Heat dissipation performance test system and method, and storage medium

Abstract

The invention provides a heat dissipation performance test system and method, and a storage medium, which can be applied to the technical field of equipment performance test. The heat dissipation performance test system comprises a heating element which is used for simulating the operation heating state of equipment; the liquid cooling device comprises a liquid cooling circulation pipeline and an adjusting structure installed in the liquid cooling circulation pipeline, and a heating element is installed in the liquid cooling circulation pipeline; the controller is used for changing the operation state of the adjusting structure so as to adjust the flow of the cooling liquid in the liquid cooling circulation pipeline and realize heat dissipation of the heating element; the processor is used for executing the following operations: acquiring N groups of basic data corresponding to N moments in the heat dissipation process of the heating element; based on the N groups of basic data, calculating to obtain M groups of heat dissipation performance data corresponding to the M different heat dissipation duration intervals; and based on the M groups of heat dissipation performance data, determining an equipment heat dissipation performance test result of the liquid cooling device, where M and N are integers greater than 1.

Description

Technical Field

[0001] The present disclosure relates to the technical field of equipment performance testing, and more specifically to a heat dissipation performance testing system, method, and storage medium. Background Art

[0002] With the rapid development of emerging technologies such as cloud computing, big data, and artificial intelligence, people have higher and higher requirements for servers. Servers with good heat dissipation performance must be accompanied by higher power. Traditional fan heat dissipation can no longer meet the needs of higher-power servers. The emergence of liquid-cooled servers has solved this problem.

[0003] In the process of implementing the present invention, it was found that liquid-cooled heat dissipation devices need to undergo performance testing before they can be officially put into operation. During the testing process of liquid-cooled servers, due to the instability of the heat dissipation devices, using the server for testing is likely to cause damage to the server, and conventional test results are only a qualitative analysis of the heat dissipation performance. For example, monitoring the temperature changes of the server to qualitatively analyze the quality of the heat dissipation performance cannot achieve a refined quantitative analysis of the heat dissipation performance of the heat dissipation device. Summary of the invention

[0004] In view of the above problems, the present disclosure provides a heat dissipation performance testing system, method, device, electronic device, medium, and program product.

[0005] According to a first aspect of the present disclosure, a heat dissipation performance testing system is provided, comprising:

[0006] Heating element, used to simulate the heating state of the equipment;

[0007] A liquid cooling device, comprising a liquid cooling circulation pipeline and a regulating structure installed in the liquid cooling circulation pipeline, wherein a heating element is installed in the liquid cooling circulation pipeline;

[0008] A controller, used to change the operating state of the regulating structure to adjust the flow rate of the coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element;

[0009] A processor that performs the following operations:

[0010] Acquire N groups of basic data corresponding to N moments in the heat dissipation process of the heating element, wherein each group of basic data includes a temperature value of the heating element and an operating state value of the regulating structure;

[0011] Based on N groups of basic data, M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals are calculated, wherein each group of heat dissipation performance data includes heat dissipation performance parameters, temperature change values ​​of heating elements, and change values ​​of operating states of regulating structures;

[0012] Based on M groups of heat dissipation performance data, determine the equipment heat dissipation performance test results of the liquid cooling device, where M and N are integers greater than 1.

[0013] A second aspect of the present disclosure provides a heat dissipation performance testing method, comprising:

[0014] When the heating element is connected to the liquid cooling circulation pipeline of the liquid cooling device and the heating element is used to simulate the heating state of the equipment, an adjustment instruction is generated to change the operating state of the adjustment structure installed in the liquid cooling circulation pipeline through the adjustment instruction to adjust the flow of the coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element;

[0015] Acquire N groups of basic data corresponding to N moments in the heat dissipation process of the heating element, wherein each group of basic data includes a temperature value of the heating element and an operating state value of the regulating structure;

[0016] Based on N groups of basic data, M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals are calculated, wherein each group of heat dissipation performance data includes heat dissipation performance parameters, temperature change values ​​of heating elements, and change values ​​of operating states of regulating structures;

[0017] Based on M groups of heat dissipation performance data, determine the equipment heat dissipation performance test results of the liquid cooling device, where M and N are integers greater than 1.

[0018] A third aspect of the present disclosure provides a heat dissipation performance testing device, comprising:

[0019] The adjustment module is used to generate an adjustment instruction when the heating element is connected to the liquid cooling circulation pipeline of the liquid cooling device and the heating element is used to simulate the heating state of the device, so as to change the operating state of the adjustment structure installed in the liquid cooling circulation pipeline through the adjustment instruction, so as to adjust the flow rate of the coolant in the liquid cooling circulation pipeline and realize the heat dissipation of the heating element;

[0020] An acquisition module, used to acquire N groups of basic data corresponding to N moments in the heat dissipation process of the heating element, wherein each group of basic data includes a temperature value of the heating element and an operating state value of the regulating structure;

[0021] A calculation module, for calculating, based on N groups of basic data, M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals, wherein each group of heat dissipation performance data includes a heat dissipation performance parameter, a temperature change value of a heating element, and a change value of an operating state of an adjustment structure;

[0022] A determination module determines a device heat dissipation performance test result of the liquid cooling device based on M groups of heat dissipation performance data, wherein M and N are integers greater than 1.

[0023] A fourth aspect of the present disclosure provides an electronic device, comprising: one or more processors; and a memory for storing one or more computer programs, wherein the one or more processors execute the one or more computer programs to implement the steps of the above method.

[0024] The fifth aspect of the present disclosure further provides a computer-readable storage medium having a computer program or instructions stored thereon, which implements the steps of the above method when the above computer program or instructions are executed by a processor.

[0025] The sixth aspect of the present disclosure further provides a computer program product, including a computer program or instructions, which implement the steps of the above method when the above computer program or instructions are executed by a processor.

[0026] According to the embodiments of the present disclosure, in the above-mentioned system of the embodiments of the present disclosure, the server is simulated by the heating element to avoid damage to the server during the test process, and at the same time, the working conditions of the device performance limit can be simulated, such as simulating the scene of the device working at a critical high temperature that is easy to be damaged, and the test results under extreme conditions can be obtained, which expands the test scenarios. Furthermore, by collecting the temperature value of the heating element and the operating status value of the adjustment structure in real time and performing data processing, the heat dissipation performance data corresponding to different heat dissipation time intervals can be obtained. Based on the heat dissipation performance parameter column in the heat dissipation performance data, you can intuitively see the quality of the comprehensive heat dissipation performance corresponding to different heat dissipation time intervals; based on the temperature change of the heating element in the heat dissipation performance data, you can intuitively see the temperature change of the heating element corresponding to different heat dissipation time intervals; based on the change of the operating state of the adjustment structure in the heat dissipation performance data, you can intuitively see the change of the operating state of the adjustment structure corresponding to different heat dissipation time intervals, which realizes the purpose of subdividing the heat dissipation effect into different heat dissipation time, and quantitatively and comprehensively analyzing the heat dissipation performance of the liquid cooling device from multiple different dimensions (heat dissipation performance, temperature change, and change of the operating state of the adjustment structure) under different heat dissipation time conditions, so as to obtain more intuitive quantitative analysis results and comprehensively conduct heat dissipation performance tests of liquid-cooled servers. In addition, by setting the controller and the processor separately, the controller can be set on-site for precise regulation, and the processor can be set remotely to achieve remote control of the heat dissipation performance test, without the need for testers to be on-site all the time, which improves the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above contents and other objects, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0028] Figure 1 The application scenario diagram of the heat dissipation performance testing system, method, device, electronic device, medium, and program product according to the embodiment of the present disclosure is schematically shown;

[0029] Figure 2 The structure diagram of the heat dissipation performance testing system according to the embodiment of the present disclosure is schematically shown;

[0030] Figure 3 A flowchart schematically shows a test performed by a heat dissipation performance test system according to an embodiment of the present disclosure;

[0031] Figure 4 An exemplary form of a first heat dissipation variation trend diagram according to an embodiment of the present disclosure is schematically shown;

[0032] Figure 5 Schematically shows another example form of the first heat dissipation change trend diagram according to an embodiment of the present disclosure;

[0033] Figure 6 A system principle diagram of a heat dissipation performance testing method according to an embodiment of the present disclosure is schematically shown;

[0034] Figure 7 A flow chart of a method for testing heat dissipation performance according to an embodiment of the present disclosure is schematically shown;

[0035] Figure 8 A schematic diagram of a heat dissipation performance testing device according to an embodiment of the present disclosure is shown; and

[0036] Fig. 9 A block diagram of an electronic device suitable for implementing a heat dissipation performance testing method according to an embodiment of the present disclosure is schematically shown. DETAILED DESCRIPTION

[0037] Figure 1 The application scenario diagram of the heat dissipation performance testing system, method, device, electronic device, medium, and program product according to the embodiments of the present disclosure is schematically shown.

[0038] like Figure 1 As shown, the application scenario 100 according to this embodiment may include a heating element 101, a liquid cooling circulation pipeline 102, an adjustment structure 103, a heat exchange device 104, a coolant tank 105 and a control processor 106. Among them, the liquid cooling circulation pipeline 102, the adjustment structure 103, the heat exchange device 104, and the coolant tank 105 constitute a liquid cooling device.

[0039] In the scenario of testing the heat dissipation performance of the liquid cooling device, the heating element 101 is used to simulate the heating state of the device during operation, such as simulating the heating of the server during operation. After the heating element 101 is powered on, the temperature of the heating element 101 gradually increases, simulating the heating of the device.

