A quality inspection device for a packaged chip

Abstract

The present invention provides a quality detection device for packaged chips, belonging to the technical field of chip detection. It includes a workbench and an equipment box. Above the workbench, there is a detection tooling for placing multiple groups of packaged chips. On the top of the workbench, there is a transportation track for transporting the detection tooling. Corresponding to the detection tooling on the top of the workbench, there is a load detection component. The load detection component includes a pressure plate and a hydraulic cylinder. Above the workbench, there is a hydraulic cylinder and a pressure plate. On one side of the load detection component, there is a load detection component. The load detection component includes a power-on plate. A second through groove is opened on the top of the workbench, and a power-on plate is slidably arranged in the second through groove. On the side of the load detection component away from the load detection component, there is a sorting component. By using the load detection component to detect internal cracks, bubbles and solder joints of the packaged chips, and using the load detection component to detect the internal circuit of the chips and perform load detection, the comprehensiveness and accuracy of the detection are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip detection, and more specifically, particularly relates to a quality detection device for packaged chips. Background Art

[0002] In the production of chips, chip packaging is required. It not only provides physical protection for the chips, protecting them from physical damage and chemical erosion in the external environment, but also enables the electrical connection between the chips and external circuits to ensure the stable transmission of signals. At the same time, it assists the chips in heat dissipation to ensure that the chips operate within the normal working temperature range.

[0003] During the packaging process, due to the influence of various factors such as process level, material properties, and production environment, quality problems may occur. For example, poor pin soldering may lead to unstable electrical connection. As disclosed in the Chinese invention patent with the patent number 202411132674.7, a pin detection device for packaged chips is provided. When using this device, the packaged chips are transported to the detection frame to detect the pins. When abnormal pins of the packaged chips are detected, the abnormal packaged chips are sorted through the air blowing pipe and air blowing holes. However, by analyzing the above patent and combining with the existing technology, it is found that the existing detection devices can only detect some surface defects of the chips, and it is difficult to effectively detect potential problems inside the chips, making it difficult to ensure the accuracy of the detection results. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a quality detection device for packaged chips to solve the technical problems in the prior art that traditional detection devices can only detect some surface defects of the chips, and it is difficult to effectively detect potential problems inside the chips, making it difficult to ensure the accuracy of the detection results.

[0005] The purpose and efficacy of a quality detection device for packaged chips of the present invention are achieved by the following specific technical means:

[0006] A quality detection device for packaged chips includes a workbench and an equipment box arranged at the bottom of the workbench. Above the workbench, there is a detection tooling for placing multiple groups of packaged chips. On the top of the workbench, there is a transportation track for transporting the detection tooling. On the top of the workbench, a load detection component is also correspondingly arranged for the detection tooling. The load detection component includes a pressure plate and a hydraulic cylinder. Above the workbench, there are the hydraulic cylinder and the pressure plate. On one side of the load detection component, there is a load detection component. The load detection component includes a power-on plate. A second through groove is opened on the top of the workbench, and the power-on plate is slidably arranged in the second through groove. On the side of the load detection component away from the load detection component, there is a sorting component.

[0007] In a preferred embodiment, a plurality of placement grooves are formed at the top of the detection tooling. The plurality of placement grooves are evenly distributed at the top of the detection tooling. Detection bases for placing the encapsulated chips are arranged in the plurality of placement grooves. A plurality of power supply holes corresponding to the pins of the encapsulated chips are arranged at the top of the detection base. Power supply interfaces corresponding to the plurality of power supply holes are arranged at the bottom of the detection base. An installation groove is formed at one side of the detection base. An RFID tag is arranged in the installation groove. A detachable side plate is arranged at the opening at one side of the installation groove.

[0008] In a preferred embodiment, a first mounting seat is arranged at the top of the workbench. A first mounting hole is arranged at the top of the first mounting seat. The hydraulic cylinder is arranged at the top of the first mounting hole. Two first guide columns are arranged at the top of the pressure plate. Two first guide holes corresponding to the two first guide columns are formed at the bottom of the first mounting seat. The two first guide columns are respectively slidably arranged in the two first guide holes. The bottom end of the hydraulic cylinder is connected to a connecting seat through a hydraulic rod. A bearing plate is arranged at the bottom of the connecting seat. Two second guide columns are also arranged at the top of the pressure plate. Two second guide holes corresponding to the two second guide columns are formed at the bottom of the bearing plate. The two second guide columns are respectively slidably arranged in the two second guide holes. A pressure sensor is arranged between the bearing plate and the pressure plate.

[0009] In a preferred embodiment, the load-bearing detection assembly further includes a plurality of pressing contact blocks. A layout plate is arranged at the top of the detection tooling. A plurality of layout holes corresponding to the plurality of detection bases are formed at the top of the layout plate. A plurality of the pressing contact blocks corresponding to the plurality of layout holes are arranged at the bottom of the pressure plate. A first mounting plate is connected to one side of the first mounting seat. An installation frame is arranged on the side of the first mounting plate away from the pressure plate. A plurality of installation clips are arranged on one side of the installation frame. A plurality of X-ray detectors are respectively installed in the plurality of installation clips through connecting blocks. A defect detection module is also arranged on one side of the first mounting plate. The plurality of X-ray detectors are all connected to the defect detection module through signal lines. A plurality of first RFID writers corresponding to the plurality of X-ray detectors are arranged on the other side of the first mounting plate.

[0010] In a preferred embodiment, a first through groove is formed in the top of the workbench corresponding to the load detection component. A second mounting seat is arranged at the bottom of the first through groove. A second mounting hole is formed in the bottom of the second mounting seat. A first linear driving device is arranged at the bottom of the second mounting hole. A receiving plate is connected to the push rod of the first linear driving device. An anti-slip layer is arranged on the top of the receiving plate. A groove is formed on one side of the first through groove. A first photoelectric sensor is arranged in the groove corresponding to the detection tooling. Two sets of blocking through grooves are also formed on one side of the first through groove. A first connecting rod is arranged on one side of the second mounting seat. A blocking fork is arranged on one side of the first connecting rod. The top of the blocking fork is slidably arranged in the two sets of blocking through grooves.

