Digital control method and system for uniform deposition of multi-component alloy electroplated layer

Abstract

The invention discloses a digital control method and system for uniform deposition of a multi-component alloy electroplated coating, and belongs to the technical field of hardware electroplating. The digital control method specifically comprises the steps that hardware to be electroplated is selected and subjected to primary treatment; according to specific multi-component alloy electroplating formula requirements, the electroplating liquid is accurately prepared, so that the quality and the performance of an electroplated layer are guaranteed; the prepared electroplating liquid is injected into an electroplating bath, then a temperature control system of the electroplating bath is started, and the temperature of the electroplating liquid is maintained within a preset range through accurate temperature control, so that the stability of the electroplating process and the uniformity of the quality of an electroplated layer are ensured; the electroplating efficiency of the hardware with the complex shape and the quality of an electroplated layer are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of hardware electroplating, and in particular to a digital control method and system for uniform deposition of a multi-element alloy electroplating layer. Background Art

[0002] In the production process of hardware products, electroplating is a crucial surface treatment process, which can improve the corrosion resistance, wear resistance and appearance of hardware. However, when faced with complex-shaped hardware, such as those with deep holes, grooves, sharp corners and other structures, it is difficult to achieve uniform deposition of multi-element alloy electroplating layers. Traditional electroplating processes often rely on experience, and it is difficult to accurately control electroplating parameters, resulting in uneven coating thickness. In complex-shaped parts, the coating is prone to be too thin or even leaking, which seriously affects the quality and service life of hardware. With the continuous improvement of industrial production requirements for hardware quality, there is an urgent need for a precise and efficient digital control method to solve this problem.

[0003] For example, a Chinese patent with the authorization announcement number CN103952740B discloses a method for preparing a cerium oxide buffer layer by electrochemical deposition, including: preparing an electroplating solution, adjusting the pH value of the electroplating solution to 6-8; placing a nickel-tungsten alloy substrate in the electroplating solution as a cathode, and a graphite sheet as an anode, electroplating the nickel-tungsten alloy substrate to generate a cerium oxide electroplating layer on its surface; placing the nickel-tungsten alloy substrate after the electroplating treatment in a tube furnace for annealing treatment, and obtaining a layer of cerium oxide buffer layer with c-axis orientation on its surface. This technical solution induces and controls the nucleation and growth process of cerium oxide on the nickel-tungsten alloy substrate through an electrochemical deposition process, and uses a lower temperature for annealing treatment, so as to obtain a high-quality cerium oxide buffer layer with c-axis orientation and no surface cracks, and this method can completely avoid oxidation of the metal substrate without the need for a reducing atmosphere, and has the advantages of low cost and suitability for large-scale production applications.

[0004] The above existing technologies have the following problems: the application scope is relatively narrow, and they are mainly suitable for occasions requiring specific crystal structures and properties; there is a lack of digital control and real-time monitoring optimization mechanism during the electroplating process, which leads to certain challenges in the quality stability and uniformity of the electroplated layer. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention proposes a digital control method and system for uniform deposition of a multi-element alloy electroplating layer, wherein hardware to be electroplated is selected and subjected to preliminary treatment; the electroplating solution is accurately prepared according to the specific multi-element alloy electroplating formula requirements to ensure the quality and performance of the electroplating layer; the prepared electroplating solution is injected into an electroplating tank, and then the temperature control system of the electroplating tank is started, and the temperature of the electroplating solution is maintained within a preset range through precise temperature control to ensure the stability of the electroplating process and the uniformity of the quality of the electroplating layer; the present invention improves the efficiency of electroplating of hardware with complex shapes and the quality of the electroplating layer.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A digital control method for uniform deposition of a multi-element alloy electroplating layer, comprising:

[0008] Step S1: Select the hardware to be electroplated and perform preliminary treatment. At the same time, prepare the electroplating solution according to the requirements of the multi-element alloy electroplating formula, inject the prepared electroplating solution into the electroplating tank, and start the temperature control system of the electroplating tank to control the temperature of the electroplating solution within a preset range;

[0009] Step S2: Scan the hardware using a 3D scanning method to obtain 3D model data of the hardware, and transmit the 3D model data of the hardware to the electroplating simulation software for finite element analysis. According to the finite element analysis results, construct an electroplating process model and determine the core parameters and conditions in the electroplating process;

[0010] Step S3: Hang the pretreated hardware at the cathode position in the electroplating tank. During the electroplating process, use sensors to monitor the core parameters of the electroplating process in real time, and use intelligent optimization algorithms to optimize the core parameters. The optimized core parameters are transmitted to the host computer. The monitoring software in the host computer visualizes the optimized core parameters and displays the real-time status of the electroplating process in the form of dynamic charts.

[0011] Step S4: After the electroplating reaches the predetermined electroplating completion time, the power is automatically turned off and the hardware is taken out, and the taken out hardware is post-processed. At the same time, the quality of the coating is sampled and tested.