[0040] The cooling liquid circulates in the liquid cooling circulation pipeline 102, and the cooling liquid is used to cool the heating element 101. The cooling of the heating element 101 may be performed by indirect cooling. For example, the heat of the heating element 101 is transferred to the cooling liquid through a high-efficiency heat conduction component such as a liquid cooling plate, and the cooling liquid is used as a medium for intermediate heat transfer to transfer the heat from the inside of the heating element 101 to the outside of the heating element 101, and then the cooling process is performed.

[0041] The regulating structure 103 is used to adjust the flow of the liquid cooling circulation pipeline 102. The regulating structure 103 may be, for example, a water valve, a circulation pump, etc. The water valve may be any type of valve that can adjust the flow rate, including but not limited to a stop valve, a plug valve, a ball valve, a solenoid valve, etc.

[0042] Furthermore, the liquid cooling circulation pipeline 102 may include a liquid supply pipeline and a liquid return pipeline. The liquid supply pipeline is connected to the inlet of the liquid cooling plate of the heating element 101, and the liquid return pipeline is connected to the outlet of the liquid cooling plate of the heating element 101.

[0043] The heat exchange device 104 is connected to the liquid cooling circulation pipeline 102, and the heat exchange device 104 can be any type of heat exchanger, such as a tubular heat exchanger, a plate heat exchanger, a cooling tower, an evaporative condenser, etc. The inlet of the heat exchange device 104 is connected to the outlet of the liquid cooling plate, and the high-temperature coolant at the outlet of the liquid cooling plate enters the liquid return pipeline after heat exchange and temperature reduction in the heat exchange device 104.

[0044] When the regulating structure 103 adopts a water valve, the water valve is installed in the liquid supply pipe to regulate the flow into the liquid cooling plate; when the regulating structure 103 adopts a circulating pump, the circulating pump is installed in the liquid return pipe to pressurize the coolant in the liquid cooling circulation pipeline 102 to achieve circulating flow.

[0045] A temperature sensor, such as a thermocouple, a thermal resistor, etc., may be installed at the heating element 101 ; an opening detection sensor, such as a gate position meter, a Hall principle gate opening meter, a displacement sensor, etc., may be installed at the regulating structure 103 .

[0046] The control processor 106 can obtain real-time monitoring data from various sensors, such as the temperature value of the heating element and the operating status value of the adjustment structure, and process the obtained data to calculate the heat dissipation performance test results of the liquid cooling device.

[0047] The following will be based on Figure 1 The scene described by Figure 2-Figure 9 The heat dissipation performance testing method, system, device, and equipment of the disclosed embodiments are described in detail.

[0048] Figure 2The structural diagram of the heat dissipation performance testing system according to an embodiment of the present disclosure is schematically shown.

[0049] like Figure 2 As shown, the heat dissipation performance testing system includes a heating element, a liquid cooling device, a controller, and a processor.

[0050] Among them, the heating element is used to simulate the heating state of the equipment;

[0051] A liquid cooling device, comprising a liquid cooling circulation pipeline and a regulating structure installed in the liquid cooling circulation pipeline, wherein a heating element is installed in the liquid cooling circulation pipeline;

[0052] A controller, used to change the operating state of the regulating structure to adjust the flow rate of the coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element;

[0053] A processor that performs the following operations:

[0054] Acquire N groups of basic data corresponding to N moments in the heat dissipation process of the heating element, wherein each group of basic data includes the temperature value of the heating element and the operating state value of the regulating structure; based on the N groups of basic data, calculate and obtain M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals, wherein each group of heat dissipation performance data includes heat dissipation performance parameters, temperature change values ​​of the heating element, and operating state change values ​​of the regulating structure; based on the M groups of heat dissipation performance data, determine the equipment heat dissipation performance test results of the liquid cooling device, wherein M and N are integers greater than 1.

[0055] In addition, the heat dissipation performance testing system may also include a power supply device for supplying power to the controller, processor, liquid cooling device, and heating element.

[0056] Among them, various sensors are installed in the heating elements, water valves, circulation pumps, and pipelines to collect the temperature of the heating elements, the opening of the water valves, the speed of the circulation pumps, the liquid pressure in the pipelines, etc.

[0057] The processor includes but is not limited to BMC (Baseboard Management Controller), MCU (Microcontroller Unit), and CPU (Central Processing Unit), which are responsible for the main data processing and computing operations. In the scenario of the embodiment of the present disclosure, BMC has a lower hardware cost on the basis of meeting the data processing requirements.

[0058] The controller includes but is not limited to PLC (Programmable Logic Controller), or single-chip microcomputer, or MCU (Microcontroller Unit), which can realize data acquisition (receive information from sensors or input devices and convert it into digital data), logic control (process input data and trigger output according to pre-programmed parameters), and output control (convert the processed data into control signals and transmit them to valves, pumps and other equipment).

[0059] According to an embodiment of the present disclosure, the heat dissipation performance test system is applied in the scenario of testing the heat dissipation performance of the liquid cooling device of the device. The device will generate heat during operation, and the device needs to be cooled by the liquid cooling device to ensure the normal operation of the device. The device can be, for example, a server, or other device that needs to dissipate heat in time during operation.

[0060] Liquid cooling devices need to undergo performance testing before they can be put into formal operation. However, due to the instability of liquid cooling devices, using original equipment (such as servers) for testing can easily cause damage to the equipment, and requires testers to observe on-site for a long time, resulting in a waste of manpower.

[0061] Therefore, a heating element is used in the system of the embodiment of the present disclosure to perform simulation testing, the heating element is connected to the liquid cooling circulation pipeline of the liquid cooling device, and the heating element is used to simulate the heating state of the device. After the heating element is powered on, the temperature of the heating element gradually increases to simulate the heating of the device, and the temperature change of the heating element is monitored in real time. When the temperature of the heating element is greater than the preset temperature threshold, the liquid cooling device is turned on to dissipate the heat of the heating element.

[0062] The liquid cooling device includes a liquid cooling circulation pipeline and a regulating structure, a heat exchange device, a coolant tank, etc. installed in the liquid cooling circulation pipeline.

[0063] The cooling liquid circulates in the liquid cooling circulation pipeline, and the cooling liquid is used to cool the heating element. The cooling of the heating element can be done by indirect cooling. For example, the heat of the heating element is transferred to the cooling liquid through high-efficiency heat conduction components such as liquid cooling plates, and the cooling liquid is used as the medium for intermediate heat transfer to transfer the heat from the inside of the heating element to the outside of the heating element, and then the cooling process is performed.

[0064] Furthermore, the liquid cooling device also includes a cooling liquid tank and a heat exchanger, and the heating element is indirectly cooled by the liquid cooling plate. The liquid cooling circulation pipeline includes a liquid supply pipeline and a liquid return pipeline. The liquid supply pipeline is connected to the inlet of the liquid cooling plate of the heating element to supply liquid to the liquid cooling plate, and the liquid return pipeline is connected to the outlet of the liquid cooling plate of the heating element. The high-temperature liquid flowing out of the liquid cooling plate enters the heat exchange device for cooling, enters the cooling liquid tank after cooling, and enters the liquid supply pipeline from the outlet of the cooling liquid tank to start the next cycle.

[0065] The controller is used to read the values ​​of each sensor and control the set values ​​of the circulation pump and the water valve based on the collected data; the heating element is used to simulate the server, and there is a temperature sensor inside it to monitor its temperature. At the same time, the controller can read the value of the internal register of the temperature sensor through the I2C bus (Inter Integrated Circuit serial communication bus) to obtain the temperature of the heating element; the temperature of the heating element will gradually rise after power-on, similar to the temperature state of the server when it is working; the coolant tank is connected to the outlet pipe and the inlet pipe. When the circulation pump is working, the outlet pipe is pressurized to make the coolant in the coolant tank flow out, and then return to the coolant tank after passing through the heating element; the water valve is used to control the flow rate of the coolant flowing out of the coolant tank. The larger the opening, the greater the flow rate; the heat exchanger is used to exchange heat with the outside world, and the heat absorbed by the current coolant from the heating element is exchanged to the outside world, such as a cooling tower, to ensure heat dissipation efficiency. The regulating structure is used to adjust the flow rate of the coolant in the liquid cooling circulation pipeline, and the heat dissipation of the heating element is achieved by adjusting the flow rate of the coolant in the liquid cooling circulation pipeline. The regulating structure may include various types of valves, pumps, etc. For example, the regulating structure includes a water valve and a circulating pump. The water valve is installed in the liquid supply pipe, and the water valve regulates the flow of coolant entering the liquid cooling plate; the circulating pump is installed in the return liquid pipe. The circulating pump is installed in the return liquid pipe, and the coolant in the return liquid pipe is pressurized to increase the flow rate and realize the circulation of the coolant.

[0066] Temperature sensors, such as thermocouples, thermal resistors, etc., can be installed at the heating elements; sensors for real-time monitoring of the operating status of the regulating structure can be installed at the regulating structure, such as opening detection sensors, speed measuring instruments, flow measuring instruments, pressure measuring instruments, etc.

[0067] According to the embodiments of the present disclosure, by powering on the heating element, the temperature of the heating element rises and is greater than a preset temperature threshold, the liquid cooling device is turned on to dissipate heat from the heating element, and during the heat dissipation process, the temperature changes of the heating element and the state change data of the regulating structure in the liquid cooling device (such as valve opening, flow, pressure, pump speed, flow, pressure, etc.) are monitored and collected in real time.

