Temperature rising method and system

Abstract

The embodiment of the invention provides a temperature rising method and system. According to the scheme, the temperature rising system comprises a refrigerating machine and temperature control equipment, and each layer in the refrigerating machine is provided with a heating module in communication connection with the temperature control equipment. The temperature control equipment receives a temperature rising instruction for the refrigerating machine, and supplies power to each heating module in the refrigerating machine based on the temperature rising instruction; the heating device in each heating module converts electric energy into heat energy. Through the technical scheme provided by the embodiment of the invention, the time required for rising of the internal temperature of the refrigerator is shortened.

Description

Technical Field

[0001] The present application relates to the technical field of cryogenic equipment, and in particular to a temperature recovery method and system. Background Art

[0002] In the field of quantum computing, quantum chips have strict requirements on the temperature of their operating environment, and generally need to perform quantum computing at extremely low temperatures (such as 10 millikelvin). At present, quantum chips are deployed inside refrigerators (also called dilution refrigerators), and the operating environment of quantum chips is supported by regulating the temperature inside the refrigerator.

[0003] For the above refrigerator, its internal temperature change process may include a temperature reduction process and a temperature recovery process. The temperature reduction process is a process in which the internal temperature of the refrigerator can be reduced from room temperature to the temperature required for the operation of the quantum chip; the temperature recovery process is a process in which the internal temperature of the refrigerator is restored from the temperature required for the operation of the quantum chip to room temperature.

[0004] During the above-mentioned temperature recovery process, due to the particularity of the internal components of the refrigerator, that is, the low-temperature components inside the refrigerator are in a vacuum environment, and each low-temperature component has been treated with radiation prevention and heat leakage treatment. Therefore, the current temperature recovery process inside the refrigerator is completely dependent on the natural recovery of the internal temperature of the refrigerator to room temperature, and this process takes a long time. Summary of the invention

[0005] The purpose of the embodiment of the present application is to provide a temperature recovery method and system to shorten the time required for the internal temperature of the refrigerator to recover. The specific technical solution is as follows:

[0006] The embodiment of the present application provides a temperature recovery method, which is applied to a temperature recovery system, wherein the temperature recovery system includes a refrigerator and a temperature control device, and each layer of the refrigerator is equipped with a heating module that is communicatively connected to the temperature control device. The method includes:

[0007] The temperature control device receives a temperature recovery instruction for the refrigerator, and supplies power to each heating module in the refrigerator based on the temperature recovery instruction;

[0008] The heating device in each heating module converts electrical energy into thermal energy.

[0009] Optionally, the method further includes:

[0010] For each heating module, when the current temperature of the layer where the heating module is located is greater than or equal to a first temperature threshold, the temperature control device stops supplying power to the heating module.

[0011] Optionally, each heating module further includes a temperature sensor;

[0012] Before stopping supplying power to the heating module, the method further includes:

[0013] For each heating module, the temperature control device obtains the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value;

[0014] According to a preset calibration relationship of the temperature sensor in the heating module, the temperature corresponding to the current resistance value is determined as the current temperature of the layer where the heating module is located; the preset calibration relationship is the correspondence between the resistance value and the temperature pre-calibrated for the temperature sensor;

[0015] The current temperature of the layer where the heating module is located is compared with the first temperature threshold.

[0016] Optionally, for each heating module, the temperature control device obtains the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value, including:

[0017] For each heating module, the temperature control device uses a three-wire resistance measurement method or a four-wire resistance measurement method to obtain the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value.

[0018] Optionally, before the step of stopping supplying power to the heating module, the method further includes:

[0019] For each heating module, the temperature control device determines the power supply duration corresponding to the heating module at the current moment;

[0020] When the power supply duration is greater than or equal to the preset duration threshold, determining that the current temperature of the layer where the heating module is located is greater than or equal to the first temperature threshold;

[0021] When the power supply duration is less than the preset duration threshold, it is determined that the current temperature of the layer where the heating module is located is less than the first temperature threshold.

[0022] Optionally, the heating module further comprises a temperature protection switch; the temperature protection switch is connected in series with the heating device in the heating module;

[0023] The temperature protection switch is turned on when its own temperature is less than or equal to the second temperature threshold, and is turned off when its own temperature is greater than the second temperature threshold at the current moment.