[0012] Specifically, the specific steps of step S2 include:

[0013] S2.1: Perform an all-round scan of the hardware to obtain the 3D point cloud data of the hardware surface, and splice the scanned 3D point cloud data to generate complete 3D model data of the hardware;

[0014] S2.2: Import the three-dimensional model data of the hardware into the electroplating simulation software, and set the electroplating parameters in the electroplating process according to the electroplating solution configured in step S1 and the material and shape of the hardware, wherein the electroplating parameters include the composition of the electroplating solution, the current density range and the electroplating time;

[0015] S2.3: Based on the electroplating parameters and the three-dimensional model data of the hardware, use the finite element analysis method to simulate the electroplating process, obtain the current density distribution and the thickness distribution of the electroplating layer during the electroplating process, and analyze the simulation results to identify potential problems in the current density distribution and the thickness distribution of the electroplating layer;

[0016] S2.4: Based on the finite element analysis results, construct an electroplating process model, and determine the core parameters and conditions in the electroplating process by analyzing the current density distribution and electroplating layer thickness distribution in the electroplating process model.

[0017] Specifically, the specific steps of S2.3 include:

[0018] S2.31: Obtain electroplating parameters and hardware 3D model data, and at the same time, open the finite element analysis software to create a new electroplating simulation project;

[0019] S2.32: Import the hardware 3D model data into the finite element analysis software to generate the hardware 3D model, and mesh the hardware 3D model to generate a meshed hardware 3D model;

[0020] S2.33: According to the characteristics of the electroplating process, set the time step and convergence criteria for the solution, combine the electroplating parameters, use the finite element analysis software to simulate the electroplating process of the meshed hardware 3D model, and monitor the progress and convergence of the simulation during the simulation process;

[0021] If convergence problems or anomalies occur during the simulation, adjust the solution parameters or meshing based on the monitoring results and rerun the simulation;

[0022] S2.34: After the simulation is completed, the current density distribution and the thickness distribution data of the electroplating process are extracted, and the simulation results are analyzed using visualization tools to generate the current density and plating thickness The distribution diagram is shown in Figure 2, where J represents the current density, I represents the current, S represents the electroplating area, d represents the thickness of the electroplating layer, c represents the electrochemical equivalent, t represents the electroplating time, and r represents the metal density of the electroplating layer. represents the fitting function, T represents the temperature of the plating solution, pH represents the pH value of the plating solution, add represents the concentration of the organic additive, is the cathode current density, Indicates electroplating efficiency;

[0023] S2.35: Identify potential problems in the current density distribution and the electroplating layer thickness distribution according to the distribution diagram, and adjust the electroplating parameters according to the identification results, wherein the potential problems include burning and uneven electroplating layer thickness.

[0024] Specifically, the specific steps of S2.4 include:

[0025] S2.41: Export the results of current density distribution and electroplating layer thickness distribution from the finite element analysis software, and analyze the exported results of current density distribution and electroplating layer thickness distribution to identify the distribution characteristics of current density and electroplating layer thickness;

[0026] S2.42: Based on the finite element analysis results, use mathematical modeling methods to construct an electroplating process model;

[0027] S2.43: Compare the constructed electroplating process model with the finite element analysis results, and adjust the electroplating process model according to the comparison results until the electroplating process model and the finite element analysis results are consistent in key indicators;

[0028] S2.44: Use simulation software to simulate the electroplating process using a validated electroplating process model as input, and determine the core parameters and conditions of the electroplating process based on the simulation results.

[0029] Specifically, the specific steps of step S3 include:

[0030] S3.1: Hang the pretreated hardware at the cathode position in the electroplating tank, and install sensors in the electroplating tank to monitor the core parameters of the electroplating process in real time, including pH value, conductivity, temperature, heavy metal ion concentration, and organic additive concentration;

[0031] S3.2: Optimize the core parameters using genetic algorithm according to the electroplating process requirements and the core parameters monitored by the sensor;

[0032] S3.3: transmitting the optimized core parameters to the control system in the electroplating tank, and the control system adjusts the conditions of the electroplating process according to the received core parameters;

[0033] S3.4: Start the monitoring software pre-installed in the host computer to monitor the data of the electroplating process in real time, wherein the monitoring software is used to receive, process and visualize the real-time data of the electroplating process.

[0034] Specifically, the specific steps of step S4 include:

[0035] S4.1: Before the start of electroplating, set the electroplating completion time according to the electroplating process requirements;

[0036] S4.2: After the electroplating equipment is started, the built-in timing function of the electroplating equipment monitors the time of the electroplating process in real time. When the electroplating time reaches the electroplating completion time, the electroplating equipment automatically cuts off the power and stops the electroplating process;

[0037] S4.3: After the electroplating is stopped, the hardware is taken out from the electroplating tank using a hook, and the taken out hardware is placed in a cleaning solution, and the residual electroplating solution and impurities on the surface of the hardware are removed using the cleaning solution, and the cleaned hardware is dried;

[0038] S4.4: Randomly select a certain amount of hardware samples from the batch of electroplated hardware according to the sampling standards for quality inspection, and conduct appearance inspection on the sampled hardware samples. At the same time, use a thickness gauge to measure the thickness of the coating, and use the scratch method to test the bonding strength between the coating and the base metal;

[0039] S4.5: Record quality inspection data and perform data analysis.

[0040] A digital control system for uniform deposition of multi-element alloy electroplating layers, comprising: a pre-processing module, an electroplating solution preparation module, an electroplating simulation module, an electroplating process control module, and a post-processing module;

[0041] The pre-treatment module is used to select the hardware to be electroplated and perform preliminary treatment;

[0042] The electroplating solution preparation module is used to prepare and control the temperature of the electroplating solution according to the multi-element alloy electroplating formula requirements;

[0043] The electroplating simulation module is used to perform three-dimensional scanning on the hardware, obtain the three-dimensional model data of the hardware, and perform finite element analysis through electroplating simulation software to determine the core parameters and conditions of the electroplating process;

[0044] The electroplating process control module is used to control and monitor the electroplating process in real time;

[0045] The post-processing module is used to remove the hardware, perform post-processing and perform sampling inspection on the quality of the coating after the electroplating is completed.

