Ejector pin device detection method

Abstract

The invention provides an ejector pin device detection method. The ejector pin device detection method comprises the steps that a to-be-detected ejector pin device is placed on a detection platform; acquiring a thimble top surface image of the thimble device through a top surface optical system, and determining arrangement defect information of thimbles of the thimble device based on the thimble top surface image; and acquiring a thimble side image of the thimble device through the side optical system, and determining size defect information of the thimble of the thimble device based on the thimble side image. According to the ejector pin device detection method, automatic detection of the ejector pin can be realized, so that the risks of missing detection, wrong detection, false detection and the like can be reduced, and poor chip quality caused by ejector pin defects is avoided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a method for detecting a ejector pin device. Background Art

[0002] As an important fixture in semiconductor packaging production, the quality of the ejector pin is directly related to the quality and production efficiency of the chip. The coplanarity, integrity, pin arrangement, and pin thickness of the ejector pins of the ejector pin device will affect the chip lifting and suction process, leading to chip breakage, peeling, surface scratches or offset problems. In order to ensure high-quality chip production, the ejector pins must be strictly tested to avoid poor chip quality caused by ejector pin problems and improve the overall production level.

[0003] However, the existing method for detecting ejector pins is to manually judge the quality of the ejector pins, which has a high risk of missed detection, wrong detection, and misdetection, and the detection results lack traceability. Summary of the invention

[0004] The embodiments of the present application at least provide a method for detecting an ejector pin device, which can realize automated detection of the ejector pin device, thereby reducing the risks of missed detection, wrong detection, and misdetection, and avoiding poor chip quality caused by ejector pin defects.

[0005] The present application provides a method for detecting an ejector device, the method comprising:

[0006] Place the ejector device to be tested on the testing platform;

[0007] Acquire a top surface image of the ejector pins of the ejector pin device through a top surface optical system, and determine arrangement defect information of the ejector pins of the ejector pin device based on the top surface image of the ejector pins;

[0008] A side image of the ejector pin of the ejector pin device is acquired through a side optical system, and size defect information of the ejector pin of the ejector pin device is determined based on the side image of the ejector pin.

[0009] In an optional embodiment, the top surface optical system includes a first telecentric light source and a first telecentric lens, and the first telecentric light source and the first telecentric lens are sequentially arranged along a first optical path; the step of acquiring the top surface image of the ejector pin of the ejector pin device through the top surface optical system includes:

[0010] Using the first telecentric light source to emit first parallel light toward the top surface of the ejector device;

[0011] The first telecentric lens is used to receive reflected light from the top surface of the ejector device to form an image of the top surface of the ejector.

[0012] In an optional implementation, the determining arrangement defect information of the ejector pins of the ejector device based on the ejector pin top surface image includes:

[0013] Based on the top surface image, a circular contour outside the ejector device is identified, and a center point position of the ejector device is determined based on the circular contour;

[0014] Based on the top surface image, the positions of all ejector pins in the ejector circular holes are identified to obtain the position of each ejector point;

[0015] The actual distances from the ejector point positions to the center point position are calculated respectively, and arrangement defect information of the ejector pins of the ejector device is determined according to the actual distances.

[0016] In an optional implementation, determining arrangement defect information of ejector pins of an ejector pin device according to the actual distance includes:

[0017] The actual distances are compared with the standard distances respectively. If the actual distances are inconsistent with the standard distances, it is determined that the ejector pin corresponding to the actual distance has deflection and / or fracture defects.

[0018] In an optional embodiment, the side optical system includes a second telecentric light source and a second telecentric lens, the second telecentric light source and the second telecentric lens are arranged relatively along a second optical path, and during detection, the ejector device is located in the second optical path and between the second telecentric light source and the second telecentric lens; the step of acquiring the ejector side image of the ejector device through the side optical system includes:

[0019] emitting a second parallel light toward the side of the ejector device using the second telecentric light source;

[0020] The second telecentric lens is used to receive the transmitted light from the side of the ejector device to form the ejector side image.

