A formic acid vacuum welding equipment for semiconductor packaging

Abstract

The present invention discloses a formic acid vacuum welding device for semiconductor packaging, comprising: a vacuum welding device body, the vacuum welding device body comprising a device housing, a preheating chamber, a heating welding chamber, a cooling chamber, a formic acid source module and a vacuum source module connected to the preheating chamber, the heating welding chamber and the cooling chamber, and a cooling source module connected to the cooling chamber, an upper heating assembly and a lower heating assembly are arranged in the preheating chamber and the heating welding chamber, a cooling assembly is arranged in the cooling chamber, and the ends of the preheating chamber, the heating welding chamber and the cooling chamber are all provided with a sealing mechanism. When the present invention is in use, a semiconductor workpiece to be welded can be placed on a workpiece plate, and an upper heating assembly and a lower heating assembly are further installed in the preheating chamber and the heating welding chamber. The upper heating assembly and the lower heating assembly can provide heating to the workpiece plate from above and below, making the welding process more uniform and helping to improve the welding quality.

Description

Technical Field

[0001] The present invention relates to the technical field of formic acid vacuum welding equipment, and more particularly to formic acid vacuum welding equipment for semiconductor packaging. Background Art

[0002] A formic acid vacuum furnace uses formic acid as the gas medium in the welding environment, providing high-quality welding. In a vacuum environment, impurities such as oxygen and moisture are removed during the welding process, preventing welding defects such as pores and inclusions. This maintains the temperature stability of semiconductor sealing materials and improves welding quality.

[0003] The Chinese invention patent with application number CN202322873882.X discloses a heating mechanism, comprising: a sealed cavity; a heating component, arranged in the sealed cavity, for heating the product; the heating component includes a heating plate and a plurality of heating cables evenly arranged therein, each heating cable being provided with a temperature measuring element; a control element, connected to the temperature measuring element signal. The above-mentioned heating mechanism can ensure the uniformity of temperature, ensure high-precision welding of the product, and improve the welding quality of the product. Although the formic acid vacuum welding equipment using the heating mechanism of the above-mentioned technical solution can achieve uniform heating of semiconductor package welding, the heating mechanism mainly heats the semiconductor package material from below through the heating component, and further improvement is needed to make the welding heating more uniform. Therefore, it is necessary to propose a formic acid vacuum welding equipment for semiconductor packaging to at least partially solve the problems existing in the prior art. Summary of the Invention

[0004] The Summary of the Invention introduces a series of simplified concepts that will be further described in the Detailed Description of the Invention. The Summary of the Invention is not intended to define the key features and essential features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0005] In order to at least partially solve the above problems, the present invention provides a formic acid vacuum welding equipment for semiconductor packaging, comprising: a vacuum welding equipment body, the vacuum welding equipment body including an equipment housing, in which a preheating chamber, a heating welding chamber, a cooling chamber are sequentially arranged, as well as a formic acid source module and a vacuum source module connected to the preheating chamber, the heating welding chamber, and the cooling chamber, and a cooling source module connected to the cooling chamber, an upper heating component and a lower heating component are arranged in the preheating chamber and the heating welding chamber, a cooling component is arranged in the cooling chamber, and sealing mechanisms are arranged at the ends of the preheating chamber, the heating welding chamber, and the cooling chamber.

[0006] According to the formic acid vacuum welding equipment for semiconductor packaging of the embodiment of the present invention, the preheating chamber and the heating welding chamber are provided with an upper cover plate, the upper heating assembly is arranged in the upper cover plate, and the temperature measuring element is also arranged in the upper cover plate.

[0007] According to the formic acid vacuum welding equipment for semiconductor packaging according to an embodiment of the present invention, the upper heating assembly includes multiple upper heating elements, which are evenly distributed on the bottom of the upper cover plate. The upper heating element includes a fixed seat, a heating lamp tube, and a fixed clamp frame. The fixed clamp frame is connected to the upper cover plate through the fixed seat. The heating lamp tube is arranged in the fixed clamp frame, and an adjustment rod is also arranged in the fixed clamp frame. The adjustment rod is located above the heating lamp tube.

