Intelligent testing method and system for connection state of electrical connector

Abstract

This application relates to the field of electrical connector testing technology, specifically to an intelligent testing method and system for the connection status of electrical connectors. The method includes: acquiring the resistance value and temperature parameters of the electrical connector and circuit at various moments during vibration testing; obtaining the resistivity coefficient at each moment by analyzing the difference between the resistance value at each moment and the initial resistance value; obtaining the circuit state coefficient at each moment by analyzing the changes in resistance value and resistivity coefficient at each moment and the differences in temperature data, and marking the corresponding moments; obtaining the stable parameters for each marked moment; filtering all marked moments to obtain stable moments; and obtaining the overall circuit fluctuation index based on the number of stable moments and the distribution of the stable parameters, thereby testing the connection status of the electrical connector. This application aims to improve the accuracy of electrical connector connection status testing.

Description

Technical Field

[0001] This application relates to the field of electrical connector testing technology, specifically to an intelligent testing method and system for the connection status of electrical connectors. Background Technology

[0002] Electrical connectors are used in various electronic devices to achieve electrical connections between circuits. Testing the connection status of electrical connectors is crucial for ensuring the safe, stable, and efficient operation of electrical systems. Regular connector inspection can promptly identify problems such as poor contact, loosening, or corrosion, preventing faults such as current interruptions, overheating, or signal distortion. This improves system reliability and performance, extends equipment lifespan, ensures compliance with industry standards, and guarantees the safety and long-term stability of the equipment.

[0003] In some devices, electrical connectors may shift due to vibration or movement, causing friction and vibration between the connector and the circuit. This friction can cause fluctuations in contact resistance, leading to unstable circuit connections. Consequently, this can distort the connection status test results of the electrical connector, affecting its working efficiency and overall performance. Summary of the Invention

[0004] In view of the above, it is necessary to provide an intelligent testing method and system for the connection status of electrical connectors to solve the above problems.

[0005] The first aspect of this application provides an intelligent testing method for the connection status of an electrical connector, the method comprising:

[0006] Obtain the initial resistance value of the electrical connector under test before vibration testing, as well as the resistance value and temperature parameters at various moments during the vibration test.

[0007] The resistance coefficient at each moment is obtained by comparing the resistance value at each moment with the initial resistance value; the circuit state coefficient at each moment is obtained by comparing the resistance value, resistance coefficient and temperature parameters at each moment with those of adjacent moments.

[0008] Based on the numerical characteristics of the circuit state coefficients, the corresponding times are marked; the changes in the circuit state coefficients of the marked times are compared with those of the adjacent times to obtain the change stability parameters of each marked time.

[0009] Based on the changing stability parameters, all marked moments are filtered to obtain stable moments; according to the number of stable moments and their distribution, combined with the overall distribution characteristics of the changing stability parameters, the overall circuit fluctuation index is obtained, and the connection status of the electrical connector is tested.

[0010] Specifically, obtaining the resistance coefficient at each moment involves:

[0011] The difference between the resistance value at each moment during the vibration test and the initial resistance value is calculated and denoted as the first difference. The normalized value obtained by fusing the negative correlation mapping result of the initial resistance value with the first difference is used as the resistance coefficient at each moment.

[0012] The specific process for obtaining the circuit state coefficients at each time point is as follows:

[0013] The wear coefficient at each moment is obtained by measuring the changes in resistance value and resistivity at each moment and between adjacent moments.

[0014] The difference in temperature parameters between each time point and adjacent time points is recorded as the temperature rise value at each time point;

[0015] Based on the wear coefficient and the temperature rise value at each time, the circuit state coefficient at each time is obtained; wherein, the circuit state coefficient is positively correlated with the wear coefficient and negatively correlated with the temperature rise value at each time.

[0016] Specifically, the wear coefficients obtained at each time point are as follows:

[0017] Calculate the ratio of the resistance value of the previous moment to the resistance value of each moment, and record the difference between the resistance coefficient of each moment and the resistance coefficient of the previous moment as the second difference; combine the resistance ratio and the second difference to obtain the wear coefficient of each moment.

[0018] Specifically, marking the corresponding time points involves marking the times when the circuit state coefficient is less than a preset value.

[0019] The formula for the change stability parameter at each marked time point is: ;in, This represents the stability parameter at each marked time point; Represents the circuit state coefficients at each marked time; Represents the circuit state coefficients at the next time step after each marked time step; This represents the derivative of the softsign function; It represents the absolute value of the difference between the circuit state coefficient at each marked time and the next time.