[0021] In an optional implementation, determining the size defect information of the ejector pin of the ejector device based on the ejector pin side image includes:

[0022] Based on the side image, identifying the ejector pin position and ejector pin contour;

[0023] Calculating the actual ejector position of each ejector pin based on the ejector pin profile, and determining the ejector pin missing information according to the actual ejector pin position of each ejector pin;

[0024] The actual ejector pin diameter and the actual ejector pin height of each ejector pin are calculated based on the ejector pin profile, and the ejector pin diameter and the flatness defect of the ejector pin are determined according to the actual ejector pin diameter and the actual ejector pin height of each ejector pin.

[0025] In an optional implementation manner, determining the ejector pin missing information according to the actual ejector pin position of each ejector pin includes:

[0026] The actual ejector position of each ejector pin is compared with the standard ejector position. If there is no corresponding ejector contour at the actual ejector position, it is determined that the ejector pin at this position is missing.

[0027] In an optional implementation, determining the ejector diameter defect of the ejector according to the actual ejector diameter of each ejector includes:

[0028] The actual ejector pin diameters are respectively compared with the standard ejector pin diameters. If the actual ejector pin diameters are inconsistent with the standard ejector pin diameters, it is determined that the ejector pin corresponding to the actual ejector pin diameter has an ejector pin diameter defect.

[0029] In an optional implementation, determining the ejector pin flatness defect of the ejector pin according to the actual ejector pin height of each ejector pin includes:

[0030] The actual flatness of the ejector pin is determined based on each actual ejector pin height, and the actual flatness is compared with a standard flatness. If the actual flatness is inconsistent with the standard flatness, it is determined that the ejector pin has an ejector pin flatness defect.

[0031] In an optional embodiment, the ejector device is provided with coding information, and the coding information is configured with ejector standard parameter information; the method further comprises:

[0032] The coding information of the ejector device is obtained by a scanner, and the ejector standard parameter information is determined according to the coding information, so as to judge whether the ejector of the ejector device has arrangement defects and size defects.

[0033] The above technical solution of the present application has the following beneficial technical effects:

[0034] The needle device detection method of the embodiment of the present application can first fix the ejector device by a carrier, then obtain the ejector pin top surface image and ejector pin side image of the ejector device by the top surface optical system and the side surface optical system respectively, and finally determine the defects of the ejector pin of the ejector device according to the ejector pin top surface image and the ejector pin side image. Compared with the method of manually judging the quality of the ejector pin in the prior art, the ejector device detection method can realize automatic detection of the ejector pin, thereby reducing the risks of missed detection, wrong detection, and misdetection, and avoiding poor chip quality caused by ejector pin defects.

[0035] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and are used together with the specification to illustrate the technical solutions of the present application. It should be understood that the following drawings only illustrate certain embodiments of the present application and should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can also be obtained based on these drawings without creative work.

[0037] Figure 1 A schematic structural diagram of an ejector device detection device provided in an embodiment of the present application is shown;

[0038] Figure 2 Shows Figure 1 Schematic diagram of the internal structure;

[0039] Figure 3 Shows Figure 2 A schematic diagram of the structure of the vehicle in FIG.

[0040] Figure 4 Shows Figure 3 A schematic diagram of the structure of the detection platform in FIG.

[0041] Figure 5 Shows Figure 3 Schematic diagram of the assembly of the detection platform and the fixed platform;

[0042] Figure 6 Shows Figure 2 Schematic diagram of the top optical system in FIG.

[0043] Figure 7 Shows Figure 2 Schematic diagram of the side optical system in;

[0044] Figure 8 Shows Figure 3 A schematic diagram of the structure of the ejector device;

[0045] Fig. 9 A schematic diagram of a process flow of ejector device detection provided by an embodiment of the present application is shown;

[0046] Reference numerals:

[0047] 1. Body; 11. Door; 2. Carrier; 21. Inspection platform; 211. Assembly slot; 212. Anti-fool baffle; 22. Fixed platform; 23. Screw; 24. Linear motor; 3. Top optical system; 31. First telecentric light source; 32. First telecentric lens; 33. 90° prism; 4. Side optical system; 41. Second telecentric light source; 42. Second telecentric lens; 43. Mechanism stand; 5. Ejector device; 51. Needle holder; 52. Ejector. DETAILED DESCRIPTION

