Optocoupler surface gluing equipment and gluing process

By designing the cutting surface and movement mode of the cutting components in the optocoupler surface glue coating equipment, the problem of colloid wire drawing is solved, and the quality of glue coating and the operating efficiency of the equipment are improved.

CN119838830APending Publication Date: 2025-04-18XIAN GUOSH ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202510103046.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-22
Publication Date
2025-04-18

AI Technical Summary

Technical Problem

The existing optocoupler surface glue coating technology is difficult to effectively solve the phenomenon of colloid wire drawing, causing colloids to adhere to unnecessary places and affect product quality.

Method used

An optical coupling surface glue coating device is designed, and two cutting blocks of the cutting assembly move relative to each other in the second direction to form a cutting surface to cut the colloid, and the colloid diameter is reduced by wavy or concave arc cutting surface design to reduce the wire drawing phenomenon.

Benefits of technology

Through the design of the cutting assembly, the colloid can be accurately cut off, the colloid wire drawing phenomenon can be reduced, the quality and reliability of glue coating are improved, and the cleanliness and efficient operation of the equipment can be ensured through the cooperation of the material suction assembly and the electric heating wire.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119838830A_ABST
    Figure CN119838830A_ABST
Patent Text Reader

Abstract

The invention relates to optocoupler surface gluing equipment and a gluing process, and relates to the field of optocoupler gluing equipment.The optocoupler surface gluing equipment comprises a rack, a glue feeding pipe with a glue outlet and a cutting assembly, the glue feeding pipe is arranged in parallel to the first direction, and the glue feeding pipe is connected to the rack; the cutting assembly comprises a mounting frame and two cutting blocks with cutting surfaces, and the mounting frame is connected to the rack; in the first direction, the cutting block is located outside a glue outlet of the glue feeding pipe. The two cutting blocks are sequentially distributed in the second direction, the faces, close to each other, of the two cutting blocks are cutting faces, and the cutting blocks are slidably connected to the mounting frame in the second direction so that the cutting blocks can be adjusted between the cutting posture and the glue feeding posture; when the cutting blocks are in the cutting posture, the cutting faces of the two cutting blocks make contact with each other. When the cutting blocks are in the glue feeding posture, a material passing gap is formed between the cutting faces of the two cutting blocks. The method has the effect of reducing the colloid wiredrawing phenomenon.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the field of equipment for gluing optical couplers, and in particular to an optical coupler surface gluing equipment and a gluing process. Background Art

[0002] Optocoupler surface glue coating equipment is widely used in the manufacturing process of electronic components, especially in the production line of optocouplers. With the increasingly obvious trend of miniaturization and integration of electronic products, the requirements for optocoupler surface glue coating are also getting higher and higher.

[0003] In the existing technology, in order to solve the problem of gluing on the surface of the optical coupler, the following methods are usually used: one is to use a manual dispensing gun for gluing. This method is simple and easy, but manual operation can easily lead to uneven glue amount and low efficiency; the second is to use a nozzle-type automatic gluing machine. This equipment achieves uniform gluing by precisely controlling the position and speed of the nozzle.

[0004] However, the above methods still have some problems in practical application; especially for products such as optocouplers that require precise control of the amount and shape of the colloid, the traditional method is difficult to effectively solve the phenomenon of colloid drawing, which will cause the colloid to adhere to unnecessary places and affect product quality. Therefore, how to reduce the phenomenon of colloid drawing is an urgent problem to be solved. Summary of the invention

[0005] In order to reduce the colloid wire drawing phenomenon, the present application provides an optical coupler surface glue coating device and a glue coating process.

[0006] In the first aspect, the present application provides an optical coupling surface glue coating device, which adopts the following technical solution: An optical coupler surface glue coating device, comprising: frame; a glue delivery pipe having a glue outlet, the glue delivery pipe being arranged parallel to the first direction, the glue delivery pipe being connected to the frame; and, A cutting assembly, the cutting assembly comprising: A mounting frame connected to the frame; and Two cutting blocks with cutting surfaces, in a first direction, the cutting blocks are located outside the glue outlet of the glue feeding tube; the two cutting blocks are distributed in sequence in a second direction, and the sides of the two cutting blocks close to each other are the cutting surfaces, and the cutting blocks are slidably connected to the mounting frame along the second direction, so that the cutting blocks can be adjusted between a cutting posture and a glue feeding posture; When the cutting blocks are in a cutting posture, the cutting surfaces of the two cutting blocks are in contact with each other; When the cutting block is in the glue feeding posture, a material passing gap is formed between the cutting surfaces of the two cutting blocks.

