Method, device and equipment for reading IDs (Identity) on two sides of wafer by adopting single code reader and medium

Abstract

The invention discloses a method, a device, equipment and a medium for reading two-sided IDs (Identity) of a wafer by adopting a single code reader, and relates to the technical field of wafer ID reading. The method comprises the steps that whether a wafer ID is located on the front face of a wafer or not is judged; if the wafer ID is located on the front face of the wafer, the wafer ID on the front face of the wafer is scanned and read through a reading head; if the wafer ID is located on the reverse side of the wafer, the reading head is adjusted to the position capable of receiving an image reflected by an optical reflection assembly, and the optical reflection assembly is used for reflecting the image on the reverse side of the wafer into the reading head; and scanning the image reflected by the optical reflection assembly through a reading head so as to read the wafer ID on the reverse side of the wafer. Visibly, the optical reflection assembly can reflect the image on the reverse side of the wafer into the reading head, so that the ID of the wafer on the two sides of the front side of the wafer can be read through one scanning head, and the cost is greatly reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer ID reading, and in particular to a method, device, equipment and medium for reading double-sided IDs of wafers using a single barcode reader. Background Art

[0002] During the semiconductor device manufacturing process, wafer manufacturers will store the chip information in the wafer into a data file and print the wafer ID on the front or back of the wafer to facilitate the one-to-one correspondence between the physical object and the data.

[0003] In the packaging and testing industry, in order to sort and grind wafers, it is necessary to read the wafer ID for further processing. Since the positions of the IDs of different manufacturers are inconsistent, some are located on the front side and some are located on the back side, in the existing technology, two reading terminals are generally used to facilitate compatible reading of the front and back sides. Since the price of the reading terminal is relatively high, the equipment cost will also increase accordingly. Summary of the invention

[0004] The embodiments of the present invention provide a method, device, equipment and medium for reading double-sided IDs of wafers using a single barcode reader, aiming to solve the problem of high cost in existing wafer ID reading solutions.

[0005] In a first aspect, an embodiment of the present invention provides a method for reading a double-sided ID of a wafer using a single barcode reader, comprising:

[0006] Determine whether the wafer ID is located on the front side of the wafer;

[0007] If the wafer ID is located on the front side of the wafer, the wafer ID on the front side of the wafer is read by scanning at the reader terminal;

[0008] If the wafer ID is located on the back side of the wafer, adjust the reading terminal to a position capable of receiving an image reflected by an optical reflection component, wherein the optical reflection component is used to reflect the image of the back side of the wafer into the reading terminal;

[0009] The image reflected by the optical reflection component is scanned by a reading terminal to read the wafer ID located on the reverse side of the wafer.

[0010] A further technical solution is that, in determining whether the wafer ID is located in front of the front side of the wafer, the method further comprises:

[0011] placing the wafer on a positioning table;

[0012] By rotating and scanning the edge of the wafer, the center and direction of the wafer are positioned.

[0013] A further technical solution is that the step of determining whether the wafer ID is located on the front side of the wafer includes:

[0014] Scan the front side of the wafer to determine whether the wafer ID is scanned;

[0015] If the wafer ID is scanned, it is determined that the wafer ID is located on the front side of the wafer;

[0016] If the wafer ID is not scanned, it is determined that the wafer ID is located on the reverse side of the wafer.

[0017] A further technical solution is that the wafer ID on the front side of the wafer is read by scanning at a reader terminal, comprising:

[0018] Keep the position of the reading dock unchanged;

[0019] Rotate the wafer to move the wafer ID under the reader terminal;

[0020] The wafer ID on the front side of the wafer is read by scanning at the reader terminal.

[0021] A further technical solution is that the step of adjusting the reading port to a position capable of receiving the image reflected by the optical reflection component comprises:

[0022] The reading terminal is rotated and / or moved to a position where it can receive the image reflected by the optical reflective component.

[0023] A further technical solution is that the optical reflection assembly includes a first reflector, a second reflector and a third reflector; the first reflector is located below the wafer, the second reflector is located on one side of the first reflector in a horizontal direction, the third reflector is located above the second reflector, and the reading port is located on one side of the third reflector in a horizontal direction;

[0024] The image reflected by the optical reflective component is received by rotating the reading terminal toward the third reflector.

[0025] A further technical solution is that the optical reflection component includes a first reflection mirror and a second reflection mirror; the first reflection mirror is located below the wafer, and the second reflection mirror is located on one side of the first reflection mirror in a horizontal direction;

[0026] The reading port is moved to above the second reflector to receive the image reflected by the optical reflective component.