[0068] During the heat dissipation process, the controller generates adjustment instructions to change the operating state of the adjustment structure installed in the liquid cooling circulation pipeline through the adjustment instructions to adjust the flow of coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element.

[0069] For example, the temperature change of the heating element collected in real time at the sensor can be obtained to dynamically adjust the operating state of the regulating structure multiple times. When the temperature of the heating element is greater than the preset temperature threshold and the temperature rises, a control instruction is issued to the regulating structure to increase the operating state of the regulating structure on the basis of the previous adjustment (such as increasing the valve opening and flow, increasing the pump speed, pressure, flow, etc.); for example, when the temperature of the heating element is greater than the preset temperature threshold and the temperature drops, the operating state of the regulating structure is reduced on the basis of the previous adjustment (such as increasing the valve opening and flow, increasing the pump speed, pressure, flow, etc.).

[0070] Furthermore, in the heat dissipation process, the controller obtains real-time monitoring data from various sensors, including obtaining the temperature values ​​of N groups of heating elements corresponding to N moments, and the operating state values ​​of N groups of regulating structures. For example, an array X of N groups including time, heating element temperature, valve opening and / or flow, pump speed and / or pressure and / or flow is obtained, wherein any i-th X(i) = {i, T(i), G(i)}, i corresponds to the moment. T(i) is the temperature of the heating element corresponding to the moment i, and G(i) is the operating state of the regulating structure corresponding to the moment i.

[0071] The controller sends the acquired monitoring data to the processor, and then the processor processes the acquired data to obtain the equipment heat dissipation performance test results of the liquid cooling device.

[0072] In which, based on N groups of basic data, the processor calculates and obtains M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals. For example, the N arrays X obtained above are combined and calculated in pairs, or some of the N arrays are combined and calculated in pairs, to obtain M groups of heat dissipation performance data S (1), S (2), S (3) ... S (k) ... corresponding to M different heat dissipation time intervals, wherein any j-th S (j) is a matrix, and the elements of any row in the matrix = {a (j), T (m) - T (n), G (m) - G (n)}, wherein the heat dissipation time interval j = mn, m, n corresponds to different moments. The columns of the matrix are multiple groups of combinations corresponding to the heat dissipation time interval j = mn, m, n, T (m), T (n) are respectively the temperatures of the heating elements corresponding to the moments m and n, G (m), G (n) are respectively the operating states of the regulating structure corresponding to the moments m and n. a (j) corresponds to the heat dissipation performance parameter of the heat dissipation time interval j. For example, a(j) is the heat dissipation performance parameter calculated for interval j, and a(k) is the heat dissipation performance parameter calculated for interval k. The heat dissipation performance parameter can reflect the heat dissipation performance of the liquid cooling device within the heat dissipation time interval, and can be calculated based on the temperature change of the heating element within the heat dissipation time interval and the change of the operating state of the regulating structure.

[0073] The heat dissipation time interval can be customized by the user. For example, M groups of heat dissipation performance data with heat dissipation time of 1 second, 2 seconds, 3 seconds, 4 seconds, etc. can be calculated, or M groups of heat dissipation performance data with heat dissipation time of 3 seconds, 6 seconds, 9 seconds, etc. can be calculated. For the heat dissipation time j=1 second, it can be calculated using the basic data corresponding to multiple groups of combinations of m and n when j=mn=1. For example, the multiple combinations when j=1 are: m=2, n=1; m=3, n=2; m=4, n=3, etc., that is, using the data collected at the time of m=2, n=1, using the data collected at the time of m=3, n=2, using the data collected at the time of m=4, n=3, etc., and calculating a group of heat dissipation performance data S(j) of j=1.

[0074] Among them, in the processor, based on M groups of heat dissipation performance data, the equipment heat dissipation performance test results of the liquid cooling device are determined. According to the calculated data, the change of the temperature of the current liquid cooling device at different times, the change of the operating state of the adjustment structure and the relationship between the performance parameters can be seen to evaluate the heat dissipation performance efficiency of the current liquid cooling device. At the same time, the liquid cooling device is tested in different working modes and different working environments to obtain more data to evaluate the heat dissipation performance of each liquid cooling device.

[0075] Furthermore, the controller and the processor can be set on-site and remotely, respectively. For example, the controller is set on-site to control the operating state of the adjustment structure, as well as to control the start and stop of the heating element, control the start and stop of the power supply equipment, and obtain the basic data collected in real time from the sensor, and send the basic data to the processor. The processor is set at the remote end, receives the basic data and performs data processing and analysis to obtain the performance test results. The functional test of the liquid-cooled server can be carried out quickly and efficiently. By setting the controller and the processor on-site and remotely, respectively, remote control of the heat dissipation performance test can be achieved, without the need for testers to be on-site all the time, thereby improving the test efficiency.

[0076] There are some problems with the testing methods in the related art. For example, when testing directly based on a real server, relays and solenoid valves are set on the liquid cooling pipes, and the control end is connected to the solenoid valves through the corresponding relays to control the opening and closing of the solenoid valves, and the corresponding tests are performed by switching the switch states of the corresponding pipes through the solenoid valves.

[0077] Based on the problem in the related art that directly testing based on real equipment may easily cause damage if the equipment exceeds its limit performance, and the problem that it is impossible to achieve refined quantitative analysis of the heat dissipation performance of the heat dissipation device, the above method of the embodiment of the present disclosure simulates the server through the heating element to avoid damage to the server during the test. At the same time, it can simulate the working conditions of the equipment performance limit, such as simulating the scene of the equipment working at a critical high temperature that is easy to be damaged, and can obtain test results under extreme conditions, thus expanding the test scenarios. Furthermore, by collecting the temperature value of the heating element and the operating status value of the adjustment structure in real time and performing data processing, the heat dissipation performance data corresponding to different heat dissipation time intervals can be obtained. Based on the heat dissipation performance parameter column in the heat dissipation performance data, you can intuitively see the quality of the comprehensive heat dissipation performance corresponding to different heat dissipation time intervals; based on the temperature change of the heating element in the heat dissipation performance data, you can intuitively see the temperature change of the heating element corresponding to different heat dissipation time intervals; based on the change of the operating state of the adjustment structure in the heat dissipation performance data, you can intuitively see the change of the operating state of the adjustment structure corresponding to different heat dissipation time intervals, which realizes the purpose of subdividing the heat dissipation effect into different heat dissipation time periods, and quantitatively and comprehensively analyzing the heat dissipation performance of the liquid cooling device from multiple different dimensions (heat dissipation performance, temperature change, change of the operating state of the adjustment structure) under different heat dissipation time conditions, so as to obtain more intuitive quantitative analysis results and comprehensively conduct heat dissipation performance tests on liquid-cooled servers.

[0078] Figure 3 The flowchart of the heat dissipation performance testing system executing the test according to the embodiment of the present disclosure is schematically shown.

[0079] like Figure 3 As shown, based on the above heat dissipation performance testing system, the method for performing the test may include:

[0080] Operation 11. Send a power supply instruction to the power supply device through the controller, the power supply device powers on the liquid cooling device, and each device in the liquid cooling device starts;

[0081] Operation 12: After the controller sends a power-on command, each device operates normally, and the temperature of the heating element continues to rise; the sensor is used to monitor and collect the temperature change of the heating element and the state change data of the adjustment structure in the liquid cooling device in real time and send them to the controller;

[0082] Operation 13: After the controller detects that the temperature of the heating element exceeds a preset threshold, the controller calculates a design value of the regulating structure based on the temperature change of the heating element and the state change of the regulating structure, and generates a control instruction to control the dynamic change of the state of the regulating structure;

[0083] Operation 14: The controller obtains real-time monitoring data from various sensors, including the temperature values ​​of the heating elements corresponding to different time stamps and the operating status values ​​of the regulating structure, to obtain an array X; when the data is not obtained in time, a fault alarm will be issued to notify the tester;

[0084] Operation 15: Determine whether a shutdown command is received. If not, go to operation 13; if a shutdown command is received, the current test ends.

[0085] Operation 16: After the test is completed, the controller sends the recorded multiple arrays X to the processor, and the processor calculates two by two to obtain the heat dissipation performance data S corresponding to different heat dissipation time intervals;

[0086] Operation 17: Through the data matrix S, the relationship between the temperature change at different times, the change in the operating state of the regulating structure and the performance parameters can be clearly seen, thereby evaluating the heat dissipation performance of the current device.

[0087] According to an embodiment of the present disclosure, further, the liquid cooling circulation pipeline includes a liquid supply pipeline and a liquid return pipeline. The liquid supply pipeline is connected to the inlet of the liquid cooling plate of the heating element to supply liquid to the liquid cooling plate, and the liquid return pipeline is connected to the outlet of the liquid cooling plate of the heating element. The high-temperature liquid flowing out of the liquid cooling plate enters the heat exchange device for cooling, enters the cooling liquid tank after cooling, and enters the liquid supply pipeline from the outlet of the cooling liquid tank to start the next cycle.

[0088] The regulating structure includes a water valve and a circulation pump. The water valve is installed in the liquid supply pipeline to regulate the flow of the coolant entering the liquid cooling plate; the circulation pump is installed in the return liquid pipeline to pressurize the coolant in the return liquid pipeline, increase the flow rate, and realize the circulation of the coolant. Based on this, the operating state value of the water valve includes the water valve opening, and the operating state value of the circulation pump includes the circulation pump speed.

