Coating assembly, coating base station and coating method for preparing crystalline silicon perovskite battery

Abstract

The invention provides a coating assembly, a coating base station and a coating method for preparing a crystalline silicon perovskite cell, and relates to the technical field of solar cells. The coating assembly is arranged in a coating machine and comprises a first body and a plurality of containing areas divided on the first body in a matrix mode, a preset interval is formed between every two adjacent containing areas, and the containing areas are used for containing substrates to be coated; the first body is provided with a plurality of adsorption holes, and the adsorption holes are located in the range of the bottom face of the containing area and used for conducting vacuum adsorption on the to-be-coated base plate placed in the containing area. According to the coating assembly obtained through the design, the coating operation is simple and convenient, the planes of a plurality of substrates can be arranged in order, the whole planes are flush, the precision is consistent, the large-area uniform coating of the substrates is achieved, and the coating yield and the coating efficiency are improved.

Description

Technical Field

[0001] The present application relates to the technical field of solar cells, and in particular to a coating component, a coating base, and a coating method for preparing a crystalline silicon perovskite cell. Background Art

[0002] In recent years, organic-inorganic hybrid perovskite materials have attracted widespread attention in the field of solar cells due to their advantages such as high light absorption coefficient, excellent carrier separation, good carrier transport capability, low cost and solution preparation.

[0003] With the advancement of flat panel coating methods, panel coating of perovskite on glass has been realized. However, when coating perovskite cells on crystalline silicon, in order to meet mass production needs and improve coating efficiency, it is necessary to coat multiple crystalline silicon bottom cells at the same time. However, the size and thickness of each crystalline silicon bottom cell are different. Therefore, when facing the simultaneous coating of multiple crystalline silicon bottom cells, the current coating equipment cannot complete the coating of crystalline silicon bottom cells of different sizes and thicknesses, and thus cannot meet the quality requirements such as uniform coating, and thus cannot meet mass production needs. Summary of the invention

[0004] The present application provides a coating component, a coating base and a coating method for preparing a crystalline silicon perovskite cell, which can arrange the planes of multiple substrates neatly to make the entire surface flat and consistent in precision, so as to achieve large-area uniform coating of the substrates, thereby increasing the coating output and coating efficiency.

[0005] The embodiment of the present application is implemented as follows:

[0006] According to one aspect of an embodiment of the present application, a coating assembly is provided, which is configured in a coating machine and includes a first body and a plurality of placement areas divided in a matrix on the first body, with a preset interval between two adjacent placement areas, and the placement areas are used to place substrates to be coated; a plurality of adsorption holes are provided on the first body, and the adsorption holes are located within the bottom surface of the placement areas, and are used for vacuum adsorption of the substrates to be coated placed in the placement areas.

[0007] Optionally, the coating assembly also includes a mask plate arranged on the first body, and the thickness of the mask plate is the same as the thickness of the substrate to be coated; the mask plate is provided with openings corresponding to multiple placement areas on the first body, and the first body is also provided with multiple adsorption holes at positions corresponding to the mask plate, which are used to vacuum adsorb and fix the mask plate in a preset interval between two adjacent placement areas.

[0008] Optionally, a groove is processed on the first body at a preset interval between two adjacent placement areas, and the groove is used to separate the vacuum ranges of the two adjacent placement areas.

[0009] According to one aspect of an embodiment of the present application, a coating base is provided, comprising a second body and a plurality of placement areas divided in a matrix on the second body, with a preset interval between two adjacent placement areas, the placement areas being used to place substrates to be coated; a plurality of adsorption holes are provided on the second body, the adsorption holes are located within the bottom surface of the placement areas, and are used to vacuum adsorb and fix the substrates to be coated placed in the placement areas.

[0010] Optionally, the coating base further includes an isolation frame, which is disposed on the second body and correspondingly clamped in a preset interval to define a plurality of placement areas divided in a matrix.

[0011] Optionally, a groove is processed on the second body at a preset interval between two adjacent placement areas, and the groove is used to separate the vacuum ranges of the two adjacent placement areas.

[0012] Optionally, the coating base further includes a temperature control component disposed in the second body, for heating or cooling the surface of the second body.

[0013] Another aspect of an embodiment of the present application provides a coating base, including a third body and a receiving plate fixedly mounted on the third body, the receiving plate being coated with a photocurable adhesive layer, and a plurality of placement areas being divided into a matrix on the receiving plate, the placement areas being used to place substrates to be coated.

[0014] Optionally, a plurality of adsorption holes are provided on the third body for fixing the receiving plate by vacuum adsorption.

[0015] Optionally, the coating base further includes a temperature control component disposed in the third body, for heating or cooling the surface of the third body.

[0016] Another aspect of the present application provides a coating method for preparing a crystalline silicon perovskite cell using a coating component, the method comprising:

[0017] Placing the substrate to be coated in the placement area of ​​the first body;

[0018] Vacuum adsorbing the substrate to be coated in the placement area through a plurality of adsorption holes on the first body;

[0019] The first body is sent into a coating machine to coat the substrates to be coated in the plurality of placement areas with a whole layer of perovskite, dry and crystallize to form a crystalline silicon perovskite cell structure;

[0020] The first body is separated and removed to obtain a plurality of crystalline silicon perovskite cells.