[0046] Specifically, the electroplating simulation module includes: a three-dimensional scanning unit, a data transmission unit, a finite element analysis unit, and a model building unit;

[0047] The three-dimensional scanning unit is used to use a three-dimensional scanner to perform an all-round scan on the hardware to obtain three-dimensional model data of the hardware;

[0048] The data transmission unit is used to transmit the hardware three-dimensional model data to the electroplating simulation software;

[0049] The finite element analysis unit is used to perform finite element analysis in the electroplating simulation software to simulate the current distribution and coating thickness changes during the electroplating process;

[0050] The model building unit is used to build an electroplating process model according to the finite element analysis results, and determine the core parameters and conditions in the electroplating process.

[0051] Specifically, the electroplating process control module includes: an electroplating parameter monitoring unit, an intelligent optimization algorithm unit, and a visualization unit;

[0052] The electroplating parameter monitoring unit is used to monitor the core parameters of the electroplating process in real time using sensors;

[0053] The intelligent optimization algorithm unit is used to optimize the core parameters monitored in real time, predict and adjust the problems existing in the electroplating process;

[0054] The visualization unit is used to transmit the optimized core parameters to the host computer, and perform visualization processing through the monitoring software to display the real-time status of the electroplating process in the form of dynamic charts.

[0055] A computer-readable storage medium stores computer instructions, which, when executed, execute the steps of a digital control method for uniform deposition of a multi-element alloy electroplating layer.

[0056] Compared with the prior art, the present invention has the following beneficial effects:

[0057] 1. The present invention proposes a digital control system for uniform deposition of multi-element alloy electroplating layers, and optimizes and improves the architecture, operating steps and processes. The system has the advantages of simple processes, low investment and operating costs, and low production work costs.

[0058] 2. The present invention proposes a digital control method for uniform deposition of a multi-element alloy electroplating layer. The entire electroplating process realizes automated and intelligent control, including temperature control of the electroplating solution, real-time monitoring and optimization of electroplating parameters, and visual display of the electroplating process. This not only improves the accuracy and controllability of the electroplating operation, but also reduces human operation errors. By accurately preparing the electroplating solution, optimizing the electroplating process model using three-dimensional scanning and finite element analysis, and real-time monitoring and optimization of electroplating parameters, it is ensured that complex-shaped hardware can obtain high-quality and uniform electroplating layers, thereby improving the electroplating efficiency and consistency of the coating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 A schematic diagram of a digital control method for uniform deposition of a multi-element alloy electroplating layer according to the present invention;

[0060] Figure 2This is a principle flow chart of a digital control method for uniform deposition of a multi-element alloy electroplating layer according to the present invention;

[0061] Figure 3 This is a diagram of the architecture of a digital control system for uniform deposition of a multi-element alloy electroplating layer according to the present invention. DETAILED DESCRIPTION

[0062] Example 1

[0063] See also Figure 1 and Figure 2 The present invention provides an embodiment: a digital control method for uniform deposition of a multi-element alloy electroplating layer, comprising the following steps:

[0064] Step S1: Select the hardware to be electroplated and perform preliminary treatment. At the same time, prepare the electroplating solution according to the requirements of the multi-element alloy electroplating formula, inject the prepared electroplating solution into the electroplating tank, and start the temperature control system of the electroplating tank to control the temperature of the electroplating solution within a preset range;

[0065] In the present invention, the hardware used is a hardware with a complex shape or an irregular shape.

[0066] Furthermore, the specific steps of step S1 include:

[0067] (1) Selection and preliminary processing of hardware:

[0068] Selection: Select hardware according to electroplating requirements and factors such as the shape and material of the hardware;

[0069] Preliminary treatment: Clean the hardware to remove impurities such as oil, scale, rust, etc. to ensure a good combination of the electroplating layer and the substrate. The cleaning method can be mechanical cleaning, chemical cleaning or ultrasonic cleaning;

[0070] (2) Preparation of electroplating solution:

[0071] According to the requirements of the multi-element alloy electroplating formula, accurately weigh the required electroplating solution components, and add the weighed electroplating solution components into the container in sequence, stirring while adding to ensure that the components are evenly mixed;

[0072] After preparation, the plating solution is tested, such as pH value, conductivity, etc., to ensure the quality of the plating solution;

[0073] (3) Injection of plating solution and start-up of temperature control system:

[0074] Pour the prepared plating solution into the plating tank, making sure that the plating solution covers the entire plating area;

[0075] Start the temperature control system of the electroplating tank and adjust the temperature of the electroplating solution according to a preset temperature range. The temperature control system can use heating, cooling or pressure control to ensure that the temperature of the electroplating solution is stable within the preset range.

[0076] Step S2: Scan the hardware using a 3D scanning method to obtain 3D model data of the hardware, and transmit the 3D model data of the hardware to the electroplating simulation software for finite element analysis. According to the finite element analysis results, construct an electroplating process model and determine the core parameters and conditions in the electroplating process;

[0077] Among them, the electroplating process model should include the relationship between the geometry of hardware, electroplating parameters and coating distribution; the electroplating simulation software predicts the quality and uniformity of the electroplating layer by simulating the distribution of current, potential and ion concentration during the electroplating process.