[0007] By adopting the above technical solution, the two cutting blocks of the cutting assembly can slide along the second direction under the action of the driving cylinder, so that they can contact each other to form a closed state when needed, effectively cutting off the colloid and reducing the occurrence of colloid wiredrawing; and when there is no need to cut the colloid, the material gap formed between the two cutting blocks can ensure that the colloid flows smoothly onto the chip.

[0008] Optionally, the cutting surface is wavy in a cross section perpendicular to the first direction.

[0009] By adopting the above technical solution, the cross section of the cutting surface perpendicular to the first direction is designed to be wavy, which can separate the colloid into multiple strips along the third direction, reduce the overall diameter of the colloid, and effectively reduce the occurrence of colloid wire drawing.

[0010] Optionally, the cutting surface, along a cross section perpendicular to the third direction, is in the shape of an arc that is concave toward one side of one of the cutting blocks.

[0011] By adopting the above technical solution, the cross section of the cutting surface along the third direction is designed to be concave toward one side of one of the cutting blocks, which can cut the colloid in the first direction and further reduce colloid stringing.

[0012] Optionally, the wall surface of the cutting block close to the glue feeding tube is a material receiving surface; in the first direction, a drop gap is formed between the material receiving surface and the glue outlet end wall of the glue feeding tube.

[0013] By adopting the above technical solution, the drop gap formed between the material receiving surface and the end wall of the glue outlet of the glue delivery hose can facilitate personnel to insert their hands or other tools into the glue outlet to peel off the solidified colloid, thereby effectively reducing the problem of normal operation of the equipment being affected by colloid solidification.

[0014] Optionally, the two material receiving surfaces are inclined toward the glue outlet on a side that is close to each other.

[0015] By adopting the above technical solution, the design of the two material connection surfaces being inclined toward the glue outlet side toward the side close to each other can guide the cut colloid to flow to both sides, effectively avoiding the accumulation of colloid at the joint of the two material connection surfaces, thereby reducing equipment failure and maintenance frequency caused by colloid accumulation.

[0016] Optionally, each of the cutting blocks is fixedly connected with a corresponding stop bar, the stop bar has a material blocking surface, and the stop bar is located on a side of the cutting block close to the glue feeding pipe; The two material blocking surfaces are inclined toward a side close to each other and a side away from the glue outlet, so that a material receiving area is formed between the material blocking surface and the material receiving surface.

[0017] By adopting the above technical solution, the design of the baffle bar and the material receiving surface can effectively prevent the colloid from falling off the cutting block. Specifically, the material receiving surface on the baffle bar is inclined toward the side close to each other and away from the glue outlet, so that a material receiving area is formed between the material receiving surface and the material receiving surface, and the colloid falls along the material receiving surface into the material receiving area, reducing the risk of the colloid falling directly from the cutting block.

[0018] Optionally, a suction component is also included, and the suction component includes: A material collecting box having an air outlet and a material inlet; and, A vacuum pump having an air outlet, wherein the air outlet of the vacuum pump is connected to the air outlet of the collecting box; The blocking bar and / or the cutting block is provided with a first discharge hole, one end of the first discharge hole is communicated with the material receiving area, and the other end of the first discharge hole is communicated with the feed port of the material collecting box.

[0019] By adopting the above technical solution, the suction component can effectively collect the colloid residue generated during the cutting process. Specifically, the combined design of the collection box and the vacuum pump allows the cut colloid to smoothly enter the collection box through the first discharge hole, avoiding the problem of equipment blockage caused by colloid residue, and improving the cleanliness and maintenance convenience of the equipment. At the same time, the design of the material receiving area ensures that the colloid can flow into the first discharge hole in an orderly manner, further enhancing the collection efficiency of the colloid.