[0011] In a preferred embodiment, a third mounting seat is arranged at the bottom of the second through groove. A third mounting hole is formed in the bottom of the third mounting seat. A second linear driving device is arranged at the bottom of the third mounting hole. The push rod of the second linear driving device passes through the third mounting hole and is connected to the power-on plate. A plurality of through holes are formed in the top of the power-on plate corresponding to the plurality of power supply interfaces. Power supply pins are arranged in the plurality of through holes. The power supply pins can be inserted into the power supply interfaces. A groove is formed on one side of the second through groove. A second photoelectric sensor is arranged in the groove. Positioning grooves are formed on both sides of the second through groove. First electric telescopic rods are arranged on both sides of the third mounting seat. A positioning jaw is connected to one end of the first electric telescopic rod. One side of the positioning jaw is slidably arranged in the positioning groove.

[0012] In a preferred embodiment, a closed box is arranged on the top of the second through groove. An opening is formed in the bottom of the closed box corresponding to the detection tooling. Two sets of limiting plates are arranged at the top of the opening. First sliding rails are arranged on both sides of the opening. First electric sliders are slidably arranged on the two sets of first sliding rails. The bottom end of the gantry is connected to the two first electric sliders. A second sliding rail is arranged on the gantry. A second electric slider is slidably arranged on the second sliding rail. A thermal imaging detection module is arranged at the bottom of the second electric slider. A second RFID writer is connected to one side of the second electric slider through two second connecting rods.

[0013] In a preferred embodiment, the sorting component includes an RFID reader. A fourth mounting seat is arranged on one side of the load detection component. A three-axis moving device is arranged on the top of the fourth mounting seat. A second mounting plate is arranged on the three-axis moving device. The RFID reader is arranged at the bottom of the second mounting plate. A mounting jaw is arranged on one side of the second mounting plate. A vacuum generator is arranged on the mounting jaw. A mounting bracket is arranged at the bottom of the mounting jaw. A suction nozzle is arranged on the mounting bracket. The bottom end of the vacuum generator is connected to the suction nozzle through an air pipe. A recycling conveyor belt is arranged on one side of the workbench.

[0014] In a preferred embodiment, the sorting component includes an infrared detector. A fourth mounting seat is provided on one side of the load detection component. A three-axis moving device is provided on the top of the fourth mounting seat. A third slide rail is provided on one side of the fourth mounting seat. A third electric slider is provided on the third slide rail. An elevation frame is provided on the top of the third electric slider. A fifth mounting seat is provided on the top of the elevation frame. The infrared detector is provided on the fifth mounting seat. Two groups of second electric telescopic rods are provided in each of the plurality of placement grooves. Limiting connecting plates are provided on both sides of the detection base. The tops of the two groups of second electric telescopic rods are respectively connected to the two limiting connecting plates. A second mounting plate is provided on the three-axis moving device. An installation jaw and an installation bracket are provided on one side of the second mounting plate. A vacuum generator is provided on the installation jaw. A suction nozzle is provided on the installation bracket. The bottom end of the vacuum generator is connected to the suction nozzle through an air pipe. A recycling conveyor belt is provided on the other side of the fourth mounting seat.

[0015] A detection method for a quality detection device of a packaged chip includes the following steps:

[0016] Step 1: Place the packaged chip to be detected correspondingly on the detection base in the placement groove on the top of the detection tooling, so that the pins of the packaged chip are inserted into the power supply holes on the top of the detection base;

[0017] Step 2: Start the transportation track to convey the detection tooling with the packaged chip to the position of the load detection component. When the first photoelectric sensor detects the detection tooling, start the first linear driving device to push the receiving plate and the blocking fork to rise. The blocking fork first intercepts the detection tooling on the transportation track through the blocking through groove, and then the receiving plate rises to lift the detection tooling by using the anti-slip layer on the top; start the hydraulic cylinder to push the pressure plate to press down. Multiple pressure application contact blocks at the bottom of the pressure plate respectively contact and apply a set pressure to multiple packaged chips. During the pressure application process, the pressure sensor between the bearing plate and the pressure plate monitors the pressure value in real time;

[0018] Step 3: After the pressure application is completed, the load detection component resets. The hydraulic cylinder moves in the reverse direction to drive the pressure plate to rise and reset. At the same time, the first linear driving device also drives the receiving plate and the blocking fork to descend, and the detection tooling is placed back on the transportation track again. The detection tooling continues to move forward along the transportation track and passes through multiple X-ray detectors on the mounting frame on one side of the first mounting plate. The X-ray detectors detect the packaged chips after load detection to check whether there are cracks, bubble defects and solder joint abnormalities. The information detected by the X-ray detectors is transmitted to the defect detection module through a signal line. After the defect detection module analyzes and processes it, the defect information is written into the RFID tag in the detection base below the corresponding packaged chip through the first RFID writer on the other side of the first mounting plate;

[0019] Step 4: When the detection tooling reaches the load detection component, the second photoelectric sensor detects the detection tooling, starts the second linear drive device to push the power-on plate upward to lift the detection tooling, and at the same time starts the first electric telescopic rods on both sides to drive the positioning jaws to position the detection tooling, ensuring that the power supply pins on the top of the power-on plate penetrate into the power supply interfaces at the bottom of the detection base. The power-on plate continues to rise, lifts the detection tooling to the opening at the bottom of the closed box, enables the detection tooling to enter the closed box, powers on the encapsulated chip to generate heat, and then uses the thermal imaging detection module to detect the circuit inside the encapsulated chip. At the same time, gradually increase the power of the encapsulated chip for load detection. The second RFID writer writes the detected defect information into the RFID tag under the corresponding encapsulated chip. After the detection is completed, the power-on plate descends and resets, and the detection tooling is placed back on the transport track;

