Gluing treatment method, device and equipment

Abstract

The invention relates to a gluing processing method, device and equipment.The method comprises the steps that in the process that gluing equipment conducts gluing on materials according to a gluing path, gluing data of gluing positions is obtained; wherein the gluing data comprises a glue width value and a glue height value of the corresponding gluing position; according to the gluing data, determining whether the corresponding gluing position is a gluing defect position with a gluing defect; and under the condition that the corresponding gluing position is a gluing defect position, recording a defect processing type corresponding to the gluing defect position, a gluing deviation value and a position coordinate of the gluing defect position in the material to obtain gluing defect information of the material.

Description

Technical Field

[0001] The present disclosure relates to the field of glue coating technology, and more specifically, to a glue coating processing method, device and equipment. Background Art

[0002] At present, new energy vehicles install power batteries on the frame through battery trays to protect and support the power batteries. Usually, the battery tray consists of three parts: the bottom frame of the tray, the bottom plate, and the expansion beam on the side. These three parts need to be glued and bonded into one before they can be put into use. However, in the related art, when gluing the various parts of the battery tray, due to the influence of various external or internal factors, the gluing often does not meet the requirements, such as overflowing glue, insufficient glue, etc., which seriously affects the gluing efficiency and the yield rate of the battery tray. Summary of the invention

[0003] One purpose of the embodiments of the present disclosure is to provide a method for improving the gluing efficiency and yield rate of materials.

[0004] According to a first aspect of the present disclosure, an embodiment of a glue coating method is provided, the method comprising:

[0005] In the process of gluing the material by the gluing device according to the gluing path, the gluing data of the completed gluing position is obtained; wherein the gluing data includes the glue width value and the glue height value of the corresponding gluing position;

[0006] According to the glue coating data, determining whether the corresponding glue coating position is a glue coating defect position with a glue coating defect;

[0007] In the case where the corresponding glue coating position is a glue coating defect position, the defect processing type, glue coating deviation and position coordinates of the glue coating defect position in the material corresponding to the glue coating defect position are recorded to obtain glue coating defect information of the material.

[0008] Optionally, after the gluing of the material is completed, the method further comprises:

[0009] According to the gluing defect information of the material, for each gluing defect position, defect processing corresponding to the gluing deviation amount is performed at the position coordinates of the gluing defect position by using a device adapted to the defect processing type corresponding to the gluing defect position.

[0010] Optionally, according to the gluing defect information of the material, for each gluing defect position, defect processing corresponding to the gluing deviation amount is performed at the position coordinates where the gluing defect position is located by using a device adapted to the defect processing type corresponding to the gluing defect position, including:

[0011] According to the gluing defect information of the material, determining whether the material has a first gluing defect position whose defect processing type is a glue repair type;

[0012] In the case that the material has the first glue coating defect position, the glue coating device is controlled at the position coordinates of the first glue coating defect position, and glue is repaired according to the defect deviation amount of the first glue coating defect position.

[0013] Optionally, according to the gluing defect information of the material, for each gluing defect position, defect processing corresponding to the gluing deviation amount is performed at the position coordinates where the gluing defect position is located by using a device adapted to the defect processing type corresponding to the gluing defect position, including:

[0014] According to the gluing defect information of the material, determining whether the material has a second gluing defect position whose defect processing type is a gluing scraping type;

[0015] In the case where the material has the second glue coating defect position, the glue scraping device is controlled at the position coordinates of the second glue coating defect position, and glue scraping is performed according to the defect deviation amount of the second glue coating defect position.

[0016] Optionally, determining whether the corresponding glue coating position is a glue coating defect position having a glue coating defect according to the glue coating data includes:

[0017] Determine the actual glue path cross-section value of the corresponding glue application position according to the glue width value and glue height value of the corresponding glue application position in the glue application data;

[0018] When the difference between the actual glue path cross-sectional value of the corresponding glue coating position and the reference glue path cross-sectional value of the corresponding glue coating position exceeds a set range, the corresponding glue coating position is determined to be a glue coating defect position with a glue coating defect.

[0019] Optionally, in the process of the gluing device gluing the material according to the gluing path, the method further includes:

[0020] According to the glue properties of the glue required in the gluing process corresponding to the acquired or detected ambient temperature and humidity values, the glue output of the glue used in the gluing process is adjusted.

[0021] Optionally, the glue required in the gluing process includes a first glue and a second glue, the first glue and the second glue have different glue properties, and adjusting the glue output of the glue used in the gluing process according to the glue properties of the glue required in the gluing process corresponding to the acquired or detected ambient temperature and humidity values ​​includes:

[0022] According to the glue properties of the first glue and the second glue corresponding to the acquired or detected ambient temperature and humidity values, the glue output ratio of the first glue and the second glue during the gluing process is adjusted.

[0023] Optionally, in the process of the gluing device gluing the material according to the gluing path, before obtaining the gluing data of the completed gluing position, the method further includes:

[0024] Get visual data of materials;

[0025] Determining the material type of the material according to the acquired visual data of the material;

[0026] When a size deviation value between a material size value in the visual data and a standard size value of a material type to which the material belongs is within a set tolerance range, gluing the material is started.

[0027] Optionally, the starting of gluing the material includes:

[0028] Determine a gluing path according to a size deviation value between the size value of the material and a standard size value of the material type to which the material belongs;

[0029] According to the gluing path, gluing of the material is started.