[0020] Optionally, a heating wire is embedded in the baffle bar and / or the cutting block.

[0021] By adopting the above technical solution, when a heating wire is embedded in the baffle and / or the cutting block, the colloid can be heated to make it easier to flow and be collected in the collection box through the first discharge hole and the second discharge hole, thereby effectively reducing the residue of colloid on the cutting block and improving the cleanliness and working efficiency of the equipment.

[0022] Optionally, it further includes a cross slide having a driving part, the cross slide is fixedly connected to the frame, the sliding direction of the driving part of the cross slide is perpendicular to the first direction, and the mounting frame is fixedly connected to the driving part.

[0023] By adopting the above technical solution, the driving part of the cross slide can move on the reference plane, so that the mounting frame and the cutting block thereon can be accurately moved to the required position on the reference plane, thereby improving the flexibility and precision of the equipment and ensuring the accuracy and reliability of the colloid cutting process.

[0024] In a second aspect, the present application provides a process for coating an optical coupler surface with glue, which adopts the following technical solution: A process for coating the surface of an optical coupler, using the aforementioned coating equipment, is characterized in that it includes the following steps: S1: Place the chip on the base; S2: Open the valve to drip the colloid in the glue delivery tube to between the two optocouplers on the chip; after the colloid drips, if the cutting block needs to be cleaned, just energize the heating wire and let the vacuum machine collect the colloid in the first discharge hole and the second discharge hole into the collection box through the main discharge hole; S3: Send the chip coated with colloid to a drying box for drying.

[0025] By adopting the above technical solution, when the colloid is cut by a cutting block, the occurrence of wire drawing of the colloid can be effectively reduced.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. The cutting assembly can accurately cut the colloid through the relative movement of the two cutting blocks in the second direction, reducing the occurrence of colloid drawing and improving the quality and reliability of glue coating; 2. The wavy cutting surface design can divide the colloid into multiple small parts, further reduce the diameter of the colloid, reduce overall wire drawing, and ensure uniformity and stability during the gluing process; 3. The drop gap design between the material receiving surface and the glue outlet makes it convenient for personnel to clean the solidified colloid at the glue outlet, ensuring the continuous and efficient operation of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 It is a schematic diagram of the structure of the cutting block and the driving cylinder in the embodiment of the present application; Figure 3 It is a schematic diagram of the structure when the cutting block in the embodiment of the present application is in a glue feeding posture; Figure 4 is a cross-sectional view of the cutting block in the embodiment of the present application when it is in a glue feeding posture; Figure 5 It is a structural schematic diagram of the material suction assembly in an embodiment of the present application; Figure 6 It is a schematic diagram of the structure of the cross slide in the embodiment of the present application.

[0028] Explanation of the reference numerals: 1. Frame; 11. Base; 12. Vertical frame; 2. Glue feeding hose; 21. Glue outlet; 22. Valve; 3. Cutting assembly; 31. Mounting frame; 32. Cutting block; 321. Cutting surface; 3211. Material passing gap; 322. Material receiving surface; 323. First discharge hole; 324. Second discharge hole; 325. Total discharge hole; 33. Driving cylinder; 34. Dropping gap; 35. Baffle bar; 351. Baffle surface; 36. Material receiving area; 37. Heating wire; 4. Suction assembly; 41. Collecting box; 411. Air outlet; 412. Material inlet; 42. Vacuum extractor; 421. Air outlet; 5. Cross slide; 51. Driving unit. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-6 The present application is further described in detail. For ease of description, the present application introduces directional words such as a first direction, a second direction, and a third direction to form a three-dimensional reference direction. The directional words used, such as "a first direction, a second direction, and a third direction", can be specifically shown with reference to the figure, where X represents the first direction, Y represents the second direction, and Z represents the third direction, and the first direction, the second direction, and the third direction are perpendicular to each other.