[0024] The embodiment of the present application further provides a temperature recovery system, the temperature recovery system comprising a refrigerator and a temperature control device, each layer of the refrigerator is equipped with a heating module that is communicatively connected to the temperature control device, and the heating module comprises a heating device;

[0025] The temperature control device is used to receive a temperature recovery instruction for the refrigerator, and supply power to each heating module in the refrigerator based on the temperature recovery instruction;

[0026] The heating device is used to convert electrical energy into thermal energy.

[0027] Optionally, the temperature control device is further used to stop supplying power to each heating module when the current temperature of the layer where the heating module is located is greater than or equal to a first temperature threshold.

[0028] Optionally, each heating module further includes a temperature sensor;

[0029] The temperature control device is further used to obtain, for each heating module, a resistance value of a temperature sensor in the heating module at a current moment before stopping supplying power to the heating module, as a current resistance value;

[0030] According to a preset calibration relationship of the temperature sensor in the heating module, the temperature corresponding to the current resistance value is determined as the current temperature of the layer where the heating module is located; the preset calibration relationship is the correspondence between the resistance value and the temperature pre-calibrated for the temperature sensor;

[0031] The current temperature of the layer where the heating module is located is compared with the first temperature threshold.

[0032] Optionally, the temperature control device is specifically used to obtain, for each heating module, a resistance value of a temperature sensor in the heating module at a current moment by using a three-wire resistance measurement method or a four-wire resistance measurement method as a current resistance value.

[0033] An embodiment of the present application also provides a quantum computer, comprising a refrigerator as described in any one of the above items, and a quantum chip located inside the refrigerator.

[0034] Beneficial effects of the embodiments of the present application:

[0035] The technical solution provided by the embodiment of the present application can be provided with a heating module on each layer of the refrigerator. During the temperature recovery process of the refrigerator, the temperature control device connected to each heating module transmits electrical energy to each heating module by power supply, and each heating module converts the electrical energy into heat energy. This can quickly increase the temperature of the layer where each heating module is located, realize the overall increase of the internal temperature of the refrigerator, and effectively shorten the time required for the internal temperature of the refrigerator to recover.

[0036] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 A first signaling diagram of the temperature recovery method provided in an embodiment of the present application;

[0039] Figure 2 A schematic diagram of the structure of a temperature recovery system provided in an embodiment of the present application;

[0040] Figure 3 A schematic diagram of a structure of a communication connection between a heating module and a temperature control device provided in an embodiment of the present application;

[0041] Figure 4 A second signaling diagram of the temperature recovery method provided in an embodiment of the present application;

[0042] Figure 5 A third signaling diagram of the temperature recovery method provided in an embodiment of the present application;

[0043] Figure 6 A fourth signaling diagram of the temperature recovery method provided in an embodiment of the present application;

[0044] Figure 7 A fifth signaling diagram of the temperature recovery method provided in an embodiment of the present application;

[0045] Figure 8 A schematic diagram of the structure of the temperature recovery system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0047] In order to solve the problems in the related art, the present application provides a temperature recovery method. Figure 1 As shown, Figure 1The first signaling diagram of the temperature recovery method provided in the embodiment of the present application. The method applies a temperature recovery system. The temperature recovery system may include a refrigerator and a temperature control device, and each layer of the refrigerator is equipped with a heating module that is connected to the temperature control device in communication, and the heating module includes a heating device. Figure 1 The method shown includes the following steps.

[0048] Step S101 : The temperature control device receives a temperature recovery instruction for a refrigerator, and supplies power to each heating module in the refrigerator based on the temperature recovery instruction.

[0049] In step S102 , the heating device in each heating module converts electrical energy into thermal energy.

[0050] In the embodiment of the present application, the refrigerator may include multiple cold plates. After the refrigerator temperature is lowered, the temperature of each cold plate is different. Figure 2 Take this as an example to illustrate. Figure 2 A schematic diagram of the structure of the temperature recovery system provided in an embodiment of the present application.

[0051] exist Figure 2 The temperature recovery system shown may include a refrigerator 201 and a temperature control device 202. The refrigerator 201 includes five cold plates 205. In a known dry refrigerator, the quantum chip is installed in a Figure 2 The refrigerator is shown as being located on the bottom cold plate 205. The temperatures of each cold plate 205 layer are, from top to bottom, 300 K, 70 K, 4 K, 0.7 K, 0.1 K, and 10 mK.

[0052] In the above Figure 2 The refrigerator 201 shown further includes a vacuum penetration plate assembly 203 fixedly mounted on the room temperature plate 204 , and a heating module 206 fixedly mounted on each cold plate 205 .

