Cleaning process and cleaning device of carrier plate for laser printing

Abstract

The invention discloses a cleaning process and a cleaning device for a carrier plate for laser printing, and relates to the technical field of laser printing. The cleaning technology of the carrier plate for laser printing comprises the steps that the carrier plate is conveyed to a cleaning station, a solvent pool is adjusted to immerse the carrier plate, a laser transmitter and an ultrasonic vibration source are started for cleaning, and the cleaned carrier plate is conveyed into a production line. According to the technical scheme, the cleaning process and the cleaning device for the carrier plate for laser printing are designed, improvement is carried out on the basis of a laser wet cleaning technology, and laser shock, solvent dissolution and ultrasonic vibration are combined for use; specific parameters of related devices or equipment are reasonably controlled in combination with the specific shape of the carrier plate for laser printing and the position of residual slurry, cleaning of the carrier plate is completed within a very short time, an online cleaning scheme is adopted, the laser printing system can continuously work, meanwhile, the carrier plate can be kept clean, and the cleaning efficiency of the carrier plate is improved. The method has good application value.

Description

Technical Field

[0001] The invention relates to the technical field of laser printing, and in particular to a cleaning process and a cleaning device for a carrier plate used for laser printing. Background Art

[0002] In the solar cell manufacturing process, laser printing is a technology that uses laser to irradiate metal paste carried on a transparent carrier, causing the metal paste to fall off from the grooves of the carrier and then transfer to the solar cell to form a grid electrode.

[0003] After the metal slurry falls off from the grooves of the carrier, a very small amount of metal slurry particles will remain in the grooves of the carrier. The cleaning method in the related technology is to place the carrier in a solvent for cleaning, but after cleaning, there are still a very small number of stubborn metal slurry particles remaining in the grooves, and the cleaning time is too long to meet the production efficiency requirements of the production line. Summary of the invention

[0004] The main purpose of the present invention is to develop a cleaning process and cleaning device for a laser printing carrier, which can clean and remove residual slurry in the grooves of the laser printing carrier in a very short time. At the same time, the cleaning process can be matched with the production cycle of solar cells, thereby ensuring the efficient production of solar cells.

[0005] To achieve the above object, the present invention proposes a cleaning process for a carrier plate for laser printing, the cleaning process for a carrier plate for laser printing comprising the following steps:

[0006] S10, adjusting the transmission device to deliver the carrier after laser printing to a cleaning station, wherein the cleaning station is located above the solvent pool;

[0007] S20, adjusting the solvent pool to rise so that the carrier plate is immersed in the solvent in the solvent pool;

[0008] S30, starting the ultrasonic vibration source at the bottom of the solvent pool and the laser emitter above the cleaning station, so that the laser emitted by the laser emitter hits the groove of the carrier plate to clean the slurry remaining in the groove of the carrier plate;

[0009] S40, adjusting the solvent pool to reset, and sending the carrier cleaned in step S30 to a drying station for drying through the transmission device;

[0010] S50, adjusting the transmission device to transfer the carrier plate after the drying process in step S40 to the subsequent station, and sending the next carrier plate to be cleaned to the cleaning station for cleaning operation.

[0011] In one embodiment, in the step S10, the carrier board after laser printing is delivered to the cleaning station, and the direction of the carrier board is adjusted so that the grooves of the carrier board face downward.

[0012] In one embodiment, in step S20, the solvent pool is adjusted to rise so that the depth of the carrier plate immersed in the solvent is 0.1 mm to 2 mm.

[0013] In one embodiment, in step S30, the laser emitter is selected from any one of a continuous laser emitter, a quasi-continuous laser emitter, and a pulsed laser emitter.

[0014] In one implementation, in step S30, the emission power of the laser transmitter is 100W to 2000W.

[0015] In one embodiment, in the step S30, the width of the light spot output by the laser emitter on the carrier is 30 μm to 10 mm.

[0016] In one embodiment, in step S30, the laser wavelength emitted by the laser emitter is 248nm-2000nm.

[0017] In one embodiment, in the step S30, the distance between the laser emitter and the carrier is 270 mm to 600 mm.