[0030] Optionally, determining the material type of the material according to the visual data of the material includes:

[0031] Identifying feature points in the visual data;

[0032] The material type to which the material belongs is determined according to the number of the feature points and the position coordinates of the feature points.

[0033] According to a second aspect of the present disclosure, an embodiment of a glue coating processing device is provided, the glue coating processing device comprising:

[0034] An acquisition module is used to acquire the glue coating data of the completed glue coating position during the process of the glue coating equipment coating the material according to the glue coating path; wherein the glue coating data includes the glue width value and the glue height value of the corresponding glue coating position;

[0035] A determination module, used for determining whether the corresponding glue coating position is a glue coating defect position with glue coating defects according to the glue coating data;

[0036] The recording module is used to record the defect processing type, glue deviation and position coordinates of the glue defect position corresponding to the glue defect position in the material when the corresponding glue coating position is a glue defect position, so as to obtain the glue defect information of the material.

[0037] According to the third aspect of the present disclosure, another embodiment of a gluing processing device is provided, the control device comprising: a memory and a processor, the memory storing executable instructions, the instructions being used to control the processor to operate to execute the gluing processing method according to the first aspect of the present disclosure.

[0038] According to a fourth aspect of the present disclosure, an embodiment of a gluing device is provided, the device comprising: a 3D scanner, the 3D scanner is used to collect gluing data of a completed gluing position during the process of the gluing device gluing a material according to a gluing path, and output the gluing data to a gluing processing device; wherein the gluing data comprises a glue width value and a glue height value of the corresponding gluing position;

[0039] A glue coating processing device, wherein the glue coating processing device is the glue coating processing device described in the second aspect or the third aspect.

[0040] Optionally, the glue coating device further comprises:

[0041] A temperature and humidity detector, which is used to detect the ambient temperature and humidity values ​​and output them to the glue coating processing device;

[0042] A visual scanner is used to scan the material, obtain the visual data of the material, and output it to the gluing processing device.

[0043] One beneficial effect of the disclosed embodiment is that according to the method of the embodiment, during the process of gluing the material according to the gluing path by the gluing equipment, the gluing data of the completed gluing position is obtained; according to the gluing data, whether the corresponding gluing position is a gluing defect position with a gluing defect is determined; when the corresponding gluing position is a gluing defect position, the defect processing type, gluing deviation and position coordinates of the gluing defect position in the material corresponding to the gluing defect position are recorded to obtain the gluing defect information of the material. It is possible to record the gluing defect positions that appear during the gluing process and obtain the gluing defect information, thereby facilitating the corresponding processing of the gluing defect positions according to the gluing defect information, thereby improving the gluing efficiency and yield rate of the material.

[0044] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0046] Figure 1 is a flow chart of a method for gluing according to an embodiment;

[0047] Figure 2 is a flow chart of a gluing processing method according to another embodiment;

[0048] Figure 3 A schematic structural diagram of a glue coating processing device according to an embodiment;

[0049] Figure 4 is a schematic structural diagram of a glue coating processing device according to another embodiment;

[0050] Figure 5 is a schematic structural diagram of a glue coating device according to an embodiment;

[0051] Figure 6 It is a schematic structural diagram of a glue coating device according to another embodiment. DETAILED DESCRIPTION

[0052] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0053] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0054] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0055] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0056] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0057] <Method Example>

[0058] Figure 1 It is a flow chart of the gluing processing method according to an embodiment of the present disclosure.

[0059] like Figure 1 As shown, the glue coating processing method of this embodiment can be performed by a glue coating processing device.

[0060] Specifically, the gluing method of this embodiment may include the following steps S1100 to S1300:

[0061] Step S1100, in the process of the gluing equipment gluing the material according to the gluing path, the gluing data of the completed gluing position is obtained.

[0062] In this embodiment, the material can be any one of the bottom frame, bottom plate and side expansion beam of the battery tray, and the material can also be other materials that need to be glued and bonded, which is not limited here.

[0063] The gluing device may be a device capable of gluing the material according to a gluing path, wherein the gluing path may be a gluing path corresponding to the material type to which the material belongs, or may be a unique gluing path corresponding to the material, which is not limited here.

[0064] There are multiple gluing positions on the gluing path. When the gluing equipment is gluing the material according to the gluing path, when a certain gluing position in the gluing path is coated with glue, the gluing position has completed gluing, and the gluing data of the completed gluing position is obtained. The gluing data includes the glue width value and the glue height value of the corresponding gluing position.

[0065] It should be noted that there are multiple gluing positions on the gluing path, and accordingly, the obtained gluing data of the completed gluing positions also correspond to the glue width values ​​and glue height values ​​of the multiple gluing positions.

[0066] In some examples, a 3D scanner and a glue head of a glue coating device can be connected together. When the glue head moves to a certain glue coating position on the glue coating path, the 3D scanner also moves to the glue coating position. After the glue head discharges glue to coat the glue coating position, the glue coating at the glue coating position is completed, and the 3D scanner obtains the glue coating data of the completed glue coating position. When the 3D scanner collects the glue coating data of the completed glue coating position, the glue width value and glue height value of the completed glue coating position can be collected.

[0067] Step S1200: determining, based on the glue coating data, whether the corresponding glue coating position is a glue coating defect position with glue coating defects.