[0053] The temperature control device 202 is connected to the heating modules 206 installed on each cold plate 205 through the vacuum through-plate assembly 203. The temperature control device 202 is connected to the vacuum through-plate assembly 203 through the wire 207, and the heating module is connected to the vacuum through-plate assembly 203 through the wire 208.

[0054] The vacuum penetration assembly 203 may be a device with sealing and connecting functions, such as a sealing connector. Considering that the wire 207 is deployed in the atmosphere and the wire 208 is deployed inside the refrigerator, the wire 207 may be a copper wire, and the wire 207 may include an electromagnetic shielding layer, such as a metal braided mesh; the wire 208 may be made of a material with low heat leakage, such as phosphor bronze, manganese copper or stainless steel.

[0055] Regarding the above Figure 2 The heating module 206 in the embodiment of the present invention can be as follows: Figure 3 As shown, Figure 3 A schematic diagram of a structure of a heating module and a temperature control device in communication connection according to an embodiment of the present application. The heating module 206 may include a heat-conducting substrate 2061 , a temperature protection switch 2062 , a heating device 2063 and a temperature sensor 2064 .

[0056] The connection relationship between the various components in the heating module 206 and the temperature control device 202 can be as follows: Figure 3 The temperature protection switch 2062, the heating device 2063 and the temperature control device 202 are connected in series to form a first series circuit. The temperature sensor 2064 is connected in series with the temperature control device 202 to form a second series circuit.

[0057] In the above Figure 2 and Figure 3 In the illustrated embodiment, only one heating module is deployed on one cold plate, and each heating module includes a temperature sensor, a temperature protection switch, and a heating device. In actual application, the number of heating modules installed on each cold plate and the number of temperature sensors, temperature protection switches, and heating devices included in each heating module can be set according to the size of the cold plate, the installation position of the heating module, the resistance value of the heating device, etc.

[0058] For example, in the above Figure 2 In the refrigerator shown, in order to restore the temperatures of each layer of the refrigerator to room temperature as simultaneously as possible during the temperature recovery process, the number of heating modules deployed on each cold plate from top to bottom can be increased successively, and the resistance value of the heating device in the heating module can also be increased successively.

[0059] Here, the number of heating modules installed on each cold plate in the above refrigerator, and the number of temperature sensors, temperature protection switches and heating devices installed on each heating module are not specifically limited. The following description is only based on the example that the number of each device is 1, which does not serve any limiting purpose. Figure 2 and Figure 3 The functions of the devices in the embodiment can be found in the description below and will not be elaborated here.

[0060] pass Figure 1The method shown can be provided with a heating module on each layer of the refrigerator. During the temperature recovery process of the refrigerator, the temperature control device connected to each heating module transmits electrical energy to each heating module by power supply, and each heating module converts the electrical energy into heat energy. This can quickly increase the temperature of the layer where each heating module is located, realize the overall increase of the internal temperature of the refrigerator, and effectively shorten the time required for the internal temperature of the refrigerator to recover.

[0061] The embodiments of the present application are described below through specific examples.

[0062] With respect to the above step S101 , the temperature control device receives a temperature recovery instruction for the refrigerator, and supplies power to each heating module in the refrigerator based on the temperature recovery instruction.

[0063] In this step, the user can manually trigger the temperature recovery process inside the refrigerator. When the user manually triggers the temperature recovery process, the temperature control device will receive a temperature recovery instruction for the temperature inside the refrigerator.

[0064] In the embodiment of the present application, considering that the refrigerator may include multiple heating modules, the temperature recovery instruction may include a device identifier corresponding to the heating module. The device identifier may be an identifier corresponding to all heating modules or an identifier corresponding to some heating modules in each layer of the refrigerator.

[0065] After receiving the temperature recovery instruction, the temperature control device may supply power to the heating modules corresponding to the component identifiers according to the component identifiers in the temperature recovery instruction.

[0066] In the embodiment of the present application, the temperature control device will supply power to the heating module only when it receives a temperature recovery instruction. That is, the temperature control device will not supply power to the heating module when no temperature recovery instruction is received. This effectively ensures that the temperature control device will not supply power to the heating module when no temperature recovery instruction is received, avoids the heating module from generating heat energy in other situations such as the process of lowering the temperature of the refrigerator, and has an adverse effect on the temperature change process inside the refrigerator, thereby ensuring the stable change of the temperature inside the refrigerator.

[0067] Regarding the above step S102 , the heating device in each heating module converts electrical energy into thermal energy.

