Photoelectric chip packaging structure and packaging method thereof

Abstract

The invention provides a photoelectric chip packaging structure and a packaging method thereof. The photoelectric chip packaging method comprises the following steps that an initial structure is provided, the initial structure comprises a substrate, an optical chip arranged on the surface of the substrate and an electric chip arranged on the surface of the optical chip, and the surface of one side of the optical chip is provided with an optical port; a heat dissipation cover plate is provided and packaged to the surface of the initial structure, the heat dissipation cover plate comprises a first body and a first bent part surrounding the edge of the first body, the first body is correspondingly provided with a notch above the light port, the first bent part is correspondingly provided with an opening in the side of the light port, the notch is communicated with the opening, and the first bent part is provided with a second bent part; a protection structure covering the notch and the opening is further formed on the surface of the heat dissipation cover plate. According to the technical scheme, the protection structure covering the optical port is arranged in the photoelectric packaging structure, so that the optical port is protected in the process and transportation before shipment, the optical port is prevented from being polluted or damaged in the process, and the cleanliness and the yield of products are ensured.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to an optoelectronic chip packaging structure and a packaging method thereof. Background Art

[0002] With the development of information technology, higher and higher requirements are put forward for the transmission rate, delay, energy efficiency and other aspects of optical modules. The combined optoelectronic package (CPO) structure that encapsulates optical chips and electrical chips in the same package has been more and more widely used. In the optoelectronic chip packaging structure, silicon through vias are made on the optical chip or electrical chip, and then vertically stacked with the matching electrical chip / optical chip. The three-dimensional optoelectronic integrated package formed has the advantages of high interconnection density and small parasitic parameters. It is an important development direction for high-speed optical interconnection. However, during the packaging process, the optical port of the optical chip is easily contaminated or damaged during the plastic packaging process. Photosensitive devices have extremely high requirements for the cleanliness of the optical port. Therefore, how to protect the optical port of the optical chip and prevent the optical port from being contaminated or damaged during the process is a problem that needs to be solved at present. Summary of the invention

[0003] The technical problem to be solved by the present invention is how to protect the optical port of an optical chip and prevent the optical port from being contaminated or damaged during the process, and to provide an optoelectronic chip packaging structure and a packaging method thereof.

[0004] In order to solve the above problems, the present invention provides an optoelectronic chip packaging method, comprising the following steps: providing an initial structure, the initial structure comprising a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, wherein the surface of one side of the optical chip has an optical port; providing a heat dissipation cover plate and packaging the heat dissipation cover plate to the surface of the initial structure, wherein the heat dissipation cover plate comprises a first body and a first bending portion surrounding the edge of the first body, the first body is provided with a notch corresponding to the top of the optical port, the first bending portion is provided with an opening corresponding to the side of the optical port, the notch is connected to the opening, and a protective structure covering the notch and the opening is formed on the surface of the heat dissipation cover plate facing away from the substrate.

[0005] In order to solve the above problems, the present invention provides an optoelectronic chip packaging structure, including: an initial structure, the initial structure includes a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, and the surface of one side of the optical chip has an optical port; a heat dissipation cover plate, the heat dissipation cover plate includes a first body and a first bending portion surrounding the edge of the first body, the first body is provided with a notch correspondingly above the optical port, the first bending portion is provided with an opening correspondingly on the side of the optical port, the notch is connected to the opening, and a protective structure covering the notch and the opening is formed on the surface of the heat dissipation cover plate away from the substrate.

[0006] The above technical solution sets a protective structure covering the notches and openings on the surface of the heat dissipation cover plate, thereby forming a closed cavity to protect the light port during the packaging process, and protecting the light port during transportation before shipment, thereby preventing the light port from being contaminated or damaged during the process and ensuring the cleanliness and yield of the product.

[0007] It should be understood that the above general description and the detailed description below are exemplary and explanatory only and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but where appropriate, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following is a brief introduction to the drawings required for the description of the specific embodiments. Obviously, the drawings described below are only some specific embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 The figure is a top view of an optoelectronic chip packaging structure in the prior art.

[0010] Figure 2 for Figure 1 Cross-sectional view along AA' direction.

[0011] Figure 3 This is a flow chart of the steps of the first embodiment of the optoelectronic chip packaging method of the present invention.