[0018] In one embodiment, the ultrasonic vibration source includes at least one vibration device, and the vibration device is evenly distributed in a rectangular lattice at the bottom of the solvent pool.

[0019] In one embodiment, in the step S30, the vibration frequency of the vibration device is 80 kHz to 200 kHz.

[0020] In one embodiment, in step S30, the distance between the plane where the vibration device is located and the carrier plate is 30 mm to 200 mm.

[0021] In one embodiment, the solvent in the solvent pool is an organic solvent, and the organic solvent is selected from at least one of alcohols, esters, ethers, and ketones.

[0022] In one embodiment, the temperature of the solvent in the solvent tank is 25°C to 40°C.

[0023] The present invention also proposes a cleaning device, which applies the cleaning process of the carrier plate for laser printing; the cleaning device includes a solvent pool, an ultrasonic vibration source located at the bottom of the solvent pool, and a laser emitter located above the solvent pool.

[0024] In one embodiment, the cleaning device further comprises a filter, which is connected to the solvent pool via a drain port at the bottom of the solvent pool and is used to recover slurry particles in the solvent.

[0025] The technical solution of the present invention designs a cleaning process and a cleaning device for a carrier plate for laser printing, which is improved on the basis of laser wet cleaning technology, and combines laser impact, solvent dissolution and ultrasonic vibration. In combination with the specific shape of the carrier plate for laser printing and the location of the residual slurry, the specific parameters of the relevant devices or equipment are reasonably controlled to complete the cleaning of the carrier plate in a very short time. In addition, the cleaning rate of the carrier plate in the cleaning process of the present invention is 0.5 to 0.7 seconds per piece, while the production cycle of the photovoltaic cell laser printing production line is generally 0.7 to 0.8 seconds per piece. Therefore, the cleaning process of the present invention meets the requirements of the online cleaning solution, and there is no need to stop the line during the cleaning process. In summary, the cleaning process and cleaning device for the carrier plate for laser printing in the present invention enable the laser printing system to keep the carrier plate clean while working continuously and uninterruptedly, and prevent residual slurry from affecting the integrity and consistency of the printed grid line electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0027] Figure 1 It is a schematic structural diagram of a cleaning device for a carrier plate for laser printing in Example 1 of the present invention;

[0028] Figure 2 This is an EL test diagram of a solar cell produced after applying the cleaning device for a laser printing substrate in Example 1 of the present invention;

[0029] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings.

[0031] 1. Laser emitter; 2. Solvent pool; 3. Ultrasonic vibration source; 4. Carrier plate; 41. Groove; 5. Filter. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0035] The technical problem solved by the present application is that in the existing laser printing technology, the conventional cleaning method for the residual slurry in the carrier is ultrasonic cleaning in a solvent, but a small amount of stubborn slurry is still difficult to remove or requires longer ultrasonic treatment, all of which will affect the production efficiency and product quality of solar cells.

[0036] In order to solve the above technical problems, a cleaning process for a laser printing substrate is developed, which can clean and remove residual slurry in the grooves of the laser printing substrate in a very short time. At the same time, the cleaning process can be matched with the production cycle of solar cells, thereby ensuring efficient production of solar cells.

[0037] The present invention proposes a cleaning process for a carrier plate for laser printing, comprising the following steps:

[0038] S10, adjusting the transmission device to deliver the carrier after laser printing to a cleaning station, wherein the cleaning station is located above the solvent pool;

[0039] S20, adjusting the solvent pool to rise so that the carrier plate is immersed in the solvent in the solvent pool;

[0040] S30, starting the ultrasonic vibration source at the bottom of the solvent pool and the laser emitter above the cleaning station, so that the laser emitted by the laser emitter hits the groove of the carrier plate to clean the slurry remaining in the groove of the carrier plate;

[0041] S40, adjusting the solvent pool to reset, and sending the carrier cleaned in step S30 to a drying station for drying through the transmission device;

[0042] S50, adjusting the transmission device to transfer the carrier plate after the drying process in step S40 to the subsequent station, and sending the next carrier plate to be cleaned to the cleaning station for cleaning operation.