[0078] Step S3: Hang the pretreated hardware at the cathode position in the electroplating tank. During the electroplating process, use sensors to monitor the core parameters of the electroplating process in real time, and use intelligent optimization algorithms to optimize the core parameters. The optimized core parameters are transmitted to the host computer. The monitoring software in the host computer visualizes the optimized core parameters and displays the real-time status of the electroplating process in the form of dynamic charts.

[0079] Step S4: After the electroplating reaches the predetermined electroplating completion time, the power is automatically turned off and the hardware is taken out, and the taken out hardware is post-processed. At the same time, the quality of the coating is sampled and tested.

[0080] The specific steps of step S2 include:

[0081] S2.1: Perform an all-round scan of the hardware to obtain the 3D point cloud data of the hardware surface, and splice the scanned 3D point cloud data to generate complete 3D model data of the hardware;

[0082] S2.2: Import the three-dimensional model data of the hardware into the electroplating simulation software, and set the electroplating parameters in the electroplating process according to the electroplating solution configured in step S1 and the material and shape of the hardware, wherein the electroplating parameters include the current density range and the electroplating time;

[0083] Among them, the method of importing hardware 3D model data is: open the electroplating simulation software, find options such as import or file in the software interface, select the hardware 3D model data file for import, and ensure that the imported model data is complete and accurate, and consistent with the actual shape and size of the hardware.

[0084] The process of configuring the plating solution includes: finding the corresponding plating solution setting module in the plating simulation software according to the plating solution composition and concentration configured in step S1; inputting various components of the plating solution and their concentration values ​​to ensure consistency with the configuration in step S1; at the same time, if the plating simulation software provides a plating solution performance prediction or verification function, corresponding tests can be performed to confirm the applicability of the plating solution.

[0085] In addition, the specific steps for setting the current density range and plating time include:

[0086] (1) Find the setting options for current density and plating time in the electroplating simulation software;

[0087] (2) According to the material, shape and required electroplating effect of the hardware, the current density range should be reasonably set. Generally speaking, the current density will directly affect the electroplating rate and coating quality;

[0088] (3) Setting the electroplating time usually depends on factors such as the required coating thickness, electroplating rate, and penetration capacity of the electroplating solution. It should be noted that when setting these parameters, you can refer to the electroplating process manual or relevant standards to ensure the rationality and accuracy of the parameters.

[0089] S2.3: Based on the electroplating parameters and the three-dimensional model data of the hardware, use the finite element analysis method to simulate the electroplating process, obtain the current density distribution and the thickness distribution of the electroplating layer during the electroplating process, and analyze the simulation results to identify potential problems in the current density distribution and the thickness distribution of the electroplating layer;

[0090] S2.4: Based on the finite element analysis results, construct an electroplating process model, and determine the core parameters and conditions in the electroplating process by analyzing the current density distribution and electroplating layer thickness distribution in the electroplating process model.

[0091] The specific steps of S2.3 include:

[0092] S2.31: Obtain electroplating parameters and hardware 3D model data, and at the same time, open the finite element analysis software to create a new electroplating simulation project;

[0093] S2.32: Import the hardware 3D model data into the finite element analysis software to generate the hardware 3D model, and mesh the hardware 3D model to generate a meshed hardware 3D model;

[0094] Furthermore, the specific steps of S2.32 include:

[0095] (1) Modeling in external software: Since finite element analysis software does not have modeling functions, the 3D model of hardware is usually created in professional 3D modeling software such as Pro / E and Creo, and the built 3D model of hardware is exported to a file format that can be recognized by the finite element analysis software, such as STEP, STL, etc.;

[0096] (2) Import into finite element analysis software: Open the finite element analysis software, find the import function in the software, and import the externally created 3D model file into the software;

[0097] (3) Generate a 3D model of hardware: After confirming that the imported model is correct in the software, generate a 3D model of the hardware for finite element analysis;

[0098] (4) Enter the DesignModeler interface in the finite element analysis software, set the mesh properties, including the shape and size of the unit, and use the mapped meshing method to mesh the 3D model of the hardware;

[0099] (5) After the division is completed, check the mesh quality.

[0100] The specific process of meshing the hardware 3D model using the mapped meshing method includes:

[0101] (1) Obtain a 3D model of a hardware part with a complex shape, identify irregular areas and features in the 3D model of the hardware part, determine the area that needs to be cut, and define the position and shape of the cutting surface;

[0102] (2) Use the cutting tool in the 3D modeling software to cut the model along the defined cutting plane. After cutting, check and clean the cutting edges to ensure there are no extra debris or irregular shapes.

[0103] (3) In the three-dimensional model of the cut hardware, identify the parts that can be re-overlapped or combined, and use the overlap or combination tools in the three-dimensional modeling software to re-overlap or combine the cut parts to form a regular shape, obtain the three-dimensional model of the overlapped hardware, and ensure that the overlap interface has a smooth transition without gaps or overlaps;

[0104] (4) Smoothing the 3D model of the overlapped hardware to reduce the irregularity of the shape, and adjusting the size and proportion of the 3D model of the overlapped hardware as needed to make it more consistent with the requirements of a regular shape;

[0105] (5) Use the verification tool in the 3D modeling software to check whether the 3D model of the hardware after overlap meets the standard of regular shape, and export the converted regular shape model into a file format that can be recognized by the finite element analysis software;

[0106] (6) Import the exported 3D model of the overlapped hardware into the finite element analysis software and prepare for mapping mesh division;

[0107] (7) In the finite element analysis software, set the parameters for mapping mesh division, such as unit size and shape, and automatically generate the mapping mesh based on the set parameters and the specified area;

[0108] (8) Check the quality of the generated mesh. If the quality of the generated mesh does not meet the requirements, the mesh can be optimized and adjusted, including modifying the mesh size, shape and other properties, or re-specifying the partition area for optimization.

