HSA pin resistance value selection method and device and computer readable storage medium

By installing a serial presence detection hub on the chip test machine and using nonvolatile memory to save the best HID, the problem of users requiring a long time to test to find the HID that SPD5 Hub works normally at different temperatures is solved, and the effect of quickly finding the best HID is achieved and the user experience is improved.

CN119847840AActive Publication Date: 2025-04-18PUYA SEMICON SHANGHAI CO LTD
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Patent Information

Application Number
CN202411921613.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-25
Publication Date
2025-04-18
Estimated Expiration
2044-12-25

AI Technical Summary

Technical Problem

When using the DDR5 serial presence detection hub, users need to find the HID that SPD5 Hub can work normally at different temperatures through tests, resulting in a longer test time and affecting the user's user experience.

Method used

Install a serial presence detection hub on the chip test machine, and use nonvolatile memory to persist HID that can work normally at low temperature, normal temperature and high temperature, that is, the best HID. The user can directly obtain the best HID and connect the preset resistance value corresponding to the best HID to the HSA pin.

Benefits of technology

Save test time, improve user experience, and enable users to quickly find the HID that SPD5 Hub can work normally at different temperatures.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the invention provides an HSA pin resistance value selection method and device and a computer readable storage medium, and relates to the technical field of chips. According to the method, a nonvolatile memory is arranged in the serial existence detection hub, and the HID, namely the optimal HID, which can normally work at low temperature, normal temperature and high temperature of the serial existence detection hub is persistently stored by utilizing the nonvolatile memory. When the serial existence detection hub is used, a user can directly obtain the optimal HID in the nonvolatile memory of the serial existence detection hub and access the preset resistance value corresponding to the optimal HID to the HSA pin of the serial existence detection hub, so that the test time is saved for the user, and the use experience of the user is improved.
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Description

Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to a method and device for selecting a resistance value of an HSA pin, and a computer-readable storage medium. Background Art

[0002] The DDR5 Serial Presence Detect EEPROMwith Hub function (SPD5 Hub) generates a Host Identifier (HID) by connecting resistors of different resistance values ​​to the Host Status Array (HSA) pin. This is a serial presence detection mechanism. Users can find the HID that the SPD5 Hub can work normally at different temperatures through testing, which will take up more valuable time and affect the user experience. Summary of the invention

[0003] In view of this, an object of the present invention is to provide a method, device and computer-readable storage medium for selecting an HSA pin resistance value, which can save testing time and improve the user experience.

[0004] In order to achieve the above purpose, the technical solution adopted by the embodiment of the present invention is as follows:

[0005] In a first aspect, the present invention provides a method for selecting a resistance value of an HSA pin, which is applied to a chip tester, wherein a serial presence detection hub is installed on the chip tester, and the serial presence detection hub includes a non-volatile memory and an HSA pin; the method includes:

[0006] Connecting different preset resistance values ​​to the HSA pin in sequence; each preset resistance value corresponds to a HID;

[0007] Based on the preset resistance value, obtaining test results of the serial presence detection hub at low temperature, normal temperature and high temperature;

[0008] When the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is saved in the non-volatile memory so that the user can access the corresponding preset resistance value based on the optimal HID; the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are all passed, indicating that the serial presence detection hub works normally at low temperature, normal temperature and high temperature.

[0009] In an optional embodiment, the non-volatile memory stores test records of each HID, the test records including the HID, low temperature test results, normal temperature test results and high temperature test results; the step of obtaining the test results of the serial presence detection hub at low temperature, normal temperature and high temperature based on the preset resistance value includes:

[0010] Determine a corresponding test record according to the HID corresponding to the preset resistance value;

[0011] Testing the serial presence detection hub in a low temperature environment to obtain a low temperature test result in a test record corresponding to the HID;

[0012] Testing the serial presence detection hub under normal temperature to obtain normal temperature test results in the test record corresponding to the HID;

[0013] The serial presence detection hub is tested in a high temperature environment to obtain a high temperature test result in a test record corresponding to the HID.

[0014] In an optional implementation, the serial presence detection hub further includes an HSDA pin; and testing the serial presence detection hub in a low temperature environment to obtain a low temperature test result in a test record corresponding to the HID includes:

[0015] When the HSDA pin receives an ACK signal in a low temperature environment, the low temperature test result in the test record corresponding to the HID is set to pass;

[0016] When the HSDA pin does not receive an ACK signal in a low temperature environment, the low temperature test result in the test record corresponding to the HID is set to fail.

[0017] In an optional implementation, the serial presence detection hub further includes an HSDA pin; and testing the serial presence detection hub under a normal temperature environment to obtain a normal temperature test result in a test record corresponding to the HID includes:

[0018] When the HSDA pin receives an ACK signal under normal temperature, the normal temperature test result in the test record corresponding to the HID is set to pass;

[0019] When the HSDA pin does not receive an ACK signal under normal temperature, the normal temperature test result in the test record corresponding to the HID is set as failure.