[0043] It should be noted that the cleaning process of the carrier for laser printing in the present invention introduces ultrasonic vibration and solvent dissolution on the basis of laser cleaning, which can effectively improve the related defects of simple laser cleaning and improve the cleaning effect. It should also be noted that in the above process of the present invention, the carrier is first immersed in the solvent in step S20, and then the ultrasonic vibration source and the laser emitter are synchronously turned on in step S30; the shock wave generated by the cavitation of ultrasound in the liquid can make the residual slurry break away from the groove of the carrier and rush into the solvent; ultrasonic cavitation can generate high-speed microjets on the surface of solids and liquids, which can weaken the boundary dirt layer of the residual slurry, enhance the stirring effect, and accelerate the dissolution of soluble organic matter in the residual slurry in the solvent. During the laser cleaning process, the high-energy laser penetrates the transparent carrier and acts on the slurry particles in the micro-grooves. The surface of the particles will quickly heat up to the vaporization temperature. At the same time, vaporization will cause extremely high pressure, and the residual particles will instantly break away from the micro-grooves. By adopting the above process, a laser printing carrier plate can be cleaned within 0.5 to 0.7 seconds, and the residual slurry particles in the grooves of the carrier plate can be reduced by 99.9%.

[0044] It should also be noted that in the cleaning process of the carrier for laser printing of the present invention, it is necessary to ensure that the carrier is immersed in the solvent during laser cleaning in step S30. If laser impact is performed first and then the carrier is immersed in the solvent, it is easy to cause the residual slurry not to be vaporized and separated by the laser, but instead the soluble organic matter such as adhesive in the residual slurry is completely volatilized, so that the residual slurry solidifies in the grooves of the carrier, thereby greatly increasing the difficulty of cleaning the carrier.

[0045] In one embodiment, in step S20, the solvent pool is adjusted to rise so that the depth of the carrier immersed in the solvent is 0.1 mm to 2 mm. It is understandable that the depth of the carrier immersed in the solvent can be 0.1 mm, 0.2 mm, 0.5 mm, 1 mm, 1.1 mm, 1.5 mm or 2 mm; any value within the above range is acceptable.

[0046] It should be noted that by immersing the carrier in the solvent to a certain depth, on the one hand, it is beneficial for the residual slurry in the grooves of the carrier to be easily separated during laser cleaning, and on the other hand, the laser needs to penetrate the solvent and the carrier to irradiate the residual slurry in the grooves of the carrier. The greater the depth of the carrier immersed in the solvent, the greater the energy loss. If the depth of the carrier immersed in the solvent is too shallow, the effect of ultrasonic vibration will be reduced, which is not conducive to removing the residual slurry. In summary, the carrier needs to be immersed in the solvent to an appropriate depth.

[0047] In one embodiment, in the step S20, the carrier board after laser printing is sent to the cleaning station, and the direction of the carrier board is adjusted so that the grooves of the carrier board face downward.

[0048] It should be noted that the groove direction of the carrier board after laser printing is downward in the production line. After arriving at the cleaning station, it does not need to be turned over and can be directly immersed in the solvent; the groove direction downward is also conducive to the residual slurry to be separated into the solvent under the action of gravity and the resonance of the ultrasonic wave at the bottom of the solvent pool. In addition, there is a drain outlet and a filter connected to the drain outlet at the bottom of the solvent pool. The groove direction downward is conducive to the recovery of the slurry and maintaining the solvent in a clean state. Although the groove direction upward can avoid energy loss during laser cleaning, it is necessary to add two steps of flipping the carrier board, which increases the complexity of the equipment and makes the solvent pool more turbid during the cleaning process, requiring frequent solvent replacement. Therefore, even if the groove direction is downward, it will cause 5-10% energy loss of the laser, which is still acceptable to the applicant considering the entire production process.

[0049] In one embodiment, the carrier is made of a material with high light transmittance and low thermal expansion coefficient, has high heat resistance, and will not be deformed or damaged after multiple penetrations or irradiations of the laser, thereby ensuring the integrity and consistency of the produced grid lines.

[0050] In one embodiment, in step S30, the laser emitter is selected from any one of a continuous laser emitter, a quasi-continuous laser emitter, and a pulsed laser emitter.

[0051] In one embodiment, in step S30, the light spot output by the laser emitter may be a Gaussian light spot or a light spot that has been specially shaped, such as a multi-spot light spot, a square, rectangular, circular flat-top light spot, a line light spot, etc.