[0020] Step 5: When the detection tooling reaches the sorting component position, the three-axis moving device drives the second mounting plate to move, aligning the RFID reader at the bottom with the RFID tag on the detection tooling. The RFID reader reads the information in the RFID tag to determine whether there are defects in the encapsulated chip. If a defective encapsulated chip is detected, the three-axis moving device continues to act to drive the mounting jaws to move above the corresponding encapsulated chip. The vacuum generator on the mounting jaws is started, and the suction nozzle on the mounting bracket generates negative pressure through the air pipe to suck the defective encapsulated chip, and then transports it to the recycling conveyor belt on one side of the workbench to complete the sorting of the encapsulated chips.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. Through the setting of the bearing detection component, the hydraulic cylinder is used to push the pressure plate, and the pressure application contact block is used to apply a set pressure to the encapsulated chip. At the same time, the pressure sensor monitors the pressure value in real time, simulating the force-bearing situation of the chip in actual use to detect its structural stability. Subsequently, the X-ray detector is used to scan the chip, which can deeply detect potential problems such as cracks, bubble defects, and solder joint abnormalities inside the chip. During this process, the X-ray detector and the defect detection module work together. After the detection information is transmitted and analyzed, the defect information is accurately recorded into the RFID tag of the corresponding chip through the first RFID writer, realizing the positioning and recording of the internal quality problems of the chip, and improving the comprehensiveness and accuracy of the detection.

[0023] 2. By setting up the load detection component, the encapsulated chip is powered by connecting the power supply pin to the power supply interface. After the encapsulated chip is powered on and generates heat, the internal circuit of the chip is detected by the thermal imaging detection module to check for abnormal heating areas. At the same time, the chip power is gradually increased for load detection to simulate the operating conditions of the chip in an actual complex working scenario, which can further expose potential problems such as decreased heat dissipation performance and poor stability under high load conditions of the chip, improving the detection ability for the electrical and thermal performance problems of the encapsulated chip and ensuring the reliability of the chip in actual applications.

[0024] 3. By setting up the first photoelectric sensor and the second photoelectric sensor, it can be detected that the detection tooling for placing the chip to be detected passes through the bearing detection component and the load detection component in sequence on the transportation track. When the detection tooling reaches the bearing detection component and the load detection component respectively, the first photoelectric sensor and the second photoelectric sensor trigger the corresponding linear drive device and the electric telescopic rod to complete operations such as intercepting, lifting, and positioning of the detection tooling, without excessive manual intervention. This automated detection method improves the detection efficiency, ensures the consistency of the detection results, and can meet the detection requirements of large-scale chip production.

[0025] 4. By setting up the first RFID writer and the second RFID writer, the defect information found during the detection process is written into the RFID tag. Finally, the sorting component reads the information in the RFID tag through the RFID reader to determine whether there are defects in the chip and automatically sorts the defective chips. This detection data recording and traceability mechanism based on RFID technology can ensure that the detection results of each chip are traceable, facilitating subsequent quality analysis and problem troubleshooting, and improving the transparency of production management. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is the schematic structural diagram after assembly of Embodiment 1 of the present invention;

[0027] Figure 2 is the schematic structural diagram after unfolding of Embodiment 1 of the present invention;

[0028] Figure 3 is the schematic structural diagram after assembly of the detection tooling and the layout board in the present invention;

[0029] Figure 4 is the schematic structural diagram after disassembly of the detection tooling and the layout board in the present invention;

[0030] Figure 5 is the schematic structural diagram after disassembly of the detection base and the side plate in the present invention;

[0031] Figure 6 is the schematic structural diagram after assembly of the bearing detection component in the present invention;

[0032] Figure 7 is Figure 6 The structural schematic diagram after splitting;

[0033] Figure 8 is the structural schematic diagram of the pressure - contact block in the present invention;

[0034] Figure 9 is the structural schematic diagram after splitting the second mounting seat and the receiving plate in the present invention;

[0035] Figure 10 is the structural schematic diagram after assembling the load - detection component in the present invention;

[0036] Figure 11 is Figure 10 The structural schematic diagram after splitting;

[0037] Figure 12 is the structural schematic diagram after assembling the sorting component in the present invention;

[0038] Figure 13 is Figure 12 The structural schematic diagram after splitting;

[0039] Figure 14 is the structural schematic diagram after assembling the sorting component in the second embodiment of the present invention;

[0040] Figure 15 is the structural schematic diagram after splitting the sorting component in the second embodiment of the present invention;

[0041] Figure 16 is the step - flow chart of the detection method of the quality - detection device for a packaged chip in the present invention.

[0042] In the figure, the corresponding relationship between the component names and the drawing numbers is:

[0043] 101, workbench; 102, equipment box; 103, packaged chip; 104, transport track; 105, second through slot; 106, first through slot; 107, recycling conveyor belt; 201, pressure plate; 202, hydraulic cylinder; 203, first mounting seat; 204, first mounting hole; 205, first guide column; 206, first guide hole; 207, connecting seat; 208, bearing plate; 209, second guide column; 210, second guide hole; 211, pressure sensor; 212, pressure contact block; 213, first mounting plate; 214, mounting frame; 215, pressure sensor; 216, pressure contact block; 217, pressure sensor; 218, pressure contact block; 219, pressure sensor; 220, pressure contact block; 221, pressure sensor; 222, pressure contact block; 223, pressure sensor; 224, pressure contact block; 225, pressure sensor; 226, pressure contact block; 227, pressure sensor; 228, pressure sensor; 229, pressure contact block; 230, pressure sensor; 231, pressure sensor; 232, pressure contact block; 233, pressure sensor; 234, pressure contact block; 235, pressure sensor; 236, pressure sensor; 237, pressure sensor; 238, pressure sensor; 239, pressure sensor; 240, pressure sensor; 241, pressure sensor; 242, pressure sensor; 243, pressure sensor; 244, pressure sensor; 245, pressure sensor; 246, pressure sensor; 247, pressure sensor; 248, pressure sensor; 249, pressure sensor; 250, pressure sensor; 251, pressure sensor; 252, pressure sensor; 253, pressure sensor; 254, pressure sensor; 5. Mounting card; 216. X-ray detector; 217. Defect detection module; 218. Signal line; 219. First RFID writer; 220. Second mounting seat; 221. Second mounting hole; 222. First linear drive device; 223. Adapter plate; 224. Anti-skid layer; 225. First photoelectric sensor; 226. Blocking groove; 227. First connecting rod; 228. Blocking fork; 229. Connecting block; 301. Power plate; 302. Third mounting seat; 303. Third mounting hole; 304. Second linear drive device; 305. Power supply pin ; 307, second photoelectric sensor; 308, positioning slot; 309, first electric telescopic rod; 310, positioning claw; 311, closed box; 312, opening; 313, limit plate; 314, first slide rail; 315, first electric slider; 316, gantry; 317, second slide rail; 318, second electric slider; 319, thermal imaging detection module; 320, second connecting rod; 321, second RFID writer; 401, detection tooling; 402, placement slot; 403, detection base; 404, power supply hole; 405, power supply interface; 40 6. Mounting slot; 407. RFID tag; 408. Side panel; 409. Arrangement plate; 410. Arrangement hole; 411. Second electric telescopic rod; 412. Limiting connecting plate; 501. RFID reader; 502. Fourth mounting seat; 503. Three-axis moving device; 504. Second mounting plate; 505. Mounting jaws; 506. Vacuum generator; 507. Mounting bracket; 508. Suction nozzle; 509. Air pipe; 510. Third slide rail; 511. Third electric slide block; 512. Heightening frame; 513. Fifth mounting seat; 514. Infrared detector. DETAILED DESCRIPTION

