Spherical solder processing device and processing method

Abstract

The invention discloses a spherical welding flux processing device and method. The spherical welding flux processing device comprises mirror boards, the surfaces of a plurality of mirror boards arranged at different heights serve as rolling channels of spherical welding flux, and the mirror boards are in a sector shape; the method comprises the steps that a motor of a rotating base is controlled to operate, so that a mirror board and a stand column synchronously rotate according to the set speed, a switch valve of a feeding mechanism is controlled to be opened, welding flux in a stock bin falls on the mirror board at the highest position, and the motor of the mirror board is controlled to rotate at the set time point and then reset immediately. And the mirror board is immediately reset after being overturned at the set time point. The device has the advantages that the occupied area is small, the one-time screening qualification rate of spherical welding flux treatment is increased, the production cost of the spherical welding flux is reduced, and the procedure of manually and regularly cleaning unqualified roundness on a mirror board is omitted.

Description

Technical Field

[0001] The invention belongs to the technical field of microelectronic welding materials, and in particular relates to a spherical solder processing device and a processing method. Background Art

[0002] Spherical solder material (spherical solder for short) is a kind of microelectronic solder material, and its diameter is usually 0.075~1mm, such as tin ball solder, copper ball solder or silver ball solder for chips. At present, the main production process of spherical solder material is: alloy configuration - atomization forming (obtaining spherical solder with qualified roundness and solder with unqualified roundness) - solder treatment (screening / selecting the atomized granular solder to obtain solder balls that meet the roundness requirements) - grading by size - weighing and packaging, among which the solder treatment process is one of the key processes affecting product quality.

[0003] In the prior art, document CN204544777U discloses a BGA solder ball roundness screening device, comprising a first base and a second base, an L-shaped support plate is provided near one side of the first base, and a first support frame is vertically provided near the other opposite side, one side plate of the support plate is perpendicular to the first base, and the other side plate is parallel to the first base, and a hopper is provided on the side plate, a discharge pipe is connected to the discharge port of the hopper, and a buffer bottle is connected to the other end of the discharge pipe, a guide groove is provided under the buffer bottle, and a mirror screening plate is hinged on the first bracket. When in use, the solder balls to be screened are placed in the hopper, and the solder balls reach the guide groove through the discharge pipe, and then roll down along the mirror screening plate by gravity. If the product has unqualified roundness, the rolling trajectory will be deflected instead of flowing downward in a straight line. Finally, the product with unqualified roundness will flow into a waste receiving box, while the qualified solder balls will flow into a finished product receiving box. The above scheme still has some problems that need to be improved. First, it occupies a large area. Second, the qualified rate of the finished product after one screening (that is, the qualified rate of the solder balls to be screened after one screening by three mirror screening plates) is low, usually only about 90%. In particular, some products with unqualified roundness (that is, solder balls) are immediately mixed into the products with qualified roundness after being screened. Third, the efficiency is low and the operation is troublesome, and the products with unqualified roundness on the mirror screening plates need to be manually cleaned regularly. Summary of the invention

[0004] At least in order to solve the technical problems mentioned in the background technology, the purpose of the present invention is to provide a spherical solder processing device and a processing method. The spherical solder processing of the present invention refers to the process of obtaining spherical solder with qualified roundness through the processing process, and the product with unqualified roundness refers to non-spherical solder, including but not limited to ellipsoidal solder and incomplete solder.

[0005] The present invention adopts the following technical solution.

[0006] A spherical solder processing device includes a mirror plate, and the surfaces of several mirror plates arranged at different heights are used as rolling channels for spherical solder. The mirror plates are fan-shaped, and there is an angle of 5 to 20 degrees between two adjacent mirror plates at different heights. With such a solution, the space occupied by the spherical solder processing device can be significantly reduced.

[0007] Furthermore, the mirror panel is rotatably connected to the column, and the bottom of the column is connected to the rotating base.

[0008] Furthermore, the column has a cavity, and a plurality of motors are arranged in the cavity. The output end of each motor is fixedly connected to a mirror panel, and all the motors and the motors of the rotating base are connected to the controller.