[0020] In an optional implementation, the serial presence detection hub further includes an HSDA pin; and testing the serial presence detection hub in a high temperature environment to obtain a high temperature test result in a test record corresponding to the HID includes:

[0021] When the HSDA pin receives an ACK signal in a high temperature environment, the high temperature test result in the test record corresponding to the HID is set to pass;

[0022] When the HSDA pin does not receive an ACK signal in a high temperature environment, the high temperature test result in the test record corresponding to the HID is set to fail.

[0023] In an optional embodiment, the method further comprises:

[0024] When the low temperature and / or the high temperature changes, erasing the low temperature test result and / or the high temperature test result in each test record, and erasing the best HID in the non-volatile memory;

[0025] sequentially connecting different preset resistance values ​​to the HSA pin, and obtaining test results of the serial presence detection hub at an updated low temperature and / or an updated high temperature based on the preset resistance values;

[0026] Updating the low temperature test result and / or the high temperature test result in the test record with the new test result;

[0027] A new optimal HID is determined based on the low temperature test results, normal temperature test results, and high temperature test results in the updated test record.

[0028] In an optional embodiment, the method further comprises:

[0029] Connecting different preset resistance values ​​to the HSA pins of multiple sample hubs in sequence; the multiple sample hubs are selected from multiple serial presence detection hubs in the same wafer;

[0030] Based on the preset resistance value, obtaining the test result of each sample hub at low temperature, normal temperature and high temperature;

[0031] When the test results of all sample hubs corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID.

[0032] In an optional embodiment, the non-volatile memory is further provided with a trimming bit area; when the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is stored in the non-volatile memory, including:

[0033] Traversing each test record in the non-volatile memory, if the low temperature test result, the normal temperature test result and the high temperature test result in the test record are all passed, determining the HID in the test record as the optimal HID;

[0034] The optimal HID is saved in the trimming bit area.

[0035] In a second aspect, the present invention provides a HSA pin resistance value selection device, which is applied to a chip tester, wherein a serial presence detection hub is installed on the chip tester, and the serial presence detection hub includes a non-volatile memory and an HSA pin; the device includes:

[0036] An access module, used to sequentially access different preset resistance values ​​for the HSA pin; each preset resistance value corresponds to a HID;

[0037] A testing module, used for obtaining test results of the serial presence detection hub at low temperature, normal temperature and high temperature based on the preset resistance value;

[0038] A selection module is used to determine the HID corresponding to the preset resistance value as the optimal HID when the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, and the optimal HID is stored in the non-volatile memory so that the user can access the corresponding preset resistance value based on the optimal HID; the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are all passed, indicating that the serial presence detection hub works normally at low temperature, normal temperature and high temperature.

[0039] In a third aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a chip tester, implements the HSA pin resistance value selection method as described in any one of the aforementioned embodiments.

[0040] Compared with the prior art, the HSA pin resistance value selection method, device and computer-readable storage medium provided in the embodiments of the present invention have a built-in non-volatile memory in the serial presence detection hub, and use the non-volatile memory to persistently save the HID of the serial presence detection hub that can work normally at low temperature, normal temperature and high temperature, that is, the optimal HID. When using the serial presence detection hub, the user can directly obtain the optimal HID in the non-volatile memory of the serial presence detection hub, and connect the preset resistance value corresponding to the optimal HID to the HSA pin of the serial presence detection hub, which saves the user testing time and improves the user experience.

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0043] Figure 1 A schematic flow chart of a method for selecting a resistance value of an HSA pin provided in an embodiment of the present invention is shown.

[0044] Figure 2 Another schematic flow chart of a method for selecting a resistance value of an HSA pin provided in an embodiment of the present invention is shown.

[0045] Figure 3 Another schematic flow chart of a method for selecting a resistance value of an HSA pin provided in an embodiment of the present invention is shown.

[0046] Figure 4 Another schematic flow chart of a method for selecting a resistance value of an HSA pin provided in an embodiment of the present invention is shown.

[0047] Figure 5 Another schematic flow chart of a method for selecting a resistance value of an HSA pin provided in an embodiment of the present invention is shown.

[0048] Figure 6 A block diagram of a device for selecting a resistance value of an HSA pin provided by an embodiment of the present invention is shown.

[0049] Figure 7 A block diagram of a chip testing machine provided by an embodiment of the present invention is shown.

[0050] Icons: 100 - chip tester; 110 - serial presence detection hub; 300 - HSA pin resistance value selection device; 301 - access module; 302 - test module; 303 - selection module. DETAILED DESCRIPTION

[0051] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0053] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0054] Different resistor values ​​connected to the HSA pin of the SPD5 Hub correspond to different 3-bit HIDs, which are used to identify the characteristics and status of the device connected to the SPD5 Hub. Specifically, the change of each resistor value will affect the time delay in signal transmission, thereby forming a unique identification sequence. Taking Table 1 as an example, Table 1 shows the correspondence between different preset resistor values ​​and HIDs, which is crucial to ensure the compatibility and configuration of the storage system.