[0089] The water valve may be any type of valve capable of adjusting the flow rate, such as, but not limited to, a stop valve, a plug valve, a ball valve, a solenoid valve, etc. The circulation pump may be any type, including, but not limited to, a brushless DC water pump, a brushless DC water pump (motor type), a brushless DC water pump (magnetic drive isolation type), etc.

[0090] The water valve opening can be measured by an opening measuring instrument, such as but not limited to a gate position meter, a Hall principle gate opening meter, a displacement sensor, etc. The circulating pump speed can be obtained by a speed measuring instrument, such as but not limited to a photoelectric sensor, a magnetoelectric sensor, an ultrasonic sensor, a centrifugal sensor, etc.

[0091] According to the embodiments of the present disclosure, the water valve adjusts the flow rate of the coolant entering the liquid cooling plate. By adjusting the opening of the water valve, the flow rate of the coolant entering the liquid cooling plate is changed. The larger the flow rate, the better the heat dissipation effect on the heating element. Therefore, there is a direct and close correlation between the opening of the water valve and the heat dissipation performance.

[0092] The circulation pump provides pressure for the flow of coolant in the pipeline, and plays a decisive role in the flow rate of the entire liquid cooling circulation pipeline. The higher the speed of the circulation pump, the higher the hydraulic pressure in the circulation pipeline, the greater the flow rate, and the greater the limit flow rate of coolant entering the liquid cooling plate. Therefore, there is a direct and close relationship between the speed of the circulation pump and the heat dissipation performance. Therefore, when analyzing the heat dissipation performance, by real-time collection of the water valve opening and the speed of the circulation pump, combined with the temperature changes of the heating elements, a more comprehensive analysis of the heat dissipation performance of the liquid cooling device can be performed.

[0093] According to the embodiment of the present disclosure, after the heat dissipation device is started, the temperature change of the heating element and the state change data of the regulating structure in the liquid cooling device are monitored and collected in real time, and an adjustment instruction is generated based on the monitoring data, so as to change the operating state of the regulating structure installed in the liquid cooling circulation pipeline through the adjustment instruction to adjust the flow rate of the coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element. K adjustment instructions may be generated to achieve dynamic adjustment.

[0094] A method for generating any k-th adjustment instruction may be, for example, the following method:

[0095] The temperature change of the heating element collected in real time at the sensor is obtained, and the operating state of the regulating structure is adjusted dynamically multiple times. When the temperature of the heating element is greater than the preset temperature threshold and the temperature rises, a control instruction is issued to the regulating structure to increase the operating state of the regulating structure (such as increasing the valve opening, increasing the pump speed, etc.) on the basis of the previous adjustment; for example, when the temperature of the heating element is greater than the preset temperature threshold and the temperature drops, the operating state of the regulating structure is reduced on the basis of the previous adjustment (such as increasing the valve opening, increasing the pump speed, etc.).

[0096] Another method for generating any k-th adjustment instruction may be to use the following method:

[0097] Operation 21: acquiring a k-1th operating state value of the regulating structure based on the k-1th adjustment instruction;

[0098] Operation 22: obtaining a k-1th reference deviation of a k-1th adjustment of a preset reference variable and a kth reference deviation of a kth adjustment;

[0099] Operation 23: generating a kth operating state value of the regulating structure based on the k-1th reference deviation and / or the kth reference deviation, and the k-1th operating state value; and

[0100] Operation 24: Generate a kth adjustment instruction based on the kth running state value; K is an integer greater than 1, k=2, ...K.

[0101] That is, the operating status of the current regulation structure is mainly calculated based on the status value of the previous adjustment, the deviation between the preset reference variable and the variable threshold in the previous adjustment, and the deviation between the preset reference variable and the variable threshold in the current adjustment.

[0102] Among them, when the regulating structure adopts a water valve, the preset reference variable includes the temperature of the heating element, and the reference deviation is the deviation between the temperature of the heating element and the preset temperature threshold; when the regulating structure adopts a circulating pump, the preset reference variable includes the pressure of the liquid cooling circulation pipeline, and the reference deviation is the deviation between the pressure of the liquid cooling circulation pipeline and the preset pressure threshold.

[0103] Furthermore, the operating state value of the regulating structure is between the minimum state value and the maximum state value. If the calculated state value is less than the minimum state value, it operates according to the minimum state value. If the calculated minimum state value is greater than the maximum state value, it operates according to the maximum state value.

[0104] The following uses a water valve as an example to explain the method for calculating the adjustment of the valve opening. According to an embodiment of the present disclosure, the water valve opening u(k) at the current time k can be calculated using the following formula (1).

[0105] u(k)=u(k-1)+1 / 10 Kcfc*[e(k)-e(k-1)]+10 / Tcfc*e(k) (1);

[0106] in:

[0107] u(k) is the water valve opening at the current moment k, ranging from Nc_min to Nc_max; Nc_min is the minimum valve opening, and Nc_max is the maximum valve opening;

[0108] u(k-1) is the water valve opening at the k-1th moment, ranging from Nc_min to Nc_max;

[0109] u(1)is the initial opening of the primary side water valve at the first start-up, unit: %

[0110] e(k) is the temperature deviation (reference deviation) at the kth moment, e(k)=T1k-T2, T1k is the temperature monitoring value at the kth moment, T2 is the preset temperature threshold, unit, °C;

[0111] e(k-1): temperature deviation (reference deviation) at the k-1th moment, unit, °C;

[0112] Kcfc: It is the valve proportional coefficient, which is a constant between 0 and 1. If you want to achieve a more precise adjustment, Kcfc can take a smaller value. On the contrary, if you want to achieve a more rough adjustment, take a larger value.

[0113] Tcfc: It is the valve integral coefficient, which is a constant between 0 and 1. To achieve a more precise adjustment, Tcfc can take a smaller value. Conversely, to achieve a coarser adjustment, take a larger value.

[0114] According to another embodiment of the present disclosure, the water valve opening u(k) at the current time k can also be calculated using the following formula (2).

[0115] u(k)=u(k-1)+1 / 10 Kcfc*e(k)+10 / Tcfc*e(k) (2);

[0116] It can be seen that the valve opening is mainly calculated based on the valve opening read last time, the temperature threshold of the heating element and the temperature monitoring value of the heating element. If the calculated valve opening is less than the minimum valve opening, it will operate according to the minimum opening. If the calculated valve opening is greater than the maximum valve opening, it will operate according to the maximum opening.

[0117] The following uses a circulating pump as an example to explain the adjustment calculation method of the circulating pump speed. According to an embodiment of the present disclosure, the circulating pump speed s(k) at the current time k can be calculated using the following formula (3).

[0118] s(k)=s(k-1)+1 / 10*Kcfc_p*[d(k)-d(k-1)]+10 / Tcfc_p*d(k)(3);

[0119] in:

[0120] s(k) is the speed of the circulating pump at the kth moment, ranging from Np_min to Np_max, where Np_min is the minimum speed and Np_max is the maximum speed;

[0121] s(k-1) is the speed of the circulating pump at the k-1th time, ranging from Np_min to Np_max;

[0122] s (1): the rated speed of the circulating pump at the first start-up;

[0123] d(k) is the pressure deviation (reference deviation) at the kth sampling moment, d(k)=P1k-P2, P1k is the pressure monitoring value at the kth moment; P2 is the preset pressure threshold, the unit is bar, where the pressure refers to the pressure in the return liquid pipeline, or the outlet pressure of the circulating pump;

[0124] d(k-1) is the pressure deviation (reference deviation) at the k-1th sampling moment, in bar;

[0125] Kcfc_p is the proportional coefficient of the circulation pump, which is a constant between 0 and 1. If a more precise adjustment is to be achieved, Kcfc can take a smaller value. Conversely, if a more rough adjustment is to be achieved, a larger value can be taken. Tcfc_p is the integral coefficient of the circulation pump, which is a constant between 0 and 1. If a more precise adjustment is to be achieved, Tcfc can take a smaller value. Conversely, if a more rough adjustment is to be achieved, a larger value can be taken.

[0126] According to another embodiment of the present disclosure, the circulating pump speed s(k) at the current time k can also be calculated using the following formula (4).

[0127] s(k)=s(k-1)+1 / 10*Kcfc_p*d(k)+10 / Tcfc_p*d(k)(4);

[0128] It can be seen that the circulation pump speed is mainly calculated based on the circulation pump speed of the last sampling, the pressure setting threshold and the pressure monitoring value. If the calculated circulation pump speed is less than the minimum speed, it will run at the minimum speed. If the calculated circulation pump speed is greater than the maximum speed, it will run at the maximum speed.

[0129] According to the embodiments of the present disclosure, the operating state of the current adjustment structure is calculated based on the state value of the previous adjustment, the deviation between the preset reference variable and the variable threshold in the previous adjustment, and the deviation between the preset reference variable and the variable threshold in the current adjustment, so that the dynamic adjustment of the operating state of the adjustment structure can be achieved. By adjusting based on the deviation, the heat dissipation reaches a stable state, effectively reducing the steady-state error of the system, and improving the response speed and stability of the system.