[0068] In this step, after the temperature control device supplies power to the heating modules to which it is connected, current flows through the heating devices on each heating module in the refrigerator, and the heating devices can convert electrical energy into thermal energy.

[0069] In an optional embodiment, the heating device may be a resistance heater. For example, the heating device may be a resistor made of metal wire, or a resistor made of a metal film with a thickness of 0.1 micrometer (um) to 20 um. The heating device is not specifically limited here.

[0070] In an optional embodiment, when the heating module does not include Figure 3 When the heat conductive substrate 2061 is shown, the components included in the heating module can be directly fixed on the cold plate. The heat energy generated by the heating components is directly transmitted to the cold plate by heat radiation, so that the temperature of the cold plate is continuously increased, thereby changing the temperature inside the refrigerator.

[0071] In another optional embodiment, when the heating module includes the above Figure 3 When the thermally conductive substrate 2061 is shown, the heat energy generated by the above-mentioned heating device will be transmitted to the thermally conductive substrate by thermal radiation, and the thermally conductive substrate will transmit the heat energy to the cold plate by thermal radiation. At this time, the temperature of the cold plate will continue to increase with the heat generated by the heating device, thereby changing the temperature inside the refrigerator.

[0072] The above-mentioned heat-conducting substrate can be made of a material with good thermal conductivity. For example, the material of the heat-conducting substrate can be oxygen-free copper, pure aluminum or high-purity aluminum oxide. The shape of the above-mentioned heat-conducting substrate can be set according to the number of components included in the heating module and the distribution of each component, such as the above-mentioned Figure 2 and Figure 3 Here, the material and shape of the thermal conductive substrate are not specifically limited.

[0073] In the embodiment of the present application, the heat energy generated by the above-mentioned heating device is transmitted by means of thermal radiation. Since the interior of the refrigerator is almost a vacuum environment, the heat energy generated by the heating device can be conducted to the cold plate on which it is fixed, thereby increasing the temperature of the cold plate. As a result, the temperature of the layer where the cold plate is located is increased, thereby increasing the temperature inside the refrigerator as a whole and shortening the time required for the internal temperature of the refrigerator to return to room temperature.

[0074] In an optional embodiment, the heating module may further include a temperature protection switch which is connected in series with the heating device in the heating module.

[0075] When the heating module includes a plurality of temperature protection switches and a plurality of heating devices, for each heating device, the heating device has a temperature protection switch connected in series. For example, in the heating module, a temperature protection switch can be connected in series with one or more heating devices. For another example, in the heating module, a temperature protection switch is connected in series with one or more heating devices as a third series circuit, and all third series circuits are connected in parallel. Here, the connection method between the temperature protection switch and the heating device in the heating module is not specifically limited.

[0076] In an optional embodiment, the temperature protection switch may be made of a bimetallic strip. The temperature protection switch is turned on when its own temperature is less than or equal to a second temperature threshold, and is turned off when its own temperature is greater than the second temperature threshold at the current moment.

[0077] Specifically, when the temperature of the temperature protection switch itself is less than or equal to the second temperature threshold, it can be considered that the current temperature will not affect the safety of the low-temperature device in the low-temperature device. At this time, the temperature protection switch is in the on state. If the above-mentioned temperature control device supplies power to the temperature protection switch and the heating device connected in series, the entire series circuit is on. At this time, the heating device can convert electrical energy into thermal energy.

[0078] When the temperature of the temperature protection switch itself is greater than the second temperature threshold, it can be considered that the current temperature will affect the safety of the cryogenic device in the cryogenic device. At this time, the temperature protection switch is in an off state. If the temperature control device supplies power to the temperature protection switch and the heating device connected in series, the entire series circuit is disconnected. At this time, there is no electrical energy on the heating device and heat energy cannot be generated.

[0079] In the embodiment of the present application, once the temperature of the temperature protection switch itself is greater than the second temperature threshold, the temperature protection switch will be in the off state. As time goes by, the temperature of the temperature protection switch can gradually cool down and return to less than or equal to the second temperature threshold, at which time the temperature protection switch will also return to the on state.

[0080] The second temperature threshold may be set according to the ambient temperature applicable to the low temperature device in the refrigerator. For example, the value range of the second temperature threshold may be between 300 K and 500 K. Here, the value range of the second temperature threshold is not specifically limited.

[0081] In an optional embodiment, according to the above Figure 1 The method shown in the embodiment of the present application also provides a temperature recovery method. Figure 4 As shown, Figure 4 A second signaling diagram of the temperature recovery method provided in an embodiment of the present application. The method comprises the following steps.