[0008] According to the formic acid vacuum welding equipment for semiconductor packaging according to an embodiment of the present invention, the fixed clamp frame includes an inverted U-shaped frame and two arc-shaped clamps, the two arc-shaped clamps are relatively arranged at the lower end of the inverted U-shaped frame, the heating lamp tube is arranged in the two arc-shaped clamps, and the adjustment rod is passed through the inverted U-shaped frame.

[0009] According to the formic acid vacuum welding equipment for semiconductor packaging according to an embodiment of the present invention, there are internal transportation mechanisms in the preheating chamber and the heating welding chamber respectively, and the internal transportation mechanisms include two transportation racks, and the two transportation racks are located on both sides of the lower heating component. The transportation racks include a transportation support plate and multiple transportation wheel groups. The transportation support plate is located on one side of the lower heating component, and the multiple transportation wheel groups are on the transportation support plate.

[0010] According to the formic acid vacuum welding equipment for semiconductor packaging according to an embodiment of the present invention, the transport wheel group includes an outer moving wheel and an inner transport wheel. The outer moving wheel and the inner transport wheel are located on both sides of the transport support plate, and there is an inner shaft rod between the outer moving wheel and the inner transport wheel. The inner shaft rod is passed through the transport support plate. An outer side of the transport support plate is also provided with an outer cover plate. Multiple outer moving wheels are located in the outer cover plate, and the multiple outer moving wheels are rotatably connected by a sprocket.

[0011] According to the formic acid vacuum welding equipment for semiconductor packaging according to an embodiment of the present invention, a plurality of guide columns and two anti-dislocation plates are also arranged on the transport support plate. The plurality of guide columns are evenly distributed at the upper end of the transport support plate. The two anti-dislocation plates are respectively close to the end portions of the transport support plate, and the upper ends of the anti-dislocation plates have transverse stoppers.

[0012] According to the formic acid vacuum welding equipment for semiconductor packaging according to an embodiment of the present invention, the lower heating assembly includes a lower heating plate, and a first lifting mechanism is further configured below the working chamber. The first lifting mechanism is used to lift the lower heating plate, and a heating wire is configured in the lower heating plate.

[0013] According to the formic acid vacuum welding equipment for semiconductor packaging according to an embodiment of the present invention, the cooling assembly includes a cooling plate, which is arranged on the second lifting mechanism. A cooling channel is arranged in the cooling plate, and the opening of the cooling channel is connected to the cooling source module through the cooling joint module.

[0014] According to the formic acid vacuum welding equipment for semiconductor packaging according to an embodiment of the present invention, the cooling joint module includes a first cooling joint part and a second cooling joint part. The first cooling joint part includes a first inner tube and an outer cap. The first inner tube is arranged at the left end of the external cap, and the first inner tube is connected to the opening of the cooling channel. The second cooling joint part includes a second inner joint, an outer seat ring, and a second inner tube. The second inner joint is arranged at the left end of the outer seat ring, and the second inner tube is arranged at the right end of the outer seat ring. The second inner tube is connected to the cooling water pipe of the cooling source module, and the second inner joint is connected to the external cap.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects:

[0016] The present invention provides a formic acid vacuum welding device for semiconductor packaging, which includes a vacuum welding device body, a device housing, and a preheating chamber, a heating welding chamber, and a cooling chamber in the device housing from left to right. The device housing also includes a formic acid source module, a vacuum source module, and a cooling source module. When in use, a semiconductor workpiece to be welded can be placed on a workpiece plate, and the workpiece plate can be transported to the working chamber by a conveying mechanism at the left end of the device housing. An upper heating component and a lower heating component are also installed in the preheating chamber and the heating welding chamber. The upper heating component and the lower heating component can provide heating to the workpiece plate from above and below, making the welding process more uniform and helping to improve the welding quality.

[0017] The formic acid vacuum welding equipment for semiconductor packaging of the present invention, other advantages, objectives and features of the present invention will be reflected in part through the following description, and in part will be understood by those skilled in the art through research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 It is a structural schematic diagram of the present invention.

[0020] Figure 2 It is a bottom view of the structure of the present invention.

[0021] Figure 3 Schematic diagram of the structure of the working chamber in the present invention.