[0055] Table 1

[0056]

[0057]

[0058] The inventors have found that each time before using the SPD5 Hub, it is necessary to find a suitable HID through chip probing (CP test) and connect the HSA pin to the appropriate resistance value corresponding to the HID. Due to cost and efficiency limitations, CP testing is usually performed by connecting a chip tester to an analog resistor. The SPD5 Hub is affected by temperature, and through continuous adjustment, it is verified that the HID can work at low temperature, normal temperature, and high temperature at the same time. This undoubtedly increases the time cost and affects the user experience.

[0059] Based on this, the HSA pin resistance value selection method, device, chip tester and storage medium provided by the embodiment of the present invention have a built-in non-volatile memory in the serial presence detection hub, and use the non-volatile memory to persistently save the HID of the serial presence detection hub that can work normally at low temperature, normal temperature and high temperature, that is, the optimal HID. When using the serial presence detection hub, the user can directly obtain the optimal HID in the non-volatile memory of the serial presence detection hub, and connect the preset resistance value corresponding to the optimal HID to the HSA pin of the serial presence detection hub, which saves the user testing time and improves the user experience.

[0060] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0061] Please refer to Figure 1 , Figure 1 A flow chart of a method for selecting the resistance value of an HSA pin provided by an embodiment of the present invention is shown. The method is applied to a chip tester, on which a serial presence detection hub is installed, and the serial presence detection hub includes a non-volatile memory and an HSA pin. The method includes the following steps:

[0062] Step S10, connecting different preset resistance values ​​to the HSA pin in sequence; each preset resistance value corresponds to a HID.

[0063] In the embodiment of the present invention, the non-volatile memory built into the serial presence detection hub (ie, SPD5 Hub) may be an electrically erasable programmable read-only memory (Electrically Erasable Programmable Read-Only Memory, referred to as EEPROM), and the EEPROM is used to record the best HID.

[0064] The chip tester sequentially connects different preset resistance values ​​to the HSA pin, for example, first connects the preset resistance value 10.0KΩ to GND to the HSA pin in order from small to large resistance values, and finally connects the preset resistance value 196KΩ to GND to the HSA pin. Alternatively, first connect the preset resistance value 196KΩ to GND to the HSA pin in order from large to small resistance values, and finally connects the preset resistance value 10.0KΩ to GND to the HSA pin. Alternatively, randomly select preset resistance values ​​to connect to the HSA pin until the chip tester connects all preset resistance values ​​to the HSA pin in sequence. The present invention does not limit the order in which the preset resistance values ​​are connected to the HSA pin.

[0065] Step S20, based on the preset resistance value, obtaining the test results of the serial presence detection hub at low temperature, normal temperature and high temperature.

[0066] In the embodiment of the present invention, after the HSA pin is connected to a preset resistance value, the serial presence detection hub is tested at low temperature, normal temperature and high temperature to obtain test results.

[0067] Among them, low temperature represents the lower temperature range in which the SPD5 Hub can work normally, which belongs to the low temperature part of the industrial temperature range, such as below -40℃ to -30℃. Normal temperature usually refers to room temperature, which belongs to the ideal temperature range for normal operation of the chip, such as between 15℃ and 25℃. High temperature represents the upper temperature range in which the SPD5 Hub can work normally, which belongs to the high temperature part of the industrial temperature range, such as between 110℃ and 125℃.

[0068] Step S30, when the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is saved in a non-volatile memory so that the user can access the corresponding preset resistance value based on the optimal HID; the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are all passed, indicating that the serial presence detection hub works normally at low temperature, normal temperature and high temperature.

[0069] In the embodiment of the present invention, it is determined whether the test results of the SPD5 Hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed. If there is a test result that fails, the preset resistance value will not be able to support the normal operation of the SPD5 Hub at low temperature, normal temperature and high temperature. If the test results corresponding to the preset resistance value are all passed, the preset resistance value can support the normal operation of the SPD5 Hub at low temperature, normal temperature and high temperature, and the HID corresponding to the preset resistance value is determined as the optimal HID and saved in the EEPROM.

[0070] When the user uses the SPD5 Hub, the best HID is obtained from the non-volatile memory (ie, EEPROM), and the preset resistance value corresponding to any best HID is connected to the HSA pin, which can enable the SPD5 Hub to quickly enter the working state and save the testing time of the SPD5 Hub.

[0071] In summary, the HSA pin resistance value selection method provided in the embodiment of the present invention is to connect different preset resistance values ​​to the HSA pin in turn; based on the preset resistance values, obtain the test results of the serial presence detection hub at low temperature, normal temperature and high temperature; when the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is saved in a non-volatile memory, so that the user can connect the corresponding preset resistance value based on the optimal HID.

[0072] It can be seen that the embodiment of the present invention creatively builds a non-volatile memory in the serial presence detection hub, and uses the non-volatile memory to persistently save the HID of the serial presence detection hub that can work normally at low temperature, normal temperature and high temperature, that is, the optimal HID. When using the serial presence detection hub, the user can directly obtain the optimal HID in the non-volatile memory of the serial presence detection hub, and connect the preset resistance value corresponding to the optimal HID to the HSA pin of the serial presence detection hub, which saves the user testing time and improves the user experience.