[0068] In this embodiment, during the process of gluing the material by the gluing device according to the gluing path, there may be gluing defect positions such as glue overflow or insufficient glue in multiple gluing positions due to environmental factors, such as the temperature and humidity of the environment, or due to the workmanship of the material itself, or due to bubbles in the glue, etc. Therefore, it is necessary to determine whether there are gluing defect positions in the multiple gluing positions based on the gluing data corresponding to the multiple gluing positions.

[0069] In one example, whether the glue coating position is a glue coating defect position can be determined by comparing the glue width value and glue height value of the corresponding glue coating position with the reference glue width value and reference glue height value of the corresponding glue coating position.

[0070] In another example, the actual glue path cross-section value of the corresponding glue coating position can also be determined based on the glue width value and glue height value of the corresponding glue coating position, and the actual glue path cross-section value can be compared with the reference glue path cross-section value of the corresponding glue coating position to determine whether the glue coating position is a glue coating defect position.

[0071] In some embodiments, determining whether the corresponding glue coating position is a glue coating defect position with glue coating defects according to the glue coating data in step S1200 includes: step S1201 and step S1202.

[0072] Step S1201, determining the actual glue path cross-section value of the corresponding glue coating position according to the glue width value and glue height value of the corresponding glue coating position in the glue coating data.

[0073] In this embodiment, the actual glue path cross-section value corresponding to each glue application position is calculated based on the glue width value and glue height value of the glue application position.

[0074] In one example, the formula for calculating the actual glue path cross-section value at the glue application location is as follows:

[0075] sCross.value≈π*rWidth.value*rHeight.value

[0076] Among them, sCross.value is the actual glue path cross-section value of the corresponding glue coating position, rWidth.value is the glue width value of the corresponding glue coating position, rHeight.value is the glue height value of the corresponding glue coating position, and π is the pi.

[0077] Step S1202, when the difference between the actual glue path cross-section value of the corresponding glue coating position and the reference glue path cross-section value of the corresponding glue coating position exceeds a set range, determine that the corresponding glue coating position is a glue coating defect position with a glue coating defect.

[0078] In this embodiment, the reference glue path cross-sectional value can be determined based on the glue ratio and glue thickness required to be achieved after the materials involved in the gluing and the materials to be bonded. The reference glue path cross-sectional values ​​corresponding to different gluing positions can be the same or different, which is not limited here.

[0079] The setting range can be the allowable deviation between the actual glue path cross-section value and the reference glue path cross-section value without affecting the supply performance of the material.

[0080] In an example, the setting range may be smaller than a positive value and larger than a negative value.

[0081] When the difference between the actual glue path cross-sectional value and the reference glue path cross-sectional value of the gluing position is not within the set range, the gluing position is determined to be a gluing defect position. Through this step, the gluing data corresponding to multiple gluing positions can be judged, and then the gluing defect position among the multiple gluing positions can be determined.

[0082] In these embodiments, the glue coating defect position can be divided into a first glue coating defect position and a second glue coating defect position. When the difference between the actual glue path cross-section value of the glue coating position and the reference glue path cross-section value is less than zero and is not within a set range, the glue coating position is determined to be a first glue coating defect position.

[0083] When the difference between the actual glue path cross-sectional value of the glue coating position and the reference glue path cross-sectional value is greater than zero and is not within the set range, the glue coating position is determined to be the second glue coating defect position.

[0084] Step S1300, when the corresponding glue coating position is a glue coating defect position, record the defect processing type corresponding to the glue coating defect position, the glue coating deviation and the position coordinates of the glue coating defect position in the material to obtain the glue coating defect information of the material.

[0085] In this embodiment, the glue coating defect position is divided into a first glue coating defect position and a second glue coating defect position, wherein the first glue coating defect position is a glue coating position where the glue coating amount is less than a reference glue coating amount, and the defect processing type corresponding to the first glue coating defect position is glue repairing, and the second glue coating defect position is a glue coating position where the glue coating amount is greater than the reference glue coating amount, and the defect processing type corresponding to the second glue coating defect position is glue scraping.

[0086] In some examples, the amount of glue applied can be reflected by the glue width and glue height of the glue path, or by the cross-sectional value of the glue path, which is not limited here.

[0087] The glue coating deviation is the difference between the actual glue coating amount of the corresponding glue coating position and the reference glue coating amount.

[0088] In some examples, the existence of three glue defect positions A, B, and C is determined through the glue coating data of multiple completed glue coating positions, and the glue coating defect position A is the first glue coating defect position, and the glue coating defect positions B and C are the second glue coating defect positions. Then, the defect processing types, glue coating deviations, and position coordinates of the glue coating defect positions in the material corresponding to the three glue coating defect positions are recorded to obtain the glue defect information of the material.

[0089] In some embodiments, after the gluing of the material is completed, the method further includes:

[0090] Step S1400, based on the gluing defect information of the material, for each gluing defect position, defect processing corresponding to the gluing deviation is performed at the position coordinates of the gluing defect position by using a device adapted to the defect processing type corresponding to the gluing defect position.

[0091] In this embodiment, after the gluing of the material is completed, the material is defect-processed according to the gluing defect information of the material. When the defect processing type of the gluing position corresponding to the gluing defect information of the material is glue filling, the corresponding defect processing equipment is the gluing equipment. When the defect processing type of the gluing position corresponding to the gluing defect information of the material is glue scraping, the corresponding defect processing equipment can be a glue scraping equipment.