[0021] Optionally, the coating assembly further includes a mask plate disposed on the first body, and before the substrate to be coated is correspondingly placed in the placement area of ​​the first body, the method further includes:

[0022] The mask is placed on the first body and clamped in a preset interval between two adjacent placement areas so that the opening of the mask corresponds to the positions of the multiple placement areas on the first body;

[0023] The mask is vacuum adsorbed through a plurality of adsorption holes on the first body.

[0024] Optionally, a groove is processed on the first body at a preset interval between two adjacent placement areas;

[0025] Before coating the substrates to be coated in the plurality of placement areas with a whole layer of perovskite, drying and crystallizing to form a crystalline silicon perovskite cell structure, the method further includes:

[0026] Introduce positive pressure gas into the groove.

[0027] Another aspect of the present application provides a coating method for preparing a crystalline silicon perovskite cell using a coating base, the method comprising:

[0028] Placing the substrate to be coated in the placement area of ​​the second body;

[0029] Vacuum adsorbing the substrate to be coated in the placement area through a plurality of adsorption holes on the second body;

[0030] The substrates to be coated in the plurality of placement areas are coated with a whole layer of perovskite, dried and crystallized to form a crystalline silicon perovskite cell structure;

[0031] The second body is separated and removed to obtain a plurality of crystalline silicon perovskite cells.

[0032] Optionally, the coating base further includes an isolation frame, and before the substrate to be coated is correspondingly placed in the placement area of ​​the second body, the method further includes:

[0033] The isolation frame is correspondingly placed on the second body and correspondingly clamped in a preset interval between two adjacent placement areas, so that the opening of the isolation frame corresponds to the positions of the multiple placement areas on the second body.

[0034] Optionally, the coating base station further includes a temperature control component disposed in the second body. Before coating the substrates to be coated in the plurality of placement areas with a whole layer of perovskite, drying and crystallizing to form a crystalline silicon perovskite cell structure, the method further includes:

[0035] The second body is heated or cooled by the temperature control component so that the placement area reaches a preset temperature range.

[0036] Another aspect of the present application provides a coating method for preparing a crystalline silicon perovskite cell using a coating base, the method comprising:

[0037] The substrate to be coated is placed in the placement area of ​​the receiving plate, and the substrate to be coated is adhered and fixed to the receiving plate through a light-curing adhesive layer;

[0038] The substrates to be coated in the plurality of placement areas are coated with a whole layer of perovskite, dried and crystallized to form a crystalline silicon perovskite cell structure;

[0039] The photocurable adhesive layer is cured by light, and the receiving plate is cleaned to remove the cured photocurable adhesive layer, thereby obtaining a plurality of crystalline silicon perovskite cells.

[0040] Optionally, there is an adsorption hole on the third body, and the method further includes adsorbing and fixing the receiving plate on the third body through the adsorption hole.

[0041] Optionally, the coating base further includes a temperature control component disposed in the third body, and before curing the light-curing adhesive layer by light, cleaning the receiving plate to remove the cured light-curing adhesive layer, and obtaining a plurality of crystalline silicon perovskite cells, the method further includes:

[0042] The third body is heated or cooled by the temperature control component so that the placement area reaches a preset temperature range.

[0043] The beneficial effects of the embodiments of the present application include at least one of the following:

[0044] The coating assembly provided in the embodiment of the present application is configured in a coating machine, including a first body and a plurality of placement areas divided in a matrix on the first body, which can enable a plurality of substrates to be coated to be placed independently during the coating process; there is a preset interval between two adjacent placement areas, and the placement area is used to place the substrates to be coated; the first body is provided with a plurality of adsorption holes, and the adsorption holes are located within the bottom surface range of the placement area, which are used to vacuum adsorb the substrates to be coated placed in the placement area, so that the substrates to be coated can be stable and firm during the coating process. The coating assembly obtained by the above design can be placed in the coating machine for use without adjusting the overall structure of the coating machine. Its coating operation is simple and convenient, and it can arrange the planes of multiple substrates neatly, so that the entire surface is flat and the precision is consistent, so as to achieve large-area uniform coating of substrates, and increase the coating output and coating efficiency.

[0045] The coating base provided in the embodiment of the present application includes a second body and a plurality of placement areas divided in a matrix on the second body, with a preset interval between two adjacent placement areas, so that a plurality of substrates to be coated can be placed independently during the coating process; the placement area is used to place the substrate to be coated; the second body is provided with a plurality of adsorption holes, and the adsorption holes are located within the bottom surface of the placement area, which are used to vacuum adsorb and fix the substrate to be coated placed in the placement area, so that the substrate to be coated can be stable and firm during the coating process. The coating base obtained by the above design has a simple and convenient coating operation, can arrange the planes of multiple substrates neatly, make the entire surface flat and consistent in precision, so as to achieve large-area uniform coating of substrates, and increase the coating output and coating efficiency.