[0044] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the scope of protection of the present invention.

[0045] Embodiment 1: As shown in the attached Figures 1 to 13 as well as Figure 16 As shown:

[0046] The present invention provides a quality detection device for packaged chips, including a workbench 101 and an equipment box 102 arranged at the bottom of the workbench 101. The equipment box 102 is connected to an external circuit for power supply. Above the workbench 101, there is a detection tooling 401 for placing multiple groups of packaged chips 103. Through the setting of the detection tooling 401, multiple packaged chips 103 can be centrally detected at one time, improving the detection efficiency. On the top of the workbench 101, there is a transportation track 104 for transporting the detection tooling 401, enabling the detection tooling 401 to reach the positions of each detection component in sequence and realizing an automated detection process. On the top of the workbench 101, a load-bearing detection component is also correspondingly arranged for the detection tooling 401. The load-bearing detection component includes a pressure plate 201 and a hydraulic cylinder 202. Above the workbench 101, there is a hydraulic cylinder 202 and a pressure plate 201. On one side of the load-bearing detection component, there is a load detection component, and the load detection component includes a power-on plate 301. On the top of the workbench 101, a second through groove 105 is opened, and the power-on plate 301 can slide in the second through groove 105. On the side of the load detection component away from the load-bearing detection component, there is a sorting component.

[0047] Please refer to Figure 3 , Figure 4 and Figure 5 As shown, multiple placement grooves 402 are opened on the top of the detection tooling 401. These placement grooves 402 are evenly distributed on the top of the detection tooling 401. In each of the multiple placement grooves 402, there is a detection base 403 for placing the packaged chip 103. On the top of the detection base 403, multiple power supply holes 404 are correspondingly arranged for the pins of the packaged chip 103. The power supply holes 404 can be adapted to the pins of the packaged chip 103 to ensure the stability of electrical connection. At the bottom of the detection base 403, power supply interfaces 405 are correspondingly arranged for the multiple power supply holes 404, which are used to supply power to the packaged chip 103 subsequently. On one side of the detection base 403, there is an installation groove 406, and an RFID tag 407 is arranged in the installation groove 406. The RFID tag 407 can record various detection information of the packaged chip 103, facilitating subsequent sorting. At the opening on one side of the installation groove 406, there is a detachable side plate 408, which is convenient for replacing or maintaining the RFID tag 407 when needed.

[0048] Please refer to Figure 6 and Figure 7As shown, a first mounting seat 203 is provided on the top of the workbench 101. A first mounting hole 204 is formed in the top of the first mounting seat 203. A hydraulic cylinder 202 is installed at the top of the first mounting hole 204. Two groups of first guide posts 205 are provided on the top of the pressure plate 201. Two groups of first guide holes 206 corresponding to the two groups of first guide posts 205 are formed in the bottom of the first mounting seat 203. The two groups of first guide posts 205 are respectively slidably inserted into the two groups of first guide holes 206, so that the pressure plate 201 can be kept stable when moving up and down for load detection, avoiding deviation. The bottom end of the hydraulic cylinder 202 is connected with a connecting seat 207 through a hydraulic rod. A bearing plate 208 is provided at the bottom of the connecting seat 207. Two groups of second guide posts 209 are also provided on the top of the pressure plate 201. Two groups of second guide holes 210 corresponding to the two groups of second guide posts 209 are formed in the bottom of the bearing plate 208. The two groups of second guide posts 209 are respectively slidably inserted into the two groups of second guide holes 210. A pressure sensor 211 is provided between the bearing plate 208 and the pressure plate 201. The pressure sensor 211 can be selected as the JLBU-1 model. The pressure value applied to the packaged chip 103 can be monitored in real time through the pressure sensor 211 to ensure that the pressing process meets the detection requirements.