[0073] Optionally, in actual applications, the non-volatile memory stores test records of each HID, and the test records include HID, low temperature test results, normal temperature test results, and high temperature test results. As for how to generate the low temperature test results, normal temperature test results, and high temperature test results in the test records, a possible implementation method is provided below. Please refer to Figure 2 , Figure 1 The sub-steps of step S20 may include:

[0074] Step S201, determining a corresponding test record according to the HID corresponding to the preset resistance value.

[0075] In the embodiment of the present invention, the EEPROM stores the test records of each HID, and each test record includes the HID, the low temperature test result, the normal temperature test result, and the high temperature test result. The chip tester can find the corresponding HID from Table 1 according to the preset resistance value connected to the HSA pin, and the corresponding test record can be found through the corresponding HID.

[0076] Before executing the HSA pin resistance value selection method, the low temperature test results, normal temperature test results, and high temperature test results in each test record of the EEPROM are invalid values ​​(eg, 0xFF), as shown in Table 2.

[0077] Table 2

[0078] HID Low temperature test results Normal temperature test results High temperature test results 000 0xFF 0xFF 0xFF 001 0xFF 0xFF 0xFF 010 0xFF 0xFF 0xFF 011 0xFF 0xFF 0xFF 100 0xFF 0xFF 0xFF 101 0xFF 0xFF 0xFF 110 0xFF 0xFF 0xFF 111 0xFF 0xFF 0xFF

[0079] Step S202, testing the serial presence detection hub in a low temperature environment to obtain a low temperature test result in a test record corresponding to the HID.

[0080] Step S203, testing the serial presence detection hub under normal temperature environment, and obtaining normal temperature test results in the test record corresponding to the HID.

[0081] Step S204, testing the serial presence detection hub in a high temperature environment to obtain a high temperature test result in a test record corresponding to the HID.

[0082] In the embodiment of the present invention, the chip tester is placed in a low temperature environment, and the SPD5 Hub is tested in the low temperature environment, that is, the SPD5 Hub communicates with the host, obtains the low temperature test result corresponding to the HID, and updates the low temperature test result to the test record corresponding to the HID. Similarly, the chip tester is placed in a normal temperature environment and a high temperature environment respectively, the SPD5 Hub is tested, and the normal temperature test result and the high temperature test result corresponding to the HID are updated to the test record corresponding to the HID.

[0083] It should be noted that in order to reduce the time of changing the test environment temperature, the serial presence detection hub connected to different preset resistance values ​​can be tested in the same temperature environment. For example, in a low temperature environment, different preset resistance values ​​are connected to the HSA pin in sequence to obtain the test results of the serial presence detection hub connected to each preset resistance value in the low temperature environment.

[0084] In a normal temperature environment, different preset resistance values ​​are sequentially connected to the HSA pin to obtain the test results of the serial presence detection hub connected to each preset resistance value in a normal temperature environment. In a high temperature environment, different preset resistance values ​​are sequentially connected to the HSA pin to obtain the test results of the serial presence detection hub connected to each preset resistance value in a high temperature environment, and finally the optimal HID is obtained based on the test results of each preset resistance value at low temperature, normal temperature and high temperature.

[0085] It can be seen that the embodiment of the present invention uses a non-volatile memory to record the test results of the serial presence detection hub based on each preset resistance value at low temperature, normal temperature and high temperature, thereby ensuring that the test results will not be lost after power failure. And based on the low temperature test results, normal temperature test results and high temperature test results recorded in the test records in the non-volatile memory, the best HID is quickly determined.

[0086] Optionally, in practical applications, the serial presence detection hub further includes a HSDA pin. As to how to use the HSDA pin to determine the low temperature test result, a possible implementation is provided below. Figure 2 The sub-steps of step S202 may include:

[0087] When the HSDA pin receives an ACK signal in a low temperature environment, the low temperature test result in the test record corresponding to the HID is set to pass; when the HSDA pin does not receive an ACK signal in a low temperature environment, the low temperature test result in the test record corresponding to the HID is set to fail.

[0088] In the embodiment of the present invention, when the host successfully receives the data sent by the serial presence detection hub, the host sends an ACK signal to the serial presence detection hub, and the serial presence detection hub receives the ACK signal through the HSDA pin.

[0089] When the chip tester is in a low temperature environment, if the HSDA pin receives an ACK signal, it indicates that the serial presence detection hub can work normally in the low temperature environment and can successfully send data to the host, and the low temperature test result in the test record corresponding to the HID is set to pass, for example, set to 1. If the HSDA pin does not receive an ACK signal, it indicates that the serial presence detection hub cannot work normally in the low temperature environment, and the low temperature test result in the test record corresponding to the HID is set to fail, for example, set to 0.