[0027] In a second aspect, an embodiment of the present invention further provides a device for reading double-sided IDs of a wafer using a single barcode reader, which includes a unit for executing the above method.

[0028] In a third aspect, an embodiment of the present invention further provides a computer device, which includes a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the above method when executing the computer program.

[0029] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, wherein the storage medium stores a computer program, and the computer program can implement the above method when executed by a processor.

[0030] The embodiment of the present invention provides a method, device, equipment and medium for reading the double-sided ID of a wafer using a single barcode reader. The method includes: determining whether the wafer ID is located on the front side of the wafer; if the wafer ID is located on the front side of the wafer, scanning and reading the wafer ID on the front side of the wafer through the barcode reader; if the wafer ID is located on the back side of the wafer, adjusting the barcode reader to a position capable of receiving an image reflected by an optical reflection component, wherein the optical reflection component is used to reflect the image on the back side of the wafer into the barcode reader; scanning the image reflected by the optical reflection component through the barcode reader to read the wafer ID located on the back side of the wafer. It can be seen that the optical reflection component can reflect the image on the back side of the wafer into the barcode reader, so that the present invention can realize the reading of the wafer ID on both sides of the wafer through one scanning head, which greatly reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0032] Figure 1 A schematic flow chart of a method for reading double-sided IDs of wafers using a single barcode reader provided by an embodiment of the present invention;

[0033] Figure 2 A schematic diagram of reading a wafer ID on the back side of a wafer in a method for reading a wafer double-sided ID using a single barcode reader provided by an embodiment of the present invention;

[0034] Figure 3 A schematic diagram of reading a wafer ID on the back side of a wafer in a method for reading a wafer double-sided ID using a single barcode reader provided by another embodiment of the present invention;

[0035] Figure 4 A schematic block diagram of a computer device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0038] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0039] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0040] As used in this specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0041] See also Figure 1 The embodiment of the present invention provides a method for reading the double-sided ID of a wafer using a single barcode reader. Figure 1 As shown, the method comprises the following steps:

[0042] S1, determining whether the wafer ID is located on the front side of the wafer.

[0043] In a specific implementation, before executing step S1, the following steps are first performed: placing a wafer on a positioning table; and completing the positioning of the center and direction of the wafer by rotating and scanning the edge of the wafer. Specifically, loading the wafer onto the positioning table, and completing the positioning of the center and direction of the wafer by scanning the edge of the wafer.

[0044] Afterwards, it is further determined whether the wafer ID is located on the front or back side of the wafer.

[0045] In one embodiment, the above step of "determining whether the wafer ID is located on the front side of the wafer" includes: scanning the front side of the wafer to determine whether the wafer ID is scanned; if the wafer ID is scanned, determining that the wafer ID is located on the front side of the wafer; if the wafer ID is not scanned, determining that the wafer ID is located on the back side of the wafer.

[0046] In a specific implementation, the front side of the wafer is scanned to determine whether the area with the wafer ID is scanned. If it is scanned, it means that the wafer ID is located on the front side of the wafer; if it is not scanned, it means that the wafer ID is on the back side of the wafer.

[0047] S2, if the wafer ID is located on the front side of the wafer, the wafer ID on the front side of the wafer is read by scanning at the reader terminal.

[0048] In a specific implementation, if the wafer ID is located on the front side of the wafer, the front side of the wafer can be directly scanned through the reading terminal to read the wafer ID located on the front side of the wafer.

[0049] In one embodiment, the above step of "reading the wafer ID on the front side of the wafer by scanning the reading terminal" includes: keeping the position of the reading terminal unchanged; rotating the wafer to rotate the wafer ID under the reading terminal; and reading the wafer ID on the front side of the wafer by scanning the reading terminal.

[0050] In the specific implementation, the position of the reading terminal is kept unchanged, and the wafer is aligned downward. The wafer is rotated so that the wafer ID area is rotated directly below the reading terminal; the wafer area directly below is scanned by the reading terminal, so that the wafer ID located on the front of the wafer can be accurately read.

[0051] S3, if the wafer ID is located on the back side of the wafer, adjust the reading terminal to a position capable of receiving the image reflected by the optical reflection component, wherein the optical reflection component is used to reflect the image of the back side of the wafer into the reading terminal.