[0092] In some embodiments, in step S1400, based on the glue defect information of the material, for each glue defect position, defect processing corresponding to the glue deviation amount is performed at the position coordinates of the glue defect position by using a device adapted to the defect processing type corresponding to the glue defect position, including: steps S1411 to S1412.

[0093] Step S1411, according to the gluing defect information of the material, determining whether the material has a first gluing defect position whose defect processing type is a glue repair type.

[0094] Step S1412, when the material has the first glue coating defect position, control the glue coating equipment at the position coordinates where the first glue coating defect position is located, and perform glue filling according to the defect deviation amount of the first glue coating defect position.

[0095] Continuing with the above example, after the gluing of the material is completed, according to the defect processing type in the gluing defect information of the material, it is determined that there is a gluing defect position A of the gluing type in the material, and the gluing defect position A is the first gluing defect position. In this case, the gluing equipment is controlled at the position coordinates of the gluing defect position A, and the gluing defect position A is repaired according to the deviation value between the actual gluing amount of the gluing defect position A and the reference gluing amount.

[0096] In some embodiments, according to the glue defect information of the material in step S1400, for each glue defect position, defect processing corresponding to the glue deviation amount is performed at the position coordinates of the glue defect position by using a device adapted to the defect processing type corresponding to the glue defect position, including: step S1421 and step S1422.

[0097] Step S1421, determining whether the material has a second gluing defect position whose defect processing type is a gluing type according to the gluing defect information of the material;

[0098] Step S1422, when the material has the second glue coating defect position, control the glue scraping equipment at the position coordinates where the second glue coating defect position is located, and perform glue scraping according to the defect deviation amount of the second glue coating defect position.

[0099] Continuing with the above example, after the gluing of the material is completed, according to the defect processing type in the gluing defect information of the material, it is determined that there are gluing defect positions B and C of the scraping type in the material, and the gluing defect positions B and C are the second gluing defect positions. In this case, the scraping device can be controlled at the position coordinates of the gluing defect position B, and the gluing defect position B can be scraped according to the deviation value between the actual gluing amount of the gluing defect position B and the reference gluing amount. Then, the scraping device can be controlled at the position coordinates of the gluing defect position C, and the gluing defect position C can be scraped according to the deviation value between the actual gluing amount of the gluing defect position C and the reference gluing amount.

[0100] According to an embodiment of the present application, after completing the gluing of the material, based on the gluing defect information of the material, for each gluing defect position, defect processing corresponding to the gluing deviation amount is performed at the position coordinates of the gluing defect position by using a device adapted to the defect processing type corresponding to the gluing defect position, thereby improving the gluing efficiency and yield rate of the material.

[0101] During the gluing process of materials, the properties of glue are seriously affected by the ambient temperature and humidity. In order to avoid the influence of ambient temperature and humidity on the gluing efficiency and yield rate of materials and further improve the gluing efficiency and yield rate of materials, the embodiment of the present application also provides a method for adjusting the glue output according to the ambient temperature and humidity.

[0102] In some embodiments, during the process of the gluing device gluing the material according to the gluing path, the method further includes: step S2100.

[0103] Step S2100, adjusting the glue output of the glue used in the gluing process according to the glue properties of the glue required in the gluing process corresponding to the acquired or detected ambient temperature and humidity values.

[0104] In this embodiment, the glue properties may include the bonding strength and curing time of the glue. Among them, the bonding strength may be the maximum cohesive force after the glue is cured, that is, the strength of the bonding force of the glue. The curing time may be the time required for the glue to be completely cured. During the gluing process of the material, the gluing processing device may obtain the ambient temperature and humidity values, or detect the ambient temperature and humidity values, and adjust the glue output during the gluing process according to the glue properties of the glue corresponding to the ambient temperature and humidity values.

[0105] In some examples, the higher the ambient temperature and humidity, the smaller the difference in the bonding strength of the corresponding glue, and the shorter the curing time of the glue, that is, the glue is easy to air-dry. In this case, under the same air-drying time requirement, the amount of glue output when the ambient temperature and humidity are high can be reduced.

[0106] In some examples, the ambient temperature and humidity values ​​may be detected by a temperature and humidity detector, and the detected ambient temperature and humidity values ​​may be output to the glue processing device, so that the glue processing device determines the glue output amount according to the ambient temperature and humidity values.

[0107] In other examples, the glue processing device can directly detect the ambient temperature and humidity, and thus determine the amount of glue output based on the ambient temperature and humidity.

[0108] In some embodiments, the glue required in the gluing process includes a first glue and a second glue, and the first glue and the second glue have different glue properties. In step S2200, the glue output of the glue used in the gluing process is adjusted according to the glue properties of the glue required in the gluing process corresponding to the acquired or detected ambient temperature and humidity values, including:

[0109] According to the glue properties of the first glue and the second glue corresponding to the acquired or detected ambient temperature and humidity values, the glue output ratio of the first glue and the second glue during the gluing process is adjusted.

[0110] In this embodiment, the glue required in the gluing process includes a first glue and a second glue, and the first glue and the second glue have different glue properties.