[0130] According to an embodiment of the present disclosure, after collecting N groups of basic data, such as an array X including time, heating element temperature, water valve opening, and circulating pump speed, calculating M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals based on the N groups of basic data includes the following operations:

[0131] Operation 31. Based on N groups of basic data, calculate and obtain M groups of heating element temperature change values ​​and M groups of regulating structure operating state change values ​​corresponding to M different heat dissipation time intervals; any j-th group of data D(j)={T(m)-T(n), G(m)-G(n)}; the heat dissipation time interval j=mn, m and n correspond to different moments, G(m) and G(n) are the regulating structure operating states (water valve opening or circulating pump speed) corresponding to moments m and n, respectively.

[0132] Operation 32: Based on the M groups of heating element temperature change values ​​and the M groups of adjustment structure operation state change values, calculate and obtain M groups of heat dissipation performance parameters corresponding to M different heat dissipation time intervals. For example, corresponding to any heat dissipation time interval j=mn, the heat dissipation performance parameter a(j)=f(T(m)-T(n), G(m)-G(n)).

[0133] The function f(x) may be a linear function, an exponential function, a logarithmic function, etc. For example, it includes but is not limited to the following formulas (5)-(7).

[0134] a(j)=(T(m)-T(n))+(G(m)-G(n)) (5);

[0135] a(j)=ln(T(m)-T(n))+(G(m)-G(n)) (6);

[0136] (7);

[0137] According to the embodiments of the present disclosure, the calculation of the heat dissipation performance parameters takes into account the comprehensive influence of temperature changes and changes in the state of the adjustment structure, which can objectively reflect the quality of the heat dissipation performance.

[0138] Furthermore, the heat dissipation performance parameter can also be calculated using the following method:

[0139] Operation 41: Determine a temperature influence coefficient A, a water valve influence coefficient B, and a circulation pump influence coefficient C, wherein the temperature influence coefficient A is used to characterize the correlation between the temperature change of the heating element and the heat dissipation performance, the water valve influence coefficient B is used to characterize the correlation between the water valve opening change and the heat dissipation performance, and the circulation pump influence coefficient C is used to characterize the correlation between the circulation pump speed change and the heat dissipation performance;

[0140] Operation 42: Calculate a first heat dissipation performance component based on the temperature influence coefficient A and the temperature change value of the heating element. The first heat dissipation performance component may be, for example: A*(T(m)–T(n)), where T(m) is the temperature recorded at time m, and T(n) is the temperature recorded at time n;

[0141] The second heat dissipation performance component is calculated based on the water valve influence coefficient B and the water valve opening change value. The second heat dissipation performance component may be, for example: B*(u(m)- u(n)), where u(m) is the water valve opening setting value at time m, and u(n) is the water valve opening setting value at time n;

[0142] The third heat dissipation performance component is calculated based on the circulation pump influence coefficient C and the circulation pump speed change value. The third heat dissipation performance component may be, for example: C*(s(m)-s(n)), where s(m) is the circulation pump setting value at time m, and s(n) is the circulation pump setting value at time n;

[0143] Operation 43: Calculate M groups of heat dissipation performance parameters corresponding to the M different heat dissipation time intervals using the M groups of first heat dissipation performance components, the M groups of second heat dissipation performance components, and the M groups of third heat dissipation performance components corresponding to the M different heat dissipation time intervals. For example, the following formula (8) may be used for calculation.

[0144] a(j)={ A*(T(m)–T(n))+B*(u(m)- u(n))+C*(s(m)-s(n))} / (m–n) (8);

[0145] It can be seen from formula (8) that the heat dissipation performance parameters can be expressed as a linear function whose independent variables are temperature change T(m)–T(n), water valve opening change u(m)-u(n), and circulation pump speed change s(m)-s(n).

[0146] According to the embodiments of the present disclosure, the heat dissipation performance parameters comprehensively reflect the quality of the heat dissipation performance. During the calculation process, the temperature influence coefficient, the water valve influence coefficient and the circulation pump influence coefficient are introduced to consider the influence of temperature changes, water valve opening changes and circulation pump speed changes on the heat dissipation performance. The calculated heat dissipation performance parameters comprehensively reflect the quality of the heat dissipation performance and are more useful for reference.

[0147] According to the embodiment of the present disclosure, further, the temperature influence coefficient is greater than the water valve influence coefficient; the temperature influence coefficient is greater than the circulation pump influence coefficient. Because the temperature change of the heat dissipation element is the factor that most directly reflects the quality of the heat dissipation performance, the temperature influence coefficient can be set to a higher value.

[0148] According to the embodiments of the present disclosure, each set of basic data collected includes the temperature value of the heating element, the operating state value of the regulating structure, and may also include the pressure value of the coolant in the return liquid pipeline.

[0149] The heat dissipation performance parameters can also be calculated by the following method:

[0150] Operation 51. Based on N groups of basic data, calculate and obtain M groups of temperature change values ​​of heating elements and M groups of pressure change values ​​corresponding to M different heat dissipation time intervals; any j-th group of data D(j)={T(m)-T(n), P(m)-P(n)}; the heat dissipation time interval j=mn, m and n correspond to different moments, P(m) and P(n) are the pressure values ​​of the coolant in the return liquid pipeline corresponding to moments m and n, respectively.

[0151] Operation 52: Based on the M groups of heating element temperature change values ​​and the M groups of pressure change values, calculate and obtain M groups of heat dissipation performance parameters corresponding to M different heat dissipation time intervals.

[0152] Based on this, corresponding to any heat dissipation time interval j=mn, the heat dissipation performance parameter a(j) can also be calculated using the following formula (9).

[0153] a(j)={(A+B*E1)*(T(m)–T(n))+ C*E2*(P(m)–P(n))+B*v1+v2} / mn

[0154] ={Q1*(T(m)–T(n))+ Q2*(P(m)–P(n))+ Q3} / mn(9);

[0155] A, B, and C have the same meanings as above and are constants. E1, E2, v1, v2, Q1, Q2, and Q3 are also constants.

[0156] Thus, it can be seen from formula (9) that the heat dissipation performance parameter can also be expressed as a linear function whose independent variables are temperature change T(m)–T(n) and coolant pressure change P(m)–P(n).

[0157] This is also because the water valve opening, circulating pump speed, temperature, and coolant pressure have a potential change dependency relationship. Therefore, changes in the water valve opening and circulating pump speed can also be reflected in the form of temperature changes and coolant pressure changes. The following is an example of the calculation process of the potential correlation between these variables.

[0158] To simplify the calculation, the water valve opening u(k) is calculated according to formula (2), and the circulating pump speed s(k) is calculated according to formula (4).

[0159] From formula (2), corresponding to time m and n:

[0160] u(m)-u(n)=u(m-1)+1 / 10Kcfc*T(m)+10 / Tcfc*T(m)-u(n-1)+1 / 10Kcfc*T(n)+10 / Tcfc*T(n), which can be simplified to formula (10):

[0161] u(m)-u(n)=E1*(T(m)–T(n))+v1 (10);

[0162] Among them, E1 and v1 are constants;

[0163] From formula (4), corresponding to time m and n:

[0164] s(m)-s(n)=s(m-1)+1 / 10*Kcfc_p*P(m)+10 / Tcfc_p*P(m)-s(n-1)+1 / 10*Kcfc_p*P(n)+10 / Tcfc_p*P(n), which can be simplified to formula (11):

[0165] s(m)-s(n)=E2*(p(m)–p(n))+v2;

[0166] Among them, E2 and v2 are constants;

[0167] Substituting formula (10) and formula (11) into formula (8), we get the following formula (12):

[0168] a(j)={ A*(T(m)–T(n))+B*(E1*(T(m)–T(n))+v1)+C*(E2*(P(m)–P(n))+v2)} / mn (12);

[0169] The above formula (12) can be further simplified to the above formula (9): a(j)={(A+B*E1)*(T(m)–T(n))+ C*E2*(P(m)–P(n))+B*v1+v2} / mn.

[0170] Therefore, it can be seen that changes in the water valve opening and the circulating pump speed can also be reflected in the form of temperature changes and coolant pressure changes.

[0171] Therefore, the heat dissipation performance parameters can be expressed as a linear function with the independent variables being the temperature change T(m)–T(n), the water valve opening change u(m)- u(n), and the circulation pump speed change s(m)-s(n).

[0172] The heat dissipation performance parameters can also be expressed as a linear function with the independent variables being the temperature change T(m)–T(n) and the coolant pressure change P(m)–P(n).

[0173] According to the embodiments of the present disclosure, by exploring the potential correlations between multiple factors that affect the heat dissipation performance and obtaining the correlation between the heat dissipation performance and each factor, the heat dissipation performance can be analyzed from multiple different dimensions.

[0174] According to the embodiments of the present disclosure, although the temperature change of the heat dissipation element can intuitively reflect the quality of the heat dissipation performance, only referring to the temperature change of the heat dissipation element cannot objectively and comprehensively reflect the performance and working conditions of the overall liquid cooling device. For example, in the initial cooling stage, the temperature of the heat dissipation element is relatively high, and it is possible that the water valve opening increases by a large margin, the circulating pump speed increases by a large margin, the heat dissipation element temperature changes by a large margin, and the heat dissipation performance is better; it is possible that the water valve opening increases by a large margin, the circulating pump speed increases by a large margin, but the heat dissipation element temperature changes by a small margin, and the heat dissipation performance is poor; in the later cooling stage, because the heat dissipation element is already at a relatively low temperature and the cooling space is relatively small, it is possible that the water valve opening increases by a large margin, the circulating pump speed increases by a large margin, but the heat dissipation element temperature changes by a small margin, and it cannot be simply considered that the heat dissipation performance of the heat dissipation device is poor. Therefore, when performing heat dissipation performance analysis, it is necessary to combine the changing trend of temperature or heat dissipation performance parameters to conduct a comprehensive and objective analysis of the heat dissipation performance of the liquid cooling device.