[0012] Figure 4 The present invention provides a schematic structural diagram of an initial structure of the first embodiment of the optoelectronic chip packaging method.

[0013] Figure 5 The present invention provides a schematic structural diagram of a heat dissipation cover plate according to the first embodiment of the optoelectronic chip packaging method of the present invention.

[0014] Figure 6 This is a structural schematic diagram of packaging the heat dissipation cover plate onto the initial structure surface according to the first embodiment of the optoelectronic chip packaging method of the present invention.

[0015] Figure 7 It is a structural schematic diagram of removing the protective structure of the first embodiment of the optoelectronic chip packaging method of the present invention.

[0016] Figure 8 It is a structural schematic diagram of an optoelectronic chip packaging structure formed by the second embodiment of the optoelectronic chip packaging method of the present invention. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1-2 ,in, Figure 1 It is a top view of an optoelectronic chip packaging structure in the prior art. Figure 2 for Figure 1 The cross-sectional view along the AA' direction. Figure 1-2 As shown, the optoelectronic chip packaging structure includes a substrate 11, an optical chip 12, an electrical chip 13, and a heat dissipation cover plate 14. Among them, a light port 120 is provided on the surface of one side of the optical chip 12, and a notch 140 is provided on the surface of the heat dissipation cover plate 14, and the notch 140 exposes the light port 120. The optoelectronic chip packaging structure is used in photosensitive devices, and the light port 120 needs to remain exposed to align and connect with the external optical fiber to achieve optical coupling. Therefore, since photosensitive devices have extremely high requirements on the cleanliness of the chip surface, and the surface of such chips (especially the light port 120) is extremely fragile, the chip to be protected is exposed throughout, and the light port 120 is at the edge, which is difficult to protect. Conventional packaging will have problems of poor cleanliness and low quality.

[0019] In order to protect the optical port of the optical chip and prevent the optical port from being contaminated or damaged during the process, the present invention provides a method for encapsulating an optoelectronic chip. Figure 3 as well as Figures 4 to 6 ,in, Figure 3 A flowchart of the steps of the first embodiment of the optoelectronic chip packaging method of the present invention; Figures 4 to 6 This is a process flow chart of the first embodiment of the optoelectronic chip packaging method of the present invention; wherein: Figures 4 to 6 Part (b) is a top view of the structure, and part (a) is a cross-sectional view along the BB' direction in part (b). Figure 3As shown, the optoelectronic chip packaging method includes the following steps: step S31, providing an initial structure, the initial structure including a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, and the surface of one side of the optical chip has an optical port; step S32, providing a heat dissipation cover plate and packaging the heat dissipation cover plate to the surface of the initial structure, wherein the heat dissipation cover plate includes a first body and a first bending portion surrounding the edge of the first body, the first body is provided with a notch corresponding to the top of the optical port, the first bending portion is provided with an opening corresponding to the side of the optical port, the notch is connected to the opening, and a protective structure covering the notch and the opening is also formed on the surface of the heat dissipation cover plate.

[0020] See also Figure 4 And step S31, providing an initial structure 40, the initial structure 40 includes a substrate 41, an optical chip 42 arranged on the surface of the substrate 41, and an electrical chip 43 arranged on the surface of the optical chip 42, and a surface of one side of the optical chip 42 has an optical port 420.

[0021] In some embodiments, the substrate 41 is a substrate for electrically connecting the semiconductor chip to other external devices, and the substrate 41 may include circuit traces in the substrate body of the dielectric material layer. The substrate 41 may include a package substrate, an interposer, or a printed circuit board (PCB).

[0022] In some embodiments, the optical chip 42 may be an active optoelectronic chip such as a laser, a modulator, a detector, or an optoelectronic integrated chip of multiple structures, and its material may be a silicon optical chip or an indium, gallium, arsenic, phosphorus compound semiconductor material or silicon carbide, silicon nitride material. The optical port 420 of the optical chip 42 is used to align and connect with an external optical fiber to realize the function of optical coupling.

[0023] In some embodiments, the functional circuit (not shown) on the surface of the optical chip 42 is electrically connected to the substrate 41 through a bonding wire 421. In other embodiments, a through silicon via penetrating the optical chip 42 may be provided in the optical chip 42 to electrically connect the functional circuit on the surface of the optical chip 42 to the substrate 41.