[0052] In one embodiment, in step S30, the emission power of the laser emitter is 100 W to 2000 W. It is understandable that the emission power of the laser emitter can be 100 W, 120 W, 150 W, 300 W or 2000 W, whichever is within the above range.

[0053] In one embodiment, in step S30, the width of the light spot output by the laser emitter on the carrier is 30 μm to 10 mm. It is understandable that the width of the light spot output by the laser emitter on the carrier can be 30 μm, 31 μm, 35 μm, 50 μm or 10 mm, whichever is within the above range.

[0054] It should be noted that in step S30, the light spot output by the laser emitter on the carrier needs to cover the entire groove range, so the width of the light spot needs to be greater than or equal to the width of the groove. The width of the groove of a conventional carrier is 3μm to 30μm. In order to meet the needs and reduce laser energy consumption, the width of the light spot output by the laser emitter on the carrier is controlled to be 30μm to 10mm. In a specific embodiment, a Gaussian spot is used. In order to reduce the alignment accuracy requirements between a single laser beam and a single groove, the width of the light spot output by the laser emitter on the carrier is usually controlled to be 100μm to 200μm; in addition, the width of the light spot output by the laser emitter on the carrier can be expanded to the millimeter level, so that a single laser beam can cover multiple grooves at a time, further improving production efficiency.

[0055] It should also be noted that the emission power of the laser transmitter is highly correlated with the width of the light spot on the carrier. If the width of the light spot on the carrier is simply controlled at the level of 100μm to 200μm, the emission power of the laser transmitter can be in the hundreds of watts level; if the light spot is shaped to a width of the light spot on the carrier at the millimeter level, in order to achieve the same energy density, the emission power of the laser transmitter needs to reach the kilowatt level.

[0056] In one embodiment, in step S30, the laser wavelength emitted by the laser emitter is 248nm-2000nm. It is understandable that the laser wavelength of the laser emitter can be 248nm, 343nm, 532nm, 1030nm or 2000nm, whichever is within the above range.

[0057] It should be noted that 248nm laser is the typical output wavelength of excimer laser (such as KrF laser), which is ultraviolet laser, has high energy, can directly destroy the chemical bonds of organic matter without relying on thermal effects, and is more suitable for cleaning stains on metal surfaces; 2000nm laser is mid-infrared laser, which is often generated by thulium fiber laser or holmium laser, and has a longer wavelength. In the present invention, the above three lasers all have good cleaning effects.

[0058] In one embodiment, in step S30, the distance between the laser emitter and the carrier is 270 mm to 600 mm. It is understandable that the distance between the laser emitter and the carrier can be 270 mm, 271 mm, 280 mm, 300 mm, 320 mm or 600 mm, whichever is within the above range.

[0059] It should be noted that in step S30, the distance between the laser emitter and the carrier specifically refers to the distance between the laser emitter and the carrier when the laser emitter is started and emits laser. In order to ensure full utilization of laser energy, the above distance should be close to the focal length of the laser emitter, that is, the focal length of the laser emitter should be in the range of 270mm to 600mm.

[0060] In one embodiment, the ultrasonic vibration source includes at least one vibration device, and the vibration devices are evenly distributed in a rectangular lattice at the bottom of the solvent pool. In a specific embodiment, the cleaning device is a single-station cleaning device, that is, it can only complete the cleaning of one carrier plate at a time, and the specifications of the solvent pool are 300mm*300mm*50mm, and the ultrasonic vibration source includes 9 vibration devices, which are evenly distributed in a 3*3 square lattice at the bottom of the solvent pool. In a specific embodiment, the cleaning device is a single-station cleaning device, that is, it can only complete the cleaning of one carrier plate at a time, and the specifications of the solvent pool are 300mm*300mm*50mm, and the ultrasonic vibration source includes 16 vibration devices, which are evenly distributed in a 4*4 square lattice at the bottom of the solvent pool. In a specific embodiment, the cleaning device is a double-station cleaning device, that is, it can complete the cleaning of two carrier plates each time, and the specifications of the solvent pool are 300mm*800mm*200mm, and the ultrasonic vibration source includes 32 vibration devices, which are evenly distributed in a 4*8 rectangular lattice at the bottom of the solvent pool.