[0020] Specifically, the stable moment is the marked moment when the changing stable parameter is greater than or equal to a preset stable threshold.

[0021] Specifically, the obtained overall circuit fluctuation index is as follows:

[0022] The number of stable moments during the vibration test is counted and recorded as the duration number; the number of moments before the first stable moment is counted and recorded as the transition number; the ratio of the transition number to the duration number is calculated, and combined with the negative correlation mapping of the mean of the change stability parameters of all marked moments, the overall circuit fluctuation index is obtained.

[0023] The process of testing the connection status of the electrical connector specifically includes:

[0024] When the overall fluctuation index of the circuit is greater than the preset fluctuation threshold, the electrical connector connection status is determined to be abnormal; otherwise, the electrical connector connection status is determined to be normal.

[0025] Secondly, embodiments of this application also provide an intelligent testing system for the connection status of an electrical connector, including a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor executes the computer program to implement the steps of any of the methods described above.

[0026] In the above scheme, the resistance and temperature parameters during the vibration test of the electrical connector are analyzed. By comparing the changes in resistance and temperature parameters at adjacent moments, and combining the changes in resistance at each moment relative to the period before the vibration test, a circuit state coefficient is obtained. Its beneficial effect lies in measuring the relationship between the wear degree of the electrical connector and the current contact surface and the change in temperature parameters. Since the wear debris generated by the wear on the contact surface of the electrical connector softens as the temperature increases, the resistance decreases. Therefore, based on the numerical characteristics of the circuit state coefficient, the corresponding moments are marked, which helps to identify the moments when the resistance decreases after wear occurs, facilitating subsequent analysis based on these moments. Considering the contact surface... As temperature parameters rise, wear occurs, producing wear debris, which then softens and forms abrasive particles, affecting the resistance value. Therefore, by comparing the changes in the circuit state coefficient at a marked time with its adjacent times, a stable parameter is obtained for each marked time. This is beneficial for analyzing the vibration resistance of the electrical connector under load. Based on this stable parameter, all marked times are filtered to obtain stable times, facilitating subsequent analysis based on the distribution of stable times to obtain the overall circuit fluctuation index. This is beneficial for distinguishing the influence of contact resistance and temperature rise resistance on the load circuit, thereby obtaining the true test results of the electrical connector and improving the accuracy of the electrical connector connection state test. Attached Figure Description

[0027] Figure 1 A flowchart illustrating the steps of an intelligent testing method for the connection status of an electrical connector, provided as an embodiment of this application;

[0028] Figure 2This is a schematic diagram illustrating the acquisition of the overall circuit fluctuation index according to one embodiment of this application. Detailed Implementation

[0029] In the description of the embodiments in this application, the words "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary," "or," and "for example" is intended to present the relevant concepts in a specific manner.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0031] It should also be noted that the terms "first" and "second" in this application and its accompanying drawings are used to distinguish similar objects, rather than to describe a specific order or sequence. The methods disclosed in the embodiments of this application or the methods shown in the flowcharts include one or more steps for implementing the method. Without departing from the scope of protection of this application, the execution order of multiple steps can be interchanged, and some steps can also be deleted.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0033] The following description, in conjunction with the accompanying drawings, details the specific scheme of the intelligent testing method and system for the connection status of an electrical connector provided in this application.

[0034] Please see Figure 1 The diagram illustrates a flowchart of a smart testing method for the connection status of an electrical connector according to an embodiment of this application. The method includes the following steps:

[0035] The first step: Obtain the initial resistance value of the electrical connector to be tested before the vibration test, as well as the resistance value and temperature parameters at various moments during the vibration test.

[0036] For electrical connectors operating in vibration environments, prolonged vibration can adversely affect their safety and stability. Therefore, when conducting intelligent testing of the connector's connection status, it is necessary to analyze the impact of vibration on the connector's connection status. First, a vibration drive module is installed, which can adjust the vibration frequency and amplitude to simulate the connector's vibration state under different environments. Then, the connector to be tested is connected to the test circuit. Before vibration testing, the connected circuit is checked to ensure the stability and effectiveness of the vibration test. Second, current and voltage sensors are used to monitor the circuit, acquiring current and voltage parameters at various times, and Ohm's law is used to calculate the resistance value between the connector and the circuit at each moment. It should be noted that the current and voltage sensors are placed outside the vibration drive module to prevent vibration from affecting the accuracy of the experimental results. An infrared temperature sensor is used to acquire the temperature parameters of the connector pins at various times during the test.