[0109] S2.33: According to the characteristics of the electroplating process, set the time step and convergence criteria for the solution, combine the electroplating parameters, use the finite element analysis software to simulate the electroplating process of the meshed hardware 3D model, and monitor the progress and convergence of the simulation during the simulation process;

[0110] If convergence problems or anomalies occur during the simulation, adjust the solution parameters or meshing based on the monitoring results and rerun the simulation;

[0111] Furthermore, the specific steps of S2.33 include:

[0112] (1) Analyze the movement of ions in the electroplating solution, the electrode reaction kinetics, and the growth process of the electroplating layer, and consider factors such as current distribution, coating thickness, and electroplating efficiency during the electroplating process;

[0113] (2) Set an appropriate time step according to the speed of the electroplating process and the required simulation accuracy. In the finite element analysis software, adjust the time step by setting parameters;

[0114] (3) Select the displacement convergence criterion and set the convergence threshold according to the characteristics of the electroplating simulation ;

[0115] (4) Input the electroplating parameters in the electroplating process, such as current density range, electroplating solution composition, electroplating time, etc., into the finite element analysis software. These electroplating parameters serve as input conditions in the simulation process and affect the results of the electroplating simulation;

[0116] (5) Obtain the three-dimensional model of the hardware after overlap and import it into the finite element analysis software;

[0117] (6) In the finite element analysis software, set the parameters and conditions of the electroplating simulation;

[0118] (7) Start the simulation process and observe the changes in current distribution, coating thickness, etc. during the electroplating process;

[0119] (8) During the simulation process, monitor the progress and convergence of the simulation in real time. If convergence difficulties or errors occur during the simulation process, adjust the time step, convergence criterion or electroplating parameters in time to ensure that the simulation process can proceed smoothly and obtain accurate results.

[0120] S2.34: After the simulation is completed, the current density distribution and the thickness distribution data of the electroplating process are extracted, and the simulation results are analyzed using visualization tools to generate the current density and plating thickness The distribution diagram is shown in Figure 2, where J represents the current density, I represents the current, S represents the electroplating area, d represents the thickness of the electroplating layer, c represents the electrochemical equivalent, t represents the electroplating time, and r represents the metal density of the electroplating layer. represents the fitting function, T represents the temperature of the plating solution, pH represents the pH value of the plating solution, add represents the concentration of the organic additive, is the cathode current density, Indicates electroplating efficiency;

[0121] Furthermore, the specific steps of S2.34 include:

[0122] (1) Use finite element analysis software to open the result file after the electroplating simulation is completed, and locate the relevant data of current density distribution and electroplating layer thickness distribution in the result file;

[0123] (2) Extract the data of current density distribution and electroplating layer thickness distribution from the result file, preprocess the extracted data, and map them onto the 3D model of the hardware so that the distribution of current density and electroplating layer thickness can be accurately displayed in the visualization tool;

[0124] (3) Import the preprocessed data in (2) into the visualization tool and set the visualization parameters, such as color mapping, legend, title, and coordinate axis;

[0125] (4) Use the visualization tool to generate the distribution map of current density and electroplating layer thickness, and save the generated distribution map to the specified folder;

[0126] (5) Observe the distribution diagram, analyze the distribution of current density and electroplating layer thickness, and write an electroplating simulation report based on the analysis results of the distribution diagram, including the simulation process, result analysis, and optimization suggestions.

[0127] S2.35: Identify potential problems in the current density distribution and the electroplating layer thickness distribution according to the distribution diagram, and adjust the electroplating parameters according to the identification results. The potential problems include burning caused by excessive current density and uneven electroplating layer thickness.

[0128] The specific steps of S2.4 include:

[0129] S2.41: Export the results of current density distribution and electroplating layer thickness distribution from the finite element analysis software, and analyze the exported results of current density distribution and electroplating layer thickness distribution to identify the distribution characteristics of current density and electroplating layer thickness;

[0130] S2.42: Based on the finite element analysis results, use mathematical modeling methods to construct an electroplating process model;

[0131] Furthermore, the specific process of constructing the electroplating process model includes:

[0132] (1) Determine key indicators such as thickness, uniformity, and quality of the electroplated layer, analyze the physical and chemical changes during the electroplating process, and the factors that may affect the electroplating effect;

[0133] (2) Based on the electroplating principle, combined with factors such as the composition of the electroplating solution, current distribution, temperature, and pH value, the Faraday's law equation describing the electroplating process is established. The Faraday's law equation is a prior art in the art and is not an inventive solution of the present application, and is not described in detail herein.

[0134] (3) Use finite element analysis software to simulate the electroplating process, set parameters such as the electroplating tank, anode, cathode, electroplating solution, and boundary conditions such as current distribution and temperature distribution;

[0135] (4) Through finite element analysis, the distribution of key parameters such as current density, potential distribution, and coating thickness during the electroplating process is obtained, and the electroplating process model is obtained;

[0136] (5) Adjust the parameters and Faraday's law equation in the electroplating process model based on the finite element analysis results;

[0137] (6) using the adjusted electroplating process model to predict the electroplating process;

[0138] (7) Based on the prediction results, adjust the electroplating process parameters, such as current density, electroplating time, temperature, etc., to optimize the electroplating effect.