[0046] The coating base provided in the embodiment of the present application includes a third body and a receiving plate fixedly arranged on the third body, the receiving plate is coated with a light-curing adhesive layer, and a plurality of placement areas are divided into a matrix on the receiving plate, and the placement areas are used to place the substrates to be coated. The coating base obtained by the above design does not need to adjust the overall structure of the coating machine, and its coating operation is simple and convenient, and it can arrange the planes of multiple substrates neatly, making the entire surface flush and consistent in precision, so as to achieve large-area uniform coating of substrates, thereby increasing the coating output and coating efficiency.

[0047] The coating method for preparing crystalline silicon perovskite cells provided in the embodiments of the present application can realize perovskite coating of multiple substrates to be coated, and the coating process is stable and reliable, and can realize large-area uniform coating of substrates, thereby increasing coating output and coating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0049] Figure 1 One of the structural schematic diagrams of the coating base provided in the embodiment of the present application;

[0050] Figure 2 One of the schematic diagrams of the placement area of ​​the coating base provided in the embodiment of the present application;

[0051] Figure 3 A schematic diagram of the structure of the mask provided in the embodiment of the present application;

[0052] Figure 4 The second structural schematic diagram of the coating base provided in the embodiment of the present application;

[0053] Figure 5 The second schematic diagram of the placement area of ​​the coating base provided in the embodiment of the present application;

[0054] Figure 6 A schematic diagram of an isolation framework provided in an embodiment of the present application;

[0055] Figure 7 The third structural schematic diagram of the coating base provided in the embodiment of the present application;

[0056] Figure 8 A schematic diagram of the structure of the receiving plate provided in the embodiment of the present application;

[0057] Fig. 9 One of the schematic diagrams of the coating method for preparing a crystalline silicon perovskite cell using a coating component provided in an embodiment of the present application;

[0058] Fig.10 A second schematic diagram of a coating method for preparing a crystalline silicon perovskite cell using a coating component provided in an embodiment of the present application;

[0059] Fig.11 A third schematic diagram of a coating method for preparing a crystalline silicon perovskite cell using a coating component provided in an embodiment of the present application;

[0060] Fig.12 A fourth schematic diagram of a coating method for preparing a crystalline silicon perovskite cell using a coating substrate provided in an embodiment of the present application;

[0061] Fig.13 Schematic diagram 5 of a coating method for preparing crystalline silicon perovskite cells using a coating substrate provided in an embodiment of the present application.

[0062] Icons: 100-coating component; 110-placing area; 111-adsorption hole; 120-mask; 121-opening; 130-preset interval; 131-groove; 140-isolation frame; 141-bar; 150-receiving plate; 151-photocuring adhesive layer; 200-coating base; 300-substrate to be coated. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0064] In the description of the present application, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present utility model.

[0065] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0066] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or a signal connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0067] With the advancement of flat panel coating methods, panel coating of perovskite on glass has been achieved. However, when coating perovskite cells with crystalline silicon at present, since the size and thickness of each substrate are different, it is impossible to arrange them into a plane with consistent height and precision, and the substrate coating requirements are high, resulting in the inability to uniformly coat the substrate over a large area. Only a single piece of small area coating can be performed, and the coating output is small and the efficiency is low. In view of this, the present application provides a coating component 100, a coating base 200, and a coating method for preparing a crystalline silicon perovskite cell using the coating component 100 and the coating base 200.

[0068] Example 1: Please refer to Figure 1 , a coating component 100 is provided, which is configured in a coating machine, including a first body and a plurality of placement areas 110 divided in a matrix on the first body, and a preset interval 130 is provided between two adjacent placement areas 110, and the placement areas 110 are used to place substrates 300 to be coated; a plurality of adsorption holes 111 are provided on the first body, and the adsorption holes 111 are located within the bottom surface range of the placement areas 110, and are used for vacuum adsorption of the substrates 300 to be coated placed in the placement areas 110.

[0069] Specifically, Figure 2As shown, the coating base 200 includes a first body, which plays a certain supporting role as a carrier for multiple substrates to be coated 300. In a preferred embodiment of the present application, the first body can be made of a material that is not easily deformed, such as marble, stainless steel, aluminum alloy, etc. The first body can be made into a tray structure for carrying the substrates to be coated 300.

[0070] A temperature control component is provided inside the first body. Since the perovskite process involves the thermodynamic and kinetic processes of nucleation and crystallization, and the subsequent passivation layer process also involves molecular coordination, the temperature control of the coating process is extremely important. Therefore, during the coating process, the first body needs to be preheated or precooled in advance. The first body is divided into a plurality of placement areas 110, and the plurality of placement areas 110 are divided into a matrix for placing the substrates 300 to be coated, so that the plurality of substrates 300 to be coated are arranged in order. It should be noted that in order to ensure the accuracy of the coating process, the upper and lower surfaces of the tray need to be processed to be particularly flat, with a flatness error of less than 5 microns.