[0022] Figure 4 Schematic diagram of the internal structure of the working chamber in the present invention.

[0023] Figure 5It is a structural schematic diagram of the upper heating element in the present invention.

[0024] Figure 6 It is a structural schematic diagram of the internal transportation mechanism in the present invention.

[0025] Figure 7 This is a schematic structural diagram of the cooling joint module in the present invention.

[0026] Figure 8 This is a schematic diagram of the exploded structure of the cooling joint module in the present invention.

[0027] Figure 9 This is a partial structural diagram of the first cooling joint part in the present invention.

[0028] Figure 10 This is a partial structural diagram of the second cooling joint part in the present invention.

[0029] Figure 11 Schematic diagram of the internal structure of the cooling joint module in the present invention.

[0030] Figure 12 For the present invention Figure 11 Schematic diagram of the enlarged structure of the part A in the middle.

[0031] Figure 13 It is a structural diagram of the stopping mechanism and the driving mechanism in the present invention.

[0032] Figure 14 It is a partial structural diagram of the stopping mechanism in the present invention.

[0033] Illustration, Figure 3 The middle arrow indicates the moving direction of the workpiece plate. DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments so that those skilled in the art can implement the invention with reference to the description.

[0035] It should be understood that terms such as “having”, “including” and “comprising” used herein do not preclude the existence or addition of one or more other elements or combinations thereof.

[0036] like Figures 1-6As shown, the present invention provides a formic acid vacuum welding device for semiconductor packaging, comprising: a vacuum welding device body 100, the vacuum welding device body 100 having a device housing 1, wherein the device housing 1 sequentially comprises a preheating chamber 2a, a heating welding chamber 2b, and a cooling chamber 2c from left to right, and further comprising a formic acid source module and a vacuum source module connected to the preheating chamber 2a, the heating welding chamber 2b, and the cooling chamber 2c, and a cooling source module connected to the cooling chamber 2c, wherein the cooling chamber 2c comprises a cooling assembly 60. The cooling component 60 is connected to the cooling source module, and provides formic acid, vacuum, cooling and other functions to the vacuum welding equipment main body 100 through the above-mentioned formic acid source module, vacuum source module, and cooling source module. When in use, the semiconductor workpiece to be welded can be placed on the workpiece plate 200, and the workpiece plate 200 can be transported through the conveying mechanism 11 at the left end of the equipment housing 1. The workpiece plate 200 can then pass through the preheating chamber 2a and the heating welding chamber 2b in turn and then enter the cooling chamber 2c, thereby achieving a better heating and welding effect and greatly improving welding efficiency.

[0037] An upper heating assembly 3, a lower heating assembly 4, and an internal transport mechanism 5 are also installed in the preheating chamber 2a and the heating welding chamber 2b. The upper heating assembly 3 and the lower heating assembly 4 can provide heating to the workpiece plate 200 from above and below, making the welding process more uniform and helping to improve the quality of heating welding. In addition, sealing mechanisms 7 are provided at the left and right ends of the preheating chamber 2a, the heating welding chamber 2b, and the cooling chamber 2c. The sealing mechanism 7 has a good sealing effect, ensuring absolute vacuum in the formic acid furnace during welding, so as to be suitable for welding high-precision and high-requirement semiconductor workpieces.

[0038] It can be understood that the above-mentioned lower heating assembly 4 and sealing mechanism 7 are components in the prior art, and the specific structural models are not limited here.

[0039] Furthermore, in some embodiments of the present invention, the above-mentioned upper heating assembly 3 is installed in the upper cover plate 21 of the preheating chamber 2a and the heating welding chamber 2b, so that the upper heating assembly 3 is located above the internal transport mechanism 5. The upper heating assembly 3 also provides a heating function from above for the semiconductor workpiece on the workpiece plate 200, thereby improving the welding quality of the semiconductor workpiece.

[0040] Furthermore, a temperature measuring element 22 is installed in the upper cover plate 21. Here, the temperature measuring element 22 is a thermocouple or a temperature sensor, which can obtain the temperature below the upper cover plate 21, avoid large temperature differences in different areas, and ensure high-precision welding requirements.