[0175] According to an embodiment of the present disclosure, each group of heat dissipation performance data includes not only heat dissipation performance parameters, temperature change values ​​of heating elements, and change values ​​of operating state of regulating structures, but also temperature values ​​of heating elements, operating state values ​​of regulating structures, and timestamps. For example, M groups of heat dissipation performance data S(1), S(2), S(3)...S(k)... corresponding to M different heat dissipation time intervals are obtained, wherein any j-th S(j) is a matrix, and the elements of any row in the S(j) matrix = {a(j), T(m)-T(n), G(m)-G(n), T(m), T(n), G(m), G(n), m, n}, wherein the heat dissipation time interval j = mn, and m and n correspond to different moments. The columns of the matrix correspond to multiple combinations of m and n when the heat dissipation time interval is j (for example, the multiple combinations when j=1 are: m=2,n=1; m=3,n=2; m=4,n=3...), T(m) and T(n) are the temperatures of the heating element at time m and n respectively, and G(m) and G(n) are the operating states of the regulating structure at time m and n respectively. a(j) corresponds to the heat dissipation performance parameter of the heat dissipation time interval j.

[0176] Based on the M groups of heat dissipation performance data, determining the equipment heat dissipation performance test result of the liquid cooling device may include the following method.

[0177] According to an embodiment of the present disclosure, in one implementation mode: corresponding to any heat dissipation time interval j=mn, the data change trend is analyzed to determine the equipment heat dissipation performance of the liquid cooling device.

[0178] Operation 61: For any heat dissipation time interval j=mn, a time series {(m1, n1), (m2, n2)…(mk, nk)…}, a temperature series {(T(m1), T(n1)), (T(m2), T(n2))…(T(mk), T(nk))…}, or a temperature difference series {(T(m1)-T(n1)), (T(m2)-T(n2))…(T(mk)-T(nk))…}, or a heat dissipation performance parameter series {a(j1), a(j2)…a(jk)…} can be extracted from the heat dissipation performance data matrix S(j);

[0179] Among them, in the data sequence, (m1, n1), (m2, n2)...(mk, nk) are multiple combinations of m and n corresponding to the same heat dissipation time interval j=mn, for example, the multiple combinations when j=1 are: m1=2, n1=1; m2=3, n2=2; m3=4, n3=3...; the multiple combinations when j=2 are: m1=3, n1=1; m2=4, n2=2; m3=5, n3=3...; a(jk) is the heat dissipation performance parameter corresponding to (mk, nk), k=1, 2, 3...;

[0180] Operation 62: using the time series {(m1+n1) / 2, (m2+n2) / 2…(mk+nk) / 2…} as the abscissa and the temperature series {(T(m1)+T(n1)) / 2, (T(m2)+T(n2)) / 2…(T(mk)+T(nk) / 2)…} corresponding to the abscissas m and n as the ordinates and abscissas, to generate a first heat dissipation change trend graph, wherein in the time series, m and n are arranged in ascending order;

[0181] Alternatively, a first heat dissipation change trend graph is generated by taking the time series {(m1+n1) / 2, (m2+n2) / 2…(mk+nk) / 2…} as the horizontal coordinate and the temperature difference series {(T(m1)-T(n1)), (T(m2)-T(n2))…(T(mk)-T(nk))…} as the vertical coordinate;

[0182] Alternatively, a first heat dissipation change trend graph is generated by taking the time series {(m1+n1) / 2, (m2+n2) / 2…(mk+nk) / 2…} as the horizontal coordinates and the heat dissipation performance parameter series {a(j1), a(j2)…a(jk)…} as the vertical and horizontal coordinates;

[0183] Operation 63: Determine the equipment heat dissipation performance of the liquid cooling device based on the curve form of the first heat dissipation change trend graph.

[0184] If the first heat dissipation change trend graph is in the form of a first curve, the heat dissipation performance of the liquid cooling device is good and is set to the first level performance; if the first heat dissipation change trend graph is in the form of a second curve, the heat dissipation performance of the liquid cooling device is poor and is set to the second level performance. The first curve form is an approximately concave curve, and the second curve form is an approximately convex curve or an approximately linear curve.

[0185] Exemplarily, the generated first heat dissipation change trend graph may be as follows: Figure 4 or Figure 5 shown.

[0186] Figure 4 An exemplary form of a first heat dissipation variation trend diagram according to an embodiment of the present disclosure is schematically shown; Figure 5 Another example form of the first heat dissipation change trend diagram according to an embodiment of the present disclosure is schematically shown.

[0187] like Figure 4 In the figure, the curve is approximately a concave curve. In the early stage of heat dissipation, the slope of the curve is large and the change trend is steep, which means that the temperature of the heat dissipation element decreases rapidly, or the temperature drop difference changes rapidly, or the heat dissipation performance parameters change rapidly. Therefore, it can be determined that the heat dissipation performance of the liquid cooling device is good. Although the curve tends to be flat in the later stage of heat dissipation, this is because the heat dissipation element is already at a lower temperature and the cooling space is small, which does not affect the evaluation of the overall heat dissipation performance.

[0188] like Figure 5 In the figure, the curve is approximately convex (No. 1) or approximately straight (No. 2). In the early stage of heat dissipation, the slope of the curve is small and the change trend is gentle, indicating that the temperature drop rate of the heat dissipation component is slow, or the temperature drop difference changes slowly, or the heat dissipation performance parameter changes slowly. Therefore, it can be determined that the heat dissipation performance of the liquid cooling device is poor. Although the curve tends to be steep in the later stage of heat dissipation, this is because the temperature of the component has dropped rapidly after a long cooling period, which does not affect the evaluation of the overall heat dissipation performance.

[0189] According to the embodiments of the present disclosure, although the temperature change of the heat dissipation element can intuitively reflect the quality of the heat dissipation performance, only referring to the temperature of the heat dissipation element cannot objectively and comprehensively reflect the performance and working conditions of the overall liquid cooling device. Therefore, corresponding to the same heat dissipation time interval j=mn, analyzing the change trend of the thermal data under different time combinations, it is possible to more accurately determine the quality of the heat dissipation performance of the liquid cooling device based on the same heat dissipation time length, thereby achieving a more quantitative and fine-grained analysis, which is convenient for obtaining more accurate performance analysis results.

[0190] According to an embodiment of the present disclosure, another implementation method for determining the equipment heat dissipation performance test results of the liquid cooling device based on M groups of heat dissipation performance data may be: corresponding to different heat dissipation time intervals j=mn, analyzing the data change trend to determine the equipment heat dissipation performance of the liquid cooling device.

[0191] Operation 71: corresponding to multiple heat dissipation time intervals j=mn, based on the same starting time n0, from multiple heat dissipation performance data matrices S(j), extract a time series {(m1, n0), (m2, n0) ...}, extract a temperature series {(T(m1), T(n0)), (T(m2), T(n0)) ...}, or extract a temperature difference series {(T(m1)-T(n0)), (T(m2)-T(n0)) ...}, or extract a heat dissipation performance parameter series {a(j=1, n0), a(j=2, n0) ...};

[0192] Among them, in the data sequence, (m1, n0), (m2, n0) are multiple combinations of m and n corresponding to the same starting time n0, heat dissipation time interval j=1, 2, 3..., such as, the multiple combinations when n0=1 are: m1=2, n0=1; m2=3, n0=1; m3=4, n0=1...; the multiple combinations when n0=2 are: m1=3, n0=2; m2=4, n0=2; m3=5, n0=2...; a(j=k, n0) is the heat dissipation performance parameter corresponding to j=k, starting time n0, k=1, 2, 3...

[0193] Operation 72: Generate a second heat dissipation change trend graph by using the time series {(m1+n0) / 2, (m2+n0) / 2...} as the abscissa and the temperature series {(T(m1)+T(n0)) / 2, (T(m2)+T(n0)) / 2...} corresponding to the abscissas m and n as the ordinate, wherein in the time series, m is arranged in ascending order;

[0194] Alternatively, a second heat dissipation change trend graph is generated by taking the time series {(m1+n0) / 2, (m2+n0) / 2...} as the horizontal coordinate and the temperature difference series {(T(m1)-T(n0)), (T(m2)-T(n0))...} as the vertical coordinate;

[0195] Alternatively, a second heat dissipation change trend graph is generated by taking the time series {(m1+n0) / 2, (m2+n0) / 2...} as the abscissa and the heat dissipation performance parameter series {a(j=1,n0), a(j=2,n0)...} as the ordinate;

[0196] Operation 73: Determine the equipment heat dissipation performance of the liquid cooling device based on the curve form of the second heat dissipation change trend graph.

[0197] If the first heat dissipation change trend graph is in the form of a first curve, the heat dissipation performance of the liquid cooling device is good and is set to the first level performance; if the first heat dissipation change trend graph is in the form of a second curve, the heat dissipation performance of the liquid cooling device is poor and is set to the second level performance. The first curve form is an approximately concave curve, and the second curve form is an approximately convex curve or an approximately linear curve.