[0082] Step S401 : The temperature control device receives a temperature recovery instruction for a refrigerator, and supplies power to each heating module in the refrigerator based on the temperature recovery instruction.

[0083] In step S402 , the heating device in each heating module converts electrical energy into thermal energy.

[0084] The above steps S401 and S402 are the same as the above steps S101 and S102.

[0085] Step S403: for each heating module, when the current temperature of the layer where the heating module is located is greater than or equal to a first temperature threshold, the temperature control device stops supplying power to the heating module.

[0086] In this step, after the heating device converts electrical energy into thermal energy, as the heating device continues to operate, the temperature of the layer where the heating module in the refrigerator is located will continue to increase. For each heating module, when the temperature of the layer where the heating module is located at the current moment (recorded as the current temperature) is greater than or equal to the first temperature threshold, the temperature control device can stop supplying power to the heating module. That is, at this time, no current passes through the heating module, the heating module cannot perform electrical energy conversion, and will no longer generate heat.

[0087] In an optional embodiment, the first temperature threshold may be less than or equal to the ambient temperature of the environment outside the refrigerator. For example, the first temperature threshold may be the room temperature at the current moment. Here, the first temperature threshold is not specifically limited.

[0088] Through the above step S403, when the temperature of the layer where the heating module is located is greater than or equal to the first temperature threshold, the temperature control device can stop supplying power to the heating module in time, thereby stopping the generation of heat in time and preventing the heating module from continuing to generate heat, thereby preventing the internal temperature of the refrigerator from continuing to increase and even exceeding the room temperature.

[0089] In an optional embodiment, when the current temperature of the layer where the heating module is located is less than the first temperature threshold, the temperature control device may not perform any processing, that is, the temperature control device will not stop supplying power to the heating module.

[0090] In an optional embodiment, when each of the above-mentioned heating modules further includes the above-mentioned temperature sensor, according to the above-mentioned Figure 4 The method shown in the embodiment of the present application also provides a temperature recovery method. Figure 5 As shown, Figure 5 This is a third signaling diagram of the temperature recovery method provided in the embodiment of the present application. The method includes the following steps.

[0091] Step S501 : The temperature control device receives a temperature recovery instruction for a refrigerator, and supplies power to each heating module in the refrigerator based on the temperature recovery instruction.

[0092] In step S502 , the heating device in each heating module converts electrical energy into thermal energy.

[0093] The above steps S501 to S502 are the same as the above steps S401 to S402.

[0094] Step S503: for each heating module, the temperature control device obtains the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value.

[0095] In this step, for each heating module, the resistance value of the temperature sensor in the heating module can change with the temperature of the layer where the heating module is located. The temperature control device can obtain the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value.

[0096] Step S504, according to the preset calibration relationship of the temperature sensor in the heating module, the temperature control device determines the temperature corresponding to the current resistance value as the current temperature of the layer where the heating module is located; the preset calibration relationship is the correspondence between the resistance value and temperature pre-calibrated for the temperature sensor.

[0097] In an embodiment of the present application, the temperature control device may pre-store a calibration relationship of the temperature sensor in each heating module (recorded as a preset calibration relationship), and the preset calibration relationship is a corresponding relationship between the resistance value of the temperature sensor and the temperature.

[0098] For each heating module, after obtaining the current resistance value of the temperature sensor in the heating module, the temperature control device can determine the temperature corresponding to the current resistance value according to the preset calibration relationship of the temperature sensor, and determine the temperature as the current temperature of the layer where the heating module is located.

[0099] Step S505: The temperature control device compares the current temperature of the layer where the heating module is located with the first temperature threshold.

[0100] In this step, after determining the current temperature of the layer where the heating module is located through the above step S504, the temperature control device can compare the current temperature with the first temperature threshold to obtain a comparison result.

[0101] The above comparison result may indicate that the current temperature of the layer where the heating module is located is greater than or equal to the first temperature threshold, or may also indicate that the current temperature of the layer where the heating module is located is less than the first temperature threshold.

[0102] In an optional embodiment, when the comparison result indicates that the current temperature of the layer where the heating module is located is greater than or equal to the first temperature threshold, the temperature control device may execute step S506. When the comparison result indicates that the current temperature of the layer where the heating module is located is less than the first temperature threshold, the temperature control device may not perform any processing, that is, the temperature control device continues to supply power to the heating module.