[0090] Optionally, in practical applications, the serial presence detection hub further includes a HSDA pin. As to how to use the HSDA pin to determine the normal temperature test result, a possible implementation is provided below. Figure 2 The sub-steps of step S203 may include:

[0091] When the HSDA pin receives an ACK signal under normal temperature, the normal temperature test result in the test record corresponding to the HID is set to pass; when the HSDA pin does not receive an ACK signal under normal temperature, the normal temperature test result in the test record corresponding to the HID is set to fail.

[0092] In the embodiment of the present invention, when the chip tester is in a normal temperature environment, if the HSDA pin receives an ACK signal, it indicates that the serial presence detection hub can work normally in the normal temperature environment and can successfully send data to the host, and the normal temperature test result in the test record corresponding to the HID is set to pass, for example, to 1. If the HSDA pin does not receive an ACK signal, it indicates that the serial presence detection hub cannot work normally in the normal temperature environment, and the normal temperature test result in the test record corresponding to the HID is set to fail, for example, to 0.

[0093] Optionally, in practical applications, the serial presence detection hub further includes a HSDA pin. As to how to use the HSDA pin to determine the high temperature test result, a possible implementation is provided below. Figure 2 The sub-steps of step S204 may include:

[0094] When the HSDA pin receives an ACK signal in a high temperature environment, the high temperature test result in the test record corresponding to the HID is set to pass; when the HSDA pin does not receive an ACK signal in a high temperature environment, the high temperature test result in the test record corresponding to the HID is set to fail.

[0095] In an embodiment of the present invention, when the chip tester is in a high temperature environment, if the HSDA pin receives an ACK signal, it indicates that the serial presence detection hub can work normally in the high temperature environment and can successfully send data to the host, and the high temperature test result in the test record corresponding to the HID is set to pass, for example, to 1. If the HSDA pin does not receive an ACK signal, it indicates that the serial presence detection hub cannot work normally in the high temperature environment, and the high temperature test result in the test record corresponding to the HID is set to fail, for example, to 0.

[0096] As a possible implementation, assume that in a low temperature environment, the test result of the serial presence detection hub is that the passed HIDs are 011, 100, 101, 110, and 111. In a normal temperature environment, the test result of the serial presence detection hub is that the passed HIDs are 010, 011, 100, and 101. In a high temperature environment, the test result of the serial presence detection hub is that the passed HIDs are 001, 010, 011, and 100, and the test records of each HID of the EEPROM are shown in Table 3.

[0097] Table 3

[0098] HID Low temperature test results Normal temperature test results High temperature test results 000 0 0 0 001 0 0 1 010 0 1 1 011 1 1 1 100 1 1 1 101 1 1 0 110 1 0 0 111 1 0 0

[0099] Optionally, in practical applications, the non-volatile memory is further provided with a trimming bit area. As to how to use the trimming bit area to store the optimal HID, a possible implementation is provided below. Figure 1 The sub-steps of step S30 may include:

[0100] Traversing each test record in the non-volatile memory, if the low temperature test result, the normal temperature test result and the high temperature test result in the test record are all passed, determining the HID in the test record as the best HID; and saving the best HID in the trimming bit area.

[0101] During the product calibration phase, the test results of each HID at three temperatures (i.e., low temperature, normal temperature, and high temperature) are read from the non-volatile memory EEPROM, and the HID whose test results at low temperature, normal temperature, and high temperature (i.e., low temperature test result, normal temperature test result, and high temperature test result) are all passed is determined as the best HID, such as 011 and 100 in Table 3 are determined as the best HID.

[0102] A trimming bit area is set in the nonvolatile memory EEPROM. The trimming bit area is used to record the best HID of the serial presence detection hub. The best HID (eg, 011 and 100) is written into the trimming bit area as the final adjustment setting of the product.

[0103] Optionally, in actual applications, it is necessary to re-test the best HID for the serial presence detection hub when redefining low or high temperatures. The following is a possible implementation method, please refer to Figure 3 , the HSA pin resistance value selection method also includes the following steps:

[0104] Step S40, when the low temperature and / or high temperature changes, the low temperature test result and / or high temperature test result in each test record is erased, and the best HID in the non-volatile memory is erased.

[0105] In an embodiment of the present invention, when the ambient temperature of the serial presence detection hub changes greatly, it is necessary to redefine the low temperature and / or high temperature according to the actual application scenario. When the low temperature or high temperature is redefined, the HSA pin resistance value needs to be re-recommended. In order to prevent important information in a non-volatile memory (such as EEPROM) from being accidentally overwritten, old data needs to be erased before each write, and the non-volatile memory needs to be regularly maintained to extend its service life, thereby ensuring the durability and security of the optimal HID storage.

[0106] Step S50, connecting different preset resistance values ​​to the HSA pin in sequence, and obtaining test results of the serial presence detection hub under the updated low temperature and / or the updated high temperature based on the preset resistance values.

[0107] Step S60: Update the low temperature test result and / or high temperature test result in the test record with the new test result.

[0108] Step S70, determining a new optimal HID according to the low temperature test result, normal temperature test result and high temperature test result in the updated test record.