[0071] There is a preset interval 130 between two adjacent placement areas 110 to isolate the two adjacent placement areas 110 so that each substrate 300 to be coated is independent of each other during the coating process. A plurality of adsorption holes 111 are provided on the first body. When the substrate 300 to be coated is placed in the placement area 110, the adsorption holes 111 can adsorb the substrate 300 to be coated to the placement area 110 to prevent the substrate 300 to be coated from shifting during the coating process.

[0072] There is a preset interval 130 between two adjacent placement areas 110 , and a groove 131 can be processed and set at the preset interval 130 to separate the vacuum ranges of the two adjacent placement areas 110 .

[0073] like Figure 3 The coating component 100 also includes a mask plate 120 arranged on the first body, and the thickness of the mask plate 120 is the same as the thickness of the substrate 300 to be coated; the mask plate 120 is provided with openings 121 corresponding to the multiple placement areas 110 on the first body, and the first body is also provided with multiple adsorption holes 111 at positions corresponding to the mask plate 120, which are used to vacuum adsorb and fix the mask plate 120 in a preset interval 130 between two adjacent placement areas 110.

[0074] Specifically, the coating assembly 100 also includes a mask plate 120, and the mask plate 120 is provided with openings 121 corresponding to the positions of the multiple placement areas 110 on the first body and adapted in size. The first body is also provided with multiple adsorption holes 111 at the position corresponding to the mask plate 120, which are used to vacuum adsorb and fix the mask plate 120. When the mask plate 120 is placed on the first body of the coating assembly 100, the placement table can be exposed to place the substrate 300 to be coated, and the preset interval 130, groove 131, etc. except the placement area 110 can be covered. At the same time, when the substrate 300 to be coated is placed in the hole, the gap around it is no more than 50 microns. Through the above-mentioned setting of the mask plate 120, a liquid bridge can be formed between two adjacent substrates 300 to be coated during the coating process to prevent the liquid from flowing into the back of the substrate 300 to be coated, thereby improving the coating yield.

[0075] like Fig. 9 and Fig.10 The present application provides a coating method for preparing a crystalline silicon perovskite cell using the above-mentioned coating base 200, the method comprising:

[0076] Step S100, placing the substrate 300 to be coated in the placement area 110 of the first body;

[0077] Step S200, vacuum adsorbing the substrate 300 to be coated in the placement area 110 through the plurality of adsorption holes 111 on the first body;

[0078] Step S300, sending the first body into a coating machine to coat the substrates 300 to be coated in the plurality of placement areas 110 with a whole layer of perovskite, drying and crystallizing to form a crystalline silicon perovskite cell structure;

[0079] Step S400, separating and removing the first body to obtain a plurality of crystalline silicon perovskite cells.

[0080] The coating platform 200 further includes a mask 120 disposed on the first body. Before the substrate 300 to be coated is correspondingly placed in the placement area 110 of the first body in step S100, the method further includes:

[0081] Step S110, placing the mask 120 on the first body, and clamping it in the preset interval 130 between two adjacent placement areas 110, so that the opening 121 of the mask 120 corresponds to the positions of the plurality of placement areas 110 on the first body;

[0082] Step S120 , vacuum adsorbing the mask 120 through the plurality of adsorption holes 111 on the first body.

[0083] In step S300, the first body is sent into a coating machine to coat the substrates 300 to be coated in the plurality of placement areas 110 with a whole layer of perovskite, dry and crystallize to form a crystalline silicon perovskite cell structure. Fig.11 , the method further comprises:

[0084] Step S310 , introducing positive pressure gas into the groove 131 .

[0085] Specifically, the coating method for preparing a crystalline silicon perovskite cell is as follows, which is applied to the coating base 200 provided in Example 1:

[0086] First, the incoming substrates 300 to be coated are sorted to ensure that the size difference of each substrate 300 to be coated is within 50 microns and the thickness difference is within ±10 microns;

[0087] The first body can be made of a material that is easy to process and not easy to deform, such as marble, stainless steel, aluminum alloy, etc.; the first body can be processed into a tray-shaped structure; the tray has a plurality of placement areas 110 arranged in a matrix; the mask plate 120 is placed on the first body accordingly, the opening 121 of the mask plate 120 corresponds to the position of the placement area 110 on the first body, and the mask plate 120 is adsorbed on the first body through the adsorption holes 111; then the substrate 300 to be coated is placed in the opening 121 of the mask plate 120, that is, placed in the placement area 110 of the first body; after the substrate 300 to be coated is placed, the substrate 300 to be coated in the placement area 110 is vacuum adsorbed through the plurality of adsorption holes 111 on the first body, and the first body is heated or cooled by the temperature control component so that the placement area 110 reaches a preset temperature range;

[0088] Next, positive pressure gas is introduced into the groove 131 to compensate for the negative pressure on the back of the substrate 300 to be coated due to vacuum adsorption. This negative pressure makes it easy for the wet film on the surface of the substrate 300 to be coated to pass through the gaps between the substrates 300 to be coated and to be plated to the back of the substrate 300 to be coated. The slight positive pressure can reduce the risk of plating around when coating the entire slit. At this point, the substrate 300 to be coated, the mask 120, and the base form an integrated structure.