[0048] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0049] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0050] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0051] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0052] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] As an important jig in the production of semiconductor packaging, the ejector pin device includes a pin holder with multiple mounting holes and ejector pins installed in each mounting hole. Factors such as the coplanarity, integrity, pin arrangement, and pin thickness of the ejector pin will affect the chip lifting and suction process, which will lead to problems such as chip breakage, peeling, surface scratches or offset. In order to ensure high-quality chip production, the ejector pins must be strictly inspected to avoid poor chip quality caused by ejector pin problems and improve the overall production level. However, the existing ejector pin device detection method is to manually judge the quality of the ejector pin, which has a high risk of missed detection, wrong detection, and false detection, and the detection results lack traceability.

[0054] To this end, an embodiment of the present application provides a device for detecting an ejector device, which can realize automated detection of the ejector device, thereby reducing the risks of missed detection, wrong detection, and misdetection.

[0055] refer to Figures 1 to 5 The ejector device detection device provided in the embodiment of the present application includes: a body 1 having a bin body, and a carrier 2 installed in the bin body, a top surface optical system 3, a side optical system 4 and a processor. The carrier 2 is used to install the ejector device 5. The top surface optical system 3 is used to obtain an ejector top surface image of the ejector device 5. The side optical system 4 is used to obtain an ejector side image of the ejector device 5. The processor is connected to the top surface optical system 3 and the side optical system 4 with electrical signals respectively, and is used to determine the actual parameters of the ejector of the ejector device 5 according to the ejector top surface image and the ejector side image, and determine whether the ejector 52 is qualified based on the comparison result of the actual parameters of the ejector and the standard parameters of the ejector, and the actual parameters of the ejector include the ejector flatness, ejector diameter and ejector position. In specific use, the ejector device detection device can first fix the ejector device 5 through the carrier 2, and then obtain the ejector top surface image and the ejector side image of the ejector device 5 through the top surface optical system 3 and the side surface optical system 4 respectively, and finally process the ejector top surface image and the ejector side image through the processor to determine whether the ejector 52 of the ejector device 5 is qualified. Compared with the method of manually determining the quality of the ejector 52 in the prior art, the ejector device detection device can realize automatic detection of the ejector 52, thereby reducing the risks of missed detection, wrong detection, and misdetection, and avoiding poor chip quality caused by defects in the ejector 52.

[0056] In some embodiments, the body 1 further has a door 11 connecting the chamber body to the outside, and the door 11 is closed during detection. Specifically, during the detection process, closing the door 11 can prevent external light from entering the chamber body and affecting the imaging effect of the top optical system 3 and the side optical system 4. Of course, before and after the detection, the door 11 is opened, and the ejector device 5 can be installed on the carrier 2, or the ejector device 5 can be removed from the carrier 2.

[0057] In some embodiments, the carrier 2 includes a detection platform 21, and the detection platform 21 is provided with an assembly groove 211, and the assembly groove 211 is used to insert the needle seat 51 of the ejector device 5. For example, the upper surface of the detection platform 21 is provided with an assembly groove 211, and the assembly groove 211 is a circular blind hole, and its inner diameter is consistent with the outer diameter of the needle seat 51 of the ejector device 5. During the detection process, the assembly groove 211 can allow the needle seat 51 of the ejector device 5 to be inserted therein, and limit the lateral movement of the ejector device 5. This arrangement can facilitate the fixing of the ejector device 5 on the carrier 2, which is conducive to improving the efficiency of the detection.

[0058] In some embodiments, the detection platform 21 is provided with an anti-fool baffle 212, which is arranged around the assembly groove 211. Specifically, during the installation of the ejector device 5, the anti-fool baffle 212 can guide the needle seat 51 of the ejector device 5 to move toward the direction close to the assembly groove 211 until the needle seat 51 of the ejector device 5 is inserted into the assembly groove 211. In this embodiment, the number of the anti-fool baffles 212 can be 3, and the 3 anti-fool baffles 212 are distributed at intervals along the circumference of the assembly groove 211.