[0111] For example, the first glue performs better than the second glue in terms of bonding strength, and the second glue performs better than the first glue in terms of curing time. The bonding strength of the first glue does not vary much with changes in ambient temperature and humidity, and the curing time of the second glue decreases as the ambient temperature and humidity increase, and the glue dries easily. Taking the bottom frame, bottom plate, and side expansion beams of a battery tray as an example, if the glue requirement is that the bonding state of the battery tray meets the requirements within a certain air-drying time, such as 2 hours of air-drying time, then when the ambient temperature and humidity are high, the proportion of the second glue in the glue used can be reduced, thereby appropriately extending the air-drying time of the glue to meet the glue requirements.

[0112] For example, the ratio of the first glue to the second glue corresponding to normal ambient temperature and humidity is 1:1.3. When the ambient temperature and humidity are higher than the normal ambient temperature and humidity, the glue is easy to dry, and the ratio of the first glue to the second glue in the glue used can be adjusted to 1:1.25 to meet the glue requirements.

[0113] According to an embodiment of the present application, by adjusting the glue output of the glue used in the gluing process according to the glue properties of the glue required in the gluing process corresponding to the acquired or detected ambient temperature and humidity values, gluing defects caused by differences in ambient temperature and humidity can be avoided, thereby further improving the gluing efficiency and yield rate of the material.

[0114] In some embodiments, in step S1100, during the process of the gluing device gluing the material according to the gluing path, before obtaining the gluing data of the completed gluing position, the method further includes:

[0115] Step S3100, obtaining visual data of the material.

[0116] In this embodiment, the gluing processing device obtains visual data of the material.

[0117] In some examples, the material may be scanned by a visual scanner to obtain visual data of the material, and the visual data may be output to the gluing processing device.

[0118] Step S3200: Determine the material type of the material based on the acquired visual data of the material.

[0119] In some embodiments, determining the material type of the material according to the acquired visual data of the material in step S3200 includes:

[0120] Step S3211, identifying feature points in the visual data.

[0121] Step S3212: Determine the material type to which the material belongs based on the number of the feature points and the position coordinates of the feature points.

[0122] In this embodiment, the number of set points of multiple material types and the position coordinates of each set point are pre-stored. Among them, the position coordinates of each set point include at least one of the absolute position coordinates of each set point in the material and the relative position coordinates between each set point. After acquiring the visual data of the material, the gluing processing device identifies the feature points in the visual data. According to the number of identified feature points and the position coordinates of each feature point, the material type to which the material belongs is determined. Among them, the position coordinates of each feature point include at least one of the absolute position coordinates of each feature point in the material and the relative position coordinates between each feature point.

[0123] Feature points and set points can be basic points of the material, such as pin holes, etc.

[0124] In some examples, the bottom frame of the battery tray includes 6 pin holes, the side includes 4 pin holes, and the expansion rack includes 3 pin holes. The gluing processing device can pre-store the number of pin holes (set points) in the materials of the above three parts of the battery tray. After acquiring the visual data of the material, it is identified that there are 3 pin holes in the visual data, and the current material is determined to be an expansion rack.

[0125] In other examples, the bottom frame of the battery tray includes 2 pin holes, the side includes 2 pin holes, and the expansion frame includes 2 pin holes. The glue processing device can pre-store the number of pin holes and the position coordinates of the pin holes (set points) of the above three parts of the battery tray, such as the relative position coordinates between the pin holes and the absolute position coordinates of each pin hole on the material. The glue processing device can determine the type of the current material based on the number of pin holes and the position coordinates between the pin holes identified by the visual data.

[0126] Step S3300, when the size deviation value between the material size value in the visual data and the standard size value of the material type to which the material belongs is within a set tolerance range, start gluing the material.

[0127] In this embodiment, the dimension value may be the length, width, height, etc. of the material.

[0128] After determining the material type to which the material belongs, the material size value in the visual data can be used to determine whether the material is good quality.

[0129] The formula for calculating the dimensional deviation value is as follows:

[0130] roffset.value==PosTarget.value-PosDigifax.value

[0131] Among them, roffset.value is the size deviation value, PosTarget.value is the material size value in the visual data of the material, and PosDigifax.value is the standard size value of the material type to which the material belongs.

[0132] The tolerance range can be set according to the compliance requirements of the material. If the dimensional deviation value is within the set tolerance range, it means that the material is good and the gluing of the material is started.

[0133] In some embodiments, in step S3212, after determining the material type to which the material belongs according to the number of the feature points and the position coordinates of the feature points, the method further includes:

[0134] When the size deviation value between the material size value in the visual data and the standard size value of the material type to which the material belongs is not within the set tolerance range, the material is unloaded.

[0135] In this embodiment, when the dimension deviation value is not within the set tolerance range, it means that the material is a defective product, and the glue processing device can control related equipment to unload the defective product.

[0136] In some embodiments, initiating the gluing of the material in step S3300 includes:

[0137] Step S3301, determining a gluing path according to a size deviation value between a material size value in the visual data and a standard size value of a material type to which the material belongs.

[0138] Step S3302, starting gluing of the material according to the gluing path.

[0139] In this embodiment, when the size deviation value is within the set tolerance range, the gluing path is determined according to the size deviation value between the material size value and the standard size value, and the gluing of the material is started according to the gluing path.