[0030] The present application embodiment discloses an optical coupling surface glue coating device. Figure 1 , the optical coupling surface glue coating device comprises a frame 1, a glue feeding pipe 2 with a glue outlet 21 and a cutting assembly 3; The rack 1 has a base 11 and a vertical frame 12, the base 11 is used to place chips; the glue feeding tube 2 is fixedly connected to the vertical frame 12 on the rack 1, and the glue feeding tube 2 is arranged parallel to the first direction. In the first direction, the base 11 is arranged opposite to the glue outlet 21. After the glue is discharged from the glue feeding tube 2, it can fall onto the base 11, and then it can fall onto the chip placed on the base 11; the glue feeding tube 2 is installed with a valve 22 at the glue outlet 21, and the cutting component 3 is used to cut off the discharged glue to reduce the occurrence of glue drawing.

[0031] Reference Figure 1 , Figure 2 and Figure 3 The cutting assembly 3 includes a mounting frame 31, two cutting blocks 32 with cutting surfaces 321, and a driving cylinder 33 connected between the cutting blocks 32 and the mounting frame 31. The mounting frame 31 is connected to the frame 1. In the first direction, the cutting blocks 32 are located outside the glue outlet 21 of the glue feeding tube 2. Specifically, in the first direction, the cutting blocks 32 are located between the base 11 and the glue outlet 21; the two cutting blocks 32 are distributed in sequence in the second direction, and the sides of the two cutting blocks 32 that are close to each other are the cutting surfaces 321. The cutting blocks 32 are slidably connected to the mounting frame 31 along the second direction, so that the cutting blocks 32 can be adjusted between the cutting posture and the glue feeding posture; When the cutting blocks 32 are in the cutting posture, the cutting surfaces 321 of the two cutting blocks 32 are in contact with each other; When the cutting block 32 is in the glue feeding posture, a material passing gap 3211 is formed between the cutting surfaces 321 of the two cutting blocks 32; when the cutting block 32 is in the glue feeding posture, the glue can fall from the glue outlet 21 and then pass through the material passing gap 3211 and fall onto the base 11; The driving cylinder 33 is used to move the cutting block 32 along the second direction to change the posture of the cutting block 32. Specifically, each cutting block 32 is connected to the mounting frame 31 via a corresponding driving cylinder 33. In the present disclosure, the driving cylinder 33 is a cylinder arranged parallel to the second direction, the cylinder body of the driving cylinder 33 is fixedly connected to the mounting frame 31, and the piston rod of the driving cylinder 33 is fixedly connected to the cutting block 32, so that the two driving cylinders 33 drive the two cutting blocks 32 to move in a direction close to or away from each other.

[0032] Reference Figure 3 and Figure 4 In order to cut the colloid more thoroughly, in some embodiments of the present application, the cutting surface 321 is wavy in cross section along the first direction perpendicular to the first direction. The wavy design can separate the colloid into multiple strips along the third direction, so as to reduce the diameter of the colloid and reduce the overall stringing of the colloid; further, the cutting surface 321 is in a concave arc toward one side of one of the cutting blocks 32 in cross section along the third direction perpendicular to the third direction, that is, the cutting surface 321 on one of the cutting blocks 32 is in a concave arc, and the cutting surface 321 on the other cutting block 32 is in a convex arc. The combination of the convex and concave can cut the colloid in the first direction, further reducing the stringing of the colloid.

[0033] Reference Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, the wall surface of the cutting block 32 close to the glue delivery tube 2 is a material receiving surface 322. In the first direction, a drop gap 34 is formed between the material receiving surface 322 and the end wall of the glue outlet 21 of the glue delivery tube 2. When too much colloid solidifies at the glue outlet 21, the drop gap can facilitate personnel to extend their hands or other peeling structures into the glue outlet 21 to peel off the solidified colloid.