[0198] The curve is approximately concave, indicating that in the early stage of heat dissipation, as the heat dissipation time interval (i.e., heat dissipation market) increases, the temperature of the heat dissipation component decreases faster, or the temperature drop difference changes faster, or the heat dissipation performance parameters change faster. Therefore, it can be determined that the liquid cooling device has better equipment heat dissipation performance. Although the curve tends to be flat in the later stage of heat dissipation, this is because the heat dissipation component is already at a lower temperature and the cooling space is smaller, which does not affect the overall heat dissipation performance assessment.

[0199] The curve is approximately convex or linear. This means that in the early stage of heat dissipation, as the heat dissipation time interval (i.e., heat dissipation market) increases, the temperature of the heat dissipation component decreases slowly, or the temperature drop difference changes slowly, or the heat dissipation performance parameters change slowly. Therefore, it can be determined that the heat dissipation performance of the liquid cooling device is poor. Although the curve tends to be steep in the later stage of heat dissipation, this is because the temperature of the component decreases rapidly after a long cooling period, which does not affect the evaluation of the overall heat dissipation performance.

[0200] According to the embodiments of the present disclosure, although the temperature change of the heat dissipation element can intuitively reflect the quality of the heat dissipation performance, only referring to the temperature of the heat dissipation element cannot objectively and comprehensively reflect the performance and working conditions of the overall liquid cooling device. Therefore, corresponding to different heat dissipation time intervals j=mn, the change trend of the thermal data during the heat dissipation process based on the same time starting point is analyzed, which can more accurately determine the quality of the heat dissipation performance of the liquid cooling device based on different heat dissipation time lengths, thereby achieving a more quantitative and fine-grained analysis, which is convenient for obtaining more accurate performance analysis results.

[0201] Based on the above heat dissipation performance testing system, an embodiment of the present disclosure further provides a heat dissipation performance testing method.

[0202] Figure 6 The system principle diagram of the heat dissipation performance testing method according to an embodiment of the present disclosure is schematically shown.

[0203] like Figure 6 As shown, based on the heat dissipation performance test system including a heating element, a circulation pump, a water valve, a controller, a processor, a power supply device, etc., the test method includes:

[0204] Connecting the heating element to the liquid cooling device and using the heating element to simulate the heating state of the equipment, wherein the liquid cooling device includes a liquid cooling circulation pipeline and a regulating structure installed in the liquid cooling circulation pipeline;

[0205] The controller is used to change the operating state of the regulating structure to adjust the flow rate of the coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element;

[0206] The processor is used to perform the following operations: obtaining N groups of basic data corresponding to N moments in the heat dissipation process of the heating element, wherein each group of basic data includes the temperature value of the heating element and the operating state value of the regulating structure; based on the N groups of basic data, calculating and obtaining M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals, wherein each group of heat dissipation performance data includes heat dissipation performance parameters, temperature change values ​​of the heating element, and operating state change values ​​of the regulating structure; based on the M groups of heat dissipation performance data, determining the equipment heat dissipation performance test results of the liquid cooling device, wherein M and N are integers greater than 1.

[0207] Among them, the processor is set at the remote end, and the controller is set on site. The power can be turned on and off through the processor. When the tester issues a power-on command in the processor, the power supply equipment supplies power to the controller, processor, liquid cooling device, heating element, etc.; then the tester can send a power-on command through the processor, and the controller starts to run the device after receiving the power-on command, and detects the current values ​​of each sensor and transmits them back to the controller for storage. As the temperature of the server gradually increases with the increase of running time, the controller will monitor the temperature of the heating element and the preset temperature threshold in real time to calculate the set value of the water valve to increase the heat dissipation speed; after starting up, each device in the device operates normally, and the temperature of the heating element continues to rise. After the controller detects that the temperature exceeds the preset threshold, it will calculate the set value of the water valve and the circulating pump according to the formula and send it to the water valve and the circulating pump, and at the same time transmit the monitored temperature of the heating element and the set value of the water valve and the circulating pump back to the processor. Among them, the specific operation method of the controller generating an adjustment instruction to change the operating state of the adjustment structure can refer to the relevant description of the aforementioned embodiment, which will not be repeated here.

[0208] After receiving the data, the processor saves it and records the corresponding timestamp, obtains a set of basic data including time, water valve opening, circulation pump speed, and heating element temperature, and performs data processing until a shutdown command is received to end the test. The specific method of data processing can be referred to the description of the above embodiment, which will not be repeated here.

[0209] When the processor fails to receive data correctly and in a timely manner or when power-on fails, a fault alarm will be issued, the current test will be terminated and the tester will be notified.

[0210] Further, based on the above heat dissipation performance test method, the controller and the processor can be combined to form a control processor, and the control processor executes the following heat dissipation performance test method. The control processor is in communication connection with sensors, adjustment structures, heating elements, etc. in the liquid cooling device.

[0211] Figure 7 The flowchart of the heat dissipation performance testing method according to the embodiment of the present disclosure is schematically shown.

[0212] like Figure 7 As shown, the method of this embodiment includes operations S701 to S704.

[0213] In operation S701, when the heating element is connected to the liquid cooling circulation pipeline of the liquid cooling device and the heating element is used to simulate the heating state of the device, an adjustment instruction is generated to change the operating state of the adjustment structure installed in the liquid cooling circulation pipeline through the adjustment instruction to adjust the flow of the coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element;

[0214] In operation S702, N groups of basic data corresponding to N moments in the heat dissipation process of the heating element are obtained, wherein each group of basic data includes a temperature value of the heating element and an operating state value of the regulating structure;

[0215] In operation S703, based on the N groups of basic data, M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals are calculated, wherein each group of heat dissipation performance data includes a heat dissipation performance parameter, a temperature change value of a heating element, and a change value of an operating state of an adjustment structure;

[0216] In operation S704, based on M groups of heat dissipation performance data, a device heat dissipation performance test result of the liquid cooling device is determined, where M and N are integers greater than 1.

[0217] Based on the above Figure 7 The present disclosure also provides a heat dissipation performance testing device. Figure 8 The device is described in detail.

[0218] Figure 8 The structural block diagram of the heat dissipation performance testing device according to an embodiment of the present disclosure is schematically shown.

[0219] like Figure 8 As shown, the heat dissipation performance testing device 800 of this embodiment includes an adjustment module 801 , an acquisition module 802 , a calculation module 803 , and a determination module 804 .

[0220] The adjustment module 801 is used to generate an adjustment instruction when the heating element is connected to the liquid cooling circulation pipeline and the heating element is used to simulate the heating state of the equipment. The adjustment instruction is used to change the operating state of the regulating structure installed in the liquid cooling circulation pipeline to adjust the flow rate of the coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element. In one embodiment, the adjustment module 801 can be used to execute the operation S701 described above, which will not be repeated here.

[0221] The acquisition module 802 is used to obtain N groups of basic data corresponding to N moments in the heat dissipation process of the heating element, wherein each group of basic data includes the temperature value of the heating element and the operating status value of the adjustment structure; in one embodiment, the acquisition module 802 can be used to execute the operation S702 described above, which will not be repeated here.

[0222] The calculation module 803 is used to calculate M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals based on N groups of basic data, wherein each group of heat dissipation performance data includes heat dissipation performance parameters, temperature change values ​​of heating elements, and change values ​​of operating states of adjustment structures; in one embodiment, the acquisition module 803 can be used to execute the operation S703 described above, which will not be repeated here.

[0223] The determination module 804 determines the equipment heat dissipation performance test result of the liquid cooling device based on the M sets of heat dissipation performance data, where M and N are integers greater than 1. In one embodiment, the acquisition module 804 can be used to perform the operation S704 described above, which will not be repeated here.

[0224] According to an embodiment of the present disclosure, any multiple modules of the adjustment module 801, the acquisition module 802, the calculation module 803, and the determination module 804 can be combined into one module for implementation, or any one of the modules can be split into multiple modules. Alternatively, at least part of the functions of one or more of these modules can be combined with at least part of the functions of other modules and implemented in one module. According to an embodiment of the present disclosure, at least one of the adjustment module 801, the acquisition module 802, the calculation module 803, and the determination module 804 can be at least partially implemented as a hardware circuit, such as a field programmable gate array (FPGA), a programmable logic array (PLA), a system on a chip, a system on a substrate, a system on a package, an application-specific integrated circuit (ASIC), or can be implemented by hardware or firmware such as any other reasonable way of integrating or packaging the circuit, or implemented in any one of the three implementation methods of software, hardware, and firmware, or in any appropriate combination of any of them. Alternatively, at least one of the adjustment module 801, the acquisition module 802, the calculation module 803, and the determination module 804 can be at least partially implemented as a computer program module, and when the computer program module is run, the corresponding function can be executed.

[0225] Fig. 9 The block diagram of an electronic device suitable for implementing a heat dissipation performance testing method according to an embodiment of the present disclosure is schematically shown. The device can be suitable for implementing the above-mentioned Figure 7 Heat dissipation performance testing method of the illustrated embodiment

[0226] like Fig. 9 As shown, the electronic device 900 according to an embodiment of the present disclosure includes a processor 901, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 902 or a program loaded from a storage part 908 to a random access memory (RAM) 903. The processor 901 may include, for example, a general-purpose microprocessor (e.g., a CPU), an instruction set processor and / or a related chipset and / or a dedicated microprocessor (e.g., an application-specific integrated circuit (ASIC)), etc. The processor 901 may also include an onboard memory for caching purposes. The processor 901 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present disclosure.