[0140] According to an embodiment of the present application, visual data of a material is acquired; based on the acquired visual data of the material, the material type to which the material belongs is determined; and when a size deviation value between a material size value in the visual data and a standard size value of the material type to which the material belongs is within a set tolerance range, the gluing of the material is started. Before gluing the material, it is possible to check whether the material is defective, and when the material is good, the gluing of the material is started, thereby reducing the problems of low gluing efficiency and low number of good products caused by the bad material itself, and further improving the gluing efficiency and the yield rate of the material.

[0141] Figure 2 1 shows a glue coating method according to some other embodiments, which can also be implemented by a glue coating device. Figure 2 As shown, the gluing method may include steps S1 to S20.

[0142] Step S1, obtaining visual data of the material.

[0143] In this embodiment, the material at the loading station is scanned by a visual scanner to obtain visual data of the material and output it to the gluing processing device.

[0144] Step S2, identifying pin holes in the visual data.

[0145] Step S3, determining the material type of the material according to the number of the pin holes and the position coordinates of the pin holes.

[0146] Step S4, whether the size deviation value between the material size value in the visual data and the standard size value of the material type is within the set tolerance range; if so, execute step S6, if not, execute step S5.

[0147] Step S5, unloading the material.

[0148] Step S6, determining a gluing path according to a size deviation value between the material size value and a standard size value of the material type to which the material belongs.

[0149] Step S7, starting gluing of the material according to the gluing path.

[0150] Step S8, obtaining the ambient temperature and humidity values.

[0151] Step S9, adjusting the glue output ratio of the first glue and the second glue during the glue coating process according to the glue properties of the first glue and the second glue corresponding to the ambient temperature and humidity values.

[0152] In this embodiment, the glue required in the gluing process includes a first glue and a second glue. The first glue and the second glue have different glue properties. The glue output ratio of the first glue and the second glue in the glue used in the gluing process can be adjusted according to the glue properties of the first glue and the second glue corresponding to the acquired ambient temperature value.

[0153] Step S10, obtaining the gluing data of the gluing position where the gluing has been completed.

[0154] In this embodiment, the glue coating data includes a glue width value and a glue height value of the corresponding glue coating position.

[0155] In some examples, the gluing data of the completed gluing positions may be acquired by a 3D scanner.

[0156] Step S11, determining the actual glue path cross-section value of the corresponding glue coating position according to the glue width value and glue height value of the corresponding glue coating position.

[0157] Step S12, whether the difference between the actual glue path cross-section value of the corresponding glue coating position and the reference glue path cross-section value of the corresponding glue coating position exceeds the set range; if so, execute step S14, if not, execute step S13.

[0158] Step S13, obtaining visual data of the next material.

[0159] Step S14, recording the defect processing type, the glue coating deviation and the position coordinates of the glue coating defect position in the material corresponding to the glue coating defect position, and obtaining the glue coating defect information of the material.

[0160] In this embodiment, when the actual glue path cross-sectional value is smaller than the reference glue path cross-sectional value, the defect processing type is glue filling; when the actual glue path cross-sectional value is larger than the reference glue path cross-sectional value, the defect processing type is glue scraping processing.

[0161] Step S15, completing the gluing of the material.

[0162] Step S16, according to the gluing defect information of the material, for each gluing defect position, a defect processing corresponding to the gluing deviation is performed at the position coordinates of the gluing defect position by using a device adapted to the defect processing type corresponding to the gluing defect position.

[0163] In some examples, it can be determined whether the material has a first glue coating defect position of a defect processing type of glue repairing type based on the glue coating defect information of the material; if the material has the first glue coating defect position, the glue coating equipment is controlled at the position coordinates of the first glue coating defect position to perform glue repair according to the defect deviation amount of the first glue coating defect position.

[0164] In other examples, it can be determined whether the material has a second glue coating defect position whose defect processing type is glue scraping type based on the glue coating defect information of the material; if the material has the second glue coating defect position, the glue scraping equipment is controlled to perform glue scraping at the position coordinates of the second glue coating defect position according to the defect deviation amount of the second glue coating defect position.

[0165] In some other examples, it may be determined first whether a first glue coating defect exists, and then whether a second glue coating defect exists. If a corresponding glue coating defect exists, corresponding glue coating defect processing may be performed.

[0166] Step S17, enter the subsequent process.

[0167] In this embodiment, the subsequent process may be, for example, airtightness detection, spraying, and the like.

[0168] In some embodiments, Figure 3 As shown, a glue coating processing device 300 is also provided, which includes an acquisition module 301, a determination module 302 and a recording module 303.

[0169] The acquisition module 301 is used to acquire the glue coating data of the completed glue coating position during the process of the glue coating equipment coating the material according to the glue coating path; wherein the glue coating data includes the glue width value and the glue height value of the corresponding glue coating position;

[0170] A determination module 302 is used to determine whether the corresponding glue coating position is a glue coating defect position with a glue coating defect according to the glue coating data;

[0171] The recording module 303 is used to record the defect processing type, glue deviation and position coordinates of the glue defect position corresponding to the glue defect position in the material when the corresponding glue coating position is a glue defect position, so as to obtain the glue defect information of the material.

[0172] In some embodiments, the glue processing device 300 also includes a defect processing module 304, which is used to perform defect processing corresponding to the glue deviation amount at the position coordinates of the glue defect position based on the glue defect information of the material, for each glue defect position, through a device adapted to the defect processing type corresponding to the glue defect position.