[0089] The integrated structure is sent to the panel coating machine to coat the substrates 300 to be coated in the multiple placement areas 110 with a whole layer of perovskite. After the panel coating machine has finished coating the perovskite, the automated equipment sends the entire tray to the next process for drying and crystallization to form a crystalline silicon perovskite cell structure. Finally, the tray or base and mask 120 are removed to obtain multiple crystalline silicon perovskite cells.

[0090] This preparation method is simple and convenient, and there is no need to adjust the overall structure of the coating machine. Its coating operation is simple and convenient, and it can arrange the planes of multiple substrates neatly, making the entire surface flat and consistent in precision, so as to achieve large-area uniform coating of substrates, increasing coating output and coating efficiency.

[0091] Example 2: Please refer to Figure 4 , a coating base 200 is provided. The coating base 200 includes a second body and a plurality of placement areas 110 divided in a matrix on the second body, with a preset interval 130 between two adjacent placement areas 110, and the placement areas 110 are used to place substrates 300 to be coated; the second body is provided with a plurality of adsorption holes 111, and the adsorption holes 111 are located within the bottom surface range of the placement areas 110, and are used to vacuum adsorb and fix the substrates 300 to be coated placed in the placement areas 110.

[0092] Specifically, Figure 5 The coating base 200 includes a second body, which plays a certain supporting role as a carrier for the plurality of substrates 300 to be coated. In a preferred embodiment of the present application, the second body can be made of a material that is not easily deformed, such as marble, stainless steel, aluminum alloy, etc. Figure 2 As shown, the second body can be made into a tray structure for carrying the substrate 300 to be coated.

[0093] A temperature control component is provided inside the second body. Since the perovskite process involves the thermodynamic and kinetic processes of nucleation and crystallization, and the subsequent passivation layer process also involves molecular coordination, the temperature control of the coating process is extremely important. Therefore, during the coating process, the second body needs to be preheated or precooled in advance. The second body is divided into a plurality of placement areas 110, and the plurality of placement areas 110 are divided in a matrix to prevent the substrate 300 to be coated, so that the plurality of substrates 300 to be coated are arranged in order. It should be noted that in order to ensure the accuracy of the coating process, the upper and lower surfaces of the tray need to be processed to be particularly flat, and the flatness error is less than 5 microns.

[0094] There is a preset interval 130 between two adjacent placement areas 110 to isolate the two adjacent placement areas 110 so that each substrate 300 to be coated is independent of each other during the coating process. A plurality of adsorption holes 111 are provided on the second body. When the substrate 300 to be coated is placed in the placement area 110, the adsorption holes 111 can adsorb the substrate 300 to the placement area 110 to prevent the substrate 300 to be coated from shifting during the coating process.

[0095] There is a preset interval 130 between two adjacent placement areas 110 , and a groove 131 can be processed and set at the preset interval 130 to separate the vacuum ranges of the two adjacent placement areas 110 .

[0096] like Figure 6 , further comprising an isolation frame 140, which is disposed on the second body and correspondingly clamped in the preset interval 130 to define a plurality of placement areas 110 divided in a matrix. Specifically, the isolation frame 140 has a similar structure to the second body and can be clamped in the groove 131 of the preset gap.

[0097] like Fig.12 The present application provides a coating method for preparing a crystalline silicon perovskite cell using the above-mentioned coating base 200, the method comprising:

[0098] Step S100, placing the substrate 300 to be coated in the placement area 110 of the second body;

[0099] Step S200, vacuum adsorbing the substrate 300 to be coated in the placement area 110 through the plurality of adsorption holes 111 on the second body;

[0100] Step S300, coating the substrates 300 to be coated in the plurality of placement areas 110 with a whole layer of perovskite, drying and crystallizing to form a crystalline silicon perovskite cell structure;

[0101] Step S400, separating and removing the second body to obtain a plurality of crystalline silicon perovskite cells.

[0102] The coating base 200 further includes an isolation frame 140. Before placing the substrate 300 to be coated in the placement area 110 of the second body in step S100, the method further includes:

[0103] S110, placing the isolation frame 140 on the second body, and clamping it in the preset interval 130 between two adjacent placement areas 110, so that the opening 121 of the isolation frame 140 corresponds to the positions of the plurality of placement areas 110 on the second body.

[0104] The coating base 200 further includes a temperature control component disposed in the second body. Before coating the substrates 300 to be coated in the plurality of placement areas 110 with a whole layer of perovskite, drying and crystallizing to form a crystalline silicon perovskite cell structure in step S300, the method further includes:

[0105] In step S210, the second body is heated or cooled by the temperature control component so that the placement area 110 reaches a preset temperature range.

[0106] Before performing the whole layer coating of perovskite on the substrates 300 to be coated in the plurality of placement areas 110, drying and crystallizing to form a crystalline silicon perovskite cell structure in step S300, the method further includes:

[0107] Step S220 , introducing positive pressure gas into the groove 131 .