[0024] In some embodiments, the electrical chip 43 is a chip related to the optical chip 42 and needs to be interconnected, including a driver chip, an amplifier chip, a signal processing chip, an ASIC chip, a power chip, etc. The electrical chip 43 is assembled on the upper surface of the optical chip 42 by flip-chip bonding or wire bonding.

[0025] See also Figure 5-6 And step S32, providing a heat dissipation cover plate 44 and encapsulating the heat dissipation cover plate 44 to the surface of the initial structure 40, wherein the heat dissipation cover plate 44 includes a first body 441 and a first bending portion 442 surrounding the edge of the first body 441, the first body 441 is correspondingly provided with a notch 443 above the light port 420, the first bending portion 442 is correspondingly provided with an opening 444 on the side of the light port 420, the notch 443 is connected with the opening 444, and a protective structure 45 covering the notch 443 and the opening 444 is also formed on the surface of the heat dissipation cover plate 44 away from the substrate 41.

[0026] In some embodiments, the protective structure 45 is an ultraviolet sensitive film 451. The ultraviolet sensitive film 451 is formed outside the notch 443 and the opening 444, and a closed protective cavity 490 is formed between the heat dissipation cover plate 44, the protective structure 45 and the initial structure 40. The ultraviolet sensitive film 451 is a special film whose viscosity changes significantly after ultraviolet irradiation. Before ultraviolet irradiation, the viscosity of the ultraviolet sensitive film 451 is extremely high, and it can firmly adhere to the surface of the heat dissipation cover plate 44 to form the protective structure 45, covering the notch 443 and the opening 444, so that during the packaging of the heat dissipation cover plate 44, the optical port 420 is in the closed protective cavity 490, and the closed protective cavity 490 can prevent the optical port 420 from being contaminated during the process and ensure stability during the processing. The heat dissipation cover plate 44 with the protective structure 45 can effectively protect the optical port 420 on the surface of the optical chip 42 during the process and transportation before shipment.

[0027] After completing the above steps, the optoelectronic chip packaging structure of the first embodiment of the optoelectronic chip packaging method of the present invention can be obtained. Figure 6 shown.

[0028] See also Figure 7 , which is a schematic diagram of the structure of removing the protective structure of the first embodiment of the optoelectronic chip packaging method of the present invention; wherein, Figure 7 Part (b) is a top view of the structure, and part (a) is a cross-sectional view along the BB' direction in part (b). Figure 7 As shown, before shipment after the packaging process is completed, the optoelectronic chip packaging method further includes the following step: removing the protective structure. In this embodiment, the step of removing the protective structure includes: irradiating the ultraviolet sensitive film with ultraviolet light. Once irradiated with ultraviolet light, the viscosity of the ultraviolet sensitive film will be greatly reduced, which is convenient for demolding the protective structure.

[0029] See also Figure 8, which is a schematic diagram of the structure of the optoelectronic chip packaging structure formed by the second embodiment of the optoelectronic chip packaging method of the present invention. Figure 8 As shown, in this embodiment, the protective structure is a protective cover 86, including a second body 861 and a second bending portion 862. The second body 861 is magnetically fixed to the surface of the first body 841 of the heat dissipation cover 84 and covers the notch 843. The second bending portion 862 is arranged on a side of the second body 861 close to the notch 843 and covers the opening 844.

[0030] In this embodiment, a detachable protective cover plate 86 is added to the surface of the heat dissipation cover plate 84. The second body 861 of the protective cover plate 86 is fixed to the first body 841 of the heat dissipation cover plate 84 by magnetic attraction. The second body 861 of the protective cover plate 86 covers the notch 843 of the heat dissipation cover plate 84, and protects the optical port 820 above the optical port 820. The second bending portion 862 covers the opening 844, and covers the optical port 820 on the side of the optical port 820. The protective cover plate 86 isolates the optical port 820 from the external environment, reduces the dust-free cleanliness requirements of the subsequent process, and avoids contamination of the optical port 820 of the product by pollutants in the subsequent process, thereby improving the product yield. In addition, the optoelectronic chip packaging structure in this embodiment is relatively simple, and the disassembly and assembly of the protective cover plate 86 can be automated, which improves production efficiency, and the disassembled protective cover plate 86 can be reused, which greatly reduces the use cost.