[0037] It should be noted that the current, voltage, and temperature parameters are collected synchronously, with a data collection time interval of 1 minute. The vibration test duration is 10 hours, which can be adjusted by the implementer according to the actual situation. The resistance value before the vibration test is performed is recorded as the initial resistance value.

[0038] The second step is to obtain the resistance coefficient at each moment by comparing the resistance value at each moment with the initial resistance value; and to obtain the circuit state coefficient at each moment by comparing the resistance value, resistance coefficient, and temperature parameters between each moment and adjacent moments.

[0039] During use, although an electrical connection is formed between the pins and the circuit interface, from a microscopic perspective, the contact between the pins and the interface is not completely flat and perfect. In fact, the contact surface usually has a certain degree of surface roughness, manifested as irregular undulations and unevenness. Due to the unevenness of the contact surface, the contact resistance between the contact points may be uneven, which can affect the electrical and thermal performance of the electrical connector. Especially under high current loads, it may lead to an increase in contact temperature or the risk of poor contact.

[0040] When electrical connectors experience vibration and friction during use, the peaks of the contact surfaces collide, generating wear debris. This debris may be present at the peaks or valleys, reducing the contact area and increasing the contact resistance, thus affecting the overall circuit efficiency. The resistance coefficient at each moment is obtained by analyzing the difference between the resistance value at each moment and the initial resistance value: the difference between the resistance value at each moment and the resistance value before the vibration test is calculated and recorded as the first difference; the normalized value obtained by fusing the negative correlation mapping result of the initial resistance value with the first difference is used as the resistance coefficient at each moment.

[0041] In this embodiment, the initial resistance value is denoted as Let R be the resistance value at each moment, and the formula for the resistivity at each moment is as follows: ;in, This represents the normalization function.

[0042] If an electrical connector is exposed to a vibrating environment for an extended period during use, the friction at the contact interface caused by the vibration will generate tiny abrasive particles. These particles may accumulate between the contact points or contact surfaces, leading to an increase in the gap between the electrical connector and the circuit, a reduction in the contact area, and an increase in contact resistance.

[0043] Based on this, the wear coefficient at each moment is obtained by analyzing the changes in resistance value and resistance coefficient between each moment and adjacent moments: the ratio of the resistance value of the moment before each moment to the resistance value of each moment is calculated, and the difference between the resistance coefficient of each moment and the resistance coefficient of the moment before each moment is recorded as the second difference; the resistance value ratio and the second difference are fused together to obtain the wear coefficient at each moment.

[0044] In this embodiment, the difference between resistance coefficients is measured by the difference value; multiple variables are fused by multiplication, that is, the wear coefficient is specifically the product of the ratio of resistance values ​​and the second difference.

[0045] It should be understood that a higher wear coefficient means more wear debris is generated on the contact surface between the electrical connector and the circuit connection due to friction, and a greater impact on the contact surface.

[0046] Continuous circuit load causes the circuit temperature to rise, especially at the connection between the electrical connector and the circuit. Due to the presence of contact resistance, the temperature rise at this contact point is more pronounced. This temperature rise is accompanied by an increase in the resistance of the circuit conductors, which further increases the resistance of the contact point.

[0047] Based on this, the circuit state coefficient at each moment is obtained by combining the temperature data at each moment with the wear coefficient, according to the difference between the temperature parameters at each moment and the previous moment: the temperature rise value at each moment is recorded as the temperature rise value at each moment; the circuit state coefficient at each moment is obtained based on the wear coefficient and the temperature rise value at each moment; wherein, the circuit state coefficient is positively correlated with the wear coefficient and negatively correlated with the temperature rise value at each moment.

[0048] In this embodiment, the wear coefficient at each moment is denoted as F, the temperature rise at each moment is denoted as T, and the formula for the circuit state coefficient at each moment is as follows: ; This indicates a parameter that is preset to be greater than zero, to prevent the denominator from being 0. The circuit state coefficient is used to represent the correspondence between the circuit wear coefficient and temperature rise at each moment and the previous moment.

[0049] The third step is to mark the corresponding time based on the numerical characteristics of the circuit state coefficients; compare the changes in the circuit state coefficients of the marked time with those of its adjacent time to obtain the stable parameters of each marked time.