[0139] S2.43: Compare the constructed electroplating process model with the finite element analysis results, and adjust the electroplating process model according to the comparison results until the electroplating process model and the finite element analysis results are consistent in key indicators;

[0140] Furthermore, the specific steps of S2.43 include:

[0141] (1) Clarify the key indicators of the electroplating process, such as coating thickness, uniformity, current efficiency, and electroplating rate, and determine the calculation method or extraction method of these indicators in the electroplating process model and finite element analysis results;

[0142] (2) Obtain key indicator data from the finite element analysis results and the electroplating process model to calculate the corresponding key indicators such as coating thickness and current efficiency;

[0143] (3) Compare the results of the electroplating process model with the finite element analysis results, analyze the differences between the two, evaluate the accuracy of the electroplating process model in key indicators, and determine whether the electroplating process model needs to be adjusted;

[0144] (4) According to the comparison results, the parameters and Faraday's law equation in the electroplating process model are adjusted, including changing the conductivity of the electroplating solution, adjusting the distribution of current density, and modifying the coating growth rate formula;

[0145] (5) Repeat steps (2) to (5) until the electroplating process model and the finite element analysis results are consistent with each other in key indicators or meet the predetermined error range;

[0146] (6) Use experimental data to verify the optimized electroplating process model to ensure its accuracy in the actual electroplating process.

[0147] S2.44: Use simulation software to simulate the electroplating process using a validated electroplating process model as input, and determine the core parameters and conditions of the electroplating process based on the simulation results.

[0148] The specific steps of step S3 include:

[0149] S3.1: Hang the pretreated hardware at the cathode position in the electroplating tank, and install sensors in the electroplating tank to monitor the core parameters of the electroplating process in real time, including pH value, conductivity, temperature, heavy metal ion concentration, and organic additive concentration;

[0150] S3.2: According to the electroplating process requirements and the core parameters monitored by the sensor, the core parameters are optimized using a genetic algorithm, wherein the genetic algorithm is a prior art in this field and is not an inventive solution of the present application, and will not be described in detail here;

[0151] S3.3: transmitting the optimized core parameters to the control system in the electroplating tank, and the control system adjusts the conditions of the electroplating process according to the received core parameters;

[0152] It should be noted that when the control system adjusts the conditions in the electroplating process according to the received core parameters, it achieves precise control of the electroplating conditions by adjusting the power output, heating / cooling system, agitator and other equipment. Moreover, the working conditions in the electroplating tank include current density, electroplating time, and temperature control.

[0153] S3.4: Start the monitoring software pre-installed in the host computer to monitor the data of the electroplating process in real time, wherein the monitoring software is used to receive, process and visualize the real-time data of the electroplating process.

[0154] The specific steps of step S4 include:

[0155] S4.1: Before the start of electroplating, set the electroplating completion time according to the electroplating process requirements;

[0156] S4.2: After the electroplating equipment is started, the built-in timing function of the electroplating equipment monitors the time of the electroplating process in real time. When the electroplating time reaches the electroplating completion time, the electroplating equipment automatically cuts off the power and stops the electroplating process;

[0157] S4.3: After the electroplating is stopped, the hardware is taken out from the electroplating tank using a hook, and the taken out hardware is immediately placed in a cleaning solution, and the residual electroplating solution and impurities on the surface of the hardware are removed using the cleaning solution, and the cleaned hardware is dried;

[0158] S4.4: Randomly select a certain amount of hardware samples from the batch of electroplated hardware according to the sampling standards for quality inspection, and conduct appearance inspection on the sampled hardware samples. At the same time, use a thickness gauge to measure the thickness of the coating, and use the scratch method to test the bonding strength between the coating and the base metal;

[0159] S4.5: Record all quality inspection data and perform data analysis.

[0160] Example 2

[0161] See also Figure 3 Another embodiment provided by the present invention is a digital control system for uniform deposition of a multi-element alloy electroplating layer, comprising:

[0162] Pretreatment module, electroplating solution preparation module, electroplating simulation module, electroplating process control module, post-processing module;

[0163] The pre-treatment module is used to select the hardware to be electroplated and perform preliminary treatment;

[0164] The electroplating solution preparation module is used to prepare the electroplating solution and control the temperature according to the requirements of the multi-element alloy electroplating formula;

[0165] The electroplating simulation module is used to perform 3D scanning on hardware, obtain 3D model data of hardware, and perform finite element analysis through electroplating simulation software to determine the core parameters and conditions of the electroplating process;

[0166] The electroplating process control module is used to control and monitor the electroplating process in real time, including real-time monitoring, optimization and visual display of electroplating parameters;

[0167] The post-processing module is used to remove, post-process and sample and test the quality of the coating on the hardware after electroplating.

[0168] The electroplating simulation module includes: 3D scanning unit, data transmission unit, finite element analysis unit, and model building unit;

[0169] A three-dimensional scanning unit is used to use a high-precision three-dimensional scanner to perform an all-round scan of the hardware and obtain the three-dimensional model data of the hardware;

[0170] Data transmission unit, used to transmit the hardware three-dimensional model data to the electroplating simulation software;

[0171] Finite element analysis unit, used to perform finite element analysis in electroplating simulation software, simulating current distribution and coating thickness changes during electroplating;

[0172] The model building unit is used to build an electroplating process model based on the finite element analysis results and determine the core parameters and conditions in the electroplating process.