[0031] In some embodiments, at least one first magnetic component 840 is disposed in the first body 841 of the heat dissipation cover 84 , and at least one second magnetic component 860 disposed corresponding to the first magnetic component 840 is disposed in the second body 861 of the protection cover 86 .

[0032] In this embodiment, the protection cover plate 86 is a glass cover plate.

[0033] In other embodiments, the heat dissipation cover plate 84 and the protective cover plate 86 may also be made of magnetic materials, without providing magnetic parts in the heat dissipation cover plate 84 and the protective cover plate 86 .

[0034] In this embodiment, the steps of packaging the heat dissipation cover plate 84 to the surface of the initial structure and forming a protective structure covering the optical port 820 are as follows: (1) the protective cover plate 86 is set on the surface of the heat dissipation cover plate 84, the second body 861 is set on the surface of the first body 841 of the heat dissipation cover plate 84 and covers the notch 843, and the second bending portion 862 is set on the side of the second body 861 close to the notch 843 and covers the opening 844; (2) the heat dissipation cover plate 84 is packaged to the surface of the initial structure, and the notch 843, the opening 844 and the optical port 820 are set correspondingly.

[0035] In this embodiment, before shipment after the packaging process is completed, the optoelectronic chip packaging method further includes a step of removing the protective structure. The step of removing the protective structure includes: demagnetizing the first magnetic member 840 and the second magnetic member 860, removing the protective cover 86, and obtaining Figure 7 The structure shown.

[0036] Based on the same inventive concept, some embodiments of the present invention further provide an optoelectronic chip packaging structure.

[0037] See also Figure 6 , which is a schematic diagram of the structure of the first embodiment of the optoelectronic chip packaging structure of the present invention. Figure 6 As shown, the optoelectronic chip packaging structure includes: an initial structure 40, a heat dissipation cover plate 44, and a protective structure 45. The initial structure 40 includes a substrate 41, an optical chip 42 disposed on the surface of the substrate 41, and an electric chip 43 disposed on the surface of the optical chip 42. The surface of one side of the optical chip 42 has an optical port 420. The heat dissipation cover plate 44 includes a first body 441 and a first bending portion 442 surrounding the edge of the first body 441. The first body 441 is provided with a notch 443 corresponding to the top of the optical port 420. The first bending portion 442 is provided with an opening 444 corresponding to the side of the optical port 420. The notch 443 is connected to the opening 444. The surface of the heat dissipation cover plate 44 facing away from the substrate 41 is also formed with a protective structure 45 covering the notch 443 and the opening 444.

[0038] In some embodiments, the protection structure 45 is an ultraviolet sensitive film 451. The ultraviolet sensitive film 451 is formed outside the notch 443 and the opening 444, and a closed protection cavity 490 is formed between the heat dissipation cover plate 44, the protection structure 45 and the initial structure 40.

[0039] The optical port 450 is prevented from being contaminated during the manufacturing process, ensuring stability during the manufacturing process. The heat dissipation cover plate 44 with the protection structure 45 can effectively protect the optical port 420 on the surface of the optical chip 42 during the process and transportation before shipment, ensuring the cleanliness and yield rate of the product.

[0040] See also Figure 8 , which is a schematic diagram of the structure of the second embodiment of the optoelectronic chip packaging structure of the present invention. Figure 8 As shown, this embodiment and Figure 6 What is different from the illustrated embodiment is that the protective structure is a protective cover 86, including a second body 861 and a second bending portion 862, the second body 861 is magnetically fixed to the surface of the first body 841 of the heat dissipation cover 84 and covers the notch 843, and the second bending portion 862 is arranged on a side of the second body 861 close to the notch 843 and covers the opening 844.

[0041] In some embodiments, at least one first magnetic component 840 is disposed in the first body 841 of the heat dissipation cover 84 , and at least one second magnetic component 860 disposed corresponding to the first magnetic component 840 is disposed in the second body 861 of the protection cover 86 .

[0042] In this embodiment, the protection cover plate 86 is a glass cover plate.

[0043] In other embodiments, the heat dissipation cover plate 84 and the protective cover plate 86 may also be made of magnetic materials, without providing magnetic parts in the heat dissipation cover plate 84 and the protective cover plate 86 .