[0052] In a specific implementation, the optical reflection component is used to reflect the image of the back side of the wafer into the reading terminal. The optical reflection component may specifically include a multi-faceted reflection mirror, and the multi-faceted reflection mirror is used to reflect the image of the back side of the wafer into the reading terminal.

[0053] When the wafer ID is located on the reverse side of the wafer, the position of the reading terminal is rotated and / or moved so that the reading terminal can receive the image reflected by the optical reflection component.

[0054] See also Figure 2In one embodiment, the optical reflection component includes a first reflection mirror 10, a second reflection mirror 20 and a third reflection mirror 30; the first reflection mirror 10 is located below the wafer 50, the second reflection mirror 20 is located on one side of the first reflection mirror 10 in a horizontal direction, the third reflection mirror 30 is located above the second reflection mirror 20, and the reading terminal 40 is located on one side of the third reflection mirror 30 in a horizontal direction; wherein, the reading terminal 40 is rotated to face the third reflection mirror 30 to receive the image reflected by the optical reflection component.

[0055] Specifically, the wafer includes a front surface 51 and a back surface 52. The first reflector 10 is tilted to the right and is arranged below the back surface 52 of the wafer 50, the second reflector 20 is tilted to the left and is arranged on the left side of the first reflector 10 in the horizontal direction, the third reflector 30 is tilted to the right and is located above the second reflector 20, and the reading terminal 40 is horizontally located on the left side of the third reflector 30.

[0056] The reading port 40 is rotated 90° clockwise so that the rotating head faces the third reflecting mirror 30. The image of the wafer 50 is reflected by the first reflecting mirror 10, the second reflecting mirror 20 and the third reflecting mirror 30 in sequence and then input into the reading port 40.

[0057] See also Figure 3 In one embodiment, the optical reflective component includes a first reflector 10 and a second reflector 20; the first reflector 10 is located below the wafer 50, and the second reflector 20 is located on one side of the first reflector 10 in a horizontal direction; wherein the reading terminal 40 is moved above the second reflector 20 to receive the image reflected by the optical reflective component.

[0058] Specifically, the wafer includes a front surface 51 and a back surface 52. The first reflector 10 is disposed below the back surface 52 of the wafer 50 and tilted to the right. The second reflector 20 is disposed to the left of the first reflector 10 in a horizontal direction and tilted to the left.

[0059] The reading port 40 is moved to the upper side of the second reflecting mirror 20 so that the rotating head faces the second reflecting mirror 20. The image of the wafer 50 is reflected by the first reflecting mirror 10 and the second reflecting mirror 20 in sequence and then input into the reading port 40.

[0060] S4, scanning the image reflected by the optical reflection component through a reading terminal to read the wafer ID located on the back side of the wafer.

[0061] In a specific implementation, the image reflected by the optical reflection component is scanned by a reading port, so that the wafer ID located on the reverse side of the wafer can be read. It can be seen that by setting the optical reflection component, the wafer ID on both sides of the wafer can be read by a scanning head.

[0062] The embodiment of the present invention proposes a method for reading the double-sided ID of a wafer using a single barcode reader, including: determining whether the wafer ID is located on the front side of the wafer; if the wafer ID is located on the front side of the wafer, scanning and reading the wafer ID on the front side of the wafer through the barcode reader terminal; if the wafer ID is located on the back side of the wafer, adjusting the barcode reader terminal to a position capable of receiving an image reflected by an optical reflection component, wherein the optical reflection component is used to reflect the image on the back side of the wafer into the barcode reader terminal; scanning the image reflected by the optical reflection component through the barcode reader terminal to read the wafer ID located on the back side of the wafer. It can be seen that the optical reflection component can reflect the image on the back side of the wafer into the barcode reader terminal, so that the present invention can realize the reading of the wafer ID on both sides of the wafer through one scanning head, which greatly reduces the cost.

[0063] Corresponding to the above method of using a single barcode reader to read the double-sided ID of a wafer, the present invention also provides a device for using a single barcode reader to read the double-sided ID of a wafer. The device for using a single barcode reader to read the double-sided ID of a wafer includes a unit for executing the above method of using a single barcode reader to read the double-sided ID of a wafer. The device for using a single barcode reader to read the double-sided ID of a wafer can be configured in a desktop computer, a tablet computer, a laptop computer, and other terminals. Specifically, the device for using a single barcode reader to read the double-sided ID of a wafer includes:

[0064] A judging unit, used for judging whether the wafer ID is located on the front side of the wafer;

[0065] A first reading unit is used for scanning and reading the wafer ID on the front side of the wafer through a reading terminal if the wafer ID is located on the front side of the wafer;

[0066] an adjusting unit, for adjusting the reading terminal to a position capable of receiving an image reflected by the optical reflecting component if the wafer ID is located on the back side of the wafer, wherein the optical reflecting component is used to reflect the image of the back side of the wafer into the reading terminal;

[0067] The second reading unit is used to scan the image reflected by the optical reflection component through a reading terminal to read the wafer ID located on the reverse side of the wafer.