[0109] In an embodiment of the present invention, the chip tester is placed in an updated low-temperature environment and / or high-temperature environment, the test results after the serial presence detection hub is connected to different preset resistance values ​​are tested, and the low-temperature test results and / or high-temperature test results in the corresponding test records are updated using the new test results. When the low-temperature test results, normal temperature test results, and high-temperature test results in the updated test records are all passed, the HID in the test record is determined as the best HID, and the new best HID is saved in the non-volatile memory.

[0110] Optionally, in actual applications, there are tens of thousands of serial presence detection hubs on the same wafer. In order to improve the test efficiency, a few hundred sample hubs can be extracted from the tens of thousands of serial presence detection hubs on the same wafer. The following is a possible implementation method, please refer to Figure 4 , the HSA pin resistance value selection method also includes the following steps:

[0111] Step S80, connecting different preset resistance values ​​to the HSA pins of multiple sample hubs in sequence; the multiple sample hubs are selected from multiple serial presence detection hubs in the same wafer.

[0112] Step S90, based on the preset resistance value, obtaining the test results of each sample hub at low temperature, normal temperature and high temperature.

[0113] Step S100 , when the test results of all sample hubs corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the best HID.

[0114] In the embodiment of the present invention, in order to further improve the test efficiency, test samples are extracted from tens of thousands of serial presence detection hubs in the same wafer to obtain multiple sample hubs. Based on the different preset resistance values ​​connected, each sample hub is tested at low temperature, normal temperature and high temperature to obtain the test records of each HID corresponding to each sample hub.

[0115] When the low temperature test results, normal temperature test results, and high temperature test results in all test records of the same HID are all passed, the HID is determined as the best HID corresponding to each serial presence detection hub in the same wafer. In other words, the best HID corresponding to each serial presence detection hub in the same wafer is the same. By selecting test samples to reduce test time, the efficiency of the HSA pin resistance recommendation test is improved.

[0116] To more clearly illustrate the HSA pin resistance value selection method provided by the embodiment of the present invention, please refer to Figure 5 , taking the testing of a serial presence detection hub in a low temperature environment as an example for illustrative explanation.

[0117] Step 1, start the serial presence detection hub.

[0118] Step 2: select a preset resistance value from a plurality of preset resistance values ​​as the resistance value to be connected.

[0119] Step 3: Set the analog resistor to the resistor to be connected, and connect the resistor to be connected to the HSA pin.

[0120] Step 4, write the HID corresponding to the resistance value to be connected into the trimming area in the serial presence detection hub.

[0121] Since the trimming area can only write a three-bit HID, the old HID in the trimming area needs to be erased before recording the next HID, and then the HID corresponding to the resistor to be connected in this round of processing needs to be written into the trimming area.

[0122] Step 5, determine whether the HSDA pin of the serial presence detection hub receives an ACK signal.

[0123] If the HSDA pin does not receive an ACK signal, execute step 6; if the HSDA pin receives an ACK signal, execute step 7.

[0124] Step 6: Set the test result of the HID corresponding to the resistance value to be connected as failed.

[0125] Step 7: Set the test result of the HID corresponding to the resistance value to be connected as passed.

[0126] Step 8: Save the test result of the HID corresponding to the resistance value to be connected into a non-volatile memory.

[0127] Step 9, determine whether all preset resistance values ​​have been tested.

[0128] If yes, go to step 10; if yes, go to step 11.

[0129] Step 10, obtaining the next preset resistance value as the resistance value to be connected, and jumping back to step 3 for execution.

[0130] Step 11, low temperature test is completed.

[0131] Continue to place the chip tester at normal temperature and high temperature in turn to complete normal temperature test and high temperature test by executing step 2 to step 11. Finally, the HID corresponding to the preset resistance value for which the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are all passed is determined as the best HID, and the best HID is stored in the non-volatile memory.

[0132] It should be noted that, assuming that the test results of the serial presence detection hub in a low temperature environment are saved in a non-volatile memory, when performing a low temperature check, if the value of the trimming area is 0 (indicating failure), the corresponding low temperature test result in the non-volatile memory can be rewritten into the trimming area, and then the value in the trimming area can be checked to see if it is 1 (indicating pass), thereby improving the HSA pin yield.

[0133] Based on the same inventive concept, the basic principle and technical effect of the HSA pin resistance value selection device provided in the embodiment of the present invention are the same as those in the above embodiment. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the above embodiment.

[0134] Please refer to Figure 6 , Figure 6 A block diagram of an HSA pin resistance value selection device 300 provided in an embodiment of the present invention includes an access module 301 , a test module 302 and a selection module 303 .

[0135] The access module 301 is used to sequentially access different preset resistance values ​​to the HSA pin; each preset resistance value corresponds to a HID;

[0136] A test module 302 is used to obtain test results of the serial presence detection hub at low temperature, normal temperature and high temperature based on a preset resistance value;

[0137] The selection module 303 is used to determine the HID corresponding to the preset resistance value as the optimal HID when the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, and the optimal HID is stored in a non-volatile memory so that the user can access the corresponding preset resistance value based on the optimal HID; the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are all passed, indicating that the serial presence detection hub works normally at low temperature, normal temperature and high temperature.