[0009] Furthermore, the top of the first mirror panel is connected to a corresponding motor, the bottom of the second mirror panel is connected to a corresponding motor, and a strip hole is provided at the bottom of the second mirror panel, which serves as a drop channel for the spherical solder to continue to drop to the top of the next mirror panel.

[0010] Furthermore, at the same height, there are four mirror panels of the same specification, and preferably the gap between the edges of adjacent mirror panels does not exceed 2 mm (provided that the mirror panel flipping requirements are met), and the bottom contours of the four mirror panels together form a full circle or a near full circle.

[0011] Furthermore, waste solder collecting troughs are provided under two of the mirror panels located at the lowest position, and qualified solder collecting troughs are provided under the other two mirror panels located at the lowest position.

[0012] Furthermore, a total of five layers of mirror panels are provided, a feeding mechanism for the spherical solder is provided on the top of the column, and a switch valve of the feeding mechanism is connected to a controller.

[0013] Furthermore, the radius of the first portion of the mirror plate is smaller than the radius of the second portion of the mirror plate. Such a structure can perform solder screening more stably and significantly reduce solder loss.

[0014] In the present invention, a processing method using the above-mentioned spherical solder processing device comprises the following steps: Step 1, loading the atomized solder into a material bin of a feeding mechanism; Step 2, controlling the motor of the rotating base to operate so that the mirror plate and the column rotate synchronously at a set speed; Step 3, controlling the switch valve of the feeding mechanism to open so that the solder in the silo falls onto the mirror plate at the highest point; Step 4, controlling the motor of the mirror plate to reset immediately after the mirror plate rotates at a set time point, so that the mirror plate is reset immediately after being flipped at a set time point; during this process, whenever the mirror plate is located below the discharge port of the feeding mechanism, the solder falls on the mirror plate and is rolled and screened, and then falls to the mirror plate of the next layer for further rolling and screening, and whenever the mirror plate is located directly above the waste solder collection tank and after the mirror plate is flipped, the waste solder on the mirror plate will fall into the waste solder collection tank; Step 5, regularly collecting the spherical solder in the solder collecting tank.

[0015] As a preferred solution, for solder ball solder with a particle size of 0.35-0.76 mm, the set speed in step 2 is controlled to be 30 cycles / minute, and the angle between two adjacent mirror panels at different heights is 8°.

[0016] Beneficial effects: The spherical solder processing device of the present invention has the advantage of small footprint. Compared with the existing spherical solder processing device (i.e., the screening device in the background technology), the footprint of the spherical solder processing device of the present invention can be reduced by about 40%; the present invention significantly improves the one-time screening pass rate of spherical solder processing, and can increase its one-time screening pass rate to more than 99%. There is no need for secondary roundness screening, which reduces the production cost of spherical solder. The key is to effectively solve the technical problem of "products with unqualified roundness (i.e., solder balls) being immediately mixed into products with qualified roundness after being screened"; the scheme of the present invention also has the advantages of high screening processing efficiency and convenient operation, eliminating the process of manually cleaning the unqualified roundness on the mirror panel on a regular basis. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional schematic diagram of the spherical solder processing device in Example 1 (before the mirror plate is turned over); Figure 2 Schematic cross-sectional view of the spherical solder processing device in Example 1; Figure 3 This is a schematic diagram of the disassembled state of the spherical solder processing device in Example 1; Figure 4 This is a three-dimensional schematic diagram of the spherical solder processing device in Example 1 (after the mirror panel is turned over). DETAILED DESCRIPTION

[0018] The technical solution of the present invention is described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example 1

[0019] Combination Figures 1 to 4 As shown, a spherical solder processing device includes a mirror plate 1. The surfaces of several mirror plates 1 arranged at different heights serve as rolling channels for the spherical solder. The mirror plates 1 are fan-shaped, and there is an angle of 8° between two adjacent mirror plates 1 at different heights.