[0049] Please refer to Figure 7 and Figure 8As shown, the load-bearing detection component further includes multiple groups of pressing contact blocks 212. At the top of the detection tooling 401, there is an arrangement board 409. Multiple groups of arrangement holes 410 are provided at the top of the arrangement board 409 corresponding to multiple groups of detection bases 403. Multiple groups of pressing contact blocks 212 are provided at the bottom of the pressure plate 201 corresponding to the multiple groups of arrangement holes 410. During detection, pressure can be applied to multiple groups of packaged chips 103 through the multiple groups of pressing contact blocks 212 respectively, which can simulate the stress conditions of the chips during actual use, and then detect their structural stability; One side of the first mounting seat 203 is connected to a first mounting plate 213. An installation frame 214 is provided on the side of the first mounting plate 213 away from the pressure plate 201. Multiple groups of installation clips 215 are provided on one side of the installation frame 214. Multiple groups of X-ray detectors 216 are respectively installed in the multiple groups of installation clips 215 through connection blocks 229. The X-ray detector 216 can be of the XDM03-USBX model. After the pressure detection, the multiple groups of X-ray detectors 216 can be used to detect the packaged chips 103 to check for potential problems such as cracks, bubble defects, and abnormal solder joints inside, improving the comprehensiveness and accuracy of the detection; A defect detection module 217 is also provided on one side of the first mounting plate 213. The defect detection module 217 can be of the OHR-PR10 model. Multiple groups of X-ray detectors 216 are all connected to the defect detection module 217 through signal lines 218. The X-ray detectors 216 transmit the detection information to the defect detection module 217 for analysis and processing; Multiple groups of first RFID writers 219 are provided on the other side of the first mounting plate 213 corresponding to the multiple groups of X-ray detectors 216. The defective information can be input into the RFID tag 407 below the corresponding packaged chip 103 through the first RFID writers 219, realizing the positioning and recording of the internal quality problems of the chips.

[0050] Please refer to as Figure 9As shown in the figure, a first through groove 106 is provided at the top of the workbench 101 corresponding to the bearing detection component. A second mounting seat 220 is provided at the bottom of the first through groove 106. A second mounting hole 221 is provided at the bottom of the second mounting seat 220. A first linear driving device 222 is provided at the bottom of the second mounting hole 221. A receiving plate 223 is connected to the pushing rod of the first linear driving device 222. An anti-slip layer 224 is provided on the top of the receiving plate 223. The anti-slip layer 224 can prevent the detection tooling 401 from sliding on the receiving plate 223 and ensure the stability of the detection process. A groove is provided on one side of the first through groove 106. A first photoelectric sensor 225 is provided in the groove corresponding to the detection tooling 401. When the detection tooling 401 reaches here, the first photoelectric sensor 225 can detect it in time. Two groups of blocking through grooves 226 are also provided on one side of the first through groove 106. A first connecting rod 227 is provided on one side of the second mounting seat 220. A blocking fork 228 is provided on one side of the first connecting rod 227. The top of the blocking fork 228 is slidably inserted into the two groups of blocking through grooves 226. When the first linear driving device 222 is started, the receiving plate 223 and the blocking fork 228 can be pushed to rise. The blocking fork 228 first intercepts the detection tooling 401 on the transportation track 104 through the blocking through grooves 226, and then the receiving plate 223 rises to lift the detection tooling 401 for carrying detection.

[0051] Please refer to as Figure 10 And Figure 11 As shown in the figure, a third mounting seat 302 is provided at the bottom of the second through groove 105. A third mounting hole 303 is provided at the bottom of the third mounting seat 302. A second linear driving device 304 is provided at the bottom of the third mounting hole 303. The pushing rod of the second linear driving device 304 passes through the third mounting hole 303 and is connected to a power-on plate 301. A plurality of through holes are provided on the top of the power-on plate 301 corresponding to a plurality of power supply interfaces 405. A plurality of power supply needles 305 are provided in the plurality of through holes. When the detection tooling 401 reaches the position of the load detection component, the second linear driving device 304 is started to push the power-on plate 301 to rise, so that the power supply needles 305 can be inserted into the power supply interfaces 405 to supply power to the packaged chip 103 on the detection base 403. A groove is provided on one side of the second through groove 105. A second photoelectric sensor 307 is provided in the groove for detecting whether the detection tooling 401 reaches the position of the load detection component. Both the first photoelectric sensor 225 and the second photoelectric sensor 307 can be of the STAB-40N model. Positioning grooves 308 are provided on both sides of the second through groove 105. First electric telescopic rods 309 are provided on both sides of the third mounting seat 302. One end of the first electric telescopic rod 309 is connected to a positioning jaw 310. One side of the positioning jaw 310 is slidably arranged in the positioning groove 308. When the power-on plate 301 rises, the first electric telescopic rods 309 on both sides are started to drive the positioning jaws 310 to position the detection tooling 401 to ensure the accurate connection between the power supply needles 305 and the power supply interfaces 405.

[0052] Please refer to as Figure 11 shown, a closed box 311 is provided at the top of the second through groove 105. An opening 312 is provided at the bottom of the closed box 311 corresponding to the detection tooling 401. Two groups of limit plates 313 are provided at the top of the opening 312 for limiting the position of the detection tooling 401. First slide rails 314 are provided on both sides of the opening 312. First electric sliders 315 are slidably provided on the two groups of first slide rails 314. The bottom end of the gantry 316 is connected to the two groups of first electric sliders 315. A second slide rail 317 is provided on the gantry 316. A second electric slider 318 is slidably provided on the second slide rail 317. A thermal imaging detection module 319 is provided at the bottom of the second electric slider 318. The thermal imaging detection module 319 can be of the X384D model. After the packaged chip 103 is powered on to generate heat, the thermal imaging detection module 319 can detect its internal circuit to detect whether there is an abnormally heated area. At the same time, during the detection process, the chip power is gradually increased for load detection to simulate the operating conditions of the chip in an actual complex working scenario, which can further expose problems such as a decrease in heat dissipation performance and a deterioration in stability that may occur under high load conditions of the chip, improving the detection ability of electrical and thermal performance problems of the packaged chip and ensuring the reliability of the chip in actual applications. One side of the second electric slider 318 is connected to a second RFID writer 321 through two groups of second connecting rods 320. The first RFID writer 219 and the second RFID writer 321 can both be of the FR1000 model. The defect information detected by the load detection component is input into the RFID tag 407 below the corresponding packaged chip 103 through the second RFID writer 321, which is convenient for subsequent sorting.