[0173] The electroplating process control module includes: electroplating parameter monitoring unit, intelligent optimization algorithm unit, and visualization unit;

[0174] Electroplating parameter monitoring unit, which uses sensors to monitor the core parameters of the electroplating process in real time, such as temperature, pH value, conductivity, etc.;

[0175] Intelligent optimization algorithm unit, used to optimize the core parameters monitored in real time, predict and adjust the problems in the electroplating process;

[0176] The visualization unit is used to transmit the optimized core parameters to the host computer and perform visualization through the monitoring software to display the real-time status of the electroplating process in the form of dynamic charts.

[0177] The post-processing module includes: an electroplating end control unit, a post-processing unit, and a coating quality detection unit;

[0178] The electroplating end control unit is used to automatically cut off the power and start the removal device to remove the hardware from the electroplating tank after the electroplating reaches the predetermined electroplating completion time;

[0179] The post-processing unit is used to clean and dry the removed hardware to ensure the quality and stability of the coating;

[0180] The coating quality inspection unit is used to sample and inspect the coating quality to ensure that the coating meets the preset quality standards.

[0181] In summary, the pretreatment module, plating solution preparation module, electroplating simulation module, electroplating process control module, post-processing module and its units together constitute a complete digital control system for uniform deposition of multi-element alloy electroplating layers. The system ensures uniform deposition and high-quality output of the electroplating layer through intelligent pretreatment, precise plating solution preparation, high-precision three-dimensional scanning and simulation, real-time electroplating process control and monitoring, and strict post-processing and coating quality inspection.

[0182] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in the field may also change, modify, replace and modify the above-mentioned embodiments without departing from the purpose and scope of protection of the present invention, and all of these are within the protection of the present invention.

Claims

1. A digital control method for uniform deposition of a multi-element alloy electroplating layer, characterized in that: include: Step S1: Select the hardware to be electroplated and perform preliminary treatment. At the same time, prepare the electroplating solution according to the requirements of the multi-element alloy electroplating formula, inject the prepared electroplating solution into the electroplating tank, and start the temperature control system of the electroplating tank to control the temperature of the electroplating solution within a preset range; Step S2: Scan the hardware using a 3D scanning method to obtain 3D model data of the hardware, and transmit the 3D model data of the hardware to the electroplating simulation software for finite element analysis. According to the finite element analysis results, construct an electroplating process model and determine the core parameters and conditions in the electroplating process; Step S3: Hang the pretreated hardware at the cathode position in the electroplating tank. During the electroplating process, use sensors to monitor the core parameters of the electroplating process in real time, and use intelligent optimization algorithms to optimize the core parameters. The optimized core parameters are transmitted to the host computer. The monitoring software in the host computer visualizes the optimized core parameters and displays the real-time status of the electroplating process in the form of dynamic charts. Step S4: After the electroplating reaches the predetermined electroplating completion time, the power is automatically turned off and the hardware is taken out, and the taken out hardware is post-processed. At the same time, the quality of the coating is sampled and tested.

2. A digital control method for uniform deposition of a multi-element alloy electroplating layer as claimed in claim 1, characterized in that: The specific steps of step S2 include: S2.1: Perform an all-round scan of the hardware to obtain the 3D point cloud data of the hardware surface, and splice the scanned 3D point cloud data to generate complete 3D model data of the hardware; S2.2: Import the three-dimensional model data of the hardware into the electroplating simulation software, and set the electroplating parameters in the electroplating process according to the electroplating solution configured in step S1 and the material and shape of the hardware, wherein the electroplating parameters include the composition of the electroplating solution, the current density range and the electroplating time; S2.3: Based on the electroplating parameters and the three-dimensional model data of the hardware, use the finite element analysis method to simulate the electroplating process, obtain the current density distribution and the thickness distribution of the electroplating layer during the electroplating process, and analyze the simulation results to identify potential problems in the current density distribution and the thickness distribution of the electroplating layer; S2.4: Based on the finite element analysis results, construct an electroplating process model, and determine the core parameters and conditions in the electroplating process by analyzing the current density distribution and electroplating layer thickness distribution in the electroplating process model.

3. A digital control method for uniform deposition of a multi-element alloy electroplating layer as claimed in claim 2, characterized in that: The specific steps of S2.3 include: S2.31: Obtain electroplating parameters and hardware 3D model data, and at the same time, open the finite element analysis software to create a new electroplating simulation project; S2.32: Import the hardware 3D model data into the finite element analysis software to generate the hardware 3D model, and mesh the hardware 3D model to generate a meshed hardware 3D model; S2.33: According to the characteristics of the electroplating process, set the time step and convergence criteria for the solution, combine the electroplating parameters, use the finite element analysis software to simulate the electroplating process of the meshed hardware 3D model, and monitor the progress and convergence of the simulation during the simulation process; If convergence problems or anomalies occur during the simulation, adjust the solution parameters or meshing based on the monitoring results and rerun the simulation; S2.34: After the simulation is completed, the current density distribution and the electroplating layer thickness distribution data in the electroplating process are extracted, and the simulation results are analyzed using a visualization tool to generate a current density distribution map and an electroplating layer thickness distribution map; S2.35: Identify potential problems in the current density distribution and the electroplating layer thickness distribution according to the distribution diagram, and adjust the electroplating parameters according to the identification results, wherein the potential problems include burning and uneven thickness of the electroplating layer.