[0020] In this embodiment, the mirror panel 1 has five layers (including the top mirror panel 11, the second mirror panel 12, the third mirror panel 13, the fourth mirror panel 14, and the fifth mirror panel 15). The mirror panel 1 is rotatably connected to the column 2, and the bottom of the column 2 is connected to the rotating base 3. The column 2 has a cavity, and a plurality of motors 4 are arranged in the cavity. The number of motors 4 is the same as the number of mirror panels 1. The output end of each motor 4 is fixedly connected to a mirror panel 1, and all motors 4 and motors of the rotating base 3 are connected to the controller. The top of the first part of the mirror panel (the top mirror panel 11, the third mirror panel 13, and the fifth mirror panel 15) is connected to the corresponding motor 4, and the bottom of the second part of the mirror panel (the second mirror panel 12 and the fourth mirror panel 14) is connected to the corresponding motor 4. The lower part of each mirror panel of the second part of the mirror panel is provided with a strip hole 5, the length of the strip hole 5 is 3 cm less than the arc length of the mirror panel 1 to which it belongs, and the width of the strip hole 5 is 10 cm. The strip hole 5 serves as a material drop channel for the spherical solder to continue to fall to the top of the next mirror panel 1. At the same height, there are four mirror panels 1 of the same specification, and the bottom contours of the four mirror panels 1 together form a full circle or an approximate full circle. A waste solder collection trough 6 is provided under two of the mirror panels 1 located at the lowest position, and a qualified solder collection trough 7 is provided under the other two mirror panels 1 located at the lowest position, that is, there are two waste solder collection troughs 6 and two qualified solder collection troughs 7. A feeding mechanism for spherical solder is provided at the top of the column 2, and a switch valve 10 of the feeding mechanism is connected to a controller, wherein the feeding mechanism is fixedly mounted on a suspension bracket 8.

[0021] A processing method using the spherical solder processing device of this embodiment comprises the following steps: Step 1, loading the atomized solder (the solder at this time includes the spherical qualified solder and the solder with unqualified roundness mixed together) into the material bin 9 of the feeding mechanism; Step 2, control the motor of the rotating base 3 to operate so that the mirror plate 1 and the column 2 rotate synchronously at a set speed; for solder ball solder with a particle size of 0.35-0.76 mm, the set speed is controlled to 30 revolutions / minute; Step 3, control the switch valve 10 of the feeding mechanism to open, so that the solder in the silo 9 falls onto the mirror plate 1 at the highest point; Step 4, control the motor 4 of the mirror plate 1 to rotate at a set time point and then reset immediately, so that the mirror plate 1 is turned over at a set time point and then reset immediately, and the five layers of mirror plates 1 located directly above the waste solder collecting tank 6 are turned over and reset at the same time ( Figure 4 The schematic diagram shows the state where five layers of mirror panels 1 are turned over at the same time); during this process, whenever the mirror panel 1 is located below the discharge port of the feeding mechanism, the solder falls on the mirror panel 1 and is rolled and screened, and then falls to the mirror panel 1 of the next layer for further rolling and screening. Whenever the mirror panel 1 is located directly above the waste solder collecting tank 6 and after the mirror panel 1 is turned over, the waste solder on the mirror panel 1 will fall into the waste solder collecting tank 6; Step 5: regularly collect the spherical solder in the solder collecting tank 7.