[0059] In some embodiments, the carrier 2 further includes a fixed platform 22 and an adjustment component, wherein the fixed platform 22 is supported at the bottom of the detection platform 21, and the adjustment component is disposed between the fixed platform 22 and the detection platform 21, and the adjustment component is used to adjust the angle of the detection platform 21 relative to the fixed platform 22. In other words, the fixed platform 22 is used to carry the detection platform 21, and the adjustment component can be operated to adjust the horizontality of the detection platform 21, thereby adjusting the angle of the ejector pin 52 of the ejector pin device 5 relative to the horizontal plane, so that the angle of the ejector pin 52 can meet the imaging detection requirements of the top optical system 3 and the side optical system 4. For example, when the ejector pin 52 of the ejector pin device 5 is required to maintain a vertical state, the horizontality of the detection platform 21 can be adjusted by the adjustment component, so that the ejector pin 52 of the ejector pin device 5 tends to a vertical state.

[0060] In some embodiments, the adjustment assembly includes a plurality of screw rods 23, which are spaced apart along the circumference of the assembly slot 211, and the plurality of screw rods 23 are respectively passed through the fixed platform 22 and screwed with the fixed platform 22, and the plurality of screw rods 23 are adjusted to adjust the levelness of the detection platform 21 by adjusting their respective screw-in lengths. For example, during installation, the plurality of screw rods 23 pass through the detection platform 21 from top to bottom along the height direction and are screwed with the detection platform 21, and the lower ends of the plurality of screw rods 23 extend out of the bottom of the detection platform 21, so that the detection platform 21 can be supported on the fixed platform 22 by the screw rods 23 extending out of the bottom thereof. During use, by screwing each screw rod 23 to change the length of the screw rod 23 extending out of the bottom of the detection platform 21, the angle of the detection platform 21 relative to the fixed platform 22 can be changed, thereby adjusting the levelness of the detection platform 21.

[0061] In some embodiments, the carrier 2 further includes a moving component, the detection platform 21 is arranged on the moving component, the moving component is used to move the detection platform 21, the detection platform 21 has a first position and a second position relative to the top optical system 3 and the side optical system 4, in the first position, the ejector device 5 can be disassembled and assembled on the detection platform 21, in the second position, the ejector device 5 can be detected by the top optical system 3 and the side optical system 4. For example, the moving component can be a linear motor 24. When set, the detection platform 21 is arranged on a fixed platform 22, and the fixed platform 22 is fixed on the moving platform of the linear motor 24. When in use, the linear motor 24 controls its moving platform to move linearly, and can drive the detection platform 21 to move to the first position or the second position. In a specific implementation, the first position can be far away from the second position, so that the ejector device 5 can be easily disassembled and assembled, and the optical system can be avoided from being touched during the disassembly and assembly process, which may cause it to be displaced or damaged, thereby affecting the detection function.

[0062] In some embodiments, the top surface optical system 3 includes a first telecentric light source 31 and a first telecentric lens 32, which are arranged in sequence along the first optical path, and the first telecentric light source 31 is used to emit a first parallel light to the top surface of the ejector device 5 through the first telecentric lens 32, and the first telecentric lens 32 is used to receive the reflected light from the top surface of the ejector device 5 to form an ejector top surface image. For example, the first telecentric light source 31 and the first telecentric lens 32 are arranged in sequence from top to bottom along the height direction, and the first telecentric light source 31 is used to emit a first parallel light downward through the first telecentric lens 32, and the first parallel light is vertically irradiated to the top surface of the ejector device 5 and reflected by the top surface of the ejector device 5, and the reflected light is received by the first telecentric lens 32 to form an ejector top surface image. In this way, the top surface optical system 3 can obtain an ejector top surface image of the ejector device 5. It should be understood that in a specific implementation, the ejector top surface image can be captured by a camera and transmitted to a processor.