[0034] Reference Figure 3 , Figure 4 and Figure 5 In order to reduce the colloid being sandwiched between the two cutting surfaces 321, in some embodiments of the present application, the two material connection surfaces 322 are inclined toward the side of the glue outlet 21 toward the side close to each other, so that the cut colloid will flow to both sides, avoiding the accumulation of the colloid at the joint of the two material connection surfaces 322; In some embodiments of the present application, each cutting block 32 is fixedly connected with a corresponding stopper 35, the stopper 35 is integrally arranged with the cutting block 32, the stopper 35 has a stopper surface 351, the stopper 35 is located on the side of the cutting block 32 close to the glue feeding tube 2, in the second direction, the stopper surface 351 is arranged directly toward the butt joint surface 322, the stopper surfaces 351 on the two stopper bars 35 are inclined toward the side close to each other toward the side away from the glue outlet 21, so that a material receiving area 36 is formed between the stopper surface 351 and the material receiving surface 322, and the material receiving area 36 is V-shaped and arranged with an opening toward one side of the glue feeding tube 2; the colloid falls along the material receiving surface 322 to the material receiving area 36, ​​which can prevent the colloid from falling from the cutting block 32 to a certain extent; In order to further prevent the colloid from falling off the cutting block 32, in some embodiments of the present application, a first discharge hole 323 is provided on the baffle 35 and / or the cutting block 32, and one end of the first discharge hole 323 is connected to the material receiving area 36; a second discharge hole 324 is also provided on the cutting block 32, and one end of the second discharge hole 324 passes through the cutting surface 321; the colloid on the material receiving area 36 and the cutting surface 321 can be conveniently collected through the first discharge hole 323 and the second discharge hole 324; a total discharge hole 325 is provided at one end of each cutting block 32 away from the other cutting block 32, and one end of the first discharge hole 323 away from the material receiving area 36 is connected to the total discharge hole 325, and one end of the second discharge hole 324 away from the cutting surface 321 is also connected to the total discharge hole 325; Reference Figure 4 In some embodiments of the present application, in order to make the colloid flow more smoothly along the material hole, a heating wire 37 is embedded in the baffle 35 and / or the cutting block 32.

[0035] Reference Figure 5 In some embodiments of the present application, it also includes a suction component 4, which includes a collection box 41 with an air outlet 411 and a feed port 412, and a vacuum pump 42 with an exhaust port 421; the collection box 41 is fixedly connected to the cutting block 32, the feed port 412 is located at one end of the side wall of the collection box close to the base 11, and the feed port 412 is connected to the main discharge hole 325; the vacuum pump 42 is fixedly connected to the collection box 41, the air outlet 411 is located at one end of the side wall of the collection box 41 away from the base 11, and the exhaust port 421 of the vacuum pump 42 is connected to the air outlet 411 of the collection box 41.

[0036] Reference Figure 6In some embodiments of the present application, a cross slide 5 having a driving portion 51 is further included. The cross slide 5 is fixedly connected to the base 11 of the frame 1 by screws. The driving portion 51 on the cross slide 5 can move along the reference plane under the drive of the cross slide 5 itself. In the present disclosure, the reference plane is perpendicular to the first direction, and the mounting frame 31 is fixedly connected to the driving portion 51 so as to move with the driving portion 51 on the reference plane, so as to move the cutting block 32 to a desired position on the reference plane.

[0037] The implementation principle of an optical coupling surface coating device in an embodiment of the present application is as follows: after placing the chip on the base 11, the valve 22 is opened, and the colloid will flow downward onto the chip. After the glue discharge stops, the driving cylinder 33 drives the two cutting blocks 32 to move until the two cutting blocks 32 contact each other, and the colloid can be cut off; after the cutting is completed, if it is necessary to collect the colloid on the cutting block 32, the heating wire 37 can be energized, and the vacuum machine 42 can collect the colloid in the first discharge hole 323 and the second discharge hole 324 through the main discharge hole 325 into the collecting box 41, which can effectively reduce the solidification of the colloid into the first discharge hole 323, the second discharge hole 324 and the main discharge hole 325, and reduce the occurrence of the colloid blocking the first discharge hole 323, the second discharge hole 324 and the main discharge hole 325. While ensuring the smooth discharge of the colloid, the colloid can be centrally recovered.

[0038] The present application also discloses a process for coating the surface of an optical coupler with glue, using the aforementioned coating device, which includes the following steps: S1: placing the chip on the base 11; S2: Open the valve 22 to drip the colloid in the glue feeding tube 2 to between the two optical couplers on the chip; after the colloid drips, if the cutting block 32 needs to be cleaned, the electric heating wire 37 is powered on, and the vacuum machine 42 collects the colloid in the first discharge hole 323 and the second discharge hole 324 into the collecting box 41 through the main discharge hole 325; S3: Send the chip coated with colloid to a drying box for drying.