[0041] Exemplary upper heating assembly

[0042] like Figure 3-Figure 4As shown, further, some embodiments of the present invention provide a specific structure of the above-mentioned upper heating assembly 3, where the upper heating assembly 3 of this structure includes a plurality of upper heating elements 31, wherein the plurality of upper heating elements 31 are evenly distributed at the bottom of the upper cover 21, specifically, the upper heating element 31 includes a fixing seat 32, a heating lamp 33, and a fixing clamp frame 34, wherein the fixing clamp frame 34 is connected to the upper cover 21 via the fixing seat 32, and the heating lamp 33 is installed in the fixing clamp frame 34, and an adjustment rod 35 is also installed in the fixing clamp frame 34, and the adjustment rod 35 is located above the heating lamp 33. After the above-mentioned heating lamp 33 is started, heat can be generated to heat and weld the semiconductor workpiece, and rotating the adjustment rod 35 can control the opening and closing degree of the fixing clamp frame 34, thereby fixing the heating lamp 33 more stably. Here, the heating lamp 33 can be an infrared heating lamp, or other forms of heating lamps, which are not limited here.

[0043] like Figure 5 As shown, further, some embodiments of the present invention provide a specific structure of the above-mentioned fixed clamp frame 34, where the fixed clamp frame 34 of this structure includes an inverted U-shaped frame 341 and two arc-shaped clamps 342, wherein the two arc-shaped clamps 342 are relatively installed at the lower end of the inverted U-shaped frame 341, and the heating lamp tube 33 is installed in the two arc-shaped clamps 342, and the adjustment rod 35 is passed through the inverted U-shaped frame 341, so by rotating the adjustment rod 35, the inverted U-shaped frame 341 can be opened or closed, and then the two arc-shaped clamps 342 below can also be opened or closed, thereby realizing the fixed adjustment of the heating lamp tube 33.

[0044] Exemplary internal transportation mechanism

[0045] like Figure 6 As shown, further, some embodiments of the present invention provide a specific structure of the above-mentioned internal transport mechanism 5, where the internal transport mechanism 5 of the structure includes two transport racks 51, and the two transport racks 51 are located on both sides of the lower heating assembly 4. The workpiece plate 200 can be transported by the two transport racks 51, so that the workpiece plate 200 can pass into the preheating chamber 2a and the heating welding chamber 2b, thereby realizing the smooth transportation of the workpiece plate 200 and greatly improving the welding production efficiency.

[0046] It is understandable that an internal transport mechanism 5 with the same structure is also installed in the cooling chamber 2c to facilitate the transportation of the workpiece plate 200 in the cooling chamber 2c.

[0047] Furthermore, the above-mentioned transport frame 51 includes a transport support plate 52 and multiple transport wheel groups 53, wherein the transport support plate 52 is located on one side of the lower heating component 4, and multiple transport wheel groups 53 are on the transport support plate 52, and multiple transport wheel groups 53 support and transport the workpiece plate, thereby facilitating the movement of the workpiece plate, wherein the transport wheel group 53 includes an outer moving wheel 531 and an inner moving wheel 532, wherein the outer moving wheel 531 and the inner moving wheel 532 are located on both sides of the transport support plate 52, and an inner shaft rod 533 is provided between the outer moving wheel 531 and the inner moving wheel 532, and the inner shaft rod 533 is passed through the transport support plate 52, and the transport support plate The outer side of 52 also has an outer cover plate 521, and multiple outer driven wheels 531 are located inside the outer cover plate 521, and the multiple outer driven wheels 531 are rotatably connected through a sprocket (not shown). Here, a motor module (not shown) is installed on the outer wall of the preheating chamber 2a and the heating welding chamber 2b. The motor module can be connected to the outer driven wheels 531 at both ends of the transport support plate 52, so when the motor module drives the outer driven wheel 531 at the end to rotate, it can then drive the other multiple outer driven wheels 531 to rotate through the sprocket, and correspondingly, the inner transport wheel 532 also rotates, and the workpiece plate located on the inner transport wheel 532 can move.