[0108] Specifically, the coating method for preparing a crystalline silicon perovskite cell is as follows, which is applied to the coating base 200 provided in Example 2:

[0109] First, the incoming substrates 300 to be coated are sorted to ensure that the size difference of each substrate 300 to be coated is within 50 microns and the thickness difference is within ±10 microns;

[0110] like Figure 4 The main body of the coating base 200 can directly adopt the base marble on the panel coating machine, and directly process the groove 131 on the preset gap between two adjacent placement areas 110. The isolation frame 140 is clamped in the groove 131. The isolation frame 140 can divide a plurality of placement areas 110. A plurality of substrates 300 to be coated are placed in the placement area 110, and the substrates 300 to be coated are vacuum adsorbed through the adsorption holes 111. The main body is heated or cooled by the temperature control component so that the placement area 110 reaches the preset temperature range;

[0111] Next, positive pressure gas is introduced into the groove 131 to compensate for the negative pressure on the back of the substrate 300 to be coated due to vacuum adsorption. This negative pressure makes it easy for the wet film on the surface of the substrate 300 to be coated to pass through the gaps between the substrates 300 to be coated and to be plated to the back of the substrate 300 to be coated. A slight positive pressure can reduce the risk of plating around when coating the entire slit.

[0112] After all the substrates 300 to be coated are closely arranged and adsorbed to the marble base, coating is performed to obtain a crystalline silicon perovskite cell structure. After coating is completed, the isolation frame 140 can be lifted upward, and the substrates 300 to be coated are lifted up by the bracket as a whole, and then transferred as a whole to the next process for drying and crystallization to obtain multiple crystalline silicon perovskite cells.

[0113] It should be noted that when placing multiple substrates 300 to be coated in the placement area 110, multiple baffles 141 can be set, and the baffles 141 are respectively set on one of the longest sides and one of the shortest sides of the base, so as to serve as a positioning reference for the subsequent placement of the substrates 300 to be coated, and using image recognition algorithms and manipulators, the substrates 300 to be coated are arranged in sequence next to the baffles 141, so that the maximum gap between the substrates 300 to be coated is less than 50 microns. Through the setting of the above-mentioned baffles 141, a liquid bridge can be formed between two adjacent substrates 300 to be coated during the coating process to prevent the liquid from flowing into the back of the substrate 300 to be coated, thereby improving the coating yield.

[0114] In the above preparation method, when coating the substrate, the marble platform of the panel coating machine can be used as a carrier, thereby improving the coating accuracy; at the same time, the marble platform directly controls the temperature of the substrate 300 to be coated, and the temperature fluctuation is small. The coating operation is simple and convenient, and the planes of multiple substrates can be arranged neatly, so that the entire surface is flat and the accuracy is consistent, so as to achieve large-area uniform coating of the substrate, thereby increasing the coating output and coating efficiency.

[0115] Example 3: Please refer to Figure 7 , a coating base 200 is provided, including a third body and a receiving plate 150 fixedly arranged on the third body, a temperature control component is arranged in the third body, a photocuring adhesive layer 151 is coated on the receiving plate 150, and a plurality of placement areas 110 are divided into a matrix on the receiving plate 150, and the placement area 110 is used to place the substrate 300 to be coated.

[0116] The third body is provided with a plurality of adsorption holes 111 for fixing the receiving plate 150 by vacuum adsorption.

[0117] Specifically, Figure 8 The coating base 200 includes a base third body and a receiving plate 150 disposed on the third body. The third body is provided with a plurality of adsorption holes 111 for vacuum adsorption and fixation of the receiving plate 150. A temperature control component is disposed in the third body. Since the perovskite process involves the thermodynamic and kinetic processes of nucleation crystallization, and the subsequent passivation layer process also involves molecular coordination, the temperature control of the coating process is extremely important. Therefore, during the coating process, the third body needs to be preheated or precooled in advance.

[0118] like Figure 7 A photocurable adhesive layer 151 is coated on the receiving plate 150 . The photocurable adhesive may be a UV viscosity-reducing adhesive. The photocurable adhesive layer 151 can adhere the substrate 300 to be coated to the placement area 110 on the receiving plate 150 .

[0119] like Fig.13 The present application provides a coating method for preparing a crystalline silicon perovskite cell using the above-mentioned coating base 200, the method comprising:

[0120] Step S100, placing the substrate 300 to be coated in the placement area 110 of the receiving plate 150, and the substrate 300 to be coated is adhered and fixed to the receiving plate 150 through the photocurable adhesive layer 151;

[0121] Step S200, coating the substrates 300 to be coated in the plurality of placement areas 110 with a whole layer of perovskite, drying and crystallizing to form a crystalline silicon perovskite cell structure;

[0122] Step S300 , curing the photocurable adhesive layer 151 by light, cleaning the receiving plate 150 to remove the cured photocurable adhesive layer 151 , and obtaining a plurality of crystalline silicon perovskite cells.