[0053] Please refer to as Figure 12 and Figure 13As shown, the sorting component includes an RFID reader 501, and the RFID reader 501 can be of model D1601. On one side of the load detection component, there is a fourth mounting seat 502. On the top of the fourth mounting seat 502, there is a three-axis moving device 503. On the three-axis moving device 503, there is a second mounting plate 504. At the bottom of the second mounting plate 504, there is an RFID reader 501. After the detection tool 401 completes the previous detection process and reaches the position of the sorting component, the three-axis moving device 503 drives the second mounting plate 504 to move, so that the RFID reader 501 can align with the RFID tag 407 on the detection tool 401 to read information. On one side of the second mounting plate 504, there is a mounting jaw 505. On the mounting jaw 505, there is a vacuum generator 506, and the vacuum generator 506 can be of model ZH13BL-08-10. At the bottom of the mounting jaw 505, there is a mounting bracket 507. On the mounting bracket 507, there is a suction nozzle 508. The bottom end of the vacuum generator 506 is connected to the suction nozzle 508 through an air pipe 509. Based on the defective information read by the RFID reader 501, the three-axis moving device 503 drives the mounting jaw 505 to move above the corresponding packaged chip 103. The vacuum generator 506 is started, and the suction nozzle 508 generates negative pressure through the air pipe 509 to suck the defective packaged chip 103, and then transports it to the recycling conveyor belt 107 arranged on one side of the workbench 101, completing the sorting work of the packaged chip 103.

[0054] Please refer to as Figure 14 and Figure 15 As shown, the sorting component includes an infrared detector 514. On one side of the load detection component, there is a fourth mounting seat 502. On the top of the fourth mounting seat 502, there is a three-axis moving device 503. On one side of the fourth mounting seat 502, there is a third slide rail 510. On the third slide rail 510, there is a third electric slider 511. On the top of the third electric slider 511, there is a heightening frame 512. On the top of the heightening frame 512, there is a fifth mounting seat 513. On the fifth mounting seat 513, there is an infrared detector 514, and the infrared detector 514 can be of model SWIR FPA. In each of the multiple placement grooves 402, there are two second electric telescopic rods 411. On both sides of the detection base 403, there are limit connecting plates 412. The top ends of the two second electric telescopic rods 411 are respectively connected to the two limit connecting plates 412. On the three-axis moving device 503, there is a second mounting plate 504. On one side of the second mounting plate 504, there is a mounting jaw 505 and a mounting bracket 507. On the mounting jaw 505, there is a vacuum generator 506. On the mounting bracket 507, there is a suction nozzle 508. The bottom end of the vacuum generator 506 is connected to the suction nozzle 508 through an air pipe 509. On the other side of the fourth mounting seat 502, there is a recycling conveyor belt 107.

[0055] A detection method for a quality detection device of a packaged chip, comprising the following steps:

[0056] Step 1: Place the packaged chip 103 to be detected on the detection base 403 in the placement groove 402 at the top of the detection tooling 401, so that the pins of the packaged chip 103 are inserted into the power supply holes 404 at the top of the detection base 403;

[0057] Step 2: Start the transportation track 104 to transport the detection tooling 401 with the packaged chip 103 to the position of the bearing detection component. When the first photoelectric sensor 225 detects the detection tooling 401, start the first linear driving device 222 to push the receiving plate 223 and the blocking fork 228 to rise. The blocking fork 228 first intercepts the detection tooling 401 on the transportation track 104 through the blocking through groove 226, and then the receiving plate 223 rises to lift the detection tooling 401 by using the anti-slip layer 224 at the top; Start the hydraulic cylinder 202 to push the pressure plate 201 to press down. Multiple pressure application contact blocks 212 at the bottom of the pressure plate 201 respectively contact and apply a set pressure to multiple packaged chips 103. During the pressure application process, the pressure sensor 211 between the bearing plate 208 and the pressure plate 201 monitors the pressure value in real time;

[0058] Step 3: After the pressure application is completed, the bearing detection component resets. The hydraulic cylinder 202 acts in the reverse direction to drive the pressure plate 201 to rise and reset. At the same time, the first linear driving device 222 also drives the receiving plate 223 and the blocking fork 228 to descend, and the detection tooling 401 is placed back on the transportation track 104. The detection tooling 401 continues to move forward along the transportation track 104 and passes through multiple X-ray detectors 216 on the mounting bracket 214 on one side of the first mounting plate 213. The X-ray detectors 216 detect the packaged chips 103 after bearing detection to check for cracks, bubble defects, and solder joint abnormalities. The information detected by the X-ray detectors 216 is transmitted to the defect detection module 217 through the signal line 218. After the defect detection module 217 analyzes and processes it, the defect information is written into the RFID tag 407 in the detection base 403 below the corresponding packaged chip 103 by the first RFID writer 219 on the other side of the first mounting plate 213;

[0059] Step 4: When the detection tooling 401 reaches the load detection component, the second photoelectric sensor 307 detects the detection tooling 401, starts the second linear drive device 304 to push the energized plate 301 upward to lift the detection tooling 401, and at the same time starts the first electric telescopic rods 309 on both sides to drive the positioning jaws 310 to position the detection tooling 401, ensuring that the power supply pins 305 on the top of the energized plate 301 penetrate into the power supply interface 405 at the bottom of the detection base 403. The energized plate 301 continues to rise, lifts the detection tooling 401 to the bottom opening 312 of the closed box 311, enables the detection tooling 401 to enter the closed box 311, energizes the encapsulated chip 103 to generate heat, and then uses the thermal imaging detection module 319 to detect the internal circuit of the encapsulated chip 103. At the same time, gradually increase the power of the encapsulated chip 103 for load detection. The second RFID writer 321 writes the detected defect information into the RFID tag 407 under the corresponding encapsulated chip 103. After the detection is completed, the energized plate 301 descends and resets, and places the detection tooling 401 back on the transport track 104;

[0060] Step 5: When the detection tooling 401 reaches the sorting component position, the three-axis moving device 503 drives the second mounting plate 504 to move, so that the RFID reader 501 at the bottom is aligned with the RFID tag 407 on the detection tooling 401. The RFID reader 501 reads the information in the RFID tag 407 to determine whether there are defects in the encapsulated chip 103. If a defective encapsulated chip 103 is detected, the three-axis moving device 503 continues to act to drive the mounting jaws 505 to move above the corresponding encapsulated chip 103. The vacuum generator 506 on the mounting jaws 505 is started, and the suction nozzle 508 on the mounting bracket 507 generates negative pressure through the air pipe 509 to suck the defective encapsulated chip 103, and then transfers it to the recycling conveyor belt 107 on one side of the workbench 101 to complete the sorting of the encapsulated chip 103.