[0048] Furthermore, a plurality of guide posts 54 and two anti-dislocation plates 55 are installed on the transport support plate 52. Specifically, the plurality of guide posts 54 are evenly distributed on the upper end of the transport support plate 52. A guide wheel 541 is provided on the guide post 54. Through the contact between the workpiece plate and the guide wheel 541, the guide wheel 541 is rotated to maintain the correct movement of the workpiece plate 200 to prevent left and right directional dislocation. The two anti-dislocation plates 55 are respectively close to the ends of the transport support plate 52, and the upper ends of the anti-dislocation plates 55 are provided with transverse stops 551. The transverse stops 551 on the anti-dislocation plates 55 can provide a blocking effect above the workpiece plate to prevent it from dislocating upward, so that the semiconductor workpieces on the workpiece plate are in the same heating environment, meeting high precision requirements.

[0049] Exemplary Lower Heating Assembly

[0050] Furthermore, some embodiments of the present invention provide that the above-mentioned lower heating assembly 4 includes a lower heating plate 41. Correspondingly, a first lifting mechanism 42 is also installed below the preheating chamber 2a and the heating welding chamber 2b. Here, the first lifting mechanism 42 is used to lift the lower heating plate 41 so that the lower heating plate 41 moves upward and close to the workpiece plate 200, wherein a heating wire (not shown) is installed in the lower heating plate 41, thereby heating the workpiece plate 200 to realize preheating, welding and other functions respectively.

[0051] Exemplary Cooling Joint Module

[0052] like Figure 7-Figure 8As shown, further, in some embodiments of the present invention, the above-mentioned cooling assembly 60 includes a cooling plate 601, and the cooling plate 601 is installed on a second lifting mechanism 602, and the second lifting mechanism 602 is located below the cooling chamber 2c. When the second lifting mechanism 602 is started, the cooling plate 601 can be lifted and lowered close to the workpiece plate 200, and then the cooling source module supplies cooling water to the cooling plate 601, so that the cooling plate 601 provides cold air to the workpiece plate 200 for cooling, so that the workpiece plate 200 is in a cooling environment in the cooling chamber 2c. A cooling channel is provided in the cooling plate 601, and the opening of the cooling channel is connected to the cooling source module through the cooling joint module 6.

[0053] Furthermore, the cooling joint module 6 of this structure includes a first cooling joint portion 61 and a second cooling joint portion 62, wherein the first cooling joint portion 61 includes a first inner tube 611 and an outer cap 612, the first inner tube 611 being mounted on the left end of the outer cap 612, and the first inner tube 611 being mounted and connected to the opening of the cooling channel;

[0054] The second cooling joint part 62 includes a second inner joint 621, an outer seat ring 622, and a second inner tube 623. Here, the second inner joint 621 is installed at the left end of the outer seat ring 622, and the second inner tube 623 is installed at the right end of the outer seat ring 622. It is connected to the cooling water pipe (not shown) of the cooling source module through the second inner tube 623. Therefore, the above-mentioned second inner joint 621 and the external cap 612 can be installed and connected quickly and efficiently, which makes it convenient to remove the lower heating plate 41 for maintenance after the two are disassembled.

[0055] like Figure 9 As shown, further, the outer cap 612 has an inner left connecting cavity 613, a middle connecting cavity 614, and two outer right connecting cavities 615 from left to right. The inner left connecting cavity 613 is installed with an inner support mechanism 63, and the outer right connecting cavity 615 is installed with an inner hook rod 616;

[0056] like Figure 10-12As shown, correspondingly, a notch groove 624 and an inner groove 625 corresponding to the inner hook rod 616 are opened on the outer wall of the second inner joint 621, so that the second inner joint 621 can enter the inner left connection cavity 613 through the outer right connection cavity 615 and the middle connection cavity 614. In the above process, the inner hook rod 616 can enter the inner groove 625 along the notch groove 624, and the hook head body 6160 of the inner hook rod 616 has a first vertical hook wall 6161, and a second vertical hook wall 6161 corresponding to the first vertical hook wall 6161 is provided in the inner groove 625. Hook wall 6251, so the second vertical hook wall 6251 can block the first vertical hook wall 6161, so that the left end of the second inner joint 621 presses against the inner support mechanism 63, and the inner support mechanism 63 generates an inner support force to the right side on the second inner joint 621, thereby increasing the firm installation and fixation of the second inner joint 621 in the external cap 612, and the left end of the second inner joint 621 also has a circumferential tapered wall 6211 that presses against the inner support mechanism 63, so that it is easier to enter the external cap 612 through the circumferential tapered wall 6211.