4. A digital control method for uniform deposition of a multi-element alloy electroplating layer as claimed in claim 3, characterized in that: The specific steps of S2.4 include: S2.41: Export the results of current density distribution and electroplating layer thickness distribution from the finite element analysis software, and analyze the exported results of current density distribution and electroplating layer thickness distribution to identify the distribution characteristics of current density and electroplating layer thickness; S2.42: Based on the finite element analysis results, use mathematical modeling methods to construct an electroplating process model; S2.43: Compare the constructed electroplating process model with the finite element analysis results, and adjust the electroplating process model according to the comparison results until the electroplating process model and the finite element analysis results are consistent in key indicators; S2.44: Use simulation software to simulate the electroplating process using a validated electroplating process model as input, and determine the core parameters and conditions of the electroplating process based on the simulation results.

5. A digital control method for uniform deposition of multi-element alloy electroplating layer as claimed in claim 4, characterized in that: The specific steps of step S3 include: S3.1: Hang the pretreated hardware at the cathode position in the electroplating tank, and install sensors in the electroplating tank to monitor the core parameters of the electroplating process in real time, including pH value, conductivity, temperature, heavy metal ion concentration, and organic additive concentration; S3.2: Optimize the core parameters using genetic algorithm according to the electroplating process requirements and the core parameters monitored by the sensor; S3.3: transmitting the optimized core parameters to the control system in the electroplating tank, and the control system adjusts the conditions of the electroplating process according to the received core parameters; S3.4: Start the monitoring software pre-installed in the host computer to monitor the data of the electroplating process in real time, wherein the monitoring software is used to receive, process and visualize the real-time data of the electroplating process.

6. A digital control method for uniform deposition of a multi-element alloy electroplating layer as claimed in claim 5, characterized in that: The specific steps of step S4 include: S4.1: Before the start of electroplating, set the electroplating completion time according to the electroplating process requirements; S4.2: After the electroplating equipment is started, the built-in timing function of the electroplating equipment monitors the time of the electroplating process in real time. When the electroplating time reaches the electroplating completion time, the electroplating equipment automatically cuts off the power and stops the electroplating process; S4.3: After the electroplating is stopped, the hardware is taken out from the electroplating tank using a hook, and the taken out hardware is placed in a cleaning solution, and the residual electroplating solution and impurities on the surface of the hardware are removed using the cleaning solution, and the cleaned hardware is dried; S4.4: Randomly select a certain amount of hardware samples from the batch of electroplated hardware according to the sampling standards for quality inspection, and conduct appearance inspection on the sampled hardware samples. At the same time, use a thickness gauge to measure the thickness of the coating, and use the scratch method to test the bonding strength between the coating and the base metal; S4.5: Record quality inspection data and perform data analysis.

7. A digital control system for uniform deposition of a multi-element alloy electroplating layer, which is used to implement a digital control method for uniform deposition of a multi-element alloy electroplating layer as claimed in any one of claims 1 to 6, characterized in that: include: Pretreatment module, electroplating solution preparation module, electroplating simulation module, electroplating process control module, post-processing module; The pre-treatment module is used to select the hardware to be electroplated and perform preliminary treatment; The electroplating solution preparation module is used to prepare and control the temperature of the electroplating solution according to the multi-element alloy electroplating formula requirements; The electroplating simulation module is used to perform three-dimensional scanning on the hardware, obtain the three-dimensional model data of the hardware, and perform finite element analysis through electroplating simulation software to determine the core parameters and conditions of the electroplating process; The electroplating process control module is used to control and monitor the electroplating process in real time; The post-processing module is used to remove the hardware, perform post-processing and perform sampling inspection on the quality of the coating after the electroplating is completed.

8. A digital control system for uniform deposition of multi-element alloy electroplating layers as claimed in claim 7, characterized in that: The electroplating simulation module includes: a three-dimensional scanning unit, a data transmission unit, a finite element analysis unit, and a model building unit; The three-dimensional scanning unit is used to use a three-dimensional scanner to perform an all-round scan on the hardware to obtain three-dimensional model data of the hardware; The data transmission unit is used to transmit the hardware three-dimensional model data to the electroplating simulation software; The finite element analysis unit is used to perform finite element analysis in the electroplating simulation software to simulate the current distribution and coating thickness changes during the electroplating process; The model building unit is used to build an electroplating process model according to the finite element analysis results, and determine the core parameters and conditions in the electroplating process.

9. A digital control system for uniform deposition of multi-element alloy electroplating layers as claimed in claim 8, characterized in that: The electroplating process control module includes: an electroplating parameter monitoring unit, an intelligent optimization algorithm unit, and a visualization unit; The electroplating parameter monitoring unit is used to monitor the core parameters of the electroplating process in real time using sensors; The intelligent optimization algorithm unit is used to optimize the core parameters monitored in real time, predict and adjust the problems existing in the electroplating process; The visualization unit is used to transmit the optimized core parameters to the host computer, and perform visualization processing through the monitoring software to display the real-time status of the electroplating process in the form of dynamic charts.

10. A computer-readable storage medium, characterized in that: Computer instructions are stored thereon, and when the computer instructions are executed, the steps of a digital control method for uniform deposition of a multi-element alloy electroplating layer as described in any one of claims 1-6 are executed.

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