[0063] In some embodiments, the top surface optical system 3 further includes a 90° prism 33, the 90° prism 33 is located in the first optical path, and the 90° prism 33 is used to make the first parallel light reflect 90° and then emit it to the top surface of the ejector device 5. For example, the first telecentric light source 31, the first telecentric lens 32 and the 90° prism 33 are arranged in sequence along the horizontal direction, and the first telecentric light source 31 is used to emit the first parallel light in the horizontal direction through the first telecentric lens 32, and the first parallel light is reflected 90° by the 90° prism 33 and then vertically irradiated to the top surface of the ejector device 5, and then the first parallel light is reflected by the top surface of the ejector device 5 and returns to the original path, and is finally received by the first telecentric lens 32 to form an ejector top surface image of the ejector device 5. Such an arrangement can facilitate the flexible arrangement of the first telecentric light source 31 and the first telecentric lens 32, which is conducive to reducing the structural size of the device.

[0064] In some embodiments, the side optical system 4 includes a second telecentric light source 41 and a second telecentric lens 42, which are arranged relatively along the second optical path. During detection, the ejector device 5 is located in the second optical path and between the second telecentric light source 41 and the second telecentric lens 42. The second telecentric light source 41 is used to emit a second parallel light to the side of the ejector device 5, and the second telecentric lens 42 is used to receive the transmitted light from the side of the ejector device 5 to form an ejector side image. For example, the second telecentric light source 41 and the second telecentric lens 42 are arranged relatively along the horizontal direction. When the ejector device 5 is located between the second telecentric light source 41 and the second telecentric lens 42, the second telecentric light source 41 is used to emit a second parallel light in the horizontal direction. The second parallel light is horizontally irradiated to the side of the ejector device 5, and the light beam passing through the ejector 52 is formed into an ejector side image by the second telecentric lens 42. With this arrangement, the side optical system 4 can obtain an ejector side image of the ejector device 5. It should be understood that in a specific implementation, the ejector side image can be captured by a camera and transmitted to a processor.

[0065] In some embodiments, the second telecentric light source 41 is a bilateral telecentric light source, and the second telecentric lens 42 is a bilateral telecentric lens. That is, there are two second telecentric light sources 41 and two second telecentric lenses 42, respectively, and the two second telecentric light sources 41 and the two second telecentric lenses 42 are located in the same optical path, wherein the two second telecentric light sources 41 are arranged opposite to each other, and the two second telecentric lenses 42 are arranged opposite to each other, and the two telecentric light sources can provide almost completely parallel light from two opposite sides, and the two telecentric lenses can respectively receive the light emitted from opposite directions and respectively form side images of the ejector pin. This arrangement provides parallel optical paths and telecentric imaging from two different sides, which can not only improve the imaging quality, but also enhance the accuracy and reliability of the measurement.

[0066] In some embodiments, the side optical system 4 further includes a mechanism stand 43, the mechanism stand 43 has a first end and a second end opposite to each other, and the second telecentric light source 41 and the second telecentric lens 42 are fixed to the first end and the second end, respectively. In this way, the second telecentric light source 41 and the second telecentric lens 42 can be relatively fixed, thereby effectively reducing the influence of external vibration or mechanical movement on the optical path, and ensuring the imaging quality and measurement accuracy.

[0067] In some embodiments, the ejector device detection device further includes a display, which is disposed on the surface of the body 1 and is electrically connected to the processor for displaying the detection result, such as whether the detection is qualified or unqualified, so that the operator can take corresponding treatment measures according to the detection result. It should be understood that in a specific implementation, the display can be provided with an alarm function, such as a sound alarm function or an audible and visual alarm function, so that the display can alarm when the detection is unqualified, so as to remind the operator.

[0068] In some embodiments, the ejector device detection device further includes a memory, which is electrically connected to the processor and is used to store an ejector top surface image, an ejector side surface image, and related ejector actual parameters, so as to achieve traceability of detection information. It should be understood that in a specific implementation, both the memory and the processor can be components of the device control host.

[0069] In some embodiments, the ejector device detection apparatus further includes an input unit, which is electrically connected to the processor and is used to input standard ejector parameters of the ejector device 5, so that the processor can determine whether the ejector 52 is qualified based on the comparison result between the actual ejector parameters and the standard ejector parameters.