[0057] Furthermore, in some embodiments of the present invention, a release groove group is further provided on the outer wall of the second inner joint 621. Here, the release groove group includes an inner strip groove 626 and a side release groove 627. Here, the inner strip groove 626 is located on the right side of the inner groove 625, and the side release groove 627 is located on one side of the notch groove 624. The inner groove 625 extends to communicate with the side release groove 627.

[0058] Therefore, when the second inner joint 621 needs to be taken out from the external cap 612, the second inner joint 621 can be further moved toward the inside of the external cap 612, and then the internal hook rod 616 can enter the inner strip groove 626 from the inner groove 625, and then the second inner joint 621 is rotated, so that the hook head body 6160 of the internal hook rod 616 moves along the inner strip groove 626 to the side release groove 627, and the side release groove 627 has a side rising wall 6271 extending toward the circumferential tapered conical wall 6211, so when the second inner joint 621 is pulled outward, the hook head body 6160 can move along the side rising wall 6271, so that the second inner joint 621 can be easily taken out from the external cap 612. Correspondingly, the connection can also be installed quickly and efficiently, which makes it convenient to remove the lower heating plate 41 for maintenance after the subsequent disassembly of the two.

[0059] Exemplary internal support mechanisms

[0060] like Figure 11As shown, further, some embodiments of the present invention provide a specific structure of the above-mentioned internal support mechanism 63, where the internal support mechanism 63 of the structure includes multiple internal support springs 631 and a support ring body 632. Multiple internal support springs 631 are evenly installed at the left end of the inner left connecting cavity 613, and the support ring body 632 is installed at the right end of the internal support spring 631, and the right side of the support ring body 632 has a circumferential tapered conical groove 633 corresponding to the circumferential tapered conical wall 6211, so when the second inner joint 621 presses against the support ring body 632, the circumferential tapered conical groove 633 enters the circumferential tapered conical groove 633, and the multiple internal support springs 631 generate an internal support force after being compressed, so that the inner groove 625 of the second inner joint 621 presses against the hook head body 6160 of the inner hook rod 616, thereby increasing the firm installation and fixing effect of the second inner joint 621 and the external cap 612.

[0061] Exemplary external support mechanisms

[0062] like Figure 11 As shown, further, some embodiments of the present invention also include an external support mechanism 64 in the second cooling joint part 62, where the external support mechanism 64 of the structure includes an external support sleeve 641, an external support flange 642, multiple support bars 643, multiple support cylinders 644, and multiple external support springs 645, wherein the outer support sleeve 641 is slidably mounted on the second inner joint 621, and the outer support flange 642 is mounted on the left end of the outer support sleeve 641, multiple support bars 643 are evenly mounted on the left end of the external seat ring 622, and multiple support cylinders 644 are evenly mounted on the right end of the outer support flange 642, and then the left end of the support bar 643 is slidably mounted in the right end of the support cylinder 644, and the external support spring 645 is mounted in the support cylinder 644 and abuts between the outer support flange 642 and the support bar 643, where a receiving cavity 6221 corresponding to the outer support sleeve 641 is opened at the left end of the external seat ring 622.

[0063] The outer support flange 642 is supported by the outer support spring 645, and the outer support flange 642 is pressed against the right end of the outer cap 612, so that the inner hook rod 616 in the outer cap 612 is also supported to the left. In this way, the hook head body 6160 further presses against the inner groove 625, thereby further enhancing the firm installation and fixing effect of the second inner joint 621 and the outer cap 612. In addition, when the second inner joint 621 needs to be removed from the inner and outer caps 612, the outer support flange 642 is pulled to the right, and the outer support flange 642 drives the outer support sleeve 641 to move to the right along the second inner joint 621, and the support tube 644 compresses the outer support spring 645, thereby facilitating the second inner joint 621 to enter the outer cap 612 and be removed. In addition, the outer support flange 642 in the outer support mechanism 64 presses against the right end of the external cap 612 to play a sealing effect to prevent water leakage.