[0022] During use, combine Figure 2As shown in the figure (the arrow in the figure indicates the main moving direction of the spherical solder), the solder in the silo 9 (defined as the solder to be processed, which includes the mixed spherical solder with qualified roundness and the solder with unqualified roundness) first falls on the top mirror plate 11 through the discharge port of the feeding mechanism, and part of the solder on the top mirror plate 11 (defined as the first part of solder, including the spherical solder with qualified roundness and a small amount of solder with unqualified roundness) continues to roll along the top mirror plate 11 until it falls on the second mirror plate 12, and the rest of the solder on the top mirror plate 11 (defined as the second part of solder, i.e. the solder with unqualified roundness, as shown in the figure) falls on the second mirror plate 12. The elliptical solder) will stay on the top mirror plate 11, and then, when the top mirror plate 11 rotates to be just above the waste solder collecting tank 6, the non-spherical solder (i.e., the second part of the solder) staying thereon is poured into the waste solder collecting tank 6 by controlling the top mirror plate 11 to flip, and after controlling the top mirror plate 11 to flip and reset, it continues to rotate to below the discharge port of the feeding mechanism, and then the screening is repeated according to the above process; part of the solder (i.e., the third part of the solder) that falls on the second mirror plate 12 continues to roll along the second mirror plate 12 until it falls on the third mirror plate 13, and the second mirror plate 13 is The remaining solder on the panel 12 (i.e., the fourth portion of solder, i.e., the solder with unqualified roundness) will stay on the second mirror panel 12. Subsequently, when the second mirror panel 12 rotates to be directly above the waste solder collecting tank 6, the non-spherical solder (i.e., the fourth portion of solder) staying thereon is poured into the waste solder collecting tank 6 by controlling the second mirror panel 12 to flip, and after controlling the second mirror panel 12 to flip and reset, it continues to rotate to below the discharge port of the feeding mechanism, and then the screening is repeated according to the above process. Similarly, part of the solder (i.e., the fifth portion of solder) that falls on the third mirror panel 13 continues to Roll along the third mirror plate 13 until it falls on the fourth mirror plate 14, and the remaining solder on the third mirror plate 13 (i.e., the sixth part of solder, i.e., the solder with unqualified roundness) will stay on the third mirror plate 13. Then, when the third mirror plate 13 is rotated to just above the waste solder collecting tank 6, the non-spherical solder (i.e., the sixth part of solder) staying thereon is poured into the waste solder collecting tank 6 by controlling the third mirror plate 13 to flip, and after controlling the third mirror plate 13 to flip and reset, it continues to rotate to below the discharge port of the feeding mechanism, and then the screening is repeated according to the above process;According to the above process, part of the solder falling on the fifth mirror plate 15 (i.e., the ninth part of the solder, which is almost all qualified spherical solder) continues to roll along the fifth mirror plate 15 until it falls into the solder collecting groove 7, and the remaining solder on the fifth mirror plate 15 (i.e., the tenth part of the solder, i.e., the solder with unqualified roundness) will stay on the fifth mirror plate 15, and then, when the fifth mirror plate 15 rotates to the top of the waste solder collecting groove 6, the non-spherical solder (i.e., the tenth part of the solder) staying thereon is poured into the waste solder collecting groove 6 by controlling the fifth mirror plate 15 to flip, and after controlling the fifth mirror plate 15 to flip and reset, it continues to rotate to the bottom of the discharge port of the feeding mechanism. ;

[0023] In this embodiment, whenever the top mirror panel 11 deviates from the discharge port of the feeding mechanism after receiving the solder from the feeding mechanism, the solder with unqualified roundness on the top mirror panel 11 can stay stably on the top mirror panel 11 before the top mirror panel 11 flips over, and the small amount of unqualified solder with qualified roundness on the top mirror panel 11 will fall to the next mirror panel for rolling screening, and the solder with unqualified roundness on the top mirror panel 11 will not be squeezed / pushed down by the continuously added solder, and combined with the joint action of the multi-layer mirror panel 1, the technical problem of "the product with unqualified roundness (i.e., the solder with unqualified roundness) is immediately mixed into the product with qualified roundness after being screened once" is effectively solved. The spherical solder processing device of this embodiment has the advantage of small footprint. Compared with the existing spherical solder processing device (i.e., the screening device in the background technology), the footprint of the spherical solder processing device in the present invention can be reduced by about 40%.

[0024] Comparative Example: BGA solder ball roundness screening device in document CN204544777U.

[0025] The BGA solder balls were screened by the devices in Example 1 and the comparative example respectively. When the discharge / feeding rate of the feeding mechanism was controlled to be the same, the one-time screening qualified rate of the spherical solder treatment was counted (after the solder to be treated was screened once by each mirror plate 1, the ratio of the number of spherical solders with qualified roundness in the solder collecting tank 7 divided by the total amount of solder in the solder collecting tank 7 was counted and calculated as the one-time screening qualified rate). The results showed that for the tin ball solder with a particle size / diameter of 0.76 mm obtained after treatment, the one-time screening qualified rate corresponding to the scheme in Example 1 was 99. .95%, and the one-time screening qualified rate obtained by the scheme in the comparative embodiment is 90.86%; for the tin ball solder with a particle size / diameter of 0.5mm obtained after treatment, the one-time screening qualified rate corresponding to the scheme in Example 1 is 99.92%, and the one-time screening qualified rate obtained by the scheme in the comparative embodiment is 90.13%; for the tin ball solder with a particle size / diameter of 0.35mm obtained after treatment, the one-time screening qualified rate corresponding to the scheme in Example 1 is 99.1%, and the one-time screening qualified rate obtained by the scheme in the comparative embodiment is 89.35%. It can be seen that this embodiment significantly improves the one-time screening qualified rate of spherical solder treatment, and can increase its one-time screening qualified rate to more than 99%, without the need for secondary roundness screening, and reduces the production cost of spherical solder. In addition, the scheme of this embodiment also has the advantages of high screening processing efficiency and convenient operation, and eliminates the process of manually cleaning the unqualified roundness on the mirror plate on a regular basis.

