[0084] like Figure 3 As shown, the pressurizing fixture includes an upper pressing plate 3 and a lower pressing plate 4. The upper pressing plate 3 is placed above the entire page of thermoelectric cooling components, and the lower pressing plate 4 is placed below the entire page of thermoelectric cooling components. In order to position the entire page of thermoelectric cooling components, positioning slots 6 are provided at relative positions on the upper pressing plate 3 and the lower pressing plate 4 for placing the entire page of thermoelectric cooling components. The pressurizing method uses a screw 5 to pressurize. The screw 5 is fixed on the lower pressing plate 4. The screw 5 passes through the upper pressing plate 3 and is fastened with a nut above the upper pressing plate 3. By adjusting the position of the nut on the screw 5, the upper pressing plate 3 is pressurized, thereby applying pressure to the entire page of thermoelectric cooling components, and the pressure value is determined by the tightening torque of the nut.

[0085] S42. Use reflow soldering to solder the entire panel of thermoelectric cooling components.

[0086] The whole panel of thermoelectric cooling components that have been fastened together is welded by reflow soldering. The heating time of the welding process is 3 minutes, and the pressurization is maintained throughout the heating process by the pressurization fixture.

[0087] S5, cutting the entire sheet of thermoelectric cooling components into a plurality of thermoelectric cooling components.

[0088] The laser cutting method is used to cut the whole thermoelectric cooling component after welding into multiple single-stage thermoelectric cooling components.

[0089] The advantages and positive effects of the present invention are:

[0090] By first preparing a whole plate of thermoelectric cooling components and then cutting the whole plate of thermoelectric cooling components into multiple single-stage thermoelectric cooling components, the welding difficulty is reduced, the defects generated during the welding process are effectively reduced, the welding quality is guaranteed, the welding yield rate is improved, and the production efficiency is improved.

[0091] The embodiments of the present invention are described in detail above, but the contents described are only preferred embodiments of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A process for manufacturing a thermoelectric refrigeration component, characterized in that: The following steps are involved: preparing a thermoelectric element; Apply solder paste on the entire ceramic substrate; Integrating the thermoelectric element on the whole ceramic substrate; Welding of the entire panel of thermoelectric cooling components; The whole sheet of thermoelectric cooling components is cut into a plurality of thermoelectric cooling components.

2. A process for manufacturing a thermoelectric refrigeration component according to claim 1, characterized in that: The steps of preparing the thermoelectric element include: cutting the thermoelectric material rod into thermoelectric material sheets; Preparing a nickel layer and a solder layer on the thermoelectric material sheet; The thermoelectric material sheet is cut into the thermoelectric elements.

3. A process for manufacturing a thermoelectric refrigeration component according to claim 1 or 2, characterized in that: The steps of coating solder paste on the entire ceramic substrate include: The solder paste is applied to the metallized patterns of the cold surface ceramic substrate and the hot surface ceramic substrate by dispensing, screen printing or spraying, wherein the cold surface ceramic substrate and the hot surface ceramic substrate are the whole-plate ceramic substrates formed by splicing the multiple thermoelectric cooling components.

4. A process for manufacturing a thermoelectric refrigeration component according to claim 3, characterized in that: The step of integrating the thermoelectric element on the whole ceramic substrate includes: Arranging the thermoelectric elements in an array; The thermoelectric element is mounted on the metallized pattern of the hot surface ceramic substrate coated with solder paste.

5. A process for manufacturing a thermoelectric refrigeration component according to claim 4, characterized in that: The steps of welding the entire thermoelectric cooling component include: The cold surface ceramic substrate and the hot surface ceramic substrate on which the thermoelectric element is mounted are buckled together to form the full-plate thermoelectric cooling assembly; The whole-plate thermoelectric cooling component is welded by reflow welding, vapor phase welding or a heating platform.

6. A process for manufacturing a thermoelectric cooling component according to claim 5, characterized in that: During the process of buckling the cold surface ceramic substrate and the hot surface ceramic substrate on which the thermoelectric element is mounted, a pressure jig is used to apply pressure to the entire thermoelectric cooling assembly, and the applied pressure ranges from 10 MPa to 50 MPa.

7. A process for manufacturing a thermoelectric refrigeration component according to claim 6, characterized in that: The pressurizing jig comprises an upper pressing plate and a lower pressing plate, a screw is provided between the upper pressing plate and the lower pressing plate, the whole-page thermoelectric cooling component is placed between the upper pressing plate and the lower pressing plate, and pressure is applied to the whole-page thermoelectric cooling component by adjusting the position of the upper pressing plate on the screw.

8. A process for manufacturing a thermoelectric refrigeration component according to claim 7, characterized in that: During the welding process of the entire thermoelectric cooling component, the heating time is 1 min to 5 min.

9. A process for manufacturing a thermoelectric refrigeration component according to any one of claims 1-2 and 4-8, characterized in that: The step cuts the entire panel of thermoelectric cooling components into a plurality of thermoelectric cooling components by inner circle scribing or laser cutting.

10. A thermoelectric refrigeration component, characterized in that: The thermoelectric refrigeration component is prepared by the manufacturing process of any one of claims 1 to 9.

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