[0061] Embodiment 2: Based on the quality detection device and its detection method for post-encapsulation chips provided in Embodiment 1 of the present application, Embodiment 2 of the present application proposes a quality detection device and its detection method for post-encapsulation chips. Embodiment 2 is only a preferred manner of Embodiment 1, and the implementation of Embodiment 2 will not affect the independent implementation of Embodiment 1. The following will further describe the second Embodiment 2 of the present invention.

[0062] Please refer to Figure 14 And Figure 15As shown in the figure, the sorting component includes an infrared detector 514. Two sets of second electric telescopic rods 411 are arranged in each of the multiple sets of placement slots 402. Limiting connecting plates 412 are arranged on both sides of the detection base 403. The tops of the two sets of second electric telescopic rods 411 are respectively connected to the two limiting connecting plates 412. The two sets of second electric telescopic rods 411 can be activated based on the defect information in the RFID tag 407 to push the detection base 403 and the encapsulated chip 103 with defects on its top to rise. The encapsulated chip 103 passes through the arrangement holes 410 and reaches above the arrangement board 409. A fourth mounting base 502 is arranged on one side of the load detection component. A three-axis moving device 503 is arranged on the top of the fourth mounting base 502. A third slide rail 510 is arranged on one side of the fourth mounting base 502. A third electric slider 511 is arranged on the third slide rail 510. An elevation frame 512 is arranged on the top of the third electric slider 511. An infrared detector 514 is arranged on the top of the elevation frame 512. The infrared detector 514 is driven to move by the third electric slider 511 on the third slide rail 510, so that the infrared detector 514 can detect the encapsulated chip 103 with defects above the arrangement board 409. A second mounting plate 504 is arranged on the three-axis moving device 503. An installation jaw 505 and an installation bracket 507 are arranged on one side of the second mounting plate 504. A vacuum generator 506 is arranged on the installation jaw 505. A suction nozzle 508 is arranged on the installation bracket 507. The bottom end of the vacuum generator 506 is connected to the suction nozzle 508 through an air pipe 509. A recycling conveyor belt 107 is arranged on the other side of the fourth mounting base 502. The lifted encapsulated chip 103 is transported to the recycling conveyor belt 107 through the vacuum generator 506 and the suction nozzle 508 on the three-axis moving device 503.

[0063] Compared with the sorting component in the first embodiment that only transports the defective encapsulated chip 103 through the vacuum generator 506 and the suction nozzle 508, in the second embodiment, two sets of second electric telescopic rods 411 are activated based on the defect information to push the detection base 403 and the defective encapsulated chip 103 on its top to rise. The encapsulated chip 103 passes through the arrangement holes 410 and reaches above the arrangement board 409. The main difference is that the defective encapsulated chip 103 can be individually lifted to a specific position, which is convenient for subsequent detection and grasping operations, and can avoid the low efficiency caused by blindly searching for defective chips only relying on the vacuum generator 506 and the suction nozzle 508 among numerous encapsulated chips. And the infrared detector 514 is driven to move by the third electric slider 511 on the third slide rail 510 to detect the defective encapsulated chip 103 above the arrangement board 409 and locate the position of the chip. Therefore, compared with only transporting through the vacuum generator 506 and the suction nozzle 508, such a structure can improve the positioning accuracy of defective chips in the sorting process, thereby improving the efficiency and accuracy of the entire sorting process; the other conditions are the same as those in the first embodiment, so this embodiment will not be elaborated here.

[0064] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A quality inspection device for a packaged chip, comprising a workbench (101) and an equipment box (102) arranged at the bottom of the workbench (101), characterized in that: Above the workbench (101), a detection tooling (401) for placing multiple groups of encapsulated chips (103) is provided. On the top of the workbench (101), a transportation track (104) for conveying the detection tooling (401) is provided. On the top of the workbench (101), a load-bearing detection component is also provided corresponding to the detection tooling (401). The load-bearing detection component includes a pressure plate (201) and a hydraulic cylinder (202). Above the workbench (101), the hydraulic cylinder (202) and the pressure plate (201) are provided. On one side of the load-bearing detection component, a load detection component is provided. The load detection component includes a power-on plate (301). On the top of the workbench (101), a second through groove (105) is opened. The power-on plate (301) is slidably arranged in the second through groove (105). On the side of the load detection component away from the load-bearing detection component, a sorting component is provided; On the top of the detection tooling (401), multiple placement grooves (402) are opened. The multiple placement grooves (402) are evenly distributed on the top of the detection tooling (401). In the multiple placement grooves (402), detection bases (403) for placing the encapsulated chips (103) are provided. On the top of the detection base (403), multiple power supply holes (404) are provided corresponding to the pins of the encapsulated chip (103). On the bottom of the detection base (403), power supply interfaces (405) are provided corresponding to the multiple power supply holes (404). On one side of the detection base (403), an installation groove (406) is opened. An RFID tag (407) is arranged in the installation groove (406). At the opening on one side of the installation groove (406), a detachable side plate (408) is provided; At the bottom of the second through groove (105), a third mounting seat (302) is provided. At the bottom of the third mounting seat (302), a third mounting hole (303) is opened. At the bottom of the third mounting hole (303), a second linear driving device (304) is provided. The push rod of the second linear driving device (304) passes through the third mounting hole (303) and is connected to the power-on plate (301). On the top of the power-on plate (301), multiple through holes are opened corresponding to the multiple power supply interfaces (405). In the multiple through holes, power supply pins (305) are arranged. The power supply pins (305) can be inserted into the power supply interfaces (405). On one side of the second through groove (105), a groove is opened. A second photoelectric sensor (307) is arranged in the groove. On both sides of the second through groove (105), positioning grooves (308) are opened. On both sides of the third mounting seat (302), first electric telescopic rods (309) are provided. One end of the first electric telescopic rod (309) is connected to a positioning jaw (310). One side of the positioning jaw (310) is slidably arranged in the positioning groove (308); A closed box (311) is provided at the top of the second through groove (105). An opening (312) is provided at the bottom of the closed box (311) corresponding to the detection tooling (401). Two groups of limiting plates (313) are provided at the top of the opening (312). First slide rails (314) are provided on both sides of the opening (312). First electric sliders (315) are slidably provided on the two groups of first slide rails (314). The bottom end of the gantry (316) is connected to the two groups of first electric sliders (315). A second slide rail (317) is provided on the gantry (316). A second electric slider (318) is slidably provided on the second slide rail (317). A thermal imaging detection module (319) is provided at the bottom of the second electric slider (318). One side of the second electric slider (318) is connected to a second RFID writer (321) through two groups of second connecting rods (320).