[0173] In some embodiments, the defect processing module 304 is used to determine whether the material has a first glue coating defect position whose defect processing type is a glue repair type according to the glue coating defect information of the material;

[0174] In the case that the material has the first glue coating defect position, the glue coating device is controlled at the position coordinates of the first glue coating defect position, and glue is repaired according to the defect deviation amount of the first glue coating defect position.

[0175] In some embodiments, the defect processing module 304 is used to determine whether the material has a second glue coating defect position whose defect processing type is a glue scraping type according to the glue coating defect information of the material;

[0176] In the case where the material has the second glue coating defect position, the glue scraping device is controlled at the position coordinates of the second glue coating defect position, and glue scraping is performed according to the defect deviation amount of the second glue coating defect position.

[0177] In some embodiments, the determination module 302 is used to determine the actual glue path cross-section value of the corresponding glue application position according to the glue width value and glue height value of the corresponding glue application position in the glue application data;

[0178] When the difference between the actual glue path cross-sectional value of the corresponding glue coating position and the reference glue path cross-sectional value of the corresponding glue coating position exceeds a set range, the corresponding glue coating position is determined to be a glue coating defect position with a glue coating defect.

[0179] In some embodiments, the glue processing device 300 also includes a glue output module 305, which is used to adjust the glue output amount of the glue used in the gluing process according to the glue properties of the glue required in the gluing process corresponding to the acquired or detected ambient temperature and humidity values.

[0180] In some embodiments, the glue required in the gluing process includes a first glue and a second glue, and the first glue and the second glue have different glue properties. The glue output module 305 is used to adjust the glue output ratio of the first glue and the second glue in the gluing process according to the glue properties of the first glue and the second glue corresponding to the ambient temperature and humidity values.

[0181] In some embodiments, the gluing processing device 300 also includes a material detection module 306, which is used to obtain visual data of the material; determine the material type to which the material belongs based on the acquired visual data of the material; and start gluing the material when the size deviation value between the material size value in the visual data and the standard size value of the material type to which the material belongs is within a set tolerance range.

[0182] In some embodiments, the material detection module 306 is used to determine a gluing path according to a size deviation value between the material size value and a standard size value of a material type to which the material belongs; and start gluing the material according to the gluing path.

[0183] In some embodiments, the material detection module 306 is used to identify feature points in the visual data; and determine the material type to which the material belongs based on the number of the feature points and the position coordinates of the feature points.

[0184] In some embodiments, Figure 4 As shown, a gluing processing device 400 is also provided. The device 400 includes a memory 401 and a processor 402. The memory 401 is used to store executable instructions, and the instructions are used to control the processor 402 to operate to execute the gluing processing method described in the embodiment of the present application.

[0185] In some embodiments, Figure 5 As shown, a gluing device 500 is also provided, including: a 3D scanner 501 and a gluing processing device 502.

[0186] The 3D scanner 501 is used to collect the gluing data of the completed gluing position during the process of the gluing equipment gluing the material according to the gluing path, and output the gluing data to the gluing processing device 502; wherein the gluing data includes the glue width value and glue height value of the corresponding gluing position.

[0187] In one embodiment, the glue processing device 502 can be as follows Figure 3 The glue processing device shown.

[0188] In another embodiment, the glue coating processing device 502 can be as follows Figure 4 The glue processing device shown.

[0189] In some embodiments, Figure 6 As shown, the gluing equipment 500 also includes a temperature and humidity detector 503 and a visual scanner 504 .

[0190] The temperature and humidity detector 503 is used to detect the ambient temperature and humidity values ​​and output them to the glue coating processing device 502;

[0191] The visual scanner 504 is used to scan the material, obtain the visual data of the material, and output it to the gluing processing device 502 .

[0192] The present invention may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0193] A computer-readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples of computer-readable storage media (a non-exhaustive list) include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punch card or a raised structure in a groove on which instructions are stored, and any suitable combination of the foregoing. As used herein, a computer-readable storage medium is not to be interpreted as a transient signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0194] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0195] The computer program instructions for performing the operation of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. Computer-readable program instructions may be executed entirely on a user's computer, partially on a user's computer, as an independent software package, partially on a user's computer, partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may be personalized by utilizing the state information of the computer-readable program instructions, and the electronic circuit may execute the computer-readable program instructions, thereby realizing various aspects of the present invention.

[0196] Various aspects of the present invention are described herein with reference to the flow charts and / or block diagrams of the methods, devices (systems) and computer program products according to embodiments of the present invention. It should be understood that each box of the flow chart and / or block diagram and the combination of each box in the flow chart and / or block diagram can be implemented by computer-readable program instructions.

[0197] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0198] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operating steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0199] The flow charts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a part of a module, a program segment or an instruction, and a part of the module, a program segment or an instruction contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that it is equivalent to implement it by hardware, implement it by software, and implement it by combining software and hardware.

[0200] Embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements to the technology in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A method for gluing, characterized in that: The method comprises: In the process of gluing the material by the gluing device according to the gluing path, the gluing data of the completed gluing position is obtained; wherein the gluing data includes the glue width value and the glue height value of the corresponding gluing position; According to the glue coating data, determining whether the corresponding glue coating position is a glue coating defect position with a glue coating defect; In the case where the corresponding glue coating position is a glue coating defect position, the defect processing type, glue coating deviation and position coordinates of the glue coating defect position in the material corresponding to the glue coating defect position are recorded to obtain glue coating defect information of the material.