[0061] In one embodiment, in step S30, the vibration frequency of the vibration device is 80kHz to 200kHz. It is understandable that the vibration frequency of the vibration device can be 80kHz, 85kHz, 90kHz, 100kHz or 200kHz, corresponding to the vibration frequency of the vibration device of the ultrasonic cleaning machine in the prior art, and any frequency within the above range is acceptable.

[0062] In one embodiment, the vibration frequency of the ultrasonic vibration source can also reach the MHz level, corresponding to the vibration frequency of the vibration device in the megasonic cleaning machine.

[0063] In one embodiment, in the step S30, the distance between the plane where the vibration device is located and the carrier plate is 30 mm to 200 mm. It is understandable that the plane where the vibration device is located is equivalent to the bottom of the solvent pool, and the distance between the plane where the vibration device is located and the carrier plate is approximately the distance between the bottom of the solvent pool and the carrier plate. The above distance can be 30 mm, 35 mm, 60 mm, 80 mm, 100 mm, or 200 mm, whichever is within the above range. It should be noted that by controlling the distribution state, vibration frequency and distance from the object of action of the vibration device, it is possible to have a better impact on the residual slurry in the groove, causing it to detach in a short time.

[0064] In one embodiment, the solvent in the solvent pool is an organic solvent, and the organic solvent is selected from at least one of alcohols, esters, ethers, and ketones; preferably, the solvent in the solvent pool is an organic solvent, and the organic solvent includes ethers and ketones.

[0065] In one embodiment, the temperature of the solvent in the solvent tank is 25° C. to 40° C. It should be noted that by controlling the temperature of the solvent in the solvent tank to 25° C. to 40° C., it is beneficial to dissolve the soluble organic matter in the residual slurry in the solvent, thereby promoting the cleaning and removal of the residual slurry.

[0066] It should also be noted that, under normal circumstances, the temperature of the solvent in the solvent pool is room temperature; when the viscosity of the metal slurry is high, the temperature of the solvent in the solvent pool can be appropriately increased, but the temperature of the solvent in the solvent pool should not exceed 40°C, otherwise it will cause the organic solvent to evaporate quickly, which will reduce the cleaning ability of the solvent pool.

[0067] The present invention also proposes a cleaning device, which applies the cleaning process of the carrier plate for laser printing; the cleaning device includes a solvent pool, an ultrasonic vibration source located at the bottom of the solvent pool, and a laser emitter located above the solvent pool.

[0068] In one embodiment, the cleaning device further comprises a filter, which is connected to the solvent pool via a drain port at the bottom of the solvent pool and is used to recover slurry particles in the solvent.

[0069] The present invention is further described below by means of specific embodiments:

[0070] The raw materials used in the embodiments of the present invention are all commercially available, and the present invention does not impose any restrictions on the sources of the raw materials.

[0071] Example 1

[0072] Reference Figure 1 The cleaning device in Example 1 includes a solvent pool 2, an ultrasonic vibration source 3 and a laser emitter 1, and a filter 5 is also connected to the bottom of the solvent pool 2.

[0073] Embodiment 1 is a single-station cleaning device, which cleans one carrier plate 4 each time. The specification of the solvent pool 2 is 300mm*300mm*50mm. The ultrasonic vibration source 3 includes 16 vibration devices, which are evenly distributed in a 4*4 square matrix at the bottom of the solvent pool 2.

[0074] The cleaning process of the laser printing carrier in Example 1 includes the following steps:

[0075] S10, adjusting the transmission device to deliver the carrier after laser printing to a cleaning station, wherein the cleaning station is located above the solvent pool 2;

[0076] S20, adjusting the height of the carrier plate 4 so that the distance between the laser emitter 1 and the carrier plate 4 is 300 mm, adjusting the solvent pool 2 to rise so that the carrier plate 4 is immersed in the solvent to a depth of about 1 mm, and the distance between the carrier plate 4 and the bottom of the solvent pool 2 is about 45 mm;