[0050] The temperature rise caused by the continuous current flowing through the circuit during vibration softens the wear debris generated by vibration abrasion. This softened debris is then deformed by the pressure of the connector pins and circuit interface, increasing the contact area between the pins and the interface and reducing the contact resistance. Therefore, to address the resistance fluctuations under this phenomenon, the time when the circuit state index is less than a preset value is marked. In this embodiment, the preset value is 0. When the circuit state index is less than the preset value, the overall circuit resistance decreases, meaning the decrease in contact resistance is greater than the increase in resistance due to temperature rise.

[0051] Furthermore, under temperature rise, the softened wear debris oxidizes more rapidly, forming abrasive grains. This increases resistance, and the accumulation of abrasive grains reduces the contact area, increasing contact resistance. This state leads to increased additional resistance in the circuit, thus affecting the overall circuit output efficiency. Based on this, by comparing the changes in the circuit state coefficients at the marked time with those of adjacent times, the stable parameter for each marked time is obtained, with the following formula: ;in, Represents the circuit state coefficients at each marked time; Represents the circuit state coefficients at the next time step after each marked time step; It represents the absolute value of the difference between the circuit state coefficients at each marked time and the next time. The derivative of the softsign function is larger the closer the independent variable is to 0, and the closer it is to 1. It should be understood that... , The closer the value is to 0, the closer the circuit state is to the marked time and its adjacent time, and the larger the stability parameter is.

[0052] The fourth step: Based on the changing stability parameters, all marked moments are filtered to obtain stable moments; based on the number of stable moments and their distribution, combined with the overall distribution characteristics of the changing stability parameters, the overall circuit fluctuation index is obtained, and the connection status of the electrical connector is tested.

[0053] Electrical connectors require a long lifespan during use, while the current remains connected for extended periods. To ensure circuit safety and efficiency, the current supplied by the connectors should remain consistently stable throughout operation, with the transition time from current fluctuations to current stability being as short as possible and the duration as long as possible. Therefore, the stability parameters at all marked moments are acquired. Moments where the stability parameters are greater than or equal to a preset stability threshold are designated as stable moments. The number of stable moments is counted and recorded as the duration count. The number of moments preceding the first stable moment is counted and recorded as the transition count. The ratio of the transition count to the duration count is calculated, and combined with the negative correlation mapping of the mean stability parameters at all marked moments, the overall circuit fluctuation index is obtained.

[0054] In this embodiment, the number of durations is denoted as A, the number of transitions is denoted as B, and the mean of the stability parameter of all marked moments is denoted as... The formula for the overall fluctuation index of the circuit is as follows: The schematic diagram for obtaining the overall circuit fluctuation index is shown below. Figure 2 As shown.

[0055] It should be understood that, It can be used to represent the ratio of transition time to duration. The larger the value, the greater the circuit fluctuation and the more unstable the connection state of the electrical connector, that is, the greater the overall circuit fluctuation index. The larger the overall stability parameter, the smaller the overall circuit fluctuation, that is, the smaller the overall circuit fluctuation index.

[0056] Based on a preset fluctuation threshold, the connection status of the electrical connector is tested according to the overall circuit fluctuation index: when the overall circuit fluctuation index is greater than the preset fluctuation threshold, the connection status of the electrical connector is determined to be abnormal; otherwise, the connection status of the electrical connector is determined to be normal. In this embodiment, the fluctuation threshold is set to 0.6, and the implementer can adjust it according to the actual situation.

[0057] Based on the same inventive concept as the above method, this application embodiment also provides an intelligent testing system for the connection status of an electrical connector, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps of any one of the above-described intelligent testing methods for the connection status of an electrical connector.

[0058] In summary, this application analyzes the resistance and temperature parameters during vibration testing of electrical connectors. By comparing the changes in resistance and temperature parameters at adjacent moments, and combining the changes in resistance at each moment relative to the period before the vibration test, a circuit state coefficient is obtained. Its beneficial effect lies in measuring the relationship between the wear degree of the electrical connector and the current contact surface and the change in temperature parameters. Since the wear debris generated by the wear on the contact surface between the electrical connector and the circuit softens as the temperature increases, the resistance decreases. Therefore, based on the numerical characteristics of the circuit state coefficient, marking the corresponding moments helps to identify the moments when the resistance decreases after wear occurs, facilitating subsequent analysis based on these moments. Considering the contact... The process of wear and tear on the surface as temperature rises, producing wear debris, softening the debris, and forming abrasive grains, all affect the resistance value. Therefore, by comparing the changes in the circuit state coefficient at the marked time with those adjacent times, a stable parameter is obtained for each marked time. This is beneficial for analyzing the vibration resistance of the electrical connector under load. Based on the stable parameter, all marked times are filtered to obtain stable times, which facilitates subsequent analysis based on the distribution of stable times to obtain the overall circuit fluctuation index. This is beneficial for distinguishing the influence of contact resistance and temperature rise resistance on the load circuit, thereby obtaining the true test results of the electrical connector and improving the accuracy of the electrical connector connection state test.