[0039] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An optical coupler surface gluing device, characterized in that: include: Rack (1); A glue delivery pipe (2) having a glue outlet (21), the glue delivery pipe (2) being arranged parallel to the first direction, and the glue delivery pipe (2) being connected to the frame (1); as well as, A cutting assembly (3), the cutting assembly (3) comprising: A mounting frame (31), the mounting frame (31) being connected to the frame (1); as well as, Two cutting blocks (32) having cutting surfaces (321), wherein in a first direction, the cutting blocks (32) are located outside the glue outlet (21) of the glue feeding tube (2); the two cutting blocks (32) are distributed in sequence in a second direction, and a side of the two cutting blocks (32) close to each other is the cutting surface (321); the cutting blocks (32) are slidably connected to the mounting frame (31) along the second direction, so that the cutting blocks (32) can be adjusted between a cutting posture and a glue feeding posture; When the cutting blocks (32) are in a cutting posture, the cutting surfaces (321) of the two cutting blocks (32) are in contact with each other; When the cutting blocks (32) are in the glue feeding posture, a material passing gap (3211) is formed between the cutting surfaces (321) of the two cutting blocks (32).

2. The optical coupling surface gluing device according to claim 1, characterized in that: The cutting surface (321) is wavy in shape along a cross section perpendicular to the first direction.

3. The optical coupling surface gluing device according to claim 2, characterized in that: The cutting surface (321) has a cross section along a direction perpendicular to the third direction and is in the shape of an arc that is concave toward one side of one of the cutting blocks (32).

4. The optical coupling surface gluing device according to any one of claims 1 to 3, characterized in that: The wall surface of the cutting block (32) close to the glue delivery tube (2) is a material receiving surface (322); in the first direction, a drop gap (34) is formed between the material receiving surface (322) and the end wall of the glue outlet (21) of the glue delivery tube (2).

5. The optical coupling surface gluing device according to claim 4, characterized in that: The two material receiving surfaces (322) are inclined toward the glue outlet (21) on the side approaching each other.

6. The optical coupling surface gluing device according to claim 5, characterized in that: Each of the cutting blocks (32) is fixedly connected with a corresponding stop bar (35), the stop bar (35) having a material blocking surface (351), and the stop bar (35) is located on a side of the cutting block (32) close to the rubber feeding pipe (2); The two material blocking surfaces (351) are inclined from a side close to each other to a side away from the glue outlet (21), so that a material receiving area (36) is formed between the material blocking surfaces (351) and the material receiving surface (322).

7. The optical coupling surface gluing device according to claim 6, characterized in that: It also includes a suction component (4), which includes: A material collection box (41) having an air outlet (411) and a material inlet (412); and, A vacuum pump (42) having an air suction port (421), wherein the air suction port (421) of the vacuum pump (42) is in communication with the air outlet (411) of the material collecting box (41); The blocking bar (35) and / or the cutting block (32) is provided with a first discharge hole (323), one end of the first discharge hole (323) is connected to the material receiving area (36), and the other end is connected to the feed port (412) of the material collecting box (41).

8. The optical coupling surface gluing device according to claim 7, characterized in that: A heating wire (37) is embedded in the blocking bar (35) and / or the cutting block (32).

9. The optical coupling surface gluing device according to claim 8, characterized in that: It also comprises a cross slide (5) having a driving portion (51), the cross slide (5) being fixedly connected to the frame (1), the driving portion (51) of the cross slide (5) sliding in a direction perpendicular to the first direction, and the mounting frame (31) being fixedly connected to the driving portion (51).

10. A process for gluing the surface of an optical coupler, using the gluing device according to any one of claims 1 to 9, characterized in that: The steps include: S1: placing the chip on the base (11); S2: Open the valve (22) to drip the colloid in the glue delivery tube (2) between the two optical couplers on the chip; after the colloid is dripped, if it is necessary to clean the cutting block (32), it is only necessary to energize the heating wire (37) and use the vacuum pump (42) to collect the colloid in the first discharge hole (323) and the second discharge hole (324) into the collection box (41) through the main discharge hole (325); S3: Send the chip coated with colloid to a drying box for drying.