[0068] A further technical solution is that, in determining whether the wafer ID is located in front of the front side of the wafer, the method further comprises:

[0069] A placement unit, used for placing the wafer on the positioning table;

[0070] The positioning unit is used to locate the center and direction of the wafer by rotating and scanning the edge of the wafer.

[0071] A further technical solution is that the step of determining whether the wafer ID is located on the front side of the wafer includes:

[0072] Scan the front side of the wafer to determine whether the wafer ID is scanned;

[0073] If the wafer ID is scanned, it is determined that the wafer ID is located on the front side of the wafer;

[0074] If the wafer ID is not scanned, it is determined that the wafer ID is located on the reverse side of the wafer.

[0075] A further technical solution is that the wafer ID on the front side of the wafer is read by scanning at a reader terminal, comprising:

[0076] Keep the position of the reading dock unchanged;

[0077] Rotate the wafer to move the wafer ID under the reader terminal;

[0078] The wafer ID on the front side of the wafer is read by scanning at the reader terminal.

[0079] A further technical solution is that the step of adjusting the reading port to a position capable of receiving the image reflected by the optical reflection component comprises:

[0080] The reading terminal is rotated and / or moved to a position where it can receive the image reflected by the optical reflective component.

[0081] A further technical solution is that the optical reflection assembly includes a first reflector, a second reflector and a third reflector; the first reflector is located below the wafer, the second reflector is located on one side of the first reflector in a horizontal direction, the third reflector is located above the second reflector, and the reading port is located on one side of the third reflector in a horizontal direction;

[0082] The image reflected by the optical reflective component is received by rotating the reading terminal toward the third reflector.

[0083] A further technical solution is that the optical reflection component includes a first reflection mirror and a second reflection mirror; the first reflection mirror is located below the wafer, and the second reflection mirror is located on one side of the first reflection mirror in a horizontal direction;

[0084] The reading port is moved to above the second reflector to receive the image reflected by the optical reflective component.

[0085] It should be noted that technicians in the relevant field can clearly understand that the specific implementation process of the above-mentioned device for reading the double-sided ID of the wafer using a single barcode reader and each unit can refer to the corresponding description in the aforementioned method embodiment, and for the convenience and conciseness of the description, it will not be repeated here.

[0086] The above-mentioned device for reading the double-sided ID of the wafer using a single barcode reader can be implemented in the form of a computer program. The computer program can be used in a computer program such as Figure 4 Runs on the computer device shown.

[0087] See also Figure 4 , Figure 4 5 is a schematic block diagram of a computer device provided in an embodiment of the present application. The computer device 500 may be a terminal or a server, wherein the terminal may be an electronic device with communication functions such as a smart phone, a tablet computer, a laptop computer, a desktop computer, a personal digital assistant, and a wearable device. The server may be an independent server or a server cluster composed of multiple servers.

[0088] The computer device 500 includes a processor 502 , a memory, and a network interface 505 connected via a system bus 501 , wherein the memory may include a non-volatile storage medium 503 and an internal memory 504 .

[0089] The non-volatile storage medium 503 can store an operating system 5031 and a computer program 5032. When the computer program 5032 is executed, the processor 502 can execute a method for reading double-sided IDs of a wafer using a single barcode reader.

[0090] The processor 502 is used to provide computing and control capabilities to support the operation of the entire computer device 500 .

[0091] The internal memory 504 provides an environment for the operation of the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, the processor 502 can execute a method for reading double-sided IDs of wafers using a single barcode reader.