[0070] In some embodiments, the ejector device 5 may be provided with coding information, and the coding information is configured with ejector standard parameter information. The input unit may be a scanner, and before the ejector device 5 is installed on the carrier 2, the scanner may scan the coding information provided on the ejector device 5, and decode the coding information to obtain the ejector standard parameters of the ejector device 5 of this model. It should be understood that in a specific implementation, the scanner may be an embedded scanner or a handheld scanner.

[0071] The present application also provides a method for detecting an ejector device applicable to an ejector device detection device, the method comprising the following steps:

[0072] Step S100 , placing the ejector device 5 to be inspected on the inspection platform 21 .

[0073] Step S200 : acquiring an ejector pin top surface image of the ejector pin device 5 through the top surface optical system 3 , and determining arrangement defect information of the ejector pins 52 of the ejector pin device 5 based on the ejector pin top surface image.

[0074] Step S300 : acquiring a side image of the ejector pin of the ejector pin device 5 through the side optical system 4 , and determining size defect information of the ejector pin 52 of the ejector pin device 5 based on the side image of the ejector pin.

[0075] The needle device detection method can first fix the ejector device 5 by the carrier 2, then obtain the ejector pin top surface image and the ejector pin side surface image of the ejector device 5 by the top surface optical system 3 and the side surface optical system 4 respectively, and finally determine the defects of the ejector pin 52 of the ejector device 5 according to the ejector pin top surface image and the ejector pin side surface image. Compared with the method of manually judging the quality of the ejector pin 52 in the prior art, the ejector device detection method can realize the automatic detection of the ejector pin 52, thereby reducing the risks of missed detection, wrong detection, and misdetection, and avoiding the poor chip quality caused by the defects of the ejector pin 52.

[0076] In step S100, the ejector device 5 to be tested is placed on the testing platform 21, specifically, the ejector device 5 to be tested is placed in the assembly groove 211 on the testing platform 21. The assembly groove 211 may be a circular blind hole located on the upper surface of the testing platform 21, and its inner diameter is consistent with the outer diameter of the needle seat 51 of the ejector device 5, which not only facilitates the disassembly and assembly of the ejector device 5, but also prevents the ejector device 5 inserted therein from moving laterally.

[0077] In step S200, the top surface image of the ejector device 5 is obtained by the top surface optical system 3, which may specifically include:

[0078] Using the first telecentric light source 31 to emit a first parallel light to the top surface of the ejector device 5;

[0079] The first telecentric lens 32 is used to receive the reflected light from the top surface of the ejector device 5 to form an ejector top surface image.

[0080] The top surface optical system 3 includes a first telecentric light source 31 and a first telecentric lens 32, and the first telecentric light source 31 and the first telecentric lens 32 are sequentially arranged along the first optical path. For example, the first telecentric light source 31 and the first telecentric lens 32 can be sequentially arranged from top to bottom along the height direction, and the first telecentric light source 31 is used to emit the first parallel light downward through the first telecentric lens 32, and the first parallel light is vertically irradiated to the top surface of the ejector device 5 and reflected by the top surface of the ejector device 5, and the reflected light is received by the first telecentric lens 32 to form an ejector top surface image.

[0081] In step S200, the arrangement defect information of the ejector pins 52 of the ejector pin device 5 is determined based on the ejector pin top surface image, which may specifically include:

[0082] Based on the top surface image of the ejector pin, a circular contour outside the ejector pin device 5 (such as the contour of the upper surface of the needle seat 51 of the ejector pin device 5) is identified, and the center point position of the ejector pin device 5 is determined based on the circular contour;

[0083] Based on the ejector top surface image, the positions of all ejector pins 52 in the ejector circular holes (i.e., mounting holes) are identified to obtain the positions of each ejector point;

[0084] The actual distances from each ejector point position to the center point position are calculated respectively, and arrangement defect information of the ejector pins 52 of the ejector device 5 is determined according to the actual distances.

[0085] Wherein, determining the arrangement defect information of the ejector pins 52 of the ejector pin device 5 according to the actual distance may specifically include:

[0086] Each actual distance is compared with the standard distance respectively. If the actual distance is inconsistent with the standard distance, it is determined that the ejector pin 52 corresponding to the actual distance has a deflection and / or a break defect.