[0077] S30, simultaneously starting the ultrasonic vibration source 3 located at the bottom of the solvent pool 2 and the laser emitter 1 located above the cleaning station, so that the laser emitted by the laser emitter 1 hits the groove 41 of the carrier 4, and the slurry remaining in the groove 41 of the carrier 4 is cleaned. After 0.5 seconds, the cleaning is completed and the ultrasonic vibration source 3 and the laser emitter 1 are turned off;

[0078] S40, adjusting the solvent pool 2 to reset, and sending the carrier cleaned in step S30 to a drying station for drying through the transmission device;

[0079] S50, adjusting the transmission device to transfer the carrier plate after the drying process in step S40 to the subsequent station, and sending the next carrier plate to be cleaned to the cleaning station for cleaning operation.

[0080] The laser emitter 1 in Example 1 is a pulsed laser emitter, the emission power is controlled to be 400W, the laser wavelength is 532nm, the output light spot is a circular flat-top light spot, and the width of each light spot on the carrier 4 is controlled to be 30μm, which can completely cover a groove.

[0081] The cleaning device in the first embodiment has a plurality of laser emitters 1 , and the light spots outputted are respectively projected onto a plurality of grooves 41 of the carrier plate 4 .

[0082] In the first embodiment, the width of the groove 41 of the carrier 4 is about 22 μm.

[0083] The vibration frequency of the vibration device of the ultrasonic vibration source 3 in Example 1 is 100 kHz.

[0084] The cleaning device in Example 1 was incorporated into the production device of solar cells to form a production-cleaning cycle operation device. The production device of solar cells was a laser transfer printing device, which produced solar cells with a grid line groove width of about 20 μm. The above production-cleaning cycle operation device was used to produce solar cells, with 8 solar cells produced in one batch, and a total of 1,000 solar cells produced. The solar cells produced in the last 5 batches were tested for EL, and the test results are shown in FIG. Figure 1 .

[0085] like Figure 1 As shown, the test results did not find that multiple consecutive pieces were detected with broken grids at the same position. At the same time, the printing quality of the solar cell sheets was good, and no serious broken grid phenomenon occurred.

[0086] Example 2

[0087] Reference Figure 1 The cleaning device in Example 2 includes a solvent pool 2, an ultrasonic vibration source 3 and a laser emitter 1. A filter 5 is also connected to the bottom of the solvent pool 2. Example 2 is a double-station cleaning device, which cleans two carriers 4 each time. The size of the solvent pool 2 is 300mm*800mm*200mm. The ultrasonic vibration source 3 includes 32 vibration devices, which are evenly distributed in a 4*8 rectangular lattice at the bottom of the solvent pool.

[0088] The cleaning process of the laser printing carrier in Example 2 includes the following steps:

[0089] S10, adjusting the transmission device to deliver the carrier plate 4 after laser printing to a cleaning station, wherein the cleaning station is located above the solvent pool 2;

[0090] S20, adjusting the height of the carrier plate 4 so that the distance between the laser emitter 1 and the carrier plate 4 is 300 mm, adjusting the solvent pool 2 to rise so that the depth of the carrier plate 4 immersed in the solvent is about 0.5 mm, and the distance between the carrier plate 4 and the bottom of the solvent pool 2 is about 45 mm;

[0091] S30, simultaneously starting the ultrasonic vibration source 3 located at the bottom of the solvent pool 2 and the laser emitter 1 located above the cleaning station, so that the laser emitted by the laser emitter 1 hits the groove 41 of the carrier 4, and the slurry remaining in the groove 41 of the carrier 4 is cleaned. After 0.5 seconds, the cleaning is completed and the ultrasonic vibration source 3 and the laser emitter 1 are turned off;

[0092] S40, adjusting the solvent pool 2 to reset, and sending the carrier plate 4 cleaned in step S30 to a drying station for drying through the transmission device;

[0093] S50, adjusting the transmission device to transfer the carrier plate 4 after the drying process in step S40 to the subsequent station, and sending the next carrier plate 4 to be cleaned to the cleaning station for cleaning operation.

[0094] The laser emitter 1 in Example 2 is a pulse laser emitter, the emission power is controlled to be 300 W, the laser wavelength is 532 nm, the output light spot is a circular flat-top light spot, and the width of the light spot on the carrier board 4 is controlled to be 25 μm.