[0138] In summary, the HSA pin resistance value selection device provided in the embodiment of the present invention sequentially connects different preset resistance values ​​to the HSA pin; based on the preset resistance values, obtains the test results of the serial presence detection hub at low temperature, normal temperature and high temperature; when the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is saved in a non-volatile memory, so that the user can connect the corresponding preset resistance value based on the optimal HID.

[0139] It can be seen that the embodiment of the present invention creatively builds a non-volatile memory in the serial presence detection hub, and uses the non-volatile memory to persistently save the HID of the serial presence detection hub that can work normally at low temperature, normal temperature and high temperature, that is, the optimal HID. When using the serial presence detection hub, the user can directly obtain the optimal HID in the non-volatile memory of the serial presence detection hub, and connect the preset resistance value corresponding to the optimal HID to the HSA pin of the serial presence detection hub, which saves the user testing time and improves the user experience.

[0140] Optionally, the non-volatile memory stores test records of each HID, and the test records include HID, low temperature test results, normal temperature test results, and high temperature test results. The test module is specifically used to determine the corresponding test record according to the HID corresponding to the preset resistance value; test the serial presence detection hub in a low temperature environment to obtain the low temperature test result in the test record corresponding to the HID; test the serial presence detection hub in a normal temperature environment to obtain the normal temperature test result in the test record corresponding to the HID; test the serial presence detection hub in a high temperature environment to obtain the high temperature test result in the test record corresponding to the HID.

[0141] Optionally, the serial presence detection hub further includes a HSDA pin. The test module is specifically configured to set the low temperature test result in the test record corresponding to the HID as passed when the HSDA pin receives an ACK signal in a low temperature environment; and set the low temperature test result in the test record corresponding to the HID as failed when the HSDA pin does not receive an ACK signal in a low temperature environment.

[0142] Optionally, the serial presence detection hub further includes a HSDA pin. The test module is specifically configured to set the normal temperature test result in the test record corresponding to the HID as passed when the HSDA pin receives an ACK signal in a normal temperature environment; and set the normal temperature test result in the test record corresponding to the HID as failed when the HSDA pin does not receive an ACK signal in a normal temperature environment.

[0143] Optionally, the serial presence detection hub further includes a HSDA pin. The test module is specifically configured to set the high temperature test result in the test record corresponding to the HID as passed when the HSDA pin receives an ACK signal in a high temperature environment; and set the high temperature test result in the test record corresponding to the HID as failed when the HSDA pin does not receive an ACK signal in a high temperature environment.

[0144] Optionally, the selection module 303 is further used to erase the low temperature test result and / or the high temperature test result in each test record and erase the best HID in the non-volatile memory when the low temperature and / or the high temperature changes;

[0145] An access module 301 is used to sequentially access different preset resistance values ​​to the HSA pin;

[0146] The test module 302 is further used to obtain the test result of the serial presence detection hub at the updated low temperature and / or the updated high temperature based on the preset resistance value; and update the low temperature test result and / or the high temperature test result in the test record using the new test result;

[0147] The selection module 303 is further used to determine a new optimal HID according to the low temperature test result, normal temperature test result and high temperature test result in the updated test record.

[0148] Optionally, the access module 301 is further used to sequentially access different preset resistance values ​​for HSA pins of multiple sample hubs; the multiple sample hubs are selected from multiple serial presence detection hubs in the same wafer;

[0149] The test module 302 is further used to obtain the test results of each sample hub at low temperature, normal temperature and high temperature based on the preset resistance value;

[0150] The selection module 303 is further configured to determine the HID corresponding to the preset resistance value as the best HID when the test results of all sample hubs corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed.

[0151] Please refer to Figure 7 , Figure 7 A block diagram of a chip tester 100 provided for the implementation of the present invention. The chip tester 100 is equipped with a serial presence detection hub 110, and the chip tester 100 can implement the HSA pin resistance value selection method disclosed in the above embodiments.

[0152] The embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by the chip tester 100, the HSA pin resistance value selection method disclosed in the above embodiments is implemented.

[0153] The embodiment of the present invention further provides a program product, which, when executed by the chip tester 100, implements the HSA pin resistance value selection method disclosed in the above embodiments.

[0154] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0155] In addition, the functional modules in the various embodiments of the present invention may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0156] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0157] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for selecting a resistance value of an HSA pin, characterized in that: The method is applied to a chip tester, wherein a serial presence detection hub is installed on the chip tester, and the serial presence detection hub includes a non-volatile memory and an HSA pin; the method includes: Connecting different preset resistance values ​​to the HSA pin in sequence; each preset resistance value corresponds to a HID; Based on the preset resistance value, obtaining test results of the serial presence detection hub at low temperature, normal temperature and high temperature; When the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is saved in the non-volatile memory so that the user can access the corresponding preset resistance value based on the optimal HID; the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are all passed, indicating that the serial presence detection hub works normally at low temperature, normal temperature and high temperature.

2. The method for selecting the resistance value of the HSA pin according to claim 1, characterized in that: The non-volatile memory stores test records of each HID, wherein the test records include the HID, low temperature test results, normal temperature test results, and high temperature test results; The obtaining, based on the preset resistance value, test results of the serial presence detection hub at low temperature, normal temperature, and high temperature includes: Determine a corresponding test record according to the HID corresponding to the preset resistance value; Testing the serial presence detection hub in a low temperature environment to obtain a low temperature test result in a test record corresponding to the HID; Testing the serial presence detection hub under normal temperature to obtain normal temperature test results in the test record corresponding to the HID; The serial presence detection hub is tested in a high temperature environment to obtain a high temperature test result in a test record corresponding to the HID.

3. The method for selecting the resistance value of the HSA pin according to claim 2, characterized in that: The serial presence detection hub also includes an HSDA pin; the testing of the serial presence detection hub in a low temperature environment to obtain a low temperature test result in a test record corresponding to the HID includes: When the HSDA pin receives an ACK signal in a low temperature environment, the low temperature test result in the test record corresponding to the HID is set to pass; When the HSDA pin does not receive an ACK signal in a low temperature environment, the low temperature test result in the test record corresponding to the HID is set to fail.

4. The method for selecting the resistance value of the HSA pin according to claim 2, characterized in that: The serial presence detection hub also includes an HSDA pin; the testing of the serial presence detection hub under a normal temperature environment to obtain a normal temperature test result in a test record corresponding to the HID includes: When the HSDA pin receives an ACK signal under normal temperature, the normal temperature test result in the test record corresponding to the HID is set to pass; When the HSDA pin does not receive an ACK signal under normal temperature, the normal temperature test result in the test record corresponding to the HID is set as failure.

5. The method for selecting the resistance value of the HSA pin according to claim 2, characterized in that: The serial presence detection hub also includes an HSDA pin; the testing of the serial presence detection hub in a high temperature environment to obtain a high temperature test result in a test record corresponding to the HID includes: When the HSDA pin receives an ACK signal in a high temperature environment, the high temperature test result in the test record corresponding to the HID is set to pass; When the HSDA pin does not receive an ACK signal in a high temperature environment, the high temperature test result in the test record corresponding to the HID is set to fail.

6. The method for selecting the resistance value of the HSA pin according to claim 2, characterized in that: The method further comprises: When the low temperature and / or the high temperature changes, erasing the low temperature test result and / or the high temperature test result in each test record, and erasing the best HID in the non-volatile memory; sequentially connecting different preset resistance values ​​to the HSA pin, and obtaining test results of the serial presence detection hub at an updated low temperature and / or an updated high temperature based on the preset resistance values; Updating the low temperature test result and / or the high temperature test result in the test record with the new test result; A new optimal HID is determined based on the low temperature test results, normal temperature test results, and high temperature test results in the updated test record.

7. The method for selecting the resistance value of the HSA pin according to claim 1, characterized in that: The method further comprises: Connecting different preset resistance values ​​to the HSA pins of multiple sample hubs in sequence; the multiple sample hubs are selected from multiple serial presence detection hubs in the same wafer; Based on the preset resistance value, obtaining the test result of each sample hub at low temperature, normal temperature and high temperature; When the test results of all sample hubs corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID.

8. The method for selecting the resistance value of the HSA pin according to claim 2, characterized in that: The non-volatile memory is further provided with a trimming bit area; when the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, the HID corresponding to the preset resistance value is determined as the optimal HID, and the optimal HID is stored in the non-volatile memory, including: Traversing each test record in the non-volatile memory, if the low temperature test result, the normal temperature test result and the high temperature test result in the test record are all passed, determining the HID in the test record as the optimal HID; The optimal HID is saved in the trimming bit area.

9. A device for selecting a resistance value of an HSA pin, characterized in that: The device is applied to a chip tester, wherein a serial presence detection hub is installed on the chip tester, and the serial presence detection hub includes a non-volatile memory and an HSA pin; the device includes: An access module, used to sequentially access different preset resistance values ​​for the HSA pin; each preset resistance value corresponds to a HID; A testing module, used for obtaining test results of the serial presence detection hub at low temperature, normal temperature and high temperature based on the preset resistance value; A selection module is used to determine the HID corresponding to the preset resistance value as the optimal HID when the test results of the serial presence detection hub corresponding to the preset resistance value at low temperature, normal temperature and high temperature are all passed, and the optimal HID is stored in the non-volatile memory so that the user can access the corresponding preset resistance value based on the optimal HID; the test results of the serial presence detection hub at low temperature, normal temperature and high temperature are all passed, indicating that the serial presence detection hub works normally at low temperature, normal temperature and high temperature.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a chip tester, the HSA pin resistance value selection method according to any one of claims 1 to 8 is implemented.

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