[0092] The network interface 505 is used to communicate with other devices over the network. Those skilled in the art will appreciate that the above structure is only a block diagram of a portion of the structure related to the present application solution, and does not constitute a limitation on the computer device 500 to which the present application solution is applied. The specific computer device 500 may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0093] The processor 502 is used to run the computer program 5032 stored in the memory to implement the following steps:

[0094] Determine whether the wafer ID is located on the front side of the wafer;

[0095] If the wafer ID is located on the front side of the wafer, the wafer ID on the front side of the wafer is read by scanning at the reader terminal;

[0096] If the wafer ID is located on the back side of the wafer, adjust the reading terminal to a position capable of receiving an image reflected by an optical reflection component, wherein the optical reflection component is used to reflect the image of the back side of the wafer into the reading terminal;

[0097] The image reflected by the optical reflection component is scanned by a reading terminal to read the wafer ID located on the reverse side of the wafer.

[0098] A further technical solution is that, in determining whether the wafer ID is located in front of the front side of the wafer, the method further comprises:

[0099] placing the wafer on a positioning table;

[0100] By rotating and scanning the edge of the wafer, the center and direction of the wafer are positioned.

[0101] A further technical solution is that the step of determining whether the wafer ID is located on the front side of the wafer includes:

[0102] Scan the front side of the wafer to determine whether the wafer ID is scanned;

[0103] If the wafer ID is scanned, it is determined that the wafer ID is located on the front side of the wafer;

[0104] If the wafer ID is not scanned, it is determined that the wafer ID is located on the reverse side of the wafer.

[0105] A further technical solution is that the wafer ID on the front side of the wafer is read by scanning at a reader terminal, comprising:

[0106] Keep the position of the reading dock unchanged;

[0107] Rotate the wafer to move the wafer ID under the reader terminal;

[0108] The wafer ID on the front side of the wafer is read by scanning at the reader terminal.

[0109] A further technical solution is that the step of adjusting the reading port to a position capable of receiving the image reflected by the optical reflection component comprises:

[0110] The reading terminal is rotated and / or moved to a position where it can receive the image reflected by the optical reflective component.

[0111] A further technical solution is that the optical reflection assembly includes a first reflector, a second reflector and a third reflector; the first reflector is located below the wafer, the second reflector is located on one side of the first reflector in a horizontal direction, the third reflector is located above the second reflector, and the reading port is located on one side of the third reflector in a horizontal direction;

[0112] The image reflected by the optical reflective component is received by rotating the reading terminal toward the third reflector.

[0113] A further technical solution is that the optical reflection component includes a first reflection mirror and a second reflection mirror; the first reflection mirror is located below the wafer, and the second reflection mirror is located on one side of the first reflection mirror in a horizontal direction;

[0114] The reading port is moved to above the second reflector to receive the image reflected by the optical reflective component.

[0115] It should be understood that in the embodiment of the present application, the processor 502 may be a central processing unit (CPU), and the processor 502 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0116] It is understood by those skilled in the art that all or part of the processes in the method for implementing the above embodiment can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a storage medium, which is a computer-readable storage medium. The computer program is executed by at least one processor in the computer system to implement the process steps of the embodiment of the above method.

[0117] Therefore, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium. The storage medium stores a computer program. When the computer program is executed by a processor, the processor executes the following steps:

[0118] Determine whether the wafer ID is located on the front side of the wafer;

[0119] If the wafer ID is located on the front side of the wafer, the wafer ID on the front side of the wafer is read by scanning at the reader terminal;

[0120] If the wafer ID is located on the back side of the wafer, adjust the reading terminal to a position capable of receiving an image reflected by an optical reflection component, wherein the optical reflection component is used to reflect the image of the back side of the wafer into the reading terminal;

[0121] The image reflected by the optical reflection component is scanned by a reading terminal to read the wafer ID located on the reverse side of the wafer.

[0122] A further technical solution is that, in determining whether the wafer ID is located in front of the front side of the wafer, the method further comprises:

[0123] placing the wafer on a positioning table;

[0124] By rotating and scanning the edge of the wafer, the center and direction of the wafer are positioned.

[0125] A further technical solution is that the step of determining whether the wafer ID is located on the front side of the wafer includes:

[0126] Scan the front side of the wafer to determine whether the wafer ID is scanned;

[0127] If the wafer ID is scanned, it is determined that the wafer ID is located on the front side of the wafer;

[0128] If the wafer ID is not scanned, it is determined that the wafer ID is located on the reverse side of the wafer.

[0129] A further technical solution is that the wafer ID on the front side of the wafer is read by scanning at a reader terminal, comprising:

[0130] Keep the position of the reading dock unchanged;

[0131] Rotate the wafer to move the wafer ID under the reader terminal;

[0132] The wafer ID on the front side of the wafer is read by scanning at the reader terminal.