[0064] Exemplary Stop Mechanisms

[0065] like Figure 13-14 As shown, further, in some embodiments of the present invention, a stopping mechanism 65 is further included in the second cooling joint portion 62, wherein the stopping mechanism 65 of the structure includes a stopping baffle 651, an inner stopping pull plate 652, and a plurality of stopping tension springs 653, wherein the inner stopping pull plate 652 and the plurality of stopping tension springs 653 are installed on the inner wall of the second inner joint 621, and the plurality of stopping tension springs 653 are located between the inner stopping pull plate 652 and the inner wall of the second inner joint 621, the stopping baffle 651 is movably provided on the right side of the inner groove 625, and the stopping baffle The inner end of 651 is connected to the left end of the inner stop pull plate 652. Here, multiple stop pull springs 653 pull the inner stop pull plate 652, so that the inner stop pull plate 652 is close to the inner wall of the second inner joint 621, so that the stop baffle 651 passes through the inner wall of the second inner joint 621 and extends to the right side of the inner groove 625. The stop baffle 651 blocks the hook head body 6160 of the inner hook rod 616, so as to prevent the first cooling joint part 61 and the second cooling joint part 62 from being stretched apart when the cooling water supply pressure is too high, causing cooling water leakage.

[0066] Exemplary drive mechanisms

[0067] like Figure 13-14As shown, further, in some embodiments of the present invention, the second cooling joint part 62 also includes a driving mechanism 66, where the driving mechanism 66 of this structure includes a screw body 661 and an inner driving rod 662, where a first driving cavity 6222 is opened in the outer seat ring 622, and a second driving cavity 6212 communicating with the first driving cavity 6222 is opened in the second inner joint 621, and the second driving cavity 6212 has a driving hole 6213 communicating with the inner wall of the second inner joint 621, and the second driving cavity 6212 is arranged along the length direction of the second inner joint 621, so that the screw body 661 is rotatably installed on the right side of the outer seat ring 622, and the screw body 661 extends to the inside of the first driving cavity 6222, and correspondingly, the above-mentioned inner driving rod 662 is movably installed in the second driving cavity 6212, and a screw nut 663 is provided on the screw body 661, and then the screw body 661 is rotated to drive the screw nut 663 to move along the screw body 661. The inner driving rod 662 is moved, and the inner driving rod 662 is also moved through the inner support rod 664. In this way, the inner driving rod 662 moves to the left in the second driving cavity 6212. A first driving block 665 is installed on the inner driving rod 662. Correspondingly, a second driving block 654 is provided on the inner stop plate 652. The first driving block 665 and the second driving block 654 are located in the driving hole 6213 and slide against each other. Therefore, the inner driving rod 662 drives the first driving block 665 to contact the second driving block 654 pushes against the first driving block 665, so that the first driving block 665 moves to the left relative to the second driving block 654, and then presses the second driving block 654 out from the driving hole 6213, so that the inner stop pull plate 652 drives the stop baffle 651 to shrink into the second inner joint 621 and no longer blocks the hook head body 6160, thereby facilitating the subsequent movement of the second inner joint 621 out of the external cap 612, and then facilitating the subsequent disassembly of the two and taking out the lower heating plate 41 for maintenance.