[0095] The cleaning device in the second embodiment has a plurality of laser emitters 1 , and the light spots outputted are respectively projected onto a plurality of grooves 41 of the carrier plate 4 .

[0096] In the second embodiment, the width of the groove 41 of the carrier 4 is about 22 μm.

[0097] The vibration frequency of the vibration device of the ultrasonic vibration source 3 in Example 2 is 100 kHz.

[0098] The cleaning device in Example 2 is incorporated into the production device of solar cells to form a production-cleaning cycle operation device. The production device of solar cells is a laser transfer printing device, which produces solar cells with a grid line groove width of about 20 μm. The above-mentioned production-cleaning cycle operation device is used to produce solar cells, 16 solar cells are produced in one batch, and a total of 1,000 solar cells are produced. The solar cells in the last 5 batches are subjected to EL detection. The test results show that no continuous multiple pieces are detected with broken grids at the same position. The printing quality of the solar cells is good, and no serious broken grid phenomenon occurs.

[0099] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A cleaning process for a carrier plate for laser printing, characterized in that: The cleaning process of the carrier plate for laser printing comprises the following steps: S10, adjusting the transmission device to deliver the carrier after laser printing to a cleaning station, wherein the cleaning station is located above the solvent pool; S20, adjusting the solvent pool to rise so that the carrier plate is immersed in the solvent in the solvent pool; S30, starting the ultrasonic vibration source at the bottom of the solvent pool and the laser emitter above the cleaning station, so that the laser emitted by the laser emitter hits the groove of the carrier plate to clean the slurry remaining in the groove of the carrier plate; S40, adjusting the solvent pool to reset, and sending the carrier cleaned in step S30 to a drying station for drying through the transmission device; S50, adjusting the transmission device to transfer the carrier plate after the drying process in step S40 to the subsequent station, and sending the next carrier plate to be cleaned to the cleaning station for cleaning operation.

2. The cleaning process for a laser printing substrate as claimed in claim 1, characterized in that: In the step S10, the carrier board after laser printing is sent to the cleaning station, and the direction of the carrier board is adjusted so that the grooves of the carrier board face downward.

3. The cleaning process for a laser printing substrate as claimed in claim 1, characterized in that: In the step S20, the solvent pool is adjusted to rise so that the carrier is immersed in the solvent to a depth of 0.1 mm to 2 mm.

4. The cleaning process for a laser printing substrate as claimed in claim 1, characterized in that: In the step S30, The laser emitter is selected from any one of a continuous laser emitter, a quasi-continuous laser emitter, and a pulsed laser emitter; And / or, the emission power of the laser transmitter is 100W to 2000W; And / or, the width of the light spot output by the laser emitter on the carrier is 30 μm to 10 mm; And / or, the laser wavelength emitted by the laser emitter is 248nm~2000nm; And / or, the distance between the laser emitter and the carrier plate is 270 mm to 600 mm.

5. The cleaning process for a laser printing substrate as claimed in claim 1, characterized in that: The ultrasonic vibration source comprises at least one vibration device, and the vibration device is evenly distributed in a rectangular lattice at the bottom of the solvent pool.

6. The cleaning process for a laser printing substrate as claimed in claim 5, characterized in that: In the step S30, The vibration frequency of the vibration device is 80kHz to 200kHz; And / or, the distance between the plane where the vibration device is located and the carrier plate is 30 mm to 200 mm.

7. The cleaning process for a laser printing substrate as claimed in claim 1, characterized in that: The solvent in the solvent pool is an organic solvent, and the organic solvent is selected from at least one of alcohols, esters, ethers, and ketones; And / or, the temperature of the solvent in the solvent pool is 25°C to 40°C.

8. A cleaning device, characterized in that: The cleaning device applies the cleaning process for the carrier plate for laser printing as claimed in any one of claims 1 to 7; The cleaning device comprises a solvent pool, an ultrasonic vibration source located at the bottom of the solvent pool, and a laser emitter located above the solvent pool.

9. The cleaning device according to claim 8, characterized in that: The cleaning device also includes a filter, which is connected to the solvent pool through a drain port at the bottom of the solvent pool and is used to recover slurry particles in the solvent.

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