[0103] Through the above steps S503-S505, the temperature control device can determine the temperature of the layer where the heating module is located in a timely and accurate manner through the temperature sensor in the heating module, so that the temperature control device can timely understand the temperature changes of the layer where the heating module is located, and thus when the temperature of the layer where the heating module is located reaches the first temperature threshold, the power supply to the heating module is stopped in time, which effectively improves the accuracy of temperature regulation inside the refrigerator.

[0104] Step S506: for each heating module, when the current temperature of the layer where the heating module is located is greater than or equal to a first temperature threshold, the temperature control device stops supplying power to the heating module.

[0105] The above step S506 is the same as the above step S403.

[0106] In an optional embodiment, the temperature sensor may be a resistance sensor. For example, the temperature sensor may be a platinum resistor, a diode, a thermocouple, or a thin film zirconium oxynitride resistor. The temperature sensor is not specifically limited here.

[0107] In an optional embodiment, according to the above Figure 4 The method shown in the embodiment of the present application also provides a temperature recovery method. Figure 6 As shown, Figure 6 This is a fourth signaling diagram of the temperature recovery method provided in the embodiment of the present application. Figure 6 In the method shown, the above step S503 can be subdivided into the following steps: Step S5031.

[0108] Step S5031: For each heating module, the temperature control device uses a three-wire resistance measurement method or a four-wire resistance measurement method to obtain the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value.

[0109] When the wire 208 in the temperature recovery system is made of the material with low heat leakage, the resistance of the wire will have a greater impact on the resistance of the temperature sensor obtained by the temperature control device, thereby affecting the accuracy of the current temperature of the layer where the heating module is located.

[0110] In order to avoid the influence of the wire resistance on the obtained resistance value of the temperature sensor. For each temperature sensor, the temperature sensor can be connected to the temperature control device through 3 or 4 wires. At this time, when the temperature control device obtains the above-mentioned current resistance value, the temperature control device can use a three-wire resistance measurement method or a four-wire resistance measurement method to obtain the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value.

[0111] The process of obtaining the current resistance value by using the three-wire resistance measurement method or the four-wire resistance measurement method can refer to the measurement method in the related art, and will not be described in detail here.

[0112] Through the above-mentioned step S5031, the temperature control device can accurately obtain the resistance value of the temperature sensor through a three-wire resistance measurement method or a four-wire resistance measurement method, avoid the interference of the wire resistance on the temperature sensor, and improve the accuracy of the current resistance value obtained by the temperature control device, thereby improving the accuracy of the temperature determined later based on the current resistance value, and facilitating the temperature control device to control the progress of the temperature change inside the refrigerator.

[0113] In an optional embodiment, according to the above Figure 4 The method shown in the embodiment of the present application also provides a temperature recovery method. Figure 7 As shown, Figure 7 This is a fifth signaling diagram of the temperature recovery method provided in the embodiment of the present application. The method includes the following steps.

[0114] Step S701: The temperature control device receives a temperature recovery instruction for a refrigerator, and supplies power to each heating module in the refrigerator based on the temperature recovery instruction.

[0115] Step S702: The heating device in each heating module converts electrical energy into thermal energy.

[0116] The above steps S701 to S702 are the same as the above steps S401 to S702.

[0117] Step S703: for each heating module, the temperature control device determines the power supply duration corresponding to the heating module at the current moment.

[0118] In this step, after supplying power to each heating module, the temperature control device may count the power supply duration for each heating module to obtain the power supply duration corresponding to each heating module at the current moment.

[0119] The above step S703 may be executed in real time after the above step S701 is executed. Here, the execution of the above step S703 is not specifically limited.

[0120] Step S704: When the power supply duration is greater than or equal to the preset duration threshold, the temperature control device determines that the current temperature of the layer where the heating module is located is greater than or equal to the first temperature threshold.

[0121] For each heating module, after obtaining the power supply duration corresponding to the heating module at the current moment, the temperature control device can compare the power supply duration with the preset duration threshold corresponding to the heating module to determine whether the power supply duration is greater than the preset duration threshold.

[0122] In an embodiment of the present application, the above-mentioned preset time threshold can be determined by the temperature in the layer where the heating module is located, the number of heating modules included in the layer where the heating module is located, and the resistance value of the heating device in the heating module.

[0123] The preset time threshold may be determined by the user in advance through multiple rounds of testing, or may be calculated by the temperature control device after receiving the temperature recovery instruction according to the temperature of each layer inside the refrigerator at the current moment, the number of heating modules, the resistance of the heating device, etc. Here, the preset time threshold and the method for determining the preset time threshold are not specifically limited.