[0123] The substrate 300 to be coated is fixed to the receiving plate 150 by bonding through the photocurable adhesive layer 151, and may also include:

[0124] Step S110 , the receiving plate 150 is adsorbed and fixed on the third body through the adsorption holes 111 .

[0125] Before curing the photocurable adhesive layer 151 by light, cleaning the receiving plate 150 to remove the cured photocurable adhesive layer 151, and obtaining a plurality of crystalline silicon perovskite cells, the method further includes:

[0126] Step S120: heating or cooling the third body by a temperature control component so that the placement area 110 reaches a preset temperature range.

[0127] Specifically, the coating method for preparing a crystalline silicon perovskite cell is as follows, which is applied to the coating base 200 provided in Example 3:

[0128] First, the incoming substrates 300 to be coated are sorted to ensure that the size difference of each substrate 300 to be coated is within 50 microns and the thickness difference is within ±10 microns;

[0129] Place the receiving plate 150 on the coating base 200, wherein the coating base 200 can be the base marble of the coating machine, and the receiving plate 150 can be made of glass with a thickness of about 0.5 mm. It should be noted that in a preferred embodiment of the present application, the receiving plate 150 can be a glass panel, and of course other plates that can place the substrate 300 to be coated can also be selected. The present application does not impose any restrictions on the specific setting method of the receiving plate 150;

[0130] A light-curing adhesive layer 151 is coated on the side of the receiving plate 150 facing away from the base. The light-curing adhesive can be UV-reducing adhesive, and the receiving plate 150 is adsorbed and fixed on the third body through the adsorption holes 111; a plurality of substrates 300 to be coated are bonded to the receiving plate 150 through the light-curing adhesive layer 151. A temperature control component is provided in the third body to ensure that the coating base 200 is within a suitable process temperature range.

[0131] It should be noted that, after all the substrates 300 to be coated are arranged, a rubber roller can be used to roll the substrates 300 to be coated from beginning to end, so that the substrates 300 to be coated are firmly adhered to the receiving plate 150, so as to ensure that the upper surfaces of all substrates 300 to be coated are flat. Then, the substrates 300 to be coated in the plurality of placement areas 110 are coated with a whole layer of perovskite. Since there is glue between the back of the substrate and the panel glass, it can be ensured that the perovskite solution will not penetrate into the back of the substrate 300 to be coated.

[0132] After coating, the receiving plate 150 and the substrate are sent to the next drying and crystallization process. After all the processes are completed, the back of the receiving plate 150 is irradiated with a UV lamp. At this time, the light-cured adhesive layer 151 loses its stickiness, thereby separating the substrate and the panel glass; in addition, the adhesive can be directly dissociated by heating through the subsequent annealing process after coating. The receiving plate 150 is debonded and can be recycled after cleaning.

[0133] The above preparation method is simple and convenient, and there is no need to adjust the overall structure of the coater. When coating the substrate, the marble platform of the panel coater can be used as a carrier, thereby improving the coating accuracy. At the same time, the marble platform directly controls the temperature of the substrate 300 to be coated, and the temperature fluctuation is small.

[0134] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A coating assembly, arranged in a coating machine, characterized in that: It comprises a first body and a plurality of placement areas divided in a matrix on the first body, with a preset interval between two adjacent placement areas, and the placement areas are used to place substrates to be coated; the first body is provided with a plurality of adsorption holes, and the adsorption holes are located within the bottom surface of the placement areas, and are used for vacuum adsorption of the substrates to be coated placed in the placement areas.

2. The coating assembly according to claim 1, characterized in that: It also includes a mask plate arranged on the first body, the thickness of the mask plate is the same as the thickness of the substrate to be coated; the mask plate is provided with openings corresponding to the multiple placement areas on the first body, and the first body is also provided with multiple adsorption holes at positions corresponding to the mask plate, which are used to vacuum adsorb and fix the mask plate in a preset interval between two adjacent placement areas.

3. The coating assembly according to claim 2, characterized in that: A groove is processed on the first body at a preset interval between two adjacent placement areas, and the groove is used to separate the vacuum range of the two adjacent placement areas.

4. A coating base, characterized in that: It comprises a second body and a plurality of placement areas divided in a matrix on the second body, with a preset interval between two adjacent placement areas, and the placement areas are used to place substrates to be coated; the second body is provided with a plurality of adsorption holes, and the adsorption holes are located within the bottom surface of the placement areas, and are used to vacuum adsorb and fix the substrates to be coated placed in the placement areas.

5. The coating base according to claim 4, characterized in that: It also includes an isolation frame, which is arranged on the second body and correspondingly clamped in the preset interval to define a plurality of placement areas divided in a matrix.

6. The coating base according to claim 4, characterized in that: A groove is processed on the second body at a preset interval between two adjacent placement areas, and the groove is used to separate the vacuum range of the two adjacent placement areas.

7. The coating base according to claim 4, characterized in that: It also includes a temperature control component disposed in the second body, and is used for heating or cooling the surface of the second body.