[0227] In RAM 903, various programs and data required for the operation of electronic device 900 are stored. Processor 901, ROM 902 and RAM 903 are connected to each other via bus 904. Processor 901 performs various operations of the method flow according to the embodiment of the present disclosure by executing the program in ROM 902 and / or RAM 903. It should be noted that the program can also be stored in one or more memories other than ROM 902 and RAM 903. Processor 901 can also perform various operations of the method flow according to the embodiment of the present disclosure by executing the program stored in the one or more memories.

[0228] According to an embodiment of the present disclosure, the electronic device 900 may further include an input / output (I / O) interface 905, which is also connected to the bus 904. The electronic device 900 may further include one or more of the following components connected to the input / output (I / O) interface 905: an input portion 906 including a keyboard, a mouse, etc.; an output portion 907 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage portion 908 including a hard disk, etc.; and a communication portion 909 including a network interface card such as a LAN card, a modem, etc. The communication portion 909 performs communication processing via a network such as the Internet. A drive 910 is also connected to the input / output (I / O) interface 905 as needed. A removable medium 911, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 910 as needed, so that a computer program read therefrom is installed into the storage portion 908 as needed.

[0229] The present disclosure also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or may exist independently without being assembled into the device / apparatus / system. The above computer-readable storage medium carries one or more programs, and when the above one or more programs are executed, the computer-readable storage medium implements the operation according to the embodiment. Figure 7 The heat dissipation performance testing method of the illustrated embodiment.

[0230] According to an embodiment of the present disclosure, a computer-readable storage medium may be a non-volatile computer-readable storage medium, for example, may include but is not limited to: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In the present disclosure, a computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by or in combination with an instruction execution system, an apparatus or a device. For example, according to an embodiment of the present disclosure, a computer-readable storage medium may include the ROM 902 and / or RAM 903 described above and / or one or more memories other than ROM 902 and RAM 903.

[0231] The embodiment of the present disclosure also includes a computer program product, which includes a computer program, and the computer program contains program code for executing the method shown in the flowchart. When the computer program product is run in a computer system, the program code is used to enable the computer system to implement the method provided by the embodiment of the present disclosure.

[0232] The above functions defined in the system / device of the embodiment of the present disclosure are performed when the computer program is executed by the processor 901. According to the embodiment of the present disclosure, the system, device, module, unit, etc. described above can be implemented by a computer program module.

[0233] In one embodiment, the computer program may be based on a tangible storage medium such as an optical storage device, a magnetic storage device, etc. In another embodiment, the computer program may also be transmitted and distributed in the form of a signal on a network medium, and downloaded and installed through the communication part 909, and / or installed from a removable medium 911. The program code contained in the computer program may be transmitted using any appropriate network medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0234] In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 909, and / or installed from the removable medium 911. When the computer program is executed by the processor 901, the above functions defined in the system of the embodiment of the present disclosure are performed. According to the embodiment of the present disclosure, the system, device, means, module, unit, etc. described above can be implemented by a computer program module.

[0235] According to an embodiment of the present disclosure, the program code for executing the computer program provided by the embodiment of the present disclosure can be written in any combination of one or more programming languages. Specifically, these computing programs can be implemented using high-level process and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages ​​include, but are not limited to, Java, C++, python, "C" language or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, partially on the remote computing device, or entirely on the remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (for example, using an Internet service provider to connect through the Internet).

Claims

1. A heat dissipation performance testing system, characterized in that: The system comprises: Heating element, used to simulate the heating state of the equipment; A liquid cooling device, comprising a liquid cooling circulation pipeline and a regulating structure installed in the liquid cooling circulation pipeline, wherein the heating element is installed in the liquid cooling circulation pipeline; A controller, used to change the operating state of the regulating structure to adjust the flow rate of the coolant in the liquid cooling circulation pipeline to achieve heat dissipation for the heating element; A processor that performs the following operations: Acquire N groups of basic data corresponding to N moments in the heat dissipation process of the heating element, wherein each group of the basic data includes a temperature value of the heating element and an operating state value of the regulating structure; Based on the N groups of basic data, M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals are calculated, wherein each group of heat dissipation performance data includes a heat dissipation performance parameter, a temperature change value of a heating element, and a change value of an operating state of an adjustment structure; Based on the M groups of heat dissipation performance data, a heat dissipation performance test result of the liquid cooling device is determined, wherein M and N are integers greater than 1.

2. The system according to claim 1, characterized in that: The liquid cooling circulation pipeline includes a liquid supply pipeline and a liquid return pipeline; The regulating structure includes a water valve and a circulation pump. The water valve is installed in the liquid supply pipeline, and the circulation pump is installed in the liquid return pipeline. The operating state value of the water valve includes the water valve opening, and the operating state value of the circulation pump includes the circulation pump speed.

3. The system according to claim 1 or 2, characterized in that: Based on the N groups of basic data, M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals are calculated and obtained, including: Based on the N groups of basic data, M groups of heating element temperature change values ​​and M groups of regulating structure operating state change values ​​corresponding to the M different heat dissipation time intervals are calculated; Based on the M groups of heating element temperature change values ​​and the M groups of regulating structure operating state change values, M groups of heat dissipation performance parameters corresponding to M different heat dissipation time intervals are calculated.

4. The system according to claim 3, characterized in that The change value of the operating state of the regulating structure includes a change value of the water valve opening and a change value of the circulating pump speed; based on the temperature change values ​​of the M groups of heating elements and the change values ​​of the operating state of the M groups of regulating structures, the M groups of heat dissipation performance parameters corresponding to M different heat dissipation time intervals are calculated, including: Determine the temperature influence coefficient, the water valve influence coefficient, and the circulation pump influence coefficient, wherein the temperature influence coefficient is used to characterize the correlation between the temperature change of the heating element and the heat dissipation performance, the water valve influence coefficient is used to characterize the correlation between the water valve opening change and the heat dissipation performance, and the circulation pump influence coefficient is used to characterize the correlation between the circulation pump speed change and the heat dissipation performance; A first heat dissipation performance component is calculated based on the temperature influence coefficient and the temperature change value of the heating element, a second heat dissipation performance component is calculated based on the water valve influence coefficient and the water valve opening change value, and a third heat dissipation performance component is calculated based on the circulation pump influence coefficient and the circulation pump speed change value; M groups of heat dissipation performance parameters corresponding to the M different heat dissipation time intervals are calculated using the M groups of the first heat dissipation performance components, the M groups of the second heat dissipation performance components, and the M groups of the third heat dissipation performance components corresponding to the M different heat dissipation time intervals.

5. The system according to claim 4, characterized in that: The temperature influence coefficient is greater than the water valve influence coefficient; The temperature influence coefficient is greater than the circulation pump influence coefficient.

6. The system according to claim 1 or 2, characterized in that: The basic data also includes the pressure value of the coolant in the liquid cooling circulation pipeline; based on the N groups of basic data, the M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals are calculated and include: Based on the N groups of basic data, M groups of heating element temperature change values ​​and M groups of pressure change values ​​corresponding to M different heat dissipation time intervals are calculated; Based on the M groups of heating element temperature change values ​​and the M groups of pressure change values, M groups of heat dissipation performance parameters corresponding to M different heat dissipation time intervals are calculated.

7. The system according to claim 1, characterized in that Changing the operating state of the regulating structure comprises: Generate K adjustment instructions to complete K adjustments of the operating state of the adjustment structure, wherein generating any k-th adjustment instruction includes: Acquire the k-1th operating state value of the regulating structure based on the k-1th adjustment instruction; Obtaining the k-1th reference deviation of the k-1th adjustment of the preset reference variable and the kth reference deviation of the kth adjustment; generating a kth operating state value of the regulating structure based on the k-1th reference deviation and / or the kth reference deviation, and the k-1th operating state value; and Generate a kth adjustment instruction based on the kth operating state value; K is an integer greater than 1, k=2,…K.

8. The system according to claim 7, characterized in that: The regulating structure includes a water valve, the preset reference variable includes the temperature of the heating element, and the reference deviation is the deviation between the temperature of the heating element and a preset temperature threshold; and / or The regulating structure includes a circulation pump, the preset reference variable includes the pressure of the liquid cooling circulation pipeline, and the reference deviation is the deviation between the pressure of the liquid cooling circulation pipeline and a preset pressure threshold.

9. A heat dissipation performance testing method, characterized in that: The method comprises: When a heating element is connected to a liquid cooling circulation pipeline of a liquid cooling device and the heating element is used to simulate a heating state of the device, an adjustment instruction is generated to change the operating state of a regulating structure installed in the liquid cooling circulation pipeline through the adjustment instruction to adjust the flow of coolant in the liquid cooling circulation pipeline to achieve heat dissipation of the heating element; Acquire N groups of basic data corresponding to N moments in the heat dissipation process of the heating element, wherein each group of the basic data includes a temperature value of the heating element and an operating state value of the regulating structure; Based on the N groups of basic data, M groups of heat dissipation performance data corresponding to M different heat dissipation time intervals are calculated, wherein each group of heat dissipation performance data includes a heat dissipation performance parameter, a temperature change value of a heating element, and a change value of an operating state of an adjustment structure; Based on the M groups of heat dissipation performance data, a heat dissipation performance test result of the liquid cooling device is determined, wherein M and N are integers greater than 1.

10. A computer-readable storage medium having a computer program or instruction stored thereon, characterized in that: When the computer program or instruction is executed by a processor, the steps of the method according to claim 9 are implemented.

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