[0124] For each heating module, when the power supply duration corresponding to the heating module is greater than or equal to the corresponding preset duration threshold, the temperature control device can determine that the current temperature of the layer where the heating module is located is greater than or equal to the first temperature threshold.

[0125] In an optional embodiment, when the temperature control device determines that the current temperature of the layer where the heating module is located is greater than or equal to the first temperature threshold, the process will jump to step S706.

[0126] Step S705: When the power supply duration is less than the preset duration threshold, the temperature control device determines that the current temperature of the layer where the heating module is located is less than the first temperature threshold.

[0127] In this step, for each heating module, when the power supply duration corresponding to the heating module is greater than or equal to the corresponding preset duration threshold, the temperature control device can determine that the temperature of the layer where the heating module is located is less than the first temperature threshold.

[0128] Through the above steps S703 to S705, the temperature control device can determine whether the internal temperature of the refrigerator reaches the first temperature threshold according to the power supply duration corresponding to each heating module, thereby realizing the control of the internal temperature of the refrigerator. Moreover, compared with the above method of using temperature sensors, the method of determining whether the temperature of the layer where the heating module is located reaches the first temperature threshold according to the power supply duration can effectively reduce the number of temperature sensors deployed inside the refrigerator and reduce the deployment cost of the refrigerator.

[0129] In the embodiment of the present application, the above steps S704 and S705 are steps respectively executed when the comparison result of the power supply duration and the preset duration threshold is different. Here, the execution of the above steps S704 and S705 is not specifically limited.

[0130] Step S706: for each heating module, when the current temperature of the layer where the heating module is located is greater than or equal to a first temperature threshold, the temperature control device stops supplying power to the heating module.

[0131] Based on the same inventive concept, according to the temperature recovery method provided in the above embodiment of the present application, the embodiment of the present application also provides a temperature recovery system. Figure 8 As shown, Figure 8 A schematic diagram of a temperature recovery system provided in an embodiment of the present application. The temperature recovery system includes a refrigerator 801 and a temperature control device 802, each layer of the refrigerator is equipped with a heating module 803 that is in communication with the temperature control device 802, and the heating module 803 includes a heating device 804;

[0132] The temperature control device 802 is used to receive a temperature recovery instruction for the refrigerator 801, and supply power to each heating module 803 in the refrigerator 801 based on the temperature recovery instruction;

[0133] The heating device 804 is used to convert electrical energy into thermal energy.

[0134] Optionally, the temperature control device 802 is further configured to stop supplying power to each heating module 803 when the current temperature of the layer where the heating module 803 is located is greater than or equal to a first temperature threshold.

[0135] Optionally, each of the heating modules 803 may further include a temperature sensor;

[0136] The temperature control device 802 may also be used to obtain the resistance value of the temperature sensor in each heating module 803 at the current moment before stopping supplying power to the heating module 803 as the current resistance value;

[0137] According to the preset calibration relationship of the temperature sensor in the heating module 803, the temperature corresponding to the current resistance value is determined as the current temperature of the layer where the heating module 803 is located; the preset calibration relationship is the correspondence between the resistance value and the temperature pre-calibrated for the temperature sensor;

[0138] The current temperature of the layer where the heating module 803 is located is compared with the first temperature threshold.

[0139] Optionally, the temperature control device 802 may be specifically used to obtain the resistance value of the temperature sensor in each heating module 803 at the current moment by using a three-wire resistance measurement method or a four-wire resistance measurement method as the current resistance value.

[0140] Optionally, the temperature control device 802 may also be used to determine, for each heating module 803, a power supply duration corresponding to the heating module 803 at the current moment before stopping the step of supplying power to the heating module 803;

[0141] When the power supply duration is greater than or equal to the preset duration threshold, it is determined that the current temperature of the layer where the heating module 803 is located is greater than or equal to the first temperature threshold;

[0142] When the power supply duration is less than the preset duration threshold, it is determined that the current temperature of the layer where the heating module 803 is located is less than the first temperature threshold.

[0143] Optionally, the heating module 803 may further include a temperature protection switch; the temperature protection switch is connected in series with the heating device 804 in the heating module 803;

[0144] The temperature protection switch is turned on when its own temperature is less than or equal to the second temperature threshold, and is turned off when its own temperature is greater than the second temperature threshold at the current moment.