8. A coating base, characterized in that: It comprises a third body and a receiving plate fixedly arranged on the body, the receiving plate is coated with a light-curing adhesive layer, and a plurality of placement areas are divided into a matrix on the receiving plate, and the placement areas are used for placing substrates to be coated.

9. The coating base according to claim 8, characterized in that: The third body is provided with a plurality of adsorption holes for vacuum adsorption and fixation of the receiving plate.

10. The coating base according to claim 8, characterized in that: It also includes a temperature control component disposed in the third body, and is used for heating or cooling the surface of the third body.

11. A coating method for preparing a crystalline silicon perovskite cell using the coating assembly according to any one of claims 1 to 3, characterized in that: The method comprises: Placing the substrate to be coated in the placement area of ​​the first body; Vacuum adsorbing the substrate to be coated in the placement area through a plurality of adsorption holes on the first body; The first body is sent into a coating machine to coat the substrates to be coated in the plurality of placement areas with a whole layer of perovskite, dry and crystallize to form a crystalline silicon perovskite cell structure; The first body is separated and removed to obtain a plurality of crystalline silicon perovskite cells.

12. The coating method for preparing crystalline silicon perovskite cells according to claim 11, characterized in that: The coating assembly further includes a mask plate disposed on the first body. Before the substrate to be coated is correspondingly placed in the placement area of ​​the first body, the method further includes: Placing the mask on the first body and clamping it in a preset interval between two adjacent placement areas so that the opening of the mask corresponds to the positions of the multiple placement areas on the first body; The mask is vacuum adsorbed through a plurality of adsorption holes on the first body.

13. The coating method for preparing crystalline silicon perovskite cells according to claim 11, characterized in that: A groove is processed on the first body at a preset interval between two adjacent placement areas; Before the first body is sent into a coating machine to coat the substrates to be coated in the plurality of placement areas with a whole layer of perovskite, dry and crystallize to form a crystalline silicon perovskite cell structure, the method further includes: Positive pressure gas is introduced into the groove.

14. A coating method for preparing a crystalline silicon perovskite cell using the coating base as described in any one of claims 4 to 7, characterized in that: The method comprises: Placing the substrate to be coated in the placement area of ​​the second body; Vacuum adsorbing the substrate to be coated in the placement area through a plurality of adsorption holes on the second body; Performing full-layer coating of perovskite on the substrates to be coated in the plurality of placement areas, drying and crystallizing to form a crystalline silicon perovskite cell structure; The second body is separated and removed to obtain a plurality of crystalline silicon perovskite cells.

15. The coating method for preparing crystalline silicon perovskite cells according to claim 14, characterized in that: The coating base also includes an isolation frame. Before the substrate to be coated is placed in the placement area of ​​the second body, the method further includes: The isolation frame is correspondingly placed on the second body and correspondingly clamped in a preset interval between two adjacent placement areas, so that the opening of the isolation frame corresponds to the positions of the multiple placement areas on the second body.

16. The coating method for preparing crystalline silicon perovskite cells according to claim 14, characterized in that: The coating base also includes a temperature control component disposed in the second body. Before coating the substrates to be coated in the plurality of placement areas with a whole layer of perovskite, drying and crystallizing to form a crystalline silicon perovskite cell structure, the method also includes: The second body is heated or cooled by a temperature control component so that the placement area reaches a preset temperature range.

17. The coating method for preparing crystalline silicon perovskite cells according to claim 14, characterized in that: A groove is processed on the second body at a preset interval between two adjacent placement areas; Before coating the substrates to be coated in the plurality of placement areas with a whole layer of perovskite, drying and crystallizing to form a crystalline silicon perovskite cell structure, the method further comprises: Positive pressure gas is introduced into the groove.

18. A coating method for preparing a crystalline silicon perovskite cell using the coating base as claimed in any one of claims 8 to 10, characterized in that: The method comprises: Placing the substrate to be coated in the placement area of ​​the receiving plate, and the substrate to be coated is adhered and fixed to the receiving plate through a light-curing adhesive layer; Performing full-layer coating of perovskite on the substrates to be coated in the plurality of placement areas, drying and crystallizing to form a crystalline silicon perovskite cell structure; The photocurable adhesive layer is cured by light, and the receiving plate is cleaned to remove the cured photocurable adhesive layer, thereby obtaining a plurality of crystalline silicon perovskite cells.

19. The coating method for preparing a crystalline silicon perovskite cell according to claim 18, characterized in that: The third body has adsorption holes. After the substrate to be coated is placed in the placement area of ​​the receiving plate, the method further includes: The receiving plate is adsorbed and fixed on the third body through the adsorption holes.

20. The coating method for preparing crystalline silicon perovskite cells according to claim 18, characterized in that: The coating base station further includes a temperature control component disposed in the third body. Before curing the light-curing adhesive layer by irradiating light, cleaning the receiving plate to remove the cured light-curing adhesive layer, and obtaining a plurality of crystalline silicon perovskite cells, the method further includes: The third body is heated or cooled by a temperature control component so that the placement area reaches a preset temperature range.

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