[0026] Other embodiments: The number of layers of the mirror panel 1 can be further adaptively adjusted, the angle between two adjacent mirror panels of different heights is selected within the range of 5-20°, and the solder to be processed can be sprinkled with copper balls or silver balls.

Claims

1. A spherical solder processing device, comprising a mirror plate (1), wherein the surfaces of a plurality of mirror plates (1) arranged at different heights serve as rolling channels for the spherical solder, wherein: The mirror panels (1) are fan-shaped, and two adjacent mirror panels (1) located at different heights have an included angle of 5 to 20 degrees.

2. The ball solder processing device according to claim 1, characterized in that: The mirror panel (1) is rotatably connected to the column (2), and the bottom of the column (2) is connected to the rotating base (3).

3. The ball solder processing device according to claim 2, characterized in that: The column (2) has a cavity, and a plurality of motors (4) are arranged in the cavity. The output end of each motor (4) is fixedly connected to a mirror plate (1), and all the motors (4) and the motors of the rotating base (3) are connected to a controller.

4. The ball solder processing device according to claim 3, characterized in that: The top of the first mirror panel is connected to a corresponding motor (4), the bottom of the second mirror panel is connected to a corresponding motor (4), and a strip hole (5) is provided at the bottom of the second mirror panel, the strip hole (5) serving as a material drop channel for the spherical solder to continue to drop to the top of the next mirror panel (1).

5. The ball solder processing device according to any one of claims 2 to 4, characterized in that: At the same height, there are four mirror plates (1) with the same specifications, and the bottom contours of the four mirror plates (1) together form a full circle or a nearly full circle.

6. The ball solder processing device according to claim 5, characterized in that: Waste solder collecting troughs (6) are provided under two of the mirror panels (1) located at the lowest position, and qualified solder collecting troughs (7) are provided under the other two mirror panels (1) located at the lowest position.

7. The ball solder processing device according to claim 6, characterized in that: A total of five layers of mirror panels (1) are provided, a feeding mechanism for spherical solder is provided on the top of the column (2), and a switch valve (10) of the feeding mechanism is connected to a controller.

8. A processing method using the ball solder processing device according to any one of claims 5 to 7, characterized in that the steps include: Step 1, loading the atomized solder into a material bin (9) of a feeding mechanism; Step 2, controlling the motor of the rotating base (3) to operate so that the mirror plate (1) and the column (2) rotate synchronously at a set speed; Step 3, controlling the switch valve (10) of the feeding mechanism to open, so that the solder in the silo (9) falls onto the mirror plate (1) at the highest point; Step 4, controlling the motor (4) of the mirror plate (1) to rotate at a set time point and then immediately reset, so that the mirror plate (1) is immediately reset after being turned over at the set time point; during this process, whenever the mirror plate (1) is located below the discharge port of the feeding mechanism, the solder falls on the mirror plate (1) and is rolled and screened, and then falls to the mirror plate (1) of the next layer for further rolling and screening, and whenever the mirror plate (1) is located directly above the waste solder collection tank (6) and after the mirror plate (1) is turned over, the waste solder on the mirror plate (1) will fall into the waste solder collection tank (6); Step 5, regularly collecting the spherical solder in the solder collecting tank (7).

9. The processing method according to claim 8, characterized in that: For solder ball solder with a particle size of 0.35-0.76 mm, the set speed in step 2 is controlled to be 30 revolutions / minute, and the angle between two adjacent mirror panels (1) at different heights is 8°.

10. The processing method according to claim 8, characterized in that: The radius of the first partial mirror plate is smaller than the radius of the second partial mirror plate.

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