[0145] Through the system provided by the embodiment of the present application, a heating module can be provided on each layer of the refrigerator. During the temperature recovery process of the refrigerator, the temperature control device connected to each heating module transmits electrical energy to each heating module by power supply, and each heating module converts the electrical energy into heat energy. This can quickly increase the temperature of the layer where each heating module is located, achieve an overall increase in the temperature inside the refrigerator, and effectively shorten the time required for the temperature inside the refrigerator to recover.

[0146] Based on the same inventive concept, according to the temperature recovery method provided in the above-mentioned embodiment of the present application, the embodiment of the present application also provides a quantum computer, including the above-mentioned refrigerator and a quantum chip located inside the refrigerator.

[0147] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more available media integrated. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive Solid State Disk (SSD)), etc.

[0148] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0149] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for embodiments such as systems and quantum computers, since they are basically similar to method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiments.

[0150] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A temperature recovery method, characterized in that: Applied to a temperature recovery system, the temperature recovery system includes a refrigerator and a temperature control device, each layer of the refrigerator is equipped with a heating module that is communicatively connected to the temperature control device, and the method includes: The temperature control device receives a temperature recovery instruction for the refrigerator, and supplies power to each heating module in the refrigerator based on the temperature recovery instruction; The heating device in each heating module converts electrical energy into thermal energy.

2. The method according to claim 1, characterized in that The method further comprises: For each heating module, when the current temperature of the layer where the heating module is located is greater than or equal to a first temperature threshold, the temperature control device stops supplying power to the heating module.

3. The method according to claim 1, characterized in that: Each heating module also includes a temperature sensor; Before stopping supplying power to the heating module, the method further includes: For each heating module, the temperature control device obtains the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value; According to a preset calibration relationship of the temperature sensor in the heating module, the temperature corresponding to the current resistance value is determined as the current temperature of the layer where the heating module is located; the preset calibration relationship is the correspondence between the resistance value and the temperature pre-calibrated for the temperature sensor; The current temperature of the layer where the heating module is located is compared with the first temperature threshold.

4. The method according to claim 3, characterized in that The step of obtaining, by the temperature control device, the resistance value of the temperature sensor in each heating module at the current moment as the current resistance value includes: For each heating module, the temperature control device uses a three-wire resistance measurement method or a four-wire resistance measurement method to obtain the resistance value of the temperature sensor in the heating module at the current moment as the current resistance value.

5. The method according to claim 3, characterized in that: Before the step of stopping supplying power to the heating module, the method further comprises: For each heating module, the temperature control device determines the power supply duration corresponding to the heating module at the current moment; When the power supply duration is greater than or equal to the preset duration threshold, determining that the current temperature of the layer where the heating module is located is greater than or equal to the first temperature threshold; When the power supply duration is less than the preset duration threshold, it is determined that the current temperature of the layer where the heating module is located is less than the first temperature threshold.

6. The method according to claim 1, characterized in that The heating module also includes a temperature protection switch; the temperature protection switch is connected in series with the heating device in the heating module; The temperature protection switch is turned on when its own temperature is less than or equal to the second temperature threshold, and is turned off when its own temperature is greater than the second temperature threshold at the current moment.

7. A temperature recovery system, characterized in that: The temperature recovery system includes a refrigerator and a temperature control device, each layer of the refrigerator is equipped with a heating module that is in communication with the temperature control device, and the heating module includes a heating device; The temperature control device is used to receive a temperature recovery instruction for the refrigerator, and supply power to each heating module in the refrigerator based on the temperature recovery instruction; The heating device is used to convert electrical energy into thermal energy.

8. The system according to claim 1, characterized in that The temperature control device is also used to stop supplying power to each heating module when the current temperature of the layer where the heating module is located is greater than or equal to a first temperature threshold.

9. The system according to claim 1, characterized in that Each heating module also includes a temperature sensor; The temperature control device is further used to obtain, for each heating module, a resistance value of a temperature sensor in the heating module at a current moment before stopping supplying power to the heating module, as a current resistance value; According to a preset calibration relationship of the temperature sensor in the heating module, the temperature corresponding to the current resistance value is determined as the current temperature of the layer where the heating module is located; the preset calibration relationship is the correspondence between the resistance value and the temperature pre-calibrated for the temperature sensor; The current temperature of the layer where the heating module is located is compared with the first temperature threshold.

10. The system according to claim 9, characterized in that The temperature control device is specifically used to obtain the resistance value of the temperature sensor in each heating module at the current moment by using a three-wire resistance measurement method or a four-wire resistance measurement method as the current resistance value.

Images