[0059] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than that shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description; sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0060] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from its essential characteristics. Therefore, the embodiments described above should be considered exemplary and non-limiting in all respects; modifications to the technical solutions described in the foregoing embodiments, or equivalent substitutions of some technical features, without causing the essence of the corresponding technical solutions to deviate from the scope of the technical solutions in the embodiments of this application, should all be included within the protection scope of this application.

Claims

1. An intelligent testing method for the connection status of an electrical connector, characterized in that, The method includes the following steps: Obtain the initial resistance value of the electrical connector under test before vibration testing, as well as the resistance value and temperature parameters at various moments during the vibration test. The resistance coefficient at each moment is obtained by comparing the resistance value at each moment with the initial resistance value; the circuit state coefficient at each moment is obtained by comparing the resistance value, resistance coefficient and temperature parameters at each moment with those of adjacent moments. Based on the numerical characteristics of the circuit state coefficients, the corresponding time points are marked; the changes in the circuit state coefficients of the marked time points are compared with those of their adjacent time points to obtain the change stability parameters of each marked time point. Based on the changing stable parameters, all marked moments are filtered to obtain stable moments; based on the number of stable moments and their distribution, combined with the overall distribution characteristics of the changing stable parameters, the overall circuit fluctuation index is obtained, and the connection status of the electrical connector is tested. The specific steps to obtain the resistance coefficient at each moment are as follows: calculate the difference between the resistance value at each moment during the vibration test and the initial resistance value, and record it as the first difference; the normalized value obtained by fusing the negative correlation mapping result of the initial resistance value with the first difference is used as the resistance coefficient at each moment. The specific process for obtaining the circuit state coefficients at each time point is as follows: The wear coefficient at each time point is obtained by analyzing the changes in resistance value and resistivity between each time point and adjacent time points; the difference in temperature parameters between each time point and adjacent time points is recorded as the temperature rise value at each time point; based on the wear coefficient and the temperature rise value at each time point, the circuit state coefficients at each time point are obtained; the wear coefficient at each time point is denoted as F, and the temperature rise value at each time point is denoted as T. The formula for the circuit state coefficients at each time point is: ; This indicates a parameter that is preset to be greater than zero, to prevent the denominator from being 0; The wear coefficient at each moment is obtained as follows: calculate the ratio of the resistance value of the previous moment to the resistance value of each moment, and record the difference between the resistance coefficient of each moment and the resistance coefficient of the previous moment as the second difference; combine the resistance ratio and the second difference to obtain the wear coefficient at each moment. The formula for the change stability parameter at each marked time point is: ;in, This represents the stability parameter at each marked time point; Represents the circuit state coefficients at each marked time; Represents the circuit state coefficients at the next time step after each marked time step; This represents the derivative of the softsign function; It represents the absolute value of the difference between the circuit state coefficients at each marked time and the next time. The overall circuit fluctuation index is obtained as follows: count the number of stable moments during the vibration test, and record them as the number of durations; count the number of moments before the first stable moment, and record them as the number of transitions; calculate the ratio of the number of transitions to the number of durations, and combine it with the negative correlation mapping of the mean of the change stability parameters of all marked moments to obtain the overall circuit fluctuation index.

2. The intelligent testing method for the connection status of an electrical connector as described in claim 1, characterized in that, The corresponding times are marked, specifically: the times when the circuit state coefficient is less than a preset value are marked.

3. The intelligent testing method for the connection status of an electrical connector as described in claim 1, characterized in that, The stable moment is specifically the marked moment when the changing stable parameter is greater than or equal to the preset stable threshold.

4. The intelligent testing method for the connection status of an electrical connector as described in claim 1, characterized in that, The specific process for testing the connection status of electrical connectors is as follows: When the overall circuit fluctuation index is greater than the preset fluctuation threshold, the electrical connector connection status is judged to be abnormal; otherwise, the electrical connector connection status is judged to be normal.

5. An intelligent testing system for the connection status of an electrical connector, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes a computer program, it implements the steps of the method as described in any one of claims 1-4.

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