[0044] In this embodiment, a detachable protective cover plate 86 is added to the surface of the heat dissipation cover plate 84 away from the substrate 41. The second body 861 of the protective cover plate 86 is fixed to the first body 841 of the heat dissipation cover plate 84 by magnetic attraction. The second body 861 of the protective cover plate 86 covers the notch 843 of the heat dissipation cover plate 84, and protects the optical port 820 above the optical port 820. The second bending portion 862 covers the opening 844 and covers the optical port 820 on the side of the optical port 820. The protective cover plate 86 isolates the optical port 820 from the external environment, reduces the dust-free cleanliness requirements for subsequent processes, and avoids contamination of the optical port 820 of the product by pollutants in the subsequent process, thereby improving the product yield. In addition, the optoelectronic chip packaging structure in this embodiment is relatively simple, and the disassembly and assembly of the protective cover plate 86 can be automated, which improves production efficiency, and the disassembled protective cover plate 86 can be reused, which greatly reduces the use cost.

[0045] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.

[0046] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.

[0047] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present invention are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present invention. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0048] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for packaging an optoelectronic chip, characterized in that: The steps include: An initial structure is provided, the initial structure comprising a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, wherein the surface of one side of the optical chip has an optical port; a heat dissipation cover is provided and the heat dissipation cover is packaged to the surface of the initial structure, wherein the heat dissipation cover comprises a first body and a first bending portion surrounding the edge of the first body, the first body has a notch correspondingly arranged above the optical port, the first bending portion has an opening correspondingly arranged on the side of the optical port, the notch is connected to the opening, and a protective structure covering the notch and the opening is formed on the surface of the heat dissipation cover facing away from the substrate.

2. The method according to claim 1, characterized in that The method further comprises the steps of: The protective structure is removed.

3. The method according to claim 2, characterized in that The protective structure is an ultraviolet sensitive film, and the ultraviolet sensitive film is formed outside the notch and the opening. A closed protective cavity is formed between the heat dissipation cover plate, the protective structure and the initial structure.

4. The method according to claim 3, characterized in that The step of removing the protective structure includes: irradiating the ultraviolet sensitive film with ultraviolet light.

5. The method according to claim 2, characterized in that: The protection structure is a protection cover plate, including a second body and a second bending portion. The second body is magnetically fixed to the first body surface of the heat dissipation cover plate and covers the notch. The second bending portion is arranged on a side of the second body close to the notch and covers the opening.

6. The method according to claim 5, characterized in that At least one first magnetic component is disposed in the first body of the heat dissipation cover plate, and at least one second magnetic component is disposed corresponding to the first magnetic component in the second body of the protection cover plate.

7. The method according to claim 6, characterized in that The step of removing the protective structure includes: demagnetizing the first magnetic component and the second magnetic component, and removing the protective cover.

8. An optoelectronic chip packaging structure, characterized in that: include: An initial structure, the initial structure comprising a substrate, an optical chip disposed on a surface of the substrate, and an electrical chip disposed on a surface of the optical chip, wherein a surface on one side of the optical chip has an optical port; The heat dissipation cover plate includes a first body and a first bent portion surrounding the edge of the first body, the first body is provided with a notch corresponding to the top of the light port, the first bent portion is provided with an opening corresponding to the side of the light port, the notch is connected to the opening, and a protective structure covering the notch and the opening is formed on the surface of the heat dissipation cover plate away from the substrate.

9. The optoelectronic chip packaging structure according to claim 8, characterized in that: The protective structure is an ultraviolet sensitive film, and the ultraviolet sensitive film is formed outside the notch and the opening. A protective cavity is formed between the heat dissipation cover plate, the protective structure and the initial structure.

10. The optoelectronic chip packaging structure according to claim 8, characterized in that: The protection structure is a protection cover plate, including a second body and a second bending portion. The second body is magnetically fixed to the first body surface of the heat dissipation cover plate and covers the notch. The second bending portion is arranged on a side of the second body close to the notch and covers the opening.

11. The optoelectronic chip packaging structure according to claim 10, characterized in that: At least one first magnetic component is disposed in the first body of the heat dissipation cover plate, and at least one second magnetic component is disposed corresponding to the first magnetic component in the second body of the protection cover plate.

Images