2. The quality detection device for a packaged chip according to claim 1, wherein: A first mounting seat (203) is provided at the top of the workbench (101). A first mounting hole (204) is provided at the top of the first mounting seat (203). The hydraulic cylinder (202) is provided at the top of the first mounting hole (204). Two groups of first guiding columns (205) are provided at the top of the pressure plate (201). Two groups of first guiding holes (206) are provided at the bottom of the first mounting seat (203) corresponding to the two groups of first guiding columns (205). The two groups of first guiding columns (205) are respectively slidably inserted into the two groups of first guiding holes (206). The bottom end of the hydraulic cylinder (202) is connected to a connecting seat (207) through a hydraulic rod. A bearing plate (208) is provided at the bottom of the connecting seat (207). Two groups of second guiding columns (209) are further provided at the top of the pressure plate (201). Two groups of second guiding holes (210) are provided at the bottom of the bearing plate (208) corresponding to the two groups of second guiding columns (209). The two groups of second guiding columns (209) are respectively slidably inserted into the two groups of second guiding holes (210). A pressure sensor (211) is provided between the bearing plate (208) and the pressure plate (201).

3. The quality inspection device for a packaged chip according to claim 2, wherein: The load detection component further includes multiple groups of pressing contact blocks (212). A layout board (409) is arranged on the top of the detection tooling (401). Multiple layout holes (410) are formed in the top of the layout board (409) corresponding to the multiple groups of detection bases (403). Multiple groups of the pressing contact blocks (212) are arranged at the bottom of the pressure plate (201) corresponding to the multiple groups of the layout holes (410). A first mounting plate (213) is connected to one side of the first mounting seat (203). An installation frame (214) is arranged on the side of the first mounting plate (213) away from the pressure plate (201). Multiple installation clamping parts (215) are arranged on one side of the installation frame (214). Multiple X-ray detectors (216) are respectively installed in the multiple groups of the installation clamping parts (215) through connection blocks (229). A defect detection module (217) is also arranged on one side of the first mounting plate (213). Multiple groups of the X-ray detectors (216) are connected to the defect detection module (217) through signal lines (218). Multiple first RFID writers (219) are arranged on the other side of the first mounting plate (213) corresponding to the multiple groups of the X-ray detectors (216).

4. The quality inspection device for a packaged chip according to claim 1, characterized in that: A first through groove (106) is formed in the top of the workbench (101) corresponding to the load detection component. A second mounting seat (220) is arranged at the bottom of the first through groove (106). A second mounting hole (221) is formed in the bottom of the second mounting seat (220). A first linear driving device (222) is arranged at the bottom of the second mounting hole (221). A receiving plate (223) is connected to the push rod of the first linear driving device (222). An anti-slip layer (224) is arranged on the top of the receiving plate (223). A groove is formed on one side of the first through groove (106). A first photoelectric sensor (225) is arranged in the groove corresponding to the detection tooling (401). Two blocking through grooves (226) are also formed on one side of the first through groove (106). A first connecting rod (227) is arranged on one side of the second mounting seat (220). A blocking fork (228) is arranged on one side of the first connecting rod (227). The top of the blocking fork (228) is slidably inserted into the two blocking through grooves (226).

5. The quality inspection device for a packaged chip according to claim 1, characterized in that: The sorting component includes an RFID reader (501). A fourth mounting base (502) is provided on one side of the load detection component. A three-axis moving device (503) is provided on the top of the fourth mounting base (502). A second mounting plate (504) is provided on the three-axis moving device (503). The RFID reader (501) is provided at the bottom of the second mounting plate (504). An installation jaw (505) is provided on one side of the second mounting plate (504). A vacuum generator (506) is provided on the installation jaw (505). An installation bracket (507) is provided at the bottom of the installation jaw (505). A suction nozzle (508) is provided on the installation bracket (507). The bottom end of the vacuum generator (506) is connected to the suction nozzle (508) through an air pipe (509). A recycling conveyor belt (107) is provided on one side of the workbench (101).

6. The quality inspection device for a packaged chip according to claim 1, characterized in that: The sorting component includes an infrared detector (514). A fourth mounting base (502) is provided on one side of the load detection component. A three-axis moving device (503) is provided on the top of the fourth mounting base (502). A third slide rail (510) is provided on one side of the fourth mounting base (502). A third electric slider (511) is provided on the third slide rail (510). A heightening frame (512) is provided on the top of the third electric slider (511). A fifth mounting base (513) is provided on the top of the heightening frame (512). The infrared detector (514) is provided on the fifth mounting base (513). Two groups of second electric telescopic rods (411) are provided in each of the multiple groups of placement slots (402). Limit connecting plates (412) are provided on both sides of the detection base (403). The top ends of the two groups of second electric telescopic rods (411) are respectively connected to the two groups of limit connecting plates (412). A second mounting plate (504) is provided on the three-axis moving device (503). An installation jaw (505) and an installation bracket (507) are provided on one side of the second mounting plate (504). A vacuum generator (506) is provided on the installation jaw (505). A suction nozzle (508) is provided on the installation bracket (507). The bottom end of the vacuum generator (506) is connected to the suction nozzle (508) through an air pipe (509). A recycling conveyor belt (107) is provided on the other side of the fourth mounting base (502).

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