[0087] In step S300, the side image of the ejector device 5 is obtained by the side optical system 4, including:

[0088] Using the second telecentric light source 41 to emit a second parallel light toward the side of the ejector device 5;

[0089] The second telecentric lens 42 is used to receive the transmitted light from the side of the ejector device 5 to form an ejector side image.

[0090] The side optical system 4 may include a second telecentric light source 41 and a second telecentric lens 42, and the second telecentric light source 41 and the second telecentric lens 42 are arranged relatively along the second optical path. For example, the second telecentric light source 41 and the second telecentric lens 42 are arranged relatively along the horizontal direction. When the ejector device 5 is located between the second telecentric light source 41 and the second telecentric lens 42, the second telecentric light source 41 is used to emit a second parallel light in the horizontal direction, and the second parallel light is horizontally irradiated to the side of the ejector device 5, and the light beam passing through the ejector 52 is received by the second telecentric lens 42 to form an ejector side image.

[0091] In step S300, determining the size defect information of the ejector pin 52 of the ejector pin device 5 based on the ejector pin side image may specifically include:

[0092] Based on the side image of the ejector pin, the ejector pin position and outline are identified;

[0093] Calculate the actual ejector position of each ejector pin 52 based on the ejector pin profile, and determine ejector pin missing information according to the actual ejector pin position of each ejector pin 52;

[0094] The actual ejector pin diameter and the actual ejector pin height of each ejector pin 52 are calculated based on the ejector pin profile, and the ejector pin diameter and the flatness defect of the ejector pin 52 are determined according to the actual ejector pin diameter and the actual ejector pin height of each ejector pin 52 .

[0095] The ejector pin missing information is determined according to the actual ejector pin position of each ejector pin 52, which may specifically include:

[0096] The actual ejector position of each ejector pin 52 is compared with the standard ejector position. If there is no corresponding ejector contour at the actual ejector position, it is determined that the ejector pin 52 at this position is missing.

[0097] The method of determining the ejector diameter defect of the ejector pin 52 according to the actual ejector diameter of each ejector pin 52 may specifically include:

[0098] The actual ejector pin diameters are compared with the standard ejector pin diameters respectively. If the actual ejector pin diameters are inconsistent with the standard ejector pin diameters, it is determined that the ejector pin 52 corresponding to the actual ejector pin diameter has an ejector pin diameter defect.

[0099] The method of determining the ejector pin flatness defect of the ejector pin 52 according to the actual ejector pin height of each ejector pin 52 may specifically include:

[0100] The actual flatness of the ejector pin 52 is determined based on each actual ejector pin height, and the actual flatness is compared with the standard flatness. If the actual flatness is inconsistent with the standard flatness, it is determined that the ejector pin 52 has an ejector pin flatness defect.

[0101] In some embodiments, the ejector device detection method may further include the step of displaying the detection result on a display. For example, when the ejector 52 of the ejector device 5 has an arrangement defect or a size defect, the display shows that the detection is unqualified, and when the ejector 52 of the ejector device 5 does not have an arrangement defect or a size defect, the display shows that the detection is qualified. In this way, it is convenient for the operator to take corresponding treatment measures according to the detection results.

[0102] In some embodiments, the ejector device detection method may further include a step of storing detection information in a memory. For example, during the detection process, the ejector top surface image, the ejector side surface image, and related ejector actual parameters are stored in the memory. In this way, the traceability of the detection information can be easily achieved.

[0103] In some embodiments, the ejector device detection method may further include the step of acquiring standard parameters of ejector pins of the ejector device 5 through a scanner. For example, before the ejector device 5 is mounted on the detection platform 21, the coding information of the ejector device 5 is acquired through scanning with a scanner, and the standard parameter information of the ejector pins of the ejector device 5 is determined according to the coding information, such as decoding the coding information to acquire the standard parameter information of the ejector pins of the ejector device 5, so as to determine whether the ejector pins 52 of the ejector device 5 have arrangement defects and size defects.

[0104] One or more embodiments of this specification are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this specification should be included in the scope of protection of this application.