[0068] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0069] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0070] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the description and implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A formic acid vacuum welding equipment for semiconductor packaging, characterized in that: include: The main body of the vacuum welding equipment includes an equipment shell, in which a preheating chamber, a heating welding chamber, a cooling chamber, a formic acid source module and a vacuum source module are sequentially arranged, which are connected to the preheating chamber, the heating welding chamber and the cooling chamber, and a cooling source module is connected to the cooling chamber. The preheating chamber and the heating welding chamber are equipped with an upper heating component and a lower heating component, and the cooling chamber has a cooling component. The ends of the preheating chamber, the heating welding chamber and the cooling chamber are all equipped with sealing mechanisms. The cooling assembly includes a cooling plate, which is arranged on the second lifting mechanism. A cooling channel is arranged in the cooling plate, and an opening of the cooling channel is connected to the cooling source module through a cooling joint module. The cooling joint module includes a first cooling joint portion and a second cooling joint portion. The first cooling joint portion includes a first inner tube and an outer cap. The first inner tube is disposed at the left end of the outer cap and is connected to the opening of the cooling channel. The second cooling joint portion includes a second inner joint, an outer seat ring, and a second inner tube. The second inner joint is disposed at the left end of the outer seat ring and the second inner tube is disposed at the right end of the outer seat ring. The second inner tube is connected to the cooling water pipeline of the cooling source module, and the second inner joint is connected to the outer cap. The outer cap has an inner left connecting cavity, a middle connecting cavity, and two outer right connecting cavities from left to right. The inner left connecting cavity is provided with an inner support mechanism, and the outer right connecting cavity is provided with an inner hook rod. A notch groove and an inner groove are formed on the outer wall of the second inner joint, which correspond to the inner hook rod. The hook head of the inner hook rod has a first vertical hook wall, and the inner groove has a second vertical hook wall corresponding to the first vertical hook wall. The left end of the second inner joint also has a circumferentially tapered wall that abuts against the inner support mechanism. The outer wall of the second inner joint also has a release groove group, which includes an inner strip groove and a side release groove. The inner strip groove is located on the right side of the inner groove, and the side release groove is located on one side of the notch groove. The inner groove extends to communicate with the side release groove. The side relief groove is provided with a side rising wall extending toward the circumferentially contracted conical wall, and the hook body moves along the side rising wall.

2. A formic acid vacuum welding equipment for semiconductor packaging according to claim 1, characterized in that: An upper cover plate is provided in the preheating chamber and the heating welding chamber. An upper heating component is arranged in the upper cover plate, and a temperature measuring element is also arranged in the upper cover plate.

3. A formic acid vacuum welding equipment for semiconductor packaging according to claim 2, characterized in that: The upper heating assembly includes multiple upper heating elements, which are evenly distributed at the bottom of the upper cover. The upper heating element includes a fixed seat, a heating lamp tube, and a fixed clamp frame. The fixed clamp frame is connected to the upper cover through the fixed seat. The heating lamp tube is arranged in the fixed clamp frame, and an adjustment rod is also arranged in the fixed clamp frame. The adjustment rod is located above the heating lamp tube.

4. A formic acid vacuum welding equipment for semiconductor packaging according to claim 3, characterized in that: The fixed clamp frame includes an inverted U-shaped frame and two arc-shaped clamps. The two arc-shaped clamps are relatively arranged at the lower end of the inverted U-shaped frame. The heating lamp is arranged in the two arc-shaped clamps. The adjustment rod is passed through the inverted U-shaped frame.

5. A formic acid vacuum welding equipment for semiconductor packaging according to claim 1, characterized in that: The preheating chamber and the heating welding chamber are respectively provided with an internal transport mechanism, which includes two transport racks, which are located on both sides of the lower heating assembly. The transport racks include a transport support plate and multiple transport wheel groups. The transport support plate is located on one side of the lower heating assembly, and the multiple transport wheel groups are on the transport support plate.

6. A formic acid vacuum welding equipment for semiconductor packaging according to claim 5, characterized in that: The transport wheel group includes an outer driving wheel and an inner transport wheel. The outer driving wheel and the inner transport wheel are located on both sides of the transport support plate, and there is an inner shaft rod between the outer driving wheel and the inner transport wheel. The inner shaft rod is passed through the transport support plate. An outer cover plate is also provided on the outer side of the transport support plate. Multiple outer driving wheels are located in the outer cover plate, and the multiple outer driving wheels are rotatably connected through a sprocket.

7. A formic acid vacuum welding equipment for semiconductor packaging according to claim 5, characterized in that: The transport support plate is also equipped with multiple guide columns and two anti-dislocation plates. The multiple guide columns are evenly distributed on the upper end of the transport support plate. The two anti-dislocation plates are respectively close to the ends of the transport support plate, and the upper ends of the anti-dislocation plates have transverse stops.

8. A formic acid vacuum welding equipment for semiconductor packaging according to claim 1, characterized in that: The lower heating assembly includes a lower heating plate. A first lifting mechanism is also provided below the working chamber. The first lifting mechanism is used to lift the lower heating plate. A heating wire is provided in the lower heating plate.

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