2. The method according to claim 1, characterized in that After the gluing of the material is completed, the method further comprises: According to the gluing defect information of the material, for each gluing defect position, defect processing corresponding to the gluing deviation amount is performed at the position coordinates of the gluing defect position by using a device adapted to the defect processing type corresponding to the gluing defect position.

3. The method according to claim 2, characterized in that According to the gluing defect information of the material, for each gluing defect position, a defect processing corresponding to the gluing deviation is performed at the position coordinates where the gluing defect position is located by a device adapted to the defect processing type corresponding to the gluing defect position, including: According to the gluing defect information of the material, determining whether the material has a first gluing defect position whose defect processing type is a glue repair type; In the case that the material has the first glue coating defect position, the glue coating device is controlled at the position coordinates of the first glue coating defect position, and glue is repaired according to the defect deviation amount of the first glue coating defect position.

4. The method according to claim 2 or 3, characterized in that: According to the gluing defect information of the material, for each gluing defect position, a defect processing corresponding to the gluing deviation is performed at the position coordinates where the gluing defect position is located by a device adapted to the defect processing type corresponding to the gluing defect position, including: According to the gluing defect information of the material, determining whether the material has a second gluing defect position whose defect processing type is a gluing scraping type; In the case where the material has the second glue coating defect position, the glue scraping device is controlled at the position coordinates of the second glue coating defect position, and glue scraping is performed according to the defect deviation amount of the second glue coating defect position.

5. The method according to claim 1, characterized in that Determining whether the corresponding glue coating position is a glue coating defect position with a glue coating defect according to the glue coating data includes: Determine the actual glue path cross-section value of the corresponding glue application position according to the glue width value and glue height value of the corresponding glue application position in the glue application data; When the difference between the actual glue path cross-sectional value of the corresponding glue coating position and the reference glue path cross-sectional value of the corresponding glue coating position exceeds a set range, the corresponding glue coating position is determined to be a glue coating defect position with a glue coating defect.

6. The method according to claim 1, characterized in that In the process of the gluing device gluing the material according to the gluing path, the method further includes: According to the glue properties of the glue required in the gluing process corresponding to the acquired or detected ambient temperature and humidity values, the glue output of the glue used in the gluing process is adjusted.

7. The method according to claim 6, characterized in that The glue required in the gluing process includes a first glue and a second glue, the first glue and the second glue have different glue properties, and the glue output of the glue used in the gluing process is adjusted according to the glue properties of the glue required in the gluing process corresponding to the acquired or detected ambient temperature and humidity values, including: According to the glue properties of the first glue and the second glue corresponding to the acquired or detected ambient temperature and humidity values, the glue output ratio of the first glue and the second glue during the gluing process is adjusted.

8. The method according to claim 1, characterized in that In the process of the gluing device gluing the material according to the gluing path, before obtaining the gluing data of the completed gluing position, the method further includes: Get visual data of materials; Determining the material type of the material according to the acquired visual data of the material; When a size deviation value between a material size value in the visual data and a standard size value of a material type to which the material belongs is within a set tolerance range, gluing the material is started.

9. The method according to claim 8, characterized in that The starting of gluing the material comprises: Determine a gluing path according to a size deviation value between the size value of the material and a standard size value of the material type to which the material belongs; According to the gluing path, gluing of the material is started.

10. The method according to claim 7, characterized in that Determining the material type of the material according to the acquired visual data of the material includes: Identifying feature points in the visual data; The material type to which the material belongs is determined according to the number of the feature points and the position coordinates of the feature points.

11. A glue coating processing device, characterized in that: include: An acquisition module is used to acquire the glue coating data of the completed glue coating position during the process of the glue coating equipment coating the material according to the glue coating path; wherein the glue coating data includes the glue width value and the glue height value of the corresponding glue coating position; A determination module, used for determining whether the corresponding glue coating position is a glue coating defect position with glue coating defects according to the glue coating data; The recording module is used to record the defect processing type, glue deviation and position coordinates of the glue defect position corresponding to the glue defect position in the material when the corresponding glue coating position is a glue defect position, so as to obtain the glue defect information of the material.

12. A glue coating processing device, characterized in that: The method comprises a memory and a processor, wherein the memory stores executable instructions, and the instructions are used to control the processor to operate so as to execute the gluing processing method according to any one of claims 1 to 10.

13. A glue coating device, characterized in that: include: A 3D scanner, wherein the 3D scanner is used to collect glue coating data of the completed glue coating position during the process of the glue coating equipment coating the material according to the glue coating path, and output the glue coating data to the glue coating processing device; wherein the glue coating data includes the glue width value and the glue height value of the corresponding glue coating position; A glue coating processing device, wherein the glue coating processing device is the glue coating processing device according to claim 11 or 12.

14. The gluing device according to claim 13, characterized in that: The glue coating equipment also includes: A temperature and humidity detector, which is used to detect the ambient temperature and humidity values ​​and output them to the glue coating processing device; A visual scanner is used to scan the material, obtain the visual data of the material, and output it to the gluing processing device.

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