[0105] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for detecting an ejector device, characterized in that: The method comprises: Place the ejector device to be tested on the testing platform; Acquire a top surface image of the ejector pins of the ejector pin device through a top surface optical system, and determine arrangement defect information of the ejector pins of the ejector pin device based on the top surface image of the ejector pins; A side image of the ejector pin of the ejector pin device is acquired through a side optical system, and size defect information of the ejector pin of the ejector pin device is determined based on the side image of the ejector pin.

2. The method according to claim 1, characterized in that The top surface optical system includes a first telecentric light source and a first telecentric lens, which are sequentially arranged along a first optical path; the top surface image of the ejector pin of the ejector pin device is obtained through the top surface optical system, including: Using the first telecentric light source to emit first parallel light toward the top surface of the ejector device; The first telecentric lens is used to receive reflected light from the top surface of the ejector device to form an image of the top surface of the ejector.

3. The method according to claim 1, characterized in that The method of determining arrangement defect information of the ejector pins of the ejector device based on the ejector pin top surface image includes: Based on the top surface image, a circular contour outside the ejector device is identified, and a center point position of the ejector device is determined based on the circular contour; Based on the top surface image, the positions of all ejector pins in the ejector circular holes are identified to obtain the position of each ejector point; The actual distances from the ejector point positions to the center point position are calculated respectively, and arrangement defect information of the ejector pins of the ejector device is determined according to the actual distances.

4. The method according to claim 3, characterized in that The step of determining arrangement defect information of the ejector pins of the ejector pin device according to the actual distance includes: The actual distances are compared with the standard distances respectively. If the actual distances are inconsistent with the standard distances, it is determined that the ejector pin corresponding to the actual distance has deflection and / or fracture defects.

5. The method according to claim 1, characterized in that: The side optical system comprises a second telecentric light source and a second telecentric lens, the second telecentric light source and the second telecentric lens are arranged opposite to each other along a second optical path, and during detection, the ejector device is located in the second optical path and between the second telecentric light source and the second telecentric lens; The step of obtaining the side image of the ejector pin of the ejector pin device by using the side optical system comprises: emitting a second parallel light toward the side of the ejector device using the second telecentric light source; The second telecentric lens is used to receive the transmitted light from the side of the ejector device to form the ejector side image.

6. The method according to claim 1, characterized in that The determining of the size defect information of the ejector pin of the ejector device based on the ejector pin side image includes: Based on the side image, identifying the ejector pin position and ejector pin contour; Calculating the actual ejector position of each ejector pin based on the ejector pin profile, and determining the ejector pin missing information according to the actual ejector pin position of each ejector pin; The actual ejector pin diameter and the actual ejector pin height of each ejector pin are calculated based on the ejector pin profile, and the ejector pin diameter and the flatness defect of the ejector pin are determined according to the actual ejector pin diameter and the actual ejector pin height of each ejector pin.

7. The method according to claim 6, characterized in that The determining the ejector pin missing information according to the actual ejector pin position of each ejector pin comprises: The actual ejector position of each ejector pin is compared with the standard ejector position. If there is no corresponding ejector contour at the actual ejector position, it is determined that the ejector pin at this position is missing.

8. The method according to claim 6, characterized in that The step of determining the ejector pin diameter defect of the ejector pin according to the actual ejector pin diameter of each ejector pin comprises: The actual ejector pin diameters are respectively compared with the standard ejector pin diameters. If the actual ejector pin diameters are inconsistent with the standard ejector pin diameters, it is determined that the ejector pin corresponding to the actual ejector pin diameter has an ejector pin diameter defect.

9. The method according to claim 6, characterized in that The step of determining the ejector pin flatness defect of the ejector pin according to the actual ejector pin height of each ejector pin comprises: The actual flatness of the ejector pin is determined based on each actual ejector pin height, and the actual flatness is compared with a standard flatness. If the actual flatness is inconsistent with the standard flatness, it is determined that the ejector pin has an ejector pin flatness defect.

10. The method according to claim 1, characterized in that The ejector device is provided with coding information, and the coding information is configured with ejector standard parameter information; the method further comprises: The coding information of the ejector device is obtained by a scanner, and the ejector standard parameter information is determined according to the coding information, so as to judge whether the ejector of the ejector device has arrangement defects and size defects.

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