[0133] A further technical solution is that the step of adjusting the reading port to a position capable of receiving the image reflected by the optical reflection component comprises:

[0134] The reading terminal is rotated and / or moved to a position where it can receive the image reflected by the optical reflective component.

[0135] A further technical solution is that the optical reflection assembly includes a first reflector, a second reflector and a third reflector; the first reflector is located below the wafer, the second reflector is located on one side of the first reflector in a horizontal direction, the third reflector is located above the second reflector, and the reading port is located on one side of the third reflector in a horizontal direction;

[0136] The image reflected by the optical reflective component is received by rotating the reading terminal toward the third reflector.

[0137] A further technical solution is that the optical reflection component includes a first reflection mirror and a second reflection mirror; the first reflection mirror is located below the wafer, and the second reflection mirror is located on one side of the first reflection mirror in a horizontal direction;

[0138] The reading port is moved to above the second reflector to receive the image reflected by the optical reflective component.

[0139] The storage medium is a physical, non-transient storage medium, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a magnetic disk, or an optical disk, etc., which can store program codes. The computer-readable storage medium can be non-volatile or volatile.

[0140] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0141] In the several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of each unit is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0142] The steps in the method of the embodiment of the present invention can be adjusted in order, combined and deleted according to actual needs. The units in the device of the embodiment of the present invention can be combined, divided and deleted according to actual needs. In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0143] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, terminal, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention.

[0144] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0145] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

[0146] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A method for reading double-sided ID of a wafer using a single barcode reader, characterized in that: include: Determine whether the wafer ID is located on the front side of the wafer; If the wafer ID is located on the front side of the wafer, the wafer ID on the front side of the wafer is read by scanning at the reader terminal; If the wafer ID is located on the back side of the wafer, adjust the reading terminal to a position capable of receiving an image reflected by an optical reflection component, wherein the optical reflection component is used to reflect the image of the back side of the wafer into the reading terminal; The image reflected by the optical reflection component is scanned by a reading terminal to read the wafer ID located on the reverse side of the wafer.

2. The method for reading double-sided ID of a wafer using a single barcode reader according to claim 1, characterized in that: The method of determining whether the wafer ID is located in front of the front side of the wafer further includes: placing the wafer on a positioning table; By rotating and scanning the edge of the wafer, the center and direction of the wafer are positioned.

3. The method for reading double-sided ID of a wafer using a single barcode reader according to claim 2, characterized in that: The determining whether the wafer ID is located on the front side of the wafer includes: Scan the front side of the wafer to determine whether the wafer ID is scanned; If the wafer ID is scanned, it is determined that the wafer ID is located on the front side of the wafer; If the wafer ID is not scanned, it is determined that the wafer ID is located on the reverse side of the wafer.

4. The method for reading double-sided ID of a wafer using a single barcode reader according to claim 1, characterized in that: The step of scanning and reading the wafer ID on the front side of the wafer by the reader terminal includes: Keep the position of the reading dock unchanged; Rotate the wafer to move the wafer ID under the reader terminal; The wafer ID on the front side of the wafer is read by scanning at the reader terminal.

5. The method for reading double-sided ID of a wafer using a single barcode reader according to claim 1, characterized in that: The step of adjusting the reading terminal to a position capable of receiving the image reflected by the optical reflection component comprises: The reading terminal is rotated and / or moved to a position where it can receive the image reflected by the optical reflective component.

6. The method for reading double-sided ID of a wafer using a single barcode reader according to claim 5, characterized in that: The optical reflection assembly includes a first reflector, a second reflector and a third reflector; the first reflector is located below the wafer, the second reflector is located on one side of the first reflector in a horizontal direction, the third reflector is located above the second reflector, and the reading port is located on one side of the third reflector in a horizontal direction; The image reflected by the optical reflective component is received by rotating the reading terminal toward the third reflector.

7. The method for reading double-sided ID of a wafer using a single barcode reader according to claim 5, characterized in that: The optical reflection component includes a first reflection mirror and a second reflection mirror; the first reflection mirror is located below the wafer, and the second reflection mirror is located on one side of the first reflection mirror in a horizontal direction; The reading port is moved above the second reflector to receive the image reflected by the optical reflective component.

8. A device for reading double-sided ID of a wafer using a single barcode reader, characterized in that: The method comprises a unit for executing the method according to any one of claims 1 to 7.

9. A computer device, characterized in